January 2018 Rev. 181/60
1
NAND128-A NAND256-A
128-Mbit or 256-Mbit, 528-byte/264-word page,
3 V, SLC NAND flash memories
Features
• High density NAND flash memories
– Up to 256-Mbit memory array
– Up to 32-Mbit spare area
– Cost effective solutions for mass storage
applications
•NAND interface
–x8 or x16 bus width
– Multiplexed address/ data
– Pinout compatibility for all densities
• Supply voltage
–V
DD = 2.7 to3.6 V
•Page size
– x8 device: (512 + 16 spare) bytes
– x16 device: (256 + 8 spare) words
•Block size
– x8 device: (16 K + 512 spare) bytes
– x16 device: (8 K + 256 spare) words
• Page read/program
– Random access: 12 µs (3V)/15 us (1.8V)
(max)
– Sequential access: 50 ns (min)
– Page program time: 200 µs (typ)
• Copy back program mode
– Fast page copy without external buffering
• Fast block erase
– Block erase time: 2 ms (typical)
• Status register
• Electronic signature
• Chip enable ‘don’t care’
–Simple interface with microcontroller
• Security features
–OTP area
– Serial number (unique ID)
• Hardware data protection
–Program/erase locked during power
transitions
• Data integrity
– 100,000 program/erase cycles
– 10 years data retention
• RoHS compliance
– Lead-free components are compliant with
the RoHS directive
•Development tools
– Error correction code software and
hardware models
– Bad blocks management and wear leveling
algorithms
– File system OS native reference software
– Hardware simulation models
TSOP48 12 x 20mm
FBGA
VFBGA55 8 x 10 x 1.05mm
www.numonyx.com
Contents NAND128-A, NAND256-A
2/60
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
2 Memory array organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.1 Bad Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
3.1 Inputs/outputs (I/O0-I/O7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2 Inputs/outputs (I/O8-I/O15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3 Address Latch Enable (AL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4 Command Latch Enable (CL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.5 Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.6 Read Enable (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.7 Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8 Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.9 Ready/Busy (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.10 VDD supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.11 VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4 Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
4.1 Command input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2 Address input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.3 Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 Data output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.5 Write protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6 Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5 Command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
6 Device operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
6.1 Pointer operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.2 Read memory array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.3 Page program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
NAND128-A, NAND256-A Contents
3/60
6.4 Copy back program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.5 Block erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.6 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
6.7 Read status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.7.1 Write Protection Bit (SR7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
6.7.2 P/E/R controller bit (SR6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
6.7.3 Error bit (SR0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
6.8 Read electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7 Software algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
7.1 Bad block management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.2 Block replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.3 Garbage collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.4 Wear-leveling algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.5 Error correction code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.6 Hardware simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.6.1 Behavioral simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
7.6.2 IBIS simulations models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
8 Program and erase times and endurance cycles . . . . . . . . . . . . . . . . . . . . . .35
9 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
10 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
10.1 Ready/busy signal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10.2 Data protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
11 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
12 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Appendix A Hardware interface examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
List of tables NAND128-A, NAND256-A
4/60
List of tables
Table 1. NAND128-A and NAND256-A device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 2. Product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 3. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 4. Valid blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Table 5. Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 6. Address insertion, x8 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 7. Address insertion, x16 device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Table 8. Address definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Table 9. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 10. Copy back program addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Table 11. Status register bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Table 12. Electronic signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Table 13. Block failure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Table 14. Program, erase times and program erase endurance cycles. . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 15. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Table 16. Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Table 17. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Table 18. DC characteristics, 1.8 V devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 19. DC characteristics, 3 V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Table 20. AC characteristics for command, address, data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Table 21. AC characteristics for operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Table 22. TSOP48 - 48 lead plastic thin small outline, 12 x 20mm, package mechanical data . . . . . .52
Table 23. VFBGA 8 x 10 x 1.05 mm- 6 x 8 + 7 ball array, 0.8 pitch, package mechanical data . . . . . . .54
Table 24. Ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Table 25. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
NAND128-A, NAND256-A List of figures
5/60
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Figure 2. Logic block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Figure 3. TSOP48 connections, x8 devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Figure 4. TSOP48 connections, x16 devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Figure 5. VFBGA55 connections, x8 devices (top view through package). . . . . . . . . . . . . . . . . . . . . . . .12
Figure 6. VFBGA55 connections, x16 devices (top view through package) . . . . . . . . . . . . . . . . . . . . . .13
Figure 7. Memory array organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 8. Pointer operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Figure 9. Pointer operations for programming. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Figure 10. Read (A, B, C) operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Figure 11. Read block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Figure 12. Sequential row read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Figure 13. Sequential row read block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Figure 14. Page program operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Figure 15. Copy back operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Figure 16. Block erase operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Figure 17. Bad block management flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Figure 18. Garbage collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Figure 19. Error detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Figure 20. Equivalent testing circuit for AC characteristics measurement. . . . . . . . . . . . . . . . . . . . . . . .38
Figure 21. Command latch AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Figure 22. Address latch AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Figure 23. Data input latch AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Figure 24. Sequential data output after read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Figure 25. Read status register AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Figure 26. Read electronic signature AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Figure 27. Page read A/read B operation AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Figure 28. Read C operation, one page AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Figure 29. Page program AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Figure 30. Block erase AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Figure 31. Reset AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Figure 32. Ready/Busy AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Figure 33. Ready/busy load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Figure 34. Resistor value versus waveform timings for Ready/Busy signal . . . . . . . . . . . . . . . . . . . . . . .49
Figure 35. Data protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Figure 36. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . . .51
Figure 37. VFBGA55 8 x 10 mm - 6 x 8 active ball array, 0.80 mm pitch, package outline . . . . . . . . . . .53
Figure 38. Connection to microcontroller, without glue logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Figure 39. Connection to microcontroller, with glue logic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Figure 40. Building storage modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this
document, including without limitation specifications and product descriptions. This document
supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any
information set forth in this document if you obtain the product described herein from any unauthorized
distributor or other source not authorized by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications
unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor
and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron
harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of,
directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting
directly or indirectly from any use of nonautomotive-grade products in automotive applications.
Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and
any customer of distributor/customer (1) state that Micron products are not designed or intended for use
in automotive applications unless specifically designated by Micron as automotive-grade by their
respective data sheets and (2) require such customer of distributor/customer to indemnify and hold
Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees
arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property
damage resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron
component could result, directly or indirectly in death, personal injury, or severe property or
environmental damage ("Critical Applications"). Customer must protect against death, personal injury,
and severe property and environmental damage by incorporating safety design measures into
customer's applications to ensure that failure of the Micron component will not result in such harms.
Should customer or distributor purchase, use, or sell any Micron component for any critical application,
customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors,
and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and
expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability,
personal injury, or death arising in any way out of such critical application, whether or not Micron or its
subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of
their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS
HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE
RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR
THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate
design, manufacturing, and operating safeguards are included in customer's applications and products to
eliminate the risk that personal injury, death, or severe property or environmental damages will result
from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or
consequential damages (including without limitation lost profits, lost savings, business interruption, costs
related to the removal or replacement of any products or rework charges) whether or not such damages
are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written
agreement executed by Micron's duly authorized representative.
Description NAND128-A, NAND256-A
6/60
1 Description
The NAND flash 528 byte/ 264 word page is a family of non-volatile flash memories that
uses the single level cell (SLC) NAND cell technology, referred to as the SLC small page
family. The devices are either 128 Mbits or 256 Mbits and operate with a 3 V voltage supply.
The size of a page is either 528 bytes (512 + 16 spare) or 264 words (256 + 8 spare)
depending on whether the device has a x8 or x16 bus width.
The address lines are multiplexed with the data input/output signals on a multiplexed x8
or x16 input/output bus. This interface reduces the pin count and makes it possible to
migrate to other densities without changing the footprint.
Each block can be programmed and erased up to 100,000 cycles. To extend the lifetime of
NAND flash devices it is strongly recommended to implement an error correction code
(ECC). A Write Protect pin is available to provide hardware protection against program
and erase operations.
The devices feature an open-drain ready/busy output that identifies if the program/erase/
read (P/E/R) controller is currently active. The use of an open-drain output allows the
Ready/Busy pins from several memories to be connected to a single pull-up resistor.
A Copy Back command is available to optimize the management of defective blocks.
When a page program operation fails, the data can be programmed in another page
without having to resend the data to be programmed.
Table 1 lists the individual part numbers of the device.
The NAND128-A devices are only available in the TSOP48 (12 x 20 mm), while the
NAND256-A devices are available in both the TSOP48 and the VFBGA55 (8 x 10 x
1.05 mm) packages.
The devices are available in two different versions:
• No option (Chip Enable ‘care’, sequential row read enabled): the sequential row read
feature allows to download up to all the pages in a block with one read command and
addressing only the first page to read
• With Chip Enable ‘don’t care’ feature. This enables the sharing of the bus between
more active memories that are simultaneously active as Chip Enable transitions
during latency do not stop read operations. Program and erase operations are not
interrupted by Chip Enable transitions.
Table 1. NAND128-A and NAND256-A device summary
Reference Part Number
NAND128-A NAND128W3A
NAND256-A(1)
1. x16 organization only available for MCP.
NAND256W3A
NAND256W4A
NAND128-A, NAND256-A Description
7/60
The devices come with the following security features:
• OTP (one time programmable) area, which is a restricted access area where sensitive
data/code can be stored permanently. The access sequence and further details about
this feature are subject to an NDA (non disclosure agreement)
• Serial number (unique identifier), which enables each device to be uniquely
identified. It is subject to an NDA and is, therefore, not described in the datasheet.
For more details about these security features, contact your nearest Micron sales office.
For information on how to order these devices, refer to Table 24: Ordering information
scheme. Devices are shipped from the factory with Block 0 always valid and the memory
content bits in valid blocks erased to ’1’.
See Table 2 for all the devices available in the family.
Table 2. Product description
Reference
Part Number
Density
Bus Width
Page
Size
Block
Size
Memory Array
Operating Voltage
Timings
Package
Rand Access Max
Seq Access
Min
Page Program
Typi cal
Block Erase
Typi cal
NAND128-A NAND128W3A 128
Mbit x8 512+16
Bytes
16K+51
2 Bytes
32 pages
x 1024
Blocks
2.7 to 3.6V 12µs 50ns 200µs 2ms
TSOP48
NAND256-A(1)
NAND256W3A
256
Mbit
x8 512+16
Bytes
16K+51
2 Bytes 32 pages
x 2048
Blocks
TSOP48
VFBGA55
NAND256W4A x16 256+8
Words
8K+256
Words
1. x16 organization only available for MCP.
Description NAND128-A, NAND256-A
8/60
Figure 1. Logic diagram
Table 3. Signal names
Symbol Function
I/O8-15 Data input/outputs for x16 devices
I/O0-7 Data input/outputs, address inputs, or command inputs for x8 and x16 devices
AL Address Latch Enable
CL Command Latch Enable
E Chip Enable
R Read Enable
RB Ready/Busy (open-drain output)
W Write Enable
WP Write Protect
VDD Supply voltage
VSS Ground
NC Not connected internally
DU Do not use
AI07557C
W
I/O8-I/O15, x16
VDD
NAND Flash
E
VSS
WP
AL
CL
RB
RI/O0-I/O7, x8/x16
NAND128-A, NAND256-A Description
9/60
Figure 2. Logic block diagram
Address
Register/Counter
Command
Interface
Logic
P/E/R Controller,
High V oltage
Generator
WP
I/O Buffers & Latches
I/O8-I/O15, x16
E
W
AI07561c
R
Y Decoder
Page Buffer
NAND Flash
Memory Array
X Decoder
I/O0-I/O7, x8/x16
Command Register
CL
AL
RB
Description NAND128-A, NAND256-A
10/60
Figure 3. TSOP48 connections, x8 devices
1. This pin is DU in the USOP48 package
I/O3
I/O2
I/O6
R
RB
NC
I/O4
I/O7
AI07585C
NAND Flash
(x8)
12
1
13
24 25
36
37
48
E
I/O1
NC
NC
NC
NC
NC
NC
NC
WP
W
NC
NC
NC
VSS
VDD
AL
NC
NC
CL
NC
I/O5
NC
NC
NC
I/O0
NC
NC
NC
NC
NC
VDD
NC
NC
NC
VSS
NC
NC
NC
NC
(1)
(1)
(1)
(1)
NAND128-A, NAND256-A Description
11/60
Figure 4. TSOP48 connections, x16 devices
1. This pin is DU in the USOP48 package.
I/O3
I/O9
I/O2
I/O6
R
RB
NC
I/O14
I/O12
I/O10
I/O4
I/O7
AI07559C
NAND Flash
(x16)
12
1
13
24 25
36
37
48
I/O8
E
I/O1
I/O11
NC
NC
NC
NC
NC
NC
NC
WP
W
NC
NC
NC
VSS
VDD
AL
NC
NC
CL
NC
I/O13
I/O15
I/O5
VSS
NC
VSS
I/O0
NC
NC
NC
NC
NC
VDD
(1)
(1)
(1)
(1)
Description NAND128-A, NAND256-A
12/60
Figure 5. VFBGA55 connections, x8 devices (top view through package)
AI09366b
I/O7
WP
I/O4I/O3
NC VDD
I/O5VDD
NC
H
VSS
I/O6
D
E
CL
C
NC
NC
BDU
NC
W
NC
A
87654321
NCNC
NC NC
G
F
E
I/O0
AL
NC NC
NC
NCNC NC NCNC
NCNC
VSS
NCNC
NC NC
RB
I/O2
NC
DU
I/O1
R
NC
NC
NC
VSS
DU
DU
DUDU
DU
M
L
K
J
NAND128-A, NAND256-A Description
13/60
Figure 6. VFBGA55 connections, x16 devices (top view through package)
AI09365b
I/O15
WP
I/O4I/O11
I/O10 VDD
I/O6VDD
I/O3
H
VSS
I/O13
D
E
CL
C
NC
NC
BDU
NC
W
NC
A
87654321
NCNC
NC NC
G
F
E
I/O1
AL
NC NC
NC
NCNC NC I/O7I/O5
I/O14I/O12
VSS
NCNC
NC NC
RB
I/O2
I/O0
DU
I/O9
R
NC
NC
I/O8
VSS
DU
DU
DUDU
DU
M
L
K
J
Memory array organization NAND128-A, NAND256-A
14/60
2 Memory array organization
The memory array comprises NAND structures where 16 cells are connected in series.
The memory array is organized in blocks where each block contains 32 pages. The array is
split into two areas, the main area and the spare area. The main area of the array stores
data, whereas the spare area is typically used to store error correction codes, software flags
or bad block identification.
In x8 devices the pages are split into a main area with two half pages of 256 bytes each and
a spare area of 16 bytes. In the x16 devices the pages are split into a 256-word main area
and an 8-word spare area. Refer to Figure 7: Memory array organization.
2.1 Bad Blocks
The NAND flash 528 byte/ 264 word page devices may contain bad blocks, that is blocks
that contain one or more invalid bits whose reliability is not guaranteed. Additional bad
blocks may develop during the lifetime of the device.
The bad block information is written prior to shipping (refer to Section 2.1: Bad Blocks for
more details).
Table 4 shows the minimum number of valid blocks in each device. The values shown
include both the bad blocks that are present when the device is shipped and the bad
blocks that could develop later on.
These blocks need to be managed using bad blocks management, block replacement or
error correction codes (refer to Section 7: Software algorithms).
Table 4. Valid blocks
Density of device Minimum Maximum
256 Mbits 2008 2048
128 Mbits 1004 1024
NAND128-A, NAND256-A Memory array organization
15/60
Figure 7. Memory array organization
AI07587
Block = 32 Pages
Page = 528 Bytes (512+16)
512 Bytes
512 Bytes
Spare Area
2nd half Page
(256 bytes)
16
Bytes
Block
8 bits
16
Bytes
8 bits
Page
Page Buffer, 512 Bytes
1st half Page
(256 bytes)
Block = 32 Pages
Page = 264 Words (256+8)
256 Words
256 Words
Spare Area
Main Area
8
Words
16 bits
8
Words 16 bits
Page Buffer, 264 Words
Block
Page
x8 DEVICES x16 DEVICES
Signal descriptions NAND128-A, NAND256-A
16/60
3 Signal descriptions
See Figure 1: Logic diagram and Table 3: Signal names for a brief overview of the signals
connected to this device.
3.1 Inputs/outputs (I/O0-I/O7)
Input/Outputs 0 to 7 input the selected address, output the data during a read operation
or input a command or data during a write operation. The inputs are latched on the rising
edge of Write Enable. I/O0-I/O7 are left floating when the device is deselected or the
outputs are disabled.
3.2 Inputs/outputs (I/O8-I/O15)
Input/outputs 8 to 15 are only available in x16 devices. They output the data during a read
operation or input data during a write operation. Command and address inputs only
require I/O0 to I/O7.
The inputs are latched on the rising edge of Write Enable. I/O8-I/O15 are left floating
when the device is deselected or the outputs are disabled.
3.3 Address Latch Enable (AL)
Address Latch Enable activates the latching of the address inputs in the command
interface. When AL is high, the inputs are latched on the rising edge of Write Enable.
3.4 Command Latch Enable (CL)
The Command Latch Enable activates the latching of the command inputs in the
command interface. When CL is high, the inputs are latched on the rising edge of Write
Enable.
3.5 Chip Enable (E)
The Chip Enable input activates the memory control logic, input buffers, decoders and
read circuitry. When Chip Enable is low, VIL, the device is selected. If Chip Enable goes
High (VIH) while the device is busy, the device remains selected and does not go into
standby mode.
3.6 Read Enable (R)
Read Enable, R, controls the sequential data output during read operations. Data is valid
tRLQV after the falling edge of R. The falling edge of R also increments the internal column
address counter by one.
NAND128-A, NAND256-A Signal descriptions
17/60
3.7 Write Enable (W)
The Write Enable input, W, controls writing to the Command Interface, Input Address and
Data latches. Both addresses and data are latched on the rising edge of Write Enable.
During power-up and power-down a recovery time of 10µs (min) is required before the
Command Interface is ready to accept a command. It is recommended to keep Write
Enable high during the recovery time.
3.8 Write Protect (WP)
The Write Protect pin is an input that provides hardware protection against unwanted
program or erase operations. When Write Protect is Low, VIL, the device does not accept
any program or erase operations.
It is recommended to keep the Write Protect pin Low, VIL, during power-up and power-
down.
3.9 Ready/Busy (RB)
The Ready/Busy output, RB, is an open-drain output that can be used to identify if the
P/E/R controller is currently active.
When Ready/Busy is Low, VOL, a read, program or erase operation is in progress. When the
operation completes Ready/Busy goes High, VOH.
The use of an open-drain output allows the Ready/Busy pins from several memories to be
connected to a single pull-up resistor. A Low then indicates that one or more of the
memories is busy.
Refer to the Section 10.1: Ready/busy signal electrical characteristics for details on how to
calculate the value of the pull-up resistor.
3.10 VDD supply voltage
VDD provides the power supply to the internal core of the memory device. It is the main
power supply for all operations (read, program and erase).
An internal voltage detector disables all functions whenever VDD is below the VLKO
threshold (see paragraph Figure 35: Data protection) to protect the device from any
involuntary program/erase operations durings power-transitions.
Each device in a system should have VDD decoupled with a 0.1 µF capacitor. The PCB track
widths should be sufficient to carry the required program and erase currents
3.11 VSS ground
Ground, VSS, is the reference for the power supply. It must be connected to the system
ground.
Bus operations NAND128-A, NAND256-A
18/60
4 Bus operations
There are six standard bus operations that control the memory. Each of these is described
in this section, see Table 5: Bus operations for a summary.
4.1 Command input
Command input bus operations give commands to the memory. Commands are accepted
when Chip Enable is Low, Command Latch Enable is High, Address Latch Enable is Low,
and Read Enable is High. They are latched on the rising edge of the Write Enable signal.
Only I/O0 to I/O7 input commands.
See Figure 21: Command latch AC waveforms and Table 14: Program, erase times and
program erase endurance cycles for details of the timings requirements.
4.2 Address input
Address input bus operations input the memory address. Three bus cycles are required to
input the addresses (refer to Tables Table 6: Address insertion, x8 devices and Table 7:
Address insertion, x16 device).
The addresses are accepted when Chip Enable is Low, Address Latch Enable is High,
Command Latch Enable is Low, and Read Enable is High. They are latched on the rising
edge of the Write Enable signal. Only I/O0 to I/O7 input addresses.
See Figure 22: Address latch AC waveforms and Table 14: Program, erase times and program
erase endurance cycles for details of the timings requirements.
4.3 Data input
Data input bus operations input the data to be programmed.
Data is accepted only when Chip Enable is Low, Address Latch Enable is Low, Command
Latch Enable is Low, and Read Enable is High. The data is latched on the rising edge of the
Write Enable signal and is input sequentially using the Write Enable signal.
See Figure 23: Data input latch AC waveforms and Table 14: Program, erase times and
program erase endurance cycles and Table 21: AC characteristics for operations for details of
the timings requirements.
NAND128-A, NAND256-A Bus operations
19/60
4.4 Data output
Data output bus operations read the data in the memory array, the status register, the
electronic signature, and the serial number.
Data is output when Chip Enable is Low, Write Enable is High, Address Latch Enable is
Low, and Command Latch Enable is Low.
The data is output sequentially using the Read Enable signal.
See Figure 24: Sequential data output after read AC waveforms and Table 21: AC
characteristics for operations for details of the timings requirements.
4.5 Write protect
Write protect bus operations protect the memory against program or erase operations.
When the Write Protect signal is Low the device does not accept program or erase
operations, therefore, the contents of the memory array cannot be altered. The Write
Protect signal is not latched by Write Enable to ensure protection, even during power-up.
4.6 Standby
When Chip Enable is High the memory enters standby mode: the device is deselected,
outputs are disabled and power consumption is reduced.
Table 5. Bus operations
Bus operation E AL CL R W WP I/O0 - I/O7 I/O8 -
I/O15(1)
1. Only for x16 devices.
Command input VIL VIL VIH VIH Rising X(2)
2. WP must be VIH when issuing a program or erase command.
Command X
Address input VIL VIH VIL VIH Rising X Address X
Data input VIL VIL VIL VIH Rising X Data input Data input
Data output VIL VIL VIL
Fallin
gVIH X Data output Data output
Write protectXXXX X V
IL XX
Standby VIH XXX X X X X
Table 6. Address insertion, x8 devices(1) (2)
1. A8 is set Low or High by the 00h or 01h command ( see Section 6.1: Pointer operations)
2. Any additional address input cycles are ignored.
Bus
Cycle I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
1st A7 A6 A5 A4 A3 A2 A1 A0
2nd A16 A15 A14 A13 A12 A11 A10 A9
3rd A24 A23 A22 A21 A20 A19 A18 A17
Bus operations NAND128-A, NAND256-A
20/60
Table 7. Address insertion, x16 device(1) (2) (3)
1. A8 is ’don’t care’ in x16 devices.
2. Any additional address input cycles are ignored.
3. The 01h command is not used in x16 devices
Bus
Cycle
I/O8-
I/O15 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
1st XA7 A6 A5 A4 A3 A2 A1 A0
2nd XA16 A15 A14 A13 A12 A11 A10 A9
3rd XA24 A23 A22 A21 A20 A19 A18 A17
Table 8. Address definitions
Address Definition
A0 - A7 Column address
A9 - A26 Page address
A9 - A13 Address in block
A14 - A26 Block address
A8 A8 is set Low or High by the 00h or 01h command, and is ’don’t care’ in x16
devices
NAND128-A, NAND256-A Command set
21/60
5 Command set
All bus write operations to the device are interpreted by the command interface. The
commands are input on I/O0-I/O7 and are latched on the rising edge of Write Enable
when the Command Latch Enable signal is high. Device operations are selected by writing
specific commands to the command register. The two-step command sequences for
program and erase operations are imposed to maximize data security.
The commands are summarized in Table 9.
Table 9. Commands
Command
Bus write operations(1) (2)
1. The bus cycles are only shown for issuing the codes. The cycles required to input the
addresses or input/output data are not shown.
2. Any undefined command sequence is ignored by the device.
Command
accepted
during busy
1st cycle 2nd cycle 3rd cycle
Read A 00h - -
Read B 01h(2) - -
Read C 50h - -
Read Electronic Signature 90h - -
Read Status Register 70h - - Yes
Page Program 80h 10h -
Copy Back Program 00h 8Ah 10h
Block Erase 60h D0h -
Reset FFh - - Yes
Device operations NAND128-A, NAND256-A
22/60
6 Device operations
6.1 Pointer operations
As the NAND flash memories contain two different areas for x16 devices and three
different areas for x8 devices (see Figure 8) the read command codes (00h, 01h, 50h) act as
pointers to the different areas of the memory array (they select the most significant
column address).
The Read A and Read B commands act as pointers to the main memory area. Their use
depends on the bus width of the device.
• In x16 devices the Read A command (00h) sets the pointer to Area A (the whole of the
main area), that is words 0 to 255.
• In x8 devices the Read A command (00h) sets the pointer to Area A (the first half of the
main area), that is bytes 0 to 255, and the Read B command (01h) sets the pointer to
Area B (the second half of the main area), that is bytes 256 to 511.
In both the x8 and x16 devices the Read C command (50h) acts as a pointer to Area C (the
spare memory area), that is bytes 512 to 527 or words 256 to 263.
Once the Read A and Read C commands have been issued the pointer remains in the
respective areas until another pointer code is issued. However, the Read B command is
effective for only one operation, once an operation has been executed in Area B the
pointer returns automatically to Area A.
The pointer operations can also be used before a program operation, that is the
appropriate code (00h, 01h or 50h) can be issued before the program command 80h is
issued (see Figure 9: Pointer operations for programming).
Figure 8. Pointer operations
AI07592
Area A
(00h)
A
Area B
(01h) Area C
(50h)
Bytes 0- 255 Bytes 256-511 Bytes 512
-527
CB
Pointer
(00h,01h,50h)
Page Buffer
Area A
(00h)
A
Area C
(50h)
Words 0- 255 Words 256
-263
C
Pointer
(00h,50h)
Page Buffer
x8 Devices x16 Devices
NAND128-A, NAND256-A Device operations
23/60
Figure 9. Pointer operations for programming
6.2 Read memory array
Each operation to read the memory area starts with a pointer operation as shown in the
Section 6.1: Pointer operations. Once the area (main or spare) has been selected using the
Read A, Read B or Read C commands three bus cycles are required to input the address of
the data to be read.
The device defaults to Read A mode after power-up or a reset operation.
When reading the following spare area addresses:
• A0 to A3 (x8 devices)
• A0 to A2 (x16 devices)
set the start address of the spare area, while the following addresses are ignored:
• A4 to A7 (x8 devices)
• A3 to A7 (x16 devices)
Once the Read A or Read C commands have been issued they do not need to be reissued
for subsequent read operations as the pointer remains in the respective area. However, the
Read B command is effective for only one operation; once an operation has been executed
in Area B the pointer returns automatically to Area A. Another Read B command is
required to start another read operation in Area B.
Once a read command is issued two types of operations are available: random read and
page read.
•Random read
Each time the command is issued the first read is random read.
• Page read
After the random read access the page data is transferred to the page buffer in a time
of tWHBH (refer to Table 21: AC characteristics for operations for the value). Once the
transfer is complete the Ready/Busy signal goes High. The data can then be read out
sequentially (from the selected column address to the last column address) by
pulsing the Read Enable signal.
•Sequential row read
After the data in last column of the page is output, if the Read Enable signal is pulsed
ai07591
I/O Address
Inputs Data Input 10h
80h
Areas A, B, C can be programmed depending on how much data is input. Subsequent 00h commands can be omitted.
AREA A
00h Address
Inputs Data Input 10h
80h
00h
I/O Address
Inputs Data Input 10h
80h
Areas B, C can be programmed depending on how much data is input. The 01h command must be re-issued before each program.
AREA B
01h Address
Inputs Data Input 10h
80h
01h
I/O Address
Inputs Data Input 10h
80h
Only Areas C can be programmed. Subsequent 50h commands can be omitted.
AREA C
50h Address
Inputs Data Input 10h
80h
50h
Device operations NAND128-A, NAND256-A
24/60
and Chip Enable remains Low, then the next page is automatically loaded into the
page buffer and the read operation continues. A sequential row read operation can
only be used to read within a block. If the block changes a new read command must
be issued. Refer to Figure 12: Sequential row read operations and Figure 13: Sequential
row read block diagrams for details about sequential row read operations. To
terminate a sequential row read operation, set to High the Chip Enable signal for
more than tEHEL. Sequential row read is not available when the Chip Enable don’t care
option is enabled.
Figure 10. Read (A, B, C) operations
Figure 11. Read block diagrams
1. The highest address depends on the device density.
CL
E
W
AL
R
I/O
RB
00h/
01h/ 50h
ai07595c
Busy
Command
Code
Address Input Data Output (sequentially)
tBLBH1
(read)
AI07596
A0-A7
A9-A26(1)
Area A
(1st half Page)
Read A Command, X8 Devices
Area B
(2nd half Page) Area C
(Spare) Area A
(main area) Area C
(Spare)
A0-A7
Read A Command, X16 Devices
A0-A7
Read B Command, X8 Devices
Area A
(1st half Page) Area B
(2nd half Page) Area C
(Spare)
A0-A3 (x8)
A0-A2 (x16)
Read C Command, X8/x16 Devices
Area A Area A/ B Area C
(Spare)
A9-A26(1)
A9-A26(1)
A9-A26(1)
A4-A7 (x8), A3-A7 (x16) are don't care
NAND128-A, NAND256-A Device operations
25/60
Figure 12. Sequential row read operations
Figure 13. Sequential row read block diagrams
I/O
RB
Address Inputs
ai07597
1st
Page Output
Busy
tBLBH1
(Read Busy time)
00h/
01h/ 50h
Command
Code
2nd
Page Output Nth
Page Output
BusyBusy
tBLBH1 tBLBH1
AI07598
Block
Area A
(1st half Page)
Read A Command, x8 Devices
Area B
(2nd half Page) Area C
(Spare) Area A
(main area) Area C
(Spare)
Read A Command, x16 Devices
Read B Command, x8 Devices Read C Command, x8/x16 Devices
Area A Area A/ B Area C
(Spare)
Area A
(1st half Page) Area B
(2nd half Page) Area C
(Spare)
1st page
2nd page
Nth page
1st page
2nd page
Nth page
1st page
2nd page
Nth page
1st page
2nd page
Nth page
Block
Block
Block
Device operations NAND128-A, NAND256-A
26/60
6.3 Page program
The page program operation is the standard operation to program data to the memory
array.
The main area of the memory array is programmed by page, however partial page
programming is allowed where any number of bytes (1 to 528) or words (1 to 264) can be
programmed.
The maximum number of consecutive partial page program operations allowed in the
same page is three. After exceeding this a Block Erase command must be issued before any
further program operations can take place in that page.
Before starting a page program operation a pointer operation can be performed to point
to the area to be programmed. Refer to Section 6.1: Pointer operations and Figure 9: Pointer
operations for programming for details.
Each page program operation consists of the following five steps (see Figure 14: Page
program operation):
1. One bus cycle is required to setup the Page Program command
2. Four bus cycles are then required to input the program address (refer to Table 6:
Address insertion, x8 devices)
3. The data is then input (up to 528 bytes/ 264 words) and loaded into the page buffer
4. One bus cycle is required to issue the confirm command to start the P/E/R controller.
5. The P/E/R controller then programs the data into the array.
Once the program operation has started the status register can be read using the Read
Status Register command. During program operations the status register only flags errors
for bits set to '1' that have not been successfully programmed to '0'.
During the program operation, only the Read Status Register and Reset commands are
accepted; all other commands are ignored.
Once the program operation has completed the P/E/R controller bit SR6 is set to ‘1’ and
the Ready/Busy signal goes High.
The device remains in read status register mode until another valid command is written to
the command interface.
Figure 14. Page program operation
1. Before starting a page program operation a pointer operation can be performed. Refer to
Section 6.1: Pointer operations for details.
I/O
RB
Address Inputs SR0
ai07566
Data Input 10h 70h
80h
Page Program
Setup Code Confirm
Code Read Status Register
Busy
tBLBH2
(Program Busy time)
NAND128-A, NAND256-A Device operations
27/60
6.4 Copy back program
The copy back program operation copies the data stored in one page and reprogram it in
another page.
The copy back program operation does not require external memory and so the operation
is faster and more efficient because the reading and loading cycles are not required. The
operation is particularly useful when a portion of a block is updated and the rest of the
block needs to be copied to the newly assigned block.
If the copy back program operation fails an error is signalled in the status register.
However, as the standard external ECC cannot be used with the copy back operation bit
error due to charge loss cannot be detected. For this reason it is recommended to limit the
number of copy back operations on the same data and or to improve the performance of
the ECC.
The copy back program operation requires the following three steps:
1. The source page must be read using the Read A command (one bus write cycle to
setup the command and then 4 bus write cycles to input the source page address).
This operation copies all 264 words/ 528 bytes from the page into the page buffer.
2. When the device returns to the ready state (Ready/Busy High), the second bus write
cycle of the command is given with the 4 bus cycles to input the target page address.
Refer to Table 10 for the addresses that must be the same for the source and target
pages.
3. Then the confirm command is issued to start the P/E/R controller.
After a copy back program operation, a partial-page program is not allowed in the target
page until the block has been erased. See Figure 15 for an example of the copy back
operation.
Figure 15. Copy back operation
Table 10. Copy back program addresses
Density Same address for source and target pages
128 Mbit A23
256 Mbit A24
I/O
RB
Source
Address Inputs SR0
ai07590b
8Ah 70h00h
Copy Back
Code
Read
Code Read Status Register
Target
Address Inputs
tBLBH1
(Read Busy time)
10h
Busy
tBLBH2
(Program Busy time)
Device operations NAND128-A, NAND256-A
28/60
6.5 Block erase
Erase operations are done one block at a time. An erase operation sets all of the bits in the
addressed block to ‘1’. All previous data in the block is lost.
An erase operation consists of the following three steps (refer to Figure 16: Block erase
operation):
1. One bus cycle is required to set up the Block Erase command.
2. Only two bus cycles are required to input the block address. The first cycle (A0 to A7)
is not required as only addresses A14 to A26 (highest address depends on device
density) are valid, A9 to A13 are ignored. In the last address cycle I/O2 to I/O7 must be
set to VIL.
3. One bus cycle is required to issue the confirm command to start the P/E/R controller.
Once the erase operation has completed the status register can be checked for errors.
Figure 16. Block erase operation
6.6 Reset
The Reset command resets the command interface and status register. If the Reset
command is issued during any operation, the operation is aborted. If it was a program or
erase operation that was aborted, the contents of the memory locations being modified
are no longer valid as the data is partially programmed or erased.
If the device has already been reset then the new Reset command is not accepted.
The Ready/Busy signal goes Low for tBLBH4 after the Reset command is issued. The value
of tBLBH4 depends on the operation that the device was performing when the command
was issued (refer to Table 21: AC characteristics for operations for the values.)
6.7 Read status register
The device contains a status register which provides information on the current or
previous program or erase operation. the various bits in the status register convey
information and errors on the operation.
the status register is read by issuing the read status register command. the status register
information is present on the output data bus (I/O0-I/O7) on the falling edge of chip
enable or read enable, whichever occurs last. when several memories are connected in a
system, the use of chip enable and read enable signals allows the system to poll each
device separately, even when the ready/busy pins are common-wired. it is not necessary
I/O
RB
Block Address
Inputs SR0
ai07593
D0h 70h
60h
Block Erase
Setup Code Confirm
Code Read Status Register
Busy
tBLBH3
(Erase Busy time)
NAND128-A, NAND256-A Device operations
29/60
to toggle the chip enable or read enable signals to update the contents of the status
register.
After the read status register command has been issued, the device remains in read status
register mode until another command is issued. therefore if a read status register
command is issued during a random read cycle a new read command must be issued to
continue with a page read.
The status register bits are summarized in Table 11: Status register bits, to which you
should refer in conjunction with the following sections.
6.7.1 Write Protection Bit (SR7)
The Write Protection bit identifies if the device is protected or not. If the Write Protection
bit is set to ‘1’ the device is not protected and program or erase operations are allowed. If
the Write Protection bit is set to ‘0’ the device is protected and program or erase
operations are not allowed.
6.7.2 P/E/R controller bit (SR6)
The program/erase/read controller bit indicates whether the P/E/R controller is active or
inactive. When the P/E/R controller bit is set to ‘0’, the P/E/R controller is active (device is
busy); when the bit is set to ‘1’, the P/E/R controller is inactive (device is ready).
6.7.3 Error bit (SR0)
The error bit identifies if any errors have been detected by the P/E/R controller. The error
bit is set to ’1’ when a program or erase operation has failed to write the correct data to the
memory. If the error bit is set to ‘0’ the operation has completed successfully.
SR5, SR4, SR3, SR2 and SR1 are reserved.
6.8 Read electronic signature
The device contains a manufacturer code and device code. To read these codes the
following two steps are required:
Table 11. Status register bits
Bit Name Logic level Definition
SR7 Write protection '1' Not protected
'0' Protected
SR6 Program/erase/read
controller
'1' P/E/R C inactive, device ready
'0' P/E/R C active, device busy
SR5, SR4, SR3,
SR2, SR1 Reserved ’don’t care’
SR0 Generic error ‘1’ Error – operation failed
‘0’ No error – operation successful
Device operations NAND128-A, NAND256-A
30/60
1. First use one bus write cycle to issue the Read Electronic Signature command (90h),
followed by an address input of 00h.
2. Then, perform two bus read operations. The first one reads the manufacturer code
and the second reads the device code. Further bus read operations are ignored.
Refer to Table 12 for information on the addresses.
Table 12. Electronic signature
Part number Manufacturer code Device code
NAND128W3A 20h 73h
NAND256R3A 20h 35h
NAND256W3A 75h
NAND256R4A 0020h 0045h
NAND256W4A 0055h
NAND128-A, NAND256-A Software algorithms
31/60
7 Software algorithms
This section gives information on the software algorithms that Numonyx recommends to
implement to manage the bad blocks and extend the lifetime of the NAND device.
NAND flash memories are programmed and erased by Fowler-Nordheim tunneling using
a high voltage. Exposing the device to a high voltage for extended periods can cause the
oxide layer to be damaged. For this reason, the number of program and erase cycles is
limited (see Table 14: Program, erase times and program erase endurance cycles for the
values) and it is recommended to implement garbage collection, a wear-leveling
algorithm and an error correction code to extend the number of program and erase cycles
and increase the data retention.
For the integration of NAND memories into an application, Numonyx provides a full range
of software solutions such as file systems, sector managers, drivers, and code
management.
Contact the nearest Numonyx sales office or visit www.numonyx.com for more details.
7.1 Bad block management
Devices with bad blocks have the same quality level and the same AC and DC
characteristics as devices where all the blocks are valid. A bad block does not affect the
performance of valid blocks because it is isolated from the bit line and common source
line by a select transistor.
The devices are supplied with all the locations inside valid blocks erased (FFh). The bad
block information is written prior to shipping. Any block where the 6th byte (x8
device)/1st word (x16 device) in the spare area of the 1st page does not contain FFh is a
bad block.
The bad block information must be read before any erase is attempted as the bad block
information may be erased. For the system to be able to recognize the bad blocks based on
the original information it is recommended to create a bad block table following the
flowchart shown in Figure 17: Bad block management flowchart.
7.2 Block replacement
Over the lifetime of the device additional bad blocks may develop. In this case the block
has to be replaced by copying the data to a valid block. These additional bad blocks can be
identified as attempts to program or erase them outputs errors to the status register.
As the failure of a page program operation does not affect the data in other pages in the
same block, the block can be replaced by re-programming the current data and copying
the rest of the replaced block to an available valid block. The Copy Back Program
command can be used to copy the data to a valid block.
Refer to Section 6.4: Copy back program for more details.
Software algorithms NAND128-A, NAND256-A
32/60
Refer to Table 13 for the recommended procedure to follow if an error occurs during an
operation.
Figure 17. Bad block management flowchart
Table 13. Block failure
Operation Recommended procedure
Erase Block replacement
Program Block replacement or ECC
Read ECC
AI07588C
START
END
NO
YES
YES
NO
Block Address =
Block 0
Data
= FFh?
Last
block?
Increment
Block Address
Update
Bad Block table
NAND128-A, NAND256-A Software algorithms
33/60
7.3 Garbage collection
When a data page needs to be modified, it is faster to write to the first available page, and
the previous page is marked as invalid. After several updates it is necessary to remove
invalid pages to free some memory space.
To free this memory space and allow further program operations it is recommended to
implement a garbage collection algorithm. In a garbage collection software the valid pages
are copied into a free area and the block containing the invalid pages is erased (see
Figure 18: Garbage collection).
Figure 18. Garbage collection
7.4 Wear-leveling algorithm
For write-intensive applications, it is recommended to implement a wear-leveling
algorithm to monitor and spread the number of write cycles per block.
In memories that do not use a wear-leveling algorithm not all blocks get used at the same
rate. Blocks with long-lived data do not endure as many write cycles as the blocks with
frequently-changed data.
The wear-leveling algorithm ensures that equal use is made of all the available write cycles
for each block. There are two wear-leveling levels:
• First level wear-leveling: new data is programmed to the free blocks that have had the
fewest write cycles.
• Second level wear-leveling: long-lived data is copied to another block so that the
original block can be used for more frequently-changed data.
The second level wear-leveling is triggered when the difference between the maximum
and the minimum number of write cycles per block reaches a specific threshold.
Valid
Page
Invalid
Page Free
Page
(Erased)
Old Area
AI07599B
New Area (After GC)
Software algorithms NAND128-A, NAND256-A
34/60
7.5 Error correction code
An error correction code (ECC) can be implemented in the NAND flash memories to
identify and correct errors in the data.
The recommendation is to implement 23 bits of ECC for every 4096 bits in the device.
Figure 19. Error detection
7.6 Hardware simulation models
7.6.1 Behavioral simulation models
Denali Software Corporation models are platform-independent functional models
designed to assist customers in performing entire system simulations (typical
VHDL/Verilog). These models describe the logic behavior and timings of NAND flash
devices, and, therefore, allow software to be developed before hardware.
7.6.2 IBIS simulations models
IBIS (I/O buffer information specification) models describe the behavior of the I/O buffers
and electrical characteristics of flash devices.
These models provide information such as AC characteristics, rise/fall times, and package
mechanical data, all of which are measured or simulated at voltage and temperature
ranges wider than those allowed by target specifications.
IBIS models simulate PCB connections and can resolve compatibility issues when
upgrading devices. They can be imported into SPICETOOLS.
New ECC generated
during read
XOR previous ECC
with new ECC
All results
= zero?
22 bit data = 0
YES
11 bit data = 1
NO
1 bit data = 1
Correctable
Error ECC Error
No Error
ai08332
>1 bit
= zero?
YES
NO
NAND128-A, NAND256-A Program and erase times and endurance cycles
35/60
8 Program and erase times and endurance cycles
The program and erase times and the number of program/ erase cycles per block are
shown in Table 14.
Table 14. Program, erase times and program erase endurance cycles
Parameters
NAND flash
Unit
Min Typ Max
Page program time 200 500 µs
Block erase time 23ms
Program/erase cycles (per block) 100,000 cycles
Data retention 10 years
Maximum ratings NAND128-A, NAND256-A
36/60
9 Maximum ratings
Stressing the device above the ratings listed in Table 15 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not
implied. Exposure to absolute maximum ratings conditions for extended periods may
affect device reliability.
Table 15. Absolute maximum ratings
Symbol Parameter
Value
Unit
Min Max
TBIAS Temperature under bias – 50 125 °C
TSTG Storage temperature – 65 150 °C
TLEAD Lead temperature during soldering (1)
1. Compatibility with lead-free soldering processes in accordance with ECOPACK 7191395 specifications.
Not exceeding 250°C for more than 10 s, and peaking at 260°C.
260 °C
VIO (2)
2. Minimum voltage may undershoot to –2 V for less than 20 ns during transitions on input and I/O pins.
Maximum voltage may overshoot to VDD + 2 V for less than 20 ns during transitions on I/O pins.
Input or output voltage 1.8 V devices – 0.6 2.7 V
3 V devices – 0.6 4.6 V
VDD Supply voltage 1.8 V devices – 0.6 2.7 V
3 V devices – 0.6 4.6 V
NAND128-A, NAND256-A DC and AC parameters
37/60
10 DC and AC parameters
This section summarizes the operating and measurement conditions and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables in
this section are derived from tests performed under the measurement conditions
summarized in Table 16. Designers should check that the operating conditions in their
circuit match the measurement conditions when relying on the quoted parameters.
Table 16. Operating and AC measurement conditions
Parameter
NAND flash
Units
Min Max
Supply voltage (VDD)1.8 V devices 1.7 1.95 V
3 V devices 2.7 3.6 V
Ambient (TA)Grade 6–40 85°C
Load capacitance (CL) (1 TTL GATE
and CL)
1.8 V devices 30 pF
3 V devices
(2.7 - 3.6 V) 50 pF
3 V devices (3.0 - 3.6V) 100 pF
Input pulses voltages 1.8 V devices 0 VDD V
3 V devices 0.4 2.4 V
Input and output timing ref. voltages 1.8 V devices 0.9 V
3 V devices 1.5 V
Input rise and fall times 5 ns
Output circuit resistors, Rref 8.35 k
Table 17. Capacitance(1) (2)
1. TA = 25°C, f = 1 MHz. CIN and CI/O are not 100% tested.
2. Input/output capacitances double on stacked devices
Symbol Parameter Test condition Typ Max Unit
CIN Input capacitance VIN = 0 V 10 pF
CI/O Input/output capacitance VIL = 0 V 10 pF
DC and AC parameters NAND128-A, NAND256-A
38/60
Figure 20. Equivalent testing circuit for AC characteristics measurement
Table 18. DC characteristics, 1.8 V devices(1)
1. Leakage currents double on stacked devices.
Symbol Parameter Test conditions Min Typ Max Unit
IDD1 Operating
Current
Sequential
read
tRLRL minimum
E=VIL, IOUT = 0 mA -815mA
IDD2 Program - - 8 15 mA
IDD3 Erase - - 8 15 mA
IDD5 Standby current (CMOS) E = VDD-0.2,
WP = 0/VDD
-10 50 µA
-20 100 µA
ILI Input leakage current VIN= 0 to VDDmax - - ±10 µA
ILO Output leakage current VOUT= 0 to
VDDmax - - ±10 µA
VIH Input High voltage - VDD-0.4 - VDD+0.3 V
VIL Input Low voltage --0.3 -0.4 V
VOH Output High voltage level IOH = -100 µA VDD-0.1 - - V
VOL Output Low voltage level IOL = 100 µA - - 0.1 V
IOL (RB)Output Low current (RB) VOL = 0.1 V 3 4 mA
VLKO
VDD supply voltage (erase and
program lockout) - - - 1.1 V
Ai11085
NAND Flash
CL
2Rref
VDD
2Rref
GND
GND
NAND128-A, NAND256-A DC and AC parameters
39/60
Table 19. DC characteristics, 3 V devices(1)
1. Leakage currents double on stacked devices.
Symbol Parameter Test conditions Min Typ Max Unit
IDD1
Operating
current
Sequential
read
tRLRL minimum
E=VIL, IOUT = 0 mA -1020mA
IDD2 Program - - 10 20 mA
IDD3 Erase - - 10 20 mA
IDD4 Standby current (TTL) E = VIH,
WP = 0 V/VDD
- - 1 mA
- - 2 mA
IDD5 Standby current (CMOS) E = VDD-0.2
WP = 0 V/VDD
-10 50 µA
-20 100 µA
ILI Input leakage current VIN = 0 to VDDmax - - ±10 µA
ILO Output leakage current VOUT= 0 to
VDDmax - - ±10 µA
VIH Input High voltage -2.0 - VDD+0.3 V
VIL Input Low voltage -0.3 -0.8 V
VOH Output High voltage level IOH = 400 µA 2.4 - - V
VOL Output Low voltage level IOL = 2.1 mA - - 0.4 V
IOL (RB)Output Low current (RB) VOL = 0.4 V 810 mA
VLKO
VDD supply voltage
(erase and program lockout) - - - 1.7 V
DC and AC parameters NAND128-A, NAND256-A
40/60
t
Table 20. AC characteristics for command, address, data input
Sym-
bol
Alt.
Sym-
bol
Parameter 1.8 V
Devices
3 V
Devices Unit
tALLWL
tALS
Address Latch Low to Write Enable Low
AL Setup time Min 0 0 ns
tALHWL
Address Latch High to Write Enable
Low
tCLHWL
tCLS
Command Latch High to Write Enable
Low CL Setup time Min 0 0 ns
tCLLWL
Command Latch Low to Write Enable
Low
tDVWH tDS Data Valid to Write Enable High Data Setup time Min 20 20 ns
tELWL tCS Chip Enable Low to Write Enable Low E Setup time Min 0 0 ns
tWHALH
tALH
Write Enable High to Address Latch
High AL Hold time Min 10 10 ns
tWHALL
Write Enable High to Address Latch
Low
tWHCLH
tCLH
Write Enable High to Command Latch
High CL hold time Min 10 10 ns
tWHCLL
Write Enable High to Command Latch
Low
tWHDX tDH Write Enable High to Data Transition Data Hold time Min 10 10 ns
tWHEH tCH Write Enable High to Chip Enable High E Hold time Min 10 10 ns
tWHWL tWH Write Enable High to Write Enable Low W High Hold
time Min 20 15 ns
tWLWH tWP Write Enable Low to Write Enable High W Pulse Width Min 40 25(1) ns
tWLWL tWC Write Enable Low to Write Enable Low Write Cycle time Min 60 50 ns
1. If tELWL is less than 10 ns, tWLWH must be minimum 35 ns, otherwise, tWLWH may be minimum 25 ns.
NAND128-A, NAND256-A DC and AC parameters
41/60
Table 21. AC characteristics for operations(1)
Sym-
bol
Alt.
Sym-
bol
Parameter 1.8 V
Devices
3 V
Devices Unit
tALLRL1 tAR
Address Latch Low to
Read Enable Low
Read electronic signature Min 10 10 ns
tALLRL2 Read cycle Min 10 10 ns
tBHRL tRR Ready/Busy High to Read Enable Low Min 20 20 ns
tBLBH1
Ready/Busy Low to
Ready/Busy High
Read Busy time, 128-Mbit, 256
Mbit, dual die Max 12 12 µs
tBLBH2 tPROG Program Busy time Max 500 500 µs
tBLBH3 tBERS Erase Busy time Max 3 3 ms
tBLBH4 Reset Busy time, during ready Max 5 5 µs
tWHBH1 tRST
Write Enable High to
Ready/Busy High
Reset Busy time, during read Max 5 5 µs
Reset Busy time, during program Max 10 10 µs
Reset Busy time, during erase Max 500 500 µs
tCLLRL tCLR Command Latch Low to Read Enable Low Min 10 10 ns
tDZRL tIR Data Hi-Z to Read Enable Low Min 0 0 ns
tEHQZ tCHZ Chip Enable High to Output Hi-Z Max 20 20 ns
tELQV tCEA Chip Enable Low to Output Valid Max 45 45 ns
tRHRL tREH
Read Enable High to
Read Enable Low Read Enable High Hold time Min 15 15 ns
tRHQZ tRHZ Read Enable High to Output Hi-Z Max 30 30 ns
TEHQX TOH Chip Enable high or Read Enable high to Output Hold Min 10 10 ns
TRHQX
tRLRH tRP
Read Enable Low to
Read Enable High Read Enable Pulse Width Min 30 25 ns
tRLRL tRC
Read Enable Low to
Read Enable Low Read Cycle time Min 60 50 ns
tRLQV tREA
Read Enable Low to
Output Valid
Read Enable access time Max 35 35 ns
Read ES access time(1)
tWHBH tR
Write Enable High to
Ready/Busy High
Read Busy time, 128-Mbit, 256-
Mbit dual die Max 12 12 µs
tWHBL tWB Write Enable High to Ready/Busy Low Max 100 100 ns
tWHRL tWHR Write Enable High to Read Enable Low Min 80 60 ns
tWLWL tWC
Write Enable Low to
Write Enable Low Write Cycle time Min 60 50 ns
1. ES = electronic signature
DC and AC parameters NAND128-A, NAND256-A
42/60
Figure 21. Command latch AC waveforms
Figure 22. Address latch AC waveforms
ai08028
CL
E
W
AL
I/O
tCLHWL
tELWL
tWHCLL
tWHEH
tWLWH
tALLWL tWHALH
Command
tDVWH tWHDX
(CL Setup time) (CL Hold time)
(Data Setup time) (Data Hold time)
(ALSetup time) (AL Hold time)
(E Setup time) (E Hold time)
ai08029b
CL
E
W
AL
I/O
tWLWH
tELWL tWLWL
tCLLWL
tWHWL
tALHWL
tDVWH
tWLWL
tWLWH tWLWH
tWHWL
tWHDX
tWHALL
tDVWH
tWHDX
tDVWH
tWHDX
tWHALL
Adrress
cycle 1
tWHALL
(AL Setup time)
(AL Hold time)
Adrress
cycle 3
Adrress
cycle 2
(CL Setup time)
(Data Setup time)
(Data Hold time)
(E Setup time)
NAND128-A, NAND256-A DC and AC parameters
43/60
Figure 23. Data input latch AC waveforms
Figure 24. Sequential data output after read AC waveforms
1. CL = Low, AL = Low, W = High.
tWHCLH
CL
E
AL
W
I/O
tALLWL tWLWL
tWLWH
tWHEH
tWLWH
tWLWH
Data In 0 Data In 1 Data In
Last
tDVWH
tWHDX
tDVWH
tWHDX
tDVWH
tWHDX
ai08030
(Data Setup time)
(Data Hold time)
(ALSetup time)
(CL Hold time)
(E Hold time)
tEHQX
tEHQZ
DC and AC parameters NAND128-A, NAND256-A
44/60
Figure 25. Read status register AC waveform
Figure 26. Read electronic signature AC waveform
1. Refer to Table 12: Electronic signature for the values of the manufacturer and device codes.
tEHQX
90h 00h Man.
code Device
code
CL
E
W
AL
R
I/O
tRLQV
Read Electronic
Signature
Command
1st Cycle
Address Manufacturer and
Device Codes
ai08039b
(Read ES Access time)
tALLRL1
NAND128-A, NAND256-A DC and AC parameters
45/60
Figure 27. Page read A/read B operation AC waveform
Figure 28. Read C operation, one page AC waveform
1. A0-A7 is the address in the spare memory area, where A0-A3 are valid and A4-A7 are ‘don’t care’.
CL
E
W
AL
R
I/O
RB
tWLWL
tWHBL
tALLRL2
00h or
01h
Data
NData
N+1 Data
N+2 Data
Last
tWHBH tRLRL
tEHQZ
tRHQZ
ai08033d
Busy
Command
Code Address N Input Data Output
from Address N to Last Byte or Word in Page
Add.N
cycle 1 Add.N
cycle 3
Add.N
cycle 2
(Read Cycle time)
tRLRH
tBLBH1
tRHQX
tEHQX
CL
E
W
AL
R
I/O
RB
tWHALL
Data M Data
Last
tALLRL2
ai08035c
tWHBH
tBHRL
50h Add. M
cycle 1 Add. M
cycle 3
Add. M
cycle 2
Busy
Command
Code Address M Input Data Output from M to
Last Byte or Word in Area C
DC and AC parameters NAND128-A, NAND256-A
46/60
Figure 29. Page program AC waveform
Figure 30. Block erase AC waveform
CL
E
W
AL
R
I/O
RB
SR0
ai08037b
N
Last 10h
70h
80h
Page Program
Setup Code Confirm
Code Read Status Register
tWLWL tWLWL tWLWL
tWHBL
tBLBH2
Page
Program
Address Input Data Input
Add.N
cycle 1 Add.N
cycle 3
Add.N
cycle 2
(Write Cycle time)
(Program Busy time)
D0h60h SR0
70h
ai08038c
tWHBL
tWLWL
tBLBH3
Block Erase
Setup Command Block Erase
CL
E
W
AL
R
I/O
RB
Confirm
Code Read Status Register
Block Address
Input
(Erase Busy time)
(Write Cycle time)
Add.
cycle 1 Add.
cycle 2
NAND128-A, NAND256-A DC and AC parameters
47/60
Figure 31. Reset AC waveform
10.1 Ready/busy signal electrical characteristics
Figures Figure 32, Figure 33, and Figure 34 show the electrical characteristics for the
Ready/Busy signal. The value required for the resistor RP can be calculated using the
following equation:
Therefore,
where IL is the sum of the input currents of all the devices tied to the Ready/Busy signal. RP
max is determined by the maximum value of tr.
W
R
I/O
RB
tBLBH4
AL
CL
FFh
ai08043
(Reset Busy time)
RPmin VDDmax VOLmax
–
IOL IL
+
------------------------------------------------------------=
RPmin 1.8V1.85V
3mA IL
+
---------------------------=
RPmin 3V 3.2V
8mA IL
+
---------------------------=
DC and AC parameters NAND128-A, NAND256-A
48/60
Figure 32. Ready/Busy AC waveform
Figure 33. Ready/busy load circuit
busy
VOH
ready V
DD
VOL
t
f
t
r
AI07563B
RP
VDD
VSS
RB
DEVICE
Open Drain Output
ibusy
NAND128-A, NAND256-A DC and AC parameters
49/60
Figure 34. Resistor value versus waveform timings for Ready/Busy signal
1. T = 25°C.
t
r
t
f
ibusy
RP (k:)
1234
250
750
500
1
2
3
ibusy (mA)
2.40
1.20
0.80
0.60
220
440
660
800
3.60 3.60 3.60 3.60
0 0
1000 4
V
DD
= 3.3V, C
L
= 100pF
t
r
, t
f
(ns)
DC and AC parameters NAND128-A, NAND256-A
50/60
10.2 Data protection
The Numonyx NAND device is designed to guarantee data protection during power
transitions.
A VDD detection circuit disables all NAND operations, if VDD is below the VLKO threshold.
In the VDD range from VLKO to the lower limit of nominal range, the WP pin should be kept
low (VIL) to guarantee hardware protection during power transitions as shown in the
below figure.
Figure 35. Data protection
Ai11086
VLKO
VDD
W
Nominal Range
Locked
Locked
NAND128-A, NAND256-A Package mechanical
51/60
11 Package mechanical
To meet environmental requirements, Numonyx offers these devices in RoHS compliant
packages, which have a lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. RoHS compliant specifications are available at
www.micron.com.
Figure 36. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package
outline
1. Drawing is not to scale.
TSOP-G
B
e
DIE
C
LA1 α
E1
E
A
A2
1
24
48
25
D1
L1
CP
Package mechanical NAND128-A, NAND256-A
52/60
Table 22. TSOP48 - 48 lead plastic thin small outline, 12 x 20mm, package
mechanical data
Symbol
Millimeters Inches
Typ Min Max Typ Min Max
A – – 1.200 – – 0.0472
A1 0.100 0.050 0.150 0.0039 0.0020 0.0059
A2 1.000 0.950 1.050 0.0394 0.0374 0.0413
B 0.220 0.170 0.270 0.0087 0.0067 0.0106
C – 0.100 0.210 – 0.0039 0.0083
CP – – 0.080 – – 0.0031
D1 12.000 11.900 12.100 0.4724 0.4685 0.4764
E 20.000 19.800 20.200 0.7874 0.7795 0.7953
E1 18.400 18.300 18.500 0.7244 0.7205 0.7283
e 0.500 – – 0.0197 – –
L 0.600 0.500 0.700 0.0236 0.0197 0.0276
L1 0.800 – – 0.0315 – –
a 3°0°5°3°0°5°
NAND128-A, NAND256-A Package mechanical
53/60
Figure 37. VFBGA55 8 x 10 mm - 6 x 8 active ball array, 0.80 mm pitch,
package outline
1. Drawing is not to scale
D1
D
e
b
SD
BGA-Z61
ddd
A2
A1
A
SE E2
FE1
E1 E
D2
FE
FD1
FD
Package mechanical NAND128-A, NAND256-A
54/60
Table 23. VFBGA 8 x 10 x 1.05 mm- 6 x 8 + 7 ball array, 0.8 pitch, package
mechanical data
Symbol
Millimeters Inches
Typ Min Max Typ Min Max
A––1.05––0.041
A1 – 0.25 – – 0.010 –
A2 0.65 – – 0.026 – –
b 0.45 0.40 0.50 0.018 0.016 0.020
D 8.00 7.90 8.10 0.315 0.311 0.319
D1 4.00 – – 0.157 – –
D2 5.60 – – 0.220 – –
ddd – – 0.10 – – 0.004
E 10.00 9.90 10.10 0.394 0.390 0.398
E1 5.60 – – 0.220 – –
E2 8.80 – – 0.346 – –
e0.80 0.031
FD 2.00 – – 0.079 – –
FD1 1.20 – – 0.047 – –
FE 2.20 – – 0.087 – –
FE1 0.60 – – 0.024 – –
SD 0.40 0.016
SE 0.40 0.016
NAND128-A, NAND256-A Part numbering
55/60
12 Part numbering
Note: Not all combinations are necessarily available. For a list of available devices or for further
information on any aspect of these products, please contact your nearest Numonyx sales
office.
1. x16 organization only available for MCP.
Table 24. Ordering information scheme
Example: NAND128 R 3 A 2 B ZA 6 E
Device type
NAND flash memory
Density
128 = 128 Mbits
256 = 256 Mbits
Operating voltage
W = VDD = 2.7 to 3.6 V
Bus width
3 = x8
4 = x16(1)
1.
Family identifier
A = 528 bytes/264 word page
Device options
0 = No options (Chip Enable ‘care’; sequential row read enabled)
2 = Chip Enable ‘don't care’ enabled
A = Automotive testing
Product version
A = first version
B = second version
C = third version
Package
N = TSOP48 12 x 20 mm
ZA = VFBGA55 8 x 10 x 0.1 mm
Temperature range
6 = 40 to 85 °C
X = 40 to 85 °C; Included in product longevity program (PLP)
Option
E = RoHS compliant package, standard packing
F = RoHS compliant package, tape and reel packing
Hardware interface examples NAND128-A, NAND256-A
56/60
Appendix A Hardware interface examples
NAND flash devices can be connected to a microcontroller system bus for code and data
storage. For microcontrollers that have an embedded NAND controller the NAND flash
can be connected without the addition of glue logic (see Figure 38). However, a minimum
of glue logic is required for general purpose microcontrollers that do not have an
embedded NAND controller. The glue logic usually consists of a flip-flop to hold the Chip
Enable, Address Latch Enable, and Command Latch Enable signals stable during
command and address latch operations, and some logic gates to simplify the firmware or
make the design more robust.
Figure 39 provides an example of how to connect a NAND flash to a general purpose
microcontroller. The additional OR gates allow the microcontroller’s Output Enable and
Write Enable signals to be used for other peripherals. The OR gate between A3 and CSn
maps the flip-flop and NAND I/O in different address spaces inside the same chip select
unit, which improves the setup and hold times and simplifies the firmware. The structure
uses the microcontroller DMA (direct memory access) engines to optimize the transfer
between the NAND flash and the system RAM.
For any interface with glue logic, the extra delay caused by the gates and flip-flop must be
taken into account. This delay must be added to the microcontroller’s AC characteristics
and register settings to get the NAND flash setup and hold times.
For mass storage applications (hard disk emulations or systems where a huge amount of
storage is required) NAND flash memories can be connected together to build storage
modules (see Figure 40).
Figure 38. Connection to microcontroller, without glue logic
AI08045b
R
W
I/O
E
AL
CL
W
G
CSn
AD(24:16)
Microcontroller
NAND
Flash
DQ
WP
RBPWAITEN
AD17
AD16
VDD
VDD or VSS
or General Purpose I/O
NAND128-A, NAND256-A Hardware interface examples
57/60
Figure 39. Connection to microcontroller, with glue logic
Figure 40. Building storage modules
AI07589
R
W
I/O
E
AL
CL
CLK
D2
D1
D0 Q0
Q1
Q2
W
G
CSn
A3
A0
A1
A2
Microcontroller NAND Flash
DQ
D flip-flop
AI08331
WNAND Flash
Device 1
G
E
1
CL
AL NAND Flash
Device 3
NAND Flash
Device 2 NAND Flash
Device n+1
NAND Flash
Device n
E
2
E
3
E
n
E
n+1
I/O0-I/O7 or
I/O0-I/O15
RB
Revision history NAND128-A, NAND256-A
58/60
13 Revision history
Table 25. Document revision history
Date Ver. Revision details
06-Jun-2003 1 First Issue
07-Aug-2003 2 Design Phase
27-Oct-2003 3 Engineering Phase
03-Dec-2003 4
Document promoted from Target Specification to Preliminary Data
status.
VCC changed to VDD and ICC to IDD.
Changed title of Table 2 “Table 2.: Product description” and page
program typical timing for NANDXXXR3A devices corrected. Table 1:
NAND128-A and NAND256-A device summary, inserted on page 2.
13-Apr-2004 5
WSOP48 and VFBGA55 packages added, VFBGA63 (9 x 11 x 1mm)
removed.
Figure 19., Cache Program Operation, modified and note 2 modified.
Note removed for tWLWH timing in Table 20: AC characteristics for
command, address, data input. Meaning of tBLBH4 modified, partly
replaced by tWHBH1 and tWHRL min for 3V devices modified in
<Blue>Table 21., AC characteristics for operations.
References removed from Section 13: Revision history section and
reference made to ST Website instead.
Figure 5: VFBGA55 connections, x8 devices (top view through
package), Figure 6: VFBGA55 connections, x16 devices (top view
through package), Figure 27: Page read A/read B operation AC
waveform and Figure 30: Block erase AC waveform modified.
Section 6.8: Read electronic signature clarified and Figure 26: Read
electronic signature AC waveform, modified. Note 2 to Figure 28: Read
C operation, one page AC waveform removed. Only 00h Pointer
operations are valid before a Cache Program operation. Note added to
Figure 30: Block erase AC waveform. Small text changes.
28-May-2004 6
TFBGA55 package added (mechanical data to be announced). 512Mb
Dual Die devices added. Figure 19., Cache Program Operation
modified.
Package code changed for TFBGA63 8.5 x 15 x 1.2mm, 6x8 ball array,
0.8mm pitch (1Gbit Dual Die devices) in Table 24: Ordering
information scheme.
02-Jul-2004 7
Cache Program removed from document. TFBGA55 package
specifications added (Figure 40., TFBGA55 8 x 10mm - 6x8 active ball
array - 0.80mm pitch, Package Outline and Table 25., TFBGA55 8 x
10mm - 6x8 active ball array - 0.80mm pitch, Package Mechanical
Data).
Test conditions modified for VOL and VOH parameters in <Blue> , .
01-Oct-2004 8
Section 6.5: Block erase last address cycle modified. Definition of a Bad
Block modified in Section 7.1: Bad block management. RoHS
compliance added to Section 1: Description. Figure 2: Logic block
diagram modified.
Document promoted from Preliminary Data to Full Datasheet status.
NAND128-A, NAND256-A Revision history
Table 25. Document revision history (continua)
Date
Ver.
Revision details
03-Dec-2004
9
Automatic Page 0 Read at Power-Up option no longer available.
PC Demo board with simulation software removed from list of
available development tools.
Section 3.5: Chip Enable (E)
paragraph
clarified.
13-Dec-2004
10
R
ref
parameter added to the description of the family clarified in the
Section 1: Description
.
25-Feb-2005
11
WSOP48 replaced with USOP48 package,
VFBGA63 (8.5 x 15 x 1mm) replaced with VFBGA63 (9 x 11 x 1mm)
package,
TFBGA63 (8.5 x 15 x 1mm) replaced with TFBGA63 (9 x 11 x 1.2mm)
package.
Changes to Table 21: AC characteristics for operations.
23-June-
2005
12
t
EHBH
,
t
EHEL
,
t
RHBL
removed throughout document. TFBGA63 and TFBGA55
packages removed throughout document. Sequential Row Read
removed throughout document.
T
EHQX and
T
RHQX
added throughout document.
Section 10.2: Data
protection section and Figure 20: Equivalent testing circuit for AC
characteristics measurement
added.
Modified Section 3.7: Write Enable (W), Section 3.5: Chip Enable (E),
Section 6.2: Read memory array
,
Section 6.3: Page program
,
Section 6.8: Read electronic signature, Section 7.1: Bad block
management and Section 12: Part numbering.
Figure 10: Read (A, B, C) operations and Figure 26: Read electronic
signature AC waveform modified.
09-Aug-2005
13
Note added to
Figure 3: TSOP48 connections, x8 devices
and
Figure 4:
TSOP48 connections, x16 devices
regarding the USOP package.
20-Jun-2008
14
Removed all information pertaining to the 512-Mbit and 1-Gbit
devices. Applied Numonyx branding.
13-Aug-2008
15
Removed all the information pertaining the 1.8 V devices (VDD = 1.7
to
1.95 V) and the USOP48 and VFBGA63 packages. Added the sequential
row read option throughout the document.
30-Nov-2009
16
Added security features on the cover page and in Section 1:
Description.
Updated Figure 32: Ready/Busy AC waveform and Figure 34: Resistor
value versus waveform timings for Ready/Busy signal. References to
ECOPACK removed and replaced by RoHS compliance. Modified
dimension A2 of the VFBGA55 package in Table 22. Added automotive
testing option in Table 23: Ordering information scheme.
19-Oct-2012
17
Added X =
−
40 to 85 °C; Included in product longevity program (PLP)
under temperature range in ordering information scheme table.
30-Jan-2018
18
Added Important Notes and Warnings section for further
clarification aligning to industry.
59/60
NAND128-A, NAND256-A
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