Walsin Technology Corporation
Page 5 of 7 AS_2.4GHz 3225BPF_A3_03 JULY-2002
RELIABILITY TEST
n Mechanical performance
Test item Test condition / Test method Specification
Solderability Solder temp. : 235 ± 5°C
Immersion time: 2 ± 1 sec
Solder: SN63
At least 95% of a surface of
each terminal electrode must
be covered by fresh solder.
Resistance to soldering heat Solder: Sn63
Preheating temperature: 150 ± 10°C
Solder Temperature: 260 ± 5°C
Immersion time: 10 ± 1 sec
Measurement to be made after keeping at room
temp. for 24±2 hrs.
No mechanical damage.
Ceramic surface shall not be
exposed in the middle of the
termination or on the
terminated product edge by
leaching.
Drop Test Height : 75 cm
Direction : 3 directions
Times : 3 times for each direction.
No mechanical damage.
Samples shall satisfy
electrical specification after
test.
n Environmental characteristics
Test item Test condition / Test method Specification
Humidity (steady conditions) Humidity:90% to 95% R.H.
Tempertaure:40±2°C
Time: 500±24 hours.
Measurement: After placing for 24 hours Minimum.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Temperature cycle 1. 30±3 minutes at -40°C±3°C,
2. 10~15 minutes at room temperature,
3. 30±3 minutes at +85°±3°C,
4. 10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement after placing for 48±2 hrs min.
No mechanical damage.
Samples shall satisfy
electrical specification after
test.
High temperature Temperature: 85°C±2°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Low temperature Temperature: -40°C±3°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.