DATASHEET
BoardLevelCooling–Extruded5330
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
BOARDLEVELCOOLING–Extruded5330
Extruded5330isaseriesofdualradialboardlevelheatsinksdesignedtocool
TO‐220andTO‐220‐sin
le
au
edevices.Re
resentativeima
eonl
.
ORDERINGINFORMATION
PartNumberDeviceType
533002B02551GTO‐220,TO‐220‐singlegauge(0.020")
533101B02551GTO‐220,TO‐220‐singlegauge(0.020")
533102B02551GTO‐220,TO‐220‐singlegauge(0.020")
HEATSINKDETAILS
PropertyDetails
MaterialAluminum
FinishingBlackAnodize
DeviceAttachmentOptionsKoolClip51
ThermalInterfaceMaterialN/A
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
PartNumber“A”Dim“B”Dim“C”Dim“X”Dim“Y”Dim“Z”Dim
533002B02551G25.4018.2915.8812.70(0.500)0.79(0.031)2.67(0.105)
533101B02551G38.1021.5917.2012.70(0.500)0.79(0.031)2.67(0.105)
533102B02551G38.1018.2915.8812.70(0.500)0.79(0.031)2.67(0.105)
PropertyDetails
HeatSinkWidth(mm)34.92
HeatSinkHeight(mm)See“A”Dimbelow
HeatSinkLength(mm)12.70
HeatSinkMountingDirectionVertical