The SN54LS07 and SN74LS17 are
o
bsolete and are no longer supplied
.
SDLS021C − M AY 1990 − REVISED FEBRUARY 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DConvert TTL Voltage Levels to MOS Levels
DHigh Sink-Current Capability
DInput Clamping Diodes Simplify System
Design
DOpen-Collector Driver for Indicator Lamps
and Relays
description/ordering information
These hex buffers/drivers feature high-voltage
open-collector outputs to interface with high-level
circuits or for driving high-current loads. They are
also characterized for use as buffers for driving TTL inputs. The ’LS07 devices have a rated output voltage of
30 V, and the SN74LS17 has a rated output voltage of 15 V. The maximum sink current is 30 mA for the
SN54LS07 and 40 mA for the SN74LS07 and SN74LS17.
These circuits are compatible with most TTL families. Inputs are diode-clamped to minimize transmission-line
effects, which simplifies design. Typical power dissipation is 140 mW, and average propagation delay time is
12 ns.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube SN74LS07N SN74LS07N
SOIC − D
Tube SN74LS07D
LS07
0°C to 70°CSOIC − D Tape and reel SN74LS07DR LS07
0C to 70 C
SOP − NS Tape and reel SN74LS07NSR 74LS07
SSOP − DB Tape and reel SN74LS07DBR LS07
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
logic diagram (positive logic)
1A
2A
3A
4A
5A
6A
1Y
2Y
3Y
4Y
5Y
6Y
1
3
5
9
11
13
2
4
6
8
10
12
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
SN54LS07 ...J PACKAGE
SN74LS07, SN74LS17 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
*"!-('%& '!#*,$% %! 4565 $,, *$"$#)%)"& $") %)&%)-
(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%!
*"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&.
The SN54LS07 and SN74LS17 are
o
bsolete and are no longer supplied
.
SDLS021C − M AY 1990 − REVISED FEBRUARY 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic (each gate)
Input
VCC
Output
GND
9 kΩ1 kΩ
2 kΩ
2 kΩ
5 kΩ
Resistor values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO (see Notes 1 and 2): SN54LS07, SN74LS07 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74LS17 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range,Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
The SN54LS07 and SN74LS17 are
o
bsolete and are no longer supplied
.
SDLS021C − M AY 1990 − REVISED FEBRUARY 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
SN54LS07
SN74LS07
SN54LS07
SN74LS07
SN74LS17
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VOH
High-level output voltage
’LS07 30 30
V
VOH High-level output voltage SN74LS17 15 V
IOL Low-level output current 30 40 mA
TAOperating free-air temperature −55 125 0 70 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
‡SN54LS07 SN74LS07
SN74LS17
UNIT
PARAMETER
TEST CONDITIONS‡
MIN MAX MIN MAX
UNIT
VIK VCC = MIN, II = −12 mA −1.5 −1.5 V
IOH
VCC = MIN,
VIH = 2 V
’LS07, VOH = 30 V 0.25 0.25
mA
IOH VCC = MIN, VIH = 2 V SN74LS17, VOH = 15 V 0.25 mA
VOL
VCC = MIN,
VIL = 0.8 V
IOL = 16 mA 0.4 0.4
V
VOL VCC = MIN, VIL = 0.8 V IOL = MAX§0.7 0.7 V
IIVCC = MAX, VI = 7 V 1 1 mA
IIH VCC = MAX, VI = 2.4 V 20 20 µA
IIL VCC = MAX, VI = 0.4 V −0.2 −0.2 mA
ICCH VCC = MAX 14 14 mA
ICCL VCC = MAX 45 45 mA
‡For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§IOL = 30 mA for SN54 series parts and 40 mA for SN74 series parts.
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
FROM
TO
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tPLH
A
Y
RL = 110 Ω,
CL = 15 pF
6 10
ns
tPHL
A
Y
R
L
= 110
Ω
,
C
L
= 15 pF
19 30
ns
The SN54LS07 and SN74LS17 are
o
bsolete and are no longer supplied
.
SDLS021C − M AY 1990 − REVISED FEBRUARY 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
tPHL tPLH
tPLH tPHL
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
High-Level
Pulse
Low-Level
Pulse
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
Out-of-Phase
Output
(see Note D)
3 V
0 V
VOL
VOH
VOH
VOL
In-Phase
Output
(see Note D)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
(see Note B)
VCC
RL
From Output
Under Test
CL
(see Note A)
Test
Point
(see Note B
)
V
CC RL
From Output
Under Test
CL
(see Note A)
Test
Point
5 kΩ
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL
.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns
.
G. The outputs are measured one at a time, with one input transition per measurement.
S1
S2
tPHZ
tPLZ
tPZL
tPZH
3 V
3 V
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Timing
Input
Data
Input
3 V
0 V
Output
Control
(low-level
enabling)
Waveform 1
(see Notes C
and D)
Waveform 2
(see Notes C
and D) ≈1.5 V
VOH − 0.5 V
VOL + 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V
tw
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
VOL
VOH
Figure 1. Load Circuits and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LS07D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LS07DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS07NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS07NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS07NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS17D OBSOLETE SOIC D 14 TBD Call TI Call TI
SN74LS17N OBSOLETE PDIP N 14 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS07DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS07DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS07NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS07DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LS07DR SOIC D 14 2500 367.0 367.0 38.0
SN74LS07NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
