SN54ABT623A, SN74ABT623
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS114D – FEBRUARY 1991 – REVISED MAY 1997
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
State-of-the-Art
EPIC-
ΙΙ
B
BiCMOS Design
Significantly Reduces Power Dissipation
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Package, and Plastic (N)
and Ceramic (JT) DIPs
description
The SN54ABT623A and SN74ABT623 bus
transceivers are designed for asynchronous
communication between data buses. The
control-function implementation allows for
maximum flexibility in timing. The SN54ABT623A
and SN74ABT623 provide true data at their
outputs.
These devices allow data transmission from the
A bus to the B bus or from the B bus to the A bus,
depending on the logic levels at the output-enable
(OEAB and OEBA) inputs.
The output-enable inputs can be used to disable the device so that the buses are effectively isolated. The
dual-enable configuration gives the transceivers the capability of storing data by simultaneously enabling OEAB
and OEBA. Each output reinforces its input in this configuration. When both OEAB and OEBA are enabled and
all other data sources to the two sets of bus lines are at high impedance, both sets of bus lines (16 total) remain
at their last states.
To ensure the high-impedance state during power up or power down, OEBA should be tied to VCC through a
pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by
the current-sourcing capability of the driver.
The SN54ABT623A is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT623 is characterized for operation from –40°C to 85°C.
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
SN54ABT623A . . . JT OR W PACKAGE
SN74ABT623 . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
SN54ABT623A . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OEAB
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OEBA
B1
B2
B3
B4
B5
B6
B7
B8
3212019
910111213
4
5
6
7
8
18
17
16
15
14
B1
B2
B3
B4
B5
A3
A4
A5
A6
A7
A2
A1
OEAB
B7
B6 V
OEBA
A8
GND
B8 CC
SN54ABT623A, SN74ABT623
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS114D – FEBRUARY 1991 – REVISED MAY 1997
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
OPERATION
OEBA OEAB
OPERATION
L L B data to A bus
L H B data to A bus,
A data to B bus
H L Isolation
H H A data to B bus
logic symbol†
EN1
19
EN2
1
OEAB
2
A1
3
A2
B1
18
4
A3 5
A4 6
A5 7
A6 8
A7 9
A8
B2
17
B3
16
B5
14 B4
15
B6
13
B8
11 B7
12
OEBA
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
1
2
1
1
logic diagram (positive logic)
A1 B1
OEBA
OEAB
To Seven Other Channels
19
1
218
SN54ABT623A, SN74ABT623
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS114D – FEBRUARY 1991 – REVISED MAY 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (except I/O ports) (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or power-off state, VO –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
Current into any output in the low state, IO: SN54ABT623A 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ABT623 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –18 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 115°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 128°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
recommended operating conditions (see Note 3)
SN54ABT623A SN74ABT623
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
IOH High-level output current –24 –32 mA
IOL Low-level output current 48 64 mA
∆t/∆vInput transition rise or fall rate Outputs enabled 5 5 ns/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: Unused pins (input or I/O) must be held high or low to prevent them from floating.
SN54ABT623A, SN74ABT623
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS114D – FEBRUARY 1991 – REVISED MAY 1997
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C SN54ABT623A SN74ABT623
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN MAX MIN MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 –1.2 V
VCC = 4.5 V, IOH = –3 mA 2.5 2.5 2.5
VOH
VCC = 5 V, IOH = –3 mA 3 3 3
V
V
OH
VCC =45V
IOH = –24 mA 2 2
V
V
CC =
4
.
5
V
IOH = –32 mA 2* 2
VOL
VCC =45V
IOL = 48 mA 0.55 0.55
V
V
OL
V
CC =
4
.
5
V
IOL = 64 mA 0.55* 0.55
V
Vhys 100 mV
II
Control inputs
VCC =55V
VI=V
CC or GND
±1±1±1
µA
I
IA or B ports
V
CC =
5
.
5
V
,
V
I =
V
CC
or
GND
±100 ±100 ±100 µ
A
IOZH‡VCC = 5.5 V, VO = 2.7 V 50** 10 50 µA
IOZL‡VCC = 5.5 V, VO = 0.5 V –50** –10 –50 µA
Ioff VCC = 0, VI or VO ≤ 4.5 V ±100 ±100 µA
ICEX VCC = 5.5 V,
VO = 5.5 V Outputs high 50 50 50 µA
IO§VCC = 5.5 V, VO = 2.5 V –50 –100 –180 –50 –180 –50 –180 mA
VCC
=
5.5 V,
Outputs high 5 250 250 250 µA
ICC A or B ports
VCC
=
5
.
5
V
,
IO = 0, Outputs low 22 30 30 30 mA
VI = VCC or GND Outputs disabled 1 250 250 250 µA
Data inp ts
VCC = 5.5 V, One
input at 3.4 V, Outputs enabled 1.5 1.5 1.5
∆ICC
D
ata
i
nputs
,
Other inputs at VCC
or GND Outputs disabled 0.05 0.05 0.05 mA
Control inputs VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND 1.5 1.5 1.5
CiControl inputs VI = 2.5 V or 0.5 V 4 pF
Cio A or B ports VO = 2.5 V or 0.5 V 7 pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
** These limits apply only to the SN74ABT623.
†All typical values are at VCC = 5 V.
‡The parameters IOZH and IOZL include the input leakage current.
§Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
SN54ABT623A, SN74ABT623
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS114D – FEBRUARY 1991 – REVISED MAY 1997
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER FROM
TO
VCC = 5 V,
TA = 25°CSN54ABT623A SN74ABT623 UNIT
MIN TYP MAX MIN MAX MIN MAX
tPLH
1 2.6 4.1 1 4 1 4.6
ns
tPHL
1 2.6 4.2 0.8 4.1 1 4.6
ns
tPZH
1.7 3.4 6.5 1.2 5.4 1.7 7.5
ns
tPZL
1.7 3.8 6.5 1.5 6.8 1.7 7.5
ns
tPHZ
1.7 4.2 6.5 1.7 7.1 1.7 7.5
ns
tPLZ
1.7 4.7 6.5 1.5 7.1 1.7 7.5
ns
tPZH
1.7 4.8 6.5 1.2 6.8 1.7 7.5
ns
tPZL
1.7 4 6.5 1.7 6.5 1.7 7.5
ns
tPHZ
1.7 3.9 6.5 1.5 6.8 1.7 7.5
ns
tPLZ
1.7 3.2 6.5 1.3 5.8 1.7 7.5
ns
SN54ABT623A, SN74ABT623
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS114D – FEBRUARY 1991 – REVISED MAY 1997
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1.5 V
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
Data Input
Timing Input 1.5 V 3 V
0 V
1.5 V 1.5 V 3 V
0 V
3 V
0 V
1.5 V 1.5 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V 3 V
0 V
1.5 V1.5 V
Input
1.5 V
Output
Control
Output
W aveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V
1.5 V
3.5 V
0 V
1.5 V VOL + 0.3 V
1.5 V VOH – 0.3 V
≈0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9461801Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9461801QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI
5962-9461801QSA ACTIVE CFP W 20 1 TBD Call TI Call TI
SN74ABT623DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74ABT623DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74ABT623NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74ABT623PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74ABT623PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT623PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54ABT623AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54ABT623AJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SNJ54ABT623AW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ABT623DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74ABT623DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74ABT623PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ABT623DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74ABT623DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74ABT623PWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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