SCDS040I − DECEMBER 1997 − REVISED OCT OBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D5-Ω Switch Connection Between Two Ports
DRail-to-Rail Switching on Data I/O Ports
DIoff Supports Partial-Power-Down Mode
Operation
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
S
1B1
1B2
1A
2B1
2B2
2A
GND
VCC
OE
4B1
4B2
4A
3B1
3B2
3A
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW) RGY PACKAGE
(TOP VIEW)
116
89
2
3
4
5
6
7
15
14
13
12
11
10
OE
4B1
4B2
4A
3B1
3B2
1B1
1B2
1A
2B1
2B2
2A
S
3A V
GND
CC
description/ordering information
The SN74CBTLV3257 is a 4-bit 1-of-2 high-speed FET multiplexer/demultiplexer. The low on-state resistance
of the switch allows connections to be made with minimal propagation delay.
The select (S) input controls the data flow. The FET multiplexers/demultiplexers are disabled when the
output-enable (OE) input is high.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74CBTLV3257RGYR CL257
SOIC − D
Tube SN74CBTLV3257D
CBTLV3257
−40°C to 85°C
SOIC − D Tape and reel SN74CBTLV3257DR CBTLV3257
−40
°
C to 85
°
C
SSOP (QSOP) − DBQ Tape and reel SN74CBTLV3257DBQR CL257
TSSOP − PW Tape and reel SN74CBTLV3257PWR CL257
TVSOP − DGV Tape and reel SN74CBTLV3257DGVR CL257
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
SCDS040I − DECEMBER 1997 − REVISED OCT OBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
FUNCTION
OE S
FUNCTION
L L A port = B1 port
LH A port = B2 port
H X Disconnect
logic diagram (positive logic)
1B11A
OE
1B2
SW
SW
2B12A
2B2
SW
SW
3B13A
3B2
SW
SW
4B14A
4B2
SW
SW
S
4
7
9
12
1
15
2
3
5
6
11
10
14
13
SCDS040I − DECEMBER 1997 − REVISED OCT OBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
simplified schematic, each FET switch
A
(OE)
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI/O < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA(see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DBQ package 90°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 120°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 39°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V 1.7
V
VIH High-level control input voltage VCC = 2.7 V to 3.6 V 2V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V 0.7
V
VIL Low-level control input voltage VCC = 2.7 V to 3.6 V 0.8 V
TAOperating free-air temperature −40 85 °C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SCDS040I − DECEMBER 1997 − REVISED OCT OBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK VCC = 3 V, II = −18 mA −1.2 V
IIVCC = 3.6 V, VI = VCC or GND ±1µA
Ioff VCC = 0, VI or VO = 0 to 3.6 V 15 µA
ICC VCC = 3.6 V, IO = 0, VI = VCC or GND 10 µA
∆ICC‡Control inputs VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND 300 µA
CiControl inputs VI = 3 V or 0 3 pF
Cio(OFF)
A port
VO = 3 V or 0,
OE = VCC
10.5
pF
Cio(OFF
)
B port VO = 3 V or 0, OE = VCC 5.5 pF
VCC = 2.3 V,
VI = 0
II = 64 mA 5 8
VCC = 2.3 V,
TYP at VCC = 2.5 V
VI = 0 II = 24 mA 5 8
ron§
TYP at VCC = 2.5 V
VI = 1.7 V, II = 15 mA 27 40
Ω
r
on
§
VI = 0
II = 64 mA 5 7 Ω
V
CC
= 3 V VI = 0 II = 24 mA 5 7
VCC = 3 V
VI = 2.4 V, II = 15 mA 10 15
†All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND.
§Measured b y the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined
by the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 2.5 V
± 0.2 V VCC = 3.3 V
± 0.3 V
UNIT
PARAMETER
(INPUT)
(OUTPUT)
MIN MAX MIN MAX
UNIT
tpd
A or B¶B or A 0.15 0.25
ns
tpd SA or B 1.8 6.1 1.8 5.3 ns
ten SA or B 1.7 6.1 1.7 5.3 ns
tdis SA or B 1 4.8 1 4.5 ns
ten OE A or B 1.9 5.6 2 5 ns
tdis OE A or B 1 5.5 1.6 5.5 ns
¶The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
SCDS040I − DECEMBER 1997 − REVISED OCT OBER 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VCC/2
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 2 × VCC
Open
GND
RL
RL
Data Input
Timing Input VCC
0 V
VCC
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
Input
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VCC
0 V
VOL + V∆
VOH − V∆
≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤2 ns, tf ≤2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VCC/2 VCC/2
VCC/2 VCC/2
VCC/2 VCC/2
VCC/2
VCC/2 VCC/2
VCC/2
VCC/2
VCC/2
VCC
VCC/2
VCC/2
2.5 V ±0.2 V
3.3 V ±0.3 V 500 Ω
500 Ω
VCC RL0.15 V
0.3 V
V∆
CL
30 pF
50 pF
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74CBTLV3257DBQRE4 ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTLV3257DBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTLV3257DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3257DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3257PWRE4 ACTIVE TSSOP PW 16 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3257PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3257RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBTLV3257D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257DBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBTLV3257DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74CBTLV3257PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3257RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74CBTLV3257 :
•Enhanced Product: SN74CBTLV3257-EP
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
74CBTLV3257PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74CBTLV3257DGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74CBTLV3257DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74CBTLV3257PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74CBTLV3257PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74CBTLV3257RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74CBTLV3257PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
SN74CBTLV3257DGVR TVSOP DGV 16 2000 367.0 367.0 35.0
SN74CBTLV3257DR SOIC D 16 2500 333.2 345.9 28.6
SN74CBTLV3257PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74CBTLV3257PWR TSSOP PW 16 2000 364.0 364.0 27.0
SN74CBTLV3257RGYR VQFN RGY 16 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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