Application Specification
114–2154
Modular Jacks with Integral
LOC B
1 of 9
E
2003 T yco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
AMP and Tyco are trademarks. *T rademark
Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1–800–722–1 111
F AX/PRODUCT INFO 1–800–522–6752
For Regional Customer Service, visit our website at
www.tycoelectronics.com
This controlled document is subject to change.
For latest revision, call the FAX/PRODUCT INFO number.
Light Emitting Diode (LED) 26 AUG 03 Rev A
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2
_
.
Figures and illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of modular jacks with integral LED. The jacks are
available in standard, inverted, and light pipe. The jacks are available shielded and unshielded with up to 8
ports. These jacks are designed for mounting onto a printed circuit (pc) board and panel.
When corresponding with personnel, use the terminology provided in this specification to facilitate your
inquiries for information. Basic terms and features of this product are provided in Figure 1.
Figure 1
Inverted Modular Jack
Multiport (1
8 Shown) Single Port
Light Pipe Modular Jack
Single Port Light Pipe
Standard Modular Jack
LED Solder
Tines
Contact
Solder Tines
PC Board
Ground Tab
Single PortMultiport (1
4 Shown)
LED Solder
Tines PC Board
Ground Tab
Contact
Solder Tines
Panel
Ground Tab
LED Solder
Tines PC Board
Ground Tab
Contact
Solder Tines
Panel
Ground Tab
Panel
Ground Tab
Boardlock
Boardlock
Boardlock
Note: Note to Scale
Multiport (1
4 Shown)
NOTE
114–2154
Modular Jacks with Integral LED
Rev A2 of 9
Shielded modular jacks feature tin–lead plated brass shells which provide continuity for electromagnetic
compatibility (EMC).
When mated with corresponding shielded modular plugs, shielding and grounding continuity are achieved.
When the shield solder tines are soldered to the pc board, they provide electrical continuity to any ground path
on the pc board and, if applicable, panel ground tabs on the shield provide electrical continuity to any ground
path through the equipment panel.
2. REFERENCE MATERIAL
2.1. Revision Summary
Revisions to this application specification per EC 0990–1178–03 include:
S
Updated document to corporate requirements
S
Added titles to Figures 2 and 3
S
Added finished hole diameter for standard modular jack LED solder tine to Figure 4
S
Removed NOTE from Paragraph 3.5.B
S
Replaced temperature and exposure time in Paragraph 3.5.B with Figure 6
S
Added standard modular jack to Figure 10
2.2. Customer Assistance
Reference Product Base Part Number 406549 and Product Code 1977 are representative of modular jacks
with integral LED. Use of these numbers will identify the product line and expedite your inquiries through a
service network established to help you obtain product and tooling information. Such information can be
obtained through a local Representative (Field Service Engineer, Field Applications Engineer, etc.) or, after
purchase, by calling PRODUCT INFO at the number at the bottom of page 1.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, call PRODUCT INFO at the number at the bottom of page 1.
2.4. Manuals
Manual 402–40 can be used as a guide to soldering. This manual provides information on various flux types
and characteristics with the commercial designation and flux removal procedures. A checklist is included in the
manual as a guide for information on soldering problems.
2.5. Specifications
Product Specifications 108–1163–3 (light pipe modular jacks) and 108–1163–4 (inverted modular jacks) provide
product performance and test information.
2.6. Instructional Material
Instruction Sheets (408–series) provide product assembly instructions or tooling setup and operation
procedures and Customer Manuals (409–series) provide machine setup and operation procedures. There are
no documents that pertain to this product.
3. REQUIREMENTS
3.1. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the modular jack
housings.
B. Shelf Life
The modular jacks should remain in the shipping containers until ready for use to prevent damage. The
modular jacks should be used on a first in, first out basis to avoid storage contamination that could
adversely affect signal transmissions.
114–2154
Modular Jacks with Integral LED
Rev A 3 of 9
C. Chemical Exposure
Do not store modular jacks near any chemicals listed below as they may cause stress corrosion cracking
in the contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.2. LED Operating Requirements
The LED operating requirements for these modular jacks are given in Figures 2 and 3.
STANDARD AND INVERTED MODULAR JACKS
CR PT ON
ABSOLUTE MAXIMUM RATINGS (TA = 25
_
C [77
_
F])
DES
CR
I
PT
I
ON
GREEN YELLOW ORANGE UNIT
Wavelength At Peak Emission IF = 20 mA 565 590 610 nm
Lens Type Diffused Diffused Diffused —
Luminous Intensity—Minimum (IF = 10 mA) 5 3.2 5 mcd
Luminous Intensity—Maximum 20 12.5 20 mcd
Forward Voltage (Typ) IF = 20 mA 2.2 2.1 2.0 V
Forward Voltage (Max) IF = 20 mA 2.5 2.5 2.6 V
Reverse Voltage (VR) 5 5 5 V
Forward Current (IF) (1/10 Duty Cycle, 0.1 ms Pulse Width) 25 30 30 mA
Forward Current (Peak) 150 150 150 mA
Reverse Current VR = 5 V 10 10 10
m
A
Power Dissipation 105 105 105 mW
Low Current Application:
Forward Voltage (Typ) IF = 2 mA 1.9 1.8 1.7 V
Forward Voltage (Max) IF = 2 mA 2.2 2.1 2.0 V
Forward Current (IF) (1/10 Duty Cycle, 0.1 ms Pulse Width) 7 7 7 mA
Forward Current (Peak) 150 150 150 mA
Power Dissipation 24 25 26 mW
Figure 2
LIGHT PIPE MODULAR JACK
CR PT ON
ABSOLUTE MAXIMUM RATINGS (TA = 25
_
C [77
_
F])
DES
CR
I
PT
I
ON
GREEN YELLOW UNIT
Wavelength At Peak Emission IF = 20 mA 565 585 nm
Lens Type Clear Tint Clear Tint —
Luminous Intensity—Minimum (IF = 10 mA) 2.5 2.5 mcd
Luminous Intensity—Maximum 10 10 mcd
Forward Voltage (Typ) IF = 20 mA 2.1 2.0 V
Forward Voltage (Max.) IF = 20 mA 2.8 2.8 V
Reverse Voltage (VR) 5 5 V
Forward Current (IF) (1/10 Duty Cycle, f = 1.0 KHz 30 30 mA
Forward Current (Peak) 160 160 mA
Reverse Current VR = 5 V 10 10
m
A
Power Dissipation 100 85 mW
Figure 3
114–2154
Modular Jacks with Integral LED
Rev A4 of 9
3.3. PC Board
A. Material and Thickness
The pc board material shall be glass epoxy (FR–4 or G–10). The pc board thickness shall be 1.57 [.062].
B. Hole Dimensions
Plated through holes must be used for contact and LED solder tines and, for shielded modular jacks,
shield solder tines. The drilled hole size, plating types, and plating thickness are dependent on the
application requirements. The finished hole size must be as stated to provide unrestricted insertion, proper
retention in the pc board, and to ensure adequate application of solder to the tines. See Figure 4.
C. Layout
The holes in the pc board must be precisely located to ensure proper placement and optimum
performance of the modular jack. The pc board layout must be designed using the dimensions provided on
the customer drawing for the specific modular jack.
Drilled Hole Diameter
(Use No. 30 (3.25 [.128]) Drill Bit.
DO NOT Use 3.18 [.125 (1/8)] Drill Bit
Finished Hole Diameter
(After Plating) SEE TABLE
Finished Annular Ring Pad
(As Required)
T race Width
(As Required)
Contact Solder Tine Hole
Boardlock Hole
Drilled Hole Diameter
(As Required)
PC Board
FINISHED HOLE DIAMETER (After Plating)
CONTACT
HL
LED SOLDER TINE
CONTACT
SOLDER TINE S
H
IE
L
D
SOLDER TINE Standard
Modular Jacks Light Pipe
Modular Jack Inverted
Modular Jack
0.89 [.035] 1.57 [.062] 1.19 [.047] 1.22 [.048] 0.89 [.035]
Figure 4
114–2154
Modular Jacks with Integral LED
Rev A 5 of 9
3.4. Placement
The modular jacks should be handled only by the housing to avoid deformation, contamination, or damage to the
solder tines.
A. Alignment
The modular jack number one position must be aligned with the number one position board hole. When
placing modular jacks on the pc board, the solder tines and boardlocks must be aligned with matching
holes before placing the jack onto the pc board. All solder tines and boardlocks must be started into the
holes, then gently pressed downward.
B. Seating
The modular jack shall be flush and evenly seated on the pc board.
3.5. SolderingA hold–down may be used to hold the modular jack in place during the soldering process.
A. Flux Selection
Solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must
be compatible with the wave solder line, manufacturing, health, and safety requirements. Call PRODUCT
INFO at the number at the bottom of page 1 for consideration of other types of flux. Flux that is compatible
with these connectors are provided in Figure 5.
FLU TYP
ACT TY
RU
COMMERCIAL DESIGNATION
FLU
X
TYP
E
ACT
IVI
TY
R
ESID
U
EKESTER ALPHA
RMA Mild Noncorrosive 186 611
Figure 5
B. Process
The modular jacks can be soldered using wave soldering or equivalent soldering techniques. It is
recommended using SN60 or SN62 solder for these modular jacks. The temperature and exposure time
must be as specified in Figure 6.
More Than 3 Minutes
3
_
C [37.4
_
F]
Per Second
100 Seconds
0.5
_
C [33
_
F]
Per Second
Equalization
Figure 6
20
_
C [68
_
F]
110
_
C [230
_
F]
160
_
C [320
_
F]
230
_
C [446
_
F]
Ramp–Up Reflow Cool–Down
Reflow Soldering Process Cycle
Pre–Heat Soldering Solidification
30 Seconds
3
_
C [37.4
_
F]
Per Second
Peak Dwell
20 Seconds Max
45 Seconds
3
_
C [37.4
_
F]
Per Second
Ambient Rate
Ambient Rate
CAUTION
NOTE
114–2154
Modular Jacks with Integral LED
Rev A6 of 9
C. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. It is recommended cleaning with the pc board on its edge. If using an aqueous cleaner,
standard equipment such as a soak–tank or an automatic in–line machine should be used. The following is
a list of common cleaning solvents that will not affect the connectors for the time and temperature
specified. See Figure 7.
CLEANER
T
IME
T
EM
P
E
RATUR
E
NAME TYPE
T
IME
(Minutes)
T
EM
P
E
RATUR
E
(Maximum)
ALPHA 2110 Aqueous 1132
_
C [270
_
F]
BIOACT EC–7 Solvent 5100
_
C [212
_
F]
Butyl CARBITOL Solvent 1Ambient Room
Isopropyl Alcohol Solvent 5100
_
C [212
_
F]
KESTER 5778 Aqueous 5100
_
C [212
_
F]
KESTER 5779 Aqueous 5100
_
C [212
_
F]
LONCOTERGE 520 Aqueous 5100
_
C [212
_
F]
LONCOTERGE 530 Aqueous 5100
_
C [212
_
F]
Terpene Solvent Solvent 5100
_
C [212
_
F]
Figure 7
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental
effects. Both are carcinogenic (cancer–causing).
If you have a particular solvent that is not listed, contact PRODUCT INFO at the number at the bottom of page 1.
D. Drying
When drying cleaned assemblies and pc boards, make certain that temperature limitations are not
exceeded: –40
_
to 70
_
C [–40
_
to 158
_
F]. Excessive temperatures may cause housing degradation.
3.6. Checking Installed Jack
The shoulder of each boardlock must be through its intended hole in the pc board. Solder fillet must be evenly
formed around each solder tine. The housing of the modular jack must be seated on the pc board not
exceeding the dimension given in Figure 8.
Figure 8
0.13 [.005] Max
Modular Jack Housing to PC Board
PC Board
Modular Jack
Shoulder of Boardlock Through
PC Board Hole Solder Fillet is Evenly Formed
Around Each Solder Tine
DANGER
NOTE
114–2154
Modular Jacks with Integral LED
Rev A 7 of 9
3.7. Panel
A. Cutout
The panel must be cut using the dimensions provided on the customer drawing for the specific modular
jack. A reference
sample
of a recommended panel cutout for these modular jacks is shown in Figure 9.
Z
HL
DIMENSION
SI
Z
ES
H
IE
L
DED A B C
1
1Y16.51 [.650]
44 0
02 0 0
1
4Y59.70 [2.350]
44 0
02 0 0
1
6Y87.70 [3.450] 1
4
.
4
8 [.57
0
]
0
.
2
5 [.
0
1
0
]
1
8Y115.60 [4.550]
Z
HL
DIMENSION
SI
Z
ES
H
IE
L
DED A B C D
Y17.27 [.680] 13.97 [.550] 0.51 [.020] —
1
1N16.51 [.650] 13.59 [.535] —0.39 [.015]
1
2N32.26 [1.270] 13.59 [.535] —0.39 [.015]
4
Y64.77 [2.550] 13.97 [.550] 0.51 [.020] —
1
4
N63.75 [2.510] 13.59 [.535] —0.39 [.015]
Y96.27 [3.790] 13.97 [.550] 0.51 [.020] —
1
6N95.25 [3.750] 13.59 [.535] —0.39 [.015]
Y127.76 [5.030] 13.97 [.550] 0.51 [.020] —
1
8N126.75 [4.990] 13.59 [.535] —0.39 [.015]
Z
HL
DIMENSION
SI
Z
ES
H
IE
L
DED A B C
Y16.51 [.650]
44 0
0.38 [.015]
1
1N15.62 [.615] 1
4
.
4
8 [.57
0
]0 [0]
2
Y31.75 [.1.250]
44 0
0.38 [.015]
1
2
N30.99 [1.220] 1
4
.
4
8 [.57
0
]0 [0]
4
Y59.69 [2.350]
44 0
0.38 [.015]
1
4
N58.93 [2.320] 1
4
.
4
8 [.57
0
]0 [0]
Figure 9
A
Standard Modular Jack
C
Modular Jack Inside Panel Cutout
B
+0.38/–0.00
[+.015/–.000]
A
+0.25 [+.010]
Inverted Modular Jack
D
Modular Jack Inside Panel Cutout
B
+0.25/–0.13
[+.010/–.005]
C
A
+0.38/–0.00
[+.015/–.000]
Light Pipe Modular Jack
C
Modular Jack Inside Panel Cutout
B
+0.13/–0.25
[+.005/–.010]
114–2154
Modular Jacks with Integral LED
Rev A8 of 9
B. Mounting
The modular jack should protrude through the panel cutout to the dimension given in Figure 10.
Figure 10
2.16+0.25
[.085+.010]
Panel
PC Board
Inverted Modular Jack
1.91+0.38
[.075+.015]
Light Pipe Modular Jack
Panel Stop
2.36+0.13
[.093+.005]
Unshielded with Panel Ground
Standard Modular Jack
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏÏÏÏÏÏ
1.73+0.25
[.068+.010]
Shielded
3.8. Removal and Repair
The modular jacks must be removed from the pc board by standard de–soldering methods.
Damaged or defective modular jacks must NOT be used. Damaged modular jacks must be replaced.
When repairing or replacing a modular jack, care must be taken not to damage other pc board components during the
de–soldering process.
4. QUALIFICATIONS
Modular jacks with integral LED are recognized by Underwriters Laboratories Inc. (UL) under File E 81956 and
certified by CSA International under File LR 7189.
5. TOOLING
No tooling is required for manual placement of modular jacks; however, a pc board support that provides relief
for protruding components must be used to prevent deformation of contact and LED solder tines and, if
applicable, shield solder tines. The pc board support must be custom made (refer to 408–6927).
CAUTION
114–2154
Modular Jacks with Integral LED
Rev A 9 of 9
6. VISUAL AID
The illustration below shows a typical application of modular jacks with integral LED. This illustration should be
used by production personnel to ensure a correctly applied product. Applications which DO NOT appear
correct should be inspected using the information in the preceding pages of this specification and in the
instructional material shipped with the product or tooling.
FIGURE 11. VISUAL AID
HOUSING MUST BE
SEATED ON PC BOARD
PANEL STOP (IF PRESENT)
MUST BE AGAINST PANEL
SOLDER FILLET MUST BE
EVENLY FORMED AROUND
EACH SOLDER TINE
HOUSING MUST NOT BE
DAMAGED IN ANY WAY
SHOULDER OF BOARDLOCK
MUST BE THROUGH PC BOARD
CONTACTS MUST NOT
BE DEFORMED OR
DAMAGED IN ANY WAY
