a
ADuC816
0 World Wide Web Site: http:/
3
MicroConverter
®
, Dual-Channel
16-Bit ADCs with Embedded Flash MCU
FUNCTIONAL BLOCK DIAGRAM
8 KBYTES FLASH/EE PROGRAM MEMORY
640 BYTES FLASH/EE DATA MEMORY
256 BYTES USER RAM
3 16 BIT
TIMER/COUNTERS
1 TIME INTERVAL
COUNTER
4 PARALLEL
PORTS
8051-BASED MCU WITH ADDITIONAL
PERIPHERALS
ON-CHIP MONITORS
POWER SUPPLY
MONITOR
WATCHDOG TIMER
I
2
C-COMPATIBLE
UART AND SPI
SERIAL I/O
PGA
ADuC816
PROG.
CLOCK
DIVIDER
XTAL2XTAL1
BUF
AVDD
AGND
MUX
TEMP
SENSOR
REFIN+REFIN–
EXTERNAL
VREF
DETECT
INTERNAL
BANDGAP
VREF
AIN1
AIN2
AIN3
AIN4
AIN5
AUXILIARY
16-BIT - ADC
PRIMARY
16-BIT - ADC
MUX
OSC
&
PLL
12-BIT
VOLTAGE O/P
DAC
BUF
CURRENT
SOURCE
MUX
AVDD
IEXC1
IEXC2
DAC
FEATURES
High-Resolution Sigma-Delta ADCs
Dual 16-Bit Independent ADCs
Programmable Gain Front End
16-Bit No Missing Codes, Primary ADC
13-Bit p-p Resolution @ 20 Hz, 20 mV Range
16-Bit p-p Resolution @ 20 Hz, 2.56 V Range
Memory
8 Kbytes On-Chip Flash/EE Program Memory
640 Bytes On-Chip Flash/EE Data Memory
Flash/EE, 100 Year Retention, 100 Kcycles Endurance
256 Bytes On-Chip Data RAM
8051-Based Core
8051-Compatible Instruction Set (12.58 MHz Max)
32 kHz External Crystal, On-Chip Programmable PLL
Three 16-Bit Timer/Counters
26 Programmable I/O Lines
11 Interrupt Sources, Two Priority Levels
Power
Specified for 3 V and 5 V Operation
Normal: 3 mA @ 3 V (Core CLK = 1.5 MHz)
Power-Down: 20 A (32 kHz Crystal Running)
On-Chip Peripherals
On-Chip Temperature Sensor
12-Bit Voltage Output DAC
Dual Excitation Current Sources
Reference Detect Circuit
Time Interval Counter (TIC)
UART Serial I/O
I2C®-Compatible and SPI® Serial I/O
Watchdog Timer (WDT), Power Supply Monitor (PSM)
APPLICATIONS
Intelligent Sensors (IEEE1451.2-Compatible)
Weigh Scales
Portable Instrumentation
Pressure Transducers
4–20 mA Transmitters
MicroConverter is a registered trademark of Analog Devices, Inc.
SPI is a registered trademark of Motorola, Inc.
I
2
C is a registered trademark of Philips Semiconductors, Inc.
GENERAL DESCRIPTION
The ADuC816 is a complete smart transducer front-end, inte-
grating two high-resolution sigma-delta ADCs, an 8-bit MCU,
and program/data Flash/EE Memory on a single chip. This low
power device accepts low-level signals directly from a transducer.
The two independent ADCs (Primary and Auxiliary) include a
temperature sensor and a PGA (allowing direct measurement of
low-level signals). The ADCs with on-chip digital filtering are
intended for the measurement of wide dynamic range, low
frequency signals, such as those in weigh scale, strain gauge,
pressure transducer, or temperature measurement applications.
The ADC output data rates are programmable and the ADC
output resolution will vary with the programmed gain and
output rate.
The device operates from a 32 kHz crystal with an on-chip PLL
generating a high-frequency clock of 12.58 MHz. This clock is,
in turn, routed through a programmable clock divider from which
the MCU core clock operating frequency is generated. The
microcontroller core is an 8052 and therefore 8051-instruction-
set-compatible. The microcontroller core machine cycle consists
of 12 core clock periods of the selected core operating frequency.
8 Kbytes of nonvolatile Flash/EE program memory are provided
on-chip. 640 bytes of nonvolatile Flash/EE data memory and
256 bytes RAM are also integrated on-chip.
The ADuC816 also incorporates additional analog functionality
with a 12-bit DAC, current sources, power supply monitor,
and a bandgap reference. On-chip digital peripherals include a
watchdog timer, time interval counter, three timers/counters,
and three serial I/O ports (SPI, UART, and I
2
C-compatible).
On-chip factory firmware supports in-circuit serial download and
debug modes (via UART), as well as single-pin emulation mode
via the EA pin. A functional block diagram of the ADuC816 is
shown above with a more detailed block diagram shown in
Figure 12.
The part operates from a single 3 V or 5 V supply. When operating
from 3 V supplies, the power dissipation for the part is below
10 mW. The ADuC816 is housed in a 52-lead MQFP package.
The part operates from a single 3 V or 5 V supply. When operating
from 3 V supplies, the power dissipation for the part is below
10 mW. The ADuC816 is housed in 52-lead MQFP and 56-lead
LFCSP packages.
ADuC816
–2–
FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . 18
ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . 19
ADuC816 BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
OVERVIEW OF MCU-RELATED SFRS . . . . . . . . . . . . . . . . . . 23
Accumulator SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
B SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Stack Pointer SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Data Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Program Status Word SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Power Control SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPECIAL FUNCTION REGISTERS . . . . . . . . . . . . . . . . . . . . . 24
SFR INTERFACE TO THE PRIMARY AND
AUXILIARY ADCs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
ADCSTAT (ADC Status Register) . . . . . . . . . . . . . . . . . . . . . . 25
ADCMODE (ADC Mode Register) . . . . . . . . . . . . . . . . . . . . . 26
ADC0CON (Primary ADC Control Register) . . . . . . . . . . . . . . 27
ADC1CON (Auxiliary ADC Control Register) . . . . . . . . . . . . . 28
SF (Sinc Filter Register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
ICON (Current Sources Control Register) . . . . . . . . . . . . . . . . 29
ADC0H/ADC0M (Primary ADC Conversion Result
Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
ADC1H/ADC1L (Auxiliary ADC Conversion Result
Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
OF0H/OF0M (Primary ADC Offset Calibration
Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
OF1H/OF1L (Auxiliary ADC Offset Calibration
Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
GN0H/GN0M (Primary ADC Gain Calibration
Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
GN1H/GN1L (Auxiliary ADC Gain Calibration
Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
PRIMARY AND AUXILIARY ADC CIRCUIT
DESCRIPTION OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Primary ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Auxiliary ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PRIMARY AND AUXILIARY ADC NOISE
PERFORMANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Analog Input Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Primary and Auxiliary ADC Inputs . . . . . . . . . . . . . . . . . . . . . . 33
Analog Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Programmable Gain Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Bipolar/Unipolar Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Burnout Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Excitation Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Reference Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Reference Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Sigma-Delta Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Digital Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
ADC Chopping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
NONVOLATILE FLASH/EE MEMORY . . . . . . . . . . . . . . . . . . 37
Flash/EE Memory Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Flash/EE Memory and the ADuC816 . . . . . . . . . . . . . . . . . . . . 37
ADuC816 Flash/EE Memory Reliability . . . . . . . . . . . . . . . . . . 37
Using the Flash/EE Program Memory . . . . . . . . . . . . . . . . . . . . 38
Flash/EE Program Memory Security . . . . . . . . . . . . . . . . . . . . . 38
Using the Flash/EE Data Memory . . . . . . . . . . . . . . . . . . . . . . . 39
ECON–Flash/EE Memory Control SFR . . . . . . . . . . . . . . . . . . 39
Flash/EE Memory Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Using the Flash/EE Memory Interface . . . . . . . . . . . . . . . . . . . . 40
Erase-All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Program a Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
USER INTERFACE TO OTHER ON-CHIP ADuC816
PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
On-Chip PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Time Interval Counter (TIC) . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Power Supply Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
SERIAL PERIPHERAL INTERFACE . . . . . . . . . . . . . . . . . . . . . 48
MISO (Master In, Slave Out Data I/O Pin), Pin 14 . . . . . . . . . 48
MOSI (Master Out, Slave In Pin), Pin 27 . . . . . . . . . . . . . . . . . 48
SCLOCK (Serial Clock I/O Pin), Pin 26 . . . . . . . . . . . . . . . . . . 48
SS (Slave Select Input Pin), Pin 13 . . . . . . . . . . . . . . . . . . . . . . 48
Using the SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
SPI Interface—Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
SPI Interface—Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
I
2
C-COMPATIBLE INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . 50
8051-COMPATIBLE ON-CHIP PERIPHERALS . . . . . . . . . . . . 51
Parallel I/O Ports 0–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Timers/Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
TIMER/COUNTER 0 AND 1 OPERATING MODES . . . . . . . . 54
Mode 0 (13-Bit Timer/Counter) . . . . . . . . . . . . . . . . . . . . . . . . 54
Mode 1 (16-Bit Timer/Counter) . . . . . . . . . . . . . . . . . . . . . . . . 54
Mode 2 (8-Bit Timer/Counter with Autoreload) . . . . . . . . . . . . 54
Mode 3 (Two 8-Bit Timer/Counters) . . . . . . . . . . . . . . . . . . . . 54
Timer/Counter 2 Data Registers . . . . . . . . . . . . . . . . . . . . . . . . 55
TH2 and TL2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
RCAP2H and RCAP2L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Timer/Counter 2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . 56
16-Bit Autoreload Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
16-Bit Capture Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
UART SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
SBUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Mode 0: 8-Bit Shift Register Mode . . . . . . . . . . . . . . . . . . . . . . 58
Mode 1: 8-Bit UART, Variable Baud Rate . . . . . . . . . . . . . . . . 58
Mode 2: 9-Bit UART with Fixed Baud Rate . . . . . . . . . . . . . . . 58
Mode 3: 9-Bit UART with Variable Baud Rate . . . . . . . . . . . . . 58
UART Serial Port Baud Rate Generation . . . . . . . . . . . . . . . . . 58
Timer 1 Generated Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . 59
Timer 2 Generated Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . 59
INTERRUPT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Interrupt Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
ADuC816 HARDWARE DESIGN CONSIDERATIONS . . . . . . 62
Clock Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
External Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Power-On Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Power-Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Grounding and Board Layout Recommendations . . . . . . . . . . . 64
ADuC816 System Self-Identification . . . . . . . . . . . . . . . . . . . . . 65
OTHER HARDWARE CONSIDERATIONS . . . . . . . . . . . . . . . 65
In-Circuit Serial Download Access . . . . . . . . . . . . . . . . . . . . . . 65
Embedded Serial Port Debugger . . . . . . . . . . . . . . . . . . . . . . . . 65
Single-Pin Emulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Enhanced-Hooks Emulation Mode . . . . . . . . . . . . . . . . . . . . . . 66
Typical System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 66
QUICKSTART DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . 67
Download—In-Circuit Serial Downloader . . . . . . . . . . . . . . . . . 67
DeBug—In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . 67
ADSIM—Windows Simulator . . . . . . . . . . . . . . . . . . . . . . . . . . 67
OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
TABLE OF CONTENTS
Rev. B
–3–
ADuC816
Parameter ADuC816BS Unit Test Conditions/Comments
ADC SPECIFICATIONS
Conversion Rate 5.4 Hz min On Both Channels
105 Hz max Programmable in 0.732 ms Increments
Primary ADC
No Missing Codes
2
16 Bits min 20 Hz Update Rate
Resolution 13 Bits p-p typ Range = ±20 mV, 20 Hz Update Rate
16 Bits p-p typ Range = ±2.56 V, 20 Hz Update Rate
p-p Resolution at this Range/Update Rate
Setting Is Limited Only by the Number of
Bits Available from ADC
Output Noise See Table IX and X Output Noise Varies with Selected
in ADC Description Update Rate and Gain Range
Integral Nonlinearity ±1 LSB max
Offset Error ±3μV typ
Offset Error Drift ±10 nV/°C typ
Full-Scale Error
3
±10 μV typ Range = ±20 mV to ±640 mV
0.5 LSB typ Range = ±1.28 V to ±2.56 V
Gain Error Drift
4
±0.5 ppm/°C typ
ADC Range Matching ±0.5 LSB typ AIN = 18 mV
Power Supply Rejection (PSR) 95 dBs typ AIN = 7.8 mV, Range = ±20 mV
80 dBs typ AIN = 1 V, Range = ±2.56 V
Common-Mode DC Rejection
On AIN 95 dBs typ At DC, AIN = 7.8 mV, Range = ±20 mV
90 dBs typ At DC, AIN = 1 V, Range = ±2.56 V
On REFIN 90 dBs typ At DC, AIN = 1 V, Range = ±2.56 V
Common-Mode 50 Hz/60 Hz Rejection
2
20 Hz Update Rate
On AIN 95 dBs typ 50 Hz/60 Hz ±1 Hz, AIN = 7.8 mV,
Range = ±20 mV
90 dBs typ 50 Hz/60 Hz ±1 Hz, AIN = 1 V,
Range = ±2.56 V
On REFIN 90 dBs typ 50 Hz/60 Hz ±1 Hz, AIN = 1 V,
Range = ±2.56 V
Normal Mode 50 Hz/60 Hz Rejection
2
On AIN 60 dBs typ 50 Hz/60 Hz ±1 Hz, 20 Hz Update Rate
On REFIN 60 dBs typ 50 Hz/60 Hz ±1 Hz, 20 Hz Update Rate
Auxiliary ADC
No Missing Codes
2
16 Bits min
Resolution 16 Bits p-p typ Range = ±2.5 V, 20 Hz Update Rate
Output Noise See Table XI Output Noise Varies with Selected
in ADC Description Update Rate
Integral Nonlinearity ±1 LSB max
Offset Error –2 LSB typ
Offset Error Drift 1 μV/°C typ
Full-Scale Error
5
–2.5 LSB typ
Gain Error Drift
4
±0.5 ppm/°C typ
Power Supply Rejection (PSR) 80 dBs typ AIN = 1 V, 20 Hz Update Rate
Normal Mode 50 Hz/60 Hz Rejection
2
On AIN 60 dBs typ 50 Hz/60 Hz ±1Hz
On REFIN 60 dBs typ 50 Hz/60 Hz ±1 Hz, 20 Hz Update Rate
DAC PERFORMANCE
DC Specifications
6
Resolution 12 Bits
Relative Accuracy ±3 LSB typ
Differential Nonlinearity –1 LSB max Guaranteed 12-Bit Monotonic
Offset Error ±50 mV max
Gain Error
7
±1% maxAV
DD
Range
±1 % typ V
REF
Range
AC Specifications
2, 6
Voltage Output Settling Time 15 μs typ Settling Time to 1 LSB of Final Value
Digital-to-Analog Glitch Energy 10 nVs typ 1 LSB Change at Major Carry
(AVDD = 2.7 V to 3.6 V or 4.75 V to 5.25 V, DVDD = 2.7 V to 3.6 V or 4.75 V to 5.25 V,
REFIN(+) = 2.5 V; REFIN(–) = AGND; AGND = DGND = 0 V; XTAL1/XTAL2 = 32.768 kHz Crystal; all specifications TMIN to TMAX unless otherwise noted.)
SPECIFICATIONS
1
Rev. B
–4–
ADuC816–SPECIFICATIONS
1
Parameter ADuC816BS Unit Test Conditions/Comments
INTERNAL REFERENCE
ADC Reference
Reference Voltage 1.25 ± 1% V min/max Initial Tolerance @ 25°C, V
DD
= 5 V
Power Supply Rejection 45 dBs typ
Reference Tempco 100 ppm/°C typ
DAC Reference
Reference Voltage 2.5 ± 1% V min/max Initial Tolerance @ 25°C, V
DD
= 5 V
Power Supply Rejection 50 dBs typ
Reference Tempco ±100 ppm/°C typ
ANALOG INPUTS/REFERENCE INPUTS
Primary ADC
Differential Input Voltage Ranges
8, 9
External Reference Voltage = 2.5 V
RN2, RN1, RN0 of ADC0CON Set to
Bipolar Mode (ADC0CON.3 = 0) ±20 mV 0 0 0 (Unipolar Mode 0 mV to 20 mV)
±40 mV 0 0 1 (Unipolar Mode 0 mV to 40 mV)
±80 mV 0 1 0 (Unipolar Mode 0 mV to 80 mV)
±160 mV 0 1 1 (Unipolar Mode 0 mV to 160 mV)
±320 mV 1 0 0 (Unipolar Mode 0 mV to 320 mV)
±640 mV 1 0 1 (Unipolar Mode 0 mV to 640 mV)
±1.28 V 1 1 0 (Unipolar Mode 0 V to 1.28 V)
±2.56 V 1 1 1 (Unipolar Mode 0 V to 2.56 V)
Analog Input Current
2
±1 nA max
Analog Input Current Drift ±5pA/°C typ
Absolute AIN Voltage Limits AGND + 100 mV V min
AV
DD
– 100 mV V max
Auxiliary ADC
Input Voltage Range
8, 9
0 to V
REF
V Unipolar Mode, for Bipolar Mode
See Note 11
Average Analog Input Current 125 nA/V typ Input Current Will Vary with Input
Average Analog Input Current Drift
2
±2 pA/V/°C typ Voltage on the Unbuffered Auxiliary ADC
Absolute AIN Voltage Limits
10
AGND – 30 mV V min
AV
DD
+ 30 mV V max
External Reference Inputs
REFIN(+) to REFIN(–) Range
2
1 V min
AV
DD
V max
Average Reference Input Current 1 μA/V typ Both ADCs Enabled
Average Reference Input Current Drift ±0.1 nA/V/°C typ
“NO Ext. REF” Trigger Voltage 0.3 V min NOXREF Bit Active if V
REF
< 0.3 V
0.65 V max NOXREF Bit Inactive if V
REF
> 0.65 V
ADC SYSTEM CALIBRATION
Full-Scale Calibration Limit +1.05 × FS V max
Zero-Scale Calibration Limit –1.05 × FS V min
Input Span 0.8 × FS V min
2.1 × FS V max
ANALOG (DAC) OUTPUTS
Voltage Range 0 to V
REF
V typ DACRN = 0 in DACCON SFR
0 to AV
DD
V typ DACRN = 1 in DACCON SFR
Resistive Load 10 kΩ typ From DAC Output to AGND
Capacitive Load 100 pF typ From DAC Output to AGND
Output Impedance 0.5 Ω typ
I
SINK
50 μA typ
TEMPERATURE SENSOR
Accuracy ±2°C typ
Thermal Impedance (θ
JA
)90 °C/W typ
Rev. B
–5–
ADuC816
Parameter ADuC816BS Unit Test Conditions/Comments
TRANSDUCER BURNOUT CURRENT SOURCES
AIN+ Current –100 nA typ AIN+ is the Selected Positive Input to
the Primary ADC
AIN– Current +100 nA typ AIN– is the Selected Negative Input
the Auxiliary ADC
Initial Tolerance @ 25°C Drift ±10 % typ
Drift 0.03 %/°C typ
EXCITATION CURRENT SOURCES
Output Current –200 μA typ Available from Each Current Source
Initial Tolerance @ 25°C±10 % typ
Drift 200 ppm/°C typ
Initial Current Matching @ 25°C±1 % typ Matching Between Both Current Sources
Drift Matching 20 ppm/°C typ
Line Regulation (AV
DD
)1 μA/V typ AV
DD
= 5 V + 5%
Load Regulation 0.1 μA/V typ
Output Compliance AV
DD
– 0.6 V max
AGND min
LOGIC INPUTS
All Inputs Except SCLOCK, RESET,
and XTAL1
V
INL
, Input Low Voltage 0.8 V max DV
DD
= 5 V
0.4 V max DV
DD
= 3 V
V
INH
, Input High Voltage 2.0 V min
SCLOCK and RESET Only
(Schmitt-Triggered Inputs)
2
V
T+
1.3/3 V min/V max DV
DD
= 5 V
0.95/2.5 V min/V max DV
DD
= 3 V
V
T–
0.8/1.4 V min/V max DV
DD
= 5 V
0.4/1.1 V min/V max DV
DD
= 3 V
V
T+
– V
T–
0.3/0.85 V min/V max DV
DD
= 5 V
0.3/0.85 V min/V max DV
DD
= 3 V
Input Currents
Port 0, P1.2–P1.7, EA ±10 μA max V
IN
= 0 V or V
DD
SCLOCK, SDATA/MOSI, MISO, SS
11
–10 min, –40 max μA min/μA max V
IN
= 0 V, DV
DD
= 5 V, Internal Pull-Up
±10 μA max V
IN
= V
DD
, DV
DD
= 5 V
RESET ±10 μA max V
IN
= 0 V, DV
DD
= 5 V
35 min, 105 max μA min/μA max V
IN
= V
DD
, DV
DD
= 5 V,
Internal Pull-Down
P1.0, P1.1, Ports 2 and 3 ±10 μA max V
IN
= V
DD
, DV
DD
= 5 V
–180 μA min V
IN
= 2 V, DV
DD
= 5 V
–660 μA max
–20 μA min V
IN
= 450 mV, DV
DD
= 5 V
–75 μA max
Input Capacitance 5 pF typ All Digital Inputs
CRYSTAL OSCILLATOR (XTAL1 AND XTAL2)
Logic Inputs, XTAL1 Only
V
INL
, Input Low Voltage 0.8 V max DV
DD
= 5 V
0.4 V max DV
DD
= 3 V
V
INH
, Input High Voltage 3.5 V min DV
DD
= 5 V
2.5 V min DV
DD
= 3 V
XTAL1 Input Capacitance 18 pF typ
XTAL2 Output Capacitance 18 pF typ
Rev. B
–6–
ADuC816–SPECIFICATIONS
1
Parameter ADuC816BS Unit Test Conditions/Comments
LOGIC OUTPUTS (Not Including XTAL2)
2
V
OH
, Output High Voltage 2.4 V min V
DD
= 5 V, I
SOURCE
= 80 μA
2.4 V min V
DD
= 3 V, I
SOURCE
= 20 μA
V
OL
, Output Low Voltage
12
0.4 V max I
SINK
= 8 mA, SCLOCK, SDATA/MOSI
0.4 V max I
SINK
= 10 mA, P1.0 and P1.1
0.4 V I
SINK
= 1.6 mA, All Other Outputs max
Floating State Leakage Current ±10 μA max
Floating State Output Capacitance 5 pF typ
POWER SUPPLY MONITOR (PSM)
AV
DD
Trip Point Selection Range 2.63 V min Four Trip Points Selectable in This Range
4.63 V max Programmed via TPA1–0 in PSMCON
AV
DD
Power Supply Trip Point Accuracy ±3.5 % max
DV
DD
Trip Point Selection Range 2.63 V min Four Trip Points Selectable in This Range
4.63 V max Programmed via TPD1–0 in PSMCON
DV
DD
Power Supply Trip Point Accuracy ±3.5 % max
WATCHDOG TIMER (WDT)
Timeout Period 0 ms min Nine Timeout Periods in This Range
2000 ms max Programmed via PRE3–0 in WDCON
MCU CORE CLOCK RATE Clock Rate Generated via On-Chip PLL
MCU Clock Rate
2
98.3 kHz min Programmable via CD2–0 Bits in
PLLCON SFR
12.58 MHz max
START-UP TIME
At Power-On 300 ms typ
From Idle Mode 1 ms typ
From Power-Down Mode
Oscillator Running OSC_PD Bit = 0 in PLLCON SFR
Wake Up with INT0 Interrupt 1 ms typ
Wake Up with SPI/I
2
C Interrupt 1 ms typ
Wake Up with TIC Interrupt 1 ms typ
Wake Up with External RESET 3.4 ms typ
Oscillator Powered Down OSC_PD Bit = 1 in PLLCON SFR
Wake Up with External RESET 0.9 sec typ
After External RESET in Normal Mode 3.3 ms typ
After WDT Reset in Normal Mode 3.3 ms typ Controlled via WDCON SFR
FLASH/EE MEMORY RELIABILITY CHARACTERISTICS
13
Endurance
14
100,000 Cycles min
Data Retention
15
100 Years min
POWER REQUIREMENTS DV
DD
and AV
DD
Can Be Set
Independently
Power Supply Voltage
AV
DD
, 3 V Nominal Operation 2.7 V min
3.6 V max
AV
DD
, 5 V Nominal Operation 4.75 V min
5.25 V max
DV
DD
, 3 V Nominal Operation 2.7 V min
3.6 V max
DV
DD
, 5 V Nominal Operation 4.75 V min
5.25 V max
Rev. B
–7–
ADuC816
Parameter ADuC816BS Unit Test Conditions/Comments
POWER REQUIREMENTS (continued)
Power Supply Currents Normal Mode
16, 17
DV
DD
Current 4 mA max DV
DD
= 4.75 V to 5.25 V, Core CLK = 1.57 MHz
2.1 mA max DV
DD
= 2.7 V to 3.6 V, Core CLK = 1.57 MHz
AV
DD
Current 170 μA max AV
DD
= 5.25 V, Core CLK = 1.57 MHz
DV
DD
Current 15 mA max DV
DD
= 4.75 V to 5.25 V, Core CLK = 12.58 MHz
8 mA max DV
DD
= 2.7 V to 3.6 V, Core CLK = 12.58 MHz
AV
DD
Current 170 μA max AV
DD
= 5.25 V, Core CLK = 12.58 MHz
Power Supply Currents Idle Mode
16, 17
DV
DD
Current 1.2 mA max DV
DD
= 4.75 V to 5.25 V, Core CLK = 1.57 MHz
750 μA typ DV
DD
= 2.7 V to 3.6 V, Core CLK = 1.57 MHz
AV
DD
Current 140 μA typ Measured @ AV
DD
= 5.25 V, Core CLK = 1.57 MHz
DV
DD
Current 2 mA typ DV
DD
= 4.75 V to 5.25 V, Core CLK = 12.58 MHz
1 mA typ DV
DD
= 2.7 V to 3.6 V, Core CLK = 12.58 MHz
AV
DD
Current 140 μA typ Measured at AV
DD
= 5.25 V, Core CLK = 12.58 MHz
Power Supply Currents Power-Down Mode
16, 17
Core CLK = 1.57 MHz or 12.58 MHz
DV
DD
Current 50 μA max DV
DD
= 4.75 V to 5.25 V, Osc. On, TIC On
20 μA max DV
DD
= 2.7 V to 3.6 V, Osc. On, TIC On
AV
DD
Current 1 μA max Measured at AV
DD
= 5.25 V, Osc. On or Osc. Off
DV
DD
Current 20 μA max DV
DD
= 4.75 V to 5.25 V, Osc. Off
5μA typ DV
DD
= 2.7 V to 3.6 V, Osc. Off
Typical Additional Power Supply Currents Core CLK = 1.57 MHz, AV
DD
= DV
DD
= 5 V
(AI
DD
and DI
DD
)
PSM Peripheral 50 μA typ
Primary ADC 1 mA typ
Auxiliary ADC 500 μA typ
DAC 150 μA typ
Dual Current Sources 400 μA typ
NOTES
1
Temperature Range –40°C to +85°C.
2
These numbers are not production tested but are guaranteed by Design and/or Characterization data on production release.
3
The primary ADC is factory-calibrated at 25°C with AV
DD
= DV
DD
= 5 V yielding this full-scale error. If user power supply or temperature conditions are signifi-
cantly different from these, an Internal Full-Scale Calibration will restore this error to this level.
4
Gain Error Drift is a span drift. To calculate Full-Scale Error Drift, add the Offset Error Drift to the Gain Error Drift times the full-scale input.
5
The auxiliary ADC is factory-calibrated at 25°C with AV
DD
= DV
DD
= 5 V yielding this full-scale error of –2.5 LSB. A system zero-scale and full-scale calibration
will remove this error altogether.
6
DAC linearity and AC Specifications are calculated using:
reduced code range of 48 to 4095, 0 to V
REF
reduced code range of 48 to 3995, 0 to V
DD
.
7
Gain Error is a measure of the span error of the DAC.
8
In general terms, the bipolar input voltage range to the primary ADC is given by Range
ADC
= ±(V
REF
2
RN
)/125, where:
V
REF
= REFIN(+) to REFIN(–) voltage and V
REF
= 1.25 V when internal ADC V
REF
is selected.
RN = decimal equivalent of RN2, RN1, RN0, e.g., V
REF
= 2.5 V and RN2, RN1, RN0 = 1, 1, 0 the Range
ADC
= ±1.28 V.
In unipolar mode the effective range is 0 V to 1.28 V in our example.
9
1.25 V is used as the reference voltage to the ADC when internal V
REF
is selected via XREF0 and XREF1 bits in ADC0CON and ADC1CON respectively.
10
In bipolar mode, the Auxiliary ADC can only be driven to a minimum of A
GND
– 30 mV as indicated by the Auxiliary ADC absolute AIN voltage limits. The bipolar
range is still –V
REF
to +V
REF
; however, the negative voltage is limited to –30 mV.
11
Pins configured in I
2
C-compatible mode or SPI mode, pins configured as digital inputs during this test.
12
Pins configured in I
2
C-compatible mode only.
13
Flash/EE Memory Reliability Characteristics apply to both the Flash/EE program memory and Flash/EE data memory.
14
Endurance is qualified to 100 Kcycles as per JEDEC Std. 22 method A117 and measured at –40 °C, +25°C and +85°C, typical endurance at 25°C is 700 Kcycles.
15
Retention lifetime equivalent at junction temperature (T
J
) = 55°C as per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6eV
will derate with junction temperature as shown in Figure 27 in the Flash/EE Memory description section of this data sheet.
16
Power Supply current consumption is measured in Normal, Idle, and Power-Down Modes under the following conditions:
Normal Mode: Reset = 0.4 V, Digital I/O pins = open circuit, Core Clk changed via CD bits in PLLCON, Core Executing internal software loop.
Idle Mode: Reset = 0.4 V, Digital I/O pins = open circuit, Core Clk changed via CD bits in PLLCON, PCON.0 = 1, Core Execution suspended in idle mode.
Power-Down Mode: Reset = 0.4 V, All P0 pins and P1.2–P1.7 pins = 0.4 V, All other digital I/O pins are open circuit, Core Clk changed via CD bits in PLLCON,
PCON.1 = 1, Core Execution suspended in power-down mode, OSC turned ON or OFF via OSC_PD bit (PLLCON.7) in PLLCON SFR.
17
DV
DD
power supply current will typically increase by 3 mA (3 V operation) and 10 mA (5 V operation) during a Flash/EE memory program or erase cycle.
Specifications subject to change without notice
Rev. B
ADuC816
–8–
TIMING SPECIFICATIONS
1, 2, 3
(AVDD = 2.7 V to 3.6 V or 4.75 V to 5.25 V, DVDD = 2.7 V to 3.6 V or 4.75 V to 5.25 V; all
specifications TMIN to TMAX unless otherwise noted.)
32.768 kHz External Crystal
Parameter Min Typ Max Unit Figure
CLOCK INPUT (External Clock Driven XTAL1)
t
CK
XTAL1 Period 30.52 μs1
t
CKL
XTAL1 Width Low 15.16 μs1
t
CKH
XTAL1 Width High 15.16 μs1
t
CKR
XTAL1 Rise Time 20 ns 1
t
CKF
XTAL1 Fall Time 20 ns 1
1/t
CORE
ADuC816 Core Clock Frequency
4
0.098 12.58 MHz
t
CORE
ADuC816 Core Clock Period
5
0.636 μs
t
CYC
ADuC816 Machine Cycle Time
6
0.95 7.6 122.45 μs
NOTES
1
AC inputs during testing are driven at DV
DD
– 0.5 V for a Logic 1, and 0.45 V for a Logic 0. Timing measurements are made at V
IH
min for a Logic 1, and V
IL
max
for a Logic 0 as shown in Figure 2.
2
For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to float when a 100 mV change from the
loaded V
OH
/V
OL
level occurs as shown in Figure 2.
3
C
LOAD
for Port0, ALE, PSEN outputs = 100 pF; C
LOAD
for all other outputs = 80 pF unless otherwise noted.
4
ADuC816 internal PLL locks onto a multiple (384 times) the external crystal frequency of 32.768 kHz to provide a Stable 12.583 MHz internal clock for the system.
The core can operate at this frequency or at a binary submultiple called Core_Clk, selected via the PLLCON SFR.
5
This number is measured at the default Core_Clk operating frequency of 1.57 MHz.
6
ADuC816 Machine Cycle Time is nominally defined as 12/Core_CLK.
Specifications subject to change without notice.
t
CHK
t
CKL
t
CK
t
CKF
t
CKR
Figure 1. XTAL1 Input
DVDD – 0.5V
0.45V
0.2DVDD + 0.9V
TEST POINTS
0.2DVDD – 0.1V
VLOAD – 0.1V
VLOAD
VLOAD + 0.1V
TIMING
REFERENCE
POINTS
VLOAD – 0.1V
VLOAD
VLOAD + 0.1V
Figure 2. Timing Waveform Characteristics
Rev. B
ADuC816
–9–
12.58 MHz Core_Clk Variable Core_Clk
Parameter Min Max Min Max Unit Figure
EXTERNAL PROGRAM MEMORY
t
LHLL
ALE Pulsewidth 119 2t
CORE
– 40 ns 3
t
AVLL
Address Valid to ALE Low 39 t
CORE
– 40 ns 3
t
LLAX
Address Hold after ALE Low 49 t
CORE
– 30 ns 3
t
LLIV
ALE Low to Valid Instruction In 218 4t
CORE
– 100 ns 3
t
LLPL
ALE Low to PSEN Low 49 t
CORE
– 30 ns 3
t
PLPH
PSEN Pulsewidth 193 3t
CORE
– 45 ns 3
t
PLIV
PSEN Low to Valid Instruction In 133 3t
CORE
– 105 ns 3
t
PXIX
Input Instruction Hold after PSEN 00 ns3
t
PXIZ
Input Instruction Float after PSEN 54 t
CORE
– 25 ns 3
t
AVIV
Address to Valid Instruction In 292 5t
CORE
– 105 ns 3
t
PLAZ
PSEN Low to Address Float 25 25 ns 3
t
PHAX
Address Hold after PSEN High 0 0 ns 3
t
LHLL
t
AVLL
PCL
(OUT)
INSTRUCTION
(IN)
PCH
CORE_CLK
ALE (O)
PSEN (O)
PORT 0 (I/O)
PORT 2 (O)
t
LLPL
t
LLAX
t
PLAZ
t
PXIX
t
PXIZ
t
PLIV
t
LLIV
t
PLPH
t
PHAX
t
AVIV
Figure 3. External Program Memory Read Cycle
Rev. B
ADuC816
–10–
12.58 MHz Core_Clk Variable Core_Clk
Parameter Min Max Min Max Unit Figure
EXTERNAL DATA MEMORY READ CYCLE
t
RLRH
RD Pulsewidth 377 6t
CORE
– 100 ns 4
t
AVLL
Address Valid after ALE Low 39 t
CORE
– 40 ns 4
t
LLAX
Address Hold after ALE Low 44 t
CORE
– 35 ns 4
t
RLDV
RD Low to Valid Data In 232 5t
CORE
– 165 ns 4
t
RHDX
Data and Address Hold after RD 00 ns4
t
RHDZ
Data Float after RD 89 2t
CORE
– 70 ns 4
t
LLDV
ALE Low to Valid Data In 486 8t
CORE
– 150 ns 4
t
AVDV
Address to Valid Data In 550 9t
CORE
– 165 ns 4
t
LLWL
ALE Low to RD Low 188 288 3t
CORE
– 50 3t
CORE
+ 50 ns 4
t
AVWL
Address Valid to RD Low 188 4t
CORE
– 130 ns 4
t
RLAZ
RD Low to Address Float 0 0 ns 4
t
WHLH
RD High to ALE High 39 119 t
CORE
– 40 t
CORE
+ 40 ns 4
t
LLAX
DATA (IN)
CORE_CLK
ALE (O)
PSEN (O)
PORT 0 (I/O)
PORT 2 (O)
RD (O)
t
LLDV
t
LLWL
t
AVWL
t
AVLL
t
AVDV
t
RLAZ
t
RLDV
t
RHDX
t
RHDZ
t
WHLH
A0 – A7
(OUT)
A16 – A23 A8 – A15
t
RLRH
Figure 4. External Data Memory Read Cycle
Rev. B
ADuC816
–11–
12.58 MHz Core_Clk Variable Core_Clk
Parameter Min Max Min Max Unit Figure
EXTERNAL DATA MEMORY WRITE CYCLE
t
WLWH
WR Pulsewidth 377 6t
CORE
– 100 ns 5
t
AVLL
Address Valid after ALE Low 39 t
CORE
– 40 ns 5
t
LLAX
Address Hold after ALE Low 44 t
CORE
– 35 ns 5
t
LLWL
ALE Low to WR Low 188 288 3t
CORE
– 50 3t
CORE
+ 50 ns 5
t
AVWL
Address Valid to WR Low 188 4t
CORE
– 130 ns 5
t
QVWX
Data Valid to WR Transition 29 t
CORE
– 50 ns 5
t
QVWH
Data Setup before WR 406 7t
CORE
– 150 ns 5
t
WHQX
Data and Address Hold after WR 29 t
CORE
– 50 ns 5
t
WHLH
WR High to ALE High 39 119 t
CORE
– 40 t
CORE
+ 40 ns 5
t
LLAX
A0 – A7
CORE_CLK
ALE (O)
PSEN (O)
PORT 0 (O)
PORT 2 (O)
WR (O)
t
WHLH
t
WHQX
t
WLWH
t
QVWX
t
QVWH
t
LLWL
t
AVWL
t
AVLL
A16 – A23 A8 – A15
DATA
Figure 5. External Data Memory Write Cycle
Rev. B
ADuC816
–12–
12.58 MHz Core_Clk Variable Core_Clk
Parameter Min Typ Max Min Typ Max Unit Figure
UART TIMING (Shift Register Mode)
t
XLXL
Serial Port Clock Cycle Time 0.95 2t
CORE
μs6
t
QVXH
Output Data Setup to Clock 662 10t
CORE
– 133 ns 6
t
DVXH
Input Data Setup to Clock 292 2t
CORE
+ 133 ns 6
t
XHDX
Input Data Hold after Clock 0 0 ns
t
XHQX
Output Data Hold after Clock 42 2t
CORE
– 117 ns 6
SET RI
OR
SET TI
01
BIT 1
t
XLXL
ALE (O)
TXD
(OUTPUT CLOCK)
RXD
(OUTPUT DATA)
RXD
(INPUT DATA)
67
BIT 6MSB
MSB BIT 6 BIT 1 LSB
t
XHQX
t
QVXH
t
DVXH
t
XHDX
Figure 6. UART Timing in Shift Register Mode
Rev. B
ADuC816
–13–
Parameter Min Max Unit Figure
I
2
C-COMPATIBLE INTERFACE TIMING
t
L
SCLOCK Low Pulsewidth 4.7 μs7
t
H
SCLOCK High Pulsewidth 4.0 μs7
t
SHD
Start Condition Hold Time 0.6 μs7
t
DSU
Data Setup Time 100 μs7
t
DHD
Data Hold Time 0.9 μs7
t
RSU
Setup Time for Repeated Start 0.6 μs7
t
PSU
Stop Condition Setup Time 0.6 μs7
t
BUF
Bus Free Time between a STOP 1.3 μs7
Condition and a START Condition
t
R
Rise Time of Both SCLOCK and SDATA 300 ns 7
t
F
Fall Time of Both SCLOCK and SDATA 300 ns 7
t
SUP
*Pulsewidth of Spike Suppressed 50 ns 7
*Input filtering on both the SCLOCK and SDATA inputs suppresses noise spikes less than 50 ns.
SDATA (I/O)
STOP
CONDITION
ACK MSB
SCLK (I)
tPSU tSHD
tDSU tDHD
tSUP
tH
tDSU tDHD
tRSU
tF
tR
tF
tR
tL
tBUF
START
CONDITION
tSUP
LSB
MSB
1 2-7 8
PS
9
S(R)
REPEATED
START
1
Figure 7. I
2
C-Compatible Interface Timing
Rev. B
ADuC816
–14–
Parameter Min Typ Max Unit Figure
SPI MASTER MODE TIMING (CPHA = 1)
t
SL
SCLOCK Low Pulsewidth*630 ns 8
t
SH
SCLOCK High Pulsewidth*630 ns 8
t
DAV
Data Output Valid after SCLOCK Edge 50 ns 8
t
DSU
Data Input Setup Time before SCLOCK Edge 100 ns 8
t
DHD
Data Input Hold Time after SCLOCK Edge 100 ns 8
t
DF
Data Output Fall Time 10 25 ns 8
t
DR
Data Output Rise Time 10 25 ns 8
t
SR
SCLOCK Rise Time 10 25 ns 8
t
SF
SCLOCK Fall Time 10 25 ns 8
*Characterized under the following conditions:
a. Core clock divider bits CD2, CD1, and CD0 bits in PLLCON SFR set to 0, 1, and 1 respectively, i.e., core clock frequency = 1.57 MHz and
b. SPI bit-rate selection bits SPR1 and SPR0 bits in SPICON SFR set to 0 and 0 respectively.
SCLOCK
(CPOL = 0)
tSH
SCLOCK
(CPOL = 1)
MOSI
MISO
BITS 6 – 1 LSBMSB
tSL
tDAV tDF tDR
tSR tSF
tDHD
tDSU
MSB IN BITS 6 – 1 LSB IN
Figure 8. SPI Master Mode Timing (CPHA = 1)
Rev. B
ADuC816
–15–
Parameter Min Typ Max Unit Figure
SPI MASTER MODE TIMING (CPHA = 0)
t
SL
SCLOCK Low Pulsewidth*630 ns 9
t
SH
SCLOCK High Pulsewidth*630 ns 9
t
DAV
Data Output Valid after SCLOCK Edge 50 ns 9
t
DOSU
Data Output Setup before SCLOCK Edge 150 ns 9
t
DSU
Data Input Setup Time before SCLOCK Edge 100 ns 9
t
DHD
Data Input Hold Time after SCLOCK Edge 100 ns 9
t
DF
Data Output Fall Time 10 25 ns 9
t
DR
Data Output Rise Time 10 25 ns 9
t
SR
SCLOCK Rise Time 10 25 ns 9
t
SF
SCLOCK Fall Time 10 25 ns 9
*Characterized under the following conditions:
a. Core clock divider bits CD2, CD1 and CD0 bits in PLLCON SFR set to 0, 1, and 1 respectively, i.e., core clock frequency = 1.57 MHz and
b. SPI bit-rate selection bits SPR1 and SPR0 bits in SPICON SFR set to 0 and 0 respectively.
SCLOCK
(CPOL = 0)
tDSU
SCLOCK
(CPOL = 1)
MOSI
MISO
MSB LSB
LSB IN
BITS 6 – 1
BITS 6 – 1
MSB IN
tDHD
tDR
tDAV
tDF
tDOSU
tSH tSL
tSR tSF
Figure 9. SPI Master Mode Timing (CPHA = 0)
Rev. B
ADuC816
–16–
Parameter Min Typ Max Unit Figure
SPI SLAVE MODE TIMING (CPHA = 1)
t
SS
SS to SCLOCK Edge 0 ns 10
t
SL
SCLOCK Low Pulsewidth 330 ns 10
t
SH
SCLOCK High Pulsewidth 330 ns 10
t
DAV
Data Output Valid after SCLOCK Edge 50 ns 10
t
DSU
Data Input Setup Time before SCLOCK Edge 100 ns 10
t
DHD
Data Input Hold Time after SCLOCK Edge 100 ns 10
t
DF
Data Output Fall Time 10 25 ns 10
t
DR
Data Output Rise Time 10 25 ns 10
t
SR
SCLOCK Rise Time 10 25 ns 10
t
SF
SCLOCK Fall Time 10 25 ns 10
t
SFS
SS High after SCLOCK Edge 0 ns 10
SCLOCK
(CPOL = 0)
tSS
SCLOCK
(CPOL = 1)
MISO
MOSI
SS
MSB IN BITS 6
–
1 LSB IN
LSB
BITS 6
–
1
MSB
tDHD
tDSU
tDF tDR
tSL
tSH
tDAV
tDF
tSR tSF
tSFS
Figure 10. SPI Slave Mode Timing (CPHA = 1)
Rev. B
ADuC816
–17–
Parameter Min Typ Max Unit Figure
SPI SLAVE MODE TIMING (CPHA = 0)
t
SS
SS to SCLOCK Edge 0 ns 11
t
SL
SCLOCK Low Pulsewidth 330 ns 11
t
SH
SCLOCK High Pulsewidth 330 ns 11
t
DAV
Data Output Valid after SCLOCK Edge 50 ns 11
t
DSU
Data Input Setup Time before SCLOCK Edge 100 ns 11
t
DHD
Data Input Hold Time after SCLOCK Edge 100 ns 11
t
DF
Data Output Fall Time 10 25 ns 11
t
DR
Data Output Rise Time 10 25 ns 11
t
SR
SCLOCK Rise Time 10 25 ns 11
t
SF
SCLOCK Fall Time 10 25 ns 11
t
SSR
SS to SCLOCK Edge 50 ns 11
t
DOSS
Data Output Valid after SS Edge 20 ns 11
t
SFS
SS High after SCLOCK Edge 0 ns 11
MISO
MOSI
SCLOCK
(CPOL = 1)
SCLOCK
(CPOL = 0)
SS
MSB BITS 6 – 1 LSB
BITS 6 – 1
MSB IN
tDHD
tDSU
tDR
tDF
tDAV
tDOSS
tSH tSL
tSS
tSR tSF
tSFS
LSB IN
Figure 11. SPI Slave Mode Timing (CPHA = 0)
Rev. B
ADuC816
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Parameter Ratings
AVDD to AGND −0.3 V to +7 V
AVDD to DGND −0.3 V to +7 V
DVDD to AGND −0.3 V to +7 V
DVDD to DGND −0.3 V to +7 V
AGND to DGND1 −0.3 V to +0.3 V
AVDD to DVDD −2 V to +5 V
Analog Input Voltage to AGND2 −0.3 V to AVDD +0.3 V
Reference Input Voltage to AGND −0.3 V to AVDD +0.3 V
AIN/REFIN Current (Indefinite) 30 mA
Digital Input Voltage to DGND −0.3 V to DVDD +0.3 V
Digital Output Voltage to DGND −0.3 V to DVDD +0.3 V
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
șJA Thermal Impedance (MQFP) 90°C/W
șJA Thermal Impedance (LFCSP
Base Floating) 52°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
1 AGND and DGND are shorted internally on the ADuC816.
2 Applies to P1.2 to P1.7 pins operating in analog or digital input modes.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
–18–
Rev. B
ADuC816
PIN FUNCTION DESCRIPTIONS
PIN 1
ADuC816
TOP VI EW
(Not to Scale)
00436-001
1
14
13
26
27
40
39
52
PIN 1
INDICATOR
1
14
42
29
NOTES
1. THE EXPOSED PADDLE MUST BE LEFT
UNCONNECTED.
15 28
43
TOP VIEW
(Not to Scal e)
ADuC816
56
00436-002
56-Lead MQFP 56-Lead LFCSP
PIN FUNCTION DESCRIPTIONS
Pin No.
52-Lead
MQFP
Pin No.
56-Lead
CSP Mnemonic Type1 Description
1, 2 56, 1 P1.0/P1.1 I/O P1.0 and P1.1 can function as digital inputs or digital outputs and have a pull-up configuration as
described for Port 3. P1.0 and P1.1 have an increased current drive sink capability of 10 mA.
P1.0/T2 I/O P1.0 and P1.1 also have various secondary functions as described below. P1.0 can be used to
provide a clock input to Timer 2. When enabled, Counter 2 is incremented in response to a
negative transition on the T2 input pin.
P1.1/T2EX I/O P1.1 can also be used to provide a control input to Timer 2.When enabled, a negative transition
on the T2EX input pin will cause a Timer 2 capture or reload event.
3–4, 2–3, P1.2–P1.7 I Port 1.2 to Port 1.7 have no digital output driver; they can function as a digital input
9–12 11–14 P1.2/DAC/IEXC1 I/O for which 0 must be written to the port bit. As a digital input, these pins must be driven high or
low externally. These pins also have the following analog functionality: The voltage output from
the DAC or one or both current sources (200 µA or 2 × 200 µA) can be configured to appear at
this pin.
P1.3/AIN5/IEXC2 I/O Auxiliary ADC input or one or both current sources can be configured at this pin.
P1.4/AIN1 I Primary ADC, Positive Analog Input
P1.5/AIN2 I Primary ADC, Negative Analog Input
P1.6/AIN3 I Auxiliary ADC Input or Muxed Primary ADC, Positive Analog Input
P1.7/AIN4/DAC I/O Auxiliary ADC Input or Muxed Primary ADC, Negative Analog Input. The voltage output from the
DAC can also be configured to appear at this pin.
5 4, 5 AVDD S Analog Supply Voltage, 3 V or 5 V
6 6, 7, 8 AGND S Analog Ground. Ground reference pin for the analog circuitry.
7 9 REFIN(–) I Reference Input, Negative Terminal
8 10 REFIN(+) I Reference Input, Positive Terminal
13 15 SS I Slave Select Input for the SPI Interface. A weak pull-up is present on this pin.
14 16 MISO I/O Master Input/Slave Output for the SPI Interface. A weak pull-up is present on this input pin
15 17 RESET I Reset Input. A high level on this pin for 16 core clock cycles while the oscillator is running resets
the device. There is an internal weak pull-down and a Schmitt trigger input stage on this pin.
16–19, 18–21, P3.0–P3.7 I/O P3.0–P3.7 are bidirectional port pins with internal pull-up resistors. Port 3 pins that
22–25 24–27 P3.0/RXD I/O have 1s written to them are pulled high by the internal pull-up resistors, and in that state can be
used as inputs. As inputs, Port 3 pins being pulled externally low will source current because of
the internal pull-up resistors.When driving a 0-to-1 output transition, a strong pull-up is active for
two core clock periods of the instruction cycle. Port 3 pins also have various secondary functions
including: Receiver Data for UART Serial Port
P3.1/TXD I/O Transmitter Data for UART Serial Port
P3.2/INT0 I/O External Interrupt 0.This pin can also be used as a gate control input to Timer 0.
P3.3/INT1 I/O External Interrupt 1.This pin can also be used as a gate control input to Timer 1.
P3.4/T0 I/O Timer/Counter 0 External Input.
P3.5/T1 I/O Timer/Counter 1 External Input
P3.6/WR I/O External Data Memory Write Strobe. Latches the data byte from Port 0 into an external data
memory.
P3.7/RD I/O External Data Memory Read Strobe. Enables the data from an external data memory to Port 0.
–19–
Rev. B
ADuC816
Pin No.
52-Lead
MQFP
Pin No.
56-Lead
CSP Mnemonic Type1 Description
20, 34, 48 22, 36, 51, DVDD S Digital Supply, 3 V or 5 V
21, 35, 47 23, 37, 38, 50 DGND S Digital Ground. Ground reference point for the digital circuitry.
26 SCLOCK I/O Serial Interface Clock for either the I2C or SPI Interface. As an input, this pin is a Schmitt-triggered input,
and a weak internal pull-up is present on this pin unless it is outputting logic low. This pin can also be
directly controlled in software as a digital output pin.
27 MOSI/SDATA I/O Serial Data I/O for the I2C Interface or Master Output/Slave Input for the SPI Interface. A weak
internal pull-up is present on this pin unless it is outputting logic low. This pin can also be directly
controlled in software as a digital output pin.
28–31
36–39
30–33
39–42
P2.0–P2.7
(A8–A15)
(A16–A23)
I/O Port 2 is a bidirectional port with internal pull-up resistors. Port 2 pins that have 1s written to
them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As
inputs, Port 2 pins being pulled externally low will source current because of the internal pull-up
resistors. Port 2 emits the high order address bytes during fetches from external program
memory and middle and high order address bytes during accesses to the 24-bit external data
memory space.
32 34 XTAL1 I Input to the Crystal Oscillator Inverter
33 35 XTAL2 O Output from the Crystal Oscillator Inverter. (See the ADuC816 Hardware Design Considerations
section for description.)
40 43 EA I/O External Access Enable, Logic Input. When held high, this input enables the device to fetch code
from internal program memory locations 0000h to F7FFh.When held low, this input enables the
device to fetch all instructions from external program memory. To determine the mode of code
execution, i.e., internal or external, the EA pin is sampled at the end of an external RESET assertion
or as part of a device power cycle. EA may also be used as an external emulation I/O pin, and
therefore the voltage level at this pin must not be changed during normal mode operation as it
may cause an emulation interrupt that will halt code execution.
41 44 PSEN O Program Store Enable, Logic Output. This output is a control signal that enables the external
program memory to the bus during external fetch operations. It is active every six oscillator
periods except during external data memory accesses. This pin remains high during internal
program execution. PSEN can also be used to enable Serial Download mode when pulled low through
a resistor at the end of an external RESET assertion or as part of a device power cycle.
42 45 ALE O Address Latch Enable, Logic Output. This output is used to latch the low byte (and page byte for
24-bit data address space accesses) of the address to external memory during external code or
data memory access cycles. It is activated every six oscillator periods except during an external
data memory access. It can be disabled by setting the PCON.4 bit in the PCON SFR.
43–46
49–52
46–49
52–55
P0.0–P0.7
(AD0–AD3)
I/O These pins are part of Port 0, which is an 8-bit, open-drain, bidirectional I/O port. Port 0 pins that
have 1s written to them float and in that state can be used (AD4–AD7)as high impedance inputs.
An external pull-up resistor will be required on P0 outputs to force a valid logic high level
externally. Port 0 is also the multiplexed low order address and data bus during accesses to
external program or data memory. In this application, it uses strong internal pull-ups when
emitting 1s.
1 I = Input, O = Output, S = Supply.
–20–
Rev. B
ADuC816
Figure 12. 52-MQFP Block Diagram
–21–
Rev. B
ADuC816
–22–
MEMORY ORGANIZATION
As with all 8051-compatible devices, the ADuC816 has sepa-
rate address spaces for Program and Data memory as shown in
Figure 13 and Figure 14.
If the user applies power or resets the device while the EA pin is
pulled low, the part will execute code from the external pro-
gram space, otherwise the part defaults to code execution
from its internal 8 Kbyte Flash/EE program memory. This
internal code space can be downloaded via the UART serial
port while the device is in-circuit.
EXTERNAL
PROGRAM
MEMORY
SPACE
FFFFH
2000H
1FFFH
0000H
EA = 1
INTERNAL
8 KBYTE
FLASH/EE
PROGRAM
MEMORY
PROGRAM MEMORY SPACE
READ ONLY
EA = 0
EXTERNAL
PROGRAM
MEMORY
SPACE
Figure 13. Program Memory Map
The data memory address space consists of internal and exter-
nal memory space. The internal memory space is divided into
four physically separate and distinct blocks, namely the lower
128 bytes of RAM, the upper 128 bytes of RAM, the 128 bytes
of special function register (SFR) area, and a 640-byte Flash/EE
Data memory. While the upper 128 bytes of RAM, and the
SFR area share the same address locations, they are accessed
through different address modes.
The lower 128 bytes of data memory can be accessed through
direct or indirect addressing, the upper 128 bytes of RAM can
be accessed through indirect addressing, and the SFR area is
accessed through direct addressing.
Also, as shown in Figure 13, the additional 640 Bytes of
Flash/EE Data Memory are available to the user and can be
accessed indirectly via a group of control registers mapped into
the Special Function Register (SFR) area. Access to the Flash/
EE Data Memory is discussed in detail later as part of the Flash/
EE Memory section in this data sheet.
The external data memory area can be expanded up to 16 MBytes.
This is an enhancement of the 64 KByte external data memory
space available on standard 8051-compatible cores.
The external data memory is discussed in more detail in the
ADuC816 Hardware Design Considerations section.
SPECIAL
FUNCTION
REGISTERS
ACCESSIBLE
BY DIRECT
ADDRESSING
ONLY
640 BYTES
FLASH/EE DATA
MEMORY
ACCESSED
INDIRECTLY
VIA SFR
CONTROL REGISTERS
INTERNAL
DATA MEMORY
SPACE
FFH
80H
7FH
00H
UPPER
128
FFH
80H
EXTERNAL
DATA
MEMORY
SPACE
(24-BIT
ADDRESS
SPACE)
000000H
DATA MEMORY SPACE
READ/WRITE
(PAGE 159)
(PAGE 0)
00H
9FH FFFFFFH
LOWER
128
ACCESSIBLE
BY
INDIRECT
ADDRESSING
ONLY
ACCESSIBLE
BY
DIRECT
AND INDIRECT
ADDRESSING
Figure 14. Data Memory Map
The lower 128 bytes of internal data memory are mapped as shown
in Figure 15. The lowest 32 bytes are grouped into four banks
of eight registers addressed as R0 through R7. The next 16 bytes
(128 bits), locations 20Hex through 2FHex above the register
banks, form a block of directly addressable bit locations at bit
addresses 00H through 7FH. The stack can be located anywhere
in the internal memory address space, and the stack depth can be
expanded up to 256 bytes.
BIT-ADDRESSABLE
(BIT ADDRESSES)
FOUR BANKS OF EIGHT
REGISTERS
R0 R7
BANKS
SELECTED
VIA
BITS IN PSW
11
10
01
00
07H
0FH
17H
1FH
2FH
7FH
00H
08H
10H
18H
20H
RESET VALUE OF
STACK POINTER
30H
GENERAL-PURPOSE
AREA
Figure 15. Lower 128 Bytes of Internal Data Memory
Rev. B
ADuC816
–23–
Reset initializes the stack pointer to location 07 hex and increments
it once to start from locations 08 hex which is also the first regis-
ter (R0) of register bank 1. Thus, if one is going to use more
than one register bank, the stack pointer should be initialized to an
area of RAM not used for data storage.
The SFR space is mapped to the upper 128 bytes of internal data
memory space and accessed by direct addressing only. It provides
an interface between the CPU and all on-chip peripherals. A block
diagram showing the programming model of the ADuC816 via
the SFR area is shown in Figure 16. A complete SFR map is shown
in Figure 17.
128-BYTE
SPECIAL
FUNCTION
REGISTER
AREA
8 KBYTE
ELECTRICALLY
REPROGRAMMABLE
NONVOLATILE
FLASH/EE PROGRAM
MEMORY
8051-
COMPATIBLE
CORE
OTHER ON-CHIP
PERIPHERALS
TEMPERATURE
SENSOR
CURRENT
SOURCES
12-BIT DAC
SERIAL I/O
WDT
PSM
TIC
PLL
DUAL
SIGMA-DELTA ADCs
640-BYTE
ELECTRICALLY
REPROGRAMMABLE
NONVOLATILE
FLASH/EE DATA
MEMORY
256 BYTES
RAM
Figure 16. Programming Model
OVERVIEW OF MCU-RELATED SFRS
Accumulator SFR
ACC is the Accumulator register and is used for math operations
including addition, subtraction, integer multiplication and division,
and Boolean bit manipulations. The mnemonics for accumulator-
specific instructions refer to the Accumulator as A.
B SFR
The B register is used with the ACC for multiplication and divi-
sion operations. For other instructions it can be treated as a
general-purpose scratchpad register.
Stack Pointer SFR
The SP register is the stack pointer and is used to hold an internal
RAM address that is called the “top of the stack.” The SP register
is incremented before data is stored during PUSH and CALL
executions. While the Stack may reside anywhere in on-chip
RAM, the SP register is initialized to 07H after a reset. This causes
the stack to begin at location 08H.
Data Pointer
The Data Pointer is made up of three 8-bit registers, named
DPP (page byte), DPH (high byte) and DPL (low byte). These
are used to provide memory addresses for internal and external
code access and external data access. It may be manipulated as
a 16-bit register (DPTR = DPH, DPL), although INC DPTR
instructions will automatically carry over to DPP, or as three
independent 8-bit registers (DPP, DPH, DPL).
Program Status Word SFR
The PSW register is the Program Status Word which contains
several bits reflecting the current status of the CPU as detailed in
Table I.
SFR Address D0H
Power ON Default Value 00H
Bit Addressable Yes
YCCA0F1SR0SRVO1FP
Table I. PSW SFR Bit Designations
Bit Name Description
7 CY Carry Flag
6 AC Auxiliary Carry Flag
5 F0 General-Purpose Flag
4 RS1 Register Bank Select Bits
3 RS0 RS1 RS0 Selected Bank
000
011
102
113
2 OV Overflow Flag
1 F1 General-Purpose Flag
0 P Parity Bit
Power Control SFR
The Power Control (PCON) register contains bits for power-
saving options and general-purpose status flags as shown in
Table II.
SFR Address 87H
Power ON Default Value 00H
Bit Addressable No
DOMSDPIRESDP0TNIFFOELA1FG0FGDPLDI
Table II. PCON SFR Bit Designations
Bit Name Description
7 SMOD Double UART Baud Rate
6 SERIPD I
2
C/SPI Power-Down Interrupt
Enable
5 INT0PD INT0 Power-Down Interrupt
Enable
4 ALEOFF Disable ALE Output
3 GF1 General-Purpose Flag Bit
2 GF0 General-Purpose Flag Bit
1 PD Power-Down Mode Enable
0 IDL Idle Mode Enable
Rev. B
ADuC816
–24–
SPECIAL FUNCTION REGISTERS
All registers except the program counter and the four general-
purpose register banks, reside in the SFR area. The SFR registers
include control, configuration, and data registers that provide
an interface between the CPU and all on-chip peripherals.
Figure 17 shows a full SFR memory map and SFR contents on
RESET; NOT USED indicates unoccupied SFR locations. Unoc-
cupied locations in the SFR address space are not implemented;
i.e., no register exists at this location. If an unoccupied location
is read, an unspecified value is returned. SFR locations reserved
for future use are shaded (RESERVED) and should not be
accessed by user software.
SPICON
F8H 04H
RESERVED RESERVED
RESERVEDRESERVED
RESERVEDRESERVED
NOT USED RESERVEDRESERVED RESERVED
RESERVEDRESERVED
RESERVEDRESERVED
RESERVED
RESERVED
RESERVED RESERVED
RESERVED
RESERVED
RESERVED RESERVED
RESERVED RESERVED
RESERVEDRESERVED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USEDNOT USEDNOT USED
RESERVED
RESERVED
RESERVED RESERVED
RESERVED NOT USED
DACL
FBH 00H
DACH
FCH 00H
DACCON
FDH 00H
B
F0H 00H
I2CCON
E8H 00H
ACC
E0H 00H
ADCSTAT
D8H 00H
PSW
D0H 00H
T2CON
00H
WDCON
C0H 10H
IP
B8H 00H
P3
B0H FFH
IE
A8H 00H
P2
A0H FFH
SCON
98H 00H
P1
90H FFH
TCON
88H 00H
P0
80H FFH
ADCMODE
D1H 00H
ECON
B9H 00H
IEIP2
A9H A0H
TIMECON
A1H 00H
SBUF
99H 00H
TMOD
89H 00H
SP
81H 07H
NOT USED
EAH 55H
OF0M*
E2H 00H
ADC0M
DAH 00H
ADC0CON
D2H 07H
RCAP2L
CAH 00H
CHIPID
C2H 16H
HTHSEC
A2H 00H
I2CDAT
9AH 00H
TL0
8AH 00H
DPL
82H 00H
EBH 53H
OF0H*
E3H 80H
ADC0H
DBH 00H
ADC1CON
D3H 00H
RCAP2H
CBH 00H
SEC
A3H 00H
TL1
8BH 00H
DPH
83H 00H
RESERVED
RESERVEDRESERVED RESERVEDRESERVED
I2CDAT
00H
9BH
GN1L*
ECH 9AH
OF1L*
E4H 00H
ADC1L
DCH 00H
SF
D4H 45H
TL2
CCH 00H
EDATA1
BCH 00H
MIN
A4H 00H
TH0
8CH 00H
DPP
84H 00H
RESERVED
GN1H*
EDH 59H
OF1H*
E5H 80H
ADC1H
DDH 00H
ICON
D5H 00H
TH2
CDH 00H
EDATA2
BDH 00H
HOUR
A5H 00H
TH1
8DH 00H
RESERVED
EADRL
C6H 00H
EDATA3
BEH 00H
INTVAL
A6H 00H
SPIDAT
F7H 00H
PSMCON
DFH DEH
PLLCON
D7H 03H
EDATA4
BFH 00H
PCON
87H 00H
GN0M*GN0H*
C8H
NOT USED NOT USED NOT USED
RESERVED
RESERVED
RESERVED
ISPI
FFH 0
WCOL
FEH 0
SPE
FDH 0
SPIM
FCH 0
CPOL
FBH 0
CPHA
FAH
SPR1
F9H 0
SPR0
F8H 0
BITS
F7H 0 F6H 0 F5H 0 F4H 0 F3H 0 F2H F1H 0 F0H 0
BITS
MDO
EFH 0
MDE
EEH 0
MCO
EDH 0
MDI
ECH 0
I2CM
EBH 0
I2CRS
EAH
I2CTX
E9H 0
I2CI
E8H 0
BITS
E7H 0 E6H 0 E5H 0 E4H 0 E3H 0 E2H E1H 0 E0H 0
BITS
RDY0
DFH 0
RDY1
DEH 0
CAL
DDH 0
NOXREF
DCH 0
ERR0
DBH 0
ERR1
DAH D9H 0 D8H 0
BITS
CY
D7H 0
AC
D6H 0
F0
D5H 0
RSI
D4H 0
RS0
D3H 0
OV
D2H
FI
D1H 0
P
D0H 0
BITS
TF2
CFH 0
EXF2
CEH 0
RCLK
CDH 0
TCLK
CCH 0
EXEN2
CBH 0
TR2
CAH
CNT2
C9H 0
CAP2
C8H 0
BITS
PRE2
C7H 0
PRE1
C6H 0
PRE0
C5H 0 C4H 1
WDIR
C3H 0
WDS
C2H
WDE
C1H 0
WDWR
C0H 0
BITS
BFH 0
PADC
BEH 0
PT2
BDH 0
PS
BCH 0
PT1
BBH 0
PX1
BAH
PT0
B9H 0
PX0
B8H 0
BITS
RD
B7H 1
WR
B6H 1
T1
B5H 1
T0
B4H 1
INT1
B3H 1
INT0
B2H
TXD
B1H 1
RXD
B0H 1
BITS
EA
AFH
EADC
AEH
ET2
ADH
ES
ACH 0
ET1
ABH 0
EX1
AAH
ET0
A9H 0
EX0
A8H 0
BITS
A7H A6H A5H 1 A4H 1 A3H 1 A2H A1H 1 A0H 1
BITS
SM0
9FH 0
SM1
9EH 0
SM2
9DH 0
REN
9CH 0
TB8
9BH 0
RB8
9AH
T1
99H 0
R1
98H 0
BITS
97H 1 96H 1 95H 1 94H 1 93H 1 92H
T2EX
91H 1
T2
90H 1
BITS
TF1
8FH 0
TR1
8EH 0
TF0
8DH 0
TR0
8CH 0
IE1
8BH 0
IT1
8AH
IE0
89H 0
IT0
88H 0
BITS
87H 1 86H 1 85H 1 84H 1 83H 1 82H 81H 1 80H 1
BITS
1
1
0
1
0
1
1
0
0
0
0
0
0
0
PRE3
000 0
11
*CALIBRATION COEFFICIENTS ARE PRECONFIGURED AT POWER-UP TO FACTORY-CALIBRATED VALUES.
IE0
89H
0
IT0
88H
0
TCON
88H 00H
BIT MNEMONIC
BIT BIT ADDRESS
MNEMONIC
DEFAULT VALUE
SFR ADDRESS
THESE BITS ARE CONTAINED IN THIS BYTE.
DEFAULT BIT VALUE
SFR MAP KEY:
SFR NOTE:
SFRs WHOSE ADDRESSES END IN 0H OR 8H ARE BIT-ADDRESSABLE.
Figure 17. Special Function Register Locations and Reset Values
Rev. B
ADuC816
–25–
SFR INTERFACE TO THE PRIMARY AND AUXILIARY
ADCS
Both ADCs are controlled and configured via a number of SFRs
that are mentioned here and described in more detail in the
following pages.
ADCSTAT: ADC Status Register. Holds general status of
the Primary and Auxiliary ADCs.
ADCMODE: ADC Mode Register. Controls general modes
of operation for Primary and Auxiliary ADCs.
ADC0CON: Primary ADC Control Register. Controls
specific configuration of Primary ADC.
ADC1CON: Auxiliary ADC Control Register. Controls
specific configuration of Auxiliary ADC.
SF: Sinc Filter Register. Configures the decimation
factor for the Sinc3 filter and thus the Primary
and Auxiliary ADC update rates.
ICON: Current Source Control Register. Allows
user control of the various on-chip current
source options.
ADC0H/M*: Primary ADC 16-bit conversion result held in
these two 8-bit registers.
ADC1H/L: Auxiliary ADC 16-bit conversion result held
in these two 8-bit registers.
OF0H/M*: Primary ADC 16-bit Offset Calibration Coeffi-
cient held in these two 8-bit registers.
OF1H/L: Auxiliary ADC 16-bit Offset Calibration Coeffi-
cient held in these two 8-bit registers.
GN0H/M*: Primary ADC 16-bit Gain Calibration Coeffi-
cient held in these two 8-bit registers.
GN1H/L: Auxiliary ADC 16-bit Gain Calibration Coeffi-
cient held in these two 8-bit registers.
*To maintain code compatibility with the ADuC824, it is the low-byte SFR
associated with these register groups that is omitted on the ADuC816.
ADCSTAT (ADC Status Register)
This SFR reflects the status of both ADCs including data ready, calibration and various (ADC-related) error and warning condi-
tions including reference detect and conversion overflow/underflow flags.
SFR Address D8H
Power-On Default Value 00H
Bit Addressable Yes
0YDR1YDRLACFERXON0RRE1RRE------
Table III. ADCSTAT SFR Bit Designations
Bit Name Description
7 RDY0 Ready Bit for Primary ADC.
Set by hardware on completion of ADC conversion or calibration cycle.
Cleared directly by the user or indirectly by write to the mode bits to start another Primary
ADC conversion or calibration. The Primary ADC is inhibited from writing further results to its
data or calibration registers until the RDY0 bit is cleared.
6 RDY1 Ready Bit for Auxiliary ADC.
Same definition as RDY0 referred to the Auxiliary ADC.
5 CAL Calibration Status Bit.
Set by hardware on completion of calibration.
Cleared indirectly by a write to the mode bits to start another ADC conversion or calibration.
4 NOXREF No External Reference Bit (only active if Primary or Auxiliary ADC is active).
Set to indicate that one or both of the REFIN pins is floating or the applied voltage is below a
specified threshold. When Set conversion results are clamped to all ones,if using ext. reference.
Cleared to indicate valid V
REF
.
3 ERR0 Primary ADC Error Bit.
Set by hardware to indicate that the result written to the Primary ADC data registers has
been clamped to all zeros or all ones. After a calibration this bit also flags error conditions that
caused the calibration registers not to be written.
Cleared by a write to the mode bits to initiate a conversion or calibration.
2 ERR1 Auxiliary ADC Error Bit.
Same definition as ERR0 referred to the Auxiliary ADC.
1 --- Reserved for Future Use.
0 --- Reserved for Future Use.
Rev. B
ADuC816
–26–
ADCMODE (ADC Mode Register)
Used to control the operational mode of both ADCs.
SFR Address D1H
Power-On Default Value 00H
Bit Addressable No
------NE0CDANE1CDA---2DM1DM0DM
Table IV. ADCMODE SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 --- Reserved for Future Use.
5 ADC0EN Primary ADC Enable.
Set by the user to enable the Primary ADC and place it in the mode selected in MD2-MD0 below
Cleared by the user to place the Primary ADC in power-down mode.
4 ADC1EN Auxiliary ADC Enable.
Set by the user to enable the Auxiliary ADC and place it in the mode selected in MD2-MD0 below
Cleared by the user to place the Auxiliary ADC in power-down mode.
3 --- Reserved for Future Use.
2 MD2 Primary and Auxiliary ADC Mode bits.
1 MD1 These bits select the operational mode of the enabled ADC as follows:
0 MD0 MD2 MD1 MD0
0 0 0 Power-Down Mode (Power-On Default)
0 0 1 Idle Mode
In Idle Mode the ADC filter and modulator are held in a reset state
although the modulator clocks are still provided.
0 1 0 Single Conversion Mode
In Single Conversion Mode, a single conversion is performed on the
enabled ADC. On completion of the conversion, the ADC data regis-
ters (ADC0H/M and/or ADC1H/L) are updated, the relevant flags
in the ADCSTAT SFR are written, and power-down is re-entered with
the MD2–MD0 accordingly being written to 000.
0 1 1 Continuous Conversion
In continuous conversion mode the ADC data registers are regularly
updated at the selected update rate (see SF register)
1 0 0 Internal Zero-Scale Calibration
Internal short automatically connected to the enabled ADC(s)
1 0 1 Internal Full-Scale Calibration
Internal or External V
REF
(as determined by XREF0 and XREF1 bits
in ADC0/1CON) is automatically connected to the ADC input for
this calibration.
1 1 0 System Zero-Scale Calibration
User should connect system zero-scale input to the ADC input pins
as selected by CH1/CH0 and ACH1/ACH0 bits in the ADC0/1CON
register.
1 1 1 System Full-Scale Calibration
User should connect system full-scale input to the ADC input pins as
selected by CH1/CH0 and ACH1/ACH0 bits in the ADC0/1CON
register.
NOTES
1. Any change to the MD bits will immediately reset both ADCs. A write to the MD2–0 bits with no change is also treated as a reset. (See exception to this in Note 3 below.)
2. If ADC0CON is written when AD0EN = 1, or if AD0EN is changed from 0 to 1, then both ADCs are also immediately reset. In other words, the Primary ADC is
given priority over the Auxiliary ADC and any change requested on the primary ADC is immediately responded to.
3. On the other hand, if ADC1CON is written or if ADC1EN is changed from 0 to 1, only the Auxiliary ADC is reset. For example, if the Primary ADC is continuously
converting when the Auxiliary ADC change or enable occurs, the primary ADC continues undisturbed. Rather than allow the Auxiliary ADC to operate with a phase
difference from the primary ADC, the Auxiliary ADC will fall into step with the outputs of the primary ADC. The result is that the first conversion time for the
Auxiliary ADC will be delayed up to three outputs while the Auxiliary ADC update rate is synchronized to the Primary ADC.
4. Once ADCMODE has been written with a calibration mode, the RDY0/1 bits (ADCSTAT) are immediately reset and the calibration commences. On completion,
the appropriate calibration registers are written, the relevant bits in ADCSTAT are written, and the MD2–0 bits are reset to 000 to indicate the ADC is back in
power-down mode.
5. Any calibration request of the Auxiliary ADC while the temperature sensor is selected will fail to complete. Although the RDY1 bit will be set at the end of the
calibration cycle, no update of the calibration SFRs will take place and the ERR1 bit will be set.
6. Calibrations are performed at maximum SF (see SF SFR) value guaranteeing optimum calibration operation.
Rev. B
ADuC816
–27–
ADC0CON (Primary ADC Control Register)
Used to configure the Primary ADC for range, channel selection, external Ref enable, and unipolar or bipolar coding.
SFR Address D2H
Power-On Default Value 07H
Bit Addressable No
---0FERX1HC0HC0INU2NR1NR0NR
Table V. ADC0CON SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 XREF0 Primary ADC External Reference Select Bit.
Set by user to enable the Primary ADC to use the external reference via REFIN(+)/REFIN(–).
Cleared by user to enable the Primary ADC to use the internal bandgap reference (V
REF
= 1.25 V).
5 CH1 Primary ADC Channel Selection Bits.
4 CH0 Written by the user to select the differential input pairs used by the Primary ADC as follows:
CH1 CH0 Positive Input Negative Input
0 0 AIN1 AIN2
0 1 AIN3 AIN4
1 0 AIN2 AIN2 (Internal Short)
1 1 AIN3 AIN2
3 UNI0 Primary ADC Unipolar Bit.
Set by user to enable unipolar coding, i.e., zero differential input will result in 000000 hex output.
Cleared by user to enable bipolar coding, zero differential input will result in 800000 hex output.
2 RN2 Primary ADC Range Bits.
1 RN1 Written by the user to select the Primary ADC input range as follows:
0 RN0 RN2 RN1 RN0 Selected Primary ADC Input Range (V
REF
= 2.5 V)
000±20 mV
001±40 mV
010±80 mV
011±160 mV
100±320 mV
101±640 mV
110±1.28 V
111±2.56 V
Rev. B
ADuC816
–28–
ADC1CON (Auxiliary ADC Control Register)
Used to configure the Auxiliary ADC for channel selection, external Ref enable and unipolar or bipolar coding. It should be noted that the
Auxiliary ADC only operates on a fixed input range of ±V
REF
.
SFR Address D3H
Power-On Default Value 00H
Bit Addressable No
---1FERX1HCA0HCA1INU---------
Table VI. ADC1CON SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 XREF1 Auxiliary ADC External Reference Bit.
Set by user to enable the Auxiliary ADC to use the external reference via REFIN(+)/REFIN(–).
Cleared by user to enable the Auxiliary ADC to use the internal bandgap reference.
5 ACH1 Auxiliary ADC Channel Selection Bits.
4 ACH0 Written by the user to select the single-ended input pins used to drive the Auxiliary ADC as follows:
ACH1 ACH0 Positive Input Negative Input
0 0 AIN3 AGND
0 1 AIN4 AGND
1 0 Temp Sensor*AGND (Temp. Sensor routed to the ADC input)
1 1 AIN5 AGND
3 UNI1 Auxiliary ADC Unipolar Bit.
Set by user to enable unipolar coding, i.e., zero input will result in 0000 hex output.
Cleared by user to enable bipolar coding, zero input will result in 8000 hex output.
2 --- Reserved for Future Use.
1 --- Reserved for Future Use.
0 --- Reserved for Future Use.
*NOTES
1. When the temperature sensor is selected, user code must select internal reference via XREF1 bit above and clear the UNI1 bit (ADC1CON.3) to select bipolar coding.
2. The temperature sensor is factory calibrated to yield conversion results 8000H at 0 °C.
3. A +1°C change in temperature will result in a +1 LSB change in the ADC1H register ADC conversion result.
SF (Sinc Filter Register)
The number in this register sets the decimation factor and thus
the output update rate for the Primary and Auxiliary ADCs.
This SFR cannot be written by user software while either ADC is
active. The update rate applies to both Primary and Auxiliary
ADCs and is calculated as follows:
fSF f
ADC MOD
=· ·
1
3
1
8.
Where: f
ADC
= ADC Output Update Rate
f
MOD
= Modulator Clock Frequency = 32.768 kHz
SF = Decimal Value of SF Register
The allowable range for SF is 0Dhex to FFhex. Examples of SF
values and corresponding conversion update rate (f
ADC
) and con-
version time (t
ADC
) are shown in Table VII, the power-on default
value for the SF register is 45 hex, resulting in a default ADC
update rate of just under 20 Hz. Both ADC inputs are chopped
to minimize offset errors, which means that the settling time for
a single conversion or the time to a first conversion result in
continuous conversion mode is 2 × t
ADC
. As mentioned earlier,
all calibration cycles will be carried out automatically with a
maximum, i.e., FFhex, SF value to ensure optimum calibra-
tion performance. Once a calibration cycle has completed, the
value in the SF register will be that programmed by user software.
Table VII. SF SFR Bit Designations
SF(dec) SF(hex) f
ADC
(Hz) t
ADC
(ms)
13 0D 105.3 9.52
69 45 19.79 50.34
255 FF 5.35 186.77
Rev. B
ADuC816
–29–
ICON (Current Sources Control Register)
Used to control and configure the various excitation and burnout current source options available on-chip.
SFR Address D5H
Power-On Default Value 00H
Bit Addressable No
---OBCI1CDACI0CDANIP2INIP1INE2INE1I
Table VIII. ICON SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 BO Burnout Current Enable Bit.
Set by user to enable both transducer burnout current sources in the primary ADC signal paths.
Cleared by user to disable both transducer burnout current sources.
5 ADC1IC Auxiliary ADC Current Correction Bit.
Set by user to allow scaling of the Auxiliary ADC by an internal current source calibration word.
4 ADC0IC Primary ADC Current Correction Bit.
Set by user to allow scaling of the Primary ADC by an internal current source calibration word.
3 I2PIN*Current Source-2 Pin Select Bit.
Set by user to enable current source-2 (200 μA) to external Pin 3 (P1.2/DAC/IEXC1).
Cleared by user to enable current source-2 (200 μA) to external Pin 4 (P1.3/AIN5/IEXC2).
2 I1PIN*Current Source-1 Pin Select Bit.
Set by user to enable current source-1 (200 μA) to external Pin 4 (P1.3/AIN5/IEXC2).
Cleared by user to enable current source-1 (200 μA) to external Pin 3 (P1.2/DAC/IEXC1).
1 I2EN Current Source-2 Enable Bit.
Set by user to turn on excitation current source-2 (200 μA).
Cleared by user to turn off excitation current source-2 (200 μA).
0 I1EN Current Source-1 Enable Bit.
Set by user to turn on excitation current source-1 (200 μA).
Cleared by user to turn off excitation current source-1 (200 μA).
*Both current sources can be enabled to the same external pin, yielding a 400 μA current source.
ADC0H/ADC0M (Primary ADC Conversion Result Registers)
These two 8-bit registers hold the 16-bit conversion result from the Primary ADC.
SFR Address ADC0H High Data Byte DBH
ADC0M Middle Data Byte DAH
Power-On Default Value 00H Both Registers
Bit Addressable No Both Registers
ADC1H/ADC1L (Auxiliary ADC Conversion Result Registers)
These two 8-bit registers hold the 16-bit conversion result from the Auxiliary ADC.
SFR Address ADC1H High Data Byte DDH
ADC1L Low Data Byte DCH
Power-On Default Value 00H Both Registers
Bit Addressable No Both Registers
Rev. B
ADuC816
–30–
OF0H/OF0M (Primary ADC Offset Calibration Registers
1
)
These two 8-bit registers hold the 16-bit offset calibration coefficient for the Primary ADC. These registers are configured at power-
on with a factory default value of 8000Hex. However, these bytes will be automatically overwritten if an internal or system zero-scale
calibration is initiated by the user via MD2–0 bits in the ADCMODE register.
SFR Address OF0H Primary ADC Offset Coefficient High Byte E3H
OF0M Primary ADC Offset Coefficient Middle Byte E2H
Power-On Default Value 8000H OF0H and OF0M Respectively
Bit Addressable No Both Registers
OF1H/OF1L (Auxiliary ADC Offset Calibration Registers
1
)
These two 8-bit registers hold the 16-bit offset calibration coefficient for the Auxiliary ADC. These registers are configured at power-on
with a factory default value of 8000Hex. However, these bytes will be automatically overwritten if an internal or system zero-scale
calibration is initiated by the user via the MD2–0 bits in the ADCMODE register.
SFR Address OF1H Auxiliary ADC Offset Coefficient High Byte E5H
OF1L Auxiliary ADC Offset Coefficient Low Byte E4H
Power-On Default Value 8000H OF1H and OF1L Respectively
Bit Addressable No Both Registers
GN0H/GN0M (Primary ADC Gain Calibration Registers
1
)
These two 8-bit registers hold the 16-bit gain calibration coefficient for the Primary ADC. These registers are configured at power-on
with a factory-calculated internal full-scale calibration coefficient. Every device will have an individual coefficient. However, these
bytes will be automatically overwritten if an internal or system full-scale calibration is initiated by the user via MD2–0 bits in the
ADCMODE register.
SFR Address GN0H Primary ADC Gain Coefficient High Byte EBH
GN0M Primary ADC Gain Coefficient Middle Byte EAH
Power-On Default Value Configured at factory final test, see notes above.
Bit Addressable No Both Registers
GN1H/GN1L (Auxiliary ADC Gain Calibration Registers
1
)
These two 8-bit registers hold the 16-bit gain calibration coefficient for the Auxiliary ADC. These registers are configured at power-
on with a factory calculated internal full-scale calibration coefficient. Every device will have an individual coefficient. However, these
bytes will be automatically overwritten if an internal or system full-scale calibration is initiated by the user via MD2–0 bits in the
ADCMODE register.
SFR Address GN1H Auxiliary ADC Gain Coefficient High Byte EDH
GN1L Auxiliary ADC Gain Coefficient Low Byte ECH
Power-On Default Value Configured at factory final test, see notes above.
Bit Addressable No Both Registers
NOTE
1
These registers can be overwritten by user software only if Mode bits MD0–2 (ADCMODE SFR) are zero.
Rev. B
ADuC816
–31–
PRIMARY AND AUXILIARY ADC CIRCUIT DESCRIPTION
OVERVIEW
The ADuC816 incorporates two independent sigma-delta ADCs
(Primary and Auxiliary) with on-chip digital filtering intended
for the measurement of wide dynamic range, low frequency
signals such as those in weigh-scale, strain-gauge, pressure trans-
ducer or temperature measurement applications.
Primary ADC
This ADC is intended to convert the primary sensor input. The
input is buffered and can be programmed for one of 8 input ranges
from ±20 mV to ±2.56 V being driven from one of three differ-
ential input channel options AIN1/2, AIN3/4, or AIN3/2. The
input channel is internally buffered allowing the part to handle
significant source impedances on the analog input, allowing R/C
filtering (for noise rejection or RFI reduction) to be placed on
SIGMA-
DELTA
MODULATOR
PROGRAMMABLE
DIGITAL
FILTER
SIGMA-DELTA A/D CONVERTER
BUFFER
AGND
AVDD
REFIN(–) REFIN(+)
PROGRAMMABLE GAIN
AMPLIFIER
THE PROGRAMMABLE
GAIN AMPLIFIER ALLOWS
EIGHT UNIPOLAR AND
EIGHT BIPOLAR INPUT
RANGES FROM 20mV TO
2.56V (EXT VREF = +2.5V)
THE MODULATOR PROVIDES
A HIGH-FREQUENCY 1-BIT
DATA STREAM (THE OUTPUT
OF WHICH IS ALSO CHOPPED)
TO THE DIGITAL FILTER,
THE DUTY CYCLE OF WHICH
REPRESENTS THE SAMPLED
ANALOG INPUT VOLTAGE
SIGMA-DELTA
MODULATOR
CHOP
ANALOG INPUT CHOPPING
THE INPUTS ARE
ALTERNATELY REVERSED
THROUGH THE
CONVERSION CYCLE.
CHOPPING YIELDS
EXCELLENT ADC OFFSET
AND OFFSET DRIFT
PERFORMANCE
OUTPUT AVERAGE
AS PART OF THE CHOPPING
IMPLEMENTATION, EACH
DATA WORD OUTPUT
FROM THE FILTER IS
SUMMED AND AVERAGED
WITH ITS PREDECESSOR
TO NULL ADC CHANNEL
OFFSET ERRORS
AIN1
AIN2
AIN3
AIN4
BUFFER AMPLIFIER
THE BUFFER AMPLIFIER
PRESENTS A HIGH
IMPEDANCE INPUT STAGE
FOR THE ANALOG INPUTS,
ALLOWING SIGNIFICANT
EXTERNAL SOURCE
IMPEDANCES
BURNOUT CURRENTS
TWO 100nA BURNOUT
CURRENTS ALLOW THE
USER TO EASILY DETECT
IF A TRANSDUCER HAS
BURNED OUT OR GONE
OPEN-CIRCUIT
PROGRAMMABLE
DIGITAL FILTER
THE SINC3 FILTER REMOVES
QUANTIZATION NOISE INTRODUCED
BY THE MODULATOR. THE UPDATE
RATE AND BANDWIDTH OF THIS
FILTER ARE PROGRAMMABLE
VIA THE SF SFR
THE OUPUT WORD FROM THE
DIGITAL FILTER IS SCALED BY
THE CALIBRATION
COEFFICIENTS BEFORE
BEING PROVIDED AS
THE CONVERSION RESULT
OUTPUT SCALING
ANALOG MULTIPLEXER
A DIFFERENTIAL MULTIPLEXER
ALLOWS SELECTION OF THREE
FULLY DIFFERENTIAL PAIR OPTIONS AND
ADDITIONAL INTERNAL SHORT OPTION
(AIN2–AIN2).THE MULTIPLEXER IS
CONTROLLED VIA THE CHANNEL
SELECTION BITS IN ADC0CON
SIGMA-DELTA ADC
THE SIGMA-DELTA
ARCHITECTURE ENSURES
16 BITS NO MISSING
CODES. THE ENTIRE
SIGMA-DELTA ADC IS
CHOPPED TO REMOVE
DRIFT ERROR
OUTPUT
AVERAGE
OUTPUT
SCALING
DIGTAL OUTPUT
RESULT WRITTEN
TO ADC0H/M
SFRs
PGA
DIFFERENTIAL
REFERENCE
THE EXTERNAL REFERENCE
INPUT TO THE ADuC816 IS
DIFFERENTIAL AND
FACILITATES RATIOMETRIC
OPERATION. THE EXTERNAL
REFERENCE VOLTAGE IS
SELECTED VIA THE XREF0 BIT
IN ADC0CON.
REFERENCE DETECT
CIRCUITRY TESTS FOR OPEN OR
SHORTED REFERENCES INPUTS
CHOP
MUX
SEE PAGE 36
SEE PAGE 29 AND 34
SEE PAGE 34
SEE PAGE 35 SEE PAGE 35
SEE PAGE 36
SEE PAGE 37
SEE PAGE 35
SEE PAGE 35
SEE PAGE 33
SEE PAGES 27 AND 33
Figure 18. Primary ADC Block Diagram
the analog inputs if required. On-chip burnout currents can
also be turned on. These currents can be used to check that a
transducer on the selected channel is still operational before
attempting to take measurements.
The ADC employs a sigma-delta conversion technique to realize
up to 16 bits of no missing codes performance. The sigma-delta
modulator converts the sampled input signal into a digital pulse
train whose duty cycle contains the digital information. A Sinc3
programmable low-pass filter is then employed to decimate the
modulator output data stream to give a valid data conversion
result at programmable output rates from 5.35 Hz (186.77 ms)
to 105.03 Hz (9.52 ms). A Chopping scheme is also employed
to minimize ADC offset errors. A block diagram of the Primary
ADC is shown in Figure 18.
Rev. B
ADuC816
–32–
Auxiliary ADC
The Auxiliary ADC is intended to convert supplementary inputs
such as those from a cold junction diode or thermistor. This ADC
is not buffered and has a fixed input range of 0 V to 2.5 V
MU
X
AIN3
AIN4
AIN5
ON-CHIP
TEMPERATURE
SENSOR
SIGMA-
DELTA
MODULATOR
PROGRAMMABLE
DIGITAL FILTER
SIGMA-DELTA A/D CONVERTER
REFIN(–) REFIN(+)
CHOP
OUTPUT
AVERAGE
OUTPUT
SCALING
DIGTAL OUTPUT
RESULT WRITTEN
TO ADC1H/L SFRs
CHOP
DIFFERENTIAL REFERENCE
THE EXTERNAL REFERENCE INPUT TO
THE ADuC816 IS DIFFERENTIAL AND
FACILITATES RATIOMETRIC
OPERATION. THE EXTERNAL REFER-
ENCE VOLTAGE IS SELECTED VIA THE
XREF1 BIT IN ADC1CON. REFERENCE
DETECT CIRCUITRY TESTS FOR OPEN
OR SHORTED REFERENcES INPUTS
SEE PAGE 35
THE MODULATOR PROVIDES A
HIGH FREQUENCY 1-BIT DATA
STREAM (THE OUTPUT OF WHICH
IS ALSO CHOPPED) TO THE
DIGITAL FILTER,
THE DUTY CYCLE OF WHICH
REPRESENTS THE SAMPLED
ANALOG INPUT VOLTAGE
SIGMA-DELTA
MODULATOR
SEE PAGE 35
PROGRAMMABLE DIGITAL
FILTER
THE SINC3 FILTER REMOVES
QUANTIZATION NOISE INTRODUCED
BY THE MODULATOR. THE UPDATE
RATE AND BANDWIDTH OF THIS
FILTER ARE PROGRAMMABLE
VIA THE SF SFR
SEE PAGE 35
OUTPUT AVERAGE
AS PART OF THE CHOPPING
IMPLEMENTATION EACH
DATA WORD OUTPUT
FROM THE FILTER IS
SUMMED AND AVERAGED
WITH ITS PREDECESSOR
TO NULL ADC CHANNEL
OFFSET ERRORS
SEE PAGE 36
SIGMA-DELTA ADC
THE SIGMA-DELTA
ARCHITECTURE ENSURES
16 BITS NO MISSING
CODES. THE ENTIRE
SIGMA-DELTA ADC IS
CHOPPED TO REMOVE DRIFT
ERRORS
SEE PAGE 35
THE OUPUT WORD FROM THE
DIGITAL FILTER IS SCALED BY
THE CALIBRATION
COEFFICIENTS BEFORE
BEING PROVIDED AS
THE CONVERSION RESULT
OUTPUT SCALING
SEE PAGE 37
ANALOG INPUT CHOPPING
THE INPUTS ARE ALTERNATELY
REVERSED THROUGH THE
CONVERSION CYCLE. CHOPPING
YIELDS EXCELLENT ADC
OFFSET AND OFFSET DRIFT
PERFORMANCE
SEE PAGE 36
ANALOG MULTIPLEXER
A DIFFERENTIAL MULTIPLEXER
ALLOWS SELECTION OF THREE
EXTERNAL SINGLE ENDED INPUTS OR
THE ON-CHIP TEMP. SENSOR.
THE MULTIPLEXER IS CONTROLLED VIA
THE CHANNEL SELECTION
BITS IN ADC1CON
SEE PAGE 28 AND 33
MUX
Figure 19. Auxiliary ADC Block Diagram
(assuming an external 2.5 V reference). The single-ended inputs
can be driven from AIN3, AIN4 or AIN5 pins or directly from
the on-chip temperature sensor voltage. A block diagram of the
Auxiliary ADC is shown in Figure 19.
Rev. B
ADuC816
–33–
Table IX. Primary ADC, Typical Output RMS Noise (V)
Typical Output RMS Noise vs. Input Range and Update Rate; Output RMS Noise in V
SF Data Update Input Range
Word Rate (Hz) 20 mV 40 mV 80 mV 160 mV 320 mV 640 mV 1.28 V 2.56 V
13 105.3 1.50 1.50 1.60 1.75 3.50 4.50 6.70 11.75
69 19.79 0.60 0.65 0.65 0.65 0.65 0.95 1.40 2.30
255 5.35 0.35 0.35 0.37 0.37 0.37 0.51 0.82 1.25
Table X. Primary ADC, Peak-to-Peak Resolution (Bits)
Peak-to-Peak Resolution vs. Input Range and Update Rate; Peak-to-Peak Resolution in Bits
SF Data Update Input Range
Word Rate (Hz) 20 mV 40 mV 80 mV 160 mV 320 mV 640 mV 1.28 V 2.56 V
13 105.3 12 13 14 15 15 15.5 16 16
69 19.79 13 14 15 16 16
1
16
1
16
1
16
1
255 5.35 14 15 16 16
1
16
1
16
1
16
1
16
1
NOTE
1
Peak-to-peak resolution at these range/update rate settings is limited only by the number of bits available from the ADC. Effective resolution at these range/update
rate settings is greater than 16 bits as indicated by the rms noise table shown in Table IX.
Table XI. Auxiliary ADC
Typical Output RMS Noise vs. Update Rate
1
Output RMS Noise in V
SF Data Update Input Range
Word Rate (Hz) 2.5 V
13 105.3 10.75
69 19.79 2.00
255 5.35 1.15
NOTE
1
ADC converting in bipolar mode.
Peak-to-Peak Resolution vs. Update Rate
1
Peak-to-Peak Resolution in Bits
SF Data Update Input Range
Word Rate (Hz) 2.5 V
13 105.3 16
2
69 19.79 16
255 5.35 16
NOTES
1
ADC converting in bipolar mode.
2
In unipolar mode peak-to-peak resolution at 105 Hz is 15 bits.
Analog Input Channels
The primary ADC has four associated analog input pins (labelled
AIN1 to AIN4) which can be configured as two fully differential
input channels. Channel selection bits in the ADC0CON SFR
detailed in Table V allow three combinations of differential pair
selection as well as an additional shorted input option (AIN2–AIN2).
The auxiliary ADC has three external input pins (labelled AIN3
to AIN5) as well as an internal connection to the internal on-chip
temperature sensor. All inputs to the auxiliary ADC are single-
ended inputs referenced to the AGND on the part. Channel
selection bits in the ADC1CON SFR detailed previously in
Table VI allow selection of one of four inputs.
Two input multiplexers switch the selected input channel to the
on-chip buffer amplifier in the case of the primary ADC and
directly to the sigma-delta modulator input in the case of the
auxiliary ADC. When the analog input channel is switched, the
settling time of the part must elapse before a new valid word is
available from the ADC.
Primary and Auxiliary ADC Inputs
The output of the primary ADC multiplexer feeds into a high
impedance input stage of the buffer amplifier. As a result, the
primary ADC inputs can handle significant source impedances and
are tailored for direct connection to external resistive-type sensors
like strain gauges or Resistance Temperature Detectors (RTDs).
The auxiliary ADC, however, is unbuffered resulting in higher
analog input current on the auxiliary ADC. It should be noted that
this unbuffered input path provides a dynamic load to the driving
source. Therefore, resistor/capacitor combinations on the input
pins can cause dc gain errors depending on the output impedance
of the source that is driving the ADC inputs.
Analog Input Ranges
The absolute input voltage range on the primary ADC is restricted
to between AGND + 100 mV to AVDD – 100 mV. Care must be
taken in setting up the common-mode voltage and input voltage
range so that these limits are not exceeded, otherwise there will
be a degradation in linearity performance.
PRIMARY AND AUXILIARY ADC NOISE
PERFORMANCE
Tables IX, X and XI below show the output rms noise in μV
and output peak-to-peak resolution in bits (rounded to the
nearest 0.5 LSB) for some typical output update rates on both
the Primary and Auxiliary ADCs. The numbers are typical and
are generated at a differential input voltage of 0 V. The output
update rate is selected via the SF7–SF0 bits in the Sinc Filter
(SF) SFR. It is important to note that the peak-to-peak resolu-
tion figures represent the resolution for which there will be no
code flicker within a six-sigma limit.
Rev. B
ADuC816
–34–
The absolute input voltage range on the auxiliary ADC is restricted
to between AGND – 30 mV to AVDD + 30 mV. The slightly
negative absolute input voltage limit does allow the possibility of
monitoring small signal bipolar signals using the single-ended
auxiliary ADC front end.
Programmable Gain Amplifier
The output from the buffer on the primary ADC is applied to the
input of the on-chip programmable gain amplifier (PGA). The
PGA can be programmed through eight different unipolar input
ranges and bipolar ranges. The PGA gain range is programmed
via the range bits in the ADC0CON SFR. With the external refer-
ence select bit set in the ADC0CON SFR and an external 2.5 V
reference, the unipolar ranges are 0 mV to +20 mV, 0 mV to
40 mV, 0 mV to 80 mV, 0 mV to 160 mV, 0 mV to 320 mV,
0 mV to 640 mV and 0 V to 1.28 V and 0 to 2.56 V while the
bipolar ranges are ±20 mV, ±40 mV, ±80 mV, ±160 mV,
±320 mV, ±640 mV, ±1.28 V and ±2.56 V. These are the nominal
ranges that should appear at the input to the on-chip PGA. An
ADC range matching specification of 0.5 LSB (typ) across all
ranges means that calibration need only be carried out at a single
gain range and does not have to be repeated when the PGA
gain range is changed.
The auxiliary ADC does not incorporate a PGA and is configured
for a fixed single input range of 0 to V
REF
.
Bipolar/Unipolar Inputs
The analog inputs on the ADuC816 can accept either uni-
polar or bipolar input voltage ranges. Bipolar input ranges
do not imply that the part can handle negative voltages with
respect to system AGND.
Unipolar and bipolar signals on the AIN(+) input on the primary
ADC are referenced to the voltage on the respective AIN(–) input.
For example, if AIN(–) is 2.5 V and the primary ADC is config-
ured for an analog input range of 0 mV to +20 mV, the input
voltage range on the AIN(+) input is 2.5 V to 2.52 V. If AIN(–)
is 2.5 V and the ADuC816 is configured for an analog input range
of 1.28 V, the analog input range on the AIN(+) input is 1.22 V
to 3.78 V (i.e., 2.5 V ± 1.28 V).
As mentioned earlier, the auxiliary ADC input is a single-ended
input with respect to the system AGND. In this context a bipolar
signal on the auxiliary ADC can only span 30 mV negative
with respect to AGND before violating the voltage input limits
for this ADC.
Bipolar or unipolar options are chosen by programming the
Primary and Auxiliary Unipolar enable bits in the ADC0CON
and ADC1CON SFRs respectively. This programs the relevant
ADC for either unipolar or bipolar operation. Programming for
either unipolar or bipolar operation does not change any of the
input signal conditioning; it simply changes the data output coding
and the points on the transfer function where calibrations occur.
When an ADC is configured for unipolar operation, the output
coding is natural (straight) binary with a zero differential input
voltage resulting in a code of 000 . . . 000, a midscale voltage
resulting in a code of 100 . . . 000, and a full-scale input voltage
resulting in a code of 111 . . . 111. When an ADC is configured
for bipolar operation, the coding is offset binary with a negative
full-scale voltage resulting in a code of 000 . . . 000, a zero
differential voltage resulting in a code of 100 . . . 000, and a
positive full-scale voltage resulting in a code of 111 . . . 111.
Burnout Currents
The primary ADC on the ADuC816 contains two 100 nA con-
stant current generators, one sourcing current from AVDD to
AIN(+), and one sinking from AIN(–) to AGND. The currents
are switched to the selected analog input pair. Both currents are
either on or off, depending on the Burnout Current Enable
(BO) bit in the ICON SFR (see Table VIII). These currents can
be used to verify that an external transducer is still operational
before attempting to take measurements on that channel. Once
the burnout currents are turned on, they will flow in the exter-
nal transducer circuit, and a measurement of the input voltage
on the analog input channel can be taken. If the resultant volt-
age measured is full-scale, this indicates that the transducer has
gone open-circuit. If the voltage measured is 0 V, it indicates that
the transducer has short circuited. For normal operation, these
burnout currents are turned off by writing a 0 to the BO bit in
the ICON SFR. The current sources work over the normal abso-
lute input voltage range specifications.
Excitation Currents
The ADuC816 also contains two identical, 200 μA constant
current sources. Both source current from AVDD to Pin 3
(IEXC1) or Pin 4 (IEXC2) These current sources are con-
trolled via bits in the ICON SFR shown in Table VIII. They
can be configured to source 200 μA individually to both pins or
a combination of both currents, i.e., 400 μA to either of the
selected pins. These current sources can be used to excite exter-
nal resistive bridge or RTD sensors.
Reference Input
The ADuC816’s reference inputs, REFIN(+) and REFIN(–),
provide a differential reference input capability. The common-
mode range for these differential inputs is from AGND to AVDD.
The nominal reference voltage, VREF (REFIN(+) – REFIN(–)),
for specified operation is 2.5 V with the primary and auxil-
iary reference enable bits set in the respective ADC0CON
and/or ADC1CON SFRs.
The part is also functional (although not specified for perfor-
mance) when the XREF0 or XREF1 bits are “0,” which enables
the on-chip internal bandgap reference. In this mode, the ADCs
will see the internal reference of 1.25 V, therefore halving all
input ranges. As a result of using the internal reference volt-
age, a noticeable degradation in peak-to-peak resolution will
result. Therefore, for best performance, operation with an exter-
nal reference is strongly recommended.
In applications where the excitation (voltage or current) for the
transducer on the analog input also drives the reference voltage
for the part, the effect of the low-frequency noise in the excita-
tion source will be removed as the application is ratiometric. If the
ADuC816 is not used in a ratiometric application, a low noise
reference should be used. Recommended reference voltage sources
for the ADuC816 include the AD780, REF43, and REF192.
It should also be noted that the reference inputs provide a high
impedance, dynamic load. Because the input impedance of each
reference input is dynamic, resistor/capacitor combinations on
these inputs can cause dc gain errors depending on the output
impedance of the source that is driving the reference inputs.
Reference voltage sources, like those recommended above (e.g.,
AD780) will typically have low output impedances and therefore
decoupling capacitors on the REFIN(+) input would be recom-
Rev. B
ADuC816
–35–
mended. Deriving the reference input voltage across an external
resistor, as shown in Figure 52, will mean that the reference
input sees a significant external source impedance. External
decoupling on the REFIN(+) and REFIN(–) pins would not be
recommended in this type of circuit configuration.
Reference Detect
The ADuC816 includes on-chip circuitry to detect if the part has a
valid reference for conversions or calibrations. If the voltage
between the external REFIN(+) and REFIN(–) pins goes below
0.3 V or either the REFIN(+) or REFIN(–) inputs is open circuit,
the ADuC816 detects that it no longer has a valid reference. In
this case, the NOXREF bit of the ADCSTAT SFR is set to a 1. If
the ADuC816 is performing normal conversions and the NOXREF
bit becomes active, the conversion results revert to all 1s. Therefore,
it is not necessary to continuously monitor the status of the
NOXREF bit when performing conversions. It is only necessary
to verify its status if the conversion result read from the ADC Data
Register is all 1s.
If the ADuC816 is performing either an offset or gain calibration
and the NOXREF bit becomes active, the updating of the respec-
tive calibration registers is inhibited to avoid loading incorrect
coefficients to these registers, and the appropriate ERR0 or ERR1
bits in the ADCSTAT SFR are set. If the user is concerned
about verifying that a valid reference is in place every time a cali-
bration is performed, the status of the ERR0 or ERR1 bit should
be checked at the end of the calibration cycle.
Sigma-Delta Modulator
A sigma-delta ADC generally consists of two main blocks, an
analog modulator and a digital filter. In the case of the ADuC816
ADCs, the analog modulators consist of a difference amplifier,
an integrator block, a comparator, and a feedback DAC as illus-
trated in Figure 20.
DAC
INTEGRATOR
ANALOG
INPUT
DIFFERENCE
AMP COMPARATOR
HIGH-
FREQUENCY
BITSTREAM
TO DIGITAL
FILTER
Figure 20. Sigma-Delta Modulator Simplified Block Diagram
In operation, the analog signal sample is fed to the difference
amplifier along with the output of the feedback DAC. The differ-
ence between these two signals is integrated and fed to the
comparator. The output of the comparator provides the input to
the feedback DAC so the system functions as a negative feedback
loop that tries to minimize the difference signal. The digital data
that represents the analog input voltage is contained in the duty
cycle of the pulse train appearing at the output of the comparator.
This duty cycle data can be recovered as a data word using a
subsequent digital filter stage. The sampling frequency of
the modulator loop is many times higher than the bandwidth of
the input signal. The integrator in the modulator shapes the
quantization noise (which results from the analog-to-digital con-
version) so that the noise is pushed toward one-half of the
modulator frequency.
Digital Filter
The output of the sigma-delta modulator feeds directly into the
digital filter. The digital filter then band-limits the response to a
frequency significantly lower than one-half of the modulator
frequency. In this manner, the 1-bit output of the comparator
is translated into a band-limited, low noise output from the
ADuC816 ADCs.
The ADuC816 filter is a low-pass, Sinc
3
or (sinx/x)
3
filter whose
primary function is to remove the quantization noise introduced
at the modulator. The cutoff frequency and decimated output data
rate of the filter are programmable via the SF (Sinc Filter) SFR
as described in Table VII.
Figure 21 shows the frequency response of the ADC chan-
nel at the default SF word of 69 dec or 45 hex, yielding an
overall output update rate of just under 20 Hz.
It should be noted that this frequency response allows frequency
components higher than the ADC Nyquist frequency to pass
through the ADC, in some cases without significant attenuation.
These components may, therefore, be aliased and appear in-band
after the sampling process.
It should also be noted that rejection of mains-related frequency
components, i.e., 50 Hz and 60 Hz, is seen to be at level of
>65 dB at 50 Hz and >100 dB at 60 Hz. This confirms the
data sheet specifications for 50 Hz/60 Hz Normal Mode Rejec-
tion (NMR) at a 20 Hz update rate.
0 20 30 50 70 80 90 100 110
FREQUENCY – Hz
GAIN – dB
0
–20
–40
–70
–80
–90
–100
–110
–120 10 40 60
–10
–30
–60
–50
Figure 21. Filter Response, SF = 69 dec
The response of the filter, however, will change with SF word as
can be seen in Figure 22, which shows >90 dB NMR at 50 Hz
and >70 dB NMR at 60 Hz when SF = 255 dec.
0203050708090
100
FREQUENCY – Hz
GAIN – dB
0
–20
–40
–70
–80
–90
–100
–110
–120 10 40 60
–10
–30
–60
–50
Figure 22. Filter Response, SF = 255 dec
Rev. B
ADuC816
–36–
Figures 23 and 24 show the NMR for 50 Hz and 60 Hz across
the full range of SF word, i.e., SF = 13 dec to SF = 255 dec.
10 50 70 110 150 170 190 210
SF – Decimal
GAIN – dB
0
–20
–40
–70
–80
–90
–100
–110
–120 30 90 130
–10
–30
–60
–50
230 250
Figure 23. 50 Hz Normal Mode Rejection vs. SF
10 50 70 110 150 170 190 210
SF – Decimal
GAIN – dB
0
–20
–40
–70
–80
–90
–100
–110
–120 30 90 130
–10
–30
–60
–50
230 250
Figure 24. 60 Hz Normal Mode Rejection vs. SF
ADC Chopping
Both ADCs on the ADuC816 implement a chopping scheme
whereby the ADC repeatability reverses its inputs. The deci-
mated digital output words from the Sinc
3
filters therefore have a
positive offset and negative offset term included.
As a result, a final summing stage is included in each ADC so that
each output word from the filter is summed and averaged with the
previous filter output to produce a new valid output result to be
written to the ADC data SFRs. In this way, while the ADC
throughput or update rate is as discussed earlier and illustrated
in Table VII, the full settling time through the ADC (or the time
to a first conversion result), will actually be given by 2 × t
ADC
.
The chopping scheme incorporated in the ADuC816 ADC results
in excellent dc offset and offset drift specifications and is
extremely beneficial in applications where drift, noise rejection,
and optimum EMI rejection are important factors.
Calibration
The ADuC816 provides four calibration modes that can be pro-
grammed via the mode bits in the ADCMODE SFR detailed in
Table IV. In fact, every ADuC816 has already been factory
calibrated. The resultant Offset and Gain calibration coefficients
for both the primary and auxiliary ADCs are stored on-chip
in manufacturing-specific Flash/EE memory locations. At power-
on, these factory calibration coefficients are automatically
downloaded to the calibration registers in the ADuC816 SFR
space. Each ADC (primary and auxiliary) has dedicated calibration
SFRs, these have been described earlier as part of the general
ADC SFR description. However, the factory calibration values
in the ADC calibration SFRs will be overwritten if any one of
the four calibration options are initiated and that ADC is enabled
via the ADC enable bits in ADCMODE.
Even though an internal offset calibration mode is described
below, it should be recognized that both ADCs are chopped. This
chopping scheme inherently minimizes offset and means that an
internal offset calibration should never be required. Also, because
factory 5 V/25°C gain calibration coefficients are automatically
present at power-on, an internal full-scale calibration will only
be required if the part is being operated at 3 V or at temperatures
significantly different from 25°C.
The ADuC816 offers “internal” or “system” calibration facilities.
For full calibration to occur on the selected ADC, the calibration
logic must record the modulator output for two different input
conditions. These are “zero-scale” and “full-scale” points. These
points are derived by performing a conversion on the different
input voltages provided to the input of the modulator during
calibration. The result of the “zero-scale” calibration conversion
is stored in the Offset Calibration Registers for the appropri-
ate ADC. The result of the “full-scale” calibration conversion
is stored in the Gain Calibration Registers for the appropriate
ADC. With these readings, the calibration logic can calculate
the offset and the gain slope for the input-to-output transfer
function of the converter.
During an “internal” zero-scale or full-scale calibration, the
respective “zero” input and “full-scale” input are automatically
connected to the ADC input pins internally to the device. A
“system” calibration, however, expects the system zero-scale and
system full-scale voltages to be applied to the external ADC pins
before the calibration mode is initiated. In this way external ADC
errors are taken into account and minimized as a result of system
calibration. It should also be noted that to optimize calibration
accuracy, all ADuC816 ADC calibrations are carried out auto-
matically at the slowest update rate.
Internally in the ADuC816, the coefficients are normalized before
being used to scale the words coming out of the digital filter. The
offset calibration coefficient is subtracted from the result prior to
the multiplication by the gain coefficient. All ADuC816 ADC
specifications will only apply after a zero-scale and full-scale
calibration at the operating point (supply voltage/temperature)
of interest.
From an operational point of view, a calibration should be treated
like another ADC conversion. A zero-scale calibration (if required)
should always be carried out before a full-scale calibration. System
software should monitor the relevant ADC RDY0/1 bit in the
ADCSTAT SFR to determine end of calibration via a polling
sequence or interrupt driven routine.
Rev. B
ADuC816
–37–
NONVOLATILE FLASH/EE MEMORY
Flash/EE Memory Overview
The ADuC816 incorporates Flash/EE memory technology on-chip
to provide the user with nonvolatile, in-circuit reprogrammable,
code and data memory space.
Flash/EE memory is a relatively recent type of nonvolatile memory
technology and is based on a single transistor cell architecture.
This technology is basically an outgrowth of EPROM technology
and was developed through the late 1980s. Flash/EE memory takes
the flexible in-circuit reprogrammable features of EEPROM and
combines them with the space efficient/density features of EPROM
(see Figure 25).
Because Flash/EE technology is based on a single transistor cell
architecture, a Flash memory array, like EPROM, can be imple-
mented to achieve the space efficiencies or memory densities
required by a given design.
Like EEPROM, Flash memory can be programmed in-system at
a byte level, although it must first be erased; the erase being per-
formed in page blocks. Thus, Flash memory is often and more
correctly referred to as Flash/EE memory.
FLASH/EE MEMORY
TECHNOLOGY
SPACE EFFICIENT/
DENSITY
IN-CIRCUIT
REPROGRAMMABLE
EPROM
TECHNOLOGY
EEPROM
TECHNOLOGY
Figure 25. Flash/EE Memory Development
Overall, Flash/EE memory represents a step closer to the ideal
memory device that includes nonvolatility, in-circuit program-
mability, high density and low cost. Incorporated in the ADuC816,
Flash/EE memory technology allows the user to update program
code space in-circuit, without the need to replace one-time
programmable (OTP) devices at remote operating nodes.
Flash/EE Memory and the ADuC816
The ADuC816 provides two arrays of Flash/EE memory for user
applications. 8K bytes of Flash/EE Program space are provided
on-chip to facilitate code execution without any external discrete
ROM device requirements. The program memory can be pro-
grammed using conventional third party memory programmers.
This array can also be programmed in-circuit, using the serial
download mode provided.
A 640-Byte Flash/EE Data Memory space is also provided on-chip.
This may be used as a general-purpose nonvolatile scratchpad
area. User access to this area is via a group of six SFRs. This space
can be programmed at a byte level, although it must first be erased
in 4-byte pages.
ADuC816 Flash/EE Memory Reliability
The Flash/EE Program and Data Memory arrays on the ADuC816
are fully qualified for two key Flash/EE memory characteristics,
namely Flash/EE Memory Cycling Endurance and Flash/EE
Memory Data Retention.
Endurance quantifies the ability of the Flash/EE memory to be
cycled through many Program, Read, and Erase cycles. In real
terms, a single endurance cycle is composed of four independent,
sequential events. These events are defined as:
a. initial page erase sequence
b. read/verify sequence A single Flash/EE
c. byte program sequence Memory
d. second read/verify sequence Endurance Cycle
In reliability qualification, every byte in both the program and
data Flash/EE memory is cycled from 00 hex to FFhex until a
first fail is recorded signifying the endurance limit of the on-chip
Flash/EE memory.
As indicated in the specification pages of this data sheet, the
ADuC816 Flash/EE Memory Endurance qualification has been
carried out in accordance with JEDEC Specification A117 over
the industrial temperature range of –40°C, +25°C, and +85°C.
The results allow the specification of a minimum endurance figure
over supply and temperature of 100,000 cycles, with an endurance
figure of 700,000 cycles being typical of operation at 25°C.
Retention quantifies the ability of the Flash/EE memory to retain
its programmed data over time. Again, the ADuC816 has been
qualified in accordance with the formal JEDEC Retention Life-
time Specification (A117) at a specific junction temperature
(T
J
= 55°C). As part of this qualification procedure, the Flash/EE
memory is cycled to its specified endurance limit described above,
before data retention is characterized. This means that the Flash/
EE memory is guaranteed to retain its data for its full specified
retention lifetime every time the Flash/EE memory is repro-
grammed. It should also be noted that retention lifetime, based
on an activation energy of 0.6 eV, will derate with T
J
as shown
in Figure 26.
40 60 70 90
T
J
JUNCTION TEMPERATURE –
C
RETENTION – Years
250
200
150
100
50
050 80 110
300
100
ADI SPECIFICATION
100 YEARS MIN.
AT T
J
= 55C
Figure 26. Flash/EE Memory Data Retention
Rev. B
ADuC816
–38–
Using the Flash/EE Program Memory
The 8 Kbyte Flash/EE Program Memory array is mapped
into the lower 8 Kbytes of the 64 Kbytes program space
addressable by the ADuC816, and is used to hold user code
in typical applications.
The program memory Flash/EE memory arrays can be pro-
grammed in one of two modes, namely:
Serial Downloading (In-Circuit Programming)
As part of its factory boot code, the ADuC816 facilitates
serial code download via the standard UART serial port.
Serial download mode is automatically entered on power-up if
the external pin, PSEN, is pulled low through an external
resistor as shown in Figure 27. Once in this mode, the user can
download code to the program memory array while the device is
sited in its target application hardware. A PC serial download
executable is provided as part of the ADuC816 QuickStart devel-
opment system. The Serial Download protocol is detailed in a
MicroConverter Applications Note uC004 available from the ADI
MicroConverter Website at www.analog.com/microconverter.
PSEN
ADuC816
PULL PSEN LOW DURING RESET
TO CONFIGURE THE ADuC816
FOR SERIAL DOWNLOAD MODE
1k
Figure 27. Flash/EE Memory Serial Download Mode
Programming
Parallel Programming
The parallel programming mode is fully compatible with conven-
tional third party Flash or EEPROM device programmers. A
block diagram of the external pin configuration required to support
parallel programming is shown in Figure 28. In this mode, Ports 0,
1, and 2 operate as the external data and address bus interface,
ALE operates as the Write Enable strobe, and Port 3 is used as a
general configuration port that configures the device for various
program and erase operations during parallel programming.
The high voltage (12 V) supply required for Flash/EE program-
ming is generated using on-chip charge pumps to supply the high
voltage program lines.
V
DD
GND
P3
PSEN
RESET
P0
P1
P2
ALE
ADuC816
5V
PROGRAM MODE
(SEE TABLE XII)
GND
PROGRAM
DATA
(D0–D7)
PROGRAM
ADDRESS
(A0–A13)
(P2.0 = A0)
(P1.7 = A13)
WRITE ENABLE
STROBE
COMMAND
ENABLE P3.0
NEGATIVE
EDGE P3.6
ENTRY
SEQUENCE
V
DD
Figure 28. Flash/EE Memory Parallel Programming
Table XII. Flash/EE Memory Parallel Programming Modes
Port 3 Pins Programming
0.7 0.6 0.5 0.4 0.3 0.2 0.1 Mode
XXXX000Erase Flash/EE
Program, Data, and
Security Modes
XXXX001Read Device
Signature/ID
XXX1010Program Code Byte
XXX0010Program Data Byte
XXX1011Read Code Byte
XXX0011Read Data Byte
XXXX100Program Security
Modes
XXXX101Read/Verify Security
Modes
All Other Codes Redundant
Flash/EE Program Memory Security
The ADuC816 facilitates three modes of Flash/EE program
memory security. These modes can be independently activated,
restricting access to the internal code space. These security
modes can be enabled as part of the user interface available on all
ADuC816 serial or parallel programming tools referenced on the
MicroConverter web page at www.analog.com/microconverter.
The security modes available on the ADuC816 are described
as follows:
Lock Mode
This mode locks code in memory, disabling parallel program-
ming of the program memory although reading the memory in
parallel mode is still allowed. This mode is deactivated by initi-
ating a “code-erase” command in serial download or parallel
programming modes.
Secure Mode
This mode locks code in memory, disabling parallel programming
(program and verify/read commands) as well as disabling the
execution of a “MOVC” instruction from external memory,
which is attempting to read the op codes from internal memory.
This mode is deactivated by initiating a “code-erase” command
in serial download or parallel programming modes.
Rev. B
ADuC816
–39–
Serial Safe Mode
This mode disables serial download capability on the device. If
Serial Safe mode is activated and an attempt is made to reset
the part into serial download mode, i.e., RESET asserted and
deasserted with PSEN low, the part will interpret the serial
download reset as a normal reset only. It will, therefore, not
enter serial download mode but only execute a normal reset
sequence. Serial Safe mode can only be disabled by initiating a
code-erase command in parallel programming mode.
Using the Flash/EE Data Memory
The user Flash/EE data memory array consists of 640 bytes that
are configured into 160 (00H to 9FH) 4-byte pages as shown in
Figure 29.
9FH BYTE 1 BYTE 2 BYTE 3 BYTE 4
00H BYTE 1 BYTE 2 BYTE 3 BYTE 4
Figure 29. Flash/EE Data Memory Configuration
As with other ADuC816 user-peripheral circuits, the interface to
this memory space is via a group of registers mapped in the SFR
space. A group of four data registers (EDATA1–4) are used to
hold 4-byte page data just accessed. EADRL is used to hold the
8-bit address of the page to be accessed. Finally, ECON is an 8-
bit control register that may be written with one of five Flash/EE
memory access commands to trigger various read, write, erase, and
verify functions. These registers can be summarized as follows:
ECON: SFR Address: B9H
Function: Controls access to 640 Bytes
Flash/EE Data Space.
Default: 00H
EADRL: SFR Address: C6H
Function: Holds the Flash/EE Data Page
Address. (640 Bytes => 160 Page
Addresses.)
Default: 00H
EDATA 1–4:
SFR Address: BCH to BFH respectively
Function: Holds Flash/EE Data memory
page write or page read data bytes.
Default : EDATA1–2 –> 00H
EDATA3–4 –> 00H
A block diagram of the SFR interface to the Flash/EE Data
Memory array is shown in Figure 30.
9FH BYTE 1 BYTE 2 BYTE 3 BYTE 4
00H
EDATA1 (BYTE 1)
EDATA2 (BYTE 2)
EDATA3 (BYTE 3)
EDATA4 (BYTE 4)
EADRL
ECON COMMAND
INTERPRETER LOGIC
ECON
BYTE 1 BYTE 2 BYTE 3 BYTE 4
FUNCTION:
RECEIVES COMMAND DATA
FUNCTION:
HOLDS THE 8-BIT PAGE
ADDRESS POINTER
FUNCTION:
INTERPRETS THE FLASH
COMMAND WORD
FUNCTION:
HOLDS THE 4-BYTE
PAGE DATA
Figure 30. Flash/EE Data Memory Control and Configuration
ECON—Flash/EE Memory Control SFR
This SFR acts as a command interpreter and may be written with
one of five command modes to enable various read, program and
erase cycles as detailed in Table XIII:
Table XIII. ECON–Flash/EE Memory Control Register
Command Modes
Command
Byte Command Mode
01H READ COMMAND.
Results in four bytes being read into EDATA1–4
from memory page address contained in EADRL.
02H PROGRAM COMMAND.
Results in four bytes (EDATA1–4) being written
to memory page address in EADRL. This write
command assumes the designated “write” page has
been pre-erased.
03H RESERVED FOR INTERNAL USE.
03H should not be written to the ECON SFR.
04H VERIFY COMMAND.
Allows the user to verify if data in EDATA1–4 is
contained in page address designated by EADRL.
A subsequent read of the ECON SFR will result
in a “zero” being read if the verification is valid,
a nonzero value will be read to indicate an invalid
verification.
05H ERASE COMMAND.
Results in an erase of the 4-byte page designated
in EADRL.
06H ERASE-ALL COMMAND.
Results in erase of the full Flash/EE Data memory
160-page (640 bytes) array.
07H to FFH RESERVED COMMANDS.
Commands reserved for future use.
Rev. B
ADuC816
–40–
Flash/EE Memory Timing
The typical program/erase times for the Flash/EE Data
Memory are:
Erase Full Array (640 Bytes) – 2 ms
Erase Single Page (4 Bytes) – 2 ms
Program Page (4 Bytes) – 250 μs
Read Page (4 Bytes) – Within Single Instruction Cycle
Using the Flash/EE Memory Interface
As with all Flash/EE memory architectures, the array can be pro-
grammed in-system at a byte level, although it must be erased
first; the erasure being performed in page blocks (4-byte pages
in this case).
A typical access to the Flash/EE Data array will involve setting
up the page address to be accessed in the EADRL SFR, config-
uring the EDATA1–4 with data to be programmed to the array
(the EDATA SFRs will not be written for read accesses) and
finally, writing the ECON command word which initiates one
of the six modes shown in Table XIII.
It should be noted that a given mode of operation is initiated as
soon as the command word is written to the ECON SFR. The
core microcontroller operation on the ADuC816 is idled until the
requested Program/Read or Erase mode is completed.
In practice, this means that even though the Flash/EE memory
mode of operation is typically initiated with a two-machine cycle
MOV instruction (to write to the ECON SFR), the next instruc-
tion will not be executed until the Flash/EE operation is complete
(250 μs or 2 ms later). This means that the core will not respond
to Interrupt requests until the Flash/EE operation is complete,
although the core peripheral functions like Counter/Timers will
continue to count and time as configured throughout this period.
Erase-All
Although the 640-byte User Flash/EE array is shipped from the
factory pre-erased, i.e., Byte locations set to FFH, it is nonethe-
less good programming practice to include an erase-all routine as
part of any configuration/setup code running on the ADuC816.
An “ERASE-ALL” command consists of writing “06H” to the
ECON SFR, which initiates an erase of all 640 byte locations in
the Flash/EE array. This command coded in 8051 assembly would
appear as:
MOV ECON, #06H ; Erase all Command
; 2 ms Duration
Program a Byte
In general terms, a byte in the Flash/EE array can only be pro-
grammed if it has previously been erased. To be more specific, a
byte can only be programmed if it already holds the value FFH.
Because of the Flash/EE architecture, this erasure must happen
at a page level; therefore, a minimum of four bytes (1 page) will
be erased when an erase command is initiated.
A more specific example of the Program-Byte process is shown
below. In this example the user writes F3H into the second
byte on Page 03H of the Flash/EE Data Memory space while
preserving the other three bytes already in this page. As the user
is only required to modify one of the page bytes, the full page must
be first read so that this page can then be erased without the exist-
ing data being lost.
This example, coded in 8051 assembly, would appear as:
MOV EADRL,#03H ; Set Page Address Pointer
MOV ECON,#01H ; Read Page
MOV EDATA2,#0F3H ; Write New Byte
MOV ECON,#05H ; Erase Page
MOV ECON,#02H ; Write Page (Program Flash/EE)
Rev. B
ADuC816
–41–
USER INTERFACE TO OTHER ON-CHIP ADuC816
PERIPHERALS
The following section gives a brief overview of the various
peripherals also available on-chip. A summary of the SFRs used
to control and configure these peripherals is also given.
DAC
The ADuC816 incorporates a 12-bit, voltage output DAC
on-chip. It has a rail-to-rail voltage output buffer capable of
driving 10 kΩ/100 pF. It has two selectable ranges, 0 V to V
REF
(the internal bandgap 2.5 V reference) and 0 V to AV
DD
. It can
operate in 12-bit or 8-bit mode. The DAC has a control regis-
ter, DACCON, and two data registers, DACH/L. The DAC
output can be programmed to appear at Pin 3 or Pin 12. It
should be noted that in 12-bit mode, the DAC voltage output
will be updated as soon as the DACL data SFR has been writ-
ten; therefore, the DAC data registers should be updated as
DACH first followed by DACL.5
DACCON DAC Control Register
SFR Address FDH
Power-On Default Value 00H
Bit Addressable No
---------NIPCAD8CADNRCAD RLCCAD NECAD
Table XIV. DACCON SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 --- Reserved for Future Use.
5 --- Reserved for Future Use.
4 DACPIN DAC Output Pin Select.
Set by the user to direct the DAC output to Pin 12 (P1.7/AIN4/DAC).
Cleared by user to direct the DAC output to Pin 3 (P1.2/DAC/IEXC1).
3 DAC8 DAC 8-bit Mode Bit.
Set by user to enable 8-bit DAC operation. In this mode the 8-bits in DACL SFR are routed to
the 8 MSBs of the DAC and the 4 LSBs of the DAC are set to zero.
Cleared by user to operate the DAC in its normal 12-bit mode of operation.
2 DACRN DAC Output Range Bit.
Set by user to configure DAC range of 0 – AV
DD
.
Cleared by user to configure DAC range of 0 – 2.5 V.
1DACCLR DAC Clear Bit.
Set to “1” by user to enable normal DAC operation.
Cleared to “0” by user to reset DAC data registers DACl/H to zero.
0 DACEN DAC Enable Bit.
Set to “1” by user to enable normal DAC operation.
Cleared to “0” by user to power-down the DAC.
DACH/L DAC Data Registers
Function DAC Data Registers, written by user to update the DAC output.
SFR Address DACL (DAC Data Low Byte) –>FBH
DACH (DAC Data High Byte) –>FCH
Power-On Default Value 00H –>Both Registers
Bit Addressable No –>Both Registers
The 12-bit DAC data should be written into DACH/L right-justified such that DACL contains the lower eight bits, and the lower
nibble of DACH contains the upper four bits.
Rev. B
ADuC816
–42–
On-Chip PLL
The ADuC816 is intended for use with a 32.768 kHz watch crys-
tal. A PLL locks onto a multiple (384) of this to provide a stable
12.582912 MHz clock for the system. The core can operate at
this frequency or at binary submultiples of it to allow power
saving in cases where maximum core performance is not
required. The default core clock is the PLL clock divided by
8 or 1.572864 MHz. The ADC clocks are also derived from the
PLL clock, with the modulator rate being the same as the crystal
oscillator frequency. The above choice of frequencies ensures
that the modulators and the core will be synchronous, regardless
of the core clock rate. The PLL control register is PLLCON.
PLLCON PLL Control Register
SFR Address D7H
Power-On Default Value 03H
Bit Addressable No
DP_CSOKCOL--- AETL TNIF2DC1DC0DC
Table XV. PLLCON SFR Bit Designations
Bit Name Description
7 OSC_PD Oscillator Power-Down Bit.
Set by user to halt the 32 kHz oscillator in power-down mode.
Cleared by user to enable the 32 kHz oscillator in power-down mode.
This feature allows the TIC to continue counting even in power-down mode.
6 LOCK PLL Lock Bit.
This is a read only bit.
Set automatically at power-on to indicate the PLL loop is correctly tracking the crystal clock. If the
external crystal becomes subsequently disconnected the PLL will rail and the core will halt.
Cleared automatically at power-on to indicate the PLL is not correctly tracking the crystal clock.
This may be due to the absence of a crystal clock or an external crystal at power-on. In this mode,
the PLL output can be 12.58 MHz ± 20%.
5 --- Reserved for future use; should be written with “0.”
4LTEA Reading this bit returns the state of the external EA pin latched at reset or power-on.
3 FINT Fast Interrupt Response Bit.
Set by user enabling the response to any interrupt to be executed at the fastest core clock frequency,
regardless of the configuration of the CD2–0 bits (see below). Once user code has returned from an
interrupt, the core resumes code execution at the core clock selected by the CD2–0 bits.
Cleared by user to disable the fast interrupt response feature.
2 CD2 CPU (Core Clock) Divider Bits.
1 CD1 This number determines the frequency at which the microcontroller core will operate.
0 CD0 CD2 CD1 CD0 Core Clock Frequency (MHz)
0 0 0 12.582912
0 0 1 6.291456
0 1 0 3.145728
0 1 1 1.572864 (Default Core Clock Frequency)
1 0 0 0.786432
1 0 1 0.393216
1 1 0 0.196608
1 1 1 0.098304
Rev. B
ADuC816
–43–
Time Interval Counter (TIC)
A time interval counter is provided on-chip for counting longer
intervals than the standard 8051-compatible timers are capable
of. The TIC is capable of timeout intervals ranging from 1/128th
second to 255 hours. Furthermore, this counter is clocked by
the crystal oscillator rather than the PLL and thus has the
ability to remain active in power-down mode and time long
power-down intervals. This has obvious applications for remote
battery-powered sensors where regular widely spaced readings
are required.
Six SFRs are associated with the time interval counter, TIMECON
being its control register. Depending on the configuration of the
IT0 and IT1 bits in TIMECON, the selected time counter register
overflow will clock the interval counter. When this counter is equal
to the time interval value loaded in the INTVAL SFR, the TII
bit (TIMECON.2) is set and generates an interrupt if enabled
(See IEIP2 SFR description under Interrupt System later in this
data sheet.) If the ADuC816 is in power-down mode, again
with TIC interrupt enabled, the TII bit will wake up the device
and resume code execution by vectoring directly to the TIC
interrupt service vector address at 0053 hex. The TIC-related
SFRs are described in Table XVI. Note also that the timebase
SFRs can be written initially with the current time, the TIC can
then be controlled and accessed by user software. In effect, this
facilitates the implementation of a real-time clock. A block
diagram of the TIC is shown in Figure 31.
8-BIT
PRESCALER
HUNDREDTHS COUNTER
HTHSEC
SECOND COUNTER
SEC
MINUTE COUNTER
MIN
HOUR COUNTER
HOUR
TIEN
INTERVAL TIMEOUT
TIME INTERVAL COUNTER
INTERRUPT
8-BIT
INTERVAL COUNTER
TIME INTERVAL
INTVAL
INTERVAL
TIMEBASE
SELECTION
MUX
TCEN 32.768kHz EXTERNAL CRYSTAL
ITS0, 1
COMPARE
COUNT = INTVAL?
Figure 31. TIC, Simplified Block Diagram
Rev. B
ADuC816
–44–
TIMECON TIC CONTROL REGISTER
SFR Address A1H
Power-On Default Value 00H
Bit Addressable No
------1STI0STIITSIITNEITNECT
Table XVI. TIMECON SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 --- Reserved for Future Use. For future product code compatibility this bit should be written as a ‘1.’
5 ITS1 Interval Timebase Selection Bits.
4 ITS0 Written by user to determine the interval counter update rate.
ITS1 ITS0 Interval Timebase
0 0 1/128 Second
0 1 Seconds
1 0 Minutes
1 1 Hours
3 STI Single Time Interval Bit.
Set by user to generate a single interval timeout. If set, a timeout will clear the TIEN bit.
Cleared by user to allow the interval counter to be automatically reloaded and start counting again at
each interval timeout.
2 TII TIC Interrupt Bit.
Set when the 8-bit Interval Counter matches the value in the INTVAL SFR.
Cleared by user software.
1 TIEN Time Interval Enable Bit.
Set by user to enable the 8-bit time interval counter.
Cleared by user to disable and clear the contents of the interval counter.
0 TCEN Time Clock Enable Bit.
Set by user to enable the time clock to the time interval counters.
Cleared by user to disable the clock to the time interval counters and clear the time interval SFRs.
The time registers (HTHSEC, SEC, MIN and HOUR) can be written while TCEN is low.
Rev. B
ADuC816
–45–
INTVAL User Time Interval Select Register
Function User code writes the required time interval to this register. When the 8-bit interval counter is equal
to the time interval value loaded in the INTVAL SFR, the TII bit (TIMECON.2) bit is set and
generates an interrupt if enabled. (See IEIP2 SFR description under Interrupt System later in this
data sheet.)
SFR Address A6H
Power-On Default Value 00H
Bit Addressable No
Valid Value 0 to 255 decimal
HTHSEC Hundredths Seconds Time Register
Function This register is incremented in (1/128) second intervals once TCEN in TIMECON is active. The
HTHSEC SFR counts from 0 to 127 before rolling over to increment the SEC time register.
SFR Address A2H
Power-On Default Value 00H
Bit Addressable No
Valid Value 0 to 127 decimal
SEC Seconds Time Register
Function This register is incremented in 1-second intervals once TCEN in TIMECON is active. The SEC
SFR counts from 0 to 59 before rolling over to increment the MIN time register.
SFR Address A3H
Power-On Default Value 00H
Bit Addressable No
Valid Value 0 to 59 decimal
MIN Minutes Time Register
Function This register is incremented in 1-minute intervals once TCEN in TIMECON is active. The MIN
counts from 0 to 59 before rolling over to increment the HOUR time register.
SFR Address A4H
Power-On Default Value 00H
Bit Addressable No
Valid Value 0 to 59 decimal
HOUR Hours Time Register
Function This register is incremented in 1-hour intervals once TCEN in TIMECON is active. The HOUR
SFR counts from 0 to 23 before rolling over to 0.
SFR Address A5H
Power-On Default Value 00H
Bit Addressable No
Valid Value 0 to 23 decimal
Rev. B
ADuC816
–46–
WDCON Watchdog Timer Control Register
SFR Address C0H
Power-On Default Value 10H
Bit Addressable Yes
3ERP2ERP1ERP0ERPRIDWSDWEDWRWDW
Table XVII. WDCON SFR Bit Designations
Bit Name Description
7 PRE3 Watchdog Timer Prescale Bits.
6 PRE2 The Watchdog timeout period is given by the equation: t
WD
= (2
PRE
× (2
9
/f
PLL
))
5 PRE1 (0 ≤ PRE ≤ 7; f
PLL
= 32.768 kHz)
4 PRE0 PRE3 PRE2 PRE1 PRE0Timout Period (ms) Action
0 0 0 0 15.6 Reset or Interrupt
0 0 0 1 31.2 Reset or Interrupt
0 0 1 0 62.5 Reset or Interrupt
0 0 1 1 125 Reset or Interrupt
0 1 0 0 250 Reset or Interrupt
0 1 0 1 500 Reset or Interrupt
0 1 1 0 1000 Reset or Interrupt
0 1 1 1 2000 Reset or Interrupt
1 0 0 0 0.0 Immediate Reset
PRE3–0 > 1001 Reserved
3 WDIR Watchdog Interrupt Response Enable Bit.
If this bit is set by the user, the watchdog will generate an interrupt response instead of a system
reset when the watchdog timeout period has expired. This interrupt is not disabled by the CLR
EA instruction and it is also a fixed, high-priority interrupt. If the watchdog is not being used to
monitor the system, it can alternatively be used as a timer. The prescaler is used to set the timeout
period in which an interrupt will be generated. (See also Note 1, Table XXXIV in the Interrupt
System section.)
2 WDS Watchdog Status Bit.
Set by the Watchdog Controller to indicate that a watchdog timeout has occurred.
Cleared by writing a “0” or by an external hardware reset. It is not cleared by a watchdog reset.
1 WDE Watchdog Enable Bit.
Set by user to enable the watchdog and clear its counters. If this bit is not set by the user within
the watchdog timeout period, the watchdog will generate a reset or interrupt, depending on WDIR.
Cleared under the following conditions, User writes “0,” Watchdog Reset (WDIR = “0”);
Hardware Reset; PSM Interrupt.
0 WDWR Watchdog Write Enable Bit.
To write data into the WDCON SFR involves a double instruction sequence. The WDWR bit must
be set and the very next instruction must be a write instruction to the WDCON SFR.
e.g., CLR EA ; disable interrupts while writing
to WDT
SETB WDWR ; allow write to WDCON
MOV WDCON, #72h ; enable WDT for 2.0s timeout
SET B EA ; enable interrupts again (if rqd)
Watchdog Timer
The purpose of the watchdog timer is to generate a device reset or
interrupt within a reasonable amount of time if the ADuC816
enters an erroneous state, possibly due to a programming error,
electrical noise, or RFI. The Watchdog function can be disabled by
clearing the WDE (Watchdog Enable) bit in the Watchdog Control
(WDCON) SFR. When enabled; the watchdog circuit will generate
a system reset or interrupt (WDS) if the user program fails to set
the watchdog (WDE) bit within a predetermined amount of time
(see PRE3–0 bits in WDCON). The watchdog timer itself is a
16-bit counter that is clocked at 32.768 kHz. The watchdog
time-out interval can be adjusted via the PRE3–0 bits in WDCON.
Full Control and Status of the watchdog timer function can be
controlled via the watchdog timer control SFR (WDCON). The
WDCON SFR can only be written by user software if the double
write sequence described in WDWR below is initiated on every
write access to the WDCON SFR.
Rev. B
ADuC816
–47–
Power Supply Monitor
As its name suggests, the Power Supply Monitor, once enabled,
monitors both supplies (AVDD or DVDD) on the ADuC816. It
will indicate when any of the supply pins drop below one of
four user-selectable voltage trip points from 2.63 V to 4.63 V.
For correct operation of the Power Supply Monitor function,
AV
DD
must be equal to or greater than 2.7 V. Monitor function
is controlled via the PSMCON SFR. If enabled via the IEIP2
SFR, the monitor will interrupt the core using the PSMI bit in the
PSMCON SFR. This bit will not be cleared until the failing
power supply has returned above the trip point for at least
250 ms. This monitor function allows the user to save working
registers to avoid possible data loss due to the low supply condi-
tion, and also ensures that normal code execution will not
resume until a safe supply level has been well established. The
supply monitor is also protected against spurious glitches trig-
gering the interrupt circuit.
PSMCON Power Supply Monitor Control Register
SFR Address DFH
Power-On Default Value DEH
Bit Addressable No
DPMCAPMCIMSP1DPT0DPT1APT0APTNEMSP
Table XVIII. PSMCON SFR Bit Designations
Bit Name Description
7 CMPD DVDD Comparator Bit.
This is a read-only bit and directly reflects the state of the DVDD comparator.
Read “1” indicates the DVDD supply is above its selected trip point.
Read “0” indicates the DVDD supply is below its selected trip point.
6 CMPA AVDD Comparator Bit.
This is a read-only bit and directly reflects the state of the AVDD comparator.
Read “1” indicates the AVDD supply is above its selected trip point.
Read “0” indicates the AVDD supply is below its selected trip point.
5 PSMI Power Supply Monitor Interrupt Bit.
This bit will be set high by the MicroConverter if either CMPA or CMPD are low, indicating
low analog or digital supply. The PSMI bit can be used to interrupt the processor. Once CMPD
and/or CMPA return (and remain) high, a 250 ms counter is started. When this counter times
out, the PSMI interrupt is cleared. PSMI can also be written by the user. However, if either com-
parator output is low, it is not possible for the user to clear PSMI.
4 TPD1 DVDD Trip Point Selection Bits.
3 TPD0 These bits select the DVDD trip-point voltage as follows:
TPD1 TPD0 Selected DVDD Trip Point (V)
0 0 4.63
0 1 3.08
1 0 2.93
1 1 2.63
2 TPA1 AVDD Trip Point Selection Bits.
1 TPA0 These bits select the AVDD trip-point voltage as follows:
TPA1 TPA0 Selected AVDD Trip Point (V)
0 0 4.63
0 1 3.08
1 0 2.93
1 1 2.63
0 PSMEN Power Supply Monitor Enable Bit.
Set to “1” by the user to enable the Power Supply Monitor Circuit.
Cleared to “0” by the user to disable the Power Supply Monitor Circuit.
Rev. B
ADuC816
–48–
SERIAL PERIPHERAL INTERFACE
The ADuC816 integrates a complete hardware Serial Peripheral
Interface (SPI) interface on-chip. SPI is an industry standard syn-
chronous serial interface that allows eight bits of data to be
synchronously transmitted and received simultaneously, i.e., full
duplex. It should be noted that the SPI physical interface is shared
with the I
2
C interface and therefore the user can only enable one
or the other interface at any given time (see SPE in SPICON
below). The system can be configured for Master or Slave opera-
tion and typically consists of four pins, namely:
MISO (Master In, Slave Out Data I/O Pin), Pin 14
The MISO (master in slave out) pin is configured as an input line
in master mode and an output line in slave mode. The MISO
line on the master (data in) should be connected to the MISO
line in the slave device (data out). The data is transferred as
byte wide (8-bit) serial data, MSB first.
MOSI (Master Out, Slave In Pin), Pin 27
The MOSI (master out slave in) pin is configured as an output line
in master mode and an input line in slave mode. The MOSI
line on the master (data out) should be connected to the MOSI
line in the slave device (data in). The data is transferred as byte
wide (8-bit) serial data, MSB first.
SCLOCK (Serial Clock I/O Pin), Pin 26
The master clock (SCLOCK) is used to synchronize the data
being transmitted and received through the MOSI and MISO
data lines. A single data bit is transmitted and received in
each SCLOCK period. Therefore, a byte is transmitted/received
after eight SCLOCK periods. The SCLOCK pin is configured
as an output in master mode and as an input in slave mode. In
master mode the bit-rate, polarity and phase of the clock are
controlled by the CPOL, CPHA, SPR0 and SPR1 bits in the
SPICON SFR (see Table XIX below). In slave mode the
SPICON register will have to be configured with the phase and
polarity (CPHA and CPOL) of the expected input clock. In
both master and slave mode the data is transmitted on one edge
of the SCLOCK signal and sampled on the other. It is important
therefore that the CPHA and CPOL are configured the same for the
master and slave devices.
SS (Slave Select Input Pin), Pin 13
The Slave Select (SS) input pin is only used when the ADuC816
is configured in slave mode to enable the SPI peripheral. This line
is active low. Data is only received or transmitted in slave mode
when the SS pin is low, allowing the ADuC816 to be used in single
master, multislave SPI configurations. If CPHA = 1 then the SS
input may be permanently pulled low. With CPHA = 0 then the
SS input must be driven low before the first bit in a byte wide
transmission or reception and return high again after the last bit
in that byte wide transmission or reception. In SPI Slave Mode,
the logic level on the external SS pin (Pin 13), can be read via
the SPR0 bit in the SPICON SFR.
The following SFR registers are used to control the SPI interface.
SPICON: SPI Control Register
SFR Address F8H
Power-On Default Value 04H
Bit Addressable Yes
IPSILOCWEPSMIPSLOPCAHPC1RPS0RPS
Table XIX. SPICON SFR Bit Designations
Bit Name Description
7 ISPI SPI Interrupt Bit.
Set by MicroConverter at the end of each SPI transfer.
Cleared directly by user code or indirectly by reading the SPIDAT SFR
6 WCOL Write Collision Error Bit.
Set by MicroConverter if SPIDAT is written to while an SPI transfer is in progress.
Cleared by user code.
5 SPE SPI Interface Enable Bit.
Set by user to enable the SPI interface.
Cleared by user to enable the I
2
C interface.
4 SPIM SPI Master/Slave Mode Select Bit.
Set by user to enable Master Mode operation (SCLOCK is an output).
Cleared by user to enable Slave Mode operation (SCLOCK is an input).
3 CPOL Clock Polarity Select Bit.
Set by user if SCLOCK idles high.
Cleared by user if SCLOCK idles low.
2 CPHA Clock Phase Select Bit.
Set by user if leading SCLOCK edge is to transmit data.
Cleared by user if trailing SCLOCK edge is to transmit data.
Rev. B
ADuC816
–49–
Table XIX. SPICON SFR Bit Designations (continued)
Bit Name Description
1 SPR1 SPI Bit-Rate Select Bits.
0 SPR0 These bits select the SCLOCK rate (bit-rate) in Master Mode as follows:
SPR1 SPR0 Selected Bit Rate
00f
CORE
/2
01f
CORE
/4
10f
CORE
/8
11f
CORE
/16
In SPI Slave Mode, i.e., SPIM = 0, the logic level on the external SS pin (Pin 13), can be read
via the SPR0 bit.
NOTE
The CPOL and CPHA bits should both contain the same values for master and slave devices.
SPIDAT SPI Data Register
Function The SPIDAT SFR is written by the user to transmit data over the SPI interface or read by user
code to read data just received by the SPI interface.
SFR Address F7H
Power-On Default Value 00H
Bit Addressable No
Using the SPI Interface
Depending on the configuration of the bits in the SPICON SFR
shown in Table XIX, the ADuC816 SPI interface will transmit
or receive data in a number of possible modes. Figure 32 shows
all possible ADuC816 SPI configurations and the timing rela-
tionships and synchronization between the signals involved.
Also shown in this figure is the SPI interrupt bit (ISPI) and how
it is triggered at the end of each byte-wide communication.
SCLOCK
(CPOL = 1)
SCLOCK
(CPOL = 0)
(CPHA = 1)
(CPHA = 0)
SAMPLE INPUT
ISPI FLAG
DATA OUTPUT
ISPI FLAG
SAMPLE INPUT
DATA OUTPUT
?
?
MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB
SS
MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB
Figure 32. SPI Timing, All Modes
SPI Interface—Master Mode
In master mode, the SCLOCK pin is always an output and gener-
ates a burst of eight clocks whenever user code writes to the
SPIDAT register. The SCLOCK bit rate is determined by
SPR0 and SPR1 in SPICON. It should also be noted that the
SS pin is not used in master mode. If the ADuC816 needs to
assert the SS pin on an external slave device, a Port digital output
pin should be used.
In master mode a byte transmission or reception is initiated
by a write to SPIDAT. Eight clock periods are generated via the
SCLOCK pin and the SPIDAT byte being transmitted via MOSI.
With each SCLOCK period a data bit is also sampled via MISO.
After eight clocks, the transmitted byte will have been completely
transmitted and the input byte will be waiting in the input shift
register. The ISPI flag will be set automatically and an interrupt
will occur if enabled. The value in the shift register will be latched
into SPIDAT.
SPI Interface—Slave Mode
In slave mode the SCLOCK is an input. The SS pin must
also be driven low externally during the byte communication.
Transmission is also initiated by a write to SPIDAT. In slave
mode, a data bit is transmitted via MISO and a data bit is received
via MOSI through each input SCLOCK period. After eight clocks,
the transmitted byte will have been completely transmitted and the
input byte will be waiting in the input shift register. The ISPI flag
will be set automatically and an interrupt will occur if enabled.
The value in the shift register will be latched into SPIDAT only
when the transmission/reception of a byte has been completed.
The end of transmission occurs after the eighth clock has been
received, if CPHA = 1 or when SS returns high if CPHA = 0.
Rev. B
ADuC816
–50–
I
2
C-COMPATIBLE INTERFACE
The ADuC816 supports a 2-wire serial interface mode which is
I
2
C compatible. The I
2
C-compatible interface shares its pins
with the on-chip SPI interface and therefore the user can only
enable one or the other interface at any given time (see SPE in
I2CADD I
2
C Address Register
Function Holds the I
2
C peripheral address for
the part. It may be overwritten by
user code. Technical Note uC001 at
www.analog.com/microconverter
describes the format of the I
2
C stan-
dard 7-bit address in detail.
SFR Address 9BH
Power-On Default Value 55H
Bit Addressable No
I2CDAT I
2
C Data Register
Function The I2CDAT SFR is written by the
user to transmit data over the I
2
C
interface or read by user code to read
data just received by the I
2
C interface
Accessing I2CDAT automatically
clears any pending I
2
C interrupt and
the I2CI bit in the I2CCON SFR.
User software should only access
I2CDAT once per interrupt cycle.
SFR Address 9AH
Power-On Default Value 00H
Bit Addressable No
SPICON previously). An Application Note describing the
operation of this interface as implemented is available from
the MicroConverter Website at www.analog.com/microconverter.
This interface can be configured as a Software Master or Hard-
ware Slave, and uses two pins in the interface.
SDATA (Pin 27) Serial Data I/O Pin
SCLOCK (Pin 26) Serial Clock
Three SFRs are used to control the I
2
C-compatible interface. These are described below:
I2CCON: I
2
C Control Register
SFR Address E8H
Power-On Default Value 00H
Bit Addressable Yes
ODMEDMOCMIDMMC2ISRC2IXTC2IIC2I
Table XX. I2CCON SFR Bit Designations
Bit Name Description
7 MDO I
2
C Software Master Data Output Bit (MASTER MODE ONLY).
This data bit is used to implement a master I
2
C transmitter interface in software. Data written to this
bit will be output on the SDATA pin if the data output enable (MDE) bit is set.
6 MDE I
2
C Software Master Data Output Enable Bit (MASTER MODE ONLY).
Set by user to enable the SDATA pin as an output (Tx).
Cleared by the user to enable SDATA pin as an input (Rx).
5 MCO I
2
C Software Master Clock Output Bit (MASTER MODE ONLY).
This data bit is used to implement a master I
2
C transmitter interface in software. Data written to
this bit will be outputted on the SCLOCK pin.
4 MDI I
2
C Software Master Data Input Bit (MASTER MODE ONLY).
This data bit is used to implement a master I
2
C receiver interface in software. Data on the SDATA
pin is latched into this bit on SCLOCK if the Data Output Enable (MDE) bit is ‘0.’
3 I2CM I
2
C Master/Slave Mode Bit.
Set by user to enable I
2
C software master mode.
Cleared by user to enable I
2
C hardware slave mode.
2 I2CRS I
2
C Reset Bit (SLAVE MODE ONLY).
Set by user to reset the I
2
C interface.
Cleared by user code for normal I
2
C operation.
1 I2CTX I
2
C Direction Transfer Bit (SLAVE MODE ONLY).
Set by the MicroConverter if the interface is transmitting.
Cleared by the MicroConverter if the interface is receiving.
0 I2CI I
2
C Interrupt Bit (SLAVE MODE ONLY).
Set by the MicroConverter after a byte has been transmitted or received.
Cleared automatically when user code reads the I2CDAT SFR (see I2CDAT below).
Rev. B
ADuC816
–51–
8051-COMPATIBLE ON-CHIP PERIPHERALS
This section gives a brief overview of the various secondary periph-
eral circuits are also available to the user on-chip. These remaining
functions are fully 8051-compatible and are controlled via standard
8051 SFR bit definitions.
Parallel I/O Ports 0–3
The ADuC816 uses four input/output ports to exchange data with
external devices. In addition to performing general-purpose I/O,
some ports are capable of external memory operations; others are
multiplexed with an alternate function for the peripheral features
on the device. In general, when a peripheral is enabled, that pin
may not be used as a general purpose I/O pin.
Port 0 is an 8-bit open drain bidirectional I/O port that is directly
controlled via the Port 0 SFR (SFR address = 80 hex). Port 0
pins that have 1s written to them via the Port 0 SFR will be
configured as open drain and will therefore float. In that state,
Port 0 pins can be used as high impedance inputs. An external
pull-up resistor will be required on Port 0 outputs to force a
valid logic high level externally. Port 0 is also the multiplexed
low-order address and data bus during accesses to external pro-
gram or data memory. In this application it uses strong internal
pull-ups when emitting 1s.
Port 1 is also an 8-bit port directly controlled via the P1 SFR
(SFR address = 90 hex). The Port 1 pins are divided into two
distinct pin groupings.
P1.0 and P1.1 pins on Port 1 are bidirectional digital I/O pins with
internal pull-ups. If P1.0 and P1.1 have 1s written to them via the
P1 SFR, these pins are pulled high by the internal pull-up resis-
tors. In this state they can also be used as inputs; as input pins
being externally pulled low, they will source current because of
the internal pull-ups. With 0s written to them, both these pins
will drive a logic low output voltage (VOL) and will be capable of
sinking 10 mA compared to the standard 1.6 mA sink capa-
bility on the other port pins. These pins also have various
secondary functions described in Table XXI.
Table XXI. Port 1, Alternate Pin Functions
Pin Alternate Function
P1.0 T2 (Timer/Counter 2 External Input)
P1.1 T2EX (Timer/Counter 2 Capture/Reload Trigger)
The remaining Port 1 pins (P1.2–P1.7) can only be configured
as Analog Input (ADC), Analog Output (DAC) or Digital Input
pins. By (power-on) default these pins are configured as Analog
Inputs, i.e., “1” written in the corresponding Port 1 register bit.
To configure any of these pins as digital inputs, the user should
write a “0” to these port bits to configure the corresponding pin
as a high impedance digital input.
Port 2 is a bidirectional port with internal pull-up resistors directly
controlled via the P2 SFR (SFR address = A0 hex). Port 2 pins
that have 1s written to them are pulled high by the internal pull-up
resistors and, in that state, they can be used as inputs. As inputs,
Port 2 pins being pulled externally low will source current because
of the internal pull-up resistors. Port 2 emits the high order
address bytes during fetches from external program memory
and middle and high order address bytes during accesses to the
16-bit external data memory space.
Port 3 is a bidirectional port with internal pull-ups directly
controlled via the P2 SFR (SFR address = B0 hex). Port 3 pins
that have 1s written to them are pulled high by the internal pull-
ups and in that state they can be used as inputs. As inputs, Port
3 pins being pulled externally low will source current because of
the internal pull-ups. Port 3 pins also have various secondary
functions described in Table XXII.
Table XXII. Port 3, Alternate Pin Functions
Pin Alternate Function
P3.0 RXD (UART Input Pin)
(or Serial Data I/O in Mode 0)
P3.1 TXD (UART Output Pin)
(or Serial Clock Output in Mode 0)
P3.2 INT0 (External Interrupt 0)
P3.3 INT1 (External Interrupt 1)
P3.4 T0 (Timer/Counter 0 External Input)
P3.5 T1 (Timer/Counter 1 External Input)
P3.6 WR (External Data Memory Write Strobe)
P3.7 RD (External Data Memory Read Strobe)
The alternate functions of P1.0, P1.1, and Port 3 pins can only be
activated if the corresponding bit latch in the P1 and P3 SFRs
contains a 1. Otherwise, the port pin is stuck at 0.
Timers/Counters
The ADuC816 has three 16-bit Timer/Counters: Timer 0,
Timer 1, and Timer 2. The Timer/Counter hardware has been
included on-chip to relieve the processor core of the overhead
inherent in implementing timer/counter functionality in soft-
ware. Each Timer/Counter consists of two 8-bit registers THx and
TLx (x = 0, 1 and 2). All three can be configured to operate
either as timers or event counters.
In “Timer” function, the TLx register is incremented every
machine cycle. Thus one can think of it as counting machine
cycles. Since a machine cycle consists of 12 core clock periods,
the maximum count rate is 1/12 of the core clock frequency.
In “Counter” function, the TLx register is incremented by a
1-to-0 transition at its corresponding external input pin, T0, T1,
or T2. In this function, the external input is sampled during
S5P2 of every machine cycle. When the samples show a high in
one cycle and a low in the next cycle, the count is incremented.
The new count value appears in the register during S3P1 of the
cycle following the one in which the transition was detected. Since
it takes two machine cycles (16 core clock periods) to recognize a
1-to-0 transition, the maximum count rate is 1/16 of the core
clock frequency. There are no restrictions on the duty cycle of
the external input signal, but to ensure that a given level is
sampled at least once before it changes, it must be held for a mini-
mum of one full machine cycle. Remember that the core clock
frequency is programmed via the CD0–2 selection bits in the
PLLCON SFR.
Rev. B
ADuC816
–52–
User configuration and control of all Timer operating modes is achieved via three SFRs namely:
TMOD, TCON: Control and configuration for Timers 0 and 1.
T2CON: Control and configuration for Timer 2.
TMOD Timer/Counter 0 and 1 Mode Register
SFR Address 89H
Power-On Default Value 00H
Bit Addressable No
etaG/CT1M0MetaG/CT1M0M
Table XXIII. TMOD SFR Bit Designations
Bit Name Description
7 Gate Timer 1 Gating Control.
Set by software to enable timer/counter 1 only while INT1 pin is high and TR1 control bit is set.
Cleared by software to enable timer 1 whenever TR1 control bit is set.
6C/TTimer 1 Timer or Counter Select Bit.
Set by software to select counter operation (input from T1 pin).
Cleared by software to select timer operation (input from internal system clock).
5 M1 Timer 1 Mode Select Bit 1 (Used with M0 Bit).
4 M0 Timer 1 Mode Select Bit 0.
M1 M0
0 0 TH1 operates as an 8-bit timer/counter. TL1 serves as 5-bit prescaler.
0 1 16-Bit Timer/Counter. TH1 and TL1 are cascaded; there is no prescaler.
1 0 8-Bit Auto-Reload Timer/Counter. TH1 holds a value which is to be
reloaded into TL1 each time it overflows.
1 1 Timer/Counter 1 Stopped.
3 Gate Timer 0 Gating Control.
Set by software to enable timer/counter 0 only while INT0 pin is high and TR0 control bit is set.
Cleared by software to enable Timer 0 whenever TR0 control bit is set.
2C/TTimer 0 Timer or Counter Select Bit.
Set by software to select counter operation (input from T0 pin).
Cleared by software to select timer operation (input from internal system clock).
1 M1 Timer 0 Mode Select Bit 1.
0 M0 Timer 0 Mode Select Bit 0.
M1 M0
0 0 TH0 operates as an 8-bit timer/counter. TL0 serves as 5-bit prescaler.
0 1 16-Bit Timer/Counter. TH0 and TL0 are cascaded; there is no prescaler
1 0 8-Bit Auto-Reload Timer/Counter. TH0 holds a value which is to be
reloaded into TL0 each time it overflows.
1 1 TL0 is an 8-bit timer/counter controlled by the standard timer 0 control
bits. TH0 is an 8-bit timer only, controlled by Timer 1 control bits.
Rev. B
ADuC816
–53–
TCON: Timer/Counter 0 and 1 Control Register
SFR Address 88H
Power-On Default Value 00H
Bit Addressable Yes
1FT1RT0FT0RT1EI
1
1TI
1
0EI
1
0TI
1
NOTE
1
These bits are not used in the control of timer/counter 0 and 1, but are used instead in the control and monitoring of the external INT0 and INT1 interrupt pins.
Table XXIV. TCON SFR Bit Designations
Bit Name Description
7 TF1 Timer 1 Overflow Flag.
Set by hardware on a timer/counter 1 overflow.
Cleared by hardware when the Program Counter (PC) vectors to the interrupt service routine.
6 TR1 Timer 1 Run Control Bit.
Set by user to turn on timer/counter 1.
Cleared by user to turn off timer/counter 1.
5 TF0 Timer 0 Overflow Flag.
Set by hardware on a timer/counter 0 overflow.
Cleared by hardware when the PC vectors to the interrupt service routine.
4 TR0 Timer 0 Run Control Bit.
Set by user to turn on timer/counter 0.
Cleared by user to turn off timer/counter 0.
3 IE1 External Interrupt 1 (INT1) Flag.
Set by hardware by a falling edge or zero level being applied to external interrupt pin INT1, depend-
ing on bit IT1 state.
Cleared by hardware when the when the PC vectors to the interrupt service routine only if the inter-
rupt was transition-activated. If level-activated, the external requesting source controls the
request flag, rather than the on-chip hardware.
2 IT1 External Interrupt 1 (IE1) Trigger Type.
Set by software to specify edge-sensitive detection (i.e., 1-to-0 transition).
Cleared by software to specify level-sensitive detection (i.e., zero level).
1 IE0 External Interrupt 0 (INT0) Flag.
Set by hardware by a falling edge or zero level being applied to external interrupt pin INT0, depend-
ing on bit IT0 state.
Cleared by hardware when the PC vectors to the interrupt service routine only if the interrupt was
transition-activated. If level-activated, the external requesting source controls the request flag,
rather than the on-chip hardware.
0 IT0 External Interrupt 0 (IE0) Trigger Type.
Set by software to specify edge-sensitive detection (i.e., 1-to-0 transition).
Cleared by software to specify level-sensitive detection (i.e., zero level).
Timer/Counter 0 and 1 Data Registers
Each timer consists of two 8-bit registers. These can be used as independent registers or combined to be a single 16-bit register
depending on the timer mode configuration.
TH0 and TL0
Timer 0 high byte and low byte.
SFR Address = 8Chex, 8Ahex respectively.
TH1 and TL1
Timer 1 high byte and low byte.
SFR Address = 8Dhex, 8Bhex respectively.
Rev. B
ADuC816
–54–
TIMER/COUNTER 0 AND 1 OPERATING MODES
The following paragraphs describe the operating modes for timer/
counters 0 and 1. Unless otherwise noted, it should be assumed
that these modes of operation are the same for timer 0 as for timer 1.
Mode 0 (13-Bit Timer/Counter)
Mode 0 configures an 8-bit timer/counter with a divide-by-32
prescaler. Figure 33 shows mode 0 operation.
12
CORE
CLK*
TF0
INTERRUPT
CONTROL
P3.4/T0
GATE
P3.2/INT0
TR0
TL0
(5 BITS)
TH0
(8 BITS)
C/T = 0
C/T = 1
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 33. Timer/Counter 0, Mode 0
In this mode, the timer register is configured as a 13-bit register.
As the count rolls over from all 1s to all 0s, it sets the timer overflow
flag TF0. The overflow flag, TF0, can then be used to request an
interrupt. The counted input is enabled to the timer when TR0 = 1
and either Gate = 0 or INT0 = 1. Setting Gate = 1 allows the timer
to be controlled by external input INT0, to facilitate pulsewidth
measurements. TR0 is a control bit in the special function regis-
ter TCON; Gate is in TMOD. The 13-bit register consists of all
eight bits of TH0 and the lower five bits of TL0. The upper three
bits of TL0 are indeterminate and should be ignored. Setting the
run flag (TR0) does not clear the registers.
Mode 1 (16-Bit Timer/Counter)
Mode 1 is the same as Mode 0, except that the timer register is
running with all 16 bits. Mode 1 is shown in Figure 34.
12
CORE
CLK*
TF0
INTERRUPT
CONTROL
P3.4/T0
TL0
(8 BITS)
TH0
(8 BITS)
C/T = 0
C/T = 1
GATE
P3.2/INT0
TR0
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 34. Timer/Counter 0, Mode 1
Mode 2 (8-Bit Timer/Counter with Autoreload)
Mode 2 configures the timer register as an 8-bit counter (TL0)
with automatic reload, as shown in Figure 35. Overflow from TL0
not only sets TF0, but also reloads TL0 with the contents of TH0,
which is preset by software. The reload leaves TH0 unchanged.
12
CORE
CLK*
CONTROL
P3.4/T0
TF0
TL0
(8 BITS)
INTERRUPT
C/T = 0
C/T = 1
RELOAD
TH0
(8 BITS)
GATE
P3.2/INT0
TR0
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 35. Timer/Counter 0, Mode 2
Mode 3 (Two 8-Bit Timer/Counters)
Mode 3 has different effects on timer 0 and timer 1. Timer 1 in
Mode 3 simply holds its count. The effect is the same as setting
TR1 = 0. Timer 0 in Mode 3 establishes TL0 and TH0 as two
separate counters. This configuration is shown in Figure 36. TL0
uses the timer 0 control bits: C/T, Gate, TR0, INT0, and TF0.
TH0 is locked into a timer function (counting machine cycles)
and takes over the use of TR1 and TF1 from timer 1. Thus, TH0
now controls the “timer 1” interrupt. Mode 3 is provided for
applications requiring an extra 8-bit timer or counter.
When timer 0 is in Mode 3, timer 1 can be turned on and off by
switching it out of, and into, its own Mode 3, or can still be used by
the serial interface as a Baud Rate Generator. In fact, it can be used,
in any application not requiring an interrupt from timer 1 itself.
12
CORE
CLK*
TL0
(8 BITS)
TF0
INTERRUPT
CONTROL
P3.4/T0
C/T = 0
C/T = 1
TH0
(8 BITS)
TF1
INTERRUPT
CORE
CLK/12
TR1
CORE
CLK/12
CONTROL
GATE
P3.2/INT0
TR0
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 36. Timer/Counter 0, Mode 3
Rev. B
ADuC816
–55–
T2CON Timer/Counter 2 Control Register
SFR Address C8H
Power-On Default Value 00H
Bit Addressable Yes
2FT2FXEKLCRKLCT2NEXE2RT2TNC2PAC
Table XXV. T2CON SFR Bit Designations
Bit Name Description
7 TF2 Timer 2 Overflow Flag.
Set by hardware on a timer 2 overflow. TF2 will not be set when either RCLK or TCLK = 1.
Cleared by user software.
6 EXF2 Timer 2 External Flag.
Set by hardware when either a capture or reload is caused by a negative transition on T2EX and
EXEN2 = 1.
Cleared by user user software.
5 RCLK Receive Clock Enable Bit.
Set by user to enable the serial port to use timer 2 overflow pulses for its receive clock in serial port
Modes 1 and 3.
Cleared by user to enable timer 1 overflow to be used for the receive clock.
4 TCLK Transmit Clock Enable Bit.
Set by user to enable the serial port to use timer 2 overflow pulses for its transmit clock in serial
port Modes 1 and 3.
Cleared by user to enable timer 1 overflow to be used for the transmit clock.
3 EXEN2 Timer 2 External Enable Flag.
Set by user to enable a capture or reload to occur as a result of a negative transition on T2EX if
Timer 2 is not being used to clock the serial port.
Cleared by user for Timer 2 to ignore events at T2EX.
2 TR2 Timer 2 Start/Stop Control Bit.
Set by user to start timer 2.
Cleared by user to stop timer 2.
1 CNT2 Timer 2 Timer or Counter Function Select Bit.
Set by user to select counter function (input from external T2 pin).
Cleared by user to select timer function (input from on-chip core clock).
0 CAP2 Timer 2 Capture/Reload Select Bit.
Set by user to enable captures on negative transitions at T2EX if EXEN2 = 1.
Cleared by user to enable auto-reloads with Timer 2 overflows or negative transitions at T2EX
when EXEN2 = 1. When either RCLK = 1 or TCLK = 1, this bit is ignored and the timer is
forced to autoreload on Timer 2 overflow.
Timer/Counter 2 Data Registers
Timer/Counter 2 also has two pairs of 8-bit data registers associated with it. These are used as both timer data registers and timer
capture/reload registers.
TH2 and TL2
Timer 2, data high byte and low byte.
SFR Address = CDhex, CChex respectively.
RCAP2H and RCAP2L
Timer 2, Capture/Reload byte and low byte.
SFR Address = CBhex, CAhex respectively.
Rev. B
ADuC816
–56–
Timer/Counter 2 Operating Modes
The following paragraphs describe the operating modes for timer/
counter 2. The operating modes are selected by bits in the T2CON
SFR as shown in Table XXVI.
Table XXVI. TIMECON SFR Bit Designations
RCLK (or) TCLK CAP2 TR2 MODE
0 0 1 16-Bit Autoreload
0 1 1 16-Bit Capture
1 X 1 Baud Rate
X X 0 OFF
16-Bit Autoreload Mode
In “Autoreload” mode, there are two options, which are selected
by bit EXEN2 in T2CON. If EXEN2 = 0, then when Timer 2
rolls over it not only sets TF2 but also causes the Timer 2 registers
to be reloaded with the 16-bit value in registers RCAP2L and
RCAP2H, which are preset by software. If EXEN2 = 1, then
Timer 2 still performs the above, but with the added feature that
a 1-to-0 transition at external input T2EX will also trigger the
16-bit reload and set EXF2. The autoreload mode is illustrated
in Figure 37 below.
CORE
CLK*12
T2
PIN
C/T2 = 0
C/T2 = 1
TR2
CONTROL
TL2
(8 BITS)
TH2
(8 BITS)
RELOAD
TF2
EXF2
TIMER
INTERRUPT
EXEN2
CONTROL
TRANSITION
DETECTOR
T2EX
PIN
RCAP2L RCAP2H
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 37. Timer/Counter 2, 16-Bit Autoreload Mode
TF2
CORE
CLK*12
T2
PIN
TR2
CONTROL
TL2
(8 BITS)
TH2
(8 BITS)
CAPTURE
EXF2
TIMER
INTERRUPT
EXEN2
CONTROL
TRANSITION
DETECTOR
T2EX
PIN
RCAP2L RCAP2H
C/T2 = 0
C/T2 = 1
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 38. Timer/Counter 2, 16-Bit Capture Mode
16-Bit Capture Mode
In the “Capture” mode, there are again two options, which are
selected by bit EXEN2 in T2CON. If EXEN2 = 0, then Timer 2
is a 16-bit timer or counter which, upon overflowing, sets bit TF2,
the Timer 2 overflow bit, which can be used to generate an inter-
rupt. If EXEN2 = 1, then Timer 2 still performs the above, but
a l-to-0 transition on external input T2EX causes the current value
in the Timer 2 registers, TL2 and TH2, to be captured into regis-
ters RCAP2L and RCAP2H, respectively. In addition, the
transition at T2EX causes bit EXF2 in T2CON to be set, and
EXF2, like TF2, can generate an interrupt. The Capture Mode
is illustrated in Figure 38.
The baud rate generator mode is selected by RCLK = 1 and/or
TCLK = 1.
In either case if Timer 2 is being used to generate the baud rate,
the TF2 interrupt flag will not occur. Hence Timer 2 interrupts
will not occur so they do not have to be disabled. In this mode
the EXF2 flag, however, can still cause interrupts and this can
be used as a third external interrupt.
Baud rate generation will be described as part of the UART
serial port operation in the following pages.
Rev. B
ADuC816
–57–
UART SERIAL INTERFACE
The serial port is full duplex, meaning it can transmit and receive
simultaneously. It is also receive-buffered, meaning it can
commence reception of a second byte before a previously received
byte has been read from the receive register. However, if the first
byte still has not been read by the time reception of the second
byte is complete, the first byte will be lost. The physical interface
to the serial data network is via Pins RXD(P3.0) and TXD(P3.1)
while the SFR interface to the UART is comprised of the fol-
lowing registers.
SBUF
The serial port receive and transmit registers are both accessed
through the SBUF SFR (SFR address = 99 hex). Writing to
SBUF loads the transmit register and reading SBUF accesses a
physically separate receive register.
SCON UART Serial Port Control Register
SFR Address 98H
Power-On Default Value 00H
Bit Addressable Yes
0MS1MS2MSNER8BT8BRITIR
Table XXVII. SCON SFR Bit Designations
Bit Name Description
7 SM0 UART Serial Mode Select Bits.
6 SM1 These bits select the Serial Port operating mode as follows:
SM0 SM1 Selected Operating Mode
0 0 Mode 0: Shift Register, fixed baud rate (Core_Clk/2)
0 1 Mode 1: 8-bit UART, variable baud rate
1 0 Mode 2: 9-bit UART, fixed baud rate (Core_Clk/64) or (Core_Clk/32)
1 1 Mode 3: 9-bit UART, variable baud rate
5 SM2 Multiprocessor Communication Enable Bit.
Enables multiprocessor communication in Modes 2 and 3. In Mode 0, SM2 should be cleared.
In Mode 1, if SM2 is set, RI will not be activated if a valid stop bit was not received. If SM2 is
cleared, RI will be set as soon as the byte of data has been received. In Modes 2 or 3, if SM2 is
set, RI will not be activated if the received ninth data bit in RB8 is 0. If SM2 is cleared, RI will
be set as soon as the byte of data has been received.
4 REN Serial Port Receive Enable Bit.
Set by user software to enable serial port reception.
Cleared by user software to disable serial port reception.
3 TB8 Serial Port Transmit (Bit 9).
The data loaded into TB8 will be the ninth data bit that will be transmitted in Modes 2 and 3.
2 RB8 Serial port Receiver Bit 9.
The ninth data bit received in Modes 2 and 3 is latched into RB8. For Mode 1 the stop bit is
latched into RB8.
1 TI Serial Port Transmit Interrupt Flag.
Set by hardware at the end of the eighth bit in Mode 0, or at the beginning of the stop bit in
Modes 1, 2, and 3.
TI must be cleared by user software.
0 RI Serial Port Receive Interrupt Flag.
Set by hardware at the end of the eighth bit in mode 0, or halfway through the stop bit in
Modes 1, 2, and 3.
RI must be cleared by software.
Rev. B
ADuC816
–58–
Mode 0: 8-Bit Shift Register Mode
Mode 0 is selected by clearing both the SM0 and SM1 bits in
the SFR SCON. Serial data enters and exits through RXD. TXD
outputs the shift clock. Eight data bits are transmitted or received.
Transmission is initiated by any instruction that writes to SBUF.
The data is shifted out of the RXD line. The eight bits are trans-
mitted with the least-significant bit (LSB) first, as shown in
Figure 39.
CORE
CLK
ALE
RXD
(DATA OUT)
TXD
(SHIFT CLOCK)
DATA BIT 0 DATA BIT 1 DATA BIT 6 DATA BIT 7
S6S5S4S3S2S1S6S5S4S4S3S2S1S6S5S4S3S2S1
MACHINE
CYCLE 8
MACHINE
CYCLE 7
MACHINE
CYCLE 2
MACHINE
CYCLE 1
Figure 39. UART Serial Port Transmission, Mode 0
Reception is initiated when the receive enable bit (REN) is 1 and
the receive interrupt bit (RI) is 0. When RI is cleared the data is
clocked into the RXD line and the clock pulses are output from
the TXD line.
Mode 1: 8-Bit UART, Variable Baud Rate
Mode 1 is selected by clearing SM0 and setting SM1. Each data
byte (LSB first) is preceded by a start bit(0) and followed by a stop
bit(1). Therefore 10 bits are transmitted on TXD or received on
RXD. The baud rate is set by the Timer 1 or Timer 2 overflow
rate, or a combination of the two (one for transmission and the
other for reception).
Transmission is initiated by writing to SBUF. The “write to
SBUF” signal also loads a 1 (stop bit) into the ninth bit position
of the transmit shift register. The data is output bit by bit until
the stop bit appears on TXD and the transmit interrupt flag (TI)
is automatically set as shown in Figure 40.
TXD
TI
(SCON.1)
START
BIT D0 D1 D2 D3 D4 D5 D6 D7
STOP BIT
SET INTERRUPT
i.e.
,
READY FOR MORE DATA
Figure 40. UART Serial Port Transmission, Mode 0
Reception is initiated when a 1-to-0 transition is detected on
RXD. Assuming a valid start bit was detected, character reception
continues. The start bit is skipped and the eight data bits are
clocked into the serial port shift register. When all eight bits have
been clocked in, the following events occur:
The eight bits in the receive shift register are latched into SBUF
The ninth bit (Stop bit) is clocked into RB8 in SCON
The Receiver interrupt flag (RI) is set
if, and only if, the following conditions are met at the time the
final shift pulse is generated:
RI = 0, and
Either SM2 = 0, or SM2 = 1 and the received stop bit = 1.
If either of these conditions is not met, the received frame is
irretrievably lost, and RI is not set.
Mode 2: 9-Bit UART with Fixed Baud Rate
Mode 2 is selected by setting SM0 and clearing SM1. In this
mode the UART operates in 9-bit mode with a fixed baud rate.
The baud rate is fixed at Core_Clk/64 by default, although by
setting the SMOD bit in PCON, the frequency can be doubled to
Core_Clk/32. Eleven bits are transmitted or received, a start bit(0),
eight data bits, a programmable ninth bit and a stop bit(1). The
ninth bit is most often used as a parity bit, although it can be used
for anything, including a ninth data bit if required.
To transmit, the eight data bits must be written into SBUF. The
ninth bit must be written to TB8 in SCON. When transmission is
initiated the eight data bits (from SBUF) are loaded onto the
transmit shift register (LSB first). The contents of TB8 are loaded
into the ninth bit position of the transmit shift register. The trans-
mission will start at the next valid baud rate clock. The TI flag
is set as soon as the stop bit appears on TXD.
Reception for Mode 2 is similar to that of Mode 1. The eight
data bytes are input at RXD (LSB first) and loaded onto the
receive shift register. When all eight bits have been clocked in,
the following events occur:
The eight bits in the receive shift register are latched into SBUF
The ninth data bit is latched into RB8 in SCON
The Receiver interrupt flag (RI) is set
if, and only if, the following conditions are met at the time the
final shift pulse is generated:
RI = 0, and
Either SM2 = 0, or SM2 = 1 and the received stop bit = 1.
If either of these conditions is not met, the received frame is
irretrievably lost, and RI is not set.
Mode 3: 9-Bit UART with Variable Baud Rate
Mode 3 is selected by setting both SM0 and SM1. In this mode
the 8051 UART serial port operates in 9-bit mode with a variable
baud rate determined by either Timer 1 or Timer 2. The opera-
tion of the 9-bit UART is the same as for Mode 2 but the baud
rate can be varied as for Mode 1.
In all four modes, transmission is initiated by any instruction that
uses SBUF as a destination register. Reception is initiated in Mode 0
by the condition RI = 0 and REN = 1. Reception is initiated in
the other modes by the incoming start bit if REN = 1.
UART Serial Port Baud Rate Generation
Mode 0 Baud Rate Generation
The baud rate in Mode 0 is fixed:
Mode 0 Baud Rate = (Core Clock Frequency
1
/12)
NOTE
1
In these descriptions Core Clock Frequency refers to the core clock frequency
selected via the CD0–2 bits in the PLLCON SFR.
Mode 2 Baud Rate Generation
The baud rate in Mode 2 depends on the value of the SMOD bit
in the PCON SFR. If SMOD = 0, the baud rate is 1/64 of the core
clock. If SMOD = 1, the baud rate is 1/32 of the core clock:
Mode 2 Baud Rate = (2
SMOD
/64)
× (Core Clock Frequency)
Modes 1 and 3 Baud Rate Generation
The baud rates in Modes 1 and 3 are determined by the overflow
rate in Timer 1 or Timer 2, or both (one for transmit and the
other for receive).
Rev. B
ADuC816
–59–
Timer 1 Generated Baud Rates
When Timer 1 is used as the baud rate generator, the baud rates
in Modes 1 and 3 are determined by the Timer 1 overflow rate and
the value of SMOD as follows:
Modes 1 and 3 Baud Rate = (2
SMOD
/32)
× (Timer 1 Overflow Rate)
The Timer 1 interrupt should be disabled in this application. The
Timer itself can be configured for either timer or counter opera-
tion, and in any of its three running modes. In the most typical
application, it is configured for timer operation, in the autoreload
mode (high nibble of TMOD = 0100Binary). In that case, the baud
rate is given by the formula:
Modes 1 and 3 Baud Rate =
(2
SMOD
/32) × (Core Clock/(12 × [256-TH1]))
A very low baud rate can also be achieved with Timer 1 by leaving
the Timer 1 interrupt enabled, and configuring the timer to run
as a 16-bit timer (high nibble of TMOD = 0100Binary), and using
the Timer 1 interrupt to do a 16-bit software reload. Table XXVIII
below, shows some commonly-used baud rates and how they
might be calculated from a core clock frequency of 1.5728 MHz
and 12.58 MHz. Generally speaking, a 5% error is tolerable
using asynchronous (start/stop) communications.
Table XXVIII. Commonly-Used Baud Rates, Timer 1
Ideal Core SMOD TH1-Reload Actual %
Baud CLK Value Value Baud Error
9600 12.58 1 –7 (F9h) 9362 2.5
2400 12.58 1 –27 (E5h) 2427 1.1
1200 12.58 1 –55 (C9h) 1192 0.7
1200 1.57 1 –7 (F9h) 1170 2.5
Timer 2 Generated Baud Rates
Baud rates can also be generated using Timer 2. Using Timer 2
is similar to using Timer 1 in that the timer must overflow 16 times
before a bit is transmitted/received. Because Timer 2 has a 16-bit
autoreload mode a wider range of baud rates is possible using
Timer 2.
Modes 1 and 3 Baud Rate = (1/16) × (Timer 2 Overflow Rate)
Therefore, when Timer 2 is used to generate baud rates, the timer
increments every two clock cycles and not every core machine
cycle as before. Hence, it increments six times faster than Timer
1, and therefore baud rates six times faster are possible. Because
Timer 2 has 16-bit autoreload capability, very low baud rates
are still possible.
Timer 2 is selected as the baud rate generator by setting the TCLK
and/or RCLK in T2CON. The baud rates for transmit and receive
can be simultaneously different. Setting RCLK and/or TCLK puts
Timer 2 into its baud rate generator mode as shown in Figure 41.
In this case, the baud rate is given by the formula:
Modes 1 and 3 Baud Rate
= (Core Clk)/(32 × [65536 – (RCAP2H, RCAP2L)])
Table XXIX shows some commonly used baud rates and how they
might be calculated from a core clock frequency of 1.5728 MHz
and 12.5829 MHz.
Table XXIX. Commonly Used Baud Rates, Timer 2
Ideal Core RCAP2H RCAP2L Actual %
Baud CLK Value Value Baud Error
19200 12.58 –1 (FFh) –20 (ECh) 19661 2.4
9600 12.58 –1 (FFh) –41 (D7h) 9591 0.1
2400 12.58 –1 (FFh) –164 (5Ch) 2398 0.1
1200 12.58 –2 (FEh) –72 (B8h) 1199 0.1
9600 1.57 –1 (FFh) –5 (FBh) 9830 2.4
2400 1.57 –1 (FFh) –20 (ECh) 2457 2.4
1200 1.57 –1 (FFh) –41 (D7h) 1199 0.1
CORE
CLK*2
T2
PIN
TR2
CONTROL
TL2
(8 BITS)
TH2
(8 BITS)
RELOAD
EXEN2
CONTROL
T2EX
PIN
RCAP2L RCAP2H
NOTE: OSC. FREQ. IS DIVIDED BY 2, NOT 12.
TIMER 2
OVERFLOW
2
16
16
RCLK
TCLK
RX
CLOCK
TX
CLOCK
0
0
1
1
10
SMOD
TIMER 1
OVERFLOW
TRANSITION
DETECTOR
EXF
2
TIMER 2
INTERRUPT
NOTE AVAILABILITY OF ADDITIONAL
EXTERNAL INTERRUPT
C/T2 = 0
C/T2 = 1
*THE CORE CLOCK IS THE OUTPUT OF THE PLL AS DESCRIBED ON PAGE 42.
Figure 41. Timer 2, UART Baud Rates
Rev. B
ADuC816
–60–
INTERRUPT SYSTEM
The ADuC816 provides a total of twelve interrupt sources with two priority levels. The control and configuration of the interrupt
system is carried out through three Interrupt-related SFRs.
IE: Interrupt Enable Register.
IP: Interrupt Priority Register.
IEIP2: Secondary Interrupt Priority-Interrupt Register.
IE: Interrupt Enable Register
SFR Address A8H
Power-On Default Value 00H
Bit Addressable Yes
AECDAE2TESE1TE1XE0TE0XE
Table XXX. IE SFR Bit Designations
Bit Name Description
7 EA Written by User to Enable “1” or Disable “0” All Interrupt Sources
6 EADC Written by User to Enable “1” or Disable “0” ADC Interrupt
5 ET2 Written by User to Enable “1” or Disable “0” Timer 2 Interrupt
4 ES Written by User to Enable “1” or Disable “0” UART Serial Port Interrupt
3 ET1 Written by User to Enable “1” or Disable “0” Timer 1 Interrupt
2 EX1 Written by User to Enable “1” or Disable “0” External Interrupt 1
1 ET0 Written by User to Enable “1” or Disable “0” Timer 0 Interrupt
0 EX0 Written by User to Enable “1” or Disable “0” External Interrupt 0
IP: Interrupt Priority Register
SFR Address B8H
Power-On Default Value 00H
Bit Addressable Yes
---CDAP2TPSP1TP1XP0TP0XP
Table XXXI. IP SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 PADC Written by User to Select ADC Interrupt Priority (“1” = High; “0” = Low)
5 PT2 Written by User to Select Timer 2 Interrupt Priority (“1” = High; “0” = Low)
4 PS Written by User to Select UART Serial Port Interrupt Priority (“1” = High; “0” = Low)
3 PT1 Written by User to Select Timer 1 Interrupt Priority (“1” = High; “0” = Low)
2 PX1 Written by User to Select External Interrupt 1 Priority (“1” = High; “0” = Low)
1 PT0 Written by User to Select Timer 0 Interrupt Priority (“1” = High; “0” = Low)
0 PX0 Written by User to Select External Interrupt 0 Priority (“1” = High; “0” = Low)
Rev. B
ADuC816
–61–
IEIP2: Secondary Interrupt Enable and Priority Register
SFR Address A9H
Power-On Default Value A0H
Bit Addressable No
---ITPMSPPISP---ITEMSPEISE
Table XXXII. IEIP2 SFR Bit Designations
Bit Name Description
7 --- Reserved for Future Use.
6 PTI Written by User to Select TIC Interrupt Priority (“1” = High; “0” = Low).
5 PPSM Written by User to Select Power Supply Monitor Interrupt Priority (“1” = High; “0” = Low).
4 PSI Written by User to Select SPI/I
2
C Serial Port Interrupt Priority (“1” = High; “0” = Low).
3 --- Reserved, This Bit Must Be “0.”
2 ETI Written by User to Enable “1” or Disable “0” TIC Interrupt.
1 EPSM Written by User to Enable “1” or Disable “0” Power Supply Monitor Interrupt.
0 ESI Written by User to Enable “1” or Disable “0” SPI/I
2
C Serial Port Interrupt.
Interrupt Priority
The Interrupt Enable registers are written by the user to enable
individual interrupt sources, while the Interrupt Priority registers
allow the user to select one of two priority levels for each interrupt.
An interrupt of a high priority may interrupt the service routine
of a low priority interrupt, and if two interrupts of different priority
occur at the same time, the higher level interrupt will be serviced
first. An interrupt cannot be interrupted by another interrupt of
the same priority level. If two interrupts of the same priority level
occur simultaneously, a polling sequence is observed as shown
in Table XXXIII.
Table XXXIII. Priority within an Interrupt Level
Source Priority Description
PSMI 1 (Highest) Power Supply Monitor Interrupt
WDS 2 Watchdog Interrupt
IE0 3 External Interrupt 0
RDY0/RDY1 4 ADC Interrupt
TF0 5 Timer/Counter 0 Interrupt
IE1 6 External Interrupt 1
TF1 7 Timer/Counter 1 Interrupt
I2CI + ISPI 8 I
2
C/SPI Interrupt
RI + TI 9 Serial Interrupt
TF2 + EXF2 10 Timer/Counter 2 Interrupt
TII 11 (Lowest) Time Interval Counter Interrupt
Interrupt Vectors
When an interrupt occurs the program counter is pushed onto the
stack and the corresponding interrupt vector address is loaded into
the program counter. The interrupt vector addresses are shown
in Table XXXIV.
Table XXXIV. Interrupt Vector Addresses
Source Vector Address
IE0 0003 Hex
TF0 000B Hex
IE1 0013 Hex
TF1 001B Hex
RI + TI 0023 Hex
TF2 + EXF2 002B Hex
RDY0/RDY1 (ADC) 0033 Hex
II
2
C + ISPI 003B Hex
PSMI 0043 Hex
TII 0053 Hex
WDS (WDIR = 1)
*
005B Hex
*The watchdog can be configured to generate an interrupt instead of a reset when it
times out. This is used for logging errors or to examine the internal status of the
microcontroller core to understand, from a software debug point of view, why a
watchdog timeout occurred. The watchdog interrupt is slightly different from the
normal interrupts in that its priority level is always set to 1 and it is not possible
to disable the interrupt via the global disable bit (EA) in the IE SFR. This is
done to ensure that the interrupt will always be responded to if a watchdog
timeout occurs. The watchdog will only produce an interrupt if the watch-
dog timeout is greater than zero.
Rev. B
ADuC816
–62–
ADuC816 HARDWARE DESIGN CONSIDERATIONS
This section outlines some of the key hardware design consider-
ations that must be addressed when integrating the ADuC816
into any hardware system.
Clock Oscillator
As described earlier, the core clock frequency for the ADuC816
is generated from an on-chip PLL that locks onto a multiple
(384 times) of 32.768 kHz. The latter is generated from an inter-
nal clock oscillator. To use the internal clock oscillator, connect
a 32.768 kHz parallel resonant crystal between XTAL1 and
XTAL2 pins (32 and 33) as shown in Figure 42.
As shown in the typical external crystal connection diagram in
Figure 42, two internal 12 pF capacitors are provided on-chip.
These are connected internally, directly to the XTAL1 and
XTAL2 pins and the total input capacitances at both pins is
detailed in the specification section of this data sheet. The value
of the total load capacitance required for the external crystal should
be the value recommended by the crystal manufacturer for use
with that specific crystal. In many cases, because of the on-chip
capacitors, additional external load capacitors will not be required.
XTAL2
XTAL1
32.768kHz
TO INTERNAL
PLL
ADuC816
12pF
12pF
Figure 42. External Parallel Resonant Crystal Connections
External Memory Interface
In addition to its internal program and data memories, the
ADuC816 can access up to 64 Kbytes of external program memory
(ROM/PROM/etc.) and up to 16 Mbytes of external data
memory (SRAM).
To select from which code space (internal or external program
memory) to begin executing instructions, tie the EA (external
access) pin high or low, respectively. When EA is high (pulled up
to V
DD
), user program execution will start at address 0 of the
internal 8 Kbytes Flash/EE code space. When EA is low (tied to
ground) user program execution will start at address 0 of the
external code space. In either case, addresses above 1FFF hex
(8K) are mapped to the external space.
Note that a second very important function of the EA pin is
described in the Single Pin Emulation Mode section of this
data sheet.
External program memory (if used) must be connected to the
ADuC816 as illustrated in Figure 43. Note that 16 I/O lines
(Ports 0 and 2) are dedicated to bus functions during external
program memory fetches. Port 0 (P0) serves as a multiplexed
address/data bus. It emits the low byte of the program counter
(PCL) as an address, and then goes into a float state awaiting
the arrival of the code byte from the program memory. During the
time that the low byte of the program counter is valid on P0, the
signal ALE (Address Latch Enable) clocks this byte into an
address latch. Meanwhile, Port 2 (P2) emits the high byte of the
program counter (PCH), then PSEN strobes the EPROM and
the code byte is read into the ADuC816.
LATCH
EPROM
OE
A8–A15
A0–A7
D0–D7
(INSTRUCTION)
ADuC816
PSEN
P2
ALE
P0
Figure 43. External Program Memory Interface
Note that program memory addresses are always 16 bits wide, even
in cases where the actual amount of program memory used is less
than 64 Kbytes. External program execution sacrifices two of the
8-bit ports (P0 and P2) to the function of addressing the program
memory. While executing from external program memory, Ports
0 and 2 can be used simultaneously for read/write access to exter-
nal data memory, but not for general-purpose I/O.
Though both external program memory and external data memory
are accessed by some of the same pins, the two are completely
independent of each other from a software point of view. For
example, the chip can read/write external data memory while
executing from external program memory.
Figure 44 shows a hardware configuration for accessing up to
64 Kbytes of external RAM. This interface is standard to any 8051
compatible MCU.
LATCH
SRAM
OE
A8–A15
A0–A7
D0–D7
(DATA)
ADuC816
RD
P2
ALE
P0
WE
WR
Figure 44. External Data Memory Interface (64 K Address
Space)
If access to more than 64 Kbytes of RAM is desired, a feature
unique to the ADuC816 allows addressing up to 16 Mbytes
of external RAM simply by adding an additional latch as illustrated
in Figure 45.
Rev. B
ADuC816
–63–
LATCH
ADuC816
RD
P2
ALE
P0
WR
LATCH
SRAM
OE
A8–A15
A0–A7
D0–D7
(DATA)
WE
A16–A23
Figure 45. External Data Memory Interface (16 M Bytes
Address Space)
In either implementation, Port 0 (P0) serves as a multiplexed
address/data bus. It emits the low byte of the data pointer (DPL) as
an address, which is latched by a pulse of ALE prior to data being
placed on the bus by the ADuC816 (write operation) or the
SRAM (read operation). Port 2 (P2) provides the data pointer
page byte (DPP) to be latched by ALE, followed by the data
pointer high byte (DPH). If no latch is connected to P2, DPP is
ignored by the SRAM, and the 8051 standard of 64 Kbyte external
data memory access is maintained.
Detailed timing diagrams of external program and data memory
read and write access can be found in the timing specification
sections of this data sheet.
Power-On Reset Operation
External POR (power-on reset) circuitry must be implemented to
drive the RESET pin of the ADuC816. The circuit must hold
the RESET pin asserted (high) whenever the power supply
(DV
DD
) is below 2.5 V. Furthermore, V
DD
must remain above
2.5 V for at least 10 ms before the RESET signal is deasserted
(low) by which time the power supply must have reached at
least a 2.7 V level. The external POR circuit must be opera-
tional down to 1.2 V or less. The timing diagram of Figure 46
illustrates this functionality under three separate events: power-
up, brownout, and power-down. Notice that when RESET is
asserted (high) it tracks the voltage on DV
DD
.
10ms
MIN
1.2V MAX10ms
MIN
2.5V MIN
1.2V MAX
DV
DD
RESET
Figure 46. External POR Timing
The best way to implement an external POR function to meet the
above requirements involves the use of a dedicated POR chip, such
as the ADM809/ADM810 SOT-23 packaged PORs from Analog
Devices. Recommended connection diagrams for both active-high
ADM810 and active-low ADM809 PORs are shown in Figure
47 and Figure 48, respectively.
DVDD
RESET
48
34
20
15
ADuC816
POR
(ACTIVE HIGH)
POWER SUPPLY
Figure 47. External Active High POR Circuit
Some active-low POR chips, such as the ADM809 can be used with
a manual push-button as an additional reset source as illustrated
by the dashed line connection in Figure 48.
DV
DD
RESET
48
34
20
ADuC816
15
OPTIONAL
MANUAL RESET
PUSH-BUTTON
POR
(ACTIVE LOW)
POWER SUPPLY
1k
Figure 48. External Active Low POR Circuit
Power Supplies
The ADuC816’s operational power supply voltage range is 2.7 V
to 5.25 V. Although the guaranteed data sheet specifications are
given only for power supplies within 2.7 V to 3.6 V or +5% of
the nominal 5 V level, the chip will function equally well at any
power supply level between 2.7 V and 5.25 V.
Separate analog and digital power supply pins (AV
DD
and DV
DD
respectively) allow AV
DD
to be kept relatively free of noisy digital
signals often present on the system DVDD line. In this mode the
part can also operate with split supplies; that is, using different
voltage supply levels for each supply. For example, this means that
the system can be designed to operate with a DV
DD
voltage level
of 3 V while the AV
DD
level can be at 5 V or vice-versa if required.
A typical split supply configuration is shown in Figure 49.
DVDD
48
34
20
ADuC816
5
6
AGND
AVDD
–
+
0.1F
10F
ANALOG SUPPLY
10F
DGND
35
21
47
0.1F
–
+
DIGITAL SUPPLY
Figure 49. External Dual Supply Connections
Rev. B
ADuC816
–64–
As an alternative to providing two separate power supplies, AV
DD
quiet by placing a small series resistor and/or ferrite bead between
it and DV
DD
, and then decoupling AV
DD
separately to ground. An
example of this configuration is shown in Figure 50. With this
configuration other analog circuitry (such as op amps, voltage
reference, etc.) can be powered from the AV
DD
supply line as well.
DVDD
48
34
20
ADuC816
5
6
AGND
AVDD 0.1F
10F
DGND
35
21
47
0.1F
–
+
DIGITAL SUPPLY
10F
1.6
BEAD
Figure 50. External Single Supply Connections
Notice that in both Figure 49 and Figure 50, a large value (10 μF)
reservoir capacitor sits on DV
DD
and a separate 10 μF capacitor
sits on AV
DD
. Also, local small-value (0.1 μF) capacitors are
located at each VDD pin of the chip. As per standard design prac-
tice, be sure to include all of these capacitors, and ensure the
smaller capacitors are closest to each AV
DD
pin with trace lengths
as short as possible. Connect the ground terminal of each of these
capacitors directly to the underlying ground plane. Finally, it
should also be noticed that, at all times, the analog and digital
ground pins on the ADuC816 should be referenced to the same
system ground reference point.
Power Consumption
The “CORE” values given represent the current drawn by DV
DD
,
while the rest (“ADC” and “DAC”) are pulled by the AV
DD
pin
and can be disabled in software when not in use. The other
on-chip peripherals (watchdog timer, power supply monitor, etc.)
consume negligible current and are therefore lumped in with the
“CORE” operating current here. Of course, the user must add
any currents sourced by the parallel and serial I/O pins, and that
sourced by the DAC, in order to determine the total current
needed at the ADuC816’s supply pins. Also, current draw from
the DVDD supply will increase by approximately 5 mA during
Flash/EE erase and program cycles
Power-Saving Modes
Setting the Idle and Power-Down Mode bits, PCON.0 and
PCON.1 respectively, in the PCON SFR described in Table II,
allows the chip to be switched from normal mode into idle mode,
and also into full power-down mode.
In idle mode, the oscillator continues to run, but the core clock
generated from the PLL is halted. The on-chip peripherals con-
tinue to receive the clock, and remain functional. The CPU status
is preserved with the stack pointer, program counter, and all other
internal registers maintain their data during idle mode. Port
pins and DAC output pins also retain their states, and ALE
and PSEN outputs go high in this mode. The chip will recover
from idle mode upon receiving any enabled interrupt, or on
receiving a hardware reset.
In power-down mode, both the PLL and the clock to the core
are stopped. The on-chip oscillator can be halted or can continue
to oscillate depending on the state of the oscillator power-down
bit (OSC_PD) in the PLLCON SFR. The TIC, being driven
directly from the oscillator, can also be enabled during power-
down. All other on-chip peripherals however, are shut down.
Port pins retain their logic levels in this mode, but the DAC output
goes to a high-impedance state (three-state) while ALE and
PSEN outputs are held low. During full power-down mode,
the ADuC816 consumes a total of 5 μA typically. There are five
ways of terminating power-down mode:
Asserting the RESET Pin (15)
Returns to normal mode all registers are set to their default state
and program execution starts at the reset vector once the Reset
pin is deasserted.
Cycling Power
All registers are set to their default state and program execution
starts at the reset vector.
Time Interval Counter (TIC) Interrupt
Power-down mode is terminated and the CPU services the TIC
interrupt, the RETI at the end of the TIC Interrupt Service
Routine will return the core to the instruction after that which
enabled power down.
I
2
C or SPI Interrupt
Power-down mode is terminated and the CPU services the I
2
C/
SPI interrupt. The RETI at the end of the ISR will return the
core to the instruction after that which enabled power down. It
should be noted that the I
2
C/SPI power down interrupt enable
bit (SERIPD) in the PCON SFR must first be set to allow this
mode of operation.
INT0 Interrupt
Power-down mode is terminated and the CPU services the INT0
interrupt. The RETI at the end of the ISR will return the core
to the instruction after that which enabled power-down. It
should be noted that the INT0 power-down interrupt enable bit
(INT0PD) in the PCON SFR must first be set to allow this
mode of operation.
Grounding and Board Layout Recommendations
As with all high resolution data converters, special attention must
be paid to grounding and PC board layout of ADuC816-based
designs in order to achieve optimum performance from the ADCs
and DAC.
Although the ADuC816 has separate pins for analog and digital
ground (AGND and DGND), the user must not tie these to two
separate ground planes unless the two ground planes are con-
nected together very close to the ADuC816, as illustrated in the
simplified example of Figure 51a. In systems where digital and
analog ground planes are connected together somewhere else
(at the system’s power supply for example), they cannot be con-
nected again near the ADuC816 since a ground loop would result.
In these cases, tie the ADuC816’s AGND and DGND pins all
to the analog ground plane, as illustrated in Figure 51b. In systems
with only one ground plane, ensure that the digital and analog
components are physically separated onto separate halves of the
board such that digital return currents do not flow near analog
circuitry and vice versa. The ADuC816 can then be placed between
the digital and analog sections, as illustrated in Figure 51c.
Rev. B
ADuC816
–65–
DGND
PLACE ANALOG
COMPONENTS HERE
A
B
C
AGND
DGNDAGND
PLACE DIGITAL
COMPONENTS HERE
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
GND
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
Figure 51. System Grounding Schemes
In all of these scenarios, and in more complicated real-life appli-
cations, keep in mind the flow of current from the supplies and
back to ground. Make sure the return paths for all currents are
as close as possible to the paths the currents took to reach their
destinations. For example, do not power components on the
analog side of Figure 51b with DV
DD
since that would force
return currents from DV
DD
to flow through AGND. Also, try to
avoid digital currents flowing under analog circuitry, which could
happen if the user placed a noisy digital chip on the left half
of the board in Figure 51c. Whenever possible, avoid large
discontinuities in the ground plane(s) (such as are formed by a
long trace on the same layer), since they force return signals to
travel a longer path. And of course, make all connections to the
ground plane directly, with little or no trace separating the pin
from its via to ground.
If the user plans to connect fast logic signals (rise/fall time < 5 ns)
to any of the ADuC816’s digital inputs, add a series resistor to
each relevant line to keep rise and fall times longer than 5 ns at
the ADuC816 input pins. A value of 100 Ω or 200 Ω is usually
sufficient to prevent high-speed signals from coupling capacitively
into the ADuC816 and affecting the accuracy of ADC conversions.
ADuC816 System Self-Identification
In some hardware designs it may be an advantage for the soft-
ware running on the ADuC816 target to identify the host Micro-
Converter. For example, code running on the ADuC816 may be
used at future date to run on an ADuC816 MicroConverter host
and the code may be required to operate differently.
The CHIPID SFR is a read-only register located at SFR address
C2 hex. The top nibble of this byte is set to “1” to designate
an ADuC824 host. For an ADuC824 host, the CHIPID SFR
will contain the value “0” in the upper nibble.
OTHER HARDWARE CONSIDERATIONS
To facilitate in-circuit programming, plus in-circuit debug and
emulation options, users will want to implement some simple
connection points in their hardware that will allow easy access
to download, debug, and emulation modes.
In-Circuit Serial Download Access
Nearly all ADuC816 designs will want to take advantage of the
in-circuit reprogrammability of the chip. This is accomplished by a
connection to the ADuC816’s UART, which requires an external
RS-232 chip for level translation if downloading code from a PC.
Basic configuration of an RS-232 connection is illustrated in
Figure 52 with a simple ADM202-based circuit. If users would
rather not design an RS-232 chip onto a board, refer to the appli-
cation note “uC006–A 4-Wire UART-to-PC Interface”
1
for a
simple (and zero-cost-per-board) method of gaining in-circuit
serial download access to the ADuC816.
NOTE
1
Application note uC006 is available at www.analog.com/microconverter
In addition to the basic UART connections, users will also need
a way to trigger the chip into download mode. This is accom-
plished via a 1 kΩ pull-down resistor that can be jumpered
onto the PSEN pin, as shown in Figure 52. To get the ADuC816
into download mode, simply connect this jumper and power-
cycle the device (or manually reset the device, if a manual reset
button is available) and it will be ready to receive a new program
serially. With the jumper removed, the device will come up in
normal mode (and run the program) whenever power is cycled or
RESET is toggled.
Note that PSEN is normally an output (as described in the Exter-
nal Memory Interface section) and it is sampled as an input only
on the falling edge of RESET (i.e., at power-up or upon an
external manual reset). Note also that if any external circuitry
unintentionally pulls PSEN low during power-up or reset events, it
could cause the chip to enter download mode and therefore fail to
begin user code execution as it should. To prevent this, ensure
that no external signals are capable of pulling the PSEN pin low,
except for the external PSEN jumper itself.
Embedded Serial Port Debugger
From a hardware perspective, entry to serial port debug mode is
identical to the serial download entry sequence described above.
In fact, both serial download and serial port debug modes can be
thought of as essentially one mode of operation used in two
different ways.
Note that the serial port debugger is fully contained on the
ADuC816 device, (unlike “ROM monitor” type debuggers) and
therefore no external memory is needed to enable in-system
debug sessions.
Single-Pin Emulation Mode
Also built into the ADuC816 is a dedicated controller for
single-pin in-circuit emulation (ICE) using standard production
ADuC816 devices. In this mode, emulation access is gained by
connection to a single pin, the EA pin. Normally, this pin is hard-
wired either high or low to select execution from internal or
external program memory space, as described earlier. To enable
single-pin emulation mode, however, users will need to pull the
EA pin high through a 1 kΩ resistor as shown in Figure 52. The
emulator will then connect to the 2-pin header also shown in
Figure 52. To be compatible with the standard connector that
Rev. B
ADuC816
–66–
comes with the single-pin emulator available from Accutron Limited
(www.accutron.com), use a 2-pin 0.1-inch pitch “Friction Lock”
header from Molex (www.molex.com) such as their part number
22-27-2021. Be sure to observe the polarity of this header. As
represented in Figure 52, when the Friction Lock tab is at the
right, the ground pin should be the lower of the two pins (when
viewed from the top).
Enhanced-Hooks Emulation Mode
ADuC816 also supports enhanced-hooks emulation mode. An
enhanced-hooks-based emulator is available from Metalink Corpo-
ration (www.metaice.com). No special hardware support for these
emulators needs to be designed onto the board since these are
“pod-style” emulators where users must replace the chip on
their board with a header device that the emulator pod plugs
into. The only hardware concern is then one of determining if
adequate space is available for the emulator pod to fit into the
system enclosure.
Typical System Configuration
A typical ADuC816 configuration is shown in Figure 52. It sum-
marizes some of the hardware considerations discussed in the
previous paragraphs.
Figure 52 also includes connections for a typical analog measure-
ment application of the ADuC816, namely an interface to an
RTD (Resistive Temperature Device). The arrangement shown
is commonly referred to as a 4-wire RTD configuration.
Here, the on-chip excitation current sources are enabled to excite
the sensor. An external differential reference voltage is generated
by the current sourced through resistor R1. This current also flows
directly through the RTD, which generates a differential voltage
directly proportional to temperature. This differential voltage is
routed directly to the positive and negative inputs of the primary
ADC (AIN1, AIN2 respectively). A second external resistor, R2, is
used to ensure that absolute analog input voltage on the negative
input to the primary ADC stays within that specified for the
ADuC816, i.e., AGND + 100 mV.
C1+
V+
C1–
C2+
C2–
V–
T2OUT
R2IN
VCC
GND
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
ADM202
DVDD
39
40
47 46 44 43 42 41
52 51 50 49 48 45
DVDD 1kDVDD
1k
2-PIN HEADER FOR
EMULATION ACCESS
(NORMALLY OPEN)
DOWNLOAD/DEBUG
ENABLE JUMPER
(NORMALLY OPEN)
32.766kHz
DVDD
1
9-PIN D-SUB
FEMALE
2
3
4
5
6
7
8
9
AVDD
VREF +
VREF –
AIN +
AIN –
200A/400A
EXCITATION
CURRENT
R2
510
RTD
R1
5.6k
AVDD
AGND
P1.2IEXC1/DAC
REFIN–
REFIN+
P1.4/AIN1
P1.5/AIN2
DVDD
DGND
PSEN
EA
DGND
DVDD
XTAL2
XTAL1
RESET
RXD
TXD
DVDD
DGND
ADM810
VCC RST
GND
DVDD
NOT CONNECTED IN THIS EXAMPLE
DVDD
ADuC816
27
34
33
31
30
29
28
38
37
36
35
32
Figure 52. Typical System Configuration
Rev. B
ADuC816
–67–
It should also be noted that variations in the excitation current do
not affect the measurement system, as the input voltage from
the RTD and reference voltage across R1 vary ratiometrically with
the excitation current. Resistor R1 must, however, have a low
temperature coefficient to avoid errors in the reference volt-
age over temperature.
QUICKSTART DEVELOPMENT SYSTEM
The QuickStart Development System is a full featured, low cost
development tool suite supporting the ADuC816. The system
consists of the following PC-based (Windows-compatible) hard-
ware and software development tools.
Hardware: ADuC816 Evaluation Board, Plug-In
Power Supply and Serial Port Cable
Code Development: 8051 Assembler C Compiler
(2 Kcode Limited)
Code Functionality: ADSIM, Windows MicroConverter
Code Simulator
In-Circuit Code Download: Serial Downloader
In-Circuit Debugger: Serial Port Debugger
Misc. Other: CD-ROM Documentation and Two
Additional Prototype Devices
Figures 53 shows the typical components of a QuickStart Devel-
opment System while Figure 54 shows a typical debug session.
A brief description of some of the software tools’ components in
the QuickStart Development System is given below.
Figure 53. Components of the QuickStart Development
System
Download—In-Circuit Serial Downloader
The Serial Downloader is a software program that allows the user
to serially download an assembled program (Intel Hex format file)
to the on-chip program FLASH memory via the serial COM1
port on a standard PC. An Application Note (uC004) detailing
this serial download protocol is available from www.analog.com/
microconverter.
DeBug—In-Circuit Debugger
The Debugger is a Windows application that allows the user to
debug code execution on silicon using the MicroConverter UART
serial port. The debugger provides access to all on-chip periph-
erals during a typical debug session as well as single-step and
break-point code execution control.
ADSIM—Windows Simulator
The Simulator is a Windows application that fully simulates all
the MicroConverter functionality including ADC and DAC
peripherals. The simulator provides an easy-to-use, intuitive, inter-
face to the MicroConverter functionality and integrates many
standard debug features; including multiple breakpoints, single
stepping; and code execution trace capability. This tool can be
used both as a tutorial guide to the part as well as an efficient way
to prove code functionality before moving to a hardware platform.
The QuickStart development tool-suite software is freely
available at the Analog Devices MicroConverter Website
www.analog.com/microconverter.
Figure 54. Typical Debug Session
Rev. B
ADuC816
OUTLINE DIMENSIONS
Figure 55. 52-Lead Metric Quad Flat Package [MQFP]
(S-52-2)
Dimensions shown in millimeters
Figure 56. 56-Lead Lead Frame Chip Scale Package [LFCSP]
8 mm × 8 mm Body and 0.75 mm Package Height
(CP-56-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option Ordering Quantity
ADuC816BSZ –40°C to +85°C S-52-2
ADuC816BSZ-REEL –40°C to +85°C S-52-2 1,000
ADuC816BCPZ –40°C to +85°C CP-56-11
ADuC816BCPZ-REEL –40°C to +85°C
52-Lead Metric Quad Flat Package [MQFP]
52-Lead Metric Quad Flat Package [MQFP]
56-Lead Lead Frame Chip Scale Package [LFCSP]
56-Lead Lead Frame Chip Scale Package [LFCSP] CP-56-11 1,000
1 Z = RoHS Compliant Part.
–68– Rev. B
Data Sheet ADuC816
REVISION HISTORY
8/2016—Rev. A to Rev. B
Updated Outline Dimensions ....................................................... 68
Changes to Ordering Guide ......................................................... 68
©2001–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00436-0-8/16(B)
