BAP55L,315 - NXP Semiconductors - Datasheet.Directory

1. Product profile

1.1 General description

Planar PIN diode in a SOD882 leadless ultra small plastic SMD package.

1.2 Features and benefits

1.3 Applications

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

BAP55L

Silicon PIN diode

Rev. 2 — 5 September 2011 Preliminary data sheet

High speed switch ing for RF signals Very low series inductance

Low diode capacitance For applications up to 3 GHz

Low forward resistance

RF attenuators and switches

Table 1. Discrete pinning

Pin Description Simplified outline Symbol

1 cathode [1]

2 anode

Transparent

top view

sym006

Tabl e 2. Ordering i nfo rmation

Type number Package

Name Description Version

BAP55L - leadless ultra small plastic package; 2 terminals; body

1.0 0.6 0.5 mm SOD882

Preliminary data sheet Rev. 2 — 5 September 2011 2 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

Table 3. Marking

Type number Marking code

BAP55L E6

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 50 V

IFforward current - 100 mA

Ptot total power dissipation Ts = 90 C-500mW

Tstg storage temperature 65 +150 C

Tjjunction temperature 65 +150 C

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction

to soldering point 100 K/W

Table 6. Characteristics

Tj = 25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 50 mA - 0.95 1.1 V

IRreverse current VR=20V - - 10 nA

VR=50V - - 0.1 A

Cddiode capacitance f = 1 MHz; Figure 2

VR= 0 V - 0.27 - pF

VR= 1 V - 0.23 - pF

VR=20V - 0.18 0.28 pF

rDdiode forward

resistance f=100MHz; Figure 1

IF=0.5mA - 3.4 4.5 

IF=1mA - 2.3 3.3 

IF=10mA - 0.8 1.2 

IF=100mA - 0.4 0.7 

Preliminary data sheet Rev. 2 — 5 September 2011 3 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

s122isolation VR=0V; Figure 4

f = 900 MHz - 17.6 - dB

f = 1800 MHz - 13 - dB

f=2450MHz - 11.1 - dB

s212insertion loss IF= 0.5 mA; Figure 3

f = 900 MHz - 0.25 - dB

f = 1800 MHz - 0.27 - dB

f = 2450 MHz - 0.29 - dB

IF=1mA; Figure 3

f = 900 MHz - 0.17 - dB

f = 1800 MHz - 0.19 - dB

f = 2450 MHz - 0.21 - dB

IF=10mA; Figure 3

f = 900 MHz - 0.07 - dB

f = 1800 MHz - 0.09 - dB

f = 2450 MHz - 0.12 - dB

IF=100mA; Figure 3

f = 900 MHz - 0.05 - dB

f = 1800 MHz - 0.07 - dB

f = 2450 MHz - 0.09 - dB

Lcharge carrier life

time when switched from

IF= 10 mA to IR=6mA;

RL= 100 ; measured at

IR=3mA

-0.28-s

LSseries inductance - 0.6 - nH

Table 6. Characteristics …continued

Tj = 25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Preliminary data sheet Rev. 2 — 5 September 2011 4 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

f = 100 MHz; Tj=25C. f = 1 MHz; Tj=25C.

Fig 1. Forward re si stance as a funct ion of forward

current; typical values Fig 2. Diode ca pacitance as a function of reverse

voltage; typical values

(1) IF= 100 mA.

(2) IF=10mA.

(3) IF=1mA.

(4) IF=0.5mA.

Diode inserted in series with a 50  stripline circuit and

biased via the analyzer Tee network.

Tamb =25C.

Diode zero biased and inserted in series with a 50 

stripline circuit.

Tamb =25C.

Fig 3. Insertion loss (s212) of the diode as a function

of frequency; typical values Fig 4. Isolation (s122) of the diode as a function of

frequency; typical values

IF (mA)

10−1102

101

001aac628

102

(Ω)

10−1

VR (V)

02015510

001aac629

200

100

300

400

(fF)

001aac630

f (MHz)

0321

−0.50

−0.75

−0.25

|S21|2

(dB)

−1.00

(1)

(2)

(3)

(4)

001aac631

f (MHz)

0321

−20

−30

−10

|S12|2

(dB)

−40

Preliminary data sheet Rev. 2 — 5 September 2011 5 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

8. Package outline

Fig 5. Package outline SOD882

UNIT A1

max.

A(1) be

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.50

0.46 0.55

0.47

0.03 0.62

0.55 0.65

DIMENSIONS (mm are the original dimensions)

Notes

1. Including plating thickness

2. The marking bar indicates the cathode

0.30

0.22

SOD882 03-04-16

03-04-17

1.02

0.95

(2)

Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm SOD882

0 0.5 1 mm

scale

Preliminary data sheet Rev. 2 — 5 September 2011 6 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

9. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAP55L v.2 20110905 Preliminary data sheet - BAP55L v.1

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

BAP55L v.1

(9397 750 14811) 20050405 Preliminary data sheet - -

Preliminary data sheet Rev. 2 — 5 September 2011 7 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full dat a sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

10.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incid ental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability rela ted to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the applica tion or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Preliminary data sheet Rev. 2 — 5 September 2011 8 of 9

NXP Semiconductors BAP55L

Silicon PIN diode

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BAP55L

Silicon PIN diode

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 September 2011

Document identifier: BAP55L

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9