MPL115A1T1 - NXP SEMICONDUCTORS - Datasheet.Directory

MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Rev. 8 — 10 October 2017 Data sheet: technical data

1 General description

The MPL115A1 is an absolute pressure sensor with a digital SPI output targeting low

cost applications. A miniature 5 x 3 x 1.2 mm LGA package is ideally suited for the space

constrained requirements of portable electronic devices. Low current consumptions of

5 μA during Active mode and 1 μA during Shutdown (Sleep) mode are essential when

focusing on low-power applications. The wide operating temperature range spans from –

40 °C to +105 °C to fit demanding environment conditions.

The MPL115A1 employs a MEMS pressure sensor with a conditioning IC to provide

accurate pressure measurements from 50 to 115 kPa. An integrated ADC converts

pressure and temperature sensor readings to digitized outputs via a SPI port. Factory

calibration data is stored internally in an on-board ROM. Utilizing the raw sensor output

and calibration data, the host microcontroller executes a compensation algorithm to

render Compensated Absolute Pressure with ±1 kPa accuracy.

The MPL115A1 pressure sensor’s small form factor, low power capability, precision, and

digital output optimize it for barometric measurement applications.

2 Features

•Digitized pressure and temperature information together with programmed calibration

coefficients for host micro use.

•Factory calibrated

•50 kPa to 115 kPa absolute pressure

•±1 kPa accuracy

•2.375 V to 5.5 V supply

•Integrated ADC

•SPI Interface

•Monotonic pressure and temperature data outputs

•Surface mount RoHS compliant package

3 Applications

•Barometry (portable and desktop)

•Altimeters

•Weather stations

•Hard-disk drives (HDD)

•Industrial equipment

•Health monitoring

•Air control systems

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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4 Ordering information

Table 1. Ordering information

PackageType number

Name Description Version

MPL115A1 TSON8 LGA 8 I/O, 3 X 5 X 1.25 PITCH, SENSOR 1.2MAX MM PKG SOT1769-1

4.1 Ordering options

Table 2. Ordering options

# of Ports Pressure TypeDevice Name Package Options

None Single Dual Gauge Differential Absolute

Digital

Interface

MPL115A1 Tray • • SPI

MPL115A1T1 Tape & Reel (1000) • • SPI

5 Block diagram

Figure 1. Block diagram of MPL115A1

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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6 Pinning information

6.1 Pinning

transparent top view

DOUT

DIN

VDD

CAP

SHDN

GND

SCLK

MPL115A1

Figure 2. Pin configuration

6.2 Pin description

Table 3. Pin description

Pin Name Function

1 VDD Power Supply Connection. VDD range is 2.375 V to 5.5 V.

2 CAP External Capacitor: Output decoupling capacitor for main internal

regulator. Connect a 1 μF ceramic capacitor to ground.

3 GND Ground

4 SHDN

Shutdown: Connect to GND to disable the device. When in shut

down the part draws no more than 1 μA supply current and all

communications pins (CS, SCLK, DOUT, DIN) are high impedance.

Connect to VDD for normal operation.

5 CS Chip Select line.

6 DOUT Serial data output

7 DIN Serial data input

8 SCLK Serial clock input.

7 Handling and Board Mount Recommendations

The sensor die is sensitive to light exposure. Direct light exposure through the port hole

can lead to varied accuracy of pressure measurement. Avoid such exposure to the port

during normal operation.

7.1 Methods of Handling

Components can be picked from the carrier tape using either the vacuum assist or the

mechanical type pickup heads. A vacuum assist nozzle type is most common due to its

lower cost of maintenance and ease of operation. The recommended vacuum nozzle

configuration should be designed to make contact with the device directly on the metal

cover and avoid vacuum port location directly over the vent hole in the metal cover of the

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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device. Multiple vacuum ports within the nozzle may be required to effectively handle the

device and prevent shifting during movement to placement position.

Vacuum pressure required to adequately support the component should be

approximately 25 inches Hg (85 kPa). This level is typical of in-house vacuum supply.

Pickup nozzles are available in various sizes and configurations to suit a variety of

component geometries. To select the nozzle best suited for the specific application, it

is recommended that the customer consult their pick and place equipment supplier to

determine the correct nozzle. In some cases it may be necessary to fabricate a special

nozzle depending on the equipment and speed of operation.

Tweezers or other mechanical forms of handling that have a sharp point are not

recommended since they can inadvertently be inserted into the vent hole of the device.

This can lead to a puncture of the MEMS element that will render the device inoperable.

7.2 Board Mount Recommendations

Components can be mounted using solder paste stencil, screen printed or dispensed

onto the PCB pads prior to placement of the component. The volume of solder paste

applied to the PCB is normally sufficient to secure the component during transport to the

subsequent reflow soldering process. Use of adhesives to secure the component is not

recommended, but where necessary can be applied to the underside of the device.

Solder pastes are available in variety of metal compositions, particle size and flux types.

The solder paste consists of metals and flux required for a reliable connection between

the component lead and the PCB pad. Flux aids the removal of oxides that may be

present on PCB pads and prevents further oxidation from occurring during the solder

process.

The use of a No-Clean (NC) flux is recommended for exposed cavity components.

Using pressure spray, wire brush, or other methods of cleaning is not recommended

since it can puncture the MEMS device and render it unusable. If cleaning of the pcb

is performed, Water Soluble (WS) flux can be used. However, it is recommended the

component cavity is protected by adhesive Kapton tape, vinyl cap or other means

prior to the cleaning process. This covering will prevent damage to the MEMS device,

contamination, and foreign materials from being introduced into device cavity as result of

cleaning processes.

Ultrasonic cleaning is not recommended as the frequencies can damage wire bond

interconnections and the MEMS device.

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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8 Functional description

Readin g

coefficient data

Data conversion

Initial

powerup

Compensated

pressure readin g

Shutdown

Figure 3. Sequence flow chart

The MPL115A interfaces to a host (or system) microcontroller in the user’s application.

All communications are via SPI. A typical usage sequence is as follows:

Initial power-up

All circuit elements are active. SPI port pins are high impedance and associated registers

are cleared. The device then enters standby mode.

Reading coefficient data

The user then typically accesses the part and reads the coefficient data. The main

circuits within the slave device are disabled during read activity. The coefficients are

usually stored in the host microcontoller local memory but can be re-read at any time.

Reading of the coefficients may be executed only once and the values stored in the host

microcontroller. It is not necessary to read this multiple times because the coefficients

within a device are constant and do not change. However, note that the coefficients will

be different from device to device, and cannot be used for another part.

Data conversion

This is the first step that is performed each time a new pressure reading is required which

is initiated by the host sending the CONVERT command. The main system circuits are

activated (wake) in response to the command and after the conversion completes, the

result is placed into the Pressure and Temperature ADC output registers.

The conversion completes within the maximum conversion time, tc (see row 6, in

Table 11). The device then enters standby mode.

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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Compensated pressure reading

After the conversion has been given sufficient time to complete, the host microcontroller

reads the result from the ADC output registers and calculates the Compensated

Pressure, a barometric/atmospheric pressure value which is compensated for changes

in temperature and pressure sensor linearity. This is done using the coefficient data

from the MPL115A and the raw sampled pressure and temperature ADC output values,

in a compensation equation (detailed later). Note that this is an absolute pressure

measurement with a vacuum as a reference.

From this step the host controller may either wait and then return to the Data Conversion

step to obtain the next pressure reading or it may go to the Shutdown step.

Shutdown

For longer periods of inactivity the user may assert the SHDN input by driving this pin

low to reduce system power consumption. This removes power from all internal circuits,

including any registers. In the shutdown state, the Pressure and Temperature registers

will be reset, losing any previous ADC output values.

This step is exited by taking the SHDN pin high. Wait for the maximum wakeup time,

tw (see row 7, in Table 11), after which another pressure reading can be taken by

transitioning to the data Conversion step.

Table 4. Device memory map

Address Name Description

00h Padc_MSB 10-bit Pressure ADC output value MSB

01h Padc_LSB 10-bit Pressure ADC output value LSB

02h Tadc_MSB 10-bit Temperature ADC output value MSB

03h Tacd_LSB 10-bit Temperature ADC output value LSB

04h a0_MSB a0 coefficient MSB

05h a0_LSB a0 coefficient LSB

06h b1_MSB b1 coefficient MSB

07h b1_LSB b1 coefficient LSB

08h b2_MSB b2 coefficient MSB

09h b2_LSB b2 coefficient LSB

0Ah c12_MSB c12 coefficient MSB

0Bh c12_LSB c12 coefficient LSB

0Ch reserved[1] —

0Dh reserved[1] —

0Eh reserved[1] —

0Fh reserved[1] —

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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Address Name Description

10h reserved —

11h reserved —

12h CONVERT Start Pressure and Temperature Conversion

[1] This register is set to 00h. It is reserved, and was previously utilized as Coefficient values, c11 and c22, which were

always 00h.

For values with less than 16 bits, the lower LSBs are zero. For example, c12 is 14 bits

and is stored into 2 bytes as follows:

c12 MS byte = c12[13:6] = [c12b13 , c12b12 , c12b11 , c12b10 , c12b9 , c12b8 , c12b7 , c12b6]

c12 LS byte = c12[5:0] & "00" = [c12b5 , c12b4 , c12b3 , c12b2 , c12b1 , c12b0 , 0 , 0]

8.1 Pressure, temperature and coefficient bit-width specifications

The table below specifies the initial coefficient bit-width specifications for the

compensation algorithm and the specifications for Pressure and Temperature ADC

values.

Table 5. Pressure, temperature and compensation coefficient specifications

a0 b1 b2 c12 Padc Tadc

Total Bits 16 16 16 14 10 10

Sign Bits 111100

Integer Bits 12 2 1 0 10 10

Fractional Bits 3 13 14 13 0 0

dec pt zero pad 000900

Example Binary Format Definitions:

a0 Signed, Integer Bits = 12, Fractional Bits = 3 : Coeff a0 = S I11 I10 I9 I8 I7 I6 I5 I4 I3 I2 I1 I0 . F2 F1 F0

b1 Signed, Integer Bits = 2, Fractional Bits = 13 : Coeff b1 = S I1 I0 . F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 F0

b2 Signed, Integer Bits = 1, Fractional Bits = 14 : Coeff b2 = S I0 . F13 F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 F0

c12 Signed, Integer Bits = 0, Fractional Bits = 13, dec pt zero pad = 9 : Coeff c12 = S 0 . 000 000 000 F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 F0

Padc Unsigned, Integer Bits = 10 : Padc U = I9 I8 I7 I6 I5 I4 I3 I2 I1 I0

Tadc Unsigned, Integer Bits =10 : Tadc U = I9 I8 I7 I6 I5 I4 I3 I2 I1 I0

Note: Negative coefficients are coded in 2’s complement notation.

8.2 Compensation

The 10-bit compensated pressure output, Pcomp, is calculated as follows:

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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(1)

Where:

Padc is the 10-bit pressure ADC output of the MPL115A

Tadc is the 10-bit temperature ADC output of the MPL115A

a0 is the pressure offset coefficient

b1 is the pressure sensitivity coefficient

b2 is the temperature coefficient of offset (TCO)

c12 is the temperature coefficient of sensitivity (TCS)

Pcomp will produce a value of 0 with an input pressure of 50 kPa and will produce a full-

scale value of 1023 with an input pressure of 115 kPa.

(2)

8.3 Evaluation sequence, arithmetic circuits

The following is an example of the calculation for Pcomp, the compensated pressure

output. Input values are in bold.

c12x2 = c12 * Tadc

a1 = b1 + c12x2

a1x1 = a1 * Padc

y1 = a0 + a1x1

a2x2 = b2 * Tadc

Pcomp = y1 + a2x2

This can be calculated as a succession of Multiply Accumulates (MACs) operations of the

form y = a + b * x:

The polynomial can be evaluated (Equation 1) as a sequence of 3 MACs:

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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c12

Tadc

Padc

PComp

Please refer to NXP application note AN3785 for more detailed notes on implementation.

8.4 SPI device read/write operations

All device read/write operations are memory mapped. Device actions e.g. "Start

Conversions" are controlled by writing to the appropriate memory address location. All

memory address locations are 6-bit (see Table 2).

The 8-bit command word comprises:

•the most significant bit which is the Read/Write identifier which is '1' for read operations

and '0' for write operations.

•the 6-bit address (from Table 4);

•the least significant bit which is not used and is don't care (X).

The device write commands are shown in Table 6.

Table 6. SPI write command

Legend: X = don't care

Command Binary HEX[1]

Start Conversions 0010010X 24h

[1] The command byte needs to be paired with a 00h as part of the SPI exchange to complete the passing of Start

Conversions.

The actions taken by the part in response to each command are as follows:

Table 7. SPI Write command description

Command Action taken

Start Conversions

Wake main circuits. Start clock. Allow supply stabilization

time. Select pressure sensor input. Apply positive sensor

excitation and perform A to D conversion. Select temperature

input. Perform A to D conversion. Load the Pressure and

Temperature registers with the result. Shut down main circuits

and clock.

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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SPI Read operations are performed by sending the required address with a leading Read

bit set to ‘1’. SPI operations require that each byte be addressed individually. All data is

transmitted most significant bit first.

Table 8. Example SPI Read Commands

Legend: X = don't care

Command Binary HEX[1]

Read Pressure MSB 1000000X 80h

Read Pressure LSB 1000001X 82h

Read Temperature MSB 1000010X 84h

Read Temperature LSB 1000011X 86h

Read Coefficient data byte 1 1000100X 88h

[1] The command byte needs to be paired with a 00h as part of the SPI exchange to complete the passing of stated

command.

8.5 SPI timing

Table 9 and Figure 4 describe the timing requirements for the SPI system.

Table 9. SPI timing

Ref Symbol Function Min Max Unit

1 OfOperating Frequency — 8 MHz

2 tSCLK SCLK Period 125 — ns

3 tCLKH SCLK High time 62.5 — ns

4 tCLKL SCLK Low time 62.5 — ns

5 tSCS Enable lead time 125 — ns

6 tHCS Enable lag time 125 — ns

7 tSET Data setup time 30 — ns

8 tHOLD Data hold time 30 — ns

9 tDDLY Data valid (after SCLK low edge) — 32 ns

10 tWCS Width CS High 30 — ns

Figure 4. SPI timing diagram

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Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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8.6 Example of SPI reading of coefficients

These are MPL115A1 SPI commands to read coefficients, execute Pressure and

Temperature conversions, and to read Pressure and Temperature data. The sequence

of the commands for the interaction is given as an example to operate the MPL115A1.

Utilizing this gathered data, an example of the calculating the Compensated Pressure

reading is given in floating point notation.

SPI Commands (simplified for communication)

Command to Write "Convert Pressure and Temperature" = 24h

Command to Read "Pressure ADC High byte" = 80h

Command to Read "Pressure ADC Low byte" = 82h

Command to Read "Temperature ADC High byte" = 84h

Command to Read "Temperature ADC Low byte" = 86h

Command to Read "Coefficient data byte 1 High byte" = 88h

Read coefficients:

[CS=0], [88h], [00h], [8Ah], [00h], [8Ch], [00h], [8Eh], [00h], [90h], [00h], [92h], [00h],

[94h], [00h], [96h], [00h], [00h], [CS=1]

Start pressure and temperature conversion, read raw pressure:

[CS=0], [24h], [00h], [CS=1], [3 ms Delay]

[CS=0], [80h], [00h], [82h], [00h], [84h], [00h], [86h], [00h], [00h], [CS=1]

Note: Extra [00h] at the end of each sequence to output the last data byte on the slave

side of the SPI.

Figure 5. SPI read coefficient datagram

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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a0 coefficient MSB = 41h

a0 coefficient LSB = DFh a0 coefficient = 41DFh = 2107.875

b1 coefficient MSB = B0h

b1 coefficient LSB = 28h b1 coefficient = B028h = –2.49512

b2 coefficient MSB = BEh

b2 coefficient LSB = ADh b2 coefficient = BEADh = –1.02069

c12 coefficient MSB = 38h

c12 coefficient LSB = CCh c12 coefficient = 38CCh = 0.00086665

Figure 6. SPI start conversion datagram

Command to start pressure and temperature conversion, 24h

Figure 7. SPI read results datagram

Pressure MSB = 67h

Pressure LSB = C0h Pressure = 67C0h = 0110 0111 11 00 0000

= 415 ADC counts

Temperature MSB = 80h

Temperature LSB = 40h Temperature = 8040h = 1000 0000 01 00 0000

= 513 ADC counts

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Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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8.7 Example of pressure compensated calculation in floating-point

notation

a0 coefficient = 2107.875

b1 coefficient = –2.49512

b2 coefficient = –1.02069

c12 coefficient = 0.00086665

Pressure = 415 ADC counts

Temperature = 513 ADC counts

Pressure compensation

Using the evaluation sequence

The evaluation sequence is located in Section 8.3.

c12x2 = c12 * Tadc = 0.00086665 * 513 = 0.44459

a1 = b1 + c12x2 = –2.49512 + 0.44459 = –2.05052

a1x1 = a1 * Padc = –2.05052 * 415 = –850.96785

y1 = a0 + a1x1 = 2107.875 + (–850.96785) = 1256.90715

a2x2 = b2 * Tadc = –1.02069 * 513 = –523.61444

PComp = y1 + a2x2 = 1256.90715 + (–

523.61444)

= 733.29270

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Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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9 Maximum ratings

Table 10. Maximum ratings

Voltage (with respect to GND unless otherwise noted)

Symbol Value Units

VDD –0.3 to +5.5 V

SHDN, SCLK, CS, DIN, DOUT –0.3 to VDD + 0.3 V

Operating Temperature Range –40 to +105 °C

Storage Temperature Range –40 to +125 °C

Overpressure 1000 kPa

10 Mechanical and electrical characteristics

Table 11. Mechanical and electrical characteristics

VDD = 2.375 V to 5.5 V, TA = –40 °C to +105 °C, unless otherwise noted. Typical values are at VDD = 3.3 V, TA = +25 °C.

Ref Parameters Symbol Conditions Min Typ Max Units

1 Operating Supply Voltage VDD 2.375 3.3 5.5 V

Shutdown (SHDN = GND) — — 1 μA

Standby — 3.5 10 μA

2 Supply Current IDD

Average – at one measurement per

second

— 5 — μA

Pressure Sensor

3 Range 50 — 115 kPa

4 Resolution — 0.15 — kPa

5 Accuracy –20 ºC to 85 ºC — — ±1 kPa

6 Conversion Time

(Start Pressure and

Temperature Conversion)

tc Time between start convert command

and data available in the Pressure and

Temperature registers

— 1.6 3 ms

7 Wakeup Time tw Time between leaving Shutdown

mode (SHDN goes high) and

communicating with the device to

issue a command or read data.

— 3 5 ms

SPI Inputs: SCLK, CS, DIN

8 SCLK Clock Frequency fSCLK

[1] — — 8 MHz

9 Low Level Input Voltage VIL — — 0.3VDD V

10 High Level Input Voltage VIH 0.7VDD — — V

SPI Outputs: DOUT

VOL1 At 3 mA sink current 0 — 0.411 Low Level Output Voltage

VOL2 At 6 mA sink current 0 — 0.6

12 High Level Output Voltage VOH1 At 3 mA source current VDD

– 0.4

— —

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Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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[1] Nominal maximum SPI clock frequency.

11 Package outline

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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Figure 8. Package outline SOT1769-1 (TSON8)

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Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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12 Packing information

Figure 9. LGA (3 x 5) embossed carrier tape dimensions

Figure 10. Device orientation in chip carrier

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Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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13 Soldering

1. Use SAC solder alloy, i.e., Sn-Ag-Cu, with a melting point of about 217 °C. It is

recommended to use SAC305, i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu.

2. Reflow

•Ramp up rate: 2 to 3 °C/s.

•Preheat flat (soak): 110 to 130 s.

•Reflow peak temperature: 250 °C to 260 °C (depends on exact SAC alloy

composition).

•Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/

quantities in the reflow).

•Ramp down: 5 to 6 °C/s.

•Using an inert reflow environment (with O2 level about 5 to 15 ppm).

Note: The stress level and signal offset of the device also depends on the board type,

board core material, board thickness and metal finishing of the board.

14 Soldering/landing pad information

The LGA package is compliant with the RoHS standard. It is recommended to use a no-

clean solder paste to reduce cleaning exposure to high pressure and chemical agents

that can damage or reduce life span of the Pressure sensing element.

Figure 11. Recommended PCB landing pattern

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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15 Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

MPL115A1 v.8 20171010 Technical data — MPL115A1 v.7

Modifications: •The format of this data sheet has been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Removed the first paragraph of Section 7.

•Added Section 7.1 and Section 7.2 in Section 7 "Handling and Board Mount

Recommendations"

•Updated Figure 8. No technical changes.

MPL115A1 v.7 02/2013 Technical data — —

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

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16 Legal information

16.1 Data sheet status

Document status[1][2] Product status[3] Definition

[short] Data sheet: product preview Development This document contains certain information on a product under development.

NXP reserves the right to change or discontinue this product without notice.

[short] Data sheet: advance information Qualification This document contains information on a new product. Specifications and

information herein are subject to change without notice.

[short] Data sheet: technical data Production This document contains the product specification. NXP Semiconductors

reserves the right to change the detail specifications as may be required to

permit improvements in the design of its products.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

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with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

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relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

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Semiconductors product is deemed to offer functions and qualities beyond

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products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

21 / 23

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications. In

the event that customer uses the product for design-in and use in automotive

applications to automotive specifications and standards, customer (a) shall

use the product without NXP Semiconductors’ warranty of the product for

such automotive applications, use and specifications, and (b) whenever

customer uses the product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at customer’s own

risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,

damages or failed product claims resulting from customer design and use

of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

16.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

NXP — is a trademark of NXP B.V.

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Data sheet: technical data Rev. 8 — 10 October 2017

22 / 23

Tables

Tab. 1. Ordering information ..........................................2

Tab. 2. Ordering options ................................................2

Tab. 3. Pin description ...................................................3

Tab. 4. Device memory map ......................................... 6

Tab. 5. Pressure, temperature and compensation

coefficient specifications ....................................7

Tab. 6. SPI write command ...........................................9

Tab. 7. SPI Write command description ........................9

Tab. 8. Example SPI Read Commands ...................... 10

Tab. 9. SPI timing ........................................................10

Tab. 10. Maximum ratings .............................................14

Tab. 11. Mechanical and electrical characteristics ........ 14

Tab. 12. Revision history ...............................................19

Figures

Fig. 1. Block diagram of MPL115A1 .............................2

Fig. 2. Pin configuration ............................................... 3

Fig. 3. Sequence flow chart ......................................... 5

Fig. 4. SPI timing diagram ..........................................10

Fig. 5. SPI read coefficient datagram .........................11

Fig. 6. SPI start conversion datagram ........................12

Fig. 7. SPI read results datagram .............................. 12

Fig. 8. Package outline SOT1769-1 (TSON8) ............ 15

Fig. 9. LGA (3 x 5) embossed carrier tape

dimensions ...................................................... 17

Fig. 10. Device orientation in chip carrier .....................17

Fig. 11. Recommended PCB landing pattern ............... 18

NXP Semiconductors MPL115A1

Miniature SPI digital barometer, 50 to 115 kPa

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 10 October 2017

Document identifier: MPL115A1

Contents

1 General description ............................................ 1

2 Features ............................................................... 1

3 Applications .........................................................1

4 Ordering information .......................................... 2

4.1 Ordering options ................................................ 2

5 Block diagram ..................................................... 2

6 Pinning information ............................................ 3

6.1 Pinning ...............................................................3

6.2 Pin description ................................................... 3

7 Handling and Board Mount

Recommendations .............................................. 3

7.1 Methods of Handling ......................................... 3

7.2 Board Mount Recommendations ....................... 4

8 Functional description ........................................5

8.1 Pressure, temperature and coefficient bit-

width specifications ............................................7

8.2 Compensation ....................................................7

8.3 Evaluation sequence, arithmetic circuits ............8

8.4 SPI device read/write operations ....................... 9

8.5 SPI timing ........................................................ 10

8.6 Example of SPI reading of coefficients ............ 11

8.7 Example of pressure compensated

calculation in floating-point notation .................13

9 Maximum ratings ...............................................14

10 Mechanical and electrical characteristics .......14

11 Package outline .................................................15

12 Packing information ..........................................17

13 Soldering ............................................................18

14 Soldering/landing pad information ..................18

15 Revision history ................................................ 19

16 Legal information ..............................................20