STPS15L45CB-TR - STMicroelectronics

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STPS15L45CB

July 2003 - Ed : 2A

LOW DROP POWER SCHOTTKY RECTIFIER

Dual center tab Schottky rectifier suited for Switch

Mode Power Supply and high frequency DC to DC

converters.

Package in DPAK, this device is intended for use

in low voltage, high frequency inverters,

free-wheeling and polarity protection applications.

DESCRIPTION

■VERY SMALL CONDUCTION LOSSES

■NEGLIGIBLE SWITCHING LOSSES

■EXTREMELY FAST SWITCHING

■LOW FORWARD VOLTAGE DROP

■AVALANCHE CAPABILITY SPECIFIED

FEATURES AND BENEFITS

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 45 V

IF(RMS) RMS forward current 10 A

IF(AV) Average forward current Tc = 140°C

δ= 0.5 Per diode 7.5 A

Per device 15

IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

IRRM Peak repetitive reverse current tp=2 µs square F=1kHz 1A

ARM Repetitive peak avalanche power tp = 1µs Tj = 25°C 3700 W

Tstg Storage temperature range -65 to+175 °C

Tj Maximum operating junction temperature * 150 °C

dV/dt Critical rate of rise reverse voltage 10000 V/µs

ABSOLUTE RATINGS (limiting values, per diode)

IF(AV) 2 x 7.5 A

VRRM 45 V

Tj (max) 150 °C

VF(max) 0.46 V

MAIN PRODUCTS CHARACTERISTICS

DPAK

dPtot

dTj Rth j a

<−

()

thermal runaway condition for a diode on its own heatsink

STPS15L45CB

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Symbol Parameter Tests Conditions Min. Typ. Max. Unit

IR*Reverse leakage current Tj = 25°C VR=V

RRM 1mA

Tj = 125°C 23 45 mA

VF*Forward voltage drop Tj = 25°CI

= 7.5 A 0.52 V

Tj = 125°C IF= 7.5 A 0.40 0.46

Tj=25°CI

=12A 0.60

Tj = 125°C IF=12A 0.49 0.57

Tj=25°CI

=15A 0.64

Tj = 125°C IF=15A 0.53 0.63

Pulse test : * tp = 380 µs, δ<2%

To evaluate the conduction losses use the following equation :

P=0.29xI

F(AV) + 0.023 IF2(RMS)

STATIC ELECTRICAL CHARACTERISTICS (per diode)

Symbol Parameter Value Unit

Rth(j-c) Junction to case Per diode

Total 4

2.4 °C/W

Rth(c) Coupling 0.7

When the diodes 1 and 2 are used simultaneously :

∆Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)

THERMAL RESISTANCES

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

012345678910

IF(av)(A)

PF(av)(W)

δ= 0.05

δ= 0.1

δ= 0.2 δ= 0.5

δ= 1

δ=tp/T tp

Fig.1:Conductionlossesversusaveragecurrent.

0 25 50 75 100 125 150

Tamb(°C)

Rth(j-a)=Rth(j-c)

Rth(j-a)=70°C/W

IF(av)(A)

δ=tp/T tp

Fig. 2: Average forward current versus ambient

temperature (δ= 0.5).

0.2

0.4

0.6

0.8

1.2

0 25 50 75 100 125 150

T (°C)

P(t)

P (25°C)

ARM p

ARM

Fig. 4: Normalized avalanche power derating

versus junction temperature.

0.001

0.01

0.10.01 1

0.1

10 100 1000

t (µs)

P(t)

P (1µs)

ARM p

ARM

Fig. 3: Normalized avalanche power derating

versus pulse duration.

STPS15L45CB

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100

1.E-03 1.E-02 1.E-01 1.E+00

t(s)

Tc=25°C

Tc=75°C

Tc=125°C

IM(A)

δ=0.5

Fig. 5: Non repetitive surge peak forward current

versus overload duration (maximum values).

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

0 5 10 15 20 25 30 35 40 45

VR(V)

Tj=150°C

Tj=125°C

Tj=25°C

Tj=100°C

Tj=75°C

Tj=50°C

IR(mA)

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values).

100

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

VFM(V)

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

IFM(A)

Fig.9:Forwardvoltagedropversusforwardcurrent.

100

02468101214161820

S(cm²)

Rth(j-a)(°C/W)

Fig. 10: Thermal resistance junction to ambient ver-

sus copper surface under tab (epoxy printed board

FR4, Cu = 35µm).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-03 1.E-02 1.E-01 1.E+00

tp(s)

Zth(j-c)/Rth(j-c)

δ=tp/T tp

δ= 0.5

δ= 0.2

δ= 0.1

Single pulse

Fig. 6: Relative variation of thermal impedance

junction to case versus pulse duration.

0.1

1.0

10.0

1 10 100

VR(V)

F=1MHz

Vosc=30mV

Tj=25°C

C(nF)

Fig. 8 Junction capacitance versus reverse voltage

applied (typical values).

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STPS15L45CB

REF. DIMENSIONS

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

PACKAGE MECHANICAL DATA

DPAK

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Ordering type Marking Package Weight Base qty Delivery mode

STPS15L45CB S15L45C DPAK 0.30 g 75 Tube

STPS15L45CB-TR S15L45C DPAK 0.30 g 2500 Tape & reel

■EPOXY MEETS UL94,V0

6.7

1.61.6

2.32.3

FOOTPRINT (dimensions in mm)