MBR40250G - ON Semiconductor - Datasheet.Directory

October, 2011 − Rev. 11

1Publication Order Number:

MBR40250/D

MBR40250, MBR40250T,

MBRF40250T, MBRB40250T

250 V, 40 A SWITCHMODE]

Schottky Power Rectifier

Features

•250 V Blocking Voltage

•Low Forward Voltage Drop, VF = 0.86 V

•Soft Recovery Characteristic, TRR < 35 ns

•Stable Switching Performance Over Temperature

•These are Pb−Free Devices*

Benefits

•Reduces or Eliminates Reverse Recovery Oscillations

•Minimizes Need for EMI Filtering

•Reduces Switching Losses

•Improved Efficiency

Applications

•Power Supply

•Power Management

•Automotive

•Instrumentation

Mechanical Characteristics

•Case: Epoxy, Molded

•Weight: 1.9 grams (approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

•Epoxy Meets UL 94 V−0 at 0.125 in

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

2, 4

http://onsemi.com

TO−220AC

CASE 221B

MARKING

DIAGRAMS

AYWW

B40250TG

A K A

B40250 = Device Code

T = 3 pins

A = Assembly Location

Y = Year

WW = Work Week

G = Pb−Free Package

KA, AKA = Polarity Designator

31, 4

TO−220AB

CASE 221A

T SUFFIX

AYWW

B40250G

K A

123

TO−220 FULLPACK

CASE 221D

T SUFFIX AYWW

B40250TG

A K A

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

D2PAK

CASE 418AJ

B40250TG

AKA

AY WW

MBR40250, MBR40250T, MBRF40250T, MBRB40250T

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

250 V

Average Rectified Forward Current

(Rated VR) TC = 82°C MBR40250, MBR40250T, MBRB40250T

(Rated VR) TC = 46°C MBRF40250T

IF(AV) 40 A

Peak Repetitive Forward Current

(Rated VR, Square Wave, 20 kHz) TC = 82°C MBR40250, MBR40250T, MBRB40250T

(Rated VR, Square Wave, 20 kHz) TC = 46°C MBRF40250T

IFRM 80 A

Nonrepetitive Peak Surge Current

(Surge applied at rated load conditions halfwave, single phase, 60 Hz)

IFSM 150 A

Storage Temperature Tstg *65 to +175 °C

Operating Junction Temperature TJ*65 to +150 °C

Voltage Rate of Change (Rated VR) dv/dt 10,000 V/ms

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Maximum Thermal Resistance Junction−to−Case

MBR40250(T) and MBRB40250T

MBRF40250

Junction−to−Ambient

MBR40250(T)

MBRF40250

MBRB40250T

RqJC

RqJA

2.0

3.0

°C/W

ELECTRICAL CHARACTERISTICS

Rating Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 1)

IF = 20 A, TC = 25°C

IF = 20 A, TC = 125°C

IF = 40 A, TC = 25°C

IF = 40 A, TC = 125°C

VF0.86

0.71

0.97

0.86

Maximum Instantaneous Reverse Current (Note 1)

Rated DC Voltage, TC = 25°C

Rated DC Voltage, TC = 125°C

IR0.25

Maximum Reverse Recovery Time

IF = 1.0 A, di/dt = 50 A/ms, TC = 25°C

trr 35

DYNAMIC CHARACTERISTICS

Capacitance VR = −5.0 V, TC = 25°C, Frequency = 1.0 MHz CT500 pF

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.

MBR40250, MBR40250T, MBRF40250T, MBRB40250T

http://onsemi.com

TYPICAL CHARACTERISTICS

TJ = 25°C

TJ = 100°C

TJ = 125°C

TJ = 150°C

1.0E-02

1.0E-01

25 75 125 175 225

1.0E-03

1.0E-04

1.0E-05

1.0E-06

1.0E-07

100

0.3 0.4 0.6 0.8 1.0

Figure 1. Typical Forward Voltage

, INSTANTANEOUS FORWARD VOLTAGE (V)

TJ = 25°C

TJ = 100°C

TJ = 125°C

TJ = 150°C

, INSTANTANEOUS FORWARD CURRENT (A)

Figure 2. Maximum Forward Voltage

50 100 150 200 250

VR, REVERSE VOLTAGE (V)

IR, REVERSE CURRENT (A)

100

200

300

400

500

600

700

11010

TJ = 25°C

Figure 3. Typical Reverse Current

VR, REVERSE VOLTAGE (V)

C, CAPACITANCE (pF)

Figure 4. Typical Capacitance

100

0.3 0.5 0.7 0.9 1.1

, MAXIMUM FORWARD VOLTAGE (V)

TJ = 25°C

TJ = 100°C

TJ = 125°C

TJ = 150°C

, MAXIMUM FORWARD CURRENT (A)

0.5 0.7 0.9 0.4 0.6 0.8 1.0

SQUARE WAVE

RATED VOLTAGE

RqJC = 2°C/W

60 80 100 120 140

070 90 110 130 150

TC, CASE TEMPERATURE (°C)

IF(AV), AVERAGE FORWARD CURRENT (A)

Figure 5. Current Derating (Case) for

MBR40250, MBR40250T and MBRB40250T

Figure 6. Forward Power Dissipation for

MBR40250, MBR40250T and MBRB40250T

0204010 30 50

MBR40250

MBR40250T

MBRB40250T

SQUARE WAVE

30 40

IO, AVERAGE FORWARD CURRENT (A)

PF(AV), AVERAGE POWER DISSIPATION (W)

0102051525

MBR40250

MBR40250T

MBRB40250T

MBR40250, MBR40250T, MBRF40250T, MBRB40250T

http://onsemi.com

TYPICAL CHARACTERISTICS

SQUARE WAVE

RATED VOLTAGE

RqJC = 3°C/W

60 80 100 120 140

070 90 110 130 150

TC, CASE TEMPERATURE (°C)

IF(AV), AVERAGE FORWARD CURRENT (A)

Figure 7. Current Derating (Case) for

MBRF40250T

Figure 8. Forward Power Dissipation for

MBRF40250T

0204010 30 50

MBRF40250T

SQUARE WAVE

30 40

IO, AVERAGE FORWARD CURRENT (A)

PF(AV), AVERAGE POWER DISSIPATION (W)

0102051525

MBRF40250T

ORDERING INFORMATION

Device Package Shipping†

MBR40250G TO−220AC

(Pb−Free) 50 Units / Rail

MBR40250TG TO−220AB

(Pb−Free) 50 Units / Rail

MBRF40250TG TO−220

FULLPACK

(Pb−Free)

50 Units / Rail

MBRB40250TG D2PAK

(Pb−Free) 50 Units / Rail

MBRB40250TT4G D2PAK

(Pb−Free) 800 Units / Tape & Reel

MBR40250, MBR40250T, MBRF40250T, MBRB40250T

http://onsemi.com

PACKAGE DIMENSIONS

TO−220

CASE 221A−09

ISSUE AF

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL

BODY AND LEAD IRREGULARITIES ARE

ALLOWED.

STYLE 6:

PIN 1. ANODE

2. CATHODE

3. ANODE

4. CATHODE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.570 0.620 14.48 15.75

B0.380 0.405 9.66 10.28

C0.160 0.190 4.07 4.82

D0.025 0.035 0.64 0.88

F0.142 0.161 3.61 4.09

G0.095 0.105 2.42 2.66

H0.110 0.155 2.80 3.93

J0.014 0.025 0.36 0.64

K0.500 0.562 12.70 14.27

L0.045 0.060 1.15 1.52

N0.190 0.210 4.83 5.33

Q0.100 0.120 2.54 3.04

R0.080 0.110 2.04 2.79

S0.045 0.055 1.15 1.39

T0.235 0.255 5.97 6.47

U0.000 0.050 0.00 1.27

V0.045 --- 1.15 ---

Z--- 0.080 --- 2.04

123

SEATING

PLANE

−T−

TO−220AC

CASE 221B−04

ISSUE E

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.595 0.620 15.11 15.75

B0.380 0.405 9.65 10.29

C0.160 0.190 4.06 4.82

D0.025 0.035 0.64 0.89

F0.142 0.161 3.61 4.09

G0.190 0.210 4.83 5.33

H0.110 0.130 2.79 3.30

J0.014 0.025 0.36 0.64

K0.500 0.562 12.70 14.27

L0.045 0.060 1.14 1.52

Q0.100 0.120 2.54 3.04

R0.080 0.110 2.04 2.79

S0.045 0.055 1.14 1.39

T0.235 0.255 5.97 6.48

U0.000 0.050 0.000 1.27

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

MBR40250, MBR40250T, MBRF40250T, MBRB40250T

http://onsemi.com

PACKAGE DIMENSIONS

TO−220 FULLPAK

CASE 221D−03

ISSUE J

DIM

MIN MAX MIN MAX

MILLIMETERS

0.617 0.635 15.67 16.12

INCHES

B0.392 0.419 9.96 10.63

C0.177 0.193 4.50 4.90

D0.024 0.039 0.60 1.00

F0.116 0.129 2.95 3.28

G0.100 BSC 2.54 BSC

H0.118 0.135 3.00 3.43

J0.018 0.025 0.45 0.63

K0.503 0.541 12.78 13.73

L0.048 0.058 1.23 1.47

N0.200 BSC 5.08 BSC

Q0.122 0.138 3.10 3.50

R0.099 0.117 2.51 2.96

S0.092 0.113 2.34 2.87

U0.239 0.271 6.06 6.88

−B−

−Y−

3 PL

123

0.25 (0.010) Y

SEATING

PLANE

−T−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH

3. 221D-01 THRU 221D-02 OBSOLETE, NEW

STANDARD 221D-03.

MBR40250, MBR40250T, MBRF40250T, MBRB40250T

http://onsemi.com

PACKAGE DIMENSIONS

D2PAK 3 (TO−263, 3−LEAD)

CASE 418AJ

ISSUE A

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

D0.330 0.380 8.38 9.65

E0.380 0.420 9.65 10.67

A0.160 0.190 4.06 4.83

b0.020 0.039 0.51 0.99

c2 0.045 0.065 1.14 1.65

e0.100 BSC 2.54 BSC

A1 0.000 0.010 0.00 0.25

c0.012 0.029 0.30 0.74

L0.070 0.110 1.78 2.79

H0.575 0.625 14.60 15.88

L2 −−−− 0.070 −−−− 1.78

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. CHAMFER OPTIONAL

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH. MOLD FLASH SHALL NOT EXCEED 0.005

PER SIDE. THESE DIMENSIONS ARE MEASURED

AT THE OUTERMOST EXTREMES OF THE

PLASTIC BODY AT DATUM H.

5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN

DIMENSIONS E, L1, D1 AND E1.

6. OPTIONAL MOLD FEATURE

E1 0.245 −−−− 6.22 −−−−

L1 −−−− 0.066 −−−− 1.68

D1 0.260 −−−− 6.60 −−−−

L3 0.010 BSC 0.25 BSC

M08 08°° °°

A1 B

MDETAIL C

SEATING

PLANE

0.10 B

BSEATING

PLANE

DETAIL C

VIEW A−A

SIDE VIEW

TOP VIEW

VIEW A−A

OPTIONAL CONSTRUCTIONS

GAUGE

PLANE

NOTE 3

0.10 B

RECOMMENDED

0.366

0.100

DIMENSIONS: INCHES

PITCH

0.653

0.063

0.436

0.169

SOLDERING FOOTPRINT

NOTE 6

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

MBR40250/D

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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