BAW156
Low-leakage double diode
2 October 2020 Product data sheet
1. General description
Epitaxial, medium-speed switching, double diode in a small SOT23 plastic SMD package. The
diodes are in common anode configuration.
2. Features and benefits
Plastic SMD package
Low leakage current: typ. 3 pA
Switching time: typ. 0.8 µs
Continuous reverse voltage: max. 75 V
Repetitive peak reverse voltage: max. 85 V
Repetitive peak forward current: max. 500 mA.
AEC-Q101 qualified
3. Applications
Low-leakage current applications in surface mounted circuits.
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRreverse voltage Tj = 25 °C - - 75 V
IRreverse current VR = 75 V; pulsed; Tj = 25 °C - 0.003 5 nA
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K1 cathode (diode 1)
2 K2 cathode (diode 2)
3 CA common anode
1 2
3
SOT23
aaa-032327
K2
CA
K1
Nexperia BAW156
Low-leakage double diode
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
BAW156 SOT23 plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9
mm x 1.3 mm x 1 mm body
SOT23
7. Marking
Table 4. Marking codes
Type number Marking code[1]
BAW156 JZ%
[1] % = placeholder for manufacturing site code
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 75 V
VRRM repetitive peak reverse
voltage
Tj = 25 °C
- 85 V
Tamb = 25 °C; single diode loaded [1] - 160 mAIFforward current
Tamb = 25 °C; double diode loaded [1] - 140 mA
IFRM repetitive peak forward
current
Tj = 25 °C - 500 mA
tp = 1 µs; square wave; Tj(init) = 25 °C - 4 A
tp = 1 ms; square wave; Tj(init) = 25 °C - 1 A
IFSM non-repetitive peak
forward current
tp = 1 s; square wave; Tj(init) = 25 °C - 0.5 A
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature -55 150 °C
Tstg storage temperature -65 150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 2 / 10
Nexperia BAW156
Low-leakage double diode
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
in free air [1] - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point
[2] - - 360 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Soldering point of cathode tab.
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IF = 1 mA; Tj = 25 °C - - 0.9 V
IF = 10 mA; Tj = 25 °C - - 1 V
IF = 50 mA; Tj = 25 °C - - 1.1 V
VFforward voltage
IF = 150 mA; Tj = 25 °C - - 1.25 V
VR = 75 V; pulsed; Tj = 25 °C - 0.003 5 nAIRreverse current
VR = 75 V; pulsed; Tj = 150 °C - 3 80 nA
Cddiode capacitance VR = 0 V; f = 1 MHz; Tj = 25 °C - 3 - pF
trr reverse recovery time IF = 10 mA; IR = 10 mA; IR(meas) = 1 mA;
RL = 100 Ω; Tj = 25 °C; measured at IR
= 1 mA
- 0.8 3 µs
0 200
300
0
100
200
mlb756
100 Tamb (°C)
IF
(mA)
single diode loaded
double diode loaded
Device mounted on an FR4 printed-circuit board.
Fig. 1. Maximum permissible continuous forward
current as a function of ambient temperature.
mlb752
300
0
100
200
IF
(mA)
0 1.60.8 1.20.4 VF (V)
(1) (2) (3)
(1) Tamb = 150 °C; typical values
(2) Tamb = 25 °C; typical values
(3) Tamb = 25 °C; maximum values
Fig. 2. Forward current as a function of forward
voltage; per diode
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 3 / 10
Nexperia BAW156
Low-leakage double diode
mbg704
10
1
102
IFSM
(A)
10-1
tp (µs)
1 104
103
10 102
Based on square wave currents.
Tj(init) = 25 °C
Fig. 3. Non-repetitive peak forward current as a
function of pulse duration; typical values
102
150 200
500
mlb754
100
10
1
10- 1
10- 2
10- 3
IR
(nA)
Tj (°C)
(1)
(2)
VR = 75 V
(1) Maximum values
(2) Typical values
Fig. 4. Reverse current as a function of junction
temperature
mbg525
0 10 20155
3
4
2
0
1
VR (V)
Cd
(pF)
f = 1 MHz; Tamb = 25 °C
Fig. 5. Diode capacitance as a function of reverse voltage; typical values
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 4 / 10
Nexperia BAW156
Low-leakage double diode
11. Test information
trr
(1)
+ IF
t
output signal
trtp
t
10 %
90 %
VR
input signal
V = VR + IF × RS
RS = 50 ΩIF
D.U.T.
Ri = 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
(1) IR = 1 mA
Fig. 6. Reverse recovery time test circuit and waveforms
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in
automotive applications.
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 5 / 10
Nexperia BAW156
Low-leakage double diode
12. Package outline
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT23 TO-236AB
sot023_po
14-06-19
14-09-22
Plastic surface-mounted package; 3 leads SOT23
bp
D
A
A1
Lp
Q
HE
E
0 1 2 mm
scale
c
1 2
3
B
w B
e
e1
v A
AX
Unit
mm
max
nom
min
1.1 0.1 0.15 3.0 1.4
0.2
A
Dimensions (mm are the original dimensions)
A1bp
0.48
c D E e e1
0.95
HELpQ v w
0.11.9
2.1 0.150.9 0.09 2.8 1.20.38
2.5 0.45
0.45
0.55
detail X
Fig. 7. Package outline SOT23
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 6 / 10
Nexperia BAW156
Low-leakage double diode
13. Soldering
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
Fig. 8. Reflow soldering footprint for SOT23
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
Fig. 9. Wave soldering footprint for SOT23
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 7 / 10
Nexperia BAW156
Low-leakage double diode
14. Revision history
Table 8. Revision history
Data sheet ID Release date Data sheet status Change notice Supersedes
BAW156 v.3 20201002 Product data sheet - BAW156 v.2
Modifications: AEC-Q101 qualified attributes inserted in sections "Features and benefits", "Test
information"and "Legal information".
The format of this data sheet has been redesigned to comply with the identity guidelines of
Nexperia.
Legal texts have been adapted to the new company name where appropriate.
BAW156 v.2 19990511 Product data sheet - BAW156 v.1
BAW156 v.1 19960313 Product data sheet - -
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 8 / 10
Nexperia BAW156
Low-leakage double diode
15. Legal information
Data sheet status
Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification This document contains data from
the preliminary specification.
Product [short]
data sheet
Production This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
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Characteristics sections of this document is not warranted. Constant or
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BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 9 / 10
Nexperia BAW156
Low-leakage double diode
Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................1
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Thermal characteristics............................................... 3
10. Characteristics............................................................ 3
11. Test information.......................................................... 5
12. Package outline.......................................................... 6
13. Soldering..................................................................... 7
14. Revision history..........................................................8
15. Legal information........................................................9
© Nexperia B.V. 2020. All rights reserved
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Date of release: 2 October 2020
BAW156 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
Product data sheet 2 October 2020 10 / 10