BD95850F-LBE2 - ROHM SEMICONDUCTOR

Datashee

t

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

1/19 TSZ02201- 0RCR1GZ00130-1-2

www.rohm.com

TSZ22111 .14.001

EARTH LEAKAGE CURRENT DETECTOR IC SERIES

EARTH LEAKAGE

CURRENT DETECTOR IC

BD95850F-LB

Description

This is the product guarantees long time support in

Industrial market.

The BD95850F-LB is the monolithic IC integrates earth

leakage detection, signal amplification, and overvoltage

detection .

Especially, it’s suitable for high-sensitivity and high

-speed operation use, and, since the operating

temperature range is wide, it can be used for various

applications.

Features

■ Long Time Support Product for Industrial Applications

■ Small Temperature Fluctuation

and High Input Sensitivity

■ Wide Operating Temperature Range

■ Detection Mode Selectable

(1 count method /1.5 count method)

Applications

■ Earth leakage circuit breaker

■ Earth leakage circuit relay

■ Industrial equipment

Key Specifications

■ Operating Supply Voltage Range: 7V to 13V

■ Operating Temperature Range: -30°C to +95°C

■ Supply Current: 830μA(Typ)

■ Trip Voltage(Leakage Detection DC Voltage): 7.5mV

■ Output Current Ability : -100μA(Min)

Package W(Typ) x D(Typ) x H(Max)

SOP14 8.70mm x 6.20mm x 1.71mm

Typical Application Circuit Example

ZCT:Zero-phase Current Transfo rmer

Trip

Coil

Power

Supply

Leakage Detection

Overvoltage

Detection Reset

SCR

Driver

IREF VREF ILKI TRC1 TRC2 PSEL

OFFC SCRTIBLI TTDCVCC PSAVVS

1234567

14 13 12 11 10 9 8

SCR

VCC

COS

COFFC

CTTDC

CRC1 CRC2 VCC

RVS

CVS VZ

Datasheet

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BD95850F-LB

TSZ02201- 0RCR1GZ00130-1-2

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TSZ22111 .15.001

SOP14

(TOP VIEW)

1 2 3 4 5 6 7

14 13 12 11 10 9 8

Pin Configurations Block Diagrams

Pin Descriptions

Pin No. Symbol Function Pin No. Symbol Function

1 GND Ground 8 SCRT Output for driving thyristor

2 IREF

Connect a resistor to set constant

current of the internal circuits 9 OFFC Connect a capacitor to set reset time

3 VREF Reference voltage output 10 TTDC Connect a capacitor to set over-voltage

detection time

4 ILKI Input of leakage detection signal 11 IBLI Input of over-voltage detection signal

5 TRC1

Connect a capacitor for charge

current of negative detection 12 PSAV Enable pin for overvoltage detection

function

6 TRC2

Connect a capacitor for charge

current of positive detection 13 VCC Internal power supply

7 PSEL

Logic function switching pin for

leakage detection 14 VS Power supply

Absolute Maximum Ratings

(TA=25°C) Parameter Symbol Rating Unit Condition

Supply Current IS 4 mA

Supply Voltage (Note 1) V

S 18 V

Input Voltage VΔIN -1.5 to +1.5 V across ILKI and VREF

Input Current IΔIN -5 to +5 mA across ILKI and VREF

Input Current of VREF IVREF 10 mA across VREF and GND

Input Voltage VXXXX 8 V

IREF/REF/IN/TRC1/TRC2/

PSEL/SCRT/OFFC/PSAV/

TTDC/VCC/IBLI

Input Voltage of Overvoltage Detection VIBLI -0.3 to +5.0 V across IBLI and GND

Input Current of Overvoltage Detection IIBLI 4 mA across IBLI and GND

Power Dissipation PD 0.56

(Note 2) W

Operating Temperature Topr -30 to +95 °C

S torage Temperature Tstg -55 to +150 °C

(Note 1) Supply voltage is limited by internal clamping circuit . Please refer to maximum current voltage of the electrical characteristic item.

(Note 2) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.5mW per 1°C above 25°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Recommended Operating Conditions

Parameter Symbol Rating Unit

Supply Voltage VSopr 7 to 13 V

Power Supply

Leakage Detection

Overvoltage

Detection Reset

SCR

Drive

IREF VREF ILKI TRC1 TRC2 PSEL

OFFC SCRTIBLI TTDCVCC PSAVVS

1234567

14 13 12 11 10 9 8

Datasheet

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TSZ22111 .15.001

Electrical Characteristic

(unless otherwise specified VS=9V,GND=0V, TA=25°C)

Item Symbol Limits Unit Condition

Min Typ Max

Supply current : during standby IS0 - 830 940 µ A PSAV=VCC

Supply current : during leakage detection IS1 - 840 950 µ A PSAV=VCC

Supply current : during overvoltage detection IS2 - 840 950 µ A PSAV=VCC

Supply current : during SCRT pin is "H" IS3 - - 870 µ A PSAV=VCC

Supply current : during standby IS0' - 750 860 µ A PSAV=GND

Supply current : during leakage detection IS1' - 760 870 µ A PSAV=GND

Supply current : during SCRT pin is "H" IS3' - - 870 µ A PSAV=GND

IS0 Ambient temperature dependence - - -0.07 - %/ °C TA=-30°C to +85°C

Voltage at maximum current VSM 13.2 14.8 16.4 V IS=3mA

Leakage detection DC input voltage VT - ±7.5 - mV

ILKI pin input bias current IIH - 1 15 nA VILKI=VREF

VREF pin output voltage VVREF - 2.4 - V

ILKI-VREF input clamping voltage VINCL - ±0.8 - V IILKI=±3mA

VREF-GND clamping voltage VVREFCL - 5.5 - V IRCL=5mA

TRC1 pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-10µA

TRC1 pin threshold voltage VTH - 2.4 - V

TW1 pulse width precision ETW1 -15 - +15 % C=0.01µF：TW1=2.3ms

TW1 ambient temperature dependence - - -0.08 - %/ °C TA=-30°C to +85°C

TRC2 pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-10µA

TRC2 pin threshold voltage VTH - 2.4 - V

TW2 pulse width precision ETW2 -15 - +15 % C=0.0047µF：TW1=1.1ms

TW2 ambient temperature dependence - - -0.08 - %/ °C TA=-30°C to +85°C

VT ambient temperature dependence - - -4 - % TA=+25°C to +85°C

- -2 - % TA=+25°C to -30°C

Overvoltage detection voltage VIBLI 2.3 2.4 2.5 V

VIBLI supply voltage dependence - - 0.1 - %/V

VIBLI ambient temperature dependenc e - - 0.06 - %/°C TA=-30°C to +85°C

IBLI pin input bias current IIBLI - 50 300 nA VIN=VREF

IBLI-GND clamping voltage VIBLICL - 6.1 - V IIN=1mA

TTDC pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-8µA

TTDC pin threshold voltage VTH - 2.4 - V

Delay time pulse width precision ETW4 -30 - +30 % C=1.0µF：TW4=300ms

OFFC pin "H" output current precision EIOH -20 - +20 % VO=0V：IOH=-10µA

OFFC pin threshold voltage VTH - 2.4 - V

Reset timer pulse width precision ETW3 -30 - +30 % C=0.33µF：TW3=55ms

SCRT pin "L" output voltage VOL3 - 0.02 0.2 V ICL=200µA

SCRT pin "H" output current

IOHc - -300 -200 µ A TA=-30°C,VO=0.8V

IOHn - -260 -100 µ A TA=+25°C,VO=0.8V

IOHh - -210 -70 µ A TA=+85°C,VO=0.8V

IOH hold supply voltage VSOFF - 3.7 - V

Datasheet

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BD95850F-LB

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Function Explanation

1.Switching of leakage detection mode

The input logic to become output SCRT=HIGH

PSEL pin

voltage

VCC Negative input → Positive input

(1 count method mode)

GND Negative input → Positive input → Negative input

(1.5 count method mode)

2.ON/OFF switching of overvoltage detection function

State of the overvoltage detection function

PSAV pin

voltage

VCC ON

GND OFF

3.Reset function

Please connect a capacitor to OFFC pin (Pin.9) to set time in follows for making an IC initial state after a certain period of

time.

・When a leakage detection in put signal does not continue

・When an overvoltage detection signa l does not continue

・After leakage detection or overvoltage detection, SCRT output voltage becomes high

4.Overvoltage detection wait time

After first overvoltage detection, SCRT output voltage becomes “H” when overvoltage is detected after a certain period of

time.

Please set the wait time with a capacitor connecting to TTDC pin (Pin.10).

5.Time delay function

As shown below, by applying overvoltage detection function, the leakage detection function can be pr ovided with a time

delay function. However, the overvoltage detection function can not be used.

In Figure 1; It is set by a diode between Pin.6 and Pin.10, GND connection of Pin.11.

In Figure 2; It is set by PNP transistor between Pin.6 and Pin.10, GND connection of Pin.11.

In the case of Figure 2, the delay time becomes approximatel y 60% of Figure 1.

Figure 1. Setting of time delay function 1 Figure 2. Setting of time delay function 2

6.IREF terminal

A resistance connecting to this terminal becomes the standard constant current source of this IC. Cause this resistance

determines the characteristic of each circuit, it is recommended that a high precision resistance (+-1%) be used.

VCC

Trip

Coil

VCC

Power

Supply

Leakage Detecti on

Overvoltage

Detection Reset

SCR

Driver

IREF VREF ILKI TRC1 TRC2 PSEL

OFFC SCRTIBLI TTDCVCC PSAVVS

1234567

14 13 12 11 10 9 8

VCC

Trip

Coil

VCC

Power

Supply

Leakage Detection

Overvoltage

Detection Reset

SCR

Driver

IREF VREF ILKI TRC1 TRC2 PSEL

OFFC SCRTIBLI TTDCVCC PSAVVS

1234567

14 13 12 11 10 9 8

Datasheet

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BD95850F-LB

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TSZ22111 .15.001

Timing Chart

1. Earth leakage detection

1-1. 1 count method

1-2. 1.5 count method

Datasheet

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Timing Char t - continued

2.Overvoltage detection

3.A time delay function for leakage detection

After the first leakage detection, SCRT pin becomes “H” after a certain period of time.

OFFC

SCRT

TW3

TW4

2.4V

TTDC

IBLI

2.4V

Datasheet

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TSZ22111 .15.001

Test Circuit

(RBIAS=120kΩ)

RBIAS

Datasheet

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TSZ22111 .15.001

0

250

500

750

1000

036912

Supply Current [µA]

Supply Voltage [V]

0

250

500

750

1000

036912

Supply Current [µA]

Supply Voltage [V]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0 25 50 75 100 125 150

Power Dissipation [W]

Ambient Temperature [℃]

95

Ty pical Performance Curves (reference data)

0

4

8

12

16

01234

Vs Terminal Voltage [V]

Supply Current [mA]

Figure 3.

Supply Current - Supply Voltage

During Standby

Figure 4.

Supply Current - Supply Voltage

During Standby

Figure 1.

Derating Curve Figure 2.

Supply Voltage - Supply Current

25 °C

105°C

-40 °C

PSAV=GND PSAV=VCC

25 °C

125 °C

-40 °C 25 °C

125 °C

-40 °C

Datasheet

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TSZ02201- 0RCR1GZ00130-1-2

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TSZ22111 .15.001

0

2

4

6

8

036912

Vcc Terminal Voltage [V]

Supply Voltage [V]

0.0

0.5

1.0

1.5

2.0

2.5

3.0

036912

Vref Terminal Voltage [V]

Supply Voltage [V]

1.0

1.1

1.2

1.3

1.4

01234

Iref Terminal Voltage [V]

Supply Current [mA]

0.0

2.0

4.0

6.0

8.0

0.0 2.5 5.0 7.5 10.0

Vref Terminal Voltage [V]

Input Current [mA]

Ty pical Performance Curves (reference data) - continued

Figure 5.

VCC pin Voltage - Supply Voltage Figure 6.

VREF pin Voltage - Supply Voltage

Figure 7.

IREF pin Voltage - Supply Voltage Figure 8.

VREF pin Clamping Voltage - Input Current

25 °C

125 °C

-40 °C

25 °C

125 °C

-40 °C

25 °C

105 °C

-40 °C

25 °C

125 °C

-40 °C

Datasheet

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TSZ02201- 0RCR1GZ00130-1-2

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TSZ22111 .15.001

2.0

2.2

2.4

2.6

2.8

-40 0 40 80 120

Ibli Threshold Voltage [V]

Ambient Temperature [℃]

Ty pical Performance Curves (reference data) - continued

0

100

200

300

400

6 8 10 12 14

Supply Voltage [V]

Os Source Current [µA]

6.0

7.0

8.0

9.0

10.0

-40 0 40 80 120

Ambient Temperature [℃]

Trip Voltage [mV]

Figure 9.

Trip Voltage – Ambient Temperature Figure 10.

Overvoltage Detection Threshhold Voltage

- Ambient Temperature

Figure 11.

SCRT pin Source Current - Supply Voltage Figure 12.

Overvoltage Detection Threshhold Voltage

- Supply Voltage

VT+

VT-

2.0

2.2

2.4

2.6

2.8

6 8 10 12 14

Supply Voltage [V]

Ibli Threshold Voltage [V]

25℃

125℃

-40℃

Datasheet

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TSZ02201- 0RCR1GZ00130-1-2

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TSZ22111 .15.001

4

6

8

10

12

6 8 10 12 14

Ttdc Output Current [µA]

Supply Voltage [V]

Ty pical Performance Curves (reference data) - continued

6

8

10

12

14

6 8 10 12 14

Supply Voltage [V]

Trc Output Current [µA]

6

8

10

12

14

6 8 10 12 14

Supply Voltage [V]

Offc Output Current [µA]

Figure 13.

OFFC pin Source Current - Supply Voltage Figure 14.

TTDC pin Source Current - Supply Voltage

Figure 15.

TRC1/2 pin Source Current - Supp ly Voltage

25 °C

125°C

-40 °C

25°C

125 °C

-40°C

25°C

125°C

-40°C

Datasheet

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BD95850F-LB

TSZ02201- 0RCR1GZ00130-1-2

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TSZ22111 .15.001

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 25 50 75 100 125 150

AMBIENT TEMPERA TURE [ ℃]

POWER DISSIPATION [W]

95

Power Dissipation

Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C (normal temperature).IC is heated

when it consumed power, and the temperat ure of IC chip becomes higher than ambient temperature. The temperatur e that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal

resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead

frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called

thermal resistance, represented by the symbol θJA°C/W. The temperature of IC inside the package can be estimated by this

thermal resistance. F igure 16(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient

temperature TA, junction temperature TJmax, and power dissipation PD can be calculated by the equation below

θJA = (TJmax - TA) / PD °C /W ・・・・・ (Ⅰ)

Derating curve in Figure 16(b ) indicates power that can be cons umed by IC with reference to ambient temperatur e. Power

that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θJA. Thermal resistance θJA depends on chip size, po wer consum ption, package, ambient tem peratur e, package

condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value

measured at a specified condition. Figure 17(a) sho w a derating curve for an e xample of BD95850F-LB .

Derating Curve Slope Unit

BD95850F-LB 4.5 mW/°C

When using the unit above TA=25°C, subtract the value above per degree℃

Power dissipation is a value when glass epoxy board 70mm×70mm×1.6mm

(cooper foil area below 3%) is mounted.

Figure 17. Derating Curve

(a) BD95850F-LB

(a) Thermal Resistance

Figure 16. Thermal Resistance and Derating Curve

θJA =(TJmax-TA)/P °C /W

周囲温度 Ta [℃]

チップ表面温度 Tj [℃]

消費電力 P [W]

Ambient temperature TA[°C]

Chip surface t emperature TJ[°C]

0 50 75 100 125 15025

P1

P2

Pd (m ax)

LSIの消費電力 [W ]

θ' ja2

θ' ja1 Tj ' ( ma x)

θja2 < θja1

周囲温度 Ta [℃]

θ ja2

θ ja1 Tj ( ma x)

周囲温度

PD(max)

θJA2 < θJA1

θ’JA2 θJA2

θ’JA1 θJA1

TA [ °C ]

T’Jmax TJmax

LSI の消費電力

Ambient temperature TA [°C]

Power dissi

p

atio n of LSI

(b) Derating Curve

Datasheet

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BD95850F-LB

TSZ02201- 0RCR1GZ00130-1-2

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TSZ22111 .15.001

Pin.1

[GND] Pin.5

[TRC1]

Pin.2

[IREF] Pin.6

[TRC2]

Pin.3

[REF] Pin.7

[PSEL]

Pin.4

[IN] Pin.8

[SCRT]

VCC

VCC VCC

Pin.4

322kΩ

500Ω

350Ω150Ω

VCC

Pin.3

VCC

350Ω

VCC

150Ω

VCC

50kΩ

VCC

I/O Equivalence Circuit

Datasheet

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TSZ22111 .15.001

I/O Equivalence Circuit - continued

Pin.9

[OFFC] Pin.12

[PSAV]

Pin.10

[TTDC] Pin.13

[VCC]

Pin.11

[IBLI] Pin.14

[VS] CL

BG

VCC VCC

VCC

Internal

Circuit

Pin.14

Datasheet

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and suppl y lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using bot h small-signal and large-current ground tr aces, the two ground traces should be routed s eparately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce lin e impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this s pecification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper are a to prevent e xceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed und er the conditions of each parameter.

7. Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instant aneously du e to the internal powering seq uence and delays, espe cially if the IC has

more than one power supply. Therefore, give special consideration to power coupling capacitance, power

wiring, width of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagn etic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before co nnecting or rem oving it from the test setup d uring the inspect ion pr ocess. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are c orrect when mounting the IC on the PCB. Incorrect mounting may result i n

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Datasheet

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Operational Notes – continued

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedanc e

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 18. Example of monolithic IC structure

Datasheet

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Ordering Information

B D 9 5 8 5 0 F - L B E 2

Part Numbe

r

Package

F: SOP14

Product class

LB for Industrial applications

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

SOP14

(TOP VIEW)

BD95850F

LOT Numbe

r

1PIN MARK

Datasheet

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Physical Dimension, Tape and Reel Information

Package Name SOP14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

(Max 9.05 (include.BURR))

Datasheet

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Revision History

Date Revision Changes

13.Jun.2014 001 New Release

Datasheet

Notice – SS Rev.002

Notice

Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred b y you or thir d parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expens es or losses arising from the

use of any ROHM’s Products under an y special or extraordinary envir onments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product perform ance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (P d) depe nding on Ambient temper ature (Ta). When us ed in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant condi tion from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active hal ogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

Datasheet

Notice – SS Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportati on

1. Product performance and soldered connecti ons may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidit y exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to hi gh Electrostatic

2. Even under ROHM recommended storage condition, solder ability of products out of recommended storage time peri od

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier ba g. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products pl ease dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No lice nse, e xpressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the developm ent of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.