KIT ATION EVALU E L B AVAILA 19-4965; Rev 0; 9/09 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Features The MAX2032 high-linearity passive upconverter or downconverter mixer is designed to provide +33dBm IIP3, 7dB NF, and 7dB conversion loss for a 650MHz to 1000MHz RF frequency range to support a multitude of base-station applications. With a 650MHz to 1250MHz LO frequency range, this particular mixer is ideal for high-side LO injection architectures. For a pin-to-pincompatible mixer meant for low-side LO injection, refer to the MAX2029. 650MHz to 1000MHz RF Frequency Range 650MHz to 1250MHz LO Frequency Range 570MHz to 900MHz LO Frequency Range (Refer to the MAX2029 Data Sheet) DC to 250MHz IF Frequency Range 7dB Conversion Loss +33dBm Input IP3 +24dBm Input 1dB Compression Point 7dB Noise Figure Integrated LO Buffer Integrated RF and LO Baluns Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 49dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with the MAX2039/MAX2041 1700MHz to 2200MHz Mixers External Current-Setting Resistor Provides Option for Operating Mixer in Reduced-Power/ReducedPerformance Mode Predistortion Receivers Microwave and Fixed Broadband Wireless Access Wireless Local Loop Digital and SpreadSpectrum Communication Systems PIN-PACKAGE MAX2032ETP+ -40C to +85C 20 Thin QFN-EP* MAX2032ETP+T -40C to +85C 20 Thin QFN-EP* +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. *EP = Exposed pad. Pin Configuration/ Functional Diagram TOP VIEW + VCC 1 RF 2 TAP 3 GND 4 GND WCDMA/LTE and cdma2000 (R) Base Stations GSM 850/GSM 900 2G and 2.5G EDGE Base Stations Integrated Digital Enhanced Network (iDEN(R)) Base Stations WiMAXTM Base Stations and Customer Premise Equipment TEMP RANGE GND Applications PART IF- The MAX2032 is available in a compact 20-pin thin QFN package (5mm x 5mm) with an exposed pad. Electrical performance is guaranteed over the extended -40C to +85C temperature range. Ordering Information IF+ The MAX2032 is pin compatible with the MAX2039/ MAX2041 1700MHz to 2200MHz mixers, making this family of passive upconverters and downconverters ideal for applications where a common PCB layout is used for both frequency bands. GND In addition to offering excellent linearity and noise performance, the MAX2032 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, a dual-input LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for a single-ended RF input for downconversion (or RF output for upconversion) and single-ended LO inputs. The MAX2032 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 100mA. 20 19 18 17 16 MAX2032 15 LO2 14 VCC 13 GND 12 GND 11 LO1 EP 6 7 8 9 10 LOBIAS VCC LOSEL GND cdma2000 is a registered trademark of Telecommunications Industry Association. iDEN is a registered trademark of Motorola, Inc. WiMAX is a trademark of WiMAX Forum. 5 VCC GND ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX2032 General Description MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +5.5V RF (RF is DC shorted to GND through a balun)..................50mA LO1, LO2 to GND ..................................................-0.3V to +0.3V IF+, IF- to GND ...........................................-0.3V to (VCC + 0.3V) TAP to GND ...........................................................-0.3V to +1.4V LOSEL to GND ...........................................-0.3V to (VCC + 0.3V) LOBIAS to GND..........................................-0.3V to (VCC + 0.3V) RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm Continuous Power Dissipation (Note 2)....................................5W JA (Notes 3, 4)..............................................................+38C/W JC (Notes 2, 3)..............................................................+13C/W Operating Temperature Range (Note 5) .....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50 source. Note 2: Based on junction temperature TJ = TC + (JC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: Junction temperature TJ = TA + (JA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150C. Note 5: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = 4.75V to 5.25V, no RF signals applied, TC = -40C to +85C. IF+ and IF- are DC grounded through an IF balun. Typical values are at VCC = 5V, TC = +25C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC LOSEL Input Logic-Low VIL LOSEL Input Logic-High VIH CONDITIONS MIN TYP MAX UNITS 4.75 5.00 5.25 V 85 100 mA 0.8 V 2 V RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS Components tuned for the 700MHz band (Table 1), C1 = 7pF, C5 = 3.3pF (Notes 6, 7) RF Frequency fRF MIN TYP 650 MAX UNITS 850 MHz Components tuned for the 800MHz/900MHz cellular band (Table 1), C1 = 82pF, C5 = 2.0pF (Note 6) 800 1000 650 1250 MHz LO Frequency fLO (Notes 6, 7) IF Frequency fIF IF frequency range depends on external IF transformer selection 0 250 MHz (Note 6) -3 +3 dBm LO Drive Level 2 PLO _______________________________________________________________________________________ High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch (Typical Application Circuit, optimized for the 800MHz/900MHz cellular band (see Table 1), C1 = 82pF, C5 = 2pF, L1 and C4 not used, VCC = 4.75V to 5.25V, RF and LO ports driven from 50 sources, PLO = -3dBm to +3dBm, PRF = 0dBm, fRF = 815MHz to 1000MHz, fLO = 960MHz to 1180MHz, fIF = 160MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = 5V, PRF = 0dBm, PLO = 0dBm, fRF = 910MHz, fLO = 1070MHz, fIF = 160MHz, TC = +25C, unless otherwise noted.) (Note 8) PARAMETER Conversion Loss SYMBOL CONDITIONS MIN LC Flatness over any one of three frequency bands (fIF = 160MHz): fRF = 827MHz to 849MHz fRF = 869MHz to 894MHz fRF = 880MHz to 915MHz Conversion Loss Flatness TYP MAX UNITS 7.0 dB 0.18 dB TC = +25C to -40C -0.3 TC = +25C to +85C 0.2 P1dB (Note 9) 24 dBm Input Third-Order Intercept Point IIP3 fRF1 = 910MHz, fRF2 = 911MHz, PRF = 0dBm/tone, fLO = 1070MHz, PLO = 0dBm, TC = +25C (Note 10) 33 dBm Input IP3 Variation Over Temperature IIP3 2LO - 2RF Spurious Response at IF 2x2 3LO - 3RF Spurious Response at IF 3x3 Conversion Loss Variation Over Temperature Input 1dB Compression Point Noise Figure NF Noise Figure Under Blocking (Note 11) LO1-to-LO2 Isolation (Note 10) 29 TC = +25C to -40C 0.3 TC = +25C to +85C -0.3 dB dB 65 dBc 75 dBc Single sideband 7.0 dB PBLOCKER = +8dBm 18 PBLOCKER = +12dBm 22 LO2 selected, PLO = +3dBm, TC = +25C 42 51 LO1 selected, PLO = +3dBm, TC = +25C 42 49 dB dB Maximum LO Leakage at RF Port PLO = +3dBm -27 dBm Maximum LO Leakage at IF Port PLO = +3dBm -35 dBm LO Switching Time 50% of LOSEL to IF, settled within 2 degrees 50 ns Minimum RF-to-IF Isolation 45 dB RF Port Return Loss 17 dB LO Port Return Loss IF Port Return Loss LO1/LO2 port selected, LO2/LO1, RF, and IF terminated into 50 28 LO1/LO2 port unselected, LO2/LO1, RF, and IF terminated into 50 30 LO driven at 0dBm, RF terminated into 50 17 dB dB _______________________________________________________________________________________ 3 MAX2032 AC ELECTRICAL CHARACTERISTICS (800MHz/900MHz CELLULAR BAND DOWNCONVERTER OPERATION) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch AC ELECTRICAL CHARACTERISTICS (700MHz BAND DOWNCONVERTER OPERATION) (Typical Application Circuit, optimized for the 700MHz band (see Table 1), C1 = 7pF, C5 = 3.3pF, L1 and C4 are not used, VCC = 4.75V to 5.25V, RF and LO ports driven from 50 sources, PLO = -3dBm to +3dBm, PRF = 0dBm, fRF = 650MHz to 850MHz, fLO = 790MHz to 990MHz, fIF = 140MHz, fLO > fRF, TC = +25C, unless otherwise noted. Typical values are at VCC = 5V, PRF = 0dBm, PLO = 0dBm, fRF = 750MHz, fLO = 890MHz, fIF = 140MHz, TC = +25C, unless otherwise noted.) (Notes 8, 10) PARAMETER Conversion Loss SYMBOL CONDITIONS LC Input 1dB Compression Point P1dB fRF = 750MHz, PRF = 0dBm, PLO = 0dBm Input Third-Order Intercept Point IIP3 fRF1 = 749MHz, fRF2 = 750MHz, fLO = 890MHz, PRF = 0dBm/tone, PLO = 0dBm MIN TYP MAX UNITS 6.1 6.9 8.1 dB 29 24 dBm 33 dBm LO Leakage at IF Port PLO = +3dBm -33 dBm LO Leakage at RF Port PLO = +3dBm -20 dBm RF-to-IF Isolation 49 dB 2LO - 2RF Spurious Response 2x2 36 65 dBc 3LO - 3RF Spurious Response 3x3 75 dBc AC ELECTRICAL CHARACTERISTICS (UPCONVERTER OPERATION) (Typical Application Circuit, L1 = 4.7nH, C4 = 6pF, C1 = 82pF, C5 not used, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PIF = 0dBm, fRF = 815MHz to 1000MHz, fLO = 960MHz to 1180MHz, fIF = 160MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = 5V, PIF = 0dBm, PLO = 0dBm, fRF = 910MHz, fLO = 1070MHz, fIF = 160MHz, TC = +25C, unless otherwise noted.) (Note 8) PARAMETER Conversion Loss SYMBOL CONDITIONS MIN LC TYP MAX UNITS 7.4 dB Flatness over any one of three frequency bands (fIF = 160MHz): fRF = 827MHz to 849MHz fRF = 869MHz to 894MHz fRF = 880MHz to 915MHz 0.3 dB TC = +25C to -40C -0.3 TC = +25C to +85C 0.4 P1dB (Note 9) 24 dBm Input Third-Order Intercept Point IIP3 fIF1 = 160MHz, fIF2 = 161MHz, PIF = 0dBm/tone, fLO = 1070MHz, PLO = 0dBm, TC = +25C (Note 10) 31 dBm Input IP3 Variation Over Temperature IIP3 Conversion Loss Flatness Conversion Loss Variation Over Temperature Input 1dB Compression Point 28 TC = +25C to -40C 1.2 TC = +25C to +85C -0.9 dB dB LO 2IF Spur 64 LO 3IF Spur 83 dBc -167 dBm/Hz Output Noise Floor Note 6: Note 7: Note 8: Note 9: Note 10: Note 11: 4 POUT = 0dBm (Note 11) dBc Operation outside this range is possible, but with degraded performance of some parameters. Not production tested. All limits include external component losses. Output measurements are taken at IF or RF port of the Typical Application Circuit. Compression point characterized. It is advisable not to continuously operate the mixer RF/IF inputs above +12dBm. Guaranteed by design. Measured with external LO source noise filtered, so its noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021: Specifications and Measurement of Local Oscilator Noise in Integrated Circuit Base Station Mixers. _______________________________________________________________________________________ High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Downconverter Curves TC = +25C 7 7 5 950 1000 800 RF FREQUENCY (MHz) TC = +85C, +25C 33 35 INPUT IP3 (dBm) 800 1000 31 TC = -40C 29 TC = -25C PRF = 0dBm/TONE PLO = +3dBm PLO = 0dBm PLO = -3dBm 29 VCC = 4.75V 25 25 23 23 800 NOISE FIGURE vs. RF FREQUENCY TC = +25C 1000 9 1000 10 9 NOISE FIGURE (dB) TC = +85C 7 8 7 PLO = -3dBm, 0dBm, +3dBm TC = -40C 8 7 VCC = 4.75V, 5.0V, 5.25V 6 6 6 TC = -25C 5 5 5 850 850 900 950 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY NOISE FIGURE vs. RF FREQUENCY 8 800 800 MAX2032 toc08 9 850 900 950 RF FREQUENCY (MHz) 10 MAX2032 toc07 10 VCC = 5.0V 29 25 1000 VCC = 5.25V 31 27 850 900 950 RF FREQUENCY (MHz) 1000 33 27 800 950 PRF = 0dBm/TONE 35 27 23 900 INPUT IP3 vs. RF FREQUENCY 37 33 31 850 RF FREQUENCY (MHz) NOISE FIGURE (dB) INPUT IP3 (dBm) 35 NOISE FIGURE (dB) 950 INPUT IP3 vs. RF FREQUENCY 37 MAX2032 toc04 PRF = 0dBm/TONE 900 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY 37 850 INPUT IP3 (dBm) 900 MAX2032 toc05 850 MAX2032 toc03 5 5 800 7 6 6 TC = -40C VCC = 4.75V, 5.0V, 5.25V 8 MAX2032 toc09 6 PLO = -3dBm, 0dBm, +3dBm 8 9 CONVERSION LOSS (dB) TC = -25C 10 MAX2032 toc02 MAX2032 toc01 TC = +85C 8 9 CONVERSION LOSS (dB) CONVERSION LOSS (dB) 9 CONVERSION LOSS vs. RF FREQUENCY CONVERSION LOSS vs. RF FREQUENCY 10 MAX2032 toc06 CONVERSION LOSS vs. RF FREQUENCY 10 900 950 RF FREQUENCY (MHz) 1000 800 850 900 950 RF FREQUENCY (MHz) 1000 800 850 900 950 1000 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX2032 Typical Operating Characteristics (Typical Application Circuit, optimized for the 800MHz/900MHz cellular band (see Table 1), C1 = 82pF, C5 = 2pF, L1 and C4 not used, VCC = 5.0V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 160MHz, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 800MHz/900MHz cellular band (see Table 1), C1 = 82pF, C5 = 2pF, L1 and C4 not used, VCC = 5.0V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 160MHz, TC = +25C, unless otherwise noted.) Downconverter Curves 2LO - 2RF RESPONSE vs. RF FREQUENCY TC = +85C 65 55 TC = -25C TC = -40C 850 900 950 65 PLO = +3dBm 55 45 850 900 55 VCC = 5.25V 45 950 1000 800 850 900 950 3LO - 3RF RESPONSE vs. RF FREQUENCY 3LO - 3RF RESPONSE vs. RF FREQUENCY 65 PLO = 0dBm 3LO - 3RF RESPONSE (dBc) 3LO - 3RF RESPONSE (dBc) 75 PRF = 0dBm 85 95 MAX2032 toc14 95 75 PLO = -3dBm 65 1000 800 RF FREQUENCY (MHz) 900 950 27 INPUT P1dB (dBm) 25 TC = -25C, +85C TC = +25C 23 21 RF FREQUENCY (MHz) 1000 900 950 1000 INPUT P1dB vs. RF FREQUENCY MAX2032 toc17 29 VCC = 5.25V 27 25 PLO = -3dBm 25 VCC = 4.75V 23 VCC = 5.0V 21 21 950 850 RF FREQUENCY (MHz) 23 900 800 1000 PLO = 0dBm, +3dBm 27 850 VCC = 4.75V INPUT P1dB vs. RF FREQUENCY 29 MAX2032 toc16 TC = -40C VCC = 5.0V 65 RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY 29 850 INPUT P1dB (dBm) 950 75 55 55 900 VCC = 5.25V PLO = +3dBm 55 850 PRF = 0dBm 85 1000 MAX2032 toc15 3LO - 3RF RESPONSE vs. RF FREQUENCY TC = -40C, -25C 6 65 RF FREQUENCY (MHz) TC = +85C 800 75 RF FREQUENCY (MHz) TC = +25C 800 VCC = 4.75V, 5.0V RF FREQUENCY (MHz) PRF = 0dBm 85 PRF = 0dBm 35 800 1000 MAX2032 toc13 800 3LO - 3RF RESPONSE (dBc) 75 85 35 35 95 PLO = 0dBm P = -3dBm LO MAX2032 toc18 45 PRF = 0dBm MAX2032 toc12 75 85 2LO - 2RF RESPONSE (dBc) TC = +25C MAX2032 toc10 PRF = 0dBm 2LO - 2RF RESPONSE (dBc) 2LO - 2RF RESPONSE (dBc) 85 2LO - 2RF RESPONSE vs. RF FREQUENCY MAX2032 toc11 2LO - 2RF RESPONSE vs. RF FREQUENCY INPUT P1dB (dBm) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch 800 850 900 950 RF FREQUENCY (MHz) 1000 800 850 900 950 RF FREQUENCY (MHz) _______________________________________________________________________________________ 1000 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Downconverter Curves LO SWITCH ISOLATION vs. LO FREQUENCY TC = -40C, -25C 50 TC = +85C 45 TC = +25C 40 950 1050 1150 50 PLO = -3dBm, 0dBm, +3dBm 45 1250 950 1050 1150 850 1250 950 1050 1150 LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY -40 PLO = -3dBm, 0dBm, +3dBm -50 -60 -60 1010 1060 1110 960 1160 1010 1060 1110 MAX2032 toc24 MAX2032 toc23 -30 VCC = 5.25V -30 -40 VCC = 4.75V VCC = 5.0V -50 -60 1160 960 1010 1060 1110 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY -30 TC = +85C -35 TC = +25C -40 -25 -30 PLO = -3dBm, 0dBm, +3dBm -35 -40 950 1050 1150 LO FREQUENCY (MHz) 1250 -20 VCC = 5.25V -25 -30 VCC = 4.75V -35 VCC = 5.0V -40 -45 -45 -45 MAX2032 toc27 -20 1160 -15 LO LEAKAGE AT RF PORT (dBm) -25 MAX2032 toc26 TC = -40C, -25C -15 LO LEAKAGE AT RF PORT (dBm) MAX2032 toc25 -15 1250 -20 LO LEAKAGE AT IF PORT (dBm) -50 -20 LO LEAKAGE AT IF PORT (dBm) MAX2032 toc22 TC = +85C 850 MAX2032 toc21 40 850 LO LEAKAGE AT IF PORT vs. LO FREQUENCY TC = +25C -20 VCC = 4.75V, 5.0V, 5.25V 45 LO FREQUENCY (MHz) TC = -40C, -25C 960 50 LO FREQUENCY (MHz) -30 -40 55 LO FREQUENCY (MHz) -20 LO LEAKAGE AT IF PORT (dBm) 55 40 850 LO LEAKAGE AT RF PORT (dBm) LO SWITCH ISOLATION (dB) 55 60 MAX2032 toc20 MAX2032 toc19 60 LO SWITCH ISOLATION (dB) LO SWITCH ISOLATION (dB) 60 LO SWITCH ISOLATION vs. LO FREQUENCY LO SWITCH ISOLATION vs. LO FREQUENCY 850 950 1050 1150 LO FREQUENCY (MHz) 1250 850 950 1050 1150 1250 LO FREQUENCY (MHz) _______________________________________________________________________________________ 7 MAX2032 Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 800MHz/900MHz cellular band (see Table 1), C1 = 82pF, C5 = 2pF, L1 and C4 not used, VCC = 5.0V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 160MHz, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 800MHz/900MHz cellular band (see Table 1), C1 = 82pF, C5 = 2pF, L1 and C4 not used, VCC = 5.0V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 160MHz, TC = +25C, unless otherwise noted.) Downconverter Curves RF-TO-IF ISOLATION vs. RF FREQUENCY TC = +85C 45 TC = -40C, -25C 35 50 45 40 PLO = -3dBm PLO = 0dBm 35 30 850 900 950 1000 MAX2032 toc30 VCC = 4.75V, 5.0V, 5.25V 40 30 800 850 900 950 800 1000 850 900 950 1000 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF PORT RETURN LOSS vs. RF FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY 15 20 PLO = -3dBm, 0dBm, +3dBm 25 15 20 VCC = 4.75V, 5.0V, 5.25V 25 30 35 40 10 850 900 950 1000 1050 20 PLO = -3dBm, 0dBm, +3dBm 25 30 35 40 50 50 800 15 45 45 30 INCLUDES IF TRANSFORMER 5 IF PORT RETURN LOSS (dB) 10 IF PORT RETURN LOSS (dB) 10 INCLUDES IF TRANSFORMER 5 0 MAX2032 toc32 0 MAX2032 toc31 5 0 100 200 300 400 0 500 100 200 300 400 RF FREQUENCY (MHz) IF FREQUENCY (MHz) IF FREQUENCY (MHz) LO SELECTED RETURN LOSS vs. LO FREQUENCY LO UNSELECTED RETURN LOSS vs. LO FREQUENCY SUPPLY CURRENT vs. TEMPERATURE (TC) 15 PLO = +3dBm PLO = 0dBm 20 25 30 35 10 PLO = -3dBm, 0dBm, +3dBm 20 30 40 500 MAX2032 toc36 100 VCC = 5.25V SUPPLY CURRENT (mA) 10 0 MAX2032 toc35 5 LO UNSELECTED RETURN LOSS (dB) MAX2032 toc34 0 90 80 VCC = 5.0V VCC = 4.75V 70 50 PLO = -3dBm 60 40 800 900 1000 1100 LO FREQUENCY (MHz) 8 45 RF FREQUENCY (MHz) 0 750 50 35 30 800 RF PORT RETURN LOSS (dB) PLO = +3dBm 55 MAX2032 toc33 40 55 RF-TO-IF ISOLATION (dB) TC = +25C 60 MAX2032 toc29 MAX2032 toc28 60 RF-TO-IF ISOLATION (dB) RF-TO-IF ISOLATION (dB) 55 50 RF-TO-IF ISOLATION vs. RF FREQUENCY RF-TO-IF ISOLATION vs. RF FREQUENCY 60 LO SELECTED RETURN LOSS (dB) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch 1200 1300 60 800 900 1000 1100 LO FREQUENCY (MHz) 1200 1300 -40 -15 10 35 TEMPERATURE (C) _______________________________________________________________________________________ 60 85 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Downconverter Curves 6 TC = +25C TC = -40C 5 8 7 PLO = -3dBm, 0dBm, +3dBm 6 800 850 650 RF FREQUENCY (MHz) MAX2032 toc39 VCC = 4.75V, 5.0V, 5.25V 6 750 800 650 850 PRF = 0dBm/TONE 34 INPUT IP3 (dBm) 34 TC = +25C TC = +85C 30 32 30 750 800 850 INPUT IP3 vs. RF FREQUENCY 36 MAX2032 toc40 PRF = 0dBm/TONE 700 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY INPUT IP3 vs. RF FREQUENCY TC = +25C 7 RF FREQUENCY (MHz) 36 32 700 36 PRF = 0dBm/TONE 34 INPUT IP3 (dBm) 750 MAX2032 toc41 700 8 5 5 650 INPUT IP3 (dBm) CONVERSION LOSS (dB) 7 9 MAX2032 toc38 MAX2032 toc37 CONVERSION LOSS (dB) CONVERSION LOSS (dB) TC = +85C 8 CONVERSION LOSS vs. RF FREQUENCY CONVERSION LOSS vs. RF FREQUENCY 9 PLO = -3dBm, 0dBm, +3dBm MAX2032 toc42 CONVERSION LOSS vs. RF FREQUENCY 9 VCC = 5.25V 32 VCC = 5.0V 30 VCC = 4.75V 26 700 750 800 650 850 700 750 800 700 750 800 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 2LO - 2RF RESPONSE vs. RF FREQUENCY 2LO - 2RF RESPONSE vs. RF FREQUENCY 2LO - 2RF RESPONSE vs. RF FREQUENCY 80 PRF = 0dBm TC = +85C 60 TC = +25C 50 70 PLO = +3dBm 60 PLO = 0dBm 50 PLO = -3dBm TC = -40C 40 750 800 RF FREQUENCY (MHz) 850 850 70 60 50 VCC = 4.75V, 5.0V, 5.25V 40 40 700 PRF = 0dBm 2LO - 2RF RESPONSE (dBc) 70 80 MAX2032 toc44 PRF = 0dBm 2LO - 2RF RESPONSE (dBc) 80 650 650 850 RF FREQUENCY (MHz) MAX2032 toc43 650 MAX2032 toc45 26 26 2LO - 2RF RESPONSE (dBc) 28 28 TC = -40C 28 650 700 750 800 RF FREQUENCY (MHz) 850 650 700 750 800 850 RF FREQUENCY (MHz) _______________________________________________________________________________________ 9 MAX2032 Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 700MHz band (see Table 1), C1 = 7pF, C5 = 3.3pF, L1 and C4 are not used, VCC = 5V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 140MHz, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 700MHz band (see Table 1), C1 = 7pF, C5 = 3.3pF, L1 and C4 are not used, VCC = 5V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 140MHz, TC = +25C, unless otherwise noted.) Downconverter Curves PRF = 0dBm TC = +85C TC = -40C 75 PLO = -3dBm, 0dBm, +3dBm 65 85 PRF = 0dBm VCC = 5.25V 3LO - 3RF RESPONSE (dBc) 75 65 85 MAX2032 toc47 PRF = 0dBm 3LO - 3RF RESPONSE (dBc) 3LO - 3RF RESPONSE (dBc) TC = +25C MAX2032 toc46 85 3LO - 3RF RESPONSE vs. RF FREQUENCY 3LO - 3RF RESPONSE vs. RF FREQUENCY MAX2032 toc48 3LO - 3RF RESPONSE vs. RF FREQUENCY 75 VCC = 5.0V 65 VCC = 4.75V 750 800 55 55 850 650 RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY 800 650 850 24 INPUT P1dB (dBm) TC = +25C PLO = +3dBm 23 TC = +85C 750 800 850 INPUT P1dB vs. RF FREQUENCY 23 PLO = 0dBm 22 700 RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY 25 MAX2032 toc49 24 INPUT P1dB (dBm) 750 RF FREQUENCY (MHz) 25 22 700 25 VCC = 5.25V VCC = 5.0V 24 INPUT P1dB (dBm) 700 MAX2032 toc50 650 MAX2032 toc51 55 23 22 VCC = 4.75V 21 21 21 TC = -40C PLO = -3dBm 20 20 20 700 750 800 850 750 800 700 750 800 RF FREQUENCY (MHz) LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY -25 PLO = +3dBm -35 PLO = 0dBm PLO = -3dBm 840 890 940 LO FREQUENCY (MHz) 990 MAX2032 toc54 850 VCC = 5.25V -25 -35 VCC = 5.0V VCC = 4.75V -45 -45 -45 -15 LO LEAKAGE AT IF PORT (dBm) TC = +25C -15 MAX2032 toc53 MAX2032 toc52 TC = -40C -25 790 650 850 RF FREQUENCY (MHz) TC = +85C 10 700 RF FREQUENCY (MHz) -15 -35 650 LO LEAKAGE AT IF PORT (dBm) 650 LO LEAKAGE AT IF PORT (dBm) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch 790 840 890 940 LO FREQUENCY (MHz) 990 790 840 890 940 LO FREQUENCY (MHz) ______________________________________________________________________________________ 990 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Downconverter Curves TC = +85C TC = +25C -30 PLO = -3dBm -25 PLO = 0dBm -30 840 890 940 990 790 890 940 790 890 940 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = +85C PLO = +3dBm -25 -30 PLO = 0dBm -35 PLO = -3dBm -20 2LO LEAKAGE AT RF PORT (dBm) TC = +25C -35 MAX2032 toc59 MAX2032 toc58 -30 890 940 840 790 990 RF-TO-IF ISOLATION vs. RF FREQUENCY 940 RF-TO-IF ISOLATION (dB) -35 790 990 50 TC = +25C 30 50 40 PLO = -3dBm, 0dBm, +3dBm RF FREQUENCY (MHz) 850 890 940 990 RF-TO-IF ISOLATION vs. RF FREQUENCY 60 50 VCC = 4.75V, 5.0V, 5.25V 40 30 30 800 840 LO FREQUENCY (MHz) MAX2032 toc62 TC = +85C 750 VCC = 4.75V -30 RF-TO-IF ISOLATION vs. RF FREQUENCY 60 MAX2032 toc61 60 700 -25 LO FREQUENCY (MHz) LO FREQENCY (MHz) TC = -40C 890 RF-TO-IF ISOLATION (dB) 840 VCC = 5.0V VCC = 5.25V 990 -40 -40 -40 650 840 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY -20 MAX2032 toc57 -30 990 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY -25 40 VCC = 4.75V -25 LO FREQUENCY (MHz) TC = -40C 790 VCC = 5.0V LO FREQUENCY (MHz) -20 RF-TO-IF ISOLATION (dB) 840 -20 LO FREQUENCY (MHz) 2LO LEAKAGE AT RF PORT (dBm) 790 2LO LEAKAGE AT RF PORT (dBm) -20 VCC = 5.25V -15 MAX2032 toc63 -25 PLO = +3dBm -15 -10 MAX2032 toc60 -20 MAX2032 toc56 TC = -40C -15 LO LEAKAGE AT RF PORT vs. LO FREQUENCY -10 LO LEAKAGE AT RF PORT (dBm) MAX2032 toc55 LO LEAKAGE AT RF PORT (dBm) -10 LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT (dBm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY 650 700 750 800 RF FREQUENCY (MHz) 850 650 700 750 800 850 RF FREQUENCY (MHz) ______________________________________________________________________________________ 11 MAX2032 Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 700MHz band (see Table 1), C1 = 7pF, C5 = 3.3pF, L1 and C4 are not used, VCC = 5V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 140MHz, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit, optimized for the 700MHz band (see Table 1), C1 = 7pF, C5 = 3.3pF, L1 and C4 are not used, VCC = 5V, PLO = 0dBm, PRF = 0dBm, fLO > fRF, fIF = 140MHz, TC = +25C, unless otherwise noted.) Downconverter Curves RF PORT RETURN LOSS vs. RF FREQUENCY 10 15 800 VCC = 4.75V, 5.0V, 5.25V 25 1000 900 50 100 150 200 MAX2032 toc66 30 250 300 600 350 750 100 VCC = 5.25V SUPPLY CURRENT (mA) 10 PLO = -3dBm, 0dBm, +3dBm 90 80 VCC = 5.0V 70 30 VCC = 4.75V 60 40 600 750 900 1050 LO FREQENCY (MHz) 1200 -40 900 1050 LO FREQUENCY (MHz) SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2032 toc67 0 LO UNSELECTED RETURN LOSS (dB) 20 IF FREQUENCY (MHz) LO UNSELECTED RETURN LOSS vs. LO FREQUENCY 12 PLO = +3dBm 40 RF FREQUENCY (MHz) 20 PLO = 0dBm MAX2032 toc68 700 15 10 PLO = -3dBm 25 600 10 20 PLO = -3dBm, 0dBm, +3dBm 500 5 0 LO SELECTED RETURN LOSS (dB) IF PORT RETURN LOSS (dB) fLO = 890MHz MAX2032 toc65 0 MAX2032 toc64 5 20 LO SELECTED RETURN LOSS vs. LO FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY 0 RF PORT RETURN LOSS (dB) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch -15 10 35 60 85 TEMPERATURE (NC) ______________________________________________________________________________________ 1200 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Upconverter Curves TC = -40C 5 5 800 850 900 950 1000 MAX2032 toc71 VCC = 4.75V, 5.0V, 5.25V 6 5 3 750 1050 7 4 3 750 800 850 900 950 1000 750 1050 800 850 900 950 1000 1050 INPUT IP3 vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) INPUT IP3 vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) INPUT IP3 vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 35 35 35 PIF = 0dBm/TONE TC = -25C TC = -40C PIF = 0dBm/TONE 33 TC = +85C TC = +25C 27 29 INPUT IP3 (dBm) INPUT IP3 (dBm) 29 PLO = -3dBm, 0dBm, +3dBm 27 29 VCC = 4.75V 25 25 23 23 23 21 21 750 800 850 900 950 1000 750 1050 VCC = 5.0V 27 25 21 VCC = 5.25V 31 31 31 PIF = 0dBm/TONE 33 MAX2032 toc74 RF FREQUENCY (MHz) MAX2032 toc73 RF FREQUENCY (MHz) MAX2032 toc72 RF FREQUENCY (MHz) 33 800 850 900 950 1000 750 1050 800 850 900 950 1000 1050 RF FREQUENCY (MHz) LO + 2IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO + 2IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO + 2IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 80 80 80 PIF = 0dBm TC = -40C, -25C TC = +25C 70 65 75 LO + 2IF REJECTION (dBc) 75 TC = +85C 60 55 PIF = 0dBm PLO = +3dBm 70 65 PLO = -3dBm 60 PLO = 0dBm 960 1010 1060 1110 LO FREQUENCY (MHz) 1160 1210 VCC = 5.25V 75 70 VCC = 5.0V 65 60 VCC = 4.75V 50 50 910 PIF = 0dBm 55 55 50 MAX2032 toc77 RF FREQUENCY (MHz) MAX2032 toc75 RF FREQUENCY (MHz) LO + 2IF REJECTION (dBc) INPUT IP3 (dBm) PLO = -3dBm, 0dBm, +3dBm 4 4 LO + 2IF REJECTION (dBc) CONVERSION LOSS (dB) TC = -25C 7 6 8 MAX2032 toc76 CONVERSION LOSS (dB) 7 6 8 CONVERSION LOSS (dB) TC = +85C 9 MAX2032 toc70 TC = +25C 8 9 MAX2032 toc69 9 CONVERSION LOSS vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) CONVERSION LOSS vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) CONVERSION LOSS vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 910 960 1010 1060 1110 LO FREQUENCY (MHz) 1160 1210 910 960 1010 1060 1110 1160 1210 LO FREQUENCY (MHz) ______________________________________________________________________________________ 13 MAX2032 Typical Operating Characteristics (continued) (Typical Application Circuit, L1 = 4.7nH, C4 = 6pF, C5 not used, VCC = 5.0V, PLO = 0dBm, PIF = 0dBm, fRF = fLO + fIF, fIF = 160MHz, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit, L1 = 4.7nH, C4 = 6pF, C5 not used, VCC = 5.0V, PLO = 0dBm, PIF = 0dBm, fRF = fLO + fIF, fIF = 160MHz, TC = +25C, unless otherwise noted.) Upconverter Curves 80 80 80 75 65 TC = +25C 60 55 60 PLO = -3dBm PLO = 0dBm 960 1010 1060 1110 1160 1210 VCC = 5.25V 70 VCC = 5.0V 65 60 VCC = 4.75V 55 50 910 50 910 960 1010 1060 1110 1160 910 1210 960 1010 1060 1110 1160 1210 LO + 3IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO + 3IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO + 3IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 90 90 90 80 TC = -40C, -25C, +25C, +85C 70 60 PIF = 0dBm 80 LO + 3IF REJECTION (dBc) PIF = 0dBm PLO = -3dBm, 0dBm, +3dBm 70 60 910 960 1010 1060 1110 1160 910 1210 PIF = 0dBm VCC = 5.25V 80 VCC = 4.75V, 5.0V 70 60 50 50 50 MAX2032 toc83 LO FREQUENCY (MHz) MAX2032 toc82 LO FREQUENCY (MHz) MAX2032 toc81 LO FREQUENCY (MHz) LO + 3IF REJECTION (dBc) 960 1010 1060 1110 1160 910 1210 960 1010 1060 1110 1160 1210 LO FREQUENCY (MHz) LO - 3IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO - 3IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO - 3IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 90 90 90 PIF = 0dBm TC = -40C, -25C, +25C LO - 3IF REJECTION (dBc) 80 TC = +85C 70 60 50 PIF = 0dBm 80 PLO = -3dBm, 0dBm, +3dBm 70 60 960 1010 1060 1110 LO FREQUENCY (MHz) 1160 1210 VCC = 5.25V 80 VCC = 4.75V 70 VCC = 5.0V 60 50 50 910 PIF = 0dBm MAX2032 toc86 LO FREQUENCY (MHz) MAX2032 toc84 LO FREQUENCY (MHz) LO - 3IF REJECTION (dBc) LO + 3IF REJECTION (dBc) 65 55 50 14 PLO = +3dBm 70 PIF = 0dBm 75 MAX2032 toc85 LO - 2IF REJECTION (dBc) TC = +85C 70 PIF = 0dBm LO - 2IF REJECTION (dBc) TC = -40C, -25C LO - 2IF REJECTION (dBc) PIF = 0dBm MAX2032 toc80 LO - 2IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) MAX2032 toc79 LO - 2IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) MAX2032 toc78 LO - 2IF REJECTION vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 75 LO - 3IF REJECTION (dBc) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch 910 960 1010 1060 1110 LO FREQUENCY (MHz) 1160 1210 910 960 1010 1060 1110 LO FREQUENCY (MHz) ______________________________________________________________________________________ 1160 1210 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Upconverter Curves -20 TC = -40C, -25C -25 TC = +85C -30 TC = +25C -20 -25 PLO = -3dBm, 0dBm, +3dBm -30 910 960 1010 1060 1110 1160 -20 VCC = 5.25V -25 VCC = 4.75V -30 VCC = 5.0V -35 910 1210 MAX2032 toc89 -15 -35 -35 960 1010 1060 1110 1160 910 1210 960 1010 1060 1110 1160 1210 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz) IF LEAKAGE AT RF PORT vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) IF LEAKAGE AT RF PORT vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) IF LEAKAGE AT RF PORT vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) -70 TC = +85C -80 -90 -100 PLO = 0dBm -70 PLO = +3dBm -80 -90 -70 VCC = 4.75V -80 -90 1160 1210 ______________________________________________________________________________________ 15 1060 1110 1160 1210 910 960 LO FREQUENCY (MHz) 1010 1060 1110 1160 1210 910 960 1010 1060 1110 LO FREQUENCY (MHz) LO FREQUENCY (MHz) RF PORT RETURN LOSS vs. RF FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) 0 MAX2032 toc93 1010 L1 AND C4 BPF REMOVED 5 RF PORT RETURN LOSS (dB) 960 VCC = 5.25V -100 -100 910 VCC = 5.0V -60 MAX2032 toc92 PLO = -3dBm -60 -50 IF LEAKAGE AT RF PORT (dBm) TC = -40C, -25C MAX2032 toc91 TC = +25C -60 -50 IF LEAKAGE AT RF PORT (dBm) MAX2032 toc90 -50 IF LEAKAGE AT RF PORT (dBm) MAX2032 toc88 -15 LO LEAKAGE AT RF PORT (dBm) MAX2032 toc87 LO LEAKAGE AT RF PORT (dBm) -15 LO LEAKAGE AT RF PORT vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO LEAKAGE AT RF PORT vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) LO LEAKAGE AT RF PORT (dBm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY (L-C BPF TUNED FOR 810MHz RF FREQUENCY) L1 AND C4 BPF INSTALLED 10 15 20 THE OPTIONAL L-C BPF ENHANCES PERFORMANCE IN THE UPCONVERTER MODE, BUT LIMITS RF BANDWIDTH 25 30 35 750 800 850 900 950 1000 1050 RF FREQUENCY (MHz) MAX2032 Typical Operating Characteristics (continued) (Typical Application Circuit, L1 = 4.7nH, C4 = 6pF, C5 not used, VCC = 5.0V, PLO = 0dBm, PIF = 0dBm, fRF = fLO + fIF, fIF = 160MHz, TC = +25C, unless otherwise noted.) MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Pin Description PIN 1, 6, 8, 14 NAME VCC FUNCTION Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. 2 RF 3 TAP Single-Ended 50 RF Input/Output. This port is internally matched and DC shorted to GND through a balun. Center Tap of the Internal RF Balun. Connect to ground. 4, 5, 10, 12, 13, 16, 17, 20 GND Ground 7 LOBIAS Bias Resistor for Internal LO Buffer. Connect a 523 1% resistor from LOBIAS to the power supply. 9 LOSEL 11 LO1 15 LO2 18, 19 IF-, IF+ -- EP Local Oscillator Select. Logic-control input for selecting LO1 or LO2. Local Oscillator Input 1. Drive LOSEL low to select LO1. Local Oscillator Input 2. Drive LOSEL high to select LO2. Differential IF Input/Outputs Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the noted RF performance. Detailed Description The MAX2032 can operate either as a downconverter or an upconverter mixer that provides approximately 7dB of conversion loss with a typical 7dB noise figure. IIP3 is +33dBm and +31dBm for downconversion and upconversion modes, respectively. The integrated baluns and matching circuitry allow for 50 single-ended interfaces to the RF port and the two LO ports. The RF port can be used as an input for downconversion or an output for upconversion. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 49dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX2032's inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output for downconversion, which is ideal for providing enhanced IIP2 performance. For upconversion, the IF port is a differential input. Specifications are guaranteed over broad frequency ranges to allow for use in cellular band WCDMA, cdmaOneTM, cdma2000, and GSM 850/GSM 900 2.5G EDGE base stations. The MAX2032 is specified to operate over a 650MHz to 1000MHz RF frequency range, a 650MHz to 1250MHz LO frequency range, and a DC to 250MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details. The MAX2032 is optimized for high-side LO injection architectures. However, the device can operate in low-side LO injection applications with an extended LO range, but performance degrades as fLO decreases. See the Typical Operating Characteristics for measurements taken with fLO below 960MHz. For a pin-compatible device that has been optimized for LO frequencies below 960MHz, refer to the MAX2029. RF Port and Balun For using the MAX2032 as a downconverter, the RF input is internally matched to 50, requiring no external matching components. A DC-blocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. For upconverter operation, the RF port is a single-ended output similarly matched to 50. LO Inputs, Buffer, and Balun The MAX2032 is optimized for high-side LO injection architectures with a 650MHz to 1250MHz LO frequency range. For a device with a 570MHz to 900MHz LO frequency range, refer to the MAX2029. As an added feature, the MAX2032 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for nearly all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. cdmaOne is a trademark of CDMA Development Group. 16 ______________________________________________________________________________________ High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch High-Linearity Mixer The core of the MAX2032 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. Differential IF The MAX2032 mixer has a DC to 250MHz IF frequency range. Note that these differential ports are ideal for providing enhanced IIP2 performance. Single-ended IF applications require a 1:1 balun to transform the 50 differential IF impedance to 50 single-ended. Including the balun, the IF return loss is better than 15dB. The differential IF is used as an input port for upconverter operation. The user can use a differential IF amplifier following the mixer, but a DC block is required on both IF pins. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50. No matching components are required. As a downconverter, the return loss at the RF port is typically better than 15dB over the entire input range (650MHz to 1000MHz), and return loss at the LO ports are typically 15dB (960MHz to 1180MHz). RF and LO inputs require only DC-blocking capacitors for interfacing (see Table 1). An optional L-C bandpass filter (BPF) can be installed at the RF port to improve upconverter performance. See the Typical Application Circuit and Typical Operating Characteristics for upconverter operation with an L-C BPF tuned for 810MHz RF frequency. Performance can be optimized at other frequencies by choosing different values for L1 and C4. Removing L1 and C4 altogether results in a broader match, but performance degrades. Contact factory for details. The IF output impedance is 50 (differential). For evaluation, an external low-loss 1:1 (impedance ratio) balun transforms this impedance to a 50 single-ended output (see the Typical Application Circuit). Table 1. Typical Application Circuit Component List DESIGNATION QTY DESCRIPTION SUPPLIER 82pF microwave capacitor (0603). Use for 800MHz/ 900MHz cellular band applications. C1 1 Murata Electronics North America, Inc. 7pF microwave capacitor (0603). Use for 700MHz band applications. C2, C7, C8, C10, C11, C12 6 82pF microwave capacitors (0603) Murata Electronics North America, Inc. C3, C6, C9 3 0.01F microwave capacitors (0603) Murata Electronics North America, Inc. C4* 1 6pF microwave capacitor (0603) -- 2pF microwave capacitor (0603). Use for 800MHz/ 900MHz cellular band applications. C5** Murata Electronics North America, Inc. 1 3.3pF microwave capacitor (0603). Use for 700MHz band applications. L1* 1 4.7nH inductor (0603) R1 1 523 1% resistor (0603) Digi-Key Corp. -- T1 1 MABAES0029 1:1 transformer (50:50) M/A-Com, Inc. U1 1 MAX2032 IC (20 TQFN) Maxim Integrated Products, Inc. *C4 and L1 installed only when mixer is used as an upconverter. **C5 installed only when mixer is used as a downconverter. ______________________________________________________________________________________ 17 MAX2032 To avoid damage to the part, voltage MUST be applied to VCC before digital logic is applied to LOSEL (see the Absolute Maximum Ratings). LO1 and LO2 inputs are internally matched to 50, requiring an 82pF DC-blocking capacitor at each input. A two-stage internal LO buffer allows a wide inputpower range for the LO drive. All guaranteed specifications are for a -3dBm to +3dBm LO signal power. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. MAX2032 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch Bias Resistor Power-Supply Bypassing Bias current for the LO buffer is optimized by fine tuning resistor R1. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values. Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin with the capacitors shown in the Typical Application Circuit. See Table 1. Layout Considerations The exposed pad (EP) of the MAX2032's 20-pin thin QFN-EP package provides a low-thermal-resistance path to the die. It is important that the PCB on which the MAX2032 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP MUST be soldered to a ground plane on the PCB, either directly or through an array of plated via holes. A properly designed PCB is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground-pin traces directly to the exposed pad under the package. The PCB exposed pad MUST be connected to the ground plane of the PCB. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PCB. The MAX2032 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. 18 Exposed Pad RF/Thermal Considerations ______________________________________________________________________________________ High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch T1 1 4 3 5 IF C3 RF RF C4 L1 19 17 GND IF18 16 C12 VCC C1 20 + C2 IF+ GND VCC GND C5 TAP GND GND 15 1 MAX2032 2 14 13 3 12 4 EP 11 5 LO2 LO2 VCC VCC C11 GND GND LO1 LO1 C10 10 GND VCC 9 LOSEL 8 LOBIAS 7 VCC 6 R1 VCC LOSEL C6 C7 C8 VCC NOTE: L1 AND C4 USED ONLY FOR UPCONVERTER OPERATION. C5 USED ONLY FOR DOWNCONVERTER OPERATION. C9 Package Information Chip Information PROCESS: SiGe BiCMOS For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 20 Thin QFN-EP T2055+3 21-0140 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19 (c) 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX2032 Typical Application Circuit