LZ1-00DB00-0000 - LED ENGIN, INC - Datasheet.Directory

High Efficacy

Dental Blue LED Emitter

LZ1-00DB00

Key Features

 High Efficacy 5W Dental Blue LED

 Ultra-small foot print – 4.4mm x 4.4mm

 Surface mount ceramic package with integrated glass lens

 Very low Thermal Resistance (4.2°C/W)

 Very high Radiant Flux density

 New industry standard for Radiant Flux Maintenance

 New industry standard for Autoclave (135°C, 2 ATM, 100% RH, 168 Hours)

 JEDEC Level 1 for Moisture Sensitivity Level

 Lead (Pb) free and RoHS compliant

 Reflow solderable (up to 6 cycles)

 Available on tape and reel or with MCPCB

Typical Applications

 Dental Curing

 Teeth Whitening

Description

The LZ1-00DB00 Dental Blue LED emitter provides superior radiometric power in the wavelength range specifically

required for dental curing light applications. With a 4.4mm x 4.4mm ultra-small footprint, this package provides

exceptional optical power flux density making it ideal for use in dental curing devices. The radiometric power

performance and optimal peak wavelength of this LED are matched to the response curves of dental resins,

resulting in a significantly reduced curing time. The expanded 135°C Autoclave conditions allow for a much quicker

Autoclave cycle. The patent-pending design has unparalleled thermal and optical performance. The high quality

materials used in the package are chosen to optimize light output and minimize stresses which results in

monumental reliability and radiant flux maintenance.

2

Part number options

Base part number

Part number

Description

LZ1-00DB00-xxxx

LZ1 emitter

LZ1-10DB00-xxxx

LZ1 emitter on Standard Star MCPCB

LZ1-30DB00-xxxx

LZ1 emitter on Miniature round MCPCB

Bin kit option codes

DB, Dental-Blue (460nm)

Kit number

suffix

Min

flux

Bin

Color Bin Range

Description

0000

L

D1 – D1

full distribution flux; full distribution

wavelength

Notes:

1. Default bin kit option is -0000

3

Radiant Flux Bins

Table 1:

Bin Code

Minimum

Radiant Flux (Φ)

@ IF = 1000mA

[1,2]

(mW)

Maximum

Radiant Flux (Φ)

@ IF = 1000mA

[1,2]

(mW)

L

800

1000

M

1000

1250

Notes for Table 1:

1. Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of

± 10% on flux measurements.

2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.

Peak Wavelength Bin

Table 2:

Bin Code

Minimum

Peak Wavelength (λP)

@ IF = 1000mA

[1]

(nm)

Maximum

Peak Wavelength (λP)

@ IF = 1000mA

[1]

(nm)

D1

457

463

Notes for Table 2:

1. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.

Forward Voltage Bin

Table 3:

Bin Code

Minimum

Forward Voltage (VF)

@ IF = 1000mA

[1]

(V)

Maximum

Forward Voltage (VF)

@ IF = 1000mA

[1]

(V)

0

3.20

4.40

Notes for Table 3:

1. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.

4

Absolute Maximum Ratings

Table 4:

Parameter

Symbol

Value

Unit

DC Forward Current at Tjmax=135°C [1]

IF

1200

mA

DC Forward Current at Tjmax=150°C [1]

IF

1000

mA

Peak Pulsed Forward Current

[2]

IFP

2000

mA

Reverse Voltage

VR

See Note 3

V

Storage Temperature

Tstg

-40 ~ +150

°C

Junction Temperature

TJ

150

°C

Soldering Temperature

[4]

Tsol

260

°C

Allowable Reflow Cycles

6

Autoclave Conditions

135°C at 2 ATM,

100% RH for 168 hours

ESD Sensitivity

[5]

> 8,000 V HBM

Class 3B JESD22-A114-D

Notes for Table 4:

1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating.

2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.

3. LEDs are not designed to be reverse biased.

4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.

5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00DB00 in an electrostatic protected area (EPA).

An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.

Optical Characteristics @ TC = 25°C

Table 5:

Parameter

Symbol

Typical

Unit

Radiant Flux (@ IF = 700mA)

Φ

850

mW

Radiant Flux (@ IF = 1000mA)

Φ

1100

mW

Peak Wavelength

[1]

λP

460

nm

Viewing Angle

[2]

2Θ½

80

Degrees

Total Included Angle

[3]

Θ0.9

90

Degrees

Notes for Table 5:

1. Observe IEC 60825-1 class 2 rating for eye safety. Do not stare into the beam.

2. Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value.

3. Total Included Angle is the total angle that includes 90% of the total radiant flux.

Electrical Characteristics @ TC = 25°C

Table 6:

Parameter

Symbol

Typical

Unit

Forward Voltage (@ IF = 1000mA)

VF

3.6

V

Forward Voltage (@ IF = 1200mA)

VF

3.7

V

Temperature Coefficient

of Forward Voltage

ΔVF/ΔTJ

-2.8

mV/°C

Thermal Resistance

(Junction to Case)

RΘJ-C

4.2

°C/W

5

IPC/JEDEC Moisture Sensitivity Level

Table 7 - IPC/JEDEC J-STD-20 MSL Classification:

Soak Requirements

Floor Life

Standard

Accelerated

Level

Time

Conditions

Time (hrs)

Conditions

Time (hrs)

Conditions

1

Unlimited

≤ 30°C/

60% RH

168

+5/-0

85°C/

60% RH

n/a

Notes for Table 7:

1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag

and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.

Average Radiant Flux Maintenance Projections

Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux

Maintenance at 65,000 hours of operation at a forward current of 1000 mA. This projection is based on constant

current operation with junction temperature maintained at or below 125°C.

6

1

2

3

4

5

Mechanical Dimensions (mm)

Pin Out

Pad

Function

1

Cathode

2

Anode

3

Anode

4

Cathode

5

[2]

Thermal

Figure 1: Package outline drawing.

Notes for Figure 1:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. Thermal contact, Pad 5, is electrically neutral.

Recommended Solder Pad Layout (mm)

Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad

Note for Figure 2a:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

7

Recommended Solder Mask Layout (mm)

Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad

Note for Figure 2b:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

Recommended 8mil Stencil Apertures Layout (mm)

Figure 2c: Recommended solder mask opening for anode, cathode, and thermal pad

Note for Figure 2c:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

8

0

10

20

30

40

50

60

70

80

90

100

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Angular Displacement (Degrees)

Relative Intensity (%)

Reflow Soldering Profile

Figure 3: Reflow soldering profile for lead free soldering.

Typical Radiation Pattern

Figure 4: Typical representative spatial radiation pattern.

9

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

400 450 500 550 600 650 700

Wavelength (nm)

Relative Spectral Power

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

025 50 75 100 125 150

Case Temperature (ºC)

Peak Wavelength Shift (nm)

Typical Relative Spectral Power Distribution

Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.

Typical Peak Wavelength Shift over Temperature

Figure 6: Typical peak wavelength shift vs. case temperature.

10

0

0.2

0.4

0.6

0.8

1

1.2

1.4

0200 400 600 800 1000 1200 1400 1600

IF - Forward Current (mA)

Normalized Radiant Flux

0

0.2

0.4

0.6

0.8

1

1.2

025 50 75 100 125 150

Case Temperature (ºC)

Normalized Radinat Flux

Typical Normalized Radiant Flux

Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C.

Typical Normalized Radiant Flux over Temperature

Figure 8: Typical normalized radiant flux vs. case temperature.

11

0

200

400

600

800

1000

1200

1400

1600

025 50 75 100 125 150

Maximum Ambient Temperature (ºC)

IF - Maximum Current (mA)

RΘJ-A = 9°C/W

RΘJ-A = 13°C/W

RΘJ-A = 17°C/W

0

200

400

600

800

1000

1200

1400

1600

2.8 3 3.2 3.4 3.6 3.8 4

VF - Forward Voltage (V)

IF - Forward Current (mA)

Typical Forward Current Characteristics

Figure 9: Typical forward current vs. forward voltage @ TC = 25°C.

Current Derating

Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.

Notes for Figure 10:

1. RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00DB00 is typically 4.2°C/W.

2. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].

12

Emitter Tape and Reel Specifications (mm)

Figure 11: Emitter carrier tape specifications (mm).

Figure 12: Emitter reel specifications (mm).

13

LZ1 MCPCB Family

Part number

Type of MCPCB

Diameter

(mm)

Emitter + MCPCB

Thermal Resistance

(°C /W)

Typical Vf

(V)

Typical If

(mA)

LZ1-1xxxxx

1-channel Star

19.9

4.2 + 1.5 = 5.7

3.6

700

LZ1-3xxxxx

1-channel Mini

11.5

4.2 + 2.0 = 6.2

3.6

700

Mechanical Mounting of MCPCB

 MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to

substrate cracking and subsequently LED dies cracking.

 To avoid MCPCB bending:

o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.

o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3

screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will

increase the likelihood of board bending.

o It is recommended to always use plastics washers in combinations with the three screws.

o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after

tightening (with controlled torque) and then re-tighten the screws again.

Thermal interface material

 To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when

mounting the MCPCB on to the heat sink.

 There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal

epoxies. An example of such material is Electrolube EHTC.

 It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating

conditions.

Wire soldering

 To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.

Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is

recommended to use a solder iron of more than 60W.

 It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:

24-7068-7601)

14

LZ1-1xxxxx

1 channel, Standard Star MCPCB (1x1) Dimensions (mm)

Notes:

 Unless otherwise noted, the tolerance = ± 0.2 mm.

 Slots in MCPCB are for M3 or #4-40 mounting screws.

 LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

 LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.

 The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W

Components used

MCPCB: HT04503 (Bergquist)

ESD/TVS Diode: BZT52C5V1LP-7 (Diodes, Inc., for 1 LED die)

VBUS05L1-DD1 (Vishay Semiconductors, for 1 LED die)

Pad layout

Ch.

MCPCB

Pad

String/die

Function

1

1,2,3

1/A

Cathode -

4,5,6

Anode +

15

LZ1-3xxxxx

1 channel, Mini Round MCPCB (1x1) Dimensions (mm)

Notes:

 Unless otherwise noted, the tolerance = ± 0.20 mm.

 LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.

 The thermal resistance of the MCPCB is: RΘC-B 2.0°C/W

Components used

MCPCB: HT04503 (Bergquist)

ESD/TVS Diode: BZT52C5V1LP-7 (Diodes, Inc., for 1 LED die)

VBUS05L1-DD1 (Vishay Semiconductors, for 1 LED die)

Pad layout

Ch.

MCPCB

Pad

String/die

Function

1

1/A

Anode +

2

Cathode -

16