MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
DShort-Circuit Protection
DWide Common-Mode and Differential
Voltage Ranges
DNo Frequency Compensation Required
DLow Power Consumption
DNo Latch-Up
DDesigned to Be Interchangeable With
Motorola MC1558/MC1458 and Signetics
S5558/N5558
description/ordering information
The MC1458 and MC1558 are dual
general-purpose operational amplifiers, with each
half electrically similar to the μA741, except that
offset null capability is not provided.
The high-common-mode input voltage range and
the absence of latch-up make these amplifiers
ideal for voltage-follower applications. The
devices are short-circuit protected and the
internal frequency compensation ensures stability
without external components.
ORDERING INFORMATION
TA
VIOmax
AT 25°CPACKAGEORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P) Tube MC1458P MC1458P
0°C to 70°C
6 mV
SOIC (D)
Tube MC1458D
MC1458
0°C to 70°C6 mV SOIC (D) Tape and reel MC1458DR MC1458
SOP (PS) Tape and reel MC1458PSR M1458
CDIP (JG) Tube MC1558JG MC1558JG
55°C to 125°C5 mV CDIP (JGB) Tube MC1558JGB MC1558JGB
55 C to 125 C
5 mV
LCCC (FK) Tube MC1558FK MC1558FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
VCC
VCC+
2OUT
2IN
2IN+
(TOP VIEW)
MC1458 . . . D, P, OR PS PACKAGE
MC1558 . . . JG PACKAGE
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN
NC
NC
1IN
NC
1IN+
NC
MC1558 ...FK PACKAGE
NC
1OUT
NC
NC NC
NC
V
NC
NC No internal connection
CC+
V
2IN+
CC
(TOP VIEW)
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
symbol (each amplifier)
+
IN+
OUT
IN
schematic (each amplifier)
IN
IN + OUT
VCC +
VCC
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC+ (see Note 1): MC1458 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC1558 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC (see Note 1): MC1458 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC1558 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (either input, see Notes 1 and 3) ±15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 7 and 8): FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
JG package 14.5°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package 300°C. . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, or PS package 260°C. . . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC.
2. Differential voltages are at IN+ with respect to IN.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output can be shorted to ground or either power supply. For the MC1558 only, the unlimited duration of the short circuit applies
at (or below) 125°C case temperature or 70°C free-air temperature.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
MIN MAX UNIT
VCC±Supply voltage ±5±15 V
T
Operating free air temperature range
MC1458 0 70
°C
TAOperating free-air temperature range MC1558 55 125 °C
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
electrical characteristics at specified free-air temperature, VCC± = ±15 V
PARAMETER
TEST CONDITIONS
MC1458 MC1558
UNIT
PARAMETER TEST CONDITIONS
MIN TYP MAX MIN TYP MAX UNIT
Input offset voltage
V 0
25°C 1 6 1 5
mV
VIO Input offset voltage VO = 0 Full range 7.5 6 mV
Input offset current
V 0
25°C 20 200 20 200
nA
IIO Input offset current VO = 0 Full range 300 500 nA
Input bias current
V 0
25°C 80 500 80 500
nA
IIB Input bias current VO = 0 Full range 800 1500 nA
Common-mode input 25°C±12 ±13 ±12 ±13
V
VICR
Common mode input
voltage range Full range ±12 ±12 V
RL = 10 kΩ25°C±12 ±14 ±12 ±14
Maximum peak output RL 10 kΩFull range ±12 ±11
V
VOM
Maximum peak output
voltage swing RL = 2 kΩ25°C±10 ±13 ±10 ±13 V
RL 2 kΩFull range ±10 ±10
Lar
g
e-si
g
nal differential
R 2 kΩV ±10 V
25°C 20 200 50 200
V/mV
AVD
Large signal differential
voltage amplification RL 2 kΩ,VO = ±10 V Full range 15 25 V/mV
BOM
Maximum-output-swing
bandwidth
(closed loop)
RL = 2 kΩ,VO ±10 V,
AVD = 1, THD 5% 25°C 14 14 kHz
B1Unity-gain bandwidth 25°C 1 1 MHz
φmPhase margin AVD = 1 25°C 65 65 deg
Gain margin 25°C11 11 dB
riInput resistance 25°C 0.3 2 0.3* 2 MΩ
roOutput resistance VO = 0, See Note 9 25°C 75 75 Ω
CiInput capacitance 25°C 1.4 1.4 pF
zic
Common-mode input
impedance f = 20 Hz 25°C 200 200 MΩ
Common-mode VI
C
= VI
C
R min, 25°C 70 90 70 90
dB
CMRR
Common mode
rejection ratio
VIC = VICR min
,
VO = 0 Full range 70 70 dB
Supply-voltage
sensitivity
V
CC
= ±9 V to ±15 V, 25°C 30 150 30 150
V/V
kSVS sensitivity
(ΔVIO/ΔVCC)
VCC = ±9 V to ±15 V
,
VO = 0 Full range 150 150 μV/V
Vn
Equivalent input noise
voltage (closed loop)
AVD = 100, RS = 0,
f = 1 kHz, BW = 1 Hz 25°C 45 45 nV/Hz
IOS
Short-circuit output
current 25°C±25 ±40 ±25 ±40 mA
Suppl
y
current
V 0 No load
25°C 3.4 5.6 3.4 5
mA
ICC
Supply current
(both amplifiers) VO = 0, No load Full range 6.6 6.6 mA
Total power dissipation
V 0 No load
25°C 100 170 100 150
mW
PD
Total power dissipation
(both amplifiers) VO = 0, No load Full range 200 200 mW
VO1/VO2 Crosstalk attenuation 25°C 120 120 dB
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
All characteristics are specified under open-loop operating conditions with zero common-mode input voltage, unless otherwise specified. Full
range for MC1458 is 0°C to 70°C and for MC1558 is 55°C to 125°C.
NOTE 9: This typical value applies only at frequencies above a few hundred hertz because of the effect of drift and thermal feedback.
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C FEBRUARY 1971 REVISED AUGUST 2010
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443
operating characteristics, VCC ± = ±15 V, CL = 100 pF, TA = 25°C (see Figure 1)
PARAMETER
TEST CONDITIONS
MC1458 MC1558
UNIT
PARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT
t
Rise time VI = 20 mV, RL = 2 kΩ, 0.3 0.3 μs
trOvershoot factor VI = 20 mV, RL = 2 kΩ5 5 %
SR Slew rate at unity gain VI = 10 V, RL = 2 kΩ0.5 0.5 V/μs
PARAMETER MEASUREMENT INFORMATION
+
VI
0 V
Input
Output
RL = 2 kΩ
CL = 100 pF
Test Circuit
Input Voltage
Waveform
Figure 1. Rise-Time, Overshoot, and Slew-Rate Waveform and Test Circuit
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9760301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9760301Q2A
MC1558FKB
5962-9760301QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9760301QPA
MC1558
MC1458D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MC1458
MC1458DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MC1458
MC1458DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MC1458
MC1458DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MC1458
MC1458DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MC1458
MC1458P ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 MC1458P
MC1458PE4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 MC1458P
MC1458PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 M1458
MC1558FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9760301Q2A
MC1558FKB
MC1558JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 MC1558JG
MC1558JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9760301QPA
MC1558
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MC1458DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC1458DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC1458PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MC1458DR SOIC D 8 2500 367.0 367.0 35.0
MC1458DR SOIC D 8 2500 340.5 338.1 20.6
MC1458PSR SO PS 8 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
MC1458DR MC1458P MC1458D MC1458DE4 MC1458DRE4 MC1458PE4 MC1458PSR MC1458DRG4