1997 Microchip Technology Inc. DS30272A-page 1
PIC16C71X
8-Bit CMOS Microcontrollers with A/D Converter
Devices included in this data sheet:
• PIC16C710
• PIC16C71
• PIC16C711
• PIC16C715
PIC16C71X Microcontroller Core Features:
• High-performance RISC CPU
• Only 35 single word instructions to learn
• All single cycle instructions except for program
branches which are two cycle
• Operating speed: DC - 20 MHz clock input
DC - 200 ns instruction cycle
• Up to 2K x 14 words of Program Memory,
up to 128 x 8 bytes of Data Memory (RAM)
• Interrupt capability
• Eight level deep hardware stack
• Direct, indirect, and relative addressing modes
• Power-on Reset (POR)
• Power-up Timer (PWRT) and
Oscillator Start-up Timer (OST)
• Watchdog Timer (WDT) with its own on-chip RC
oscillator for reliable operation
• Programmable code-protection
• Power saving SLEEP mode
• Selectable oscillator options
• Low-power, high-speed CMOS EPROM
technology
• Fully static design
• Wide operating voltage range: 2.5V to 6.0V
• High Sink/Source Current 25/25 mA
• Commercial, Industrial and Extended temperature
ranges
• Program Memory Parity Error Checking Circuitry
with Parity Error Reset (PER) (PIC16C715)
• Low-power consumption:
- < 2 mA @ 5V, 4 MHz
- 15
µ
A typical @ 3V, 32 kHz
- < 1
µ
A typical standby current
PIC16C71X Peripheral Features:
• Timer0: 8-bit timer/counter with 8-bit prescaler
• 8-bit multichannel analog-to-digital converter
• Brown-out detection circuitry for
Brown-out Reset (BOR)
• 13 I/O Pins with Individual Direction Control
Pin Diagrams
PIC16C7X Features 710 71 711 715
Program Memory (EPROM)
x 14 512 1K 1K 2K
Data Memory (Bytes) x 8 36 36 68 128
I/O Pins 13 13 13 13
Timer Modules 1 1 1 1
A/D Channels 4 4 4 4
In-Circuit Serial Programming Yes Yes Yes Yes
Brown-out Reset Yes — Yes Yes
Interrupt Sources 4 4 4 4
RA2/AN2
RA3/AN3/VREF
RA4/T0CKI
MCLR/VPP
VSS
VSS
RB0/INT
RB1
RB2
RB3
RA1/AN1
RA0/AN0
OSC1/CLKIN
OSC2/CLKOUT
VDD
RB7
RB6
RB5
RB4
• 1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VDD
SSOP
RA2/AN2
RA3/AN3/VREF
RA4/T0CKI
MCLR/VPP
VSS
RB0/INT
RB1
RB2
RB3
RA1/AN1
RA0/AN0
OSC1/CLKIN
OSC2/CLKOUT
VDD
RB7
RB6
RB5
RB4
• 1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
PIC16C710
PDIP, SOIC, Windowed CERDIP
PIC16C71
PIC16C711
PIC16C715
PIC16C710
PIC16C711
PIC16C715
PIC16C71X
DS30272A-page 2
1997 Microchip Technology Inc.
Table of Contents
1.0 General Description.................................................................................................................................................................... 3
2.0 PIC16C71X Device Varieties...................................................................................................................................................... 5
3.0 Architectural Overview................................................................................................................................................................ 7
4.0 Memory Organization ............................................................................................................................................................... 11
5.0 I/O Ports.................................................................................................................................................................................... 25
6.0 Timer0 Module.......................................................................................................................................................................... 31
7.0 Analog-to-Digital Converter (A/D) Module ................................................................................................................................ 37
8.0 Special Features of the CPU .................................................................................................................................................... 47
9.0 Instruction Set Summary .......................................................................................................................................................... 69
10.0 Development Support............................................................................................................................................................... 85
11.0 Electrical Characteristics for PIC16C710 and PIC16C711....................................................................................................... 89
12.0 DC and AC Characteristics Graphs and Tables for PIC16C710 and PIC16C711.................................................................. 101
13.0 Electrical Characteristics for PIC16C715................................................................................................................................ 111
14.0 DC and AC Characteristics Graphs and Tables for PIC16C715 ............................................................................................ 125
15.0 Electrical Characteristics for PIC16C71.................................................................................................................................. 135
16.0 DC and AC Characteristics Graphs and Tables for PIC16C71 .............................................................................................. 147
17.0 Packaging Information............................................................................................................................................................ 155
Appendix A: ...................................................................................................................................................................................... 161
Appendix B: Compatibility................................................................................................................................................................. 161
Appendix C: What’s New.................................................................................................................................................................. 162
Appendix D: What’s Changed .......................................................................................................................................................... 162
Index .................................................................................................................................................................................................. 163
PIC16C71X Product Identification System......................................................................................................................................... 173
To Our Valued Customers
We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional
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1997 Microchip Technology Inc. DS30272A-page 3
PIC16C71X
1.0 GENERAL DESCRIPTION
The PIC16C71X is a family of
low-cost, high-perfor-
mance, CMOS, fully-static, 8-bit microcontrollers with
integrated analog-to-digital (A/D) converters, in the
PIC16CXX mid-range family.
All PIC16/17 microcontrollers employ an advanced
RISC architecture. The PIC16CXX microcontroller f am-
ily has enhanced core features, eight-level deep stack,
and multiple internal and external interrupt sources.
The separate instruction and data buses of the Harvard
architecture allow a 14-bit wide instruction word with
the separate 8-bit wide data. The two stage instruction
pipeline allows all instructions to execute in a single
cycle, except for program branches which require two
cycles. A total of 35 instructions (reduced instruction
set) are av ailable. Additionally, a large register set gives
some of the architectural innov ations used to achie v e a
very high performance.
PIC16CXX microcontrollers typically achieve a 2:1
code compression and a 4:1 speed improvement over
other 8-bit microcontrollers in their class.
The
PIC16C710/71
de vices hav e 36 b ytes of RAM, the
PIC16C711
has 68 bytes of RAM and the
PIC16C715
has 128 bytes of RAM. Each device has 13 I/O
pins. In
addition a timer/counter is available. Also a 4-channel
high-speed 8-bit A/D is provided. The 8-bit resolution is
ideally suited f or applications requiring low-cost analog
interface, e.g. thermostat control, pressure sensing,
etc.
The PIC16C71X family has special features to reduce
external components, thus reducing cost, enhancing
system reliability and reducing power consumption.
There are f our oscillator options, of which the single pin
RC oscillator provides a lo w-cost solution, the LP oscil-
lator minimizes power consumption, XT is a standard
crystal, and the HS is for High Speed crystals. The
SLEEP (power-down) feature provides a power saving
mode. The user can wake up the chip from SLEEP
through several external and internal interrupts and
resets.
A highly reliable Watchdog Timer with its own on-chip
RC oscillator provides protection against softw are lock-
up .
A UV erasable CERDIP packaged version is ideal for
code development while the cost-effective One-Time-
Programmable (OTP) version is suitable for production
in any volume.
The PIC16C71X family fits perfectly in applications
ranging from security and remote sensors to appliance
control and automotive. The EPROM technology
makes customization of application programs (trans-
mitter codes, motor speeds , receiver frequencies , etc.)
extremely fast and convenient. The small footprint
packages make this microcontroller series perfect for
all applications with space limitations. Low cost, low
power, high performance, ease of use and I/O fle xibility
make the PIC16C71X very versatile even in areas
where no microcontroller use has been considered
before (e.g. timer functions, serial communication, cap-
ture and compare, PWM functions and coprocessor
applications).
1.1 Family and Upward Compatibility
Users familiar with the PIC16C5X microcontroller fam-
ily will realize that this is an enhanced version of the
PIC16C5X architecture. Please refer to Appendix A for
a detailed list of enhancements. Code written for the
PIC16C5X can be easily ported to the PIC16CXX fam-
ily of devices (Appendix B).
1.2 Development Support
PIC16C71X devices are supported by the complete
line of Microchip Development tools.
Please refer to Section 10.0 for more details about
Microchip’s development tools.
PIC16C71X
DS30272A-page 4
1997 Microchip Technology Inc.
TABLE 1-1: PIC16C71X FAMILY OF DEVICES
PIC16C710 PIC16C71 PIC16C711 PIC16C715 PIC16C72 PIC16CR72
(1)
Clock
Maximum Frequency
of Operation (MHz) 20 20 20 20 20 20
Memory
EPROM Program Memory
(x14 words) 512 1K 1K 2K 2K —
ROM Program Memory
(14K words) — — — — — 2K
Data Memory (bytes) 36 36 68 128 128 128
Peripherals
Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/PWM
Module(s) — — — — 1 1
Serial Port(s)
(SPI/I
2
C, USART) — — — — SPI/I
2
C SPI/I
2
C
Parallel Slave Port — — — — — —
A/D Converter (8-bit) Channels 4 4 4 4 5 5
Features
Interrupt Sources 4 4 4 4 8 8
I/O Pins 13 13 13 13 22 22
Voltage Range (Volts) 2.5-6.0 3.0-6.0 2.5-6.0 2.5-5.5 2.5-6.0 3.0-5.5
In-Circuit Serial Programming Yes Yes Yes Yes Yes Yes
Brown-out Reset Yes — Yes Yes Yes Yes
Packages 18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC 18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
28-pin SDIP,
SOIC, SSOP 28-pin SDIP,
SOIC, SSOP
PIC16C73A PIC16C74A PIC16C76 PIC16C77
Clock
Maximum Frequency
of Operation (MHz) 20 20 20 20
Memory
EPROM Program Memory
(x14 words) 4K 4K 8K 8K
Data Memory (bytes) 192 192 376 376
Peripherals
Timer Module(s) TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/PWM
Module(s) 2222
Serial Port(s)
(SPI/I
2
C, USART) SPI/I
2
C, USART SPI/I
2
C, USART SPI/I
2
C, USART SPI/I
2
C, USART
Parallel Slave Port — Yes — Yes
A/D Converter (8-bit) Channels 5 8 5 8
Features
Interrupt Sources 11 12 11 12
I/O Pins 22 33 22 33
Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0
In-Circuit Serial Programming Yes Yes Yes Yes
Brown-out Reset Yes Yes Yes Yes
Packages 28-pin SDIP,
SOIC 40-pin DIP;
44-pin PLCC,
MQFP, TQFP
28-pin SDIP,
SOIC 40-pin DIP;
44-pin PLCC,
MQFP, TQFP
All PIC16/17 F amily devices have Power-on Reset, selectable Watchdog Timer, selectab le code protect and high I/O current capabil-
ity. All PIC16C7XX Family devices use serial programming with clock pin RB6 and data pin RB7.
Note 1: Please contact your local Microchip sales office for availability of these devices.
1997 Microchip Technology Inc. DS30272A-page 5
PIC16C71X
2.0 PIC16C71X DEVICE VARIETIES
A variety of frequency ranges and packaging options
are av ailable . Depending on application and production
requirements, the proper de vice option can be selected
using the infor mation in the PIC16C71X Product Iden-
tification System section at the end of this data sheet.
When placing orders, please use that page of the data
sheet to specify the correct part number.
For the PIC16C71X family, there are two device “types”
as indicated in the device number:
1.
C
, as in PIC16
C
71. These devices have
EPROM type memory and operate over the
standard voltage range.
2.
LC
, as in PIC16
LC
71. These devices have
EPROM type memory and operate over an
extended voltage range.
2.1 UV Erasable Devices
The UV erasable version, offered in CERDIP package
is optimal for prototype development and pilot
programs. This version can be erased and
reprogrammed to any of the oscillator modes.
Microchip's PICSTART
Plus and PRO MATE
II
programmers both support programming of the
PIC16C71X.
2.2 One-Time-Programmable (OTP)
Devices
The availability of OTP devices is especially useful for
customers who need the flexibility for frequent code
updates and small volume applications.
The OTP devices, packaged in plastic packages, per-
mit the user to program them once. In addition to the
program memory, the configuration bits must also be
programmed.
2.3 Quick-Turnaround-Production (QTP)
Devices
Microchip offers a QTP Programming Service for fac-
tory production orders. This service is made available
for users who choose not to program a medium to high
quantity of units and whose code patterns have stabi-
lized. The devices are identical to the OTP devices but
with all EPROM locations and configuration options
already programmed by the factory. Certain code and
prototype verification procedures apply before produc-
tion shipments are available. Please contact your local
Microchip Technology sales office for more details.
2.4 Serialized Quick-Turnaround
Production (SQTP
SM
) Devices
Microchip offers a unique programming service where
a few user-defined locations in each device are pro-
grammed with diff erent serial numbers. The serial num-
bers may be random, pseudo-random, or sequential.
Serial programming allows each device to have a
unique number which can serve as an entry-code,
password, or ID number.
PIC16C71X
DS30272A-page 6
1997 Microchip Technology Inc.
NOTES:
1997 Microchip Technology Inc. DS30272A-page 7
PIC16C71X
3.0 ARCHITECTURAL OVERVIEW
The high perfor mance of the PIC16CXX family can be
attributed to a number of architectural features com-
monly found in RISC microprocessors. To begin with,
the PIC16CXX uses a Harvard architecture, in which,
program and data are accessed from separate memo-
ries using separate buses. This improves bandwidth
over traditional v on Neumann architecture in which pro-
gram and data are fetched from the same memory
using the same bus. Separating program and data
buses further allows instructions to be sized differently
than the 8-bit wide data word. Instruction opcodes are
14-bits wide making it possible to have all single word
instructions. A 14-bit wide program memory access
bus fetches a 14-bit instruction in a single cycle. A two-
stage pipeline overlaps fetch and execution of instruc-
tions (Example 3-1). Consequently, all instructions (35)
execute in a single cycle (200 ns @ 20 MHz) e xcept f or
program branches.
The table below lists program memory (EPROM) and
data memory (RAM) for each PIC16C71X device.
The PIC16CXX can directly or indirectly address its
register files or data memory. All special function regis-
ters, including the program counter, are mapped in the
data memory. The PIC16CXX has an orthogonal (sym-
metrical) instr uction set that makes it possible to carr y
out any operation on an y register using any addressing
mode. This symmetrical nature and lack of ‘special
optimal situations’ make programming with the
PIC16CXX simple yet efficient. In addition, the learning
curve is reduced significantly.
Device Program
Memory Data Memory
PIC16C710 512 x 14 36 x 8
PIC16C71 1K x 14 36 x 8
PIC16C711 1K x 14 68 x 8
PIC16C715 2K x 14 128 x 8
PIC16CXX devices contain an 8-bit ALU and working
register. The ALU is a general pur pose ar ithmetic unit.
It performs arithmetic and Boolean functions between
the data in the working register and any register file.
The ALU is 8-bits wide and capable of addition, sub-
traction, shift and logical operations. Unless otherwise
mentioned, arithmetic operations are two's comple-
ment in nature. In two-operand instructions, typically
one operand is the working register (W register). The
other operand is a file register or an immediate con-
stant. In single operand instructions, the operand is
either the W register or a file register.
The W register is an 8-bit working register used for ALU
operations. It is not an addressable register.
Depending on the instruction executed, the ALU may
affect the values of the Carry (C), Digit Carry (DC), and
Zero (Z) bits in the STATUS register . The C and DC bits
operate as a borrow bit and a digit borrow out bit,
respectively, in subtraction. See the
SUBLW
and
SUBWF
instructions for examples.
PIC16C71X
DS30272A-page 8
1997 Microchip Technology Inc.
FIGURE 3-1: PIC16C71X BLOCK DIAGRAM
EPROM
Program
Memory
13 Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit) RAM
File
Registers
Direct Addr 7
RAM Addr (1) 9
Addr MUX
Indirect
Addr
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR VDD, VSS
Timer0
A/D
PORTA
PORTB
RB0/INT
RB7:RB1
8
8
Brown-out
Reset(2)
Note 1: Higher order bits are from the STATUS register.
2: Brown-out Reset is not available on the PIC16C71.
Device Program Memory Data Memory (RAM)
PIC16C710
PIC16C71
PIC16C711
PIC16C715
512 x 14
1K x 14
1K x 14
2K x 14
36 x 8
36 x 8
68 x 8
128 x 8
RA4/T0CKI
RA3/AN3/VREF
RA2/AN2
RA1/AN1
RA0/AN0
8
3
1997 Microchip Technology Inc. DS30272A-page 9
PIC16C71X
TABLE 3-1: PIC16C710/71/711/715 PINOUT DESCRIPTION
Pin Name DIP
Pin# SSOP
Pin#
(4)
SOIC
Pin# I/O/P
Type Buffer
Type Description
OSC1/CLKIN 16 18 16 I ST/CMOS
(3)
Oscillator crystal input/external clock source input.
OSC2/CLKOUT 15 17 15 O — Oscillator crystal output. Connects to crystal or resonator in crystal
oscillator mode. In RC mode, OSC2 pin outputs CLK OUT which has
1/4 the frequency of OSC1, and denotes the instruction cycle rate.
MCLR/V
PP
4 4 4 I/P ST Master clear (reset) input or programming voltage input. This pin is
an active low reset to the device.
PORTA is a bi-directional I/O port.
RA0/AN0 17 19 17 I/O TTL RA0 can also be analog input0
RA1/AN1 18 20 18 I/O TTL RA1 can also be analog input1
RA2/AN2 1 1 1 I/O TTL RA2 can also be analog input2
RA3/AN3/V
REF
2 2 2 I/O TTL RA3 can also be analog input3 or analog reference voltage
RA4/T0CKI 3 3 3 I/O ST RA4 can also be the clock input to the Timer0 module. Output is
open drain type.
PORTB is a bi-directional I/O port. PORTB can be software pro-
grammed for internal weak pull-up on all inputs.
RB0/INT 6 7 6 I/O TTL/ST
(1)
RB0 can also be the external interrupt pin.
RB1 7 8 7 I/O TTL
RB2 8 9 8 I/O TTL
RB3 9 10 9 I/O TTL
RB4 10 11 10 I/O TTL Interrupt on change pin.
RB5 11 12 11 I/O TTL Interrupt on change pin.
RB6 12 13 12 I/O TTL/ST
(2)
Interrupt on change pin. Serial programming clock.
RB7 13 14 13 I/O TTL/ST
(2)
Interrupt on change pin. Serial programming data.
V
SS
5 4, 6 5 P — Ground reference for logic and I/O pins.
V
DD
14 15, 16 14 P — Positive supply for logic and I/O pins.
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in serial programming mode.
3: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise.
4: The PIC16C71 is not available in SSOP package.
PIC16C71X
DS30272A-page 10
1997 Microchip Technology Inc.
3.1 Clocking Scheme/Instruction Cycle
The clock input (from OSC1) is internally divided by
four to generate four non-overlapping quadrature
clocks namely Q1, Q2, Q3 and Q4. Internally, the pro-
gram counter (PC) is incremented every Q1, the
instruction is fetched from the program memory and
latched into the instruction register in Q4. The instr uc-
tion is decoded and executed during the following Q1
through Q4. The clocks and instruction execution flow
is shown in Figure 3-2.
3.2 Instruction Flow/Pipelining
An “Instruction Cycle” consists of four Q cycles (Q1,
Q2, Q3 and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle
while decode and execute takes another instruction
cycle. However, due to the pipelining, each instr uction
effectively executes in one cycle. If an instruction
causes the program counter to change (e .g.
GOTO
) then
two cycles are required to complete the instruction
(Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the e xecution cycle , the fetched instruction is latched
into the “Instruction Register” (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3, and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
FIGURE 3-2: CLOCK/INSTRUCTION CYCLE
EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2
Q3
Q4
PC
OSC2/CLKOUT
(RC mode)
PC PC+1 PC+2
Fetch INST (PC)
Execute INST (PC-1) Fetch INST (PC+1)
Execute INST (PC) Fetch INST (PC+2)
Execute INST (PC+1)
Internal
phase
clock
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.
Tcy0 Tcy1 Tcy2 Tcy3 Tcy4 Tcy5
1. MOVLW 55h Fetch 1 Execute 1
2. MOVWF PORTB Fetch 2 Execute 2
3. CALL SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush
5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1
1997 Microchip Technology Inc. DS30272A-page 11
PIC16C71X
4.0 MEMORY ORGANIZATION
4.1 Program Memory Organization
The PIC16C71X family has a 13-bit program counter
capable of addressing an 8K x 14 program memory
space. The amount of program memory available to
each device is listed below:
For those devices with less than 8K program memory,
accessing a location abov e the ph ysically implemented
address will cause a wraparound.
The reset vector is at 0000h and the interrupt vector is
at 0004h.
FIGURE 4-1: PIC16C710 PROGRAM
MEMORY MAP AND STACK
Device Program
Memory Address Range
PIC16C710 512 x 14 0000h-01FFh
PIC16C71 1K x 14 0000h-03FFh
PIC16C711 1K x 14 0000h-03FFh
PIC16C715 2K x 14 0000h-07FFh
PC<12:0>
13
0000h
0004h
0005h
01FFh
0200h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
User Memory
Space
FIGURE 4-2: PIC16C71/711 PROGRAM
MEMORY MAP AND STACK
FIGURE 4-3: PIC16C715 PROGRAM
MEMORY MAP AND STACK
PC<12:0>
13
0000h
0004h
0005h
03FFh
0400h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
User Memory
Space
PC<12:0>
13
0000h
0004h
0005h
07FFh
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
0800h
PIC16C71X
DS30272A-page 12 1997 Microchip Technology Inc.
4.2 Data Memory Organization
The data memory is partitioned into two Banks which
contain the General Purpose Registers and the Special
Function Registers. Bit RP0 is the bank select bit.
RP0 (STATUS<5>) = 1 → Bank 1
RP0 (STATUS<5>) = 0 → Bank 0
Each Bank extends up to 7Fh (128 bytes). The lower
locations of each Bank are reserved for the Special
Function Registers. Abov e the Special Function Regis-
ters are General Purpose Registers implemented as
static RAM. Both Bank 0 and Bank 1 contain special
function registers. Some "high use" special function
registers from Bank 0 are mirrored in Bank 1 for code
reduction and quicker access.
4.2.1 GENERAL PURPOSE REGISTER FILE
The register file can be accessed either directly, or indi-
rectly through the File Select Register FSR
(Section 4.5).
FIGURE 4-4: PIC16C710/71 REGISTER FILE
MAP
INDF(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
ADRES
ADCON0
INDF(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
ADCON1
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
General
Purpose
Register
7Fh FFh
Bank 0 Bank 1
File
Address
ADRES
2Fh
30h
AFh
B0h
File
Address
General
Purpose
Register
Mapped
in Bank 0(3)
PCON(2)
Unimplemented data memory locations, read
as '0'.
Note 1: Not a physical register.
2: The PCON register is not implemented on the
PIC16C71.
3: These locations are unimplemented in Bank 1.
Any access to these locations will access the
corresponding Bank 0 register.
1997 Microchip Technology Inc. DS30272A-page 13
PIC16C71X
FIGURE 4-5: PIC16C711 REGISTER FILE
MAP
INDF(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
ADRES
ADCON0
INDF(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
ADCON1
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
General
Purpose
Register
7Fh FFh
Bank 0 Bank 1
File
Address
ADRES
4Fh
50h
CFh
D0h
File
Address
General
Purpose
Register
Mapped
in Bank 0(2)
PCON
Unimplemented data memory locations, read
as '0'.
Note 1: Not a physical register.
2: These locations are unimplemented in Bank 1.
Any access to these locations will access the
corresponding Bank 0 register.
FIGURE 4-6: PIC16C715 REGISTER FILE
MAP
INDF(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
ADRES
ADCON0
INDF(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
ADCON1
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h A0h
General
Purpose
Register
General
Purpose
Register
7Fh FFh
Bank 0 Bank 1
File
Address
BFh
C0h
File
Address
Unimplemented data memory locations, read
as '0'.
Note 1: Not a physical register.
PIC16C71X
DS30272A-page 14 1997 Microchip Technology Inc.
4.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and Peripheral Modules for controlling the
desired operation of the device. These registers are
implemented as static RAM.
The special function registers can be classified into two
sets (core and peripheral). Those registers associated
with the “core” functions are described in this section,
and those related to the operation of the peripheral f ea-
tures are described in the section of that peripheral
feature.
TABLE 4-1: PIC16C710/71/711 SPECIAL FUNCTION REGISTER SUMMARY
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR
Value on all
other resets
(1)
Bank 0
00h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(3) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(3) STATUS IRP(5) RP1(5) RP0 TO PD Z DC C 0001 1xxx 000q quuu
04h(3) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA — — — PORTA Data Latch when written: PORTA pins when read ---x 0000 ---u 0000
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h — Unimplemented — —
08h ADCON0 ADCS1 ADCS0 (6) CHS1 CHS0 GO/DONE ADIF ADON 00-0 0000 00-0 0000
09h(3) ADRES A/D Result Register xxxx xxxx uuuu uuuu
0Ah(2,3) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(3) INTCON GIE ADIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
Bank 1
80h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(3) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(3) STATUS IRP(5) RP1(5) RP0 TO PD Z DC C 0001 1xxx 000q quuu
84h(3) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA — — — PORTA Data Direction Register ---1 1111 ---1 1111
86h TRISB PORTB Data Direction Control Register 1111 1111 1111 1111
87h(4) PCON — — — — — — POR BOR ---- --qq ---- --uu
88h ADCON1 — — — — — — PCFG1 PCFG0 ---- --00 ---- --00
89h(3) ADRES A/D Result Register xxxx xxxx uuuu uuuu
8Ah(2,3) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(3) INTCON GIE ADIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: Other (non power-up) resets include external reset through MCLR and Watchdog Timer Reset.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8> whose
contents are transferred to the upper byte of the program counter.
3: These registers can be addressed from either bank.
4: The PCON register is not physically implemented in the PIC16C71, read as ’0’.
5: The IRP and RP1 bits are reserved on the PIC16C710/71/711, always maintain these bits clear.
6: Bit5 of ADCON0 is a General Purpose R/W bit for the PIC16C710/711 only. For the PIC16C71, this bit is unimplemented,
read as '0'.
1997 Microchip Technology Inc. DS30272A-page 15
PIC16C71X
TABLE 4-2: PIC16C715 SPECIAL FUNCTION REGISTER SUMMARY
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR, PER
Value on all
other resets
(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP(4) RP1(4) RP0 TO PD Z DC C 0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA — — — PORTA Data Latch when written: PORTA pins when read ---x 0000 ---u 0000
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h — Unimplemented — —
08h — Unimplemented — —
09h — Unimplemented — —
0Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 — ADIF — — — — — — -0-- ---- -0-- ----
0Dh — Unimplemented — —
0Eh — Unimplemented — —
0Fh — Unimplemented — —
10h — Unimplemented — —
11h — Unimplemented — —
12h — Unimplemented — —
13h — Unimplemented — —
14h — Unimplemented — —
15h — Unimplemented — —
16h — Unimplemented — —
17h — Unimplemented — —
18h — Unimplemented — —
19h — Unimplemented — —
1Ah — Unimplemented — —
1Bh — Unimplemented — —
1Ch — Unimplemented — —
1Dh — Unimplemented — —
1Eh ADRES A/D Result Register xxxx xxxx uuuu uuuu
1Fh ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — ADON 0000 00-0 0000 00-0
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8> whose
contents are transferred to the upper byte of the program counter.
3: Other (non power-up) resets include external reset through MCLR and Watchdog Timer Reset.
4: The IRP and RP1 bits are reserved on the PIC16C715, always maintain these bits clear.
PIC16C71X
DS30272A-page 16 1997 Microchip Technology Inc.
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP(4) RP1(4) RP0 TO PD Z DC C 0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA — — PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h — Unimplemented — —
88h — Unimplemented — —
89h — Unimplemented — —
8Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the PC ---0 0000 ---0 0000
8Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 — ADIE — — — — — — -0-- ---- -0-- ----
8Dh — Unimplemented — —
8Eh PCON MPEEN — — — — PER POR BOR u--- -1qq u--- -1uu
8Fh — Unimplemented — —
90h — Unimplemented — —
91h — Unimplemented — —
92h — Unimplemented — —
93h — Unimplemented — —
94h — Unimplemented — —
95h — Unimplemented — —
96h — Unimplemented — —
97h — Unimplemented — —
98h — Unimplemented — —
99h — Unimplemented — —
9Ah — Unimplemented — —
9Bh — Unimplemented — —
9Ch — Unimplemented — —
9Dh — Unimplemented — —
9Eh — Unimplemented — —
9Fh ADCON1 — — — — — — PCFG1 PCFG0 ---- --00 ---- --00
TABLE 4-2: PIC16C715 SPECIAL FUNCTION REGISTER SUMMARY (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR, PER
Value on all
other resets
(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8> whose
contents are transferred to the upper byte of the program counter.
3: Other (non power-up) resets include external reset through MCLR and Watchdog Timer Reset.
4: The IRP and RP1 bits are reserved on the PIC16C715, always maintain these bits clear.
1997 Microchip Technology Inc. DS30272A-page 17
PIC16C71X
4.2.2.1 STATUS REGISTER
The STATUS register, shown in Figure 4-7, contains
the arithmetic status of the ALU, the RESET status and
the bank select bits for data memory.
The STATUS register can be the destination for any
instruction, as with any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Fur ther more, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper-three
bits and set the Z bit. This leaves the STATUS register
as 000u u1uu (where u = unchanged).
Applicable Devices 710 71 711 715
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register because these instructions do not
affect the Z, C or DC bits from the STATUS register . For
other instructions, not aff ecting any status bits, see the
"Instruction Set Summary."
Note 1: For those de vices that do not use bits IRP
and RP1 (STATUS<7:6>), maintain these
bits clear to ensure upward compatibility
with future products.
Note 2: The C and DC bits operate as a borrow
and digit borrow bit, respectively, in sub-
traction. See the SUBLW and SUBWF
instructions for examples.
FIGURE 4-7: STATUS REGISTER (ADDRESS 03h, 83h)
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD Z DC C R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h - 1FFh)
0 = Bank 0, 1 (00h - FFh)
bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing)
11 = Bank 3 (180h - 1FFh)
10 = Bank 2 (100h - 17Fh)
01 = Bank 1 (80h - FFh)
00 = Bank 0 (00h - 7Fh)
Each bank is 128 bytes
bit 4: TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
bit 3: PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2: Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1: DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(for borrow the polarity is reversed)
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
bit 0: C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)
1 = A carry-out from the most significant bit of the result occurred
0 = No carry-out from the most significant bit of the result occurred
Note: For borrow the polarity is reversed. A subtraction is executed by adding the two’s complement of
the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order
bit of the source register.
PIC16C71X
DS30272A-page 18 1997 Microchip Technology Inc.
4.2.2.2 OPTION REGISTER
The OPTION register is a readable and writable regis-
ter which contains various control bits to configure the
TMR0/WDT prescaler, the External INT Interrupt,
TMR0, and the weak pull-ups on PORTB.
Applicable Devices 710 71 711 715 Note: To achieve a 1:1 prescaler assignment for
the TMR0 register, assign the prescaler to
the Watchdog Timer by setting bit PSA
(OPTION<3>).
FIGURE 4-8: OPTION REGISTER (ADDRESS 81h, 181h)
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6: INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin
0 = Interrupt on falling edge of RB0/INT pin
bit 5: T0CS: TMR0 Clock Source Select bit
1 = Transition on RA4/T0CKI pin
0 = Internal instruction cycle clock (CLKOUT)
bit 4: T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on RA4/T0CKI pin
0 = Increment on low-to-high transition on RA4/T0CKI pin
bit 3: PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0: PS2:PS0: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value TMR0 Rate WDT Rate
1997 Microchip Technology Inc. DS30272A-page 19
PIC16C71X
4.2.2.3 INTCON REGISTER
The INTCON Register is a readable and writable regis-
ter which contains various enable and flag bits for the
TMR0 register overflow, RB Port change and Exter nal
RB0/INT pin interrupts.
Applicable Devices 710 71 711 715
Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>).
FIGURE 4-9: INTCON REGISTER (ADDRESS 0Bh, 8Bh)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE ADIE T0IE INTE RBIE T0IF INTF RBIF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: GIE:(1) Global Interrupt Enable bit
1 = Enables all un-masked interrupts
0 = Disables all interrupts
bit 6: ADIE: A/D Converter Interrupt Enable bit
1 = Enables A/D interrupt
0 = Disables A/D interrupt
bit 5: T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interrupt
bit 4: INTE: RB0/INT External Interrupt Enable bit
1 = Enables the RB0/INT external interrupt
0 = Disables the RB0/INT external interrupt
bit 3: RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2: T0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1: INTF: RB0/INT External Interrupt Flag bit
1 = The RB0/INT external interrupt occurred (must be cleared in software)
0 = The RB0/INT external interrupt did not occur
bit 0: RBIF: RB Port Change Interrupt Flag bit
1 = At least one of the RB7:RB4 pins changed state (must be cleared in software)
0 = None of the RB7:RB4 pins have changed state
Note 1: For the PIC16C71, if an interrupt occurs while the GIE bit is being cleared, the GIE bit may be uninten-
tionally re-enabled b y the RETFIE instruction in the user’s Interrupt Service Routine. Ref er to Section 8.5
for a detailed description.
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
PIC16C71X
DS30272A-page 20 1997 Microchip Technology Inc.
4.2.2.4 PIE1 REGISTER
This register contains the individual enable bits for the
Peripheral interrupts.
Applicable Devices 710 71 711 715 Note: Bit PEIE (INTCON<6>) must be set to
enable any peripheral interrupt.
FIGURE 4-10: PIE1 REGISTER (ADDRESS 8Ch)
U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
— ADIE — — — — — — R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: Unimplemented: Read as '0'
bit 6: ADIE: A/D Converter Interrupt Enable bit
1 = Enables the A/D interrupt
0 = Disables the A/D interrupt
bit 5-0: Unimplemented: Read as '0'
1997 Microchip Technology Inc. DS30272A-page 21
PIC16C71X
4.2.2.5 PIR1 REGISTER
This register contains the individual flag bits for the
Peripheral interrupts.
Applicable Devices 710 71 711 715 Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User soft-
ware should ensure the appropriate inter-
rupt flag bits are clear prior to enabling an
interrupt.
FIGURE 4-11: PIR1 REGISTER (ADDRESS 0Ch)
U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
— ADIF — — — — — — R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: Unimplemented: Read as '0'
bit 6: ADIF: A/D Converter Interrupt Flag bit
1 = An A/D conversion completed
0 = The A/D conversion is not complete
bit 5-0: Unimplemented: Read as '0'
PIC16C71X
DS30272A-page 22 1997 Microchip Technology Inc.
4.2.2.6 PCON REGISTER
The Power Control (PCON) register contains a flag bit
to allow differentiation between a Power-on Reset
(POR) to an external MCLR Reset or WDT Reset.
Those devices with brown-out detection circuitry con-
tain an additional bit to differentiate a Brown-out Reset
(BOR) condition from a Power-on Reset condition. For
the PIC16C715 the PCON register also contains status
bits MPEEN and PER. MPEEN reflects the value of the
MPEEN bit in the configuration word. PER indicates a
parity error reset has occurred.
Applicable Devices 710 71 711 715 Note: BOR is unknown on Power-on Reset. It
must then be set by the user and checked
on subsequent resets to see if BOR is
clear, indicating a bro wn-out has occurred.
The BOR status bit is a don't care and is
not necessarily predictable if the brown-out
circuit is disabled (by clearing the BODEN
bit in the Configuration word).
FIGURE 4-12: PCON REGISTER (ADDRESS 8Eh), PIC16C710/711
FIGURE 4-13: PCON REGISTER (ADDRESS 8Eh), PIC16C715
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-q
— — — — — — POR BOR R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-2: Unimplemented: Read as '0'
bit 1: POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0: BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
R-U U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-q
MPEEN — — — — PER POR BOR(1) R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: MPEEN: Memory Parity Error Circuitry Status bit
Reflects the value of configuration word bit, MPEEN
bit 6-3: Unimplemented: Read as '0'
bit 2: PER: Memory Parity Error Reset Status bit
1 = No Error occurred
0 = Program Memory Fetch Parity Error occurred (must be set in software after a Parity Error Reset)
bit 1: POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0: BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
1997 Microchip Technology Inc. DS30272A-page 23
PIC16C71X
4.3 PCL and PCLATH
The program counter (PC) is 13-bits wide . The low byte
comes from the PCL register, which is a readable and
writable register. The upper bits (PC<12:8>) are not
readable, but are indirectly writable through the
PCLATH register. On any reset, the upper bits of the
PC will be cleared. Figure 4-14 shows the two situa-
tions for the loading of the PC. The upper example in
the figure shows how the PC is loaded on a write to
PCL (PCLATH<4:0> → PCH). The lower example in the
figure shows how the PC is loaded during a CALL or
GOTO instruction (PCLATH<4:3> → PCH).
FIGURE 4-14: LOADING OF PC IN
DIFFERENT SITUATIONS
4.3.1 COMPUTED GOTO
A computed GOTO is accomplished by adding an off-
set to the program counter (ADDWF PCL). When doing a
table read using a computed GOTO method, care
should be e x ercised if the tab le location crosses a PCL
memory boundar y (each 256 byte block). Refer to the
application note
“Implementing a Table Read"
(AN556).
PC 12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction with
ALU
GOTO, CALL
Opcode <10:0>
8
PC 12 11 10 0
11
PCLATH<4:3>
PCH PCL
8 7
2
PCLATH
PCH PCL
PCL as
Destination
4.3.2 STACK
The PIC16CXX family has an 8 lev el deep x 13-bit wide
hardware stack. The stack space is not part of either
program or data space and the stack pointer is not
readable or writable . The PC is PUSHed onto the stac k
when a CALL instruction is executed or an interrupt
causes a branch. The stack is POPed in the event of a
RETURN, RETLW or a RETFIE instruction execution.
PCLATH is not affected by a PUSH or POP operation.
The stack oper ates as a circular buff er . This means that
after the stack has been PUSHed eight times , the ninth
push ov erwrites the v alue that w as stored from the first
push. The tenth push overwrites the second push (and
so on).
4.4 Program Memory Paging
The PIC16C71X devices ignore both paging bits
(PCLATH<4:3>, which are used to access program
memory when more than one page is available. The
use of PCLATH<4:3> as general purpose read/write
bits for the PIC16C71X is not recommended since this
may affect upward compatibility with future products.
Note 1: There are no status bits to indicate stack
overflow or stack underflow conditions.
Note 2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the e xecution of the CALL,
RETURN, RETLW, and RETFIE instruc-
tions, or the vectoring to an interrupt
address.
PIC16C71X
DS30272A-page 24 1997 Microchip Technology Inc.
Example 4-1 shows the calling of a subroutine in
page 1 of the program memory. This e xample assumes
that PCLATH is saved and restored b y the interrupt ser-
vice routine (if interrupts are used).
EXAMPLE 4-1: CALL OF A SUBROUTINE IN
PAGE 1 FROM PAGE 0
ORG 0x500
BSF PCLATH,3 ;Select page 1 (800h-FFFh)
BCF PCLATH,4 ;Only on >4K devices
CALL SUB1_P1 ;Call subroutine in
: ;page 1 (800h-FFFh)
:
:
ORG 0x900
SUB1_P1: ;called subroutine
: ;page 1 (800h-FFFh)
:
RETURN ;return to Call subroutine
;in page 0 (000h-7FFh)
4.5 Indirect Addressing, INDF and FSR
Registers
The INDF register is not a ph ysical register . Addressing
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF reg-
ister. Any instruction using the INDF register actually
accesses the register pointed to by the File Select Reg-
ister, FSR. Reading the INDF register itself indirectly
(FSR = '0') will read 00h. Writing to the INDF register
indirectly results in a no-operation (although status bits
may be affected). An effectiv e 9-bit address is obtained
by concatenating the 8-bit FSR register and the IRP bit
(STATUS<7>), as shown in Figure 4-15. However, IRP
is not used in the PIC16C71X devices.
A simple program to clear RAM locations 20h-2Fh
using indirect addressing is shown in Example 4-2.
EXAMPLE 4-2: INDIRECT ADDRESSING
movlw 0x20 ;initialize pointer
movwf FSR ;to RAM
NEXT clrf INDF ;clear INDF register
incf FSR,F ;inc pointer
btfss FSR,4 ;all done?
goto NEXT ;no clear next
CONTINUE
: ;yes continue
FIGURE 4-15: DIRECT/INDIRECT ADDRESSING
For register file map detail see Figure 4-4.
Note 1: The RP1 and IRP bits are reserved, always maintain these bits clear.
Data
Memory
Indirect AddressingDirect Addressing
bank select location select
RP1:RP0 6 0
from opcode IRP(1) FSR register
70
bank select location select
00 01 10 11
Bank 0 Bank 1 Bank 2 Bank 3
FFh
80h
7Fh
00h
17Fh
100h
1FFh
180h
Not
Used
1997 Microchip Technology Inc. DS30272A-page 25
PIC16C71X
5.0 I/O PORTS
Some pins for these I/O por ts are multiplexed with an
alternate function for the peripheral features on the
device. In general, when a peripheral is enabled, that
pin may not be used as a general purpose I/O pin.
5.1 PORTA and TRISA Registers
PORTA is a 5-bit latch.
The RA4/T0CKI pin is a Schmitt Trigger input and an
open drain output. All other RA port pins have TTL
input le v els and full CMOS output driv ers . All pins hav e
data direction bits (TRIS registers) which can configure
these pins as output or input.
Setting a TRISA register bit puts the corresponding out-
put driver in a hi-impedance mode. Clearing a bit in the
TRISA register puts the contents of the output latch on
the selected pin(s).
Reading the PORTA register reads the status of the
pins whereas writing to it will wr ite to the port latch. All
write operations are read-modify-write operations.
Therefore a write to a port implies that the port pins are
read, this value is modified, and then written to the port
data latch.
Pin RA4 is multiplexed with the Timer0 module clock
input to become the RA4/T0CKI pin.
Other PORTA pins are multiplexed with analog inputs
and analog VREF input. The operation of each pin is
selected by clearing/setting the control bits in the
ADCON1 register (A/D Control Register1).
The TRISA register controls the direction of the RA
pins, even when they are being used as analog inputs.
The user must ensure the bits in the TRISA register are
maintained set when using them as analog inputs.
EXAMPLE 5-1: INITIALIZING PORTA
BCF STATUS, RP0 ;
CLRF PORTA ; Initialize PORTA by
; clearing output
; data latches
BSF STATUS, RP0 ; Select Bank 1
MOVLW 0xCF ; Value used to
; initialize data
; direction
MOVWF TRISA ; Set RA<3:0> as inputs
; RA<4> as outputs
; TRISA<7:5> are always
; read as '0'.
Applicable Devices 710 71 711 715
Note: On a Power-on Reset, these pins are con-
figured as analog inputs and read as '0'.
FIGURE 5-1: BLOCK DIAGRAM OF
RA3:RA0 PINS
FIGURE 5-2: BLOCK DIAGRAM OF RA4/
T0CKI PIN
Data
bus
QD
Q
CK
QD
Q
CK
Q D
EN
P
N
WR
Port
WR
TRIS
Data Latch
TRIS Latch
RD TRIS
RD PORT
VSS
VDD
I/O pin(1)
Note 1: I/O pins have protection diodes to VDD and
VSS.
Analog
input
mode
TTL
input
buffer
To A/D Converter
Data
bus
WR
PORT
WR
TRIS
RD PORT
Data Latch
TRIS Latch
RD TRIS
Schmitt
Trigger
input
buffer
N
VSS
I/O pin(1)
TMR0 clock input
Note 1: I/O pin has protection diodes to VSS only.
QD
Q
CK
QD
Q
CK
EN
Q D
EN
PIC16C71X
DS30272A-page 26 1997 Microchip Technology Inc.
TABLE 5-1: PORTA FUNCTIONS
TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Name Bit# Buffer Function
RA0/AN0 bit0 TTL Input/output or analog input
RA1/AN1 bit1 TTL Input/output or analog input
RA2/AN2 bit2 TTL Input/output or analog input
RA3/AN3/VREF bit3 TTL Input/output or analog input/VREF
RA4/T0CKI bit4 ST Input/output or external clock input for Timer0
Output is open drain type
Legend: TTL = TTL input, ST = Schmitt Trigger input
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR
Value on all
other resets
05h PORTA — — — RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u 0000
85h TRISA — — — PORTA Data Direction Register ---1 1111 ---1 1111
9Fh ADCON1 — — — — — — PCFG1 PCFG0 ---- --00 ---- --00
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by PORTA.
1997 Microchip Technology Inc. DS30272A-page 27
PIC16C71X
5.2 PORTB and TRISB Registers
PORTB is an 8-bit wide bi-directional port. The corre-
sponding data direction register is TRISB. Setting a bit
in the TRISB register puts the corresponding output
driver in a hi-impedance input mode. Clearing a bit in
the TRISB register puts the contents of the output latch
on the selected pin(s).
EXAMPLE 5-2: INITIALIZING PORTB
BCF STATUS, RP0 ;
CLRF PORTB ; Initialize PORTB by
; clearing output
; data latches
BSF STATUS, RP0 ; Select Bank 1
MOVLW 0xCF ; Value used to
; initialize data
; direction
MOVWF TRISB ; Set RB<3:0> as inputs
; RB<5:4> as outputs
; RB<7:6> as inputs
Each of the POR TB pins has a weak internal pull-up . A
single control bit can turn on all the pull-ups. This is
performed by clearing bit RBPU (OPTION<7>). The
weak pull-up is automatically turned off when the por t
pin is configured as an output. The pull-ups are dis-
abled on a Power-on Reset.
FIGURE 5-3: BLOCK DIAGRAM OF
RB3:RB0 PINS
Data Latch
RBPU(2) P
VDD
QD
CK
QD
CK
Q D
EN
Data bus
WR Port
WR TRIS
RD TRIS
RD Port
weak
pull-up
RD Port
RB0/INT
I/O
pin(1)
TTL
Input
Buffer
Note 1: I/O pins have diode protection to VDD and VSS.
2: TRISB = ’1’ enables weak pull-up if
RBPU = ’0’ (OPTION<7>).
Schmitt Trigger
Buffer
TRIS Latch
Four of PORTB’s pins, RB7:RB4, have an interrupt on
change feature. Only pins configured as inputs can
cause this interrupt to occur (i.e. an y RB7:RB4 pin con-
figured as an output is excluded from the interrupt on
change comparison). The input pins (of RB7:RB4) are
compared with the old value latched on the last read of
POR TB . The “mismatch” outputs of RB7:RB4 are
OR’ed together to generate the RB Port Change Inter-
rupt with flag bit RBIF (INTCON<0>).
This interrupt can wake the device from SLEEP. The
user, in the interrupt service routine, can clear the inter-
rupt in the following manner:
a) Any read or write of PORTB. This will end the
mismatch condition.
b) Clear flag bit RBIF.
A mismatch condition will continue to set flag bit RBIF.
Reading PORTB will end the mismatch condition, and
allow flag bit RBIF to be cleared.
This interrupt on mismatch feature, together with soft-
ware configurable pull-ups on these four pins allow
easy interface to a keypad and make it possible for
wake-up on key-depression. Refer to the Embedded
Control Handbook,
"Implementing Wake-Up on Key
Stroke"
(AN552).
The interrupt on change feature is recommended for
wake-up on key depression operation and operations
where PORTB is only used for the interrupt on change
feature. Polling of PORTB is not recommended while
using the interrupt on change feature.
Note: For the PIC16C71
if a change on the I/O pin should occur
when the read operation is being e xecuted
(start of the Q2 cycle), then interrupt flag bit
RBIF may not get set.
PIC16C71X
DS30272A-page 28 1997 Microchip Technology Inc.
FIGURE 5-4: BLOCK DIAGRAM OF
RB7:RB4 PINS
(PIC16C71)
Data Latch
From other
RBPU(2) P
VDD
I/O
QD
CK
QD
CK
Q D
EN
Q D
EN
Data bus
WR Port
WR TRIS
Set RBIF
TRIS Latch
RD TRIS
RD Port
RB7:RB4 pins
weak
pull-up
RD Port
Latch
TTL
Input
Buffer
pin(1)
ST
Buffer
RB7:RB6 in serial programming mode
Note 1: I/O pins have diode protection to VDD and VSS.
2: TRISB = ’1’ enables weak pull-up if
RBPU = ’0’ (OPTION<7>).
FIGURE 5-5: BLOCK DIAGRAM OF
RB7:RB4 PINS
(PIC16C710/711/715)
Data Latch
From other
RBPU(2) P
VDD
I/O
QD
CK
QD
CK
Q D
EN
Q D
EN
Data bus
WR Port
WR TRIS
Set RBIF
TRIS Latch
RD TRIS
RD Port
RB7:RB4 pins
weak
pull-up
RD Port
Latch
TTL
Input
Buffer
pin(1)
ST
Buffer
RB7:RB6 in serial programming mode Q3
Q1
Note 1: I/O pins have diode protection to VDD and VSS.
2: TRISB = ’1’ enables weak pull-up if
RBPU = ’0’ (OPTION<7>).
TABLE 5-3: PORTB FUNCTIONS
Name Bit# Buffer Function
RB0/INT bit0 TTL/ST(1) Input/output pin or external interrupt input. Internal software
programmable weak pull-up.
RB1 bit1 TTL Input/output pin. Internal software programmable weak pull-up.
RB2 bit2 TTL Input/output pin. Internal software programmable weak pull-up.
RB3 bit3 TTL Input/output pin. Internal software programmable weak pull-up.
RB4 bit4 TTL Input/output pin (with interrupt on change). Internal software programmab le
weak pull-up.
RB5 bit5 TTL Input/output pin (with interrupt on change). Internal software programmab le
weak pull-up.
RB6 bit6 TTL/ST(2) Input/output pin (with interrupt on change). Internal software progr ammab le
weak pull-up. Serial programming clock.
RB7 bit7 TTL/ST(2) Input/output pin (with interrupt on change). Internal software progr ammab le
weak pull-up. Serial programming data.
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in serial programming mode.
1997 Microchip Technology Inc. DS30272A-page 29
PIC16C71X
TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR
Value on all
other resets
06h, 106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
86h, 186h TRISB PORTB Data Direction Register 1111 1111 1111 1111
81h, 181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB.
PIC16C71X
DS30272A-page 30 1997 Microchip Technology Inc.
5.3 I/O Programming Considerations
5.3.1 BI-DIRECTIONAL I/O PORTS
Any instruction which writes, operates internally as a
read followed by a write operation. The BCF and BSF
instructions, for example, read the register into the
CPU, execute the bit operation and write the result
back to the register. Caution must be used when these
instructions are applied to a por t with both inputs and
outputs defined. For example, a BSF operation on bit5
of POR TB will cause all eight bits of POR TB to be read
into the CPU. Then the BSF operation takes place on
bit5 and PORTB is written to the output latches. If
another bit of POR TB is used as a bi-directional I/O pin
(e.g., bit0) and it is defined as an input at this time, the
input signal present on the pin itself would be read into
the CPU and rewritten to the data latch of this particular
pin, ov erwriting the previous content. As long as the pin
stays in the input mode, no problem occurs. However,
if bit0 is switched to an output, the content of the data
latch may now be unknown.
Reading the por t register, reads the values of the por t
pins. Wr iting to the por t register wr ites the value to the
port latch. When using read-modify-write instructions
(ex. BCF, BSF, etc.) on a port, the value of the port pins
is read, the desired operation is done to this v alue , and
this value is then written to the port latch.
Example 5-3 shows the effect of two sequential read-
modify-write instructions on an I/O port.
EXAMPLE 5-3: READ-MODIFY-WRITE
INSTRUCTIONS ON AN I/O
PORT
;Initial PORT settings: PORTB<7:4> Inputs
; PORTB<3:0> Outputs
;PORTB<7:6> have external pull-ups and are
;not connected to other circuitry
;
; PORT latch PORT pins
; ---------- ---------
BCF PORTB, 7 ; 01pp pppp 11pp pppp
BCF PORTB, 6 ; 10pp pppp 11pp pppp
BSF STATUS, RP0 ;
BCF TRISB, 7 ; 10pp pppp 11pp pppp
BCF TRISB, 6 ; 10pp pppp 10pp pppp
;
;Note that the user may have expected the
;pin values to be 00pp ppp. The 2nd BCF
;caused RB7 to be latched as the pin value
;(high).
A pin actively outputting a Low or High should not be
driven from external devices at the same time in order
to change the le vel on this pin (“wired-or”, “wired-and”).
The resulting high output currents may damage the
chip.
5.3.2 SUCCESSIVE OPER ATIONS ON I/O PORTS
The actual write to an I/O port happens at the end of an
instruction cycle, whereas for reading, the data must be
valid at the beginning of the instruction cycle
(Figure 5-6). Therefore, care must be exercised if a
write followed by a read operation is carried out on the
same I/O port. The sequence of instr uctions should be
such to allow the pin voltage to stabilize (load depen-
dent) before the next instruction which causes that file
to be read into the CPU is executed. Otherwise, the
previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
FIGURE 5-6: SUCCESSIVE I/O OPERATION
PC PC + 1 PC + 2 PC + 3
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Instruction
fetched
RB7:RB0
MOVWF PORTB
write to
PORTB NOP
Port pin
sampled here
NOP
MOVF PORTB,W
Instruction
executed MOVWF PORTB
write to
PORTB
NOP
MOVF PORTB,W
PC
TPD
Note:
This example sho ws a write to POR TB
followed by a read from PORTB.
Note that:
data setup time = (0.25TCY - TPD)
where TCY = instruction cycle
TPD = propagation delay
Therefore, at higher clock frequencies ,
a write followed by a read may be
problematic.
1997 Microchip Technology Inc. DS30272A-page 31
PIC16C71X
6.0 TIMER0 MODULE
The Timer0 module timer/counter has the follo wing fea-
tures:
•8-bit timer/counter
• Readable and writable
• 8-bit software programmable prescaler
• Internal or external clock select
• Interrupt on overflow from FFh to 00h
• Edge select for external clock
Figure 6-1 is a simplified block diagram of the Timer0
module.
Timer mode is selected by clearing bit T0CS
(OPTION<5>). In timer mode, the Timer0 module will
increment e very instruction cycle (without prescaler). If
the TMR0 register is written, the increment is inhibited
for the following two instruction cycles (Figure 6-2 and
Figure 6-3). The user can work around this by writing
an adjusted value to the TMR0 register.
Counter mode is selected by setting bit T0CS
(OPTION<5>). In counter mode, Timer0 will increment
either on e very rising or falling edge of pin RA4/T0CKI.
The incrementing edge is determined by the Timer0
Source Edge Select bit T0SE (OPTION<4>). Clearing
Applicable Devices 710 71 711 715
bit T0SE selects the rising edge. Restrictions on the
external clock input are discussed in detail in
Section 6.2.
The prescaler is mutually exclusively shared between
the Timer0 module and the Watchdog Timer. The pres-
caler assignment is controlled in software b y control bit
PSA (OPTION<3>). Clearing bit PSA will assign the
prescaler to the Timer0 module. The prescaler is not
readable or writable . When the prescaler is assigned to
the Timer0 module, prescale values of 1:2, 1:4, ...,
1:256 are selectable. Section 6.3 details the operation
of the prescaler.
6.1 Timer0 Interrupt
The TMR0 interrupt is generated when the TMR0 reg-
ister overflows from FFh to 00h. This overflow sets bit
T0IF (INTCON<2>). The interrupt can be masked by
clearing bit T0IE (INTCON<5>). Bit T0IF must be
cleared in software b y the Timer0 module interrupt ser-
vice routine before re-enabling this interrupt. The
TMR0 interrupt cannot awaken the processor from
SLEEP since the timer is shut off during SLEEP. See
Figure 6-4 for Timer0 interrupt timing.
FIGURE 6-1: TIMER0 BLOCK DIAGRAM
FIGURE 6-2: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
Note 1: T0CS, T0SE, PSA, PS2:PS0 (OPTION<5:0>).
2: The prescaler is shared with Watchdog Timer (refer to Figure 6-6 for detailed block diagram).
RA4/T0CKI
T0SE
0
1
1
0
pin
T0CS
FOSC/4
Programmable
Prescaler
Sync with
Internal
clocks TMR0
PSout
(2 cycle delay)
PSout
Data bus
8
PSA
PS2, PS1, PS0 Set interrupt
flag bit T0IF
on overflow
3
PC-1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
Instruction
Fetch
TMR0
PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
T0 T0+1 T0+2 NT0 NT0 NT0 NT0+1 NT0+2 T0
MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Write TMR0
executed Read TMR0
reads NT0 Read TMR0
reads NT0 Read TMR0
reads NT0 Read TMR0
reads NT0 + 1 Read TMR0
reads NT0 + 2
Instruction
Executed
PIC16C71X
DS30272A-page 32 1997 Microchip Technology Inc.
FIGURE 6-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
FIGURE 6-4: TIMER0 INTERRUPT TIMING
PC+
6
PC-1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
Instruction
Fetch
TMR0
PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
T0 NT0+1
MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Write TMR0
executed Read TMR0
reads NT0 Read TMR0
reads NT0 Read TMR0
reads NT0 Read TMR0
reads NT0 Read TMR0
reads NT0 + 1
T0+1 NT0
Instruction
Execute
Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
11
OSC1
CLKOUT(3)
Timer0
T0IF bit
(INTCON<2>)
FEh
GIE bit
(INTCON<7>)
INSTRUCTION
PC
Instruction
fetched
PC PC +1 PC +1 0004h 0005h
Instruction
executed
Inst (PC)
Inst (PC-1)
Inst (PC+1)
Inst (PC)
Inst (0004h) Inst (0005h)
Inst (0004h)Dummy cycle Dummy cycle
FFh 00h 01h 02h
Note 1: Interrupt flag bit T0IF is sampled here (every Q1).
2: Interrupt latency = 4Tcy where Tcy = instruction cycle time.
3: CLKOUT is available only in RC oscillator mode.
FLOW
1997 Microchip Technology Inc. DS30272A-page 33
PIC16C71X
6.2 Using Timer0 with an External Clock
When an e xternal clock input is used f or Timer0, it must
meet certain requirements. The requirements ensure
the external clock can be synchroniz ed with the internal
phase clock (TOSC). Also, there is a delay in the actual
incrementing of Timer0 after synchronization.
6.2.1 EXTERNAL CLOCK SYNCHRONIZATION
When no prescaler is used, the exter nal clock input is
the same as the prescaler output. The synchronization
of T0CKI with the internal phase clocks is accom-
plished by sampling the prescaler output on the Q2 and
Q4 cycles of the internal phase clocks (Figure 6-5).
Therefore, it is necessary for T0CKI to be high for at
least 2Tosc (and a small RC delay of 20 ns) and lo w f or
at least 2Tosc (and a small RC delay of 20 ns). Refer to
the electrical specification of the desired device.
When a prescaler is used, the external clock input is
divided by the asynchronous ripple-counter type pres-
caler so that the prescaler output is symmetrical. For
the external clock to meet the sampling requirement,
the ripple-counter must be taken into account. There-
fore, it is necessary for T0CKI to have a period of at
least 4Tosc (and a small RC delay of 40 ns) divided by
the prescaler value. The only requirement on T0CKI
high and low time is that they do not violate the mini-
mum pulse width requirement of 10 ns. Refer to param-
eters 40, 41 and 42 in the electrical specification of the
desired device.
6.2.2 TMR0 INCREMENT DELAY
Since the prescaler output is synchronized with the
internal clocks, there is a small delay from the time the
external clock edge occurs to the time the Timer0 mod-
ule is actually incremented. Figure 6-5 shows the delay
from the e xternal clock edge to the timer incrementing.
FIGURE 6-5: TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
External Clock Input or
Prescaler output (2)
External Clock/Prescaler
Output after sampling
Increment Timer0 (Q4)
Timer0 T0 T0 + 1 T0 + 2
Small pulse
misses sampling
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = ±4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.
(3) (1)
PIC16C71X
DS30272A-page 34 1997 Microchip Technology Inc.
6.3 Prescaler
An 8-bit counter is available as a prescaler for the
Timer0 module, or as a postscaler for the Watchdog
Timer, respectively (Figure 6-6). For simplicity, this
counter is being referred to as “prescaler” throughout
this data sheet. Note that there is only one prescaler
available which is mutually e xclusiv ely shared between
the Timer0 module and the Watchdog Timer. Thus, a
prescaler assignment for the Timer0 module means
that there is no prescaler for the Watchdog Timer, and
vice-versa.
The PSA and PS2:PS0 bits (OPTION<3:0>) determine
the prescaler assignment and prescale ratio.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g. CLRF 1, MOVWF 1,
BSF 1,x....etc.) will clear the prescaler. When
assigned to WDT, a CLRWDT instruction will clear the
prescaler along with the Watchdog Timer. The pres-
caler is not readable or writable.
Note: Writing to TMR0 when the prescaler is
assigned to Timer0 will clear the prescaler
count, but will not change the prescaler
assignment.
FIGURE 6-6: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
RA4/T0CKI
T0SE
pin
M
U
X
CLKOUT (=Fosc/4)
SYNC
2
Cycles TMR0 reg
8-bit Prescaler
8 - to - 1MUX
M
U
X
M U X
Watchdog
Timer
PSA
01
0
1
WDT
Time-out
PS2:PS0
8
Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION<5:0>).
PSA
WDT Enable bit
M
U
X
0
10
1
Data Bus
Set flag bit T0IF
on Overflow
8
PSA
T0CS
1997 Microchip Technology Inc. DS30272A-page 35
PIC16C71X
6.3.1 SWITCHING PRESCALER ASSIGNMENT
The prescaler assignment is fully under software con-
trol, i.e., it can be changed “on the fly” during program
execution.
Note: To avoid an unintended de vice RESET, the
following instruction sequence (shown in
Example 6-1) must be executed when
changing the prescaler assignment from
Timer0 to the WDT. This sequence must be
followed even if the WDT is disabled.
EXAMPLE 6-1: CHANGING PRESCALER (TIMER0→WDT)
BCF STATUS, RP0 ;Bank 0
CLRF TMR0 ;Clear TMR0 & Prescaler
BSF STATUS, RP0 ;Bank 1
CLRWDT ;Clears WDT
MOVLW b'xxxx1xxx' ;Selects new prescale value
MOVWF OPTION_REG ;and assigns the prescaler to the WDT
BCF STATUS, RP0 ;Bank 0
To change prescaler from the WDT to the Timer0
module use the sequence shown in Example 6-2.
EXAMPLE 6-2: CHANGING PRESCALER (WDT→TIMER0)
CLRWDT ;Clear WDT and prescaler
BSF STATUS, RP0 ;Bank 1
MOVLW b'xxxx0xxx' ;Select TMR0, new prescale value and
MOVWF OPTION_REG ;clock source
BCF STATUS, RP0 ;Bank 0
TABLE 6-1: REGISTERS ASSOCIATED WITH TIMER0
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR
Value on all
other resets
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
0Bh,8Bh, INTCON GIE ADIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
85h TRISA — — — PORTA Data Direction Register ---1 1111 ---1 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by Timer0.
PIC16C71X
DS30272A-page 36 1997 Microchip Technology Inc.
NOTES:
1997 Microchip Technology Inc. DS30272A-page 37
PIC16C71X
FIGURE 7-1: ADCON0 REGISTER (ADDRESS 08h), PIC16C710/71/711
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCS1 ADCS0 — (1) CHS1 CHS0 GO/DONE ADIF ADON R =Readable bit
W =Writable bit
U =Unimplemented
bit, read as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits
00 = FOSC/2
01 = FOSC/8
10 = FOSC/32
11 = FRC (clock derived from an RC oscillation)
bit 5: Unimplemented: Read as '0'.
bit 4-3: CHS1:CHS0: Analog Channel Select bits
00 = channel 0, (RA0/AN0)
01 = channel 1, (RA1/AN1)
10 = channel 2, (RA2/AN2)
11 = channel 3, (RA3/AN3)
bit 2: GO/DONE: A/D Conversion Status bit
If ADON = 1:
1 = A/D conversion in progress (setting this bit starts the A/D conversion)
0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conver-
sion is complete)
bit 1: ADIF: A/D Conversion Complete Interrupt Flag bit
1 = conversion is complete (must be cleared in software)
0 = conversion is not complete
bit 0: ADON: A/D On bit
1 = A/D converter module is operating
0 = A/D converter module is shutoff and consumes no operating current
Note 1: Bit5 of ADCON0 is a General Pur pose R/W bit for the PIC16C710/711 only. For the PIC16C71, this bit is
unimplemented, read as '0'.
7.0 ANALOG-TO-DIGITAL
CONVERTER (A/D) MODULE
The analog-to-digital (A/D) converter module has four
analog inputs.
The A/D allows conversion of an analog input signal to
a corresponding 8-bit digital number (refer to Applica-
tion Note AN546 for use of A/D Converter). The output
of the sample and hold is the input into the conver ter,
which generates the result via successive approxima-
tion. The analog reference voltage is software select-
able to either the de vice’ s positiv e supply v oltage (VDD)
or the voltage level on the RA3/AN3/VREF pin.
Applicable Devices 710 71 711 715
The A/D converter has a unique feature of being able
to operate while the de vice is in SLEEP mode. To oper-
ate in sleep, the A/D conversion clock must be derived
from the A/D’s internal RC oscillator.
The A/D module has three registers. These registers
are: •A/D Result Register (ADRES)
• A/D Control Register 0 (ADCON0)
• A/D Control Register 1 (ADCON1)
The ADCON0 register, shown in Figure 7-1 and
Figure 7-2, controls the operation of the A/D module.
The ADCON1 register, shown in Figure 7-3 configures
the functions of the port pins. The port pins can be con-
figured as analog inputs (RA3 can also be a voltage ref-
erence) or as digital I/O.
PIC16C71X
DS30272A-page 38 1997 Microchip Technology Inc.
FIGURE 7-2: ADCON0 REGISTER (ADDRESS 1Fh), PIC16C715
FIGURE 7-3: ADCON1 REGISTER, PIC16C710/71/711 (ADDRESS 88h),
PIC16C715 (ADDRESS 9Fh)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
ADCS1 ADCS0 — CHS1 CHS0 GO/DONE — ADON R =Readable bit
W =Writable bit
U =Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits
00 = FOSC/2
01 = FOSC/8
10 = FOSC/32
11 = FRC (clock derived from an RC oscillation)
bit 5: Unused
bit 6-3: CHS1:CHS0: Analog Channel Select bits
000 = channel 0, (RA0/AN0)
001 = channel 1, (RA1/AN1)
010 = channel 2, (RA2/AN2)
011 = channel 3, (RA3/AN3)
100 = channel 0, (RA0/AN0)
101 = channel 1, (RA1/AN1)
110 = channel 2, (RA2/AN2)
111 = channel 3, (RA3/AN3)
bit 2: GO/DONE: A/D Conversion Status bit
If ADON = 1
1 = A/D conversion in progress (setting this bit starts the A/D conversion)
0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conver-
sion is complete)
bit 1: Unimplemented: Read as '0'
bit 0: ADON: A/D On bit
1 = A/D converter module is operating
0 = A/D converter module is shutoff and consumes no operating current
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — PCFG1 PCFG0 R =Readable bit
W =Writable bit
U =Unimplemented
bit, read as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7-2: Unimplemented: Read as '0'
bit 1-0: PCFG1:PCFG0: A/D Port Configuration Control bits
A = Analog input
D = Di
g
ital I/O
PCFG1:PCFG0 RA1 & RA0 RA2 RA3 VREF
00 A A A VDD
01 A A VREF RA3
10 A D D VDD
11 D D D VDD
1997 Microchip Technology Inc. DS30272A-page 39
PIC16C71X
The ADRES register contains the result of the A/D con-
version. When the A/D conversion is complete, the
result is loaded into the ADRES register , the GO/DONE
bit (ADCON0<2>) is cleared, and A/D interrupt flag bit
ADIF is set. The block diagram of the A/D module is
shown in Figure 7-4.
After the A/D module has been configured as desired,
the selected channel must be acquired before the con-
version is started. The analog input channels must
have their corresponding TRIS bits selected as an
input. To determine acquisition time, see Section 7.1.
After this acquisition time has elapsed the A/D conver-
sion can be star ted. The following steps should be fol-
lowed for doing an A/D conversion:
1. Configure the A/D module:
• Configure analog pins / voltage reference /
and digital I/O (ADCON1)
• Select A/D input channel (ADCON0)
• Select A/D conversion clock (ADCON0)
• Turn on A/D module (ADCON0)
2. Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
3. Wait the required acquisition time.
4. Start conversion:
• Set GO/DONE bit (ADCON0)
5. Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE bit to be cleared
OR
• Waiting for the A/D interrupt
6. Read A/D Result register (ADRES), clear bit
ADIF if required.
7. For next conversion, go to step 1 or step 2 as
required. The A/D conversion time per bit is
defined as TAD. A minimum wait of 2TAD is
required before next acquisition starts.
FIGURE 7-4: A/D BLOCK DIAGRAM
(Input voltage)
VIN
VREF
(Reference
voltage)
VDD
PCFG1:PCFG0
CHS1:CHS0
00 or
10 or
11
01
RA3/AN3/VREF
RA0/AN0
RA2/AN2
RA1/AN1
11
10
01
00
A/D
Converter
PIC16C71X
DS30272A-page 40 1997 Microchip Technology Inc.
7.1 A/D Acquisition Requirements
For the A/D converter to meet its specified accuracy,
the charge holding capacitor (CHOLD) must be allowed
to fully charge to the input channel voltage level. The
analog input model is shown in Figure 7-5. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD),
Figure 7-5. The source impedance affects the offset
voltage at the analog input (due to pin leakage current).
The maximum recommended impedance for ana-
log sources is 10 kΩ. After the analog input channel is
selected (changed) this acquisition must be done
before the conversion can be started.
To calculate the minimum acquisition time, Equation 7-
1 ma y be used. This equation calculates the acquisition
time to within 1/2 LSb error is used (512 steps for the
A/D). The 1/2 LSb error is the maximum error allowed
for the A/D to meet its specified accuracy.
EQUATION 7-1: A/D MINIMUM CHARGING
TIME
VHOLD = (VREF - (VREF/512)) • (1 - e(-TCAP/CHOLD(RIC + RSS + RS)))
Given: VHOLD = (VREF/512), for 1/2 LSb resolution
The above equation reduces to:
TCAP = -(51.2 pF)(1 kΩ + RSS + RS) ln(1/511)
Example 7-1 shows the calculation of the minimum
required acquisition time TACQ. This calculation is
based on the following system assumptions.
CHOLD = 51.2 pF
Rs = 10 kΩ
1/2 LSb error
VDD = 5V → Rss = 7 kΩ
Temp (application system max.) = 50°C
VHOLD = 0 @ t = 0
EXAMPLE 7-1: CALCULATING THE
MINIMUM REQUIRED
AQUISITION TIME
TACQ = Amplifier Settling Time +
Holding Capacitor Charging Time +
Temperature Coefficient
TACQ = 5 µs + TCAP + [(Temp - 25°C)(0.05 µs/°C)]
TCAP = -CHOLD (RIC + RSS + RS) ln(1/511)
-51.2 pF (1 kΩ + 7 kΩ + 10 kΩ) ln(0.0020)
-51.2 pF (18 kΩ) ln(0.0020)
-0.921 µs (-6.2364)
5.747 µs
TACQ = 5 µs + 5.747 µs + [(50°C - 25°C)(0.05 µs/°C)]
10.747 µs + 1.25 µs
11.997 µs
Note 1: The reference voltage (VREF) has no
effect on the equation, since it cancels
itself out.
Note 2: The charge holding capacitor (CHOLD) is
not discharged after each conversion.
Note 3: The maximum recommended impedance
for analog sources is 10 kΩ. This is
required to meet the pin leakage specifi-
cation.
Note 4: After a conversion has completed, a
2.0TAD dela y must complete before acqui-
sition can begin again. During this time the
holding capacitor is not connected to the
selected A/D input channel.
FIGURE 7-5: ANALOG INPUT MODEL
CPIN
VA
Rs ANx
5 pF
VDD
VT = 0.6V
VT = 0.6V I leakage
RIC ≤ 1k
Sampling
Switch
SS RSS
CHOLD
= DAC capacitance
VSS
6V
Sampling Switch
5V
4V
3V
2V
5 6 7 8 9 10 11
( kΩ )
VDD
= 51.2 pF
± 500 nA
Legend CPIN
VT
I leakage
RIC
SS
CHOLD
= input capacitance
= threshold voltage
= leakage current at the pin due to
= interconnect resistance
= sampling switch
= sample/hold capacitance (from DAC)
various junctions
1997 Microchip Technology Inc. DS30272A-page 41
PIC16C71X
7.2 Selecting the A/D Conversion Clock
The A/D conversion time per bit is defined as TAD. The
A/D conversion requires 9.5TAD per 8-bit conversion.
The source of the A/D conversion clock is software
selectable. The four possible options for TAD are:
• 2TOSC
• 8TOSC
• 32TOSC
• Internal RC oscillator
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of:
2.0 µs for the PIC16C71
1.6 µs for all other PIC16C71X devices
Table 7-1 and Table 7-2 and show the resultant TAD
times derived from the device operating frequencies
and the A/D clock source selected.
7.3 Configuring Analog Port Pins
The ADCON1 and TRISA registers control the opera-
tion of the A/D port pins. The port pins that are desired
as analog inputs must have their corresponding TRIS
bits set (input). If the TRIS bit is cleared (output), the
digital output level (VOH or VOL) will be converted.
The A/D operation is independent of the state of the
CHS2:CHS0 bits and the TRIS bits.
Note 1: When reading the port register, all pins
configured as analog input channels will
read as cleared (a low level). Pins config-
ured as digital inputs, will convert an ana-
log input. Analog levels on a digitally
configured input will not aff ect the conv er-
sion accuracy.
Note 2: Analog lev els on any pin that is defined as
a digital input (including the AN7:AN0
pins), may cause the input buffer to con-
sume current that is out of the devices
specification.
TABLE 7-1: TAD vs. DEVICE OPERATING FREQUENCIES, PIC16C71
TABLE 7-2: TAD vs. DEVICE OPERATING FREQUENCIES, PIC16C710/711, PIC16C715
AD Clock Source (TAD) Device Frequency
Operation ADCS1:ADCS0 20 MHz 16 MHz 4 MHz 1 MHz 333.33 kHz
2TOSC 00 100 ns(2) 125 ns(2) 500 ns(2) 2.0 µs 6 µs
8TOSC 01 400 ns(2) 500 ns(2) 2.0 µs 8.0 µs24 µs(3)
32TOSC 10 1.6 µs(2) 2.0 µs 8.0 µs32.0 µs(3) 96 µs(3)
RC(5) 11 2 - 6 µs(1,4) 2 - 6 µs(1,4) 2 - 6 µs(1,4) 2 - 6 µs(1) 2 - 6 µs(1)
Legend: Shaded cells are outside of recommended range.
Note 1: The RC source has a typical TAD time of 4 µs.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for
sleep operation only.
5: For extended voltage devices (LC), please refer to Electrical Specifications section.
AD Clock Source (TAD) Device Frequency
Operation ADCS1:ADCS0 20 MHz 5 MHz 1.25 MHz 333.33 kHz
2TOSC 00 100 ns(2) 400 ns(2) 1.6 µs 6 µs
8TOSC 01 400 ns(2) 1.6 µs 6.4 µs24 µs(3)
32TOSC 10 1.6 µs 6.4 µs25.6 µs(3) 96 µs(3)
RC(5) 11 2 - 6 µs(1,4) 2 - 6 µs(1,4) 2 - 6 µs(1,4) 2 - 6 µs(1)
Legend: Shaded cells are outside of recommended range.
Note 1: The RC source has a typical TAD time of 4 µs.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for
sleep operation only.
5: For extended voltage devices (LC), please refer to Electrical Specifications section.
PIC16C71X
DS30272A-page 42 1997 Microchip Technology Inc.
7.4 A/D Conversions
Example 7-2 shows ho w to perform an A/D conv ersion.
The RA pins are configured as analog inputs. The ana-
log reference (VREF) is the device VDD. The A/D inter-
rupt is enabled, and the A/D conversion clock is FRC.
The conversion is performed on the RA0 pin (channel
0).
Clearing the GO/DONE bit during a conversion will
abort the current conversion. The ADRES register will
NOT be updated with the par tially completed A/D con-
version sample. That is, the ADRES register will con-
tinue to contain the value of the last completed
conversion (or the last v alue written to the ADRES reg-
ister). After the A/D conversion is aborted, a 2TAD wait
is required before the next acquisition is started. After
this 2TAD wait, an acquisition is automatically started
on the selected channel.
Note: The GO/DONE bit should NOT be set in
the same instruction that turns on the A/D.
EXAMPLE 7-2: A/D CONVERSION
BSF STATUS, RP0 ; Select Bank 1
CLRF ADCON1 ; Configure A/D inputs
BCF STATUS, RP0 ; Select Bank 0
MOVLW 0xC1 ; RC Clock, A/D is on, Channel 0 is selected
MOVWF ADCON0 ;
BSF INTCON, ADIE ; Enable A/D Interrupt
BSF INTCON, GIE ; Enable all interrupts
;
; Ensure that the required sampling time for the selected input channel has elapsed.
; Then the conversion may be started.
;
BSF ADCON0, GO ; Start A/D Conversion
: ; The ADIF bit will be set and the GO/DONE bit
: ; is cleared upon completion of the A/D Conversion.
1997 Microchip Technology Inc. DS30272A-page 43
PIC16C71X
7.4.1 FASTER CONVERSION - LOWER
RESOLUTION TRADE-OFF
Not all applications require a result with 8-bits of reso-
lution, but ma y instead require a f aster conversion time .
The A/D module allows users to make the trade-off of
conversion speed to resolution. Regardless of the res-
olution required, the acquisition time is the same. To
speed up the conversion, the clock source of the A/D
module may be switched so that the TAD time violates
the minimum specified time (see the applicab le electri-
cal specification). Once the TAD time violates the mini-
mum specified time, all the following A/D result bits are
not valid (see A/D Conversion Timing in the Electrical
Specifications section.) The cloc k sources may only be
switched between the three oscillator versions (cannot
be switched from/to RC). The equation to determine
the time before the oscillator can be switched is as
follows:
Conversion time = 2TAD + N • TAD + (8 - N)(2TOSC)
Where: N = number of bits of resolution required.
Since the TAD is based from the device oscillator, the
user must use some method (a timer, software loop,
etc.) to determine when the A/D oscillator may be
changed. Example 7-3 shows a comparison of time
required for a conversion with 4-bits of resolution, ver-
sus the 8-bit resolution conversion. The example is for
devices operating at 20 MHz and 16 MHz (The A/D
clock is programmed for 32TOSC), and assumes that
immediately after 6TAD, the A/D clock is programmed
for 2TOSC.
The 2TOSC violates the minimum TAD time since the
last 4-bits will not be converted to correct values.
EXAMPLE 7-3: 4-BIT vs. 8-BIT CONVERSION TIMES
Freq. (MHz)(1) Resolution
4-bit 8-bit
TAD 20 1.6 µs 1.6 µs
16 2.0 µs 2.0 µs
TOSC 20 50 ns 50 ns
16 62.5 ns 62.5 ns
2TAD + N • TAD + (8 - N)(2TOSC)20 10 µs 16 µs
16 12.5 µs 20 µs
Note 1: The PIC16C71 has a minimum TAD time of 2.0 µs.
All other PIC16C71X devices have a minimum TAD time of 1.6 µs.
PIC16C71X
DS30272A-page 44 1997 Microchip Technology Inc.
7.5 A/D Operation During Sleep
The A/D module can operate during SLEEP mode. This
requires that the A/D clock source be set to RC
(ADCS1:ADCS0 = 11). When the RC clock source is
selected, the A/D module waits one instruction cycle
before starting the conversion. This allows the SLEEP
instruction to be executed, which eliminates all digital
switching noise from the conversion. When the conv er-
sion is completed the GO/DONE bit will be cleared, and
the result loaded into the ADRES register. If the A/D
interrupt is enabled, the device will wake-up from
SLEEP. If the A/D interrupt is not enabled, the A/D mod-
ule will then be turned off, although the ADON bit will
remain set.
When the A/D clock source is another cloc k option (not
RC), a SLEEP instruction will cause the present conv er-
sion to be aborted and the A/D module to be turned off ,
though the ADON bit will remain set.
Turning off the A/D places the A/D module in its lowest
current consumption state.
7.6 A/D Accuracy/Error
The absolute accuracy specified for the A/D converter
includes the sum of all contributions for quantization
error, integr al error, diff erential error , full scale error , off-
set error, and monotonicity. It is defined as the maxi-
mum de viation from an actual transition versus an ideal
transition for any code. The absolute error of the A/D
converter is specified at < ±1 LSb f or VDD = VREF (o v er
the device’s specified operating range). However, the
accuracy of the A/D converter will degrade as VDD
diverges from VREF.
For a given range of analog inputs, the output digital
code will be the same. This is due to the quantization of
the analog input to a digital code. Quantization error is
typically ± 1/2 LSb and is inherent in the analog to dig-
ital conv ersion process . The only w a y to reduce quanti-
zation error is to increase the resolution of the A/D
converter.
Offset error measures the first actual transition of a
code versus the first ideal transition of a code. Offset
error shifts the entire transfer function. Offset error can
be calibrated out of a system or introduced into a sys-
tem through the interaction of the total leakage current
and source impedance at the analog input.
Gain error measures the maximum de viation of the last
actual transition and the last ideal transition adjusted
for offset error . This error appears as a change in slope
of the transfer function. The difference in gain error to
Note: For the A/D module to operate in SLEEP,
the A/D clock source must be set to RC
(ADCS1:ADCS0 = 11). To perform an A/D
conversion in SLEEP, ensure the SLEEP
instruction immediately follo ws the instruc-
tion that sets the GO/DONE bit.
full scale error is that full scale does not take offset error
into account. Gain error can be calibrated out in soft-
ware.
Linearity error refers to the uniformity of the code
changes. Linearity errors cannot be calibrated out of
the system. Integral non-linearity error measures the
actual code transition versus the ideal code transition
adjusted by the gain error for each code.
Differential non-linearity measures the maximum
actual code width versus the ideal code width. This
measure is unadjusted.
In systems where the device frequency is low, use of
the A/D RC clock is preferred. At moderate to high fre-
quencies, TAD should be derived from the device oscil-
lator. TAD must not violate the minimum and should be
≤ 8 µs for preferred operation. This is because TAD,
when derived from TOSC, is kept away from on-chip
phase clock tr ansitions. This reduces , to a large e xtent,
the effects of digital switching noise . This is not possible
with the RC derived clock. The loss of accuracy due to
digital switching noise can be significant if many I/O
pins are active.
In systems where the device will enter SLEEP mode
after the start of the A/D conversion, the RC clock
source selection is required. In this mode, the digital
noise from the modules in SLEEP are stopped. This
method gives high accuracy.
7.7 Effects of a RESET
A device reset forces all registers to their reset state.
This forces the A/D module to be turned off, and any
conversion is aborted.
The value that is in the ADRES register is not modified
for a Power-on Reset. The ADRES register will contain
unknown data after a Power-on Reset.
7.8 Connection Considerations
If the input voltage e xceeds the rail v alues (VSS or VDD)
by greater than 0.2V, then the accuracy of the conver-
sion is out of specification.
An e xternal RC filter is sometimes added for anti-alias-
ing of the input signal. The R component should be
selected to ensure that the total source impedance is
kept under the 10 kΩ recommended specification. Any
external components connected (via hi-impedance) to
an analog input pin (capacitor , zener diode, etc.) should
have very little leakage current at the pin.
Note: Care must be taken when using the RA0
pin in A/D conversions due to its proximity
to the OSC1 pin.
1997 Microchip Technology Inc. DS30272A-page 45
PIC16C71X
7.9 Transfer Function
The ideal transf er function of the A/D converter is as fol-
lows: the first transition occurs when the analog input
voltage (VAIN) is Analog VREF/256 (Figure 7-6).
7.10 References
A very good reference for understanding A/D convert-
ers is the "Analog-Digital Conversion Handbook" third
edition, published by Prentice Hall (ISBN 0-13-03-
2848-0).
FIGURE 7-6: A/D TRANSFER FUNCTION
Digital code output
FFh
FEh
04h
03h
02h
01h
00h
0.5 LSb
1 LSb
2 LSb
3 LSb
4 LSb
255 LSb
256 LSb
(full scale)
Analog input voltage
FIGURE 7-7: FLOWCHART OF A/D OPERATION
Acquire
ADON = 0
ADON = 0?
GO = 0?
A/D Clock
GO = 0
ADIF = 0
Abort Conversion
SLEEP
Power-down A/D Wait 2 TAD
Wake-up
Yes
No
Yes
No
No
Yes
Finish Conversion
GO = 0
ADIF = 1
Device in
No
Yes
Finish Conversion
GO = 0
ADIF = 1
Wait 2 TAD
Stay in Sleep
Selected Channel
= RC? SLEEP
No
Yes
Instruction?
Start of A/D
Conversion Delayed
1 Instruction Cycle
From Sleep?
Power-down A/D
Yes
No
Wait 2 TAD
Finish Conversion
GO = 0
ADIF = 1
SLEEP?
PIC16C71X
DS30272A-page 46 1997 Microchip Technology Inc.
TABLE 7-3: REGISTERS/BITS ASSOCIATED WITH A/D, PIC16C710/71/711
TABLE 7-4: REGISTERS/BITS ASSOCIATED WITH A/D, PIC16C715
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR
Value on
all other
Resets
0Bh,8Bh INTCON GIE ADIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
89h ADRES A/D Result Register xxxx xxxx uuuu uuuu
08h ADCON0 ADCS1 ADCS0 — CHS1 CHS0 GO/DONE ADIF ADON 00-0 0000 00-0 0000
88h ADCON1 — — — — — — PCFG1 PCFG0 ---- --00 ---- --00
05h PORTA — — — RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u 0000
85h TRISA — — — PORTA Data Direction Register ---1 1111 ---1 1111
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D conversion.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR,
BOR
Value on
all other
Resets
0Bh/8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 — ADIF — — — — — — -0-- ---- -0-- ----
8Ch PIE1 — ADIE — — — — — — -0-- ---- -0-- ----
1Eh ADRES A/D Result Register xxxx xxxx uuuu uuuu
1Fh ADCON
0ADCS
1ADCS
0CHS2 CHS1 CHS0 GO/
DONE — ADON 0000 00-0 0000 00-0
9Fh ADCON
1 — — — — — — PCFG1 PCFG0 ---- --00 ---- --00
05h PORTA — — —RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u 0000
85h TRISA — — —TRISA4 TRISA
3TRISA2 TRISA1 TRISA0 ---1 1111 ---1 1111
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D conversion.
1997 Microchip Technology Inc. DS30272A-page 47
PIC16C71X
8.0 SPECIAL FEATURES OF THE
CPU
What sets a microcontroller apart from other proces-
sors are special circuits to deal with the needs of real-
time applications. The PIC16CXX family has a host of
such features intended to maximize system reliability,
minimize cost through elimination of external compo-
nents, pro vide power sa ving operating modes and off er
code protection. These are:
• Oscillator selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
(PIC16C710/711/715)
- Parity Error Reset (PER) (PIC16C715)
• Interrupts
• Watchdog Timer (WDT)
• SLEEP
• Code protection
• ID locations
• In-circuit serial programming
The PIC16CXX has a Watchdog Timer which can be
shut off only through configuration bits. It runs off its
own RC oscillator for added reliability. There are two
timers that off er necessary delays on power-up. One is
the Oscillator Start-up Timer (OST), intended to keep
the chip in reset until the crystal oscillator is stable . The
other is the Po wer-up Timer (PWRT), which provides a
Applicable Devices 710 71 711 715
fixed delay of 72 ms (nominal) on power-up only,
designed to keep the part in reset while the power sup-
ply stabilizes. With these two timers on-chip, most
applications need no external reset circuitry.
SLEEP mode is designed to offer a very low current
power-down mode. The user can w ake-up from SLEEP
through external reset, Watchdog Timer Wake-up, or
through an interrupt. Se veral oscillator options are also
made available to allow the part to fit the application.
The RC oscillator option saves system cost while the
LP crystal option saves power. A set of configuration
bits are used to select various options.
8.1 Configuration Bits
The configuration bits can be progr ammed (read as '0')
or left unprogrammed (read as '1') to select various
device configurations. These bits are mapped in pro-
gram memory location 2007h.
The user will note that address 2007h is beyond the
user program memory space. In fact, it belongs to the
special test/configuration memory space (2000h -
3FFFh), which can be accessed only during program-
ming.
FIGURE 8-1: CONFIGURATION WORD FOR PIC16C71
— — — — — — — — — CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-5: Unimplemented: Read as '1'
bit 4: CP0: Code protection bit
1 = Code protection off
0 = All memory is code protected, but 00h - 3Fh is writable
bit 3: PWRTE: Power-up Timer Enable bit
1 = Power-up Timer enabled
0 = Power-up Timer disabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
PIC16C71X
DS30272A-page 48 1997 Microchip Technology Inc.
FIGURE 8-2: CONFIGURATION WORD, PIC16C710/711
FIGURE 8-3: CONFIGURATION WORD, PIC16C715
CP0 CP0 CP0 CP0 CP0 CP0 CP0 BODEN CP0 CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-7 CP0: Code protection bits (2)
5-4: 1 = Code protection off
0 = All memory is code protected, but 00h - 3Fh is writable
bit 6: BODEN: Brown-out Reset Enable bit (1)
1 = BOR enabled
0 = BOR disabled
bit 3: PWRTE: Power-up Timer Enable bit (1)
1 = PWRT disabled
0 = PWRT enabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE.
Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled.
2: All of the CP0 bits have to be given the same value to enable the code protection scheme listed.
CP1 CP0 CP1 CP0 CP1 CP0 MPEEN BODEN CP1 CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-8 CP1:CP0: Code Protection bits (2)
5-4: 11 = Code protection off
10 = Upper half of program memory code protected
01 = Upper 3/4th of program memory code protected
00 = All memory is code protected
bit 7: MPEEN: Memory Parity Error Enable
1 = Memory Parity Checking is enabled
0 = Memory Parity Checking is disabled
bit 6: BODEN: Brown-out Reset Enable bit (1)
1 = BOR enabled
0 = BOR disabled
bit 3: PWRTE: Power-up Timer Enable bit (1)
1 = PWRT disabled
0 = PWRT enabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE.
Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled.
2: All of the CP1:CP0 pairs have to be given the same value to enable the code protection scheme listed.
1997 Microchip Technology Inc. DS30272A-page 49
PIC16C71X
8.2 Oscillator Configurations
8.2.1 OSCILLATOR TYPES
The PIC16CXX can be operated in four different oscil-
lator modes. The user can program two configuration
bits (FOSC1 and FOSC0) to select one of these four
modes:
• LP Low Power Crystal
• XT Crystal/Resonator
• HS High Speed Crystal/Resonator
• RC Resistor/Capacitor
8.2.2 CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
In XT, LP or HS modes a cr ystal or ceramic resonator
is connected to the OSC1/CLKIN and OSC2/CLKOUT
pins to establish oscillation (Figure 8-4). The
PIC16CXX Oscillator design requires the use of a par-
allel cut cr ystal. Use of a ser ies cut crystal may give a
frequency out of the crystal manufacturers specifica-
tions. When in XT, LP or HS modes, the device can
have an external clock source to drive the OSC1/
CLKIN pin (Figure 8-5).
FIGURE 8-4: CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP
OSC CONFIGURATION)
FIGURE 8-5: EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP
OSC CONFIGURATION)
C1
C2
XTAL
OSC2
Note1
OSC1
RFSLEEP
PIC16CXXX
RS
See Table 8-1 and Table 8-1 for recommended values of
C1 and C2.
Note 1: A series resistor may be required for AT strip
cut crystals.
2: The buffer is on the OSC2 pin.
(2) To internal
logic
OSC1
OSC2
Open
Clock from
ext. system PIC16CXXX
TABLE 8-1: CERAMIC RESONATORS,
PIC16C71
TABLE 8-2: CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR,
PIC16C71
Ranges Tested:
Mode Freq OSC1 OSC2
XT 455 kHz
2.0 MHz
4.0 MHz
47 - 100 pF
15 - 68 pF
15 - 68 pF
47 - 100 pF
15 - 68 pF
15 - 68 pF
HS 8.0 MHz
16.0 MHz 15 - 68 pF
10 - 47 pF 15 - 68 pF
10 - 47 pF
These values are for design guidance only. See
notes at bottom of page.
Resonators Used:
455 kHz Panasonic EFO-A455K04B ± 0.3%
2.0 MHz Murata Erie CSA2.00MG ± 0.5%
4.0 MHz Murata Erie CSA4.00MG ± 0.5%
8.0 MHz Murata Erie CSA8.00MT ± 0.5%
16.0 MHz Murata Erie CSA16.00MX ± 0.5%
All resonators used did not have built-in capacitors.
Mode Freq OSC1 OSC2
LP 32 kHz
200 kHz 33 - 68 pF
15 - 47 pF 33 - 68 pF
15 - 47 pF
XT 100 kHz
500 kHz
1 MHz
2 MHz
4 MHz
47 - 100 pF
20 - 68 pF
15 - 68 pF
15 - 47 pF
15 - 33 pF
47 - 100 pF
20 - 68 pF
15 - 68 pF
15 - 47 pF
15 - 33 pF
HS 8 MHz
20 MHz 15 - 47 pF
15 - 47 pF 15 - 47 pF
15 - 47 pF
These values are for design guidance only. See
notes at bottom of page.
PIC16C71X
DS30272A-page 50 1997 Microchip Technology Inc.
TABLE 8-3: CERAMIC RESONATORS,
PIC16C710/711/715
Ranges Tested:
Mode Freq OSC1 OSC2
XT 455 kHz
2.0 MHz
4.0 MHz
68 - 100 pF
15 - 68 pF
15 - 68 pF
68 - 100 pF
15 - 68 pF
15 - 68 pF
HS 8.0 MHz
16.0 MHz 10 - 68 pF
10 - 22 pF 10 - 68 pF
10 - 22 pF
These values are for design guidance only. See
notes at bottom of page.
Resonators Used:
455 kHz Panasonic EFO-A455K04B ± 0.3%
2.0 MHz Murata Erie CSA2.00MG ± 0.5%
4.0 MHz Murata Erie CSA4.00MG ± 0.5%
8.0 MHz Murata Erie CSA8.00MT ± 0.5%
16.0 MHz Murata Erie CSA16.00MX ± 0.5%
All resonators used did not have built-in capacitors.
TABLE 8-4: CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR,
PIC16C710/711/715
Osc Type Crystal
Freq Cap. Range
C1 Cap. Range
C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 47-68 pF 47-68 pF
1 MHz 15 pF 15 pF
4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15-33 pF 15-33 pF
20 MHz 15-33 pF 15-33 pF
These values are f or design guidance only. See
notes at bottom of page.
Crystals Used
32 kHz Epson C-001R32.768K-A ± 20 PPM
200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM
4 MHz ECS ECS-40-20-1 ± 50 PPM
8 MHz EPSON CA-301 8.000M-C ± 30 PPM
20 MHz EPSON CA-301 20.000M-C ± 30 PPM
Note 1: Recommended values of C1 and C2 are identical to the ranges tested table.
2: Higher capacitance increases the stability of oscillator but also increases the start-up time.
3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal man-
ufacturer for appropriate values of external components.
4: Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level speci-
fication.
1997 Microchip Technology Inc. DS30272A-page 51
PIC16C71X
8.2.3 EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator can be used or a simple
oscillator circuit with TTL gates can be built. Prepack-
aged oscillators provide a wide operating range and
better stability. A well-designed crystal oscillator will
provide good perf ormance with TTL gates. Two types of
crystal oscillator circuits can be used; one with series
resonance, or one with parallel resonance.
Figure 8-6 shows implementation of a parallel resonant
oscillator circuit. The circuit is designed to use the fun-
damental frequency of the crystal. The 74AS04 in verter
performs the 180-degree phase shift that a parallel
oscillator requires. The 4.7 kΩ resistor provides the
negative feedback for stability. The 10 kΩ potentiome-
ter biases the 74AS04 in the linear region. This could
be used for external oscillator designs.
FIGURE 8-6: EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
Figure 8-7 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental fre-
quency of the crystal. The inverter performs a 180-
degree phase shift in a series resonant oscillator cir-
cuit. The 330 kΩ resistors provide the negative feed-
back to bias the inverters in their linear region.
FIGURE 8-7: EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
20 pF
+5V
20 pF
10k 4.7k
10k
74AS04
XTAL
10k
74AS04
CLKIN
To Other
Devices
PIC16CXXX
330 kΩ
74AS04 74AS04 PIC16CXXX
CLKIN
To Other
Devices
XTAL
330 kΩ
74AS04
0.1 µF
8.2.4 RC OSCILLATOR
For timing insensitive applications the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (Rext) and capacitor (Cext) values, and the operat-
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
Cext values. The user also needs to take into account
variation due to tolerance of external R and C compo-
nents used. Figure 8-8 shows how the R/C combina-
tion is connected to the PIC16CXX. For Rext values
below 2.2 kΩ, the oscillator operation may become
unstable, or stop completely. F or very high Rext values
(e.g. 1 MΩ), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend to keep
Rext between 3 kΩ and 100 kΩ.
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or pack-
age lead frame capacitance.
See characterization data for desired de vice f or RC fre-
quency variation from part to part due to normal pro-
cess variation. The variation is larger f or larger R (since
leakage current variation will aff ect RC frequency more
for large R) and for smaller C (since var iation of input
capacitance will affect RC frequency more).
See characterization data for desired device for varia-
tion of oscillator frequency due to VDD for given Rext/
Cext values as w ell as frequency v ariation due to oper-
ating temperature for given R, C, and VDD values.
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test pur-
poses or to synchronize other logic (see Figure 3-2 for
waveform).
FIGURE 8-8: RC OSCILLATOR MODE
OSC2/CLKOUT
Cext
VDD
Rext
VSS
PIC16CXXX
OSC1
Fosc/4
Internal
clock
PIC16C71X
DS30272A-page 52 1997 Microchip Technology Inc.
8.3 Reset
The PIC16CXX diff erentiates betw een various kinds of
reset:
• Power-on Reset (POR)
• MCLR reset during normal operation
• MCLR reset during SLEEP
• WDT Reset (normal operation)
• Brown-out Reset (BOR) (PIC16C710/711/715)
• Parity Error Reset (PIC16C715)
Some registers are not affected in any reset condition;
their status is unknown on POR and unchanged in an y
other reset. Most other registers are reset to a “reset
state” on Power-on Reset (POR), on the MCLR and
Applicable Devices 710 71 711 715
WDT Reset, on MCLR reset during SLEEP, and Brown-
out Reset (BOR). They are not affected by a WDT
Wake-up, which is viewed as the resumption of normal
operation. The T O and PD bits are set or cleared differ-
ently in different reset situations as indicated in Table 8-
7, Table 8-8 and Table 8-9. These bits are used in soft-
ware to determine the nature of the reset. See Table 8-
10 and Table 8-11 for a full description of reset states
of all registers.
A simplified bloc k diagr am of the on-chip reset circuit is
shown in Figure 8-9.
The PIC16C710/711/715 have a MCLR noise filter in
the MCLR reset path. The filter will detect and ignore
small pulses.
It should be noted that a WDT Reset
does not drive
MCLR pin low.
FIGURE 8-9: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External
Reset
MCLR/VPP Pin
VDD
OSC1/
WDT
Module
VDD rise
detect
OST/PWRT
On-chip(1)
RC OSC
WDT Time-out
Power-on Reset
OST
PWRT
Chip_Reset
10-bit Ripple-counter
Enable OST
Enable PWRT
SLEEP
See Table 8-6 for time-out situations.
Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin.
2: Brown-out Reset is implemented on the PIC16C710/711/715.
3: Parity Error Reset is implemented on the PIC16C715.
Brown-out
Reset(2) BODEN
CLKIN
Pin
10-bit Ripple-counter
Program
Memory
Parity(3)
MPEEN
1997 Microchip Technology Inc. DS30272A-page 53
PIC16C71X
8.4 Power-on Reset (POR), Power-up
Timer (PWRT) and Oscillator Start-up
Timer (OST), and Brown-out Reset
(BOR)
8.4.1 POWER-ON RESET (POR)
A Power-on Reset pulse is generated on-chip when
VDD rise is detected (in the range of 1.5V - 2.1V). To
take advantage of the POR, just tie the MCLR pin
directly (or through a resistor) to VDD. This will eliminate
external RC components usually needed to create a
Power-on Reset. A maximum rise time for VDD is spec-
ified. See Electrical Specifications for details.
When the device starts normal operation (exits the
reset condition), de vice operating par ameters (voltage,
frequency, temperature, ...) must be met to ensure
operation. If these conditions are not met, the device
must be held in reset until the operating conditions are
met. Brown-out Reset may be used to meet the startup
conditions.
For additional information, refer to Application Note
AN607, "
Power-up Trouble Shooting
."
8.4.2 POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 72 ms nominal
time-out on power-up only, from the POR. The Power-
up Timer operates on an internal RC oscillator. The
chip is kept in reset as long as the PWR T is active . The
PWRT’s time dela y allo ws V DD to rise to an acceptable
level. A configuration bit is provided to enable/disable
the PWRT.
Applicable Devices 710 71 711 715
Applicable Devices 710 71 711 715
The power-up time dela y will v ary from chip to chip due
to VDD, temperature, and process variation. See DC
parameters for details.
8.4.3 OSCILLATOR START-UP TIMER (OST)
The Oscillator Start-up Timer (OST) provides 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is o v er . This ensures that the crystal oscil-
lator or resonator has started and stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset or wake-up from
SLEEP.
8.4.4 BROWN-OUT RESET (BOR)
A configuration bit, BODEN, can disable (if clear/pro-
grammed) or enable (if set) the Brown-out Reset cir-
cuitry. If VDD falls below 4.0V (3.8V - 4.2V range) for
greater than parameter #35, the brown-out situation will
reset the chip. A reset may not occur if VDD falls below
4.0V for less than parameter #35. The chip will remain
in Brown-out Reset until VDD rises above BVDD. The
Power-up Timer will now be invoked and will keep the
chip in RESET an additional 72 ms. If VDD drops belo w
BVDD while the P o wer-up Timer is running, the chip will
go back into a Brown-out Reset and the Power-up
Timer will be initialized. Once VDD rises above BVDD,
the Power-up Timer will execute a 72 ms time delay.
The Power-up Timer should always be enabled when
Brown-out Reset is enab led. Figure 8-10 shows typical
brown-out situations.
Applicable Devices 710 71 711 715
Applicable Devices 710 71 711 715
FIGURE 8-10: BROWN-OUT SITUATIONS
72 ms
BVDD
VDD
Internal
Reset
BVDD
VDD
Internal
Reset 72 ms
<72 ms
72 ms
BVDD
VDD
Internal
Reset
PIC16C71X
DS30272A-page 54 1997 Microchip Technology Inc.
8.4.5 TIME-OUT SEQUENCE
On power-up the time-out sequence is as follows: First
PWRT time-out is inv oked after the POR time dela y has
expired. Then OST is activated. The total time-out will
vary based on oscillator configuration and the status of
the PWRT. For example, in RC mode with the PWRT
disabled, there will be no time-out at all. Figure 8-11,
Figure 8-12, and Figure 8-13 depict time-out
sequences on power-up.
Since the time-outs occur from the POR pulse, if MCLR
is kept lo w long enough, the time-outs will expire. Then
bringing MCLR high will begin execution immediately
(Figure 8-12). This is useful for testing purposes or to
synchronize more than one PIC16CXX device operat-
ing in parallel.
Table 8-10 and Table 8-11 show the reset conditions f or
some special function registers, while Table 8-12 and
Table 8-13 show the reset conditions for all the
registers.
8.4.6 POWER CONTROL/STATUS REGISTER
(PCON)
The Power Control/Status Register, PCON has up to
two bits, depending upon the device.
Bit0 is Brown-out Reset Status bit, BOR. Bit BOR is
unknown on a Power-on Reset. It must then be set by
the user and check ed on subsequent resets to see if bit
BOR cleared, indicating a BOR occurred. The BOR bit
is a "Don’t Care" bit and is not necessarily predictable
if the Brown-out Reset circuitry is disabled (by clearing
bit BODEN in the Configuration Word).
Applicable Devices 710 71 711 715
Applicable Devices 710 71 711 715
Bit1 is POR (Power-on Reset Status bit). It is cleared
on a Power-on Reset and unaffected otherwise. The
user must set this bit following a Power-on Reset.
For the PIC16C715, bit2 is PER (Parity Error Reset). It
is cleared on a Parity Error Reset and must be set by
user software. It will also be set on a Power-on Reset.
For the PIC16C715, bit7 is MPEEN (Memory Parity
Error Enable). This bit reflects the status of the MPEEN
bit in configuration word. It is unaff ected by an y reset of
interrupt.
8.4.7 PARITY ERROR RESET (PER)
The PIC16C715 has on-chip parity bits that can be
used to verify the contents of program memor y. Parity
bits may be useful in applications in order to increase
overall reliability of a system.
There are two parity bits for each word of Program
Memory. The parity bits are computed on alternating
bits of the program word. One computation is per-
formed using e v en parity, the other using odd parity. As
a program e xecutes , the parity is verified. The e ven par-
ity bit is XOR’d with the even bits in the program mem-
ory word. The odd parity bit is negated and XOR’d with
the odd bits in the program memory word. When an
error is detected, a reset is generated and the PER flag
bit 2 in the PCON register is cleared (logic ‘0’). This indi-
cation can allow software to act on a failure. However,
there is no indication of the program memory location
of the f ailure in Program Memory. This flag can only be
set (logic ‘1’) by software.
The parity array is user selectab le during programming.
Bit 7 of the configuration word located at address
2007h can be programmed (read as ‘0’) to disable par-
ity. If left unprogr ammed (read as ‘1’), parity is enabled.
Applicable Devices 710 71 711 715
TABLE 8-5: TIME-OUT IN VARIOUS SITUATIONS, PIC16C71
TABLE 8-6: TIME-OUT IN VARIOUS SITUATIONS, PIC16C710/711/715
Oscillator Configuration Power-up Wake-up from SLEEP
PWRTE = 1 PWRTE = 0
XT, HS, LP 72 ms + 1024TOSC 1024TOSC 1024 TOSC
RC 72 ms — —
Oscillator Configuration Power-up Brown-out Wake-up from SLEEP
PWRTE = 0 PWRTE = 1
XT, HS, LP 72 ms + 1024TOSC 1024TOSC 72 ms + 1024TOSC 1024TOSC
RC 72 ms — 72 ms —
1997 Microchip Technology Inc. DS30272A-page 55
PIC16C71X
TABLE 8-7: STATUS BITS AND THEIR SIGNIFICANCE, PIC16C71
TABLE 8-8: STATUS BITS AND THEIR SIGNIFICANCE, PIC16C710/711
TABLE 8-9: STATUS BITS AND THEIR SIGNIFICANCE, PIC16C715
TO PD
1 1 Power-on Reset
0 x Illegal, TO is set on POR
x 0 Illegal, PD is set on POR
0 1 WDT Reset
0 0 WDT Wake-up
u u MCLR Reset during normal operation
1 0 MCLR Reset during SLEEP or interrupt wake-up from SLEEP
POR BOR TO PD
0 x 1 1 Power-on Reset
0 x 0 x Illegal, TO is set on POR
0 x x 0 Illegal, PD is set on POR
1 0 x x Brown-out Reset
1 1 0 1 WDT Reset
1 1 0 0 WDT Wake-up
1 1 u u MCLR Reset during normal operation
1 1 1 0 MCLR Reset during SLEEP or interrupt wake-up from SLEEP
PER POR BOR TO PD
1 0 x 1 1 Power-on Reset
x 0 x 0 x Illegal, TO is set on POR
x 0 x x 0 Illegal, PD is set on POR
1 1 0 x x Brown-out Reset
1 1 1 0 1 WDT Reset
1 1 1 0 0 WDT Wake-up
1 1 1 u u MCLR Reset during normal operation
1 1 1 1 0 MCLR Reset during SLEEP or interrupt wake-up from SLEEP
0 1 1 1 1 Parity Error Reset
0 0 x x x Illegal, PER is set on POR
0 x 0 x x Illegal, PER is set on BOR
PIC16C71X
DS30272A-page 56 1997 Microchip Technology Inc.
TABLE 8-10: RESET CONDITION FOR SPECIAL REGISTERS, PIC16C710/71/711
TABLE 8-11: RESET CONDITION FOR SPECIAL REGISTERS, PIC16C715
Condition Program
Counter STATUS
Register PCON
Register
PIC16C710/711
Power-on Reset 000h 0001 1xxx ---- --0x
MCLR Reset during normal operation 000h 000u uuuu ---- --uu
MCLR Reset during SLEEP 000h 0001 0uuu ---- --uu
WDT Reset 000h 0000 1uuu ---- --uu
WDT Wake-up PC + 1 uuu0 0uuu ---- --uu
Brown-out Reset (PIC16C710/711) 000h 0001 1uuu ---- --u0
Interrupt wake-up from SLEEP PC + 1(1) uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'.
Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded
with the interrupt vector (0004h).
Condition Program
Counter STATUS
Register PCON
Register
Power-on Reset 000h 0001 1xxx u--- -10x
MCLR Reset during normal operation 000h 000u uuuu u--- -uuu
MCLR Reset during SLEEP 000h 0001 0uuu u--- -uuu
WDT Reset 000h 0000 1uuu u--- -uuu
WDT Wake-up PC + 1 uuu0 0uuu u--- -uuu
Brown-out Reset 000h 0001 1uuu u--- -uu0
Parity Error Reset 000h uuu1 0uuu u--- -0uu
Interrupt wake-up from SLEEP PC + 1(1) uuu1 0uuu u--- -uuu
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'.
Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
1997 Microchip Technology Inc. DS30272A-page 57
PIC16C71X
TABLE 8-12: INITIALIZATION CONDITIONS FOR ALL REGISTERS, PIC16C710/71/711
Register Power-on Reset,
Brown-out Reset(5) MCLR Resets
WDT Reset Wake-up via
WDT or
Interrupt
Wxxxx xxxx uuuu uuuu uuuu uuuu
INDF N/A N/A N/A
TMR0 xxxx xxxx uuuu uuuu uuuu uuuu
PCL 0000h 0000h PC + 1(2)
STATUS 0001 1xxx 000q quuu(3) uuuq quuu(3)
FSR xxxx xxxx uuuu uuuu uuuu uuuu
PORTA ---x 0000 ---u 0000 ---u uuuu
PORTB xxxx xxxx uuuu uuuu uuuu uuuu
PCLATH ---0 0000 ---0 0000 ---u uuuu
INTCON 0000 000x 0000 000u uuuu uuuu(1)
ADRES xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 00-0 0000 00-0 0000 uu-u uuuu
OPTION 1111 1111 1111 1111 uuuu uuuu
TRISA ---1 1111 ---1 1111 ---u uuuu
TRISB 1111 1111 1111 1111 uuuu uuuu
PCON(4) ---- --0u ---- --uu ---- --uu
ADCON1 ---- --00 ---- --00 ---- --uu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition
Note 1: One or more bits in INTCON will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
3: See Table 8-10 for reset value for specific condition.
4: The PCON register is not implemented on the PIC16C71.
5: Brown-out reset is not implemented on the PIC16C71.
PIC16C71X
DS30272A-page 58 1997 Microchip Technology Inc.
TABLE 8-13: INITIALIZATION CONDITIONS FOR ALL REGISTERS, PIC16C715
Register Power-on Reset,
Brown-out Reset
Parity Error Reset
MCLR Resets
WDT Reset Wake-up via
WDT or
Interrupt
Wxxxx xxxx uuuu uuuu uuuu uuuu
INDF N/A N/A N/A
TMR0 xxxx xxxx uuuu uuuu uuuu uuuu
PCL 0000 0000 0000 0000 PC + 1(2)
STATUS 0001 1xxx 000q quuu(3) uuuq quuu(3)
FSR xxxx xxxx uuuu uuuu uuuu uuuu
PORTA ---x 0000 ---u 0000 ---u uuuu
PORTB xxxx xxxx uuuu uuuu uuuu uuuu
PCLATH ---0 0000 ---0 0000 ---u uuuu
INTCON 0000 000x 0000 000u uuuu uuuu(1)
PIR1 -0-- ---- -0-- ---- -u-- ----(1)
ADCON0 0000 00-0 0000 00-0 uuuu uu-u
OPTION 1111 1111 1111 1111 uuuu uuuu
TRISA ---1 1111 ---1 1111 ---u uuuu
TRISB 1111 1111 1111 1111 uuuu uuuu
PIE1 -0-- ---- -0-- ---- -u-- ----
PCON ---- -qqq ---- -1uu ---- -1uu
ADCON1 ---- --00 ---- --00 ---- --uu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition
Note 1: One or more bits in INTCON and PIR1 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
3: See Table 8-11 for reset value for specific condition.
1997 Microchip Technology Inc. DS30272A-page 59
PIC16C71X
FIGURE 8-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
FIGURE 8-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
FIGURE 8-13: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
TOST
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
PIC16C71X
DS30272A-page 60 1997 Microchip Technology Inc.
FIGURE 8-14: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW
VDD POWER-UP)
Note 1: External Power-on Reset circuit is
required only if VDD power-up slope is too
slow. The diode D helps discharge the
capacitor quickly when VDD powers down.
2: R < 40 kΩ is recommended to make sure
that voltage drop across R does not violate
the device’s electrical specification.
3: R1 = 100Ω to 1 kΩ will limit any current
flowing into MCLR from external capacitor
C in the event of MCLR/VPP pin break-
down due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS).
C
R1
R
D
VDD
MCLR
PIC16CXX
FIGURE 8-15: EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 1
FIGURE 8-16: EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 2
Note 1: This circuit will activate reset when VDD
goes below (Vz + 0.7V) where Vz = Zener
voltage.
2: Internal brown-out detection on the
PIC16C710/711/715 should be disabled
when using this circuit.
3: Resistors should be adjusted for the char-
acteristics of the transistor.
VDD 33k
10k
40k
VDD
MCLR
PIC16CXX
Note 1: This brown-out circuit is less expensiv e ,
albeit less accurate. Transistor Q1 turns
off when VDD is below a certain level
such that:
2: Internal brown-out detection on the
PIC16C710/711/715 should be disabled
when using this circuit.
3: Resistors should be adjusted for the
characteristics of the transistor.
VDD • R1
R1 + R2 = 0.7V
VDD
R2 40k
VDD
MCLR
PIC16CXX
R1
Q1
1997 Microchip Technology Inc. DS30272A-page 61
PIC16C71X
8.5 Interrupts
The PIC16C71X family has 4 sources of interrupt.
The interrupt control register (INTCON) records indi-
vidual interrupt requests in flag bits. It also has individ-
ual and global interrupt enable bits.
A global interrupt enable bit, GIE (INTCON<7>)
enables (if set) all un-masked interrupts or disables (if
cleared) all interrupts. When bit GIE is enab led, and an
interrupt’s flag bit and mask bit are set, the interrupt will
vector immediately. Individual interrupts can be dis-
abled through their corresponding enable bits in vari-
ous registers. Individual interrupt bits are set
regardless of the status of the GIE bit. The GIE bit is
cleared on reset.
The “return from interrupt” instruction, RETFIE, exits
the interrupt routine as well as sets the GIE bit, which
re-enables interrupts.
The RB0/INT pin interrupt, the RB port change inter-
rupt and the TMR0 overflow interrupt flags are con-
tained in the INTCON register.
The peripheral interrupt flags are contained in the spe-
cial function registers PIR1 and PIR2. The correspond-
ing interrupt enable bits are contained in special
function registers PIE1 and PIE2, and the peripheral
interrupt enable bit is contained in special function reg-
ister INTCON.
When an interrupt is responded to, the GIE bit is
cleared to disable any further interrupt, the return
address is pushed onto the stack and the PC is loaded
with 0004h. Once in the interrupt service routine the
source(s) of the interrupt can be determined by polling
the interrupt flag bits. The interrupt flag bit(s) must be
cleared in software before re-enabling interrupts to
avoid recursive interrupts.
Applicable Devices 710 71 711 715
Interrupt Sources
External interrupt RB0/INT
TMR0 overflow interrupt
PORTB change interrupts (pins RB7:RB4)
A/D Interrupt
Note: Individual interrupt flag bits are set regard-
less of the status of their corresponding
mask bit or the GIE bit.
For external interrupt events, such as the INT pin or
PORTB change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends when the interrupt ev ent occurs (Figure 8-19).
The latency is the same for one or two cycle instruc-
tions. Individual interrupt flag bits are set regardless of
the status of their corresponding mask bit or the GIE
bit.
Note: For the PIC16C71
If an interrupt occurs while the Global Inter-
rupt Enable (GIE) bit is being cleared, the
GIE bit may unintentionally be re-enabled
by the user’ s Interrupt Service Routine (the
RETFIE instruction). The events that
would cause this to occur are:
1. An instruction clears the GIE bit while
an interrupt is acknowledged.
2. The program br anches to the Interrupt
vector and executes the Interrupt Ser-
vice Routine.
3. The Interrupt Service Routine com-
pletes with the execution of the RET-
FIE instruction. This causes the GIE
bit to be set (enables interrupts), and
the program returns to the instruction
after the one which was meant to dis-
able interrupts.
Perform the following to ensure that inter-
rupts are globally disabled:
LOOP BCF INTCON, GIE ; Disable global
; interrupt bit
BTFSC INTCON, GIE ; Global interrupt
; disabled?
GOTO LOOP ; NO, try again
: ; Yes, continue
; with program
; flow
PIC16C71X
DS30272A-page 62 1997 Microchip Technology Inc.
FIGURE 8-17: INTERRUPT LOGIC, PIC16C710, 71, 711
FIGURE 8-18: INTERRUPT LOGIC, PIC16C715
RBIF
RBIE
T0IF
T0IE
INTF
INTE
GIE
ADIE
Wakeup
(If in SLEEP mode)
Interrupt to CPU
ADIF
RBIF
RBIE
T0IF
T0IE
INTF
INTE
GIE
Wakeup
(If in SLEEP mode)
Interrupt to CPU
ADIF
ADIF
ADIE
1997 Microchip Technology Inc. DS30272A-page 63
PIC16C71X
8.5.1 INT INTERRUPT
External interrupt on RB0/INT pin is edge triggered:
either rising if bit INTEDG (OPTION<6>) is set, or fall-
ing, if the INTEDG bit is clear. When a valid edge
appears on the RB0/INT pin, flag bit INTF
(INTCON<1>) is set. This interrupt can be disabled by
clearing enable bit INTE (INTCON<4>). Flag bit INTF
must be cleared in software in the interrupt service rou-
tine before re-enabling this interrupt. The INT interrupt
can wak e-up the processor from SLEEP, if bit INTE was
set prior to going into SLEEP. The status of global inter-
rupt enable bit GIE decides whether or not the proces-
sor branches to the interrupt vector following wake-up.
See Section 8.8 for details on SLEEP mode.
8.5.2 TMR0 INTERRUPT
An overflow (FFh → 00h) in the TMR0 register will set
flag bit T0IF (INTCON<2>). The interrupt can be
enabled/disabled by setting/clearing enable bit T0IE
(INTCON<5>). (Section 6.0)
8.5.3 PORTB INTCON CHANGE
An input change on PORTB<7:4> sets flag bit RBIF
(INTCON<0>). The interrupt can be enabled/disabled
by setting/clearing enable bit RBIE (INTCON<4>).
(Section 5.2)
Note: For the PIC16C71
if a change on the I/O pin should occur
when the read operation is being e xecuted
(start of the Q2 cycle), then the RBIF inter-
rupt flag may not get set.
FIGURE 8-19: INT PIN INTERRUPT TIMING
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
Instruction
executed
Interrupt Latency
PC PC+1 PC+1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC+1)
Inst (PC-1) Inst (0004h)
Dummy Cycle
Inst (PC)
—
1
4
51
Note 1: INTF flag is sampled here (every Q1).
2: Interrupt latency = 3-4 Tcy where Tcy = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in RC oscillator mode.
4: For minimum width of INT pulse, refer to AC specs.
5: INTF is enabled to be set anytime during the Q4-Q1 cycles.
2
3
PIC16C71X
DS30272A-page 64 1997 Microchip Technology Inc.
8.6 Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to sa v e k e y reg-
isters during an interrupt i.e., W register and STATUS
register. This will have to be implemented in software.
Example 8-1 stores and restores the STATUS and W
registers. The user register, STATUS_TEMP, must be
defined in bank 0.
The example:
a) Stores the W register.
b) Stores the STATUS register in bank 0.
c) Executes the ISR code.
d) Restores the STATUS register (and bank select
bit).
e) Restores the W register.
EXAMPLE 8-1: SAVING STATUS AND W REGISTERS IN RAM
MOVWF W_TEMP ;Copy W to TEMP register, could be bank one or zero
SWAPF STATUS,W ;Swap status to be saved into W
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR)
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
1997 Microchip Technology Inc. DS30272A-page 65
PIC16C71X
8.7 Watchdog Timer (WDT)
The Watchdog Timer is as a free running on-chip RC
oscillator which does not require any external compo-
nents. This RC oscillator is separate from the RC oscil-
lator of the OSC1/CLKIN pin. That means that the WDT
will run, even if the clock on the OSC1/CLKIN and
OSC2/CLKOUT pins of the device has been stopped,
for example, by execution of a SLEEP instruction. Dur-
ing normal operation, a WDT time-out generates a
device RESET (W atchdog Timer Reset). If the device is
in SLEEP mode, a WDT time-out causes the device to
wake-up and continue with normal operation (Watch-
dog Timer Wake-up). The WDT can be permanently
disabled by clearing configuration bit WDTE
(Section 8.1).
8.7.1 WDT PERIOD
The WDT has a nominal time-out period of 18 ms, (with
no prescaler). The time-out periods vary with tempera-
ture, VDD and process variations from part to part (see
DC specs). If longer time-out periods are desired, a
prescaler with a division ratio of up to 1:128 can be
Applicable Devices 710 71 711 715
assigned to the WDT under software control by writing
to the OPTION register. Thus, time-out periods up to
2.3 seconds can be realized.
The CLRWDT and SLEEP instructions clear the WDT and
the postscaler, if assigned to the WDT, and prevent it
from timing out and generating a de vice RESET condi-
tion.
The TO bit in the STATUS register will be cleared upon
a Watchdog Timer time-out.
8.7.2 WDT PROGRAMMING CONSIDERATIONS
It should also be taken into account that under worst
case conditions (VDD = Min., Temperature = Max., and
max. WDT prescaler) it may take several seconds
before a WDT time-out occurs.
Note: When a CLRWDT instruction is executed
and the prescaler is assigned to the WDT,
the prescaler count will be cleared, but the
prescaler assignment is not changed.
FIGURE 8-20: WATCHDOG TIMER BLOCK DIAGRAM
FIGURE 8-21: SUMMARY OF WATCHDOG TIMER REGISTERS
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
2007h Config. bits (1) BODEN(1) CP1 CP0 PWRTE(1) WDTE FOSC1 FOSC0
81h,181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Figure 8-1, Figure 8-2 and Figure 8-3 for operation of these bits.
From TMR0 Clock Source
(Figure 6-6)
To TMR0 (Figure 6-6)
Postscaler
WDT Timer
WDT
Enable Bit
0
1M
U
X
PSA
8 - to - 1 MUX PS2:PS0
01
MUX PSA
WDT
Time-out
Note: PSA and PS2:PS0 are bits in the OPTION register.
8
PIC16C71X
DS30272A-page 66 1997 Microchip Technology Inc.
8.8 Power-down Mode (SLEEP)
Power-down mode is entered by executing a SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the PD bit (STATUS<3>) is cleared, the
TO (STATUS<4>) bit is set, and the oscillator driver is
turned off. The I/O por ts maintain the status they had,
before the SLEEP instruction was executed (driving
high, low, or hi-impedance).
For lowest current consumption in this mode, place all
I/O pins at either VDD, or VSS, ensure no external cir-
cuitry is drawing current from the I/O pin, power-down
the A/D, disable external clocks. Pull all I/O pins, that
are hi-impedance inputs, high or lo w externally to av oid
switching currents caused by floating inputs. The
T0CKI input should also be at VDD or VSS for lowest
current consumption. The contribution from on-chip
pull-ups on PORTB should be considered.
The MCLR pin must be at a logic high level (VIHMC).
8.8.1 WAKE-UP FROM SLEEP
The device can wake up from SLEEP through one of
the following events:
1. External reset input on MCLR pin.
2. Watchdog Timer Wake-up (if WDT was
enabled).
3. Interrupt from INT pin, RB port change, or some
Peripheral Interrupts.
External MCLR Reset will cause a device reset. All
other events are considered a continuation of program
execution and cause a "wake-up". The TO and PD bits
in the STATUS register can be used to determine the
cause of device reset. The PD bit, which is set on
power-up, is cleared when SLEEP is inv oked. The T O bit
is cleared if a WDT time-out occurred (and caused
wake-up).
The f ollowing peripheral interrupts can wake the de vice
from SLEEP:
1. TMR1 interrupt. Timer1 must be operating as
an asynchronous counter.
2. A/D conversion (when A/D clock source is RC).
Other peripherals cannot generate interrupts since dur-
ing SLEEP, no on-chip Q clocks are present.
When the SLEEP instruction is being ex ecuted, the ne xt
instruction (PC + 1) is pre-fetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction and then branches to the inter-
rupt address (0004h). In cases where the execution of
the instruction following SLEEP is not desirable, the
user should have a NOP after the SLEEP instruction.
8.8.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the follo wing will occur:
•If the interrupt occurs before the the execution of
a SLEEP instruction, the SLEEP instruction will
complete as a NOP. Therefore , the WDT and WDT
postscaler will not be cleared, the TO bit will not
be set and PD bits will not be cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction, the device will immedi-
ately wake up from sleep . The SLEEP instruction
will be completely executed before the wake-up.
Therefore, the WDT and WDT postscaler will be
cleared, the TO bit will be set and the PD bit will
be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set bef ore the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction was
executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruc-
tion should be executed before a SLEEP instruction.
1997 Microchip Technology Inc. DS30272A-page 67
PIC16C71X
FIGURE 8-22: WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
Instruction
executed
PC PC+1 PC+2
Inst(PC) = SLEEP
Inst(PC - 1)
Inst(PC + 1)
SLEEP
Processor in
SLEEP
Interrupt Latency
(Note 2)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy cycle
PC + 2 0004h 0005h
Dummy cycle
TOST(2)
PC+2
Note 1: XT, HS or LP oscillator mode assumed.
2: TOST = 1024TOSC (drawing not to scale) This delay will not be there for RC osc mode.
3: GIE = '1' assumed. In this case after wake- up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line.
4: CLKOUT is not available in these osc modes, but shown here for timing reference.
8.9 Program Verification/Code Protection
If the code protection bit(s) have not been pro-
grammed, the on-chip program memory can be read
out for verification purposes.
8.10 ID Locations
Four memory locations (2000h - 2003h) are designated
as ID locations where the user can store checksum or
other code-identification numbers. These locations are
not accessible during normal execution but are read-
able and writable during program/verify. It is recom-
mended that only the 4 least significant bits of the ID
location are used.
8.11 In-Circuit Serial Programming
PIC16CXX microcontrollers can be serially pro-
grammed while in the end application circuit. This is
simply done with two lines f or clock and data, and three
other lines for power, ground, and the programming
voltage. This allows customers to manufacture boards
with unprogrammed devices, and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom firm-
ware to be programmed.
Note: Microchip does not recommend code pro-
tecting windowed devices.
The device is placed into a program/verify mode by
holding the RB6 and RB7 pins low while raising the
MCLR (VPP) pin from VIL to VIHH (see programming
specification). RB6 becomes the programming clock
and RB7 becomes the programming data. Both RB6
and RB7 are Schmitt Trigger inputs in this mode.
After reset, to place the de vice into programming/v erify
mode, the progr am counter (PC) is at location 00h. A 6-
bit command is then supplied to the de vice. Depending
on the command, 14-bits of program data are then sup-
plied to or from the device, depending if the command
was a load or a read. For complete details of serial pro-
gramming, please refer to the PIC16C6X/7X Program-
ming Specifications (Literature #DS30228).
FIGURE 8-23: TYPICAL IN-CIRCUIT SERIAL
PROGRAMMING
CONNECTION
External
Connector
Signals
To Normal
Connections
To Normal
Connections
PIC16CXX
VDD
VSS
MCLR/VPP
RB6
RB7
+5V
0V
VPP
CLK
Data I/O
VDD
PIC16C71X
DS30272A-page 68 1997 Microchip Technology Inc.
NOTES:
1997 Microchip Technology Inc. DS30272A-page 69
PIC16C71X
9.0 INSTRUCTION SET SUMMARY
Each PIC16CXX instruction is a 14-bit word divided
into an OPCODE which specifies the instruction type
and one or more operands which further specify the
operation of the instruction. The PIC16CXX instruction
set summary in Table 9-2 lists byte-oriented, bit-ori-
ented, and literal and control operations. Table 9-1
shows the opcode field descriptions.
For byte-oriented instructions, 'f' represents a file reg-
ister designator and 'd' represents a destination desig-
nator. The file register designator specifies which file
register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If 'd' is zero, the result is
placed in the W register . If 'd' is one , the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, 'b' represents a bit field
designator which selects the number of the bit aff ected
by the oper ation, while 'f' represents the number of the
file in which the bit is located.
For literal and control operations, 'k' represents an
eight or eleven bit constant or literal value.
TABLE 9-1: OPCODE FIELD
DESCRIPTIONS
The instruction set is highly orthogonal and is grouped
into three basic categories:
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon't care location (= 0 or 1)
The assembler will generate code with x = 0. It is the
recommended form of use for compatibility with all
Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1
label Label name
TOS Top of Stack
PC Program Counter
PCLATH Program Counter High Latch
GIE Global Interrupt Enable bit
WDT Watchdog Timer/Counter
TO Time-out bit
PD Power-down bit
dest Destination either the W register or the specified
register file location
[ ] Options
( ) Contents
→Assigned to
< > Register bit field
∈In the set of
i
talics
User defined term (font is courier)
•Byte-oriented operations
•Bit-oriented operations
•Literal and control operations
All instructions are executed within one single instruc-
tion cycle, unless a conditional test is true or the pro-
gram counter is changed as a result of an instruction.
In this case, the execution takes two instruction cycles
with the second cycle e x ecuted as a NOP. One instruc-
tion cycle consists of four oscillator periods. Thus, for
an oscillator frequency of 4 MHz, the normal instruction
execution time is 1 µs . If a conditional test is true or the
program counter is changed as a result of an instruc-
tion, the instruction execution time is 2 µs.
Table 9-2 lists the instructions recognized by the
MPASM assembler.
Figure 9-1 shows the general formats that the instruc-
tions can have.
All examples use the following format to represent a
hexadecimal number:
0xhh
where h signifies a hexadecimal digit.
FIGURE 9-1: GENERAL FORMAT FOR
INSTRUCTIONS
Note: To maintain upward compatibility with
future PIC16CXX products, do not use the
OPTION and TRIS instructions.
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16C71X
DS30272A-page 70 1997 Microchip Technology Inc.
TABLE 9-2: PIC16CXX INSTRUCTION SET
Mnemonic,
Operands Description Cycles 14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C,DC,Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C,DC,Z
Z
1,2
1,2
2
1,2
1,2
1,2,3
1,2
1,2,3
1,2
1,2
1,2
1,2
1,2
1,2
1,2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1,2
1,2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
-
k
k
k
-
k
-
-
k
k
Add literal and W
AND literal with W
Call subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C,DC,Z
Z
TO,PD
Z
TO,PD
C,DC,Z
Z
Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external
device, the data will be written back with a '0'.
2: If this instruction is ex ecuted on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned
to the Timer0 Module.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
1997 Microchip Technology Inc. DS30272A-page 71
PIC16C71X
9.1 Instruction Descriptions
ADDLW Add Literal and W
Syntax: [
label
] ADDLW k
Operands: 0 ≤ k ≤ 255
Operation: (W) + k → (W)
Status Affected: C, DC, Z
Encoding: 11 111x kkkk kkkk
Description: The contents of the W register are
added to the eight bit literal 'k' and the
result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k' Process
data Write to
W
Example: ADDLW 0x15
Before Instruction
W = 0x10
After Instruction
W = 0x25
ADDWF Add W and f
Syntax: [
label
] ADDWF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (W) + (f) → (dest)
Status Affected: C, DC, Z
Encoding: 00 0111 dfff ffff
Description: Add the contents of the W register
with register 'f'. If 'd' is 0 the result is
stored in the W register. If 'd' is 1 the
result is stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
Dest
Example ADDWF FSR, 0
Before Instruction
W = 0x17
FSR = 0xC2
After Instruction
W = 0xD9
FSR = 0xC2
ANDLW AND Literal with W
Syntax: [
label
] ANDLW k
Operands: 0 ≤ k ≤ 255
Operation: (W) .AND. (k) → (W)
Status Affected: Z
Encoding: 11 1001 kkkk kkkk
Description: The contents of W register are
AND’ed with the eight bit literal 'k'. The
result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal "k" Process
data Write to
W
Example ANDLW 0x5F
Before Instruction
W = 0xA3
After Instruction
W = 0x03
ANDWF AND W with f
Syntax: [
label
] ANDWF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (W) .AND. (f) → (dest)
Status Affected: Z
Encoding: 00 0101 dfff ffff
Description: AND the W register with register 'f'. If
'd' is 0 the result is stored in the W
register. If 'd' is 1 the result is stored
back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
Dest
Example ANDWF FSR, 1
Before Instruction
W = 0x17
FSR = 0xC2
After Instruction
W = 0x17
FSR = 0x02
PIC16C71X
DS30272A-page 72 1997 Microchip Technology Inc.
BCF Bit Clear f
Syntax: [
label
] BCF f,b
Operands: 0 ≤ f ≤ 127
0 ≤ b ≤ 7
Operation: 0 → (f<b>)
Status Affected: None
Encoding: 01 00bb bfff ffff
Description: Bit 'b' in register 'f' is cleared.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write
register 'f'
Example BCF FLAG_REG, 7
Before Instruction
FLAG_REG = 0xC7
After Instruction
FLAG_REG = 0x47
BSF Bit Set f
Syntax: [
label
] BSF f,b
Operands: 0 ≤ f ≤ 127
0 ≤ b ≤ 7
Operation: 1 → (f<b>)
Status Affected: None
Encoding: 01 01bb bfff ffff
Description: Bit 'b' in register 'f' is set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write
register 'f'
Example BSF FLAG_REG, 7
Before Instruction
FLAG_REG = 0x0A
After Instruction
FLAG_REG = 0x8A
BTFSC Bit Test, Skip if Clear
Syntax: [
label
] BTFSC f,b
Operands: 0 ≤ f ≤ 127
0 ≤ b ≤ 7
Operation: skip if (f<b>) = 0
Status Affected: None
Encoding: 01 10bb bfff ffff
Description: If bit 'b' in register 'f' is '1' then the next
instruction is executed.
If bit 'b', in register 'f', is '0' then the ne xt
instruction is discarded, and a NOP is
executed instead, making this a 2TCY
instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f' Process
data NOP
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
NOP NOP NOP NOP
Example HERE
FALSE
TRUE
BTFSC
GOTO
•
•
•
FLAG,1
PROCESS_CODE
Before Instruction
PC = address HERE
After Instruction
if FLAG<1> = 0,
PC = address TRUE
if FLAG<1>=1,
PC = address FALSE
1997 Microchip Technology Inc. DS30272A-page 73
PIC16C71X
BTFSS Bit Test f, Skip if Set
Syntax: [
label
] BTFSS f,b
Operands: 0 ≤ f ≤ 127
0 ≤ b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Encoding: 01 11bb bfff ffff
Description: If bit 'b' in register 'f' is '0' then the next
instruction is executed.
If bit 'b' is '1', then the ne xt instruction is
discarded and a NOP is executed
instead, making this a 2TCY instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f' Process
data NOP
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
NOP NOP NOP NOP
Example HERE
FALSE
TRUE
BTFSC
GOTO
•
•
•
FLAG,1
PROCESS_CODE
Before Instruction
PC = address HERE
After Instruction
if FLAG<1> = 0,
PC = address FALSE
if FLAG<1> = 1,
PC = address TRUE
CALL Call Subroutine
Syntax: [
label
] CALL k
Operands: 0 ≤ k ≤ 2047
Operation: (PC)+ 1→ TOS,
k → PC<10:0>,
(PCLATH<4:3>) → PC<12:11>
Status Affected: None
Encoding: 10 0kkk kkkk kkkk
Description: Call Subroutine. First, return address
(PC+1) is pushed onto the stack. The
eleven bit immediate address is loaded
into PC bits <10:0>. The upper bits of
the PC are loaded from PCLATH.
CALL is a two cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read
literal 'k',
Push PC
to Stack
Process
data Write to
PC
2nd Cycle NOP NOP NOP NOP
Example HERE CALL THERE
Before Instruction
PC = Address HERE
After Instruction
PC = Address THERE
TOS = Address HERE+1
PIC16C71X
DS30272A-page 74 1997 Microchip Technology Inc.
CLRF Clear f
Syntax: [
label
] CLRF f
Operands: 0 ≤ f ≤ 127
Operation: 00h → (f)
1 → Z
Status Affected: Z
Encoding: 00 0001 1fff ffff
Description: The contents of register 'f' are cleared
and the Z bit is set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write
register 'f'
Example CLRF FLAG_REG
Before Instruction
FLAG_REG = 0x5A
After Instruction
FLAG_REG = 0x00
Z = 1
CLRW Clear W
Syntax: [
label
] CLRW
Operands: None
Operation: 00h → (W)
1 → Z
Status Affected: Z
Encoding: 00 0001 0xxx xxxx
Description: W register is cleared. Zero bit (Z) is
set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode NOP Process
data Write to
W
Example CLRW
Before Instruction
W = 0x5A
After Instruction
W = 0x00
Z = 1
CLRWDT Clear Watchdog Timer
Syntax: [
label
] CLRWDT
Operands: None
Operation: 00h → WDT
0 → WDT prescaler,
1 → TO
1 → PD
Status Affected: TO, PD
Encoding: 00 0000 0110 0100
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT. Status bits TO and PD
are set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode NOP Process
data Clear
WDT
Counter
Example CLRWDT
Before Instruction
WDT counter = ?
After Instruction
WDT counter = 0x00
WDT prescaler= 0
TO = 1
PD = 1
1997 Microchip Technology Inc. DS30272A-page 75
PIC16C71X
COMF Complement f
Syntax: [
label
] COMF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) → (dest)
Status Affected: Z
Encoding: 00 1001 dfff ffff
Description: The contents of register 'f' are comple-
mented. If 'd' is 0 the result is stored in
W. If 'd' is 1 the result is stored back in
register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example COMF REG1,0
Before Instruction
REG1 = 0x13
After Instruction
REG1 = 0x13
W = 0xEC
DECF Decrement f
Syntax: [
label
] DECF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) - 1 → (dest)
Status Affected: Z
Encoding: 00 0011 dfff ffff
Description: Decrement register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd'
is 1 the result is stored back in register
'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example DECF CNT, 1
Before Instruction
CNT = 0x01
Z = 0
After Instruction
CNT = 0x00
Z = 1
DECFSZ Decrement f, Skip if 0
Syntax: [
label
] DECFSZ f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) - 1 → (dest); skip if result = 0
Status Affected: None
Encoding: 00 1011 dfff ffff
Description: The contents of register 'f' are decre-
mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
If the result is 1, the next instruction, is
executed. If the result is 0, then a NOP is
executed instead making it a 2TCY
instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
NOP NOP NOP NOP
Example HERE DECFSZ CNT, 1
GOTO LOOP
CONTINUE •
•
•
Before Instruction
PC = address HERE
After Instruction
CNT = CNT - 1
if CNT = 0,
PC = address CONTINUE
if CNT ≠0,
PC = address HERE+1
PIC16C71X
DS30272A-page 76 1997 Microchip Technology Inc.
GOTO Unconditional Branch
Syntax: [
label
] GOTO k
Operands: 0 ≤ k ≤ 2047
Operation: k → PC<10:0>
PCLATH<4:3> → PC<12:11>
Status Affected: None
Encoding: 10 1kkk kkkk kkkk
Description: GOTO is an unconditional branch. The
eleven bit immediate value is loaded
into PC bits <10:0>. The upper bits of
PC are loaded from PCLATH<4:3>.
GOTO is a two cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read
literal 'k' Process
data Write to
PC
2nd Cycle NOP NOP NOP NOP
Example GOTO THERE
After Instruction
PC = Address THERE
INCF Increment f
Syntax: [
label
] INCF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) + 1 → (dest)
Status Affected: Z
Encoding: 00 1010 dfff ffff
Description: The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed
in the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example INCF CNT, 1
Before Instruction
CNT = 0xFF
Z = 0
After Instruction
CNT = 0x00
Z = 1
1997 Microchip Technology Inc. DS30272A-page 77
PIC16C71X
INCFSZ Increment f, Skip if 0
Syntax: [
label
] INCFSZ f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) + 1 → (dest), skip if result = 0
Status Affected: None
Encoding: 00 1111 dfff ffff
Description: The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed
in the W register. If 'd' is 1 the result is
placed back in register 'f'.
If the result is 1, the ne xt instruction is
executed. If the result is 0, a NOP is
executed instead making it a 2TCY
instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
NOP NOP NOP NOP
Example HERE INCFSZ CNT, 1
GOTO LOOP
CONTINUE •
•
•
Before Instruction
PC = address HERE
After Instruction
CNT = CNT + 1
if CNT= 0,
PC = address CONTINUE
if CNT≠0,
PC = address HERE +1
IORLW Inclusive OR Literal with W
Syntax: [
label
] IORLW k
Operands: 0 ≤ k ≤ 255
Operation: (W) .OR. k → (W)
Status Affected: Z
Encoding: 11 1000 kkkk kkkk
Description: The contents of the W register is
OR’ed with the eight bit literal 'k'. The
result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k' Process
data Write to
W
Example IORLW 0x35
Before Instruction
W = 0x9A
After Instruction
W = 0xBF
Z = 1
PIC16C71X
DS30272A-page 78 1997 Microchip Technology Inc.
IORWF Inclusive OR W with f
Syntax: [
label
] IORWF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (W) .OR. (f) → (dest)
Status Affected: Z
Encoding: 00 0100 dfff ffff
Description: Inclusive OR the W register with regis-
ter 'f'. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example IORWF RESULT, 0
Before Instruction
RESULT = 0x13
W = 0x91
After Instruction
RESULT = 0x13
W = 0x93
Z = 1
MOVF Move f
Syntax: [
label
] MOVF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) → (dest)
Status Affected: Z
Encoding: 00 1000 dfff ffff
Description: The contents of register f is moved to
a destination dependant upon the sta-
tus of d. If d = 0, destination is W reg-
ister. If d = 1, the destination is file
register f itself. d = 1 is useful to test a
file register since status flag Z is
affected.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example MOVF FSR, 0
After Instruction
W = value in FSR register
Z = 1
MOVLW Move Literal to W
Syntax: [
label
] MOVLW k
Operands: 0 ≤ k ≤ 255
Operation: k → (W)
Status Affected: None
Encoding: 11 00xx kkkk kkkk
Description: The eight bit literal 'k' is loaded into W
register. The don’t cares will assemble
as 0’s.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k' Process
data Write to
W
Example MOVLW 0x5A
After Instruction
W = 0x5A
MOVWF Move W to f
Syntax: [
label
] MOVWF f
Operands: 0 ≤ f ≤ 127
Operation: (W) → (f)
Status Affected: None
Encoding: 00 0000 1fff ffff
Description: Move data from W register to register
'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write
register 'f'
Example MOVWF OPTION_REG
Before Instruction
OPTION = 0xFF
W = 0x4F
After Instruction
OPTION = 0x4F
W = 0x4F
1997 Microchip Technology Inc. DS30272A-page 79
PIC16C71X
NOP No Operation
Syntax: [
label
] NOP
Operands: None
Operation: No operation
Status Affected: None
Encoding: 00 0000 0xx0 0000
Description: No operation.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode NOP NOP NOP
Example NOP
OPTION Load Option Register
Syntax: [
label
] OPTION
Operands: None
Operation: (W) → OPTION
Status Affected: None
Encoding: 00 0000 0110 0010
Description: The contents of the W register are
loaded in the OPTION register. This
instruction is supported for code com-
patibility with PIC16C5X products.
Since OPTION is a readable/writable
register, the user can directly address
it.
Words: 1
Cycles: 1
Example To maintain upward compatibility
with future PIC16CXX products, do
not use this instruction.
RETFIE Return from Interrupt
Syntax: [
label
] RETFIE
Operands: None
Operation: TOS → PC,
1 → GIE
Status Affected: None
Encoding: 00 0000 0000 1001
Description: Return from Interrupt. Stack is POPed
and Top of Stack (TOS) is loaded in
the PC. Interrupts are enabled by set-
ting Global Interrupt Enable bit, GIE
(INTCON<7>). This is a two cycle
instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode NOP Set the
GIE bit Pop from
the Stack
2nd Cycle NOP NOP NOP NOP
Example RETFIE
After Interrupt
PC = TOS
GIE = 1
PIC16C71X
DS30272A-page 80 1997 Microchip Technology Inc.
RETLW Return with Literal in W
Syntax: [
label
] RETLW k
Operands: 0 ≤ k ≤ 255
Operation: k → (W);
TOS → PC
Status Affected: None
Encoding: 11 01xx kkkk kkkk
Description: The W register is loaded with the eight
bit literal 'k'. The program counter is
loaded from the top of the stack (the
return address). This is a two cycle
instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read
literal 'k' NOP Write to
W, Pop
from the
Stack
2nd Cycle NOP NOP NOP NOP
Example
TABLE
CALL TABLE ;W contains table
;offset value
• ;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [
label
] RETURN
Operands: None
Operation: TOS → PC
Status Affected: None
Encoding: 00 0000 0000 1000
Description: Return from subroutine. The stack is
POPed and the top of the stac k (T OS)
is loaded into the program counter.
This is a two cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode NOP NOP Pop from
the Stack
2nd Cycle NOP NOP NOP NOP
Example RETURN
After Interrupt
PC = TOS
1997 Microchip Technology Inc. DS30272A-page 81
PIC16C71X
RLF Rotate Left f through Carry
Syntax: [
label
] RLF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: See description below
Status Affected: C
Encoding: 00 1101 dfff ffff
Description: The contents of register 'f' are rotated
one bit to the left through the Carry
Flag. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example RLF REG1,0
Before Instruction
REG1 = 1110 0110
C= 0
After Instruction
REG1 = 1110 0110
W= 1100 1100
C= 1
Register fC
RRF Rotate Right f through Carry
Syntax: [
label
] RRF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: See description below
Status Affected: C
Encoding: 00 1100 dfff ffff
Description: The contents of register 'f' are rotated
one bit to the right through the Carry
Flag. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example RRF REG1,0
Before Instruction
REG1 = 1110 0110
C= 0
After Instruction
REG1 = 1110 0110
W= 0111 0011
C= 0
Register fC
PIC16C71X
DS30272A-page 82 1997 Microchip Technology Inc.
SLEEP
Syntax: [
label
] SLEEP
Operands: None
Operation: 00h → WDT,
0 → WDT prescaler,
1 → TO,
0 → PD
Status Affected: TO, PD
Encoding: 00 0000 0110 0011
Description: The power-down status bit, PD is
cleared. Time-out status bit, TO is
set. Watchdog Timer and its pres-
caler are cleared.
The processor is put into SLEEP
mode with the oscillator stopped.
See Section 8.8 for more details.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode NOP NOP Go to
Sleep
Example: SLEEP
SUBLW Subtract W from Literal
Syntax: [
label
] SUBLW k
Operands: 0 ≤ k ≤ 255
Operation: k - (W) → (W)
Status Affected: C, DC, Z
Encoding: 11 110x kkkk kkkk
Description: The W register is subtracted (2’s comple-
ment method) from the eight bit literal 'k'.
The result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k' Process
data Write to W
Example 1: SUBLW 0x02
Before Instruction
W = 1
C = ?
Z = ?
After Instruction
W = 1
C = 1; result is positive
Z = 0
Example 2: Before Instruction
W = 2
C = ?
Z = ?
After Instruction
W = 0
C = 1; result is zero
Z = 1
Example 3: Before Instruction
W = 3
C = ?
Z = ?
After Instruction
W = 0xFF
C = 0; result is nega-
tive
Z = 0
1997 Microchip Technology Inc. DS30272A-page 83
PIC16C71X
SUBWF Subtract W from f
Syntax: [
label
] SUBWF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) - (W) → (dest)
Status Affected: C, DC, Z
Encoding: 00 0010 dfff ffff
Description: Subtract (2’s complement method) W reg-
ister from register 'f'. If 'd' is 0 the result is
stored in the W register. If 'd' is 1 the
result is stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f' Process
data Write to
dest
Example 1: SUBWF REG1,1
Before Instruction
REG1 = 3
W = 2
C = ?
Z = ?
After Instruction
REG1 = 1
W = 2
C = 1; result is positive
Z = 0
Example 2: Before Instruction
REG1 = 2
W = 2
C = ?
Z = ?
After Instruction
REG1 = 0
W = 2
C = 1; result is zero
Z = 1
Example 3: Before Instruction
REG1 = 1
W = 2
C = ?
Z = ?
After Instruction
REG1 = 0xFF
W = 2
C = 0; result is negative
Z = 0
SWAPF Swap Nibbles in f
Syntax: [
label
] SWAPF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f<3:0>) → (dest<7:4>),
(f<7:4>) → (dest<3:0>)
Status Affected: None
Encoding: 00 1110 dfff ffff
Description: The upper and lower nibbles of regis-
ter 'f' are exchanged. If 'd' is 0 the
result is placed in W register. If 'd' is 1
the result is placed in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f' Process
data Write to
dest
Example SWAPF REG, 0
Before Instruction
REG1 = 0xA5
After Instruction
REG1 = 0xA5
W = 0x5A
TRIS Load TRIS Register
Syntax: [
label
] TRIS f
Operands: 5 ≤ f ≤ 7
Operation: (W) → TRIS register f;
Status Affected: None
Encoding: 00 0000 0110 0fff
Description: The instruction is supported for code
compatibility with the PIC16C5X prod-
ucts. Since TRIS registers are read-
able and writable , the user can directly
address them.
Words: 1
Cycles: 1
Example To maintain upward compatibility
with future PIC16CXX products, do
not use this instruction.
PIC16C71X
DS30272A-page 84 1997 Microchip Technology Inc.
XORLW Exclusive OR Literal with W
Syntax: [
label
] XORLW k
Operands: 0 ≤ k ≤ 255
Operation: (W) .XOR. k → (W)
Status Affected: Z
Encoding: 11 1010 kkkk kkkk
Description: The contents of the W register are
XOR’ed with the eight bit literal 'k'.
The result is placed in the W regis-
ter.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k' Process
data Write to
W
Example: XORLW 0xAF
Before Instruction
W = 0xB5
After Instruction
W = 0x1A
XORWF Exclusive OR W with f
Syntax: [
label
] XORWF f,d
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (W) .XOR. (f) → (dest)
Status Affected: Z
Encoding: 00 0110 dfff ffff
Description: Exclusive OR the contents of the W
register with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd'
is 1 the result is stored back in register
'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data Write to
dest
Example XORWF REG 1
Before Instruction
REG = 0xAF
W = 0xB5
After Instruction
REG = 0x1A
W = 0xB5
PIC16C71X
1997 Microchip Technology Inc. DS30272A-page 85
10.0 DEVELOPMENT SUPPORT
10.1 Development Tools
The PICmicrο microcontrollers are supported with a
full range of hardware and softw are de velopment tools:
•PICMASTER/PICMASTER CE Real-Time
In-Circuit Emulator
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX
In-Circuit Emulator
• PRO MATE II Universal Programmer
• PICSTART Plus Entry-Level Prototype
Programmer
• PICDEM-1 Low-Cost Demonstration Board
• PICDEM-2 Low-Cost Demonstration Board
• PICDEM-3 Low-Cost Demonstration Board
• MPASM Assembler
• MPLAB SIM Software Simulator
• MPLAB-C (C Compiler)
•Fuzzy Logic De velopment System
(
fuzzy
TECH−MP)
10.2 PICMASTER: High Performance
Universal In-Circuit Emulator with
MPLAB IDE
The PICMASTER Universal In-Circuit Emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for all
microcontrollers in the PIC12CXXX, PIC14C000,
PIC16C5X, PIC16CXXX and PIC17CXX families.
PICMASTER is supplied with the MPLAB Integrated
Development Environment (IDE), which allows editing,
“make” and download, and source debugging from a
single environment.
Interchangeable target probes allow the system to be
easily reconfigured for emulation of different proces-
sors. The universal architecture of the PICMASTER
allows expansion to support all new Microchip micro-
controllers.
The PICMASTER Emulator System has been
designed as a real-time emulation system with
advanced features that are generally found on more
expensive development tools. The PC compatible 386
(and higher) machine platf orm and Microsoft Windows
3.x environment were chosen to best make these fea-
tures available to you, the end user.
A CE compliant version of PICMASTER is a vailab le f or
European Union (EU) countries.
10.3 ICEPIC: Low-Cost PIC16CXXX
In-Circuit Emulator
ICEPIC is a low-cost in-circuit emulator solution for the
Microchip PIC16C5X and PIC16CXXX families of 8-bit
OTP microcontrollers.
ICEPIC is designed to operate on PC-compatible
machines ranging from 286-AT through Pentium
based machines under Windows 3.x environment.
ICEPIC features real time, non-intrusive emulation.
10.4 PRO MATE II: Universal Programmer
The PRO MATE II Universal Programmer is a full-fea-
tured programmer capable of operating in stand-alone
mode as well as PC-hosted mode.
The PRO MATE II has programmable VDD and VPP
supplies which allows it to verify programmed memory
at VDD min and VDD max for maximum reliability. It has
an LCD display for displaying error messages, keys to
enter commands and a modular detachable socket
assembly to support various package types. In stand-
alone mode the PRO MATE II can read, verify or pro-
gram PIC12CXXX, PIC14C000, PIC16C5X,
PIC16CXXX and PIC17CXX devices. It can also set
configuration and code-protect bits in this mode.
10.5 PICSTART Plus Entry Level
Development System
The PICSTART programmer is an easy-to-use, low-
cost prototype programmer. It connects to the PC via
one of the COM (RS-232) ports. MPLAB Integrated
Development Environment software makes using the
programmer simple and efficient. PICSTART Plus is
not recommended for production programming.
PICSTART Plus supports all PIC12CXXX, PIC14C000,
PIC16C5X, PIC16CXXX and PIC17CXX devices with
up to 40 pins. Larger pin count devices such as the
PIC16C923 and PIC16C924 ma y be supported with an
adapter socket.
PIC16C71X
DS30272A-page 86 1997 Microchip Technology Inc.
10.6 PICDEM-1 Low-Cost PIC16/17
Demonstration Board
The PICDEM-1 is a simple board which demonstrates
the capabilities of several of Microchip’s microcontrol-
lers. The microcontrollers supported are: PIC16C5X
(PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X,
PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and
PIC17C44. All necessary hardware and software is
included to run basic demo programs. The users can
program the sample microcontrollers provided with
the PICDEM-1 board, on a PRO MATE II or
PICSTART-Plus programmer, and easily test firm-
ware. The user can also connect the PICDEM-1
board to the PICMASTER emulator and download
the firmware to the emulator f or testing. Additional pro-
totype area is availab le f or the user to b uild some addi-
tional hardware and connect it to the microcontroller
socket(s). Some of the features include an RS-232
interface, a potentiometer for simulated analog input,
push-button switches and eight LEDs connected to
PORTB.
10.7 PICDEM-2 Low-Cost PIC16CXX
Demonstration Board
The PICDEM-2 is a simple demonstration board that
supports the PIC16C62, PIC16C64, PIC16C65,
PIC16C73 and PIC16C74 microcontrollers. All the
necessary hardware and software is included to
run the basic demonstration programs. The user
can program the sample microcontrollers provided
with the PICDEM-2 board, on a PRO MATE II pro-
grammer or PICSTART-Plus, and easily test firmware .
The PICMASTER emulator may also be used with the
PICDEM-2 board to test firmware. Additional prototype
area has been provided to the user for adding addi-
tional hardware and connecting it to the microcontroller
socket(s). Some of the features include a RS-232 inter-
face, push-button switches, a potentiometer for simu-
lated analog input, a Serial EEPROM to demonstrate
usage of the I2C bus and separ ate headers f or connec-
tion to an LCD module and a keypad.
10.8 PICDEM-3 Low-Cost PIC16CXXX
Demonstration Board
The PICDEM-3 is a simple demonstration board that
supports the PIC16C923 and PIC16C924 in the PLCC
package. It will also support future 44-pin PLCC
microcontrollers with a LCD Module. All the neces-
sary hardware and software is included to run the
basic demonstration programs. The user can pro-
gram the sample microcontrollers provided with
the PICDEM-3 board, on a PRO MATE II program-
mer or PICSTART Plus with an adapter socket, and
easily test firmware. The PICMASTER emulator may
also be used with the PICDEM-3 board to test firm-
ware. Additional prototype area has been provided to
the user for adding hardware and connecting it to the
microcontroller sock et(s). Some of the f eatures include
an RS-232 interface, push-button switches, a potenti-
ometer for simulated analog input, a thermistor and
separate headers for connection to an external LCD
module and a ke ypad. Also provided on the PICDEM-3
board is an LCD panel, with 4 commons and 12 seg-
ments, that is capable of displaying time, temperature
and da y of the w eek. The PICDEM-3 provides an addi-
tional RS-232 interface and Windows 3.1 software for
showing the demultiple xed LCD signals on a PC . A sim-
ple serial interface allows the user to construct a hard-
ware demultiplexer for the LCD signals.
10.9 MPLAB Integrated Development
Environment Software
The MPLAB IDE Software brings an ease of software
development previously unseen in the 8-bit microcon-
troller market. MPLAB is a windows based application
which contains:
• A full featured editor
• Three operating modes
- editor
- emulator
- simulator
• A project manager
• Customizable tool bar and key mapping
• A status bar with project information
• Extensive on-line help
MPLAB allows you to:
• Edit your source files (either assembly or ‘C’)
• One touch assemble (or compile) and download
to PIC16/17 tools (automatically updates all
project information)
• Debug using:
- source files
- absolute listing file
• Transfer data dynamically via DDE (soon to be
replaced by OLE)
• Run up to four emulators on the same PC
The ability to use MPLAB with Microchip’s simulator
allows a consistent platform and the ability to easily
switch from the low cost simulator to the full featured
emulator with minimal retraining due to development
tools.
10.10 Assembler (MPASM)
The MPASM Universal Macro Assembler is a PC-
hosted symbolic assembler. It supports all microcon-
troller series including the PIC12C5XX, PIC14000,
PIC16C5X, PIC16CXXX, and PIC17CXX families.
MPASM offers full featured Macro capabilities, condi-
tional assembly, and sev eral source and listing formats.
It generates various object code formats to support
Microchip's development tools as well as third party
programmers.
MPASM allows full symbolic debugging from
PICMASTER, Microchip’s Universal Emulator
System.
PIC16C71X
1997 Microchip Technology Inc. DS30272A-page 87
MPASM has the following features to assist in dev elop-
ing software for specific use applications.
• Provides translation of Assembler source code to
object code for all Microchip microcontrollers.
• Macro assembly capability.
• Produces all the files (Object, Listing, Symbol,
and special) required for symbolic debug with
Microchip’s emulator systems.
• Supports Hex (def ault), Decimal and Octal source
and listing formats.
MPASM provides a rich directive language to support
programming of the PIC16/17. Directives are helpful in
making the development of y our assemble source code
shorter and more maintainable.
10.11 Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code
development in a PC host environment. It allows the
user to simulate the PIC16/17 series microcontrollers
on an instruction level. On any given instruction, the
user may examine or modify any of the data areas or
provide external stimulus to any of the pins. The input/
output radix can be set by the user and the execution
can be perf ormed in; single step, e xecute until break, or
in a trace mode.
MPLAB-SIM fully supports symbolic debugging using
MPLAB-C and MPASM. The Software Simulator offers
the low cost flexibility to develop and debug code out-
side of the laboratory environment making it an excel-
lent multi-project software development tool.
10.12 C Compiler (MPLAB-C)
The MPLAB-C Code Development System is a
complete ‘C’ compiler and integrated development
environment for Microchip’s PIC16/17 family of micro-
controllers. The compiler provides powerful integration
capabilities and ease of use not found with other
compilers.
For easier source level debugging, the compiler pro-
vides symbol information that is compatible with the
MPLAB IDE memory display.
10.13 Fuzzy Logic Development System
(
fuzzy
TECH-MP)
fuzzy
TECH-MP fuzzy logic development tool is avail-
able in two versions - a low cost introductory version,
MP Explorer, for designers to gain a comprehensive
working knowledge of fuzzy logic system design; and a
full-featured version,
fuzzy
TECH-MP, edition for imple-
menting more complex systems.
Both versions include Microchip’s
fuzzy
LAB demon-
stration board f or hands-on experience with fuzzy logic
systems implementation.
10.14 MP-DriveWay – Application Code
Generator
MP-DriveWay is an easy-to-use Windo ws-based Appli-
cation Code Generator. With MP-DriveWay you can
visually configure all the peripherals in a PIC16/17
device and, with a click of the mouse, generate all the
initialization and many functional code modules in C
language. The output is fully compatible with Micro-
chip’s MPLAB-C C compiler. The code produced is
highly modular and allows easy integ ration of y our own
code. MP-DriveWay is intelligent enough to maintain
your code through subsequent code generation.
10.15 SEEVAL Evaluation and
Programming System
The SEEVAL SEEPROM Designer’s Kit supports all
Microchip 2-wire and 3-wire Serial EEPROMs. The kit
includes everything necessar y to read, write, erase or
program special features of any Microchip SEEPROM
product including Smart Serials and secure serials.
The Total Endurance Disk is included to aid in trade-
off analysis and reliability calculations. The total kit can
significantly reduce time-to-market and result in an
optimized system.
10.16 KEELOQ Evaluation and
Programming Tools
KEELOQ evaluation and programming tools support
Microchips HCS Secure Data Products. The HCS eval-
uation kit includes an LCD display to show changing
codes, a decoder to decode transmissions, and a pro-
gramming interface to program test transmitters.
PIC16C71X
DS30272A-page 88 1997 Microchip Technology Inc.
TABLE 10-1: DEVELOPMENT TOOLS FROM MICROCHIP
PIC12C5XX PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C75X 24CXX
25CXX
93CXX
HCS200
HCS300
HCS301
Emulator Products
PICMASTER/
PICMASTER-CE
In-Circuit Emulator ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ Available
3Q97
ICEPIC Low-Cost
In-Circuit Emulator ✔ ✔ ✔ ✔ ✔ ✔
Software Tools
MPLAB
Integrated
Development
Environment ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
MPLAB C
Compiler ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
fuzzy
TECH-MP
Explorer/Edition
Fuzzy Logic
Dev. Tool ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
MP-DriveWay
Applications
Code Generator ✔ ✔ ✔ ✔ ✔ ✔
Total Endurance
Software Model ✔
Programmers
PICSTART
Lite Ultra Low-Cost
Dev. Kit ✔ ✔ ✔ ✔
PICSTART
Plus Low-Cost
Universal Dev. Kit ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
PRO MATE II
Universal
Programmer ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
KEELOQ
Programmer ✔
Demo Boards
SEEVAL
Designers Kit ✔
PICDEM-1 ✔ ✔ ✔ ✔
PICDEM-2 ✔ ✔
PICDEM-3 ✔
KEELOQ
Evaluation Kit ✔
1997 Microchip Technology Inc. DS30272A-page 89
PIC16C71X
Applicable Devices 710 71 711 715
11.0 ELECTRICAL CHARACTERISTICS FOR PIC16C710 AND PIC16C711
Absolute Maximum Ratings †
Ambient temperature under bias.................................................................................................................-55 to +125˚C
Storage temperature.............................................................................................................................. -65˚C to +150˚C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4)..........................................-0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ........................................................................................................... -0.3 to +7.5V
Voltage on MCLR with respect to VSS................................................................................................................0 to +14V
Voltage on RA4 with respect to Vss...................................................................................................................0 to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin...........................................................................................................................300 mA
Maximum current into VDD pin..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD).....................................................................................................................± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................± 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA ........................................................................................................................200 mA
Maximum current sourced by PORTA...................................................................................................................200 mA
Maximum current sunk by PORTB........................................................................................................................200 mA
Maximum current sourced by PORTB...................................................................................................................200 mA
Note 1: Power dissipation is calculated as follo ws: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)
TABLE 11-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the de vice at those or an y other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C710-04
PIC16C711-04 PIC16C710-10
PIC16C711-10 PIC16C710-20
PIC16C711-20 PIC16LC710-04
PIC16LC711-04 PIC16C710/JW
PIC16C711/JW
RC
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA typ. at 3.0V
IPD: 5.0 µA typ. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq:4 MHz max.
XT
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA typ. at 3.0V
IPD: 5.0 µA typ. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq: 4 MHz max.
HS
VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD:4.5V to 5.5V
Not recommended for
use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at
5.5V IDD: 30 mA max. at
5.5V IDD: 30 mA max. at
5.5V IDD: 30 mA max. at
5.5V
IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq:20 MHz max. Freq: 10 MHz max.
LP
VDD: 4.0V to 6.0V
IDD: 52.5 µA typ. at
32 kHz, 4.0V
IPD: 0.9 µA typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode Not recommended for
use in LP mode
VDD: 2.5V to 6.0V
IDD: 48 µA max. at
32 kHz, 3.0V
IPD: 5.0 µA max. at 3.0V
Freq: 200 kHz max.
VDD: 2.5V to 6.0V
IDD: 48 µA max. at
32 kHz, 3.0V
IPD: 5.0 µA max. at
3.0V
Freq: 200 kHz max.
PIC16C71X
DS30272A-page 90 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
11.1 DC Characteristics: PIC16C710-04 (Commercial, Industrial, Extended)
PIC16C711-04 (Commercial, Industrial, Extended)
PIC16C710-10 (Commercial, Industrial, Extended)
PIC16C711-10 (Commercial, Industrial, Extended)
PIC16C710-20 (Commercial, Industrial, Extended)
PIC16C711-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Param.
No. Characteristic Sym Min Typ† Max Units Conditions
D001
D001A Supply Voltage VDD 4.0
4.5 -
-6.0
5.5 V
VXT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1) VDR - 1.5 - V
D003 VDD start voltage to
ensure internal Power-
on Reset signal
VPOR - VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
3.7 4.0 4.4 V Extended Range Only
D010
D013
Supply Current (Note 2) IDD -
-
2.7
13.5
5
30
mA
mA
XT, RC osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D015 Brown-out Reset Current
(Note 5) ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V
D020
D021
D021A
D021B
Power-down Current
(Note 3) IPD -
-
-
-
10.5
1.5
1.5
1.5
42
21
24
30
µA
µA
µA
µA
VDD = 4.0V, WDT enabled, -40°C to +85°C
VDD = 4.0V, WDT disabled, -0°C to +70°C
VDD = 4.0V, WDT disabled, -40°C to +85°C
VDD = 4.0V, WDT disabled, -40°C to +125°C
D023 Brown-out Reset Current
(Note 5) ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V
* These parameters are characterized but not tested.
†Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating v oltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
1997 Microchip Technology Inc. DS30272A-page 91
PIC16C71X
Applicable Devices 710 71 711 715
11.2 DC Characteristics: PIC16LC710-04 (Commercial, Industrial, Extended)
PIC16LC711-04 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Param
No. Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage
Commercial/Industrial
Extended VDD
VDD 2.5
3.0 -
-6.0
6.0 V
VLP, XT, RC osc configuration (DC - 4 MHz)
LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1) VDR - 1.5 - V
D003 VDD start voltage to
ensure internal Power-
on Reset signal
VPOR - VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on
Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset
Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D010A
D015
Supply Current
(Note 2)
Brown-out Reset
Current (Note 5)
IDD
∆IBOR
-
-
-
2.0
22.5
300*
3.8
48
500
mA
µA
µA
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
BOR enabled VDD = 5.0V
D020
D021
D021A
D021B
D023
Power-down Current
(Note 3)
Brown-out Reset
Current (Note 5)
IPD
∆IBOR
-
-
-
-
-
7.5
0.9
0.9
0.9
300*
30
5
5
10
500
µA
µA
µA
µA
µA
VDD = 3.0V, WDT enabled, -40°C to +85°C
VDD = 3.0V, WDT disabled, 0°C to +70°C
VDD = 3.0V, WDT disabled, -40°C to +85°C
VDD = 3.0V, WDT disabled, -40°C to +125°C
BOR enabled VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These par ameters are f or design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
PIC16C71X
DS30272A-page 92 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
11.3 DC Characteristics: PIC16C710-04 (Commercial, Industrial, Extended)
PIC16C711-04 (Commercial, Industrial, Extended)
PIC16C710-10 (Commercial, Industrial, Extended)
PIC16C711-10 (Commercial, Industrial, Extended)
PIC16C710-20 (Commercial, Industrial, Extended)
PIC16C711-20 (Commercial, Industrial, Extended)
PIC16LC710-04 (Commercial, Industrial, Extended)
PIC16LC711-04 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Operating v oltage VDD range as described in DC spec Section 11.1 and
Section 11.2.
Param
No. Characteristic Sym Min Typ
†Max Units Conditions
Input Low Voltage
I/O ports VIL
D030 with TTL buffer VSS - 0.15VDD V For entire VDD range
D030A VSS - 0.8V V 4.5 ≤ VDD ≤ 5.5V
D031 with Schmitt Trigger buffer VSS - 0.2VDD V
D032 MCLR, OSC1
(in RC mode) VSS - 0.2VDD V
D033 OSC1 (in XT, HS and LP) VSS - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V 4.5 ≤ VDD ≤ 5.5V
D040A 0.25VDD
+ 0.8V - VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD - VDD V For entire VDD range
D042 MCLR, RB0/INT 0.8VDD - VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD - VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD - VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 µA VDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL - - ±1µA Vss ≤ VPIN ≤ VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - ±5µA Vss ≤ VPIN ≤ VDD
D063 OSC1 - - ±5µA Vss ≤ VPIN ≤ VDD, XT, HS and LP
osc configuration
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C7X be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied v oltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
1997 Microchip Technology Inc. DS30272A-page 93
PIC16C71X
Applicable Devices 710 71 711 715
Output Low Voltage
D080 I/O ports VOL - - 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40°C to +85°C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40°C to +125°C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40°C to +85°C
D083A - - 0.6 V IOL = 1.2 mA, VDD = 4.5V,
-40°C to +125°C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD - 0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40°C to +85°C
D090A VDD - 0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
-40°C to +125°C
D092 OSC2/CLKOUT (RC osc config) VDD - 0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40°C to +85°C
D092A VDD - 0.7 - - V IOH = -1.0 mA, VDD = 4.5V,
-40°C to +125°C
D130* Open-Drain High Voltage VOD - - 14 V RA4 pin
Capacitive Loading Specs on
Output Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Operating v oltage VDD range as described in DC spec Section 11.1 and
Section 11.2.
Param
No. Characteristic Sym Min Typ
†Max Units Conditions
*These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C7X be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied v oltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
PIC16C71X
DS30272A-page 94 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
11.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 11-1: LOAD CONDITIONS
1. TppS2ppS
2. TppS
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
SF Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
VDD/2
CL
RL
Pin Pin
VSS VSS
CL
RL= 464Ω
CL= 50 pF for all pins except OSC2
15 pF for OSC2 output
Load condition 1 Load condition 2
1997 Microchip Technology Inc. DS30272A-page 95
PIC16C71X
Applicable Devices 710 71 711 715
11.5 Timing Diagrams and Specifications
FIGURE 11-2: EXTERNAL CLOCK TIMING
TABLE 11-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1) DC — 4 MHz XT osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1) DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4
5—
—20
200 MHz
kHz HS osc mode
LP osc mode
1 Tosc External CLKIN Period
(Note 1) 250 — — ns XT osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5 — — µs LP osc mode
Oscillator Period
(Note 1) 250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100
50 —
—250
250 ns
ns HS osc mode (-10)
HS osc mode (-20)
5 — — µs LP osc mode
2 TCY Instruction Cycle Time (Note 1) 200 — DC ns TCY = 4/FOSC
3 TosL,
TosH External Clock in (OSC1) High
or Low Time 50 — — ns XT oscillator
2.5 — — µs LP oscillator
10 — — ns HS oscillator
4 TosR,
TosF External Clock in (OSC1) Rise
or Fall Time — — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current
consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. OSC2 is disconnected
(has no loading) for the PIC16C710/711.
OSC1
CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
1
23344
PIC16C71X
DS30272A-page 96 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 11-3: CLKOUT AND I/O TIMING
TABLE 11-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1↑ to CLKOUT↓ — 15 30 ns Note 1
11* TosH2ckH OSC1↑ to CLKOUT↑ — 15 30 ns Note 1
12* TckR CLKOUT rise time — 5 15 ns Note 1
13* TckF CLKOUT fall time — 5 15 ns Note 1
14* TckL2ioV CLKOUT ↓ to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT ↑ 0.25TCY + 25 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT ↑ 0 — — ns Note 1
17* TosH2ioV OSC1↑ (Q1 cycle) to
Port out valid — — 80 - 100 ns
18* TosH2ioI OSC1↑ (Q2 cycle) to
Port input invalid (I/O in hold time) TBD — — ns
19* TioV2osH Port input valid to OSC1↑ (I/O in setup time) TBD — — ns
20* TioR Port output rise time PIC16C710/711 — 10 25 ns
PIC16LC710/711 — — 60 ns
21* TioF Port output fall time PIC16C710/711 — 10 25 ns
PIC16LC710/711 — — 60 ns
22††* Tinp INT pin high or low time 20 — — ns
23††* Trbp RB7:RB4 change INT high or low time 20 — — ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 11-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13 14
17
20, 21
19 18
15
11
12 16
old value new value
1997 Microchip Technology Inc. DS30272A-page 97
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 11-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 11-5: BROWN-OUT RESET TIMING
TABLE 11-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 1 — — µs VDD = 5V, -40˚C to +125˚C
31 Twdt Watchdog Timer Time-out Period
(No Prescaler) 7* 18 33* ms VDD = 5V, -40˚C to +125˚C
32 Tost Oscillation Start-up Timer Period — 1024TOSC — — TOSC = OSC1 period
33 Tpwrt Power up Timer Period 28* 72 132* ms VDD = 5V, -40˚C to +125˚C
34 TIOZ I/O Hi-impedance from MCLR Low
or Watchdog Timer Reset — — 1.1 µs
35 TBOR Brown-out Reset pulse width 100 — — µs 3.8V ≤ VDD ≤ 4.2V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 11-1 for load conditions.
VDD BVDD
35
PIC16C71X
DS30272A-page 98 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 11-6: TIMER0 EXTERNAL CLOCK TIMINGS
TABLE 11-5: TIMER0 EXTERNAL CLOCK REQUIREMENTS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
40 Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20* — — ns Must also meet
parameter 42
With Prescaler 10* — — ns
41 Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20* — — ns Must also meet
parameter 42
With Prescaler 10* — — ns
42 Tt0P T0CKI Period Greater of:
20 ns or TCY + 40*
N
— — ns N = prescale value
(2, 4,..., 256)
48 Tcke2tmrI Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 11-1 for load conditions.
41
42
40
RA4/T0CKI
TMR0
1997 Microchip Technology Inc. DS30272A-page 99
PIC16C71X
Applicable Devices 710 71 711 715
TABLE 11-6: A/D CONVERTER CHARACTERISTICS:
PIC16C710/711-04 (COMMERCIAL, INDUSTRIAL, EXTENDED)
PIC16C710/711-10 (COMMERCIAL, INDUSTRIAL, EXTENDED)
PIC16C710/711-20 (COMMERCIAL, INDUSTRIAL, EXTENDED)
PIC16LC710/711-04 (COMMERCIAL, INDUSTRIAL, EXTENDED)
Param
No. Sym Characteristic Min Typ† Max Units Conditions
A01 NRResolution — — 8-bits bit VREF = VDD, VSS ≤ AIN ≤ VREF
A02 EABS Absolute error — — < ± 1 LSb VREF = VDD, VSS ≤ AIN ≤ VREF
A03 EIL Integral linearity error — — < ± 1 LSb VREF = VDD, VSS ≤ AIN ≤ VREF
A04 EDL Differential linearity error — — < ± 1 LSb VREF = VDD, VSS ≤ AIN ≤ VREF
A05 EFS Full scale error — — < ± 1 LSb VREF = VDD, VSS ≤ AIN ≤ VREF
A06 EOFF Offset error — — < ± 1 LSb VREF = VDD, VSS ≤ AIN ≤ VREF
A10 — Monotonicity — guaranteed — — VSS ≤ VAIN ≤ VREF
A20 VREF Reference voltage 2.5V — VDD + 0.3 V
A25 VAIN Analog input voltage VSS - 0.3 — VREF + 0.3 V
A30 ZAIN Recommended impedance of
analog voltage source — — 10.0 kΩ
A40 IAD A/D conversion current (VDD) — 180 — µA Average current consumption
when A/D is on. (Note 1)
A50 IREF VREF input current (Note 2) 10
—
—
—
1000
10
µA
µA
During VAIN acquisition.
Based on differential of VHOLD to VAIN.
To charge CHOLD see Section 7.1.
During A/D Conversion cycle
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: When A/D is off, it will not consume any current other than minor leakage current.
The power-down current spec includes any such leakage from the A/D module.
2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.
PIC16C71X
DS30272A-page 100 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 11-7: A/D CONVERSION TIMING
TABLE 11-7: A/D CONVERSION REQUIREMENTS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
130 TAD A/D clock period PIC16C710/711 1.6 — — µs TOSC based, VREF ≥ 3.0V
PIC16LC710/711 2.0 — — µs TOSC based, VREF full range
PIC16C710/711 2.0* 4.0 6.0 µs A/D RC mode
PIC16LC710/711 3.0* 6.0 9.0 µs A/D RC mode
131 TCNV Conversion time
(not including S/H time). (Note 1) — 9.5 — TAD
132 TACQ Acquisition time Note 2
5*
20
—
—
—
µs
µs The minimum time is the amplifier
settling time. This may be used if the
"new" input voltage has not changed
by more than 1 LSb (i.e., 19.5 mV @
5.12V) from the last sampled voltage
(as stated on CHOLD).
134 TGO Q4 to AD clock start — TOSC/2§ — — If the A/D clock source is selected as
RC, a time of T CY is added bef ore the
A/D clock starts. This allows the
SLEEP instruction to be executed.
135 TSWC Switching from convert → sample time 1.5§ — — TAD
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
§ This specification ensured by design.
Note 1: ADRES register may be read on the following TCY cycle.
2: See Section 7.1 for min conditions.
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(TOSC/2) (1)
7 6 5 4 3 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 Tcy
1997 Microchip Technology Inc. DS30272A-page 101
PIC16C71X
Applicable Devices 710 71 711 715
12.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES FOR PIC16C710
AND PIC16C711
The graphs and tables provided in this section are for design guidance and are not tested or guaranteed.
In some graphs or tables the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are guaranteed to operate properly only within the specified
range.
FIGURE 12-1: TYPICAL IPD vs. VDD (WDT DISABLED, RC MODE)
FIGURE 12-2: MAXIMUM IPD vs. VDD (WDT DISABLED, RC MODE)
Note: The data presented in this section is a statistical summary of data collected on units from diff erent lots ov er
a period of time and matr ix samples. 'Typical' represents the mean of the distribution at, 25°C, while 'max'
or 'min' represents (mean +3σ) and (mean -3σ) respectively where σ is standard deviation.
35
30
25
20
15
10
5
02.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(nA)
VDD(Volts)
IPD(µA)
VDD(Volts)
10.000
1.000
0.100
0.010
0.001
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
85°C
70°C
25°C
0°C
-40°C
PIC16C71X
DS30272A-page 102 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 12-3: TYPICAL IPD vs. VDD @ 25°C
(WDT ENABLED, RC MODE)
FIGURE 12-4: MAXIMUM IPD vs. VDD (WDT
ENABLED, RC MODE)
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(µA)
VDD(Volts)
35
30
25
20
15
10
5
02.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(µA)
VDD(Volts)
-40°C
0°C
70°C
85°C
FIGURE 12-5: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
FIGURE 12-6: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
FIGURE 12-7: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Fosc(MHz)
Cext = 22 pF, T = 25°C
R = 100k
R = 10k
R = 5k
Shaded area is beyond recommended range.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Fosc(MHz)
Cext = 100 pF, T = 25°C
R = 100k
R = 10k
R = 5k
R = 3.3k
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
1000
900
800
700
600
500
400
300
200
100
0
Fosc(kHz)
Cext = 300 pF, T = 25°C
R = 3.3k
R = 5k
R = 10k
R = 100k
1997 Microchip Technology Inc. DS30272A-page 103
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 12-8: TYPICAL IPD vs. VDD BROWN-
OUT DETECT ENABLED (RC
MODE)
FIGURE 12-9: MAXIMUM IPD vs. VDD
BROWN-OUT DETECT
ENABLED
(85°C TO -40°C, RC MODE)
The shaded region represents the built-in hysteresis of the
brown-out reset circuitry.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1400
1200
1000
800
600
400
200
0
VDD(Volts)
IPD(µA)
Device in
Brown-out
Device NOT in
Brown-out Reset
Reset
The shaded region represents the built-in hysteresis of the
brown-out reset circuitry.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1400
1200
1000
800
600
400
200
0
VDD(Volts)
IPD(µA)
4.3
1600
Device NOT in
Brown-out Reset
Device in
Brown-out
Reset
FIGURE 12-10: TYPICAL IPD vs. TIMER1
ENABLED (32 kHz, RC0/RC1 =
33 pF/33 pF, RC MODE)
FIGURE 12-11: MAXIMUM IPD vs. TIMER1
ENABLED
(32 kHz, RC0/RC1 = 33 pF/33
pF, 85°C TO -40°C, RC MODE)
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
IPD(µA)
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
IPD(µA)
35
40
45
PIC16C71X
DS30272A-page 104 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 12-12: TYPICAL IDD vs. FREQUENCY (RC MODE @ 22 pF, 25°C)
FIGURE 12-13: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 22 pF, -40°C TO 85°C)
2000
1800
1600
1400
1200
800
1000
600
400
200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency(MHz)
IDD(µA)
Shaded area is
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
beyond recommended range
2000
1800
1600
1400
1200
800
1000
600
400
200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency(MHz)
IDD(µA)
Shaded area is
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
beyond recommended range
1997 Microchip Technology Inc. DS30272A-page 105
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 12-14: TYPICAL IDD vs. FREQUENCY (RC MODE @ 100 pF, 25°C)
FIGURE 12-15: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 100 pF, -40°C TO 85°C)
1600
1400
1200
1000
800
600
400
200
00 200 400 600 800 1000 1200 1400 1600 1800
Frequency(kHz)
IDD(µA)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Shaded area is
beyond recommended range
1600
1400
1200
1000
800
600
400
200
00 200 400 600 800 1000 1200 1400 1600 1800
Frequency(kHz)
IDD(µA)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Shaded area is
beyond recommended range
PIC16C71X
DS30272A-page 106 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 12-16: TYPICAL IDD vs. FREQUENCY (RC MODE @ 300 pF, 25°C)
FIGURE 12-17: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 300 pF, -40°C TO 85°C)
1200
1000
800
600
400
200
00 100 200 300 400 500 600 700
Frequency(kHz)
IDD(µA)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1200
1000
800
600
400
200
00 100 200 300 400 500 600 700
Frequency(kHz)
IDD(µA)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1997 Microchip Technology Inc. DS30272A-page 107
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 12-18: TYPICAL IDD vs.
CAPACITANCE @ 500 kHz
(RC MODE)
TABLE 12-1: RC OSCILLATOR
FREQUENCIES
Cext Rext Average
Fosc @ 5V, 25°C
22 pF 5k 4.12 MHz ± 1.4%
10k 2.35 MHz ± 1.4%
100k 268 kHz ± 1.1%
100 pF 3.3k 1.80 MHz ± 1.0%
5k 1.27 MHz ± 1.0%
10k 688 kHz ± 1.2%
100k 77.2 kHz ± 1.0%
300 pF 3.3k 707 kHz ± 1.4%
5k 501 kHz ± 1.2%
10k 269 kHz ± 1.6%
100k 28.3 kHz ± 1.1%
The percentage variation indicated here is part to
part variation due to normal process distribution. The
variation indicated is ±3 standard deviation from
average value for VDD = 5V.
Capacitance(pF)
600
IDD(µA)
500
400
300
200
100
0
20 pF 100 pF 300 pF
5.0V
4.0V
3.0V
FIGURE 12-19: TRANSCONDUCTANCE(gm)
OF HS OSCILLATOR vs. VDD
FIGURE 12-20: TRANSCONDUCTANCE(gm)
OF LP OSCILLATOR vs. VDD
FIGURE 12-21: TRANSCONDUCTANCE(gm)
OF XT OSCILLATOR vs. VDD
4.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(mA/V)
VDD(Volts)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Max -40°C
Typ 25°C
Min 85°C
Shaded area is
beyond recommended range
110
100
90
80
70
60
50
40
30
20
10
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(µA/V)
VDD(Volts)
Max -40°C
Typ 25°C
Min 85°C
Shaded areas are
beyond recommended range
1000
900
800
700
600
500
400
300
200
100
02.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(µA/V)
VDD(Volts)
Max -40°C
Typ 25°C
Min 85°C
Shaded areas are
beyond recommended range
PIC16C71X
DS30272A-page 108 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 12-22: TYPICAL XTAL STARTUP
TIME vs. VDD (LP MODE, 25°C)
FIGURE 12-23: TYPICAL XTAL STARTUP
TIME vs. VDD (HS MODE,
25°C)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
Startup Time(Seconds)
32 kHz, 33 pF/33 pF
200 kHz, 15 pF/15 pF
7
6
5
4
3
2
1
4.0 4.5 5.0 5.5 6.0
VDD(Volts)
Startup Time(ms)
20 MHz, 33 pF/33 pF
8 MHz, 33 pF/33 pF
8 MHz, 15 pF/15 pF
20 MHz, 15 pF/15 pF
FIGURE 12-24: TYPICAL XTAL STARTUP
TIME vs. VDD (XT MODE, 25°C)
TABLE 12-2: CAPACITOR SELECTION
FOR CRYSTAL
OSCILLATORS
Osc Type Crystal
Freq Cap. Range
C1 Cap. Range
C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 47-68 pF 47-68 pF
1 MHz 15 pF 15 pF
4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15-33 pF 15-33 pF
20 MHz 15-33 pF 15-33 pF
Crystals
Used
32 kHz Epson C-001R32.768K-A ± 20 PPM
200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM
4 MHz ECS ECS-40-20-1 ± 50 PPM
8 MHz EPSON CA-301 8.000M-C ± 30 PPM
20 MHz EPSON CA-301 20.000M-C ± 30 PPM
70
60
50
40
30
20
10
03.0 3.52.5 4.0 5.0 5.5 6.04.5
VDD(Volts)
Startup Time(ms)
200 kHz, 68 pF/68 pF
200 kHz, 47 pF/47 pF
1 MHz, 15 pF/15 pF
4 MHz, 15 pF/15 pF
1997 Microchip Technology Inc. DS30272A-page 109
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 12-25: TYPICAL IDD vs. FREQUENCY
(LP MODE, 25°C)
FIGURE 12-26: MAXIMUM IDD vs.
FREQUENCY
(LP MODE, 85°C TO -40°C)
120
100
80
60
40
20
00 50 100 150 200
Frequency(kHz)
IDD(µA)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
120
100
80
60
40
20
00 50 100 150 200
Frequency(kHz)
IDD(µA)
140
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
FIGURE 12-27: TYPICAL IDD vs. FREQUENCY
(XT MODE, 25°C)
FIGURE 12-28: MAXIMUM IDD vs.
FREQUENCY
(XT MODE, -40°C TO 85°C)
1200
1000
800
600
400
200
0
0.0 0.4 Frequency(MHz)
IDD(µA)
1400
1600
1800
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1200
1000
800
600
400
200
0
0.0 0.4 Frequency(MHz)
IDD(µA)
1400
1600
1800
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
PIC16C71X
DS30272A-page 110 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 12-29: TYPICAL IDD vs. FREQUENCY
(HS MODE, 25°C)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.01 2 4 6 8 10 12 14 16 18 20
Frequency(MHz)
IDD(mA)
6.0V
5.5V
5.0V
4.5V
4.0V
FIGURE 12-30: MAXIMUM IDD vs.
FREQUENCY
(HS MODE, -40°C TO 85°C)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.01 2 4 6 8 10 12 14 16 18 20
Frequency(MHz)
IDD(mA)
6.0V
5.5V
5.0V
4.5V
4.0V
1997 Microchip Technology Inc. DS30272A-page 111
PIC16C71X
Applicable Devices 710 71 711 715
13.0 ELECTRICAL CHARACTERISTICS FOR PIC16C715
Absolute Maximum Ratings †
Ambient temperature under bias.................................................................................................................-55 to +125˚C
Storage temperature.............................................................................................................................. -65˚C to +150˚C
Voltage on any pin with respect to VSS (except VDD and MCLR)....................................................-0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ................................................................................................................ 0 to +7.5V
Voltage on MCLR with respect to VSS................................................................................................................0 to +14V
Voltage on RA4 with respect to Vss...................................................................................................................0 to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin...........................................................................................................................300 mA
Maximum current into VDD pin..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD).....................................................................................................................± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................± 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA ........................................................................................................................200 mA
Maximum current sourced by PORTA...................................................................................................................200 mA
Maximum current sunk by PORTB........................................................................................................................200 mA
Maximum current sourced by PORTB...................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the de vice at those or an y other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
PIC16C71X
DS30272A-page 112 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
TABLE 13-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
OSC PIC16C715-04 PIC16C715-10 PIC16C715-20 PIC16LC715-04 PIC16C715/JW
RC
VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ . at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 5.5V
IDD: 2.0 mA typ. at 3.0V
IPD: 0.9 µA typ . at 3V
Freq: 4 MHz max.
VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq: 4 MHz max.
XT
VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ . at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 5.5V
IDD: 2.0 mA typ. at 3.0V
IPD: 0.9 µA typ . at 3V
Freq: 4 MHz max.
VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 21 µA max. at 4V
Freq: 4 MHz max.
HS
VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD:4.5V to 5.5V
Do not use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at 5.5V IDD: 30 mA max. at 5.5V IDD:30 mA max. at 5.5V IDD: 30 mA max. at 5.5V
IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V IPD:1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 10 MHz max.
LP
VDD: 4.0V to 5.5V
IDD: 52.5 µA typ. at 32 kHz, 4.0V
IPD: 0.9 µA typ. at 4.0V
Freq: 200 kHz max.
Do not use in LP mode Do not use in LP mode
VDD: 2.5V to 5.5V
IDD: 48 µA max. at 32 kHz, 3.0V
IPD: 5.0 µA max. at 3.0V
Freq: 200 kHz max.
VDD: 2.5V to 5.5V
IDD: 48 µA max. at 32 kHz, 3.0V
IPD: 5.0 µA max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recommended that the user select the device type
that ensures the specifications required.
1997 Microchip Technology Inc. DS30272A-page 113
PIC16C71X
Applicable Devices 710 71 711 715
13.1 DC Characteristics: PIC16C715-04 (Commercial, Industrial, Extended)
PIC16C715-10 (Commercial, Industrial, Extended)
PIC16C715-20 (Commercial, Industrial, Extended))
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Param.
No. Characteristic Sym Min Typ† Max Units Conditions
D001
D001A Supply Voltage VDD 4.0
4.5 -
-5.5
5.5 V
VXT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1) VDR - 1.5 - V Device in SLEEP mode
D003 VDD start voltage to
ensure internal Power-
on Reset signal
VPOR - VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D013
Supply Current (Note 2) IDD -
-
2.7
13.5
5
30
mA
mA
XT, RC osc configuration (PIC16C715-04)
FOSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration (PIC16C715-20)
FOSC = 20 MHz, VDD = 5.5V
D015 Brown-out Reset Current
(Note 5) ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V
D020
D021
D021A
D021B
Power-down Current
(Note 3) IPD -
-
-
-
10.5
1.5
1.5
1.5
42
21
24
30
µA
µA
µA
µA
VDD = 4.0V, WDT enabled, -40°C to +85°C
VDD = 4.0V, WDT disabled, -0°C to +70°C
VDD = 4.0V, WDT disabled, -40°C to +85°C
VDD = 4.0V, WDT disabled, -40°C to +125°C
D023 Brown-out Reset Current
(Note 5) ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V
* These parameters are characterized but not tested.
†Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating v oltage and frequency. Other f actors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
PIC16C71X
DS30272A-page 114 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
13.2 DC Characteristics: PIC16LC715-04 (Commercial, Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
Param
No. Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 2.5 - 5.5 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1) VDR - 1.5 - V Device in SLEEP mode
D003 VDD start voltage to
ensure internal
Power-on Reset
signal
VPOR - VSS - V See section on Power-on Reset for details
D004* VDD rise rate to
ensure internal
Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset
Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D010A
Supply Current
(Note 2) IDD -
-
2.0
22.5
3.8
48
mA
µA
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D015 Brown-out Reset
Current (Note 5) ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V
D020
D021
D021A
Power-down Current
(Note 3) IPD -
-
-
7.5
0.9
0.9
30
5
5
µA
µA
µA
VDD = 3.0V, WDT enabled, -40°C to +85°C
VDD = 3.0V, WDT disabled, 0°C to +70°C
VDD = 3.0V, WDT disabled, -40°C to +85°C
D023 Brown-out Reset
Current (Note 5) ∆IBOR - 300* 500 µA BOR enabled VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These par ameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
1997 Microchip Technology Inc. DS30272A-page 115
PIC16C71X
Applicable Devices 710 71 711 715
13.3 DC Characteristics: PIC16C715-04 (Commercial, Industrial, Extended)
PIC16C715-10 (Commercial, Industrial, Extended)
PIC16C715-20 (Commercial, Industrial, Extended)
PIC16LC715-04 (Commercial, Industrial))
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Operating voltage VDD range as described in DC spec Section 13.1
and Section 13.2.
Param
No. Characteristic Sym Min Typ
†Max Units Conditions
Input Low Voltage
I/O ports VIL
D030 with TTL buffer VSS - 0.5V V
D031 with Schmitt Trigger buffer VSS - 0.2VDD V
D032 MCLR, RA4/T0CKI,OSC1
(in RC mode) VSS - 0.2VDD V
D033 OSC1 (in XT, HS and LP) VSS - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V 4.5 ≤ VDD ≤ 5.5V
D040A 0.8VDD - VDD V For VDD > 5.5V or VDD < 4.5V
D041 with Schmitt Trigger buffer 0.8VDD - VDD V For entire VDD range
D042 MCLR, RA4/T0CKI RB0/INT 0.8VDD - VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD - VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD - VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 µA VDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL - - ±1µA Vss ≤ VPIN ≤ VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - ±5µA Vss ≤ VPIN ≤ VDD
D063 OSC1 - - ±5µA Vss ≤ VPIN ≤ VDD, XT, HS and LP
osc configuration
Output Low Voltage
D080 I/O ports VOL - - 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40°C to +85°C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40°C to +125°C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40°C to +85°C
D083A - - 0.6 V IOL = 1.2 mA, VDD = 4.5V,
-40°C to +125°C
†Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C7X be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied v oltage le v el. The specified le v els
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as coming out of the pin.
PIC16C71X
DS30272A-page 116 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
Output High Voltage
D090 I/O ports (Note 3) VOH VDD - 0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40°C to +85°C
D090A VDD - 0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
-40°C to +125°C
D092 OSC2/CLKOUT (RC osc config) VDD - 0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40°C to +85°C
D092A VDD - 0.7 - - V IOH = -1.0 mA, VDD = 4.5V,
-40°C to +125°C
Capacitive Loading Specs on
Output Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
-40˚C ≤ TA ≤ +125˚C (extended)
Operating voltage VDD range as described in DC spec Section 13.1
and Section 13.2.
Param
No. Characteristic Sym Min Typ
†Max Units Conditions
†Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C7X be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied v oltage le v el. The specified le v els
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as coming out of the pin.
1997 Microchip Technology Inc. DS30272A-page 117
PIC16C71X
Applicable Devices 710 71 711 715
13.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 13-1: LOAD CONDITIONS
1. TppS2ppS
2. TppS
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
SF Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
VDD/2
CL
RL
Pin Pin
VSS VSS
CL
RL= 464Ω
CL= 50 pF for all pins except OSC2
15 pF for OSC2 output
Load condition 1 Load condition 2
PIC16C71X
DS30272A-page 118 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
13.5 Timing Diagrams and Specifications
FIGURE 13-2: EXTERNAL CLOCK TIMING
TABLE 13-2: CLOCK TIMING REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
Fos External CLKIN Frequency
(Note 1) DC — 4 MHz XT osc mode
DC — 4 MHz HS osc mode (PIC16C715-04)
DC — 20 MHz HS osc mode (PIC16C715-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1) DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 4 MHz HS osc mode (PIC16C715-04)
4
4
5
—
—
—
10
20
200
MHz
MHz
kHz
HS osc mode (PIC16C715-10)
HS osc mode (PIC16C715-20)
LP osc mode
1 Tosc External CLKIN Period
(Note 1) 250 — — ns XT osc mode
250 — — ns HS osc mode (PIC16C715-04)
100 — — ns HS osc mode (PIC16C715-10)
50 — — ns HS osc mode (PIC16C715-20)
5 — — µs LP osc mode
Oscillator Period
(Note 1) 250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (PIC16C715-04)
100
50
—
—
250
250
ns
ns
HS osc mode (PIC16C715-10)
HS osc mode (PIC16C715-20)
5 — — µs LP osc mode
2 TCY Instruction Cycle Time (Note 1) 200 — DC ns TCY = 4/FOSC
3 TosL,
TosH External Clock in (OSC1) High
or Low Time 50 — — ns XT oscillator
2.5 — — µs LP oscillator
10 — — ns HS oscillator
4 TosR,
TosF External Clock in (OSC1) Rise
or Fall Time — — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device e x ecuting code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. OSC2 is disconnected
(has no loading) for the PIC16C715.
OSC1
CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
1
23344
1997 Microchip Technology Inc. DS30272A-page 119
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 13-3: CLKOUT AND I/O TIMING
TABLE 13-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1↑ to CLKOUT↓ — 15 30 ns Note 1
11* TosH2ckH OSC1↑ to CLKOUT↑ — 15 30 ns Note 1
12* TckR CLKOUT rise time — 5 15 ns Note 1
13* TckF CLKOUT fall time — 5 15 ns Note 1
14* TckL2ioV CLKOUT ↓ to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT ↑ 0.25TCY + 25 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT ↑ 0 — — ns Note 1
17* TosH2ioV OSC1↑ (Q1 cycle) to
Port out valid — — 80 - 100 ns
18* TosH2ioI OSC1↑ (Q2 cycle) to
Port input invalid (I/O in hold time) TBD — — ns
19* TioV2osH Port input valid to OSC1↑ (I/O in setup time) TBD — — ns
20* TioR Port output rise time PIC16C715 — 10 25 ns
PIC16LC715 — — 60 ns
21* TioF Port output fall time PIC16C715 — 10 25 ns
PIC16LC715 — — 60 ns
22††* Tinp INT pin high or low time 20 — — ns
23††* Trbp RB7:RB4 change INT high or low time 20 — — ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 13-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13 14
17
20, 21
19 18
15
11
12 16
old value new value
PIC16C71X
DS30272A-page 120 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 13-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, AND POWER-UP
TIMER TIMING
FIGURE 13-5: BROWN-OUT RESET TIMING
TABLE 13-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2 — — µs VDD = 5V, -40˚C to +125˚C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler) 7 18 33 ms VDD = 5V, -40˚C to +125˚C
32 Tost Oscillation Start-up Timer Period — 1024TOSC — — TOSC = OSC1 period
33* Tpwrt Power up Timer Period 28 72 132 ms VDD = 5V, -40˚C to +125˚C
34 TIOZ I/O Hi-impedance from MCLR Low
or Watchdog Timer Reset — — 2.1 µs
35 TBOR Brown-out Reset pulse width 100 — — µs VDD ≤ BVDD (D005)
36 TPER Parity Error Reset — TBD — µs
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Timeout
OSC
Timeout
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Parity
Error
Reset
36
VDD BVDD
35
1997 Microchip Technology Inc. DS30272A-page 121
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 13-6: TIMER0 CLOCK TIMINGS
TABLE 13-5: TIMER0 CLOCK REQUIREMENTS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
40 Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20* — — ns
With Prescaler 10* — — ns
41 Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20* — — ns
With Prescaler 10* — — ns
42 Tt0P T0CKI Period Greater of:
20µs or TCY + 40*
N
— — ns N = prescale value
(1, 2, 4,..., 256)
48 Tcke2tmrI Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 13-1 for load conditions.
41
42
40
RA4/T0CKI
TMR0
PIC16C71X
DS30272A-page 122 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
TABLE 13-6: A/D CONVERTER CHARACTERISTICS:
PIC16C715-04 (COMMERCIAL, INDUSTRIAL, EXTENDED)
PIC16C715-10 (COMMERCIAL, INDUSTRIAL, EXTENDED)
PIC16C715-20 (COMMERCIAL, INDUSTRIAL, EXTENDED)
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
NRResolution — — 8-bits — VREF = VDD, VSS ≤ AIN ≤ VREF
NINT Integral error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
NDIF Differential error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
NFS Full scale error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
NOFF Offset error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
— Monotonicity — guaranteed — — VSS ≤ AIN ≤ VREF
VREF Reference voltage 2.5V — VDD + 0.3 V
VAIN Analog input voltage VSS - 0.3 — VREF + 0.3 V
ZAIN Recommended
impedance of analog
voltage source
— — 10.0 kΩ
IAD A/D conversion cur-
rent (VDD)— 180 — µA Average current consumption when
A/D is on. (Note 1)
IREF VREF input current
(Note 2) — — 1
10 mA
µADuring sampling
All other times
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes
any such leakage from the A/D module.
2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.
1997 Microchip Technology Inc. DS30272A-page 123
PIC16C71X
Applicable Devices 710 71 711 715
TABLE 13-7: A/D CONVERTER CHARACTERISTICS:
PIC16LC715-04 (COMMERCIAL, INDUSTRIAL)
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
NRResolution — — 8-bits — VREF = VDD, VSS ≤ AIN ≤ VREF
NINT Integral error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
NDIF Differential error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
NFS Full scale error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
NOFF Offset error — — less than
±1 LSb — VREF = VDD, VSS ≤ AIN ≤ VREF
— Monotonicity — guaranteed — — VSS ≤ AIN ≤ VREF
VREF Reference voltage 2.5V — VDD + 0.3 V
VAIN Analog input voltage VSS - 0.3 — VREF + 0.3 V
ZAIN Recommended
impedance of ana-
log voltage source
— — 10.0 kΩ
IAD A/D conversion cur-
rent (VDD)— 90 — µA Average current consumption when
A/D is on. (Note 1)
IREF VREF input current
(Note 2) — — 1
10 mA
µADuring sampling
All other times
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes
any such leakage from the A/D module.
2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.
PIC16C71X
DS30272A-page 124 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 13-7: A/D CONVERSION TIMING
TABLE 13-8: A/D CONVERSION REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
130 TAD A/D clock period 1.6
2.0 —
—µs
µsVREF ≥ 3.0V
VREF full range
130 TAD A/D Internal RC
Oscillator source ADCS1:ADCS0 = 11
(RC oscillator source)
3.0 6.0 9.0 µs PIC16LC715, VDD = 3.0V
2.0 4.0 6.0 µs PIC16C715
131 TCNV Conversion time
(not including S/H
time). Note 1
— 9.5TAD — —
132 TACQ Acquisition time Note 2 20 — µs
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: ADRES register may be read on the following TCY cycle.
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(TOSC/2) (1)
7 6 5 4 3 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 Tcy
1997 Microchip Technology Inc. DS30272A-page 125
PIC16C71X
Applicable Devices 710 71 711 715
14.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES FOR PIC16C715
The graphs and tables provided in this section are for design guidance and are not tested or guaranteed.
In some graphs or tables the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are guaranteed to operate properly only within the specified
range.
FIGURE 14-1: TYPICAL IPD vs. VDD (WDT DISABLED, RC MODE)
FIGURE 14-2: MAXIMUM IPD vs. VDD (WDT DISABLED, RC MODE)
Note: The data presented in this section is a statistical summary of data collected on units from diff erent lots ov er
a period of time and matr ix samples. 'Typical' represents the mean of the distribution at, 25°C, while 'max'
or 'min' represents (mean +3σ) and (mean -3σ) respectively where σ is standard deviation.
35
30
25
20
15
10
5
02.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(nA)
VDD(Volts)
Shaded area is beyond
recommended range.
IPD(µA)
VDD(Volts)
10.000
1.000
0.100
0.010
0.001
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
85°C
70°C
25°C
0°C
-40°C
Shaded area is beyond
recommended range.
PIC16C71X
DS30272A-page 126 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 14-3: TYPICAL IPD vs. VDD @ 25°C
(WDT ENABLED, RC MODE)
FIGURE 14-4: MAXIMUM IPD vs. VDD (WDT
ENABLED, RC MODE)
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(µA)
VDD(Volts)
Shaded area is beyond recommended range.
35
30
25
20
15
10
5
02.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(µA)
VDD(Volts)
-40°C
0°C
70°C
85°C
Shaded area is beyond recommended range.
FIGURE 14-5: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
FIGURE 14-6: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
FIGURE 14-7: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Fosc(MHz)
Cext = 22 pF, T = 25°C
R = 100k
R = 10k
R = 5k
Shaded area is beyond recommended range.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Fosc(MHz)
Cext = 100 pF, T = 25°C
R = 100k
R = 10k
R = 5k
R = 3.3k
Shaded area is beyond recommended range.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
1000
900
800
700
600
500
400
300
200
100
0
Fosc(kHz)
Cext = 300 pF, T = 25°C
R = 3.3k
R = 5k
R = 10k
R = 100k
Shaded area is beyond recommended range.
1997 Microchip Technology Inc. DS30272A-page 127
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 14-8: TYPICAL IPD vs. VDD BROWN-
OUT DETECT ENABLED (RC
MODE)
FIGURE 14-9: MAXIMUM IPD vs. VDD
BROWN-OUT DETECT
ENABLED
(85°C TO -40°C, RC MODE)
This shaded region represents the built-in hysteresis of
the brown-out reset circuitry.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1400
1200
1000
800
600
400
200
0
VDD(Volts)
IPD(µA)
Device in
Brown-out
Device NOT in
Brown-out Reset
Reset
Shaded area is beyond recommended range.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1400
1200
1000
800
600
400
200
0
VDD(Volts)
IPD(µA)
4.3
1600
Device NOT in
Brown-out Reset
Device in
Brown-out
Reset
This shaded region represents the built-in hysteresis of
the brown-out reset circuitry.
Shaded area is beyond recommended range.
FIGURE 14-10: TYPICAL IPD vs. TIMER1
ENABLED (32 kHz, RC0/RC1 =
33 pF/33 pF, RC MODE)
FIGURE 14-11: MAXIMUM IPD vs. TIMER1
ENABLED
(32 kHz, RC0/RC1 = 33 pF/33
pF, 85°C TO -40°C, RC MODE)
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
IPD(µA)
Shaded area is beyond recommended range.
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
IPD(µA)
35
40
45
Shaded area is beyond recommended range.
PIC16C71X
DS30272A-page 128 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 14-12: TYPICAL IDD vs. FREQUENCY (RC MODE @ 22 pF, 25°C)
FIGURE 14-13: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 22 pF, -40°C TO 85°C)
2000
1800
1600
1400
1200
800
1000
600
400
200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency(MHz)
IDD(µA)
Shaded area is
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
beyond recommended range
2000
1800
1600
1400
1200
800
1000
600
400
200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency(MHz)
IDD(µA)
Shaded area is
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
beyond recommended range
1997 Microchip Technology Inc. DS30272A-page 129
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 14-14: TYPICAL IDD vs. FREQUENCY (RC MODE @ 100 pF, 25°C)
FIGURE 14-15: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 100 pF, -40°C TO 85°C)
1600
1400
1200
1000
800
600
400
200
00 200 400 600 800 1000 1200 1400 1600 1800
Frequency(kHz)
IDD(µA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Shaded area is
beyond recommended range
1600
1400
1200
1000
800
600
400
200
00 200 400 600 800 1000 1200 1400 1600 1800
Frequency(kHz)
IDD(µA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Shaded area is
beyond recommended range
PIC16C71X
DS30272A-page 130 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 14-16: TYPICAL IDD vs. FREQUENCY (RC MODE @ 300 pF, 25°C)
FIGURE 14-17: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 300 pF, -40°C TO 85°C)
1200
1000
800
600
400
200
00 100 200 300 400 500 600 700
Frequency(kHz)
IDD(µA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1200
1000
800
600
400
200
00 100 200 300 400 500 600 700
Frequency(kHz)
IDD(µA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1997 Microchip Technology Inc. DS30272A-page 131
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 14-18: TYPICAL IDD vs.
CAPACITANCE @ 500 kHz
(RC MODE)
TABLE 14-1: RC OSCILLATOR
FREQUENCIES
Cext Rext Average
Fosc @ 5V, 25°C
22 pF 5k 4.12 MHz ± 1.4%
10k 2.35 MHz ± 1.4%
100k 268 kHz ± 1.1%
100 pF 3.3k 1.80 MHz ± 1.0%
5k 1.27 MHz ± 1.0%
10k 688 kHz ± 1.2%
100k 77.2 kHz ± 1.0%
300 pF 3.3k 707 kHz ± 1.4%
5k 501 kHz ± 1.2%
10k 269 kHz ± 1.6%
100k 28.3 kHz ± 1.1%
The percentage variation indicated here is part to
part variation due to normal process distribution. The
variation indicated is ±3 standard deviation from
average value for VDD = 5V.
Capacitance(pF)
600
IDD(µA)
500
400
300
200
100
0
20 pF 100 pF 300 pF
5.0V
4.0V
3.0V
FIGURE 14-19: TRANSCONDUCTANCE(gm)
OF HS OSCILLATOR vs. VDD
FIGURE 14-20: TRANSCONDUCTANCE(gm)
OF LP OSCILLATOR vs. VDD
FIGURE 14-21: TRANSCONDUCTANCE(gm)
OF XT OSCILLATOR vs. VDD
4.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(mA/V)
VDD(Volts)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Max -40°C
Typ 25°C
Min 85°C
Shaded area is beyond recommended range.
110
100
90
80
70
60
50
40
30
20
10
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(µA/V)
VDD(Volts)
Max -40°C
Typ 25°C
Min 85°C
Shaded area is beyond recommended range.
1000
900
800
700
600
500
400
300
200
100
02.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(µA/V)
Max -40°C
Typ 25°C
Min 85°C
VDD(Volts)
Shaded area is beyond recommended range.
PIC16C71X
DS30272A-page 132 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 14-22: TYPICAL XTAL STARTUP
TIME vs. VDD (LP MODE, 25°C)
FIGURE 14-23: TYPICAL XTAL STARTUP
TIME vs. VDD (HS MODE,
25°C)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
Startup Time(Seconds)
32 kHz, 33 pF/33 pF
200 kHz, 15 pF/15 pF
Shaded area is beyond recommended range.
7
6
5
4
3
2
1
4.0 4.5 5.0 5.5 6.0
VDD(Volts)
Startup Time(ms)
20 MHz, 33 pF/33 pF
8 MHz, 33 pF/33 pF
8 MHz, 15 pF/15 pF
20 MHz, 15 pF/15 pF
Shaded area is beyond recommended range.
FIGURE 14-24: TYPICAL XTAL STARTUP
TIME vs. VDD (XT MODE, 25°C)
TABLE 14-2: CAPACITOR SELECTION
FOR CRYSTAL
OSCILLATORS
Osc Type Crystal
Freq Cap. Range
C1 Cap. Range
C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 47-68 pF 47-68 pF
1 MHz 15 pF 15 pF
4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15-33 pF 15-33 pF
20 MHz 15-33 pF 15-33 pF
Crystals
Used
32 kHz Epson C-001R32.768K-A ± 20 PPM
200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM
4 MHz ECS ECS-40-20-1 ± 50 PPM
8 MHz EPSON CA-301 8.000M-C ± 30 PPM
20 MHz EPSON CA-301 20.000M-C ± 30 PPM
70
60
50
40
30
20
10
03.0 3.52.5 4.0 5.0 5.5 6.04.5
VDD(Volts)
Startup Time(ms)
200 kHz, 68 pF/68 pF
200 kHz, 47 pF/47 pF
1 MHz, 15 pF/15 pF
4 MHz, 15 pF/15 pF
Shaded area is beyond recommended range.
1997 Microchip Technology Inc. DS30272A-page 133
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 14-25: TYPICAL IDD vs. FREQUENCY
(LP MODE, 25°C)
FIGURE 14-26: MAXIMUM IDD vs.
FREQUENCY
(LP MODE, 85°C TO -40°C)
120
100
80
60
40
20
00 50 100 150 200
Frequency(kHz)
IDD(µA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
120
100
80
60
40
20
00 50 100 150 200
Frequency(kHz)
IDD(µA)
140
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
FIGURE 14-27: TYPICAL IDD vs. FREQUENCY
(XT MODE, 25°C)
FIGURE 14-28: MAXIMUM IDD vs.
FREQUENCY
(XT MODE, -40°C TO 85°C)
1200
1000
800
600
400
200
0
0.0 0.4 Frequency(MHz)
IDD(µA)
1400
1600
1800
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1200
1000
800
600
400
200
0
0.0 0.4 Frequency(MHz)
IDD(µA)
1400
1600
1800
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
PIC16C71X
DS30272A-page 134 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 14-29: TYPICAL IDD vs. FREQUENCY
(HS MODE, 25°C)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.01 2 4 6 8 10 12 14 16 18 20
Frequency(MHz)
IDD(mA)
5.5V
5.0V
4.5V
4.0V
FIGURE 14-30: MAXIMUM IDD vs.
FREQUENCY
(HS MODE, -40°C TO 85°C)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.01 2 4 6 8 10 12 14 16 18 20
Frequency(MHz)
IDD(mA)
5.5V
5.0V
4.5V
4.0V
1997 Microchip Technology Inc. DS30272A-page 135
PIC16C71X
Applicable Devices 710 71 711 715
15.0 ELECTRICAL CHARACTERISTICS FOR PIC16C71
Absolute Maximum Ratings †
Ambient temperature under bias.................................................................................................................-55 to +125˚C
Storage temperature.............................................................................................................................. -65˚C to +150˚C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4)..........................................-0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS .......................................................................................................... -0.3 to +7.5V
Voltage on MCLR with respect to VSS (Note 2)..................................................................................................0 to +14V
Voltage on RA4 with respect to Vss...................................................................................................................0 to +14V
Total power dissipation (Note 1)...........................................................................................................................800 mW
Maximum current out of VSS pin...........................................................................................................................150 mA
Maximum current into VDD pin..............................................................................................................................100 mA
Input clamp current, IIK (VI < 0 or VI > VDD).....................................................................................................................± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................± 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................20 mA
Maximum current sunk by PORTA ..........................................................................................................................80 mA
Maximum current sourced by PORTA.....................................................................................................................50 mA
Maximum current sunk by PORTB........................................................................................................................150 mA
Maximum current sourced by PORTB...................................................................................................................100 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents g reater than 80 mA, may cause latch-up . Thus,
a series resistor of 50-100Ω should be used when applying a “lo w” lev el to the MCLR pin r ather than pulling
this pin directly to VSS.
TABLE 15-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the de vice at those or an y other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C71-04 PIC16C71-20 PIC16LC71-04 JW Devices
RC
VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 µA max. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 1.8 mA typ. at 5.5V
IPD: 1.0 µA typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 6.0V
IDD: 1.4 mA typ. at 3.0V
IPD: 0.6 µA typ. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 µA max. at 4V
Freq:4 MHz max.
XT
VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 µA max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 1.8 mA typ. at 5.5V
IPD: 1.0 µA typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 6.0V
IDD: 1.4 mA typ. at 3.0V
IPD: 0.6 µA typ. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 µA max. at 4V
Freq: 4 MHz max.
HS
VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for use in
HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at 5.5V IDD: 30 mA max. at 5.5V IDD: 30 mA max. at 5.5V
IPD: 1.0 µA typ. at 4.5V IPD: 1.0 µA typ. at 4.5V IPD: 1.0 µA typ. at 4.5V
Freq: 4 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP
VDD: 4.0V to 6.0V
IDD: 15 µA typ. at 32 kHz,
4.0V
IPD: 0.6 µA typ. at 4.0V
Freq: 200 kHz max.
Not recommended for use
in LP mode
VDD: 3.0V to 6.0V
IDD: 32 µA max. at 32 kHz,
3.0V
IPD: 9 µA max. at 3.0V
Freq: 200 kHz max.
VDD: 3.0V to 6.0V
IDD: 32 µA max. at 32 kHz,
3.0V
IPD: 9 µA max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom-
mended that the user select the device type that ensures the specifications required.
PIC16C71X
DS30272A-page 136 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
15.1 DC Characteristics: PIC16C71-04 (Commercial, Industrial)
PIC16C71-20 (Commercial, Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
Param
No. Characteristic Sym Min Typ† Max Units Conditions
D001
D001A Supply Voltage VDD 4.0
4.5 -
-6.0
5.5 V
VXT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1) VDR - 1.5 - V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR - VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D013
Supply Current (Note 2) IDD -
-
1.8
13.5
3.3
30
mA
mA
XT, RC osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D020
D021
D021A
Power-down Current
(Note 3) IPD -
-
-
7
1.0
1.0
28
14
16
µA
µA
µA
VDD = 4.0V, WDT enabled, -40°C to +85°C
VDD = 4.0V, WDT disabled, -0°C to +70°C
VDD = 4.0V, WDT disabled, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating v oltage and frequency. Other f actors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
1997 Microchip Technology Inc. DS30272A-page 137
PIC16C71X
Applicable Devices 710 71 711 715
15.2 DC Characteristics: PIC16LC71-04 (Commercial, Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
OOperating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
Param
No. Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 3.0 - 6.0 V XT, RC, and LP osc configuration
D002* RAM Data Retention
Voltage (Note 1) VDR - 1.5 - V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR - VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D010A
Supply Current (Note 2) IDD -
-
1.4
15
2.5
32
mA
µA
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D020
D021
D021A
Power-down Current
(Note 3) IPD -
-
-
5
0.6
0.6
20
9
12
µA
µA
µA
VDD = 3.0V, WDT enabled, -40°C to +85°C
VDD = 3.0V, WDT disabled, 0°C to +70°C
VDD = 3.0V, WDT disabled, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
PIC16C71X
DS30272A-page 138 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
15.3 DC Characteristics: PIC16C71-04 (Commercial, Industrial)
PIC16C71-20 (Commercial, Industrial)
PIC16LC71-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
OOperating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
Operating voltage VDD range as described in DC spec Section 15.1
and Section 15.2.
Param
No. Characteristic Sym Min Typ
†Max Units Conditions
Input Low Voltage
I/O ports VIL
D030 with TTL buffer VSS - 0.15V V For entire VDD range
D031 with Schmitt Trigger buffer VSS - 0.8V V 4.5 ≤ VDD ≤ 5.5V
D032 MCLR, OSC1 (in RC mode) VSS - 0.2VDD V
D033 OSC1 (in XT, HS and LP) VSS - 0.3VDD V Note1
Input High Voltage
I/O ports (Note 4) VIH -
D040 with TTL buffer 2.0 - VDD V 4.5 ≤ VDD ≤ 5.5V
D040A 0.25VDD
+ 0.8V - VDD For entire VDD range
D041 with Schmitt Trigger buffer 0.85VDD - VDD For entire VDD range
D042 MCLR, RB0/INT 0.85VDD - VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD - VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD - VDD V
D070 PORTB weak pull-up current IPURB 50 250 †400 µA VDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL - - ±1µA Vss ≤ VPIN ≤ VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - ±5µA Vss ≤ VPIN ≤ VDD
D063 OSC1 - - ±5µA Vss ≤ VPIN ≤ VDD, XT, HS and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL - - 0.6 V IOL = 8.5mA, VDD = 4.5V,
-40°C to +85°C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6mA, VDD = 4.5V,
-40°C to +85°C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD - 0.7 - - V IOH = -3.0mA, VDD = 4.5V,
-40°C to +85°C
D092 OSC2/CLKOUT (RC osc config) VDD - 0.7 - - V IOH = -1.3mA, VDD = 4.5V,
-40°C to +85°C
D130* Open-Drain High Voltage VOD - - 14 V RA4 pin
†Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt trigger input. It is not recommended that the
PIC16C71 be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied v oltage le v el. The specified le v els
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
4: PIC16C71 Rev. "Ax" INT pin has a TTL input buffer. PIC16C71 Rev. "Bx" INT pin has a Schmitt Trigger input
buffer.
1997 Microchip Technology Inc. DS30272A-page 139
PIC16C71X
Applicable Devices 710 71 711 715
Capacitive Loading Specs on
Output Pins
D100 OSC2 pin COSC2 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO 50 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
OOperating temperature 0˚C ≤ TA ≤ +70˚C (commercial)
-40˚C ≤ TA ≤ +85˚C (industrial)
Operating voltage VDD range as described in DC spec Section 15.1
and Section 15.2.
Param
No. Characteristic Sym Min Typ
†Max Units Conditions
†Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt trigger input. It is not recommended that the
PIC16C71 be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied v oltage le v el. The specified le vels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
4: PIC16C71 Rev. "Ax" INT pin has a TTL input buffer. PIC16C71 Rev. "Bx" INT pin has a Schmitt Trigger input
buffer.
PIC16C71X
DS30272A-page 140 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
15.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 15-1: LOAD CONDITIONS
1. TppS2ppS
2. TppS
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
SF Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
VDD/2
CL
RL
Pin Pin
VSS VSS
CL
RL= 464Ω
CL= 50 pF for all pins except OSC2/CLKOUT
15 pF for OSC2 output
Load condition 1 Load condition 2
1997 Microchip Technology Inc. DS30272A-page 141
PIC16C71X
Applicable Devices 710 71 711 715
15.5 Timing Diagrams and Specifications
FIGURE 15-2: EXTERNAL CLOCK TIMING
TABLE 15-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1) DC — 4 MHz XT osc mode
DC — 4 MHz HS osc mode (-04)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1) DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
1 — 4 MHz HS osc mode
1 — 20 MHz HS osc mode
1 Tosc External CLKIN Period
(Note 1) 250 — — ns XT osc mode
250 — — ns HS osc mode (-04)
50 — — ns HS osc mode (-20)
5 — — µs LP osc mode
Oscillator Period
(Note 1) 250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 1,000 ns HS osc mode (-04)
50 — 1,000 ns HS osc mode (-20)
5 — — µs LP osc mode
2 TCY Instruction Cycle Time (Note 1) 1.0 TCY DC µs TCY = 4/Fosc
3 TosL,
TosH External Clock in (OSC1) High or
Low Time 50 — — ns XT oscillator
2.5 — — µs LP oscillator
10 — — ns HS oscillator
4 TosR,
TosF External Clock in (OSC1) Rise or
Fall Time 25 — — ns XT oscillator
50 — — ns LP oscillator
15 — — ns HS oscillator
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device e x ecuting code .
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. OSC2 is disconnected
(has no loading) for the PIC16C71.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C71X
DS30272A-page 142 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 15-3: CLKOUT AND I/O TIMING
TABLE 15-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1↑ to CLKOUT↓ — 15 30 ns Note 1
11* TosH2ckH OSC1↑ to CLKOUT↑ — 15 30 ns Note 1
12* TckR CLKOUT rise time — 5 15 ns Note 1
13* TckF CLKOUT fall time — 5 15 ns Note 1
14* TckL2ioV CLKOUT ↓ to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT ↑ 0.25TCY + 25 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT ↑ 0 — — ns Note 1
17* TosH2ioV OSC1↑ (Q1 cycle) to
Port out valid — — 80 - 100 ns
18* TosH2ioI OSC1↑ (Q2 cycle) to
Port input invalid (I/O in
hold time)
PIC16C71 100 — — ns
PIC16LC71 200 — — ns
19* TioV2osH Port input valid to OSC1↑ (I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16C71 — 10 25 ns
PIC16LC71 — — 60 ns
21* TioF Port output fall time PIC16C71 — 10 25 ns
PIC16LC71 — — 60 ns
22††* Tinp INT pin high or low time 20 — — ns
23††* Trbp RB7:RB4 change INT high or low time 20 — — ns
* These parameters are characterized but not tested.
†Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance
only and are not tested.
†† These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 15-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
old value new value
1997 Microchip Technology Inc. DS30272A-page 143
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
TABLE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER REQUIREMENTS
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 200 — — ns VDD = 5V, -40˚C to +85˚C
31 Twdt Watchdog Timer Time-out Period 7* 18 33* ms VDD = 5V, -40˚C to +85˚C
(No Prescaler)
32 Tost Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period
33 Tpwrt Power-up Timer Period 28* 72 132* ms VDD = 5V, -40˚C to +85˚C
34 TIOZ I/O High Impedance from MCLR
Low — — 100 ns
* These parameters are characterized but not tested.
†Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 15-1 for load conditions.
PIC16C71X
DS30272A-page 144 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 15-5: TIMER0 EXTERNAL CLOCK TIMINGS
TABLE 15-5: TIMER0 EXTERNAL CLOCK REQUIREMENTS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns N = prescale value
(2, 4,..., 256)
With Prescaler Greater of:
20 ns or TCY + 40
N
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 15-1 for load conditions.
41
42
40
RA4/T0CKI
TMR0
1997 Microchip Technology Inc. DS30272A-page 145
PIC16C71X
Applicable Devices 710 71 711 715
TABLE 15-6: A/D CONVERTER CHARACTERISTICS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
A01 NRResolution — — 8 bits bits VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A02 EABS Absolute error PIC16C71 — — < ±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
PIC16LC71 — — < ±2 LSb VREF = VDD = 3.0V (Note 3)
A03 EIL Integral linearity error PIC16C71 — — < ±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
PIC16LC71 — — < ±2 LSb VREF = VDD = 3.0V (Note 3)
A04 EDL Differential linearity error PIC16C71 — — < ±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
PIC16LC71 — — < ±2 LSb VREF = VDD = 3.0V (Note 3)
A05 EFS Full scale error PIC16C71 — — < ±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
PIC16LC71 — — < ±2 LSb VREF = VDD = 3.0V (Note 3)
A06 EOFF Offset error PIC16C71 — — < ±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
PIC16LC71 — — < ±2 LSb VREF = VDD = 3.0V (Note 3)
A10 — Monotonicity — guaranteed — — VSS ≤ VAIN ≤ VREF
A20 VREF Reference voltage 3.0V — VDD + 0.3 V
A25 VAIN Analog input voltage VSS - 0.3 — VREF V
A30 ZAIN Recommended impedance of analog
voltage source — — 10.0 kΩ
A40 IAD A/D conversion current (VDD) — 180 — µA Average current consump-
tion when A/D is on. (Note 1)
A50 IREF VREF input current (Note 2)
PIC16C71
10
—
—
—
1000
40
µA
µA
During VAIN acquisition.
Based on differential of
VHOLD to VAIN.
To charge CHOLD see
Section 7.1.
During A/D Conversion cycle
PIC16LC71
—
—
—
—
1
10
mA
µA
During VAIN acquisition.
Based on differential of
VHOLD to VAIN.
To charge CHOLD see
Section 7.1.
During A/D Conversion cycle
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes
any such leakage from the A/D module.
2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.
3: These specifications apply if VREF = 3.0V and if VDD ≥ 3.0V. VAIN must be between VSS and VREF.
PIC16C71X
DS30272A-page 146 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 15-6: A/D CONVERSION TIMING
TABLE 15-7: A/D CONVERSION REQUIREMENTS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
130 TAD A/D clock period PIC16C71 2.0 — — µs TOSC based, VREF ≥ 3.0V
PIC16LC71 2.0 — — µs TOSC based, VREF full range
PIC16C71 2.0 4.0 6.0 µs A/D RC Mode
PIC16LC71 3.0 6.0 9.0 µs A/D RC Mode
131 TCNV Conversion time
(not including S/H time) (Note 1) — 9.5 — TAD
132 TACQ Acquisition time Note 2
5*
20
—
—
—
µs
µs The minimum time is the ampli-
fier settling time. This may be
used if the "new" input voltage
has not changed by more than
1 LSb (i.e., 19.5 mV @ 5.12V)
from the last sampled voltage
(as stated on CHOLD).
134 TGO Q4 to A/D clock start — Tosc/2§ — — If the A/D clock source is
selected as RC, a time of T CY is
added before the A/D clock
starts. This allows the SLEEP
instruction to be executed.
135 TSWC Switching from convert → sample time 1.5§ — — TAD
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
§ These specifications ensured by design.
Note 1: ADRES register may be read on the following TCY cycle.
2: See Section 7.1 for min conditions.
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(TOSC/2) (1)
7 6 5 4 3 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 Tcy
1997 Microchip Technology Inc. DS30272A-page 147
PIC16C71X
Applicable Devices 710 71 711 715
16.0 DC AND AC
CHARACTERISTICS GRAPHS
AND TABLES FOR PIC16C71
The graphs and tables provided in this section are for
design guidance and are not tested or guaranteed. In
some graphs or tables the data presented are out-
side specified operating range (e .g. outside speci-
fied VDD range). This is for information only and
devices are guaranteed to operate properly only
within the specified range.
FIGURE 16-1: TYPICAL RC OSCILLATOR
FREQUENCY VS.
TEMPERATURE
Note: The data presented in this section is a sta-
tistical summar y of data collected on units
from diff erent lots ov er a period of time and
matrix samples. 'Typical' represents the
mean of the distribution while 'max' or 'min'
represents (mean + 3σ) and (mean - 3σ)
respectively where σ is standard deviation.
Frequency Normalized to 25°C
1.050
1.025
1.000
0.975
0.950
0.925
0.900
0.875
0.850
Fosc
Fosc (25°C)
T(°C)
Rext = 10k
Cext = 100 pF
VDD = 5.5V
VDD = 3.5V
0 10 20 30 40 50 60 70
FIGURE 16-2: TYPICAL RC OSCILLATOR
FREQUENCY VS. VDD
FIGURE 16-3: TYPICAL RC OSCILLATOR
FREQUENCY VS. VDD
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
Fosc (MHz)
R = 4.7k
R = 10k
R = 100k
Cext = 20 pF, T = 25°C
2.0
1.8
1.0
0.8
0.6
0.4
0.2
0.03.0 4.03.5 4.5 5.0 5.5 6.0
VDD (Volts)
Fosc (MHz)
R = 3.3k
R = 4.7k
R = 10k
Cext = 100 pF, T = 25°C
R = 100k
1.6
1.4
1.2
PIC16C71X
DS30272A-page 148 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 16-4: TYPICAL RC OSCILLATOR
FREQUENCY VS. VDD
FIGURE 16-5: TYPICAL IPD VS. VDD
WATCHDOG TIMER
DISABLED 25°C
03.0 VDD (Volts)
Fosc (MHz)
Cext = 300 pF, T = 25°C
R = 100k
3.5 4.0 4.5 5.0 5.5 6.0
.1
.2
.3
.4
.5
.6
.7
.8
R = 10k
R = 4.7k
R = 3.3k
0.03.0
VDD (Volts)
IPD (µA)
0.1
0.2
0.3
0.4
0.5
0.6
3.5 4.0 4.5 5.0 5.5 6.0
TABLE 16-1: RC OSCILLATOR
FREQUENCIES
The percentage variation indicated here is par t to par t
variation due to normal process distribution. The varia-
tion indicated is ±3 standard deviation from average
value for VDD = 5V.
FIGURE 16-6: TYPICAL IPD VS. VDD
WATCHDOG TIMER ENABLED
25°C
Cext Rext Average
FOSC @ 5V, 25°C
20 pF 4.7k
10k
100k
4.52 MHz
2.47 MHz
290.86 kHz
±17.35%
±10.10%
±11.90%
100 pF 3.3k
4.7k
10k
100k
1.92 MHz
1.49 MHz
788.77 kHz
88.11 kHz
±9.43%
±9.83%
±10.92%
±16.03%
300 pF 3.3k
4.7k
10k
100k
726.89 kHz
573.95 kHz
307.31 kHz
33.82 kHz
±10.97%
±10.14%
±10.43%
±11.24%
VDD (Volts)
IPD (µA)
03.0 3.5 4.0 4.5 5.0 5.5 6.0
2
4
6
8
10
12
14
Data based on matrix samples. See first page of this section for details.
1997 Microchip Technology Inc. DS30272A-page 149
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 16-7: MAXIMUM IPD VS. VDD
WATCHDOG DISABLED
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
0°C
-55°C
-40°C
70°C
85°C
125°C
IPD (µA)
25
20
15
10
5
0
FIGURE 16-8: MAXIMUM IPD VS. VDD
WATCHDOG ENABLED
IPD, with Watchdog Timer enabled, has two components:
The leakage current which increases with higher tempera-
ture and the operating current of the Watchdog Timer logic
which increases with lower temper ature. At -40°C , the latter
dominates explaining the apparently anomalous behavior.
0°C
-55°C
-40°C
70°C
85°C
125°C
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
IPD (µA)
45
40
35
30
25
20
15
10
5
0
FIGURE 16-9: VTH (INPUT THRESHOLD VOLTAGE) OF I/O PINS VS. VDD
VDD (Volts)
0.80
1.00
1.20
1.40
1.60
1.80
2.00
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
25˚C, TYP
Min (-40˚C to 85˚C)
0.60
Max (-40˚C to 85˚C)
VTH (Volts)
Data based on matrix samples. See first page of this section for details.
PIC16C71X
DS30272A-page 150 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 16-10: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) VS. VDD
FIGURE 16-11: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP MODES)
VS. VDD
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.002.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
Note: These input pins have a Schmitt Trigger input buffer.
VIH, VIL (Volts)
VIH, Max (-40°C to 85°C)
VIH, Typ (25°C)
VIH, Min (-40°C to 85°C)
VIL, Max (-40°C to 85°C)
VIL, Typ (25°C)
VIL, Min (-40°C to 85°C)
3.60
3.40
3.20
3.00
2.80
2.60
2.40
2.20
2.00
1.80
1.60
1.40
1.20
1.003.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
VDD (Volts)
VTH (Volts)
Min (-40°C to 85°C)
Max (-40°C to 85°C)
Min (-40°C to 85°C)
TYP (25°C)
Data based on matrix samples. See first page of this section for details.
1997 Microchip Technology Inc. DS30272A-page 151
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 16-12: TYPICAL IDD VS. FREQ (EXT CLOCK, 25°C)
FIGURE 16-13: MAXIMUM, IDD VS. FREQ (EXT CLOCK, -40° TO +85°C)
1
10
100
1,000
10,000
10,000 100,000 1,000,000 10,000,000 100,000,000
IDD (µA)
Frequency (Hz)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
10
100
1,000
10,000
10,000 100,000 1,000,000 10,000,000 100,000,000
IDD (µA)
Frequency (Hz)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
Data based on matrix samples. See first page of this section for details.
PIC16C71X
DS30272A-page 152 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 16-14: MAXIMUM IDD VS. FREQ WITH A/D OFF (EXT CLOCK, -55° TO +125°C)
10
100
1,000
10,000
10,000 100,000 1,000,000 10,000,000 100,000,000
IDD (µA)
Frequency (Hz)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
FIGURE 16-15: WDT TIMER TIME-OUT
PERIOD VS. VDD
50
45
40
35
30
25
20
15
10
52 3 4 5 6 7
VDD (Volts)
WDT Period (ms)
Max, 85°C
Max, 70°C
Typ, 25°C
Min, 0°C
Min, -40°C
FIGURE 16-16: TRANSCONDUCTANCE (gm)
OF HS OSCILLATOR VS. VDD
Min, 85°C
Typ, 25°C
Max, -40°C
2 3 4 5 6 7
VDD (Volts)
gm (µA/V)
0
9000
8000
7000
6000
5000
4000
3000
2000
1000
Data based on matrix samples. See first page of this section for details.
1997 Microchip Technology Inc. DS30272A-page 153
PIC16C71X
Applicable Devices 710 71 711 715
FIGURE 16-17: TRANSCONDUCTANCE (gm)
OF LP OSCILLATOR VS. VDD
FIGURE 16-18: TRANSCONDUCTANCE (gm)
OF XT OSCILLATOR VS. VDD
Min, 85°C
Typ, 25°C
Max, -40°C
225
200
175
150
125
100
75
50
25
0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
gm (µA/V)
Min, 85°C
Typ, 25°C
Max, -40°C
23 4 5 6 7
VDD (Volts)
2500
2000
1500
1000
500
0
gm (µA/V)
FIGURE 16-19: IOH VS. VOH, VDD = 3V
FIGURE 16-20: IOH VS. VOH, VDD = 5V
Min, 85°C
Typ, 25°C
Max, -40°C
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOH (Volts)
IOH (mA)
0
-5
-10
-15
-20
-25
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-500.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOH (Volts)
IOH (mA)
Min @ 85°C
Typ @ 25°C
Max @ -40°C
Data based on matrix samples. See first page of this section for details.
PIC16C71X
DS30272A-page 154 1997 Microchip Technology Inc.
Applicable Devices 710 71 711 715
FIGURE 16-21: IOL VS. VOL, VDD = 3V
35
30
25
20
15
10
5
00.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)
IOL (mA)
Max @ -40°C
Typ @ 25°C
Min @ +85°C
FIGURE 16-22: IOL VS. VOL, VDD = 5V
Max @ -40°C
80
90
70
60
50
40
30
20
10
0
VOL (Volts)
IOL (mA)
Min @ +85°C
Typ @ 25°C
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Data based on matrix samples. See first page of this section for details.
1997 Microchip Technology Inc. DS30272A-page 155
PIC16C71X
17.0 PACKAGING INFORMATION
17.1 18-Lead Ceramic CERDIP Dual In-line with Window (300 mil) (JW)
Package Group: Ceramic CERDIP Dual In-Line (CDP)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
α0°10°0°10°
A — 5.080 — 0.200
A1 0.381 1.7780 0.015 0.070
A2 3.810 4.699 0.150 0.185
A3 3.810 4.445 0.150 0.175
B 0.355 0.585 0.014 0.023
B1 1.270 1.651 Typical 0.050 0.065 Typical
C 0.203 0.381 Typical 0.008 0.015 Typical
D 22.352 23.622 0.880 0.930
D1 20.320 20.320 Reference 0.800 0.800 Reference
E 7.620 8.382 0.300 0.330
E1 5.588 7.874 0.220 0.310
e1 2.540 2.540 Reference 0.100 0.100 Reference
eA 7.366 8.128 Typical 0.290 0.320 Typical
eB 7.620 10.160 0.300 0.400
L 3.175 3.810 0.125 0.150
N 18 18 18 18
S 0.508 1.397 0.020 0.055
S1 0.381 1.270 0.015 0.050
N
Pin No. 1
Indicator
Area
E1 E
SD
B1
BD1
Base
Plane
Seating
Plane
S1
A1 A3 A
L
αC
eA
eB
e1 A2
PIC16C71X
DS30272A-page 156 1997 Microchip Technology Inc.
17.2 18-Lead Plastic Dual In-line (300 mil) (P)
Package Group: Plastic Dual In-Line (PLA)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
α0°10°0°10°
A – 4.064 – 0.160
A1 0.381 – 0.015 –
A2 3.048 3.810 0.120 0.150
B 0.355 0.559 0.014 0.022
B1 1.524 1.524 Reference 0.060 0.060 Reference
C 0.203 0.381 Typical 0.008 0.015 Typical
D 22.479 23.495 0.885 0.925
D1 20.320 20.320 Reference 0.800 0.800 Reference
E 7.620 8.255 0.300 0.325
E1 6.096 7.112 0.240 0.280
e1 2.489 2.591 Typical 0.098 0.102 Typical
eA 7.620 7.620 Reference 0.300 0.300 Reference
eB 7.874 9.906 0.310 0.390
L 3.048 3.556 0.120 0.140
N 18 18 18 18
S 0.889 – 0.035 –
S1 0.127 – 0.005 –
N
Pin No. 1
Indicator
Area
E1 E
SD
B1
BD1
Base
Plane
Seating
Plane
S1
A1 A2 A
L
e1
αC
eA
eB
1997 Microchip Technology Inc. DS30272A-page 157
PIC16C71X
17.3 18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body)(SO)
Package Group: Plastic SOIC (SO)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
α0°8°0°8°
A 2.362 2.642 0.093 0.104
A1 0.101 0.300 0.004 0.012
B 0.355 0.483 0.014 0.019
C 0.241 0.318 0.009 0.013
D 11.353 11.735 0.447 0.462
E 7.416 7.595 0.292 0.299
e 1.270 1.270 Reference 0.050 0.050 Reference
H 10.007 10.643 0.394 0.419
h 0.381 0.762 0.015 0.030
L 0.406 1.143 0.016 0.045
N 18 18 18 18
CP – 0.102 – 0.004
Be
N
Index
Area
Chamfer
h x 45°
α
EH
123
CP
h x 45°
C
L
Seating
Plane
Base
Plane
D
A1 A
PIC16C71X
DS30272A-page 158 1997 Microchip Technology Inc.
17.4 20-Lead Plastic Surface Mount (SSOP - 209 mil Body 5.30 mm) (SS)
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
side. D1 and E1 dimensions including mold mismatch.
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
(0.003”)max.
3: This outline conforms to JEDEC MS-026.
Package Group: Plastic SSOP
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
α0°8°0°8°
A 1.730 1.990 0.068 0.078
A1 0.050 0.210 0.002 0.008
B 0.250 0.380 0.010 0.015
C 0.130 0.220 0.005 0.009
D 7.070 7.330 0.278 0.289
E 5.200 5.380 0.205 0.212
e 0.650 0.650 Reference 0.026 0.026 Reference
H 7.650 7.900 0.301 0.311
L 0.550 0.950 0.022 0.037
N 20 20 20 20
CP - 0.102 - 0.004
Index
area
N
H
1 2 3
E
eB
CP
D
A
A1
Base plane
Seating plane
L
C
α
1997 Microchip Technology Inc. DS30272A-page 159
PIC16C71X
17.5 Package Marking Information
Legend: MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
MMMMMMMMMMMMM
XXXXXXXXXXXXXXXX
AABBCDE
18-Lead PDIP
18-Lead SOIC
XXXXXXXXXXXX
AABBCDE
XXXXXXXXXXXX
MMMMMMMMMM
MMMMMM
XXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
PIC16C711-04/P
9452CBA
Example
Example
-20/50
9447CBA
PIC16C715
PIC16C71
/JW
945/CBT
Example
S = Tempe, Arizona, U.S.A.
AABBCAE
XXXXXXXX
XXXXXXXX
20-Lead SSOP
9517SBP
20I/SS025
PIC16C710
Example
PIC16C71X
DS30272A-page 160 1997 Microchip Technology Inc.
NOTES:
1997 Microchip Technology Inc. DS30272A-page 161
PIC16C71X
APPENDIX A:
The following are the list of modifications over the
PIC16C5X microcontroller family:
1. Instruction word length is increased to 14-bits.
This allows larger page sizes both in program
memory (1K now as opposed to 512 bef ore) and
register file (68 bytes now versus 32 bytes
before).
2. A PC high latch register (PCLATH) is added to
handle program memory paging. Bits PA2, PA1,
PA0 are removed from STATUS register.
3. Data memory paging is redefined slightly.
STATUS register is modified.
4. Four new instructions have been added:
RETURN, RETFIE, ADDLW, and SUBLW.
Two instructions TRIS and OPTION are being
phased out although they are kept for compati-
bility with PIC16C5X.
5. OPTION and TRIS registers are made address-
able.
6. Interrupt capability is added. Interrupt vector is
at 0004h.
7. Stack size is increased to 8 deep.
8. Reset vector is changed to 0000h.
9. Reset of all registers is revisited. Five different
reset (and wak e-up) types are recognized. Reg-
isters are reset differently.
10. Wake up from SLEEP through interrupt is
added.
11. Two separate timers, Oscillator Start-up Timer
(OST) and Power-up Timer (PWRT) are
included for more reliable power-up. These tim-
ers are invoked selectively to avoid unneces-
sary delays on power-up and wake-up.
12. PORTB has weak pull-ups and interrupt on
change feature.
13. T0CKI pin is also a port pin (RA4) now.
14. FSR is made a full eight bit register.
15. “In-circuit serial programming” is made possible .
The user can program PIC16CXX de vices using
only five pins: VDD, VSS, MCLR/VPP, RB6 (clock)
and RB7 (data in/out).
16. PCON status register is added with a Power-on
Reset status bit (POR).
17. Code protection scheme is enhanced such that
portions of the program memory can be pro-
tected, while the remainder is unprotected.
18. Brown-out protection circuitry has been added.
Controlled by configuration word bit BODEN.
Brown-out reset ensures the device is placed in
a reset condition if VDD dips below a fixed set-
point.
APPENDIX B: COMPATIBILITY
To convert code written for PIC16C5X to PIC16CXX,
the user should take the following steps:
1. Remove any program memory page select
operations (PA2, PA1, PA0 bits) for CALL, GOTO.
2. Revisit any computed jump operations (write to
PC or add to PC, etc.) to make sure page bits
are set properly under the new scheme.
3. Eliminate any data memory page switching.
Redefine data variables to reallocate them.
4. Verify all wr ites to STATUS, OPTION, and FSR
registers since these have changed.
5. Change reset vector to 0000h.
PIC16C71X
DS30272A-page 162 1997 Microchip Technology Inc.
APPENDIX C: WHAT’S NEW
1. Consolidated all pin compatible 18-pin A/D
based devices into one data sheet.
APPENDIX D: WHAT’S CHANGED
1. Minor changes, spelling and grammatical
changes.
2. Low voltage operation on the PIC16LC710/711/
715 has been reduced from 3.0V to 2.5V.
3. Part numbers of the PIC16C70 and PIC16C71A
have changed to PIC16C710 and PIC16C711,
respectively.
1997 Microchip Technology Inc. DS30390D-page 163
PIC16C71X
INDEX
A
A/D Accuracy/Error ...........................................................44
ADIF bit ......................................................................39
Analog Input Model Block Diagram ............................40
Analog-to-Digital Converter ........................................37
Configuring Analog Port Pins .....................................41
Configuring the Interrupt ............................................39
Configuring the Module ..............................................39
Connection Considerations ........................................44
Conversion Clock .......................................................41
Conversion Time ........................................................43
Conversions ...............................................................42
Converter Characteristics ..........................99, 122, 145
Delays ........................................................................40
Effects of a Reset .......................................................44
Equations ...................................................................40
Faster Conversion - Lower Resolution Trade-off .......43
Flowchart of A/D Operation ........................................45
GO/DONE bit .............................................................39
Internal Sampling Switch (Rss) Impedence ...............40
Minimum Charging Time ............................................40
Operation During Sleep .............................................44
Sampling Requirements .............................................40
Source Impedence .....................................................40
Time Delays ...............................................................40
Transfer Function .......................................................45
Absolute Maximum Ratings ...............................89, 111, 135
AC Characteristics
PIC16C710 ..............................................................101
PIC16C711 ..............................................................101
PIC16C715 ..............................................................125
ADCON0 Register ..............................................................37
ADCON1 ............................................................................37
ADCON1 Register ........................................................14, 37
ADCS0 bit ..........................................................................37
ADCS1 bit ..........................................................................37
ADIE bit ........................................................................19, 20
ADIF bit ........................................................................21, 37
ADON bit ............................................................................37
ADRES Register ....................................................15, 37, 39
ALU ......................................................................................7
Application Notes
AN546 ........................................................................37
AN552 ........................................................................27
AN556 ........................................................................23
AN607, Power-up Trouble Shooting ..........................53
Architecture
Harvard ........................................................................7
Overview ......................................................................7
von Neumann ...............................................................7
Assembler
MPASM Assembler ....................................................86
B
Block Diagrams
Analog Input Model ....................................................40
On-Chip Reset Circuit ................................................52
PIC16C71X ..................................................................8
RA3/RA0 Port Pins ....................................................25
RA4/T0CKI Pin ...........................................................25
RB3:RB0 Port Pins ....................................................27
RB7:RB4 Pins ............................................................28
RB7:RB4 Port Pins .....................................................28
Timer0 ........................................................................31
Timer0/WDT Prescaler ...............................................34
Watchdog Timer .........................................................65
BODEN bit ..........................................................................48
BOR bit ........................................................................ 22, 54
Brown-out Reset (BOR) ......................................................53
C
C bit ....................................................................................17
C16C71 ..............................................................................47
Carry bit ................................................................................7
CHS0 bit .............................................................................37
CHS1 bit .............................................................................37
Clocking Scheme ................................................................10
Code Examples
Call of a Subroutine in Page 1 from Page 0 ...............24
Changing Prescaler (Timer0 to WDT) ........................35
Changing Prescaler (WDT to Timer0) ........................35
Doing an A/D Conversion ...........................................42
I/O Programming ........................................................30
Indirect Addressing .....................................................24
Initializing PORTA ......................................................25
Initializing PORTB ......................................................27
Saving STATUS and W Registers in RAM .................64
Code Protection ........................................................... 47, 67
Computed GOTO ...............................................................23
Configuration Bits ...............................................................47
CP0 bit ......................................................................... 47, 48
CP1 bit ................................................................................48
D
DC bit ..................................................................................17
DC Characteristics ........................................................... 147
PIC16C71 ................................................................ 136
PIC16C710 ........................................................ 90, 101
PIC16C711 ........................................................ 90, 101
PIC16C715 ...................................................... 113, 125
Development Support .................................................... 3, 85
Development Tools .............................................................85
Diagrams - See Block Diagrams
Digit Carry bit ........................................................................7
Direct Addressing ...............................................................24
E
Electrical Characteristics
PIC16C71 ................................................................ 135
PIC16C710 .................................................................89
PIC16C711 .................................................................89
PIC16C715 .............................................................. 111
External Brown-out Protection Circuit .................................60
External Power-on Reset Circuit ........................................60
F
Family of Devices
PIC16C71X ...................................................................4
FOSC0 bit .................................................................... 47, 48
FOSC1 bit .................................................................... 47, 48
FSR Register ......................................................... 15, 16, 24
Fuzzy Logic Dev. System (
fuzzy
TECH-MP) .....................87
G
General Description ..............................................................3
GIE bit .......................................................................... 19, 61
GO/DONE bit ......................................................................37
PIC16C71X
DS30390D-page 164 1997 Microchip Technology Inc.
I
I/O Ports
PORTA .......................................................................25
PORTB .......................................................................27
Section .......................................................................25
I/O Programming Considerations .......................................30
ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ...........85
In-Circuit Serial Programming ......................................47, 67
INDF Register ........................................................14, 16, 24
Indirect Addressing ............................................................24
Instruction Cycle .................................................................10
Instruction Flow/Pipelining .................................................10
Instruction Format ..............................................................69
Instruction Set
ADDLW ......................................................................71
ADDWF ......................................................................71
ANDLW ......................................................................71
ANDWF ......................................................................71
BCF ............................................................................72
BSF ............................................................................72
BTFSC .......................................................................72
BTFSS .......................................................................73
CALL ..........................................................................73
CLRF ..........................................................................74
CLRW ........................................................................74
CLRWDT ....................................................................74
COMF ........................................................................75
DECF .........................................................................75
DECFSZ .....................................................................75
GOTO ........................................................................76
INCF ...........................................................................76
INCFSZ ......................................................................77
IORLW .......................................................................77
IORWF .......................................................................78
MOVF .........................................................................78
MOVLW .....................................................................78
MOVWF .....................................................................78
NOP ...........................................................................79
OPTION .....................................................................79
RETFIE ......................................................................79
RETLW ......................................................................80
RETURN ....................................................................80
RLF ............................................................................81
RRF ............................................................................81
SLEEP .......................................................................82
SUBLW ......................................................................82
SUBWF ......................................................................83
SWAPF ......................................................................83
TRIS ...........................................................................83
XORLW ......................................................................84
XORWF ......................................................................84
Section .......................................................................69
Summary Table ..........................................................70
INT Interrupt .......................................................................63
INTCON Register ...............................................................19
INTE bit ..............................................................................19
INTEDG bit ...................................................................18, 63
Internal Sampling Switch (Rss) Impedence .......................40
Interrupts ............................................................................47
A/D .............................................................................61
External ......................................................................61
PORTB Change .........................................................61
PortB Change ............................................................63
RB7:RB4 Port Change ...............................................27
Section .......................................................................61
TMR0 .........................................................................63
TMR0 Overflow .......................................................... 61
INTF bit .............................................................................. 19
IRP bit ................................................................................ 17
K
KeeLoq Evaluation and Programming Tools ................... 87
L
Loading of PC .................................................................... 23
LP ...................................................................................... 54
M
MCLR ........................................................................... 52, 56
Memory
Data Memory ............................................................. 12
Program Memory ....................................................... 11
Register File Maps
PIC16C71 .......................................................... 12
PIC16C710 ........................................................ 12
PIC16C711 ........................................................ 13
PIC16C715 ........................................................ 13
MP-DriveWay - Application Code Generator .................. 87
MPEEN bit ................................................................... 22, 48
MPLAB C ........................................................................ 87
MPLAB Integrated Development Environment
Software ............................................................................. 86
O
OPCODE ........................................................................... 69
OPTION Register ............................................................... 18
Orthogonal ........................................................................... 7
OSC selection .................................................................... 47
Oscillator
HS ........................................................................ 49, 54
LP ........................................................................ 49, 54
RC ............................................................................. 49
XT ........................................................................ 49, 54
Oscillator Configurations .................................................... 49
Oscillator Start-up Timer (OST) ......................................... 53
P
Packaging
18-Lead CERDIP w/Window ................................... 155
18-Lead PDIP .......................................................... 156
18-Lead SOIC .......................................................... 157
20-Lead SSOP ........................................................ 158
Paging, Program Memory .................................................. 23
PCL Register ................................................... 14, 15, 16, 23
PCLATH ....................................................................... 57, 58
PCLATH Register ............................................ 14, 15, 16, 23
PCON Register ............................................................ 22, 54
PD bit ..................................................................... 17, 52, 55
PER bit ............................................................................... 22
PIC16C71 ........................................................................ 147
AC Characteristics ................................................... 147
PICDEM-1 Low-Cost PIC16/17 Demo Board .................... 86
PICDEM-2 Low-Cost PIC16CXX Demo Board .................. 86
PICDEM-3 Low-Cost PIC16CXXX Demo Board ............... 86
PICMASTER In-Circuit Emulator ..................................... 85
PICSTART Plus Entry Level Development System ......... 85
PIE1 Register ..................................................................... 20
Pin Functions
MCLR/VPP ................................................................... 9
OSC1/CLKIN ............................................................... 9
OSC2/CLKOUT ........................................................... 9
RA0/AN0 ...................................................................... 9
RA1/AN1 ...................................................................... 9
1997 Microchip Technology Inc. DS30390D-page 165
PIC16C71X
RA2/AN2 ......................................................................9
RA3/AN3/VREF .............................................................9
RA4/T0CKI ...................................................................9
RB0/INT .......................................................................9
RB1 ..............................................................................9
RB2 ..............................................................................9
RB3 ..............................................................................9
RB4 ..............................................................................9
RB5 ..............................................................................9
RB6 ..............................................................................9
RB7 ..............................................................................9
VDD ..............................................................................9
VSS ...............................................................................9
Pinout Descriptions
PIC16C71 ....................................................................9
PIC16C710 ..................................................................9
PIC16C711 ..................................................................9
PIC16C715 ..................................................................9
PIR1 Register .....................................................................21
POP ...................................................................................23
POR .............................................................................53, 54
Oscillator Start-up Timer (OST) ...........................47, 53
Power Control Register (PCON) ................................54
Power-on Reset (POR) ............................47, 53, 57, 58
Power-up Timer (PWRT) .....................................47, 53
Time-out Sequence ....................................................54
Time-out Sequence on Power-up ..............................59
TO ........................................................................52, 55
POR bit ........................................................................22, 54
Port RB Interrupt ................................................................63
PORTA .........................................................................57, 58
PORTA Register ....................................................14, 15, 25
PORTB .........................................................................57, 58
PORTB Register ....................................................14, 15, 27
Power-down Mode (SLEEP) ..............................................66
Prescaler, Switching Between Timer0 and WDT ...............35
PRO MATE II Universal Programmer ..............................85
Program Branches ...............................................................7
Program Memory
Paging ........................................................................23
Program Memory Maps
PIC16C71 ..................................................................11
PIC16C710 ................................................................11
PIC16C711 ................................................................11
PIC16C715 ................................................................11
Program Verification ..........................................................67
PS0 bit ...............................................................................18
PS1 bit ...............................................................................18
PS2 bit ...............................................................................18
PSA bit ...............................................................................18
PUSH .................................................................................23
PWRT
Power-up Timer (PWRT) ...........................................53
PWRTE bit ...................................................................47, 48
R
RBIE bit ..............................................................................19
RBIF bit ..................................................................19, 27, 63
RBPU bit ............................................................................18
RC ......................................................................................54
RC Oscillator ................................................................51, 54
Read-Modify-Write .............................................................30
Register File .......................................................................12
Registers
MapsPIC16C71 ..........................................................12
PIC16C710 ........................................................12
PIC16C711 .........................................................13
PIC16C715 .........................................................13
Reset Conditions ........................................................56
Summary ............................................................. 14–??
Reset ........................................................................... 47, 52
Reset Conditions for Special Registers ..............................56
RP0 bit ......................................................................... 12, 17
RP1 bit ................................................................................17
S
SEEVAL Evaluation and Programming System ...............87
Services
One-Time-Programmable (OTP) Devices ....................5
Quick-Turnaround-Production (QTP) Devices ..............5
Serialized Quick-Turnaround Production (SQTP)
Devices .........................................................................5
SLEEP ......................................................................... 47, 52
Software Simulator (MPLAB SIM) ...................................87
Special Features of the CPU ..............................................47
Special Function Registers
PIC16C71 ...................................................................14
PIC16C710 .................................................................14
PIC16C711 .................................................................14
Special Function Registers, Section ...................................14
Stack ...................................................................................23
Overflows ....................................................................23
Underflow ...................................................................23
STATUS Register ...............................................................17
T
T0CS bit ..............................................................................18
T0IE bit ...............................................................................19
T0IF bit ...............................................................................19
TAD .....................................................................................41
Timer0
RTCC ................................................................... 57, 58
Timers
Timer0
Block Diagram ....................................................31
External Clock ....................................................33
External Clock Timing ........................................33
Increment Delay .................................................33
Interrupt ..............................................................31
Interrupt Timing ..................................................32
Prescaler ............................................................34
Prescaler Block Diagram ....................................34
Section ...............................................................31
Switching Prescaler Assignment ........................35
Synchronization ..................................................33
T0CKI .................................................................33
T0IF ....................................................................63
Timing .................................................................31
TMR0 Interrupt ...................................................63
Timing Diagrams
A/D Conversion ....................................... 100, 124, 146
Brown-out Reset .................................................. 53, 97
CLKOUT and I/O ....................................... 96, 119, 142
External Clock Timing ................................ 95, 118, 141
Power-up Timer ................................................. 97, 143
Reset ................................................................. 97, 143
Start-up Timer .................................................... 97, 143
Time-out Sequence ....................................................59
Timer0 ................................................. 31, 98, 121, 144
Timer0 Interrupt Timing ..............................................32
Timer0 with External Clock .........................................33
Wake-up from SLEEP through Interrupt .....................67
Watchdog Timer ................................................ 97, 143
PIC16C71X
DS30390D-page 166 1997 Microchip Technology Inc.
TO bit .................................................................................17
TOSE bit .............................................................................18
TRISA Register ......................................................14, 16, 25
TRISB Register ......................................................14, 16, 27
Two’s Complement ..............................................................7
U
Upward Compatibility ...........................................................3
UV Erasable Devices ...........................................................5
W
W Register
ALU ..............................................................................7
Wake-up from SLEEP ........................................................66
Watchdog Timer (WDT) ...................................47, 52, 56, 65
WDT ...................................................................................56
Block Diagram ............................................................65
Programming Considerations ....................................65
Timeout ................................................................57, 58
WDT Period ........................................................................65
WDTE bit ......................................................................47, 48
Z
Z bit ....................................................................................17
Zero bit .................................................................................7
LIST OF EXAMPLES
Example 3-1: Instruction Pipeline Flow........................... 10
Example 4-1: Call of a Subroutine in Page 1 from
Page 0 ...................................................... 24
Example 4-2: Indirect Addressing................................... 24
Example 5-1: Initializing PORTA..................................... 25
Example 5-2: Initializing PORTB..................................... 27
Example 5-3: Read-Modify-Write Instructions
on an I/O Port ........................................... 30
Example 6-1: Changing Prescaler (Timer0→WDT)........ 35
Example 6-2: Changing Prescaler (WDT→Timer0)........ 35
Equation 7-1: A/D Minimum Charging Time.................... 40
Example 7-1: Calculating the Minimum Required
Aquisition Time ......................................... 40
Example 7-2: A/D Conversion......................................... 42
Example 7-3: 4-bit vs. 8-bit Conversion Times ............... 43
Example 8-1: Saving STATUS and W Registers
in RAM...................................................... 64
LIST OF FIGURES
Figure 3-1: PIC16C71X Block Diagram ........................ 8
Figure 3-2: Clock/Instruction Cycle ............................. 10
Figure 4-1: PIC16C710 Program Memory Map
and Stack.................................................. 11
Figure 4-2: PIC16C71/711 Program Memory Map
and Stack.................................................. 11
Figure 4-3: PIC16C715 Program Memory Map
and Stack.................................................. 11
Figure 4-4: PIC16C710/71 Register File Map............. 12
Figure 4-5: PIC16C711 Register File Map.................. 13
Figure 4-6: PIC16C715 Register File Map.................. 13
Figure 4-7: Status Register (Address 03h, 83h).......... 17
Figure 4-8: OPTION Register (Address 81h, 181h).... 18
Figure 4-9: INTCON Register (Address 0Bh, 8Bh) ..... 19
Figure 4-10: PIE1 Register (Address 8Ch) ................... 20
Figure 4-11: PIR1 Register (Address 0Ch)................... 21
Figure 4-12: PCON Register (Address 8Eh),
PIC16C710/711........................................ 22
Figure 4-13: PCON Register (Address 8Eh),
PIC16C715............................................... 22
Figure 4-14: Loading of PC In Different Situations........ 23
Figure 4-15: Direct/Indirect Addressing......................... 24
Figure 5-1: Block Diagram of RA3:RA0 Pins .............. 25
Figure 5-2: Block Diagram of RA4/T0CKI Pin............. 25
Figure 5-3: Block Diagram of RB3:RB0 Pins .............. 27
Figure 5-4: Block Diagram of RB7:RB4 Pins
(PIC16C71)............................................... 28
Figure 5-5: Block Diagram of RB7:RB4 Pins
(PIC16C710/711/715)............................... 28
Figure 5-6: Successive I/O Operation......................... 30
Figure 6-1: Timer0 Block Diagram .............................. 31
Figure 6-2: Timer0 Timing: Internal Clock/
No Prescale .............................................. 31
Figure 6-3: Timer0 Timing: Internal Clock/
Prescale 1:2.............................................. 32
Figure 6-4: Timer0 Interrupt Timing ............................ 32
Figure 6-5: Timer0 Timing with External Clock ........... 33
Figure 6-6: Block Diagram of the Timer0/
WDT Prescaler ......................................... 34
Figure 7-1: ADCON0 Register (Address 08h),
PIC16C710/71/711................................... 37
Figure 7-2: ADCON0 Register (Address 1Fh),
PIC16C715............................................... 38
1997 Microchip Technology Inc. DS30390D-page 167
PIC16C71X
Figure 7-3: ADCON1 Register, PIC16C710/71/711
(Address 88h),
PIC16C715 (Address 9Fh)........................38
Figure 7-4: A/D Block Diagram....................................39
Figure 7-5: Analog Input Model...................................40
Figure 7-6: A/D Transfer Function...............................45
Figure 7-7: Flowchart of A/D Operation.......................45
Figure 8-1: Configuration Word for PIC16C71 ............47
Figure 8-2: Configuration Word, PIC16C710/711........48
Figure 8-3: Configuration Word, PIC16C715...............48
Figure 8-4: Crystal/Ceramic Resonator Operation
(HS, XT or LP OSC Configuration) ...........49
Figure 8-5: External Clock Input Operation
(HS, XT or LP OSC Configuration) ...........49
Figure 8-6: External Parallel Resonant Crystal
Oscillator Circuit........................................51
Figure 8-7: External Series Resonant Crystal
Oscillator Circuit........................................51
Figure 8-8: RC Oscillator Mode...................................51
Figure 8-9: Simplified Block Diagram of On-chip
Reset Circuit..............................................52
Figure 8-10: Brown-out Situations.................................53
Figure 8-11: Time-out Sequence on Power-up
(MCLR not Tied to VDD): Case 1...............59
Figure 8-12: Time-out Sequence on Power-up
(MCLR Not Tied To VDD): Case 2.............59
Figure 8-13: Time-out Sequence on Power-up
(MCLR Tied to VDD)..................................59
Figure 8-14: External Power-on Reset Circuit
(for Slow VDD Power-up)...........................60
Figure 8-15: External Brown-out Protection Circuit 1....60
Figure 8-16: External Brown-out Protection Circuit 2....60
Figure 8-17: Interrupt Logic, PIC16C710, 71, 711.........62
Figure 8-18: Interrupt Logic, PIC16C715.......................62
Figure 8-19: INT Pin Interrupt Timing............................63
Figure 8-20: Watchdog Timer Block Diagram ...............65
Figure 8-21: Summary of Watchdog Timer Registers...65
Figure 8-22: Wake-up from Sleep Through Interrupt.....67
Figure 8-23: Typical In-Circuit Serial Programming
Connection................................................67
Figure 9-1: General Format for Instructions ................69
Figure 11-1: Load Conditions........................................94
Figure 11-2: External Clock Timing...............................95
Figure 11-3: CLKOUT and I/O Timing...........................96
Figure 11-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing .......................................................97
Figure 11-5: Brown-out Reset Timing............................97
Figure 11-6: Timer0 External Clock Timings.................98
Figure 11-7: A/D Conversion Timing...........................100
Figure 12-1: Typical IPD vs. VDD
(WDT Disabled, RC Mode) .....................101
Figure 12-2: Maximum IPD vs. VDD
(WDT Disabled, RC Mode) .....................101
Figure 12-3: Typical IPD vs. VDD @ 25°C
(WDT Enabled, RC Mode)......................102
Figure 12-4: Maximum IPD vs. VDD
(WDT Enabled, RC Mode)......................102
Figure 12-5: Typical RC Oscillator Frequency
vs. VDD....................................................102
Figure 12-6: Typical RC Oscillator Frequency
vs. VDD....................................................102
Figure 12-7: Typical RC Oscillator Frequency
vs. VDD....................................................102
Figure 12-8: Typical IPD vs. VDD Brown-out Detect
Enabled (RC Mode) ................................103
Figure 12-9: Maximum IPD vs. VDD Brown-out Detect
Enabled (85°C to -40°C, RC Mode)........ 103
Figure 12-10: Typical IPD vs. Timer1 Enabled
(32 kHz, RC0/RC1 = 33 pF/33 pF,
RC Mode) ............................................... 103
Figure 12-11: Maximum IPD vs. Timer1 Enabled
(32 kHz, RC0/RC1 = 33 pF/33 pF,
85°C to -40°C, RC Mode)....................... 103
Figure 12-12: Typical IDD vs. Frequency
(RC Mode @ 22 pF, 25°C) ..................... 104
Figure 12-13: Maximum IDD vs. Frequency
(RC Mode @ 22 pF, -40°C to 85°C)....... 104
Figure 12-14: Typical IDD vs. Frequency
(RC Mode @ 100 pF, 25°C) ................... 105
Figure 12-15: Maximum IDD vs. Frequency
(RC Mode @ 100 pF, -40°C to 85°C)..... 105
Figure 12-16: Typical IDD vs. Frequency
(RC Mode @ 300 pF, 25°C) ................... 106
Figure 12-17: Maximum IDD vs. Frequency
(RC Mode @ 300 pF, -40°C to 85°C)..... 106
Figure 12-18: Typical IDD vs. Capacitance
@ 500 kHz (RC Mode) ........................... 107
Figure 12-19: Transconductance(gm) of
HS Oscillator vs. VDD.............................. 107
Figure 12-20: Transconductance(gm) of
LP Oscillator vs. VDD .............................. 107
Figure 12-21: Transconductance(gm) of
XT Oscillator vs. VDD.............................. 107
Figure 12-22: Typical XTAL Startup Time vs.
VDD (LP Mode, 25°C) ............................. 108
Figure 12-23: Typical XTAL Startup Time vs.
VDD (HS Mode, 25°C)............................. 108
Figure 12-24: Typical XTAL Startup Time vs.
VDD (XT Mode, 25°C)............................. 108
Figure 12-25: Typical IDD vs. Frequency
(LP Mode, 25°C)..................................... 109
Figure 12-26: Maximum IDD vs. Frequency
(LP Mode, 85°C to -40°C)....................... 109
Figure 12-27: Typical IDD vs. Frequency
(XT Mode, 25°C)..................................... 109
Figure 12-28: Maximum IDD vs. Frequency
(XT Mode, -40°C to 85°C) ...................... 109
Figure 12-29: Typical IDD vs. Frequency
(HS Mode, 25°C) .................................... 110
Figure 12-30: Maximum IDD vs. Frequency
(HS Mode, -40°C to 85°C)...................... 110
Figure 13-1: Load Conditions...................................... 117
Figure 13-2: External Clock Timing............................. 118
Figure 13-3: CLKOUT and I/O Timing......................... 119
Figure 13-4: Reset, Watchdog Timer, Oscillator
Start-Up Timer, and Power-Up Timer
Timing..................................................... 120
Figure 13-5: Brown-out Reset Timing......................... 120
Figure 13-6: Timer0 Clock Timings............................. 121
Figure 13-7: A/D Conversion Timing........................... 124
Figure 14-1: Typical IPD vs. VDD
(WDT Disabled, RC Mode)..................... 125
Figure 14-2: Maximum IPD vs. VDD
(WDT Disabled, RC Mode)..................... 125
Figure 14-3: Typical IPD vs. VDD @ 25°C
(WDT Enabled, RC Mode)...................... 126
Figure 14-4: Maximum IPD vs. VDD
(WDT Enabled, RC Mode)...................... 126
Figure 14-5: Typical RC Oscillator Frequency vs.
VDD ......................................................... 126
PIC16C71X
DS30390D-page 168 1997 Microchip Technology Inc.
Figure 14-6: Typical RC Oscillator Frequency vs.
VDD..........................................................126
Figure 14-7: Typical RC Oscillator Frequency vs.
VDD..........................................................126
Figure 14-8: Typical IPD vs. VDD Brown-out Detect
Enabled (RC Mode) ................................127
Figure 14-9: Maximum IPD vs. VDD Brown-out Detect
Enabled
(85°C to -40°C, RC Mode) ......................127
Figure 14-10: Typical IPD vs. Timer1 Enabled (32 kHz,
RC0/RC1 = 33 pF/33 pF, RC Mode).......127
Figure 14-11: Maximum IPD vs. Timer1 Enabled
(32 kHz, RC0/RC1 = 33 pF/33 pF,
85°C to -40°C, RC Mode)........................127
Figure 14-12: Typical IDD vs. Frequency
(RC Mode @ 22 pF, 25°C)......................128
Figure 14-13: Maximum IDD vs. Frequency
(RC Mode @ 22 pF, -40°C to 85°C)........128
Figure 14-14: Typical IDD vs. Frequency
(RC Mode @ 100 pF, 25°C)....................129
Figure 14-15: Maximum IDD vs. Frequency
(RC Mode @ 100 pF, -40°C to 85°C)......129
Figure 14-16: Typical IDD vs. Frequency
(RC Mode @ 300 pF, 25°C)....................130
Figure 14-17: Maximum IDD vs. Frequency
(RC Mode @ 300 pF, -40°C to 85°C)......130
Figure 14-18: Typical IDD vs. Capacitance @ 500 kHz
(RC Mode)...............................................131
Figure 14-19: Transconductance(gm) of
HS Oscillator vs. VDD..............................131
Figure 14-20: Transconductance(gm) of
LP Oscillator vs. VDD...............................131
Figure 14-21: Transconductance(gm) of
XT Oscillator vs. VDD ..............................131
Figure 14-22: Typical XTAL Startup Time vs.
VDD (LP Mode, 25°C)..............................132
Figure 14-23: Typical XTAL Startup Time vs.
VDD (HS Mode, 25°C).............................132
Figure 14-24: Typical XTAL Startup Time vs.
VDD (XT Mode, 25°C)..............................132
Figure 14-25: Typical IDD vs. Frequency
(LP Mode, 25°C) .....................................133
Figure 14-26: Maximum IDD vs. Frequency
(LP Mode, 85°C to -40°C).......................133
Figure 14-27: Typical IDD vs. Frequency
(XT Mode, 25°C).....................................133
Figure 14-28: Maximum IDD vs. Frequency
(XT Mode, -40°C to 85°C).......................133
Figure 14-29: Typical IDD vs. Frequency
(HS Mode, 25°C).....................................134
Figure 14-30: Maximum IDD vs. Frequency
(HS Mode, -40°C to 85°C).......................134
Figure 15-1: Load Conditions......................................140
Figure 15-2: External Clock Timing.............................141
Figure 15-3: CLKOUT and I/O Timing.........................142
Figure 15-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing .....................................................143
Figure 15-5: Timer0 External Clock Timings...............144
Figure 15-6: A/D Conversion Timing...........................146
Figure 16-1: Typical RC Oscillator Frequency vs.
Temperature............................................147
Figure 16-2: Typical RC Oscillator Frequency vs.
VDD..........................................................147
Figure 16-3: Typical RC Oscillator Frequency vs.
VDD..........................................................147
Figure 16-4: Typical RC Oscillator Frequency vs.
VDD ......................................................... 148
Figure 16-5: Typical Ipd vs. VDD Watchdog Timer
Disabled 25°C......................................... 148
Figure 16-6: Typical Ipd vs. VDD Watchdog Timer
Enabled 25°C.......................................... 148
Figure 16-7: Maximum Ipd vs. VDD Watchdog
Disabled.................................................. 149
Figure 16-8: Maximum Ipd vs. VDD Watchdog
Enabled................................................... 149
Figure 16-9: Vth (Input Threshold Voltage) of
I/O Pins vs. VDD...................................... 149
Figure 16-10: VIH, VIL of MCLR, T0CKI and OSC1
(in RC Mode) vs. VDD ............................. 150
Figure 16-11: VTH (Input Threshold Voltage)
of OSC1 Input (in XT, HS, and
LP Modes) vs. VDD ................................. 150
Figure 16-12: Typical IDD vs. Freq (Ext Clock, 25°C).... 151
Figure 16-13: Maximum, IDD vs. Freq (Ext Clock,
-40° to +85°C)......................................... 151
Figure 16-14: Maximum IDD vs. Freq with A/D Off
(Ext Clock, -55° to +125°C) .................... 152
Figure 16-15: WDT Timer Time-out Period vs. VDD...... 152
Figure 16-16: Transconductance (gm) of
HS Oscillator vs. VDD.............................. 152
Figure 16-17: Transconductance (gm) of
LP Oscillator vs. VDD .............................. 153
Figure 16-18: Transconductance (gm) of
XT Oscillator vs. VDD.............................. 153
Figure 16-19: IOH vs. VOH, VDD = 3V.......................... 153
Figure 16-20: IOH vs. VOH, VDD = 5V.......................... 153
Figure 16-21: IOL vs. VOL, VDD = 3V........................... 154
Figure 16-22: IOL vs. VOL, VDD = 5V........................... 154
1997 Microchip Technology Inc. DS30390D-page 169
PIC16C71X
LIST OF TABLES
Table 1-1: PIC16C71X Family of Devices....................4
Table 3-1: PIC16C710/71/711/715 Pinout
Description..................................................9
Table 4-1: PIC16C710/71/711 Special Function
Register Summary ....................................14
Table 4-2: PIC16C715 Special Function Register
Summary...................................................15
Table 5-1: PORTA Functions.....................................26
Table 5-2: Summary of Registers Associated with
PORTA......................................................26
Table 5-3: PORTB Functions.....................................28
Table 5-4: Summary of Registers Associated with
PORTB......................................................29
Table 6-1: Registers Associated with Timer0.............35
Table 7-1: TAD vs. Device Operating Frequencies,
PIC16C71..................................................41
Table 7-2: TAD vs. Device Operating Frequencies,
PIC16C710/711, PIC16C715....................41
Table 7-3: Registers/Bits Associated with A/D,
PIC16C710/71/711....................................46
Table 7-4: Registers/Bits Associated with A/D,
PIC16C715................................................46
Table 8-1: Ceramic Resonators, PIC16C71...............49
Table 8-2: Capacitor Selection For Crystal
Oscillator, PIC16C71.................................49
Table 8-3: Ceramic Resonators,
PIC16C710/711/715..................................50
Table 8-4: Capacitor Selection for Crystal
Oscillator, PIC16C710/711/715.................50
Table 8-5: Time-out in Various Situations,
PIC16C71..................................................54
Table 8-6: Time-out in Various Situations,
PIC16C710/711/715..................................54
Table 8-7: Status Bits and Their Significance,
PIC16C71..................................................55
Table 8-8: Status Bits and Their Significance,
PIC16C710/711.........................................55
Table 8-9: Status Bits and Their Significance,
PIC16C715................................................55
Table 8-10: Reset Condition for Special Registers,
PIC16C710/71/711....................................56
Table 8-11: Reset Condition for Special Registers,
PIC16C715................................................56
Table 8-12: Initialization Conditions For All Registers,
PIC16C710/71/711....................................57
Table 8-13: Initialization Conditions for All Registers,
PIC16C715................................................58
Table 9-1: Opcode Field Descriptions........................69
Table 9-2: PIC16CXX Instruction Set.........................70
Table 10-1: Development Tools From Microchip .........88
Table 11-1: Cross Reference of Device Specs for
Oscillator Configurations and
Frequencies of Operation
(Commercial Devices)...............................89
Table 11-2: External Clock Timing Requirements........95
Table 11-3: CLKOUT and I/O Timing Requirements....96
Table 11-4: Reset, Watchdog Timer, Oscillator
Start-up Timer, Power-up Timer,
and Brown-out Reset Requirements.........97
Table 11-5: Timer0 External Clock Requirements .......98
Table 11-6: A/D Converter Characteristics:
PIC16C710/711-04
(Commercial, Industrial, Extended)
PIC16C710/711-10
(Commercial, Industrial, Extended)
PIC16C710/711-20
(Commercial, Industrial, Extended)
PIC16LC710/711-04
(Commercial, Industrial, Extended) ...........99
Table 11-7: A/D Conversion Requirements............... 100
Table 12-1: RC Oscillator Frequencies...................... 107
Table 12-2: Capacitor Selection for Crystal
Oscillators............................................... 108
Table 13-1: Cross Reference of Device Specs for
Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) ............................ 112
Table 13-2: Clock Timing Requirements.................... 118
Table 13-3: CLKOUT and I/O Timing Requirements. 119
Table 13-4: Reset, Watchdog Timer, Oscillator
Start-up Timer, Power-up Timer,
and Brown-out Reset Requirements....... 120
Table 13-5: Timer0 Clock Requirements................... 121
Table 13-6: A/D Converter Characteristics:
PIC16C715-04
(Commercial, Industrial, Extended)
PIC16C715-10
(Commercial, Industrial, Extended)
PIC16C715-20
(Commercial, Industrial, Extended) ........ 122
Table 13-7: A/D Converter Characteristics:
PIC16LC715-04 (Commercial,
Industrial)................................................ 123
Table 13-8: A/D Conversion Requirements............... 124
Table 14-1: RC Oscillator Frequencies...................... 131
Table 14-2: Capacitor Selection for Crystal
Oscillators............................................... 132
Table 15-1: Cross Reference of Device Specs
for Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) ............................ 135
Table 15-2: External Clock Timing Requirements ..... 141
Table 15-3: CLKOUT and I/O Timing Requirements. 142
Table 15-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Requirements ......................................... 143
Table 15-5: Timer0 External Clock Requirements..... 144
Table 15-6: A/D Converter Characteristics................ 145
Table 15-7: A/D Conversion Requirements............... 146
Table 16-1: RC Oscillator Frequencies...................... 148
PIC16C71X
DS30390D-page 170 1997 Microchip Technology Inc.
NOTES:
1997 Microchip Technology Inc. DS30272A-page 171
PIC16C71X
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PIC16C71X
DS30272A-page 172 1997 Microchip Technology Inc.
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DS30272A
PIC16C71X
1997 Microchip Technology Inc. DS30272A-page 173
PIC16C71X
PIC16C71X PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery refer to the factory or the listed sales office.
* JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of
each oscillator type (including LC devices).
PART NO. -XX X /XX XXX Pattern: QTP, SQTP, Code or Special Requirements
Package: JW = Windowed CERDIP
SO = SOIC
SP = Skinny plastic dip
P = PDIP
SS = SSOP
Temperature
Range: - = 0°C to +70°C
I = -40°C to +85°C
E = -40°C to +125°C
Frequency
Range: 04 = 200 kHz (PIC16C7X-04)
04 = 4 MHz
10 = 10 MHz
20 = 20 MHz
Device PIC16C7X :VDD range 4.0V to 6.0V
PIC16C7XT :VDD range 4.0V to 6.0V (Tape/Reel)
PIC16LC7X :VDD range 2.5V to 6.0V
PIC16LC7XT :VDD range 2.5V to 6.0V (Tape/Reel)
Examples
a) PIC16C71 - 04/P 301
Commercial Temp.,
PDIP Package, 4 MHz,
normal VDD limits, QTP
pattern #301
b)
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PIC16C71X
DS30272A-page 174 1997 Microchip Technology Inc.
NOTES:
1997 Microchip Technology Inc. DS30272A-page 175
PIC16C71X
NOTES:
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1999 Microchip Technology Inc.
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New York
Microchip Technology Inc.
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
AMERICAS (continued)
Toronto
Microchip Technology Inc.
5925 Airport Road, Suite 200
Mississauga, Ontario L4V 1W1, Canada
Tel: 905-405-6279 Fax: 905-405-6253
ASIA/PACIFIC
Hong Kong
Microchip Asia Pacific
Unit 2101, Tower 2
Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2-401-1200 Fax: 852-2-401-3431
Beijing
Microchip Technology, Beijing
Unit 915, 6 Chaoyangmen Bei Dajie
Dong Erhuan Road, Dongcheng District
New China Hong Kong Manhattan Building
Beijing 100027 PRC
Tel: 86-10-85282100 Fax: 86-10-85282104
India
Microchip Technology Inc.
India Liaison Office
No. 6, Legacy, Convent Road
Bangalore 560 025, India
Tel: 91-80-229-0061 Fax: 91-80-229-0062
Japan
Microchip Technology Intl. Inc.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa 222-0033 Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Shanghai
Microchip Technology
RM 406 Shanghai Golden Bridge Bldg.
2077 Yan’an Road West, Hong Qiao District
Shanghai, PRC 200335
Tel: 86-21-6275-5700 Fax: 86 21-6275-5060
ASIA/PACIFIC (continued)
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore 188980
Tel: 65-334-8870 Fax: 65-334-8850
Taiwan, R.O.C
Microchip Technology Taiwan
10F-1C 207
Tung Hua North Road
Tai p e i, Ta iw a n, RO C
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5858 Fax: 44-118 921-5835
Denmark
Microchip Technology Denmark ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Arizona Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH
Gustav-Heinemann-Ring 125
D-81739 München, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Arizona Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
11/15/99
WORLDWIDE SALES AND SERVICE
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999. The
Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip’s quality
system for the design and manufacture of
development systems is ISO 9001 certified.
