FDS4559 60V Complementary PowerTrenchMOSFET General Description Features This complementary MOSFET device is produced using Fairchild's advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. * Q1: N-Channel RDS(on) = 55 m @ VGS = 10V 4.5 A, 60 V RDS(on) = 75 m @ VGS = 4.5V * Applications Q2: P-Channel -3.5 A, -60 V RDS(on) = 105 m @ VGS = -10V * DC/DC converter RDS(on) = 135 m @ VGS = -4.5V * Power management * LCD backlight inverter DD2 DD2 D1 D DD1 G2 S2 G G1 S1 S S Drain-Source Voltage Gate-Source Voltage ID Drain Current 2 8 1 TA = 25C unless otherwise noted Parameter VDSS VGSS 7 S Absolute Maximum Ratings Q1 - Continuous - Pulsed Power Dissipation for Dual Operation Power Dissipation for Single Operation (Note 1a) Q2 Units 60 -60 20 4.5 20 20 -3.5 -20 V V A 2 1.6 1.2 1 -55 to +175 C (Note 1a) 78 C/W (Note 1) 40 C/W (Note 1a) (Note 1b) (Note 1c) TJ, TSTG 3 Q1 Pin 1 SO-8 PD 4 6 SO-8 Symbol Q2 5 Operating and Storage Junction Temperature Range W Thermal Characteristics RJA Thermal Resistance, Junction-to-Ambient RJC Thermal Resistance, Junction-to-Case Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity FDS4559 FDS4559 13" 12mm 2500 units 2000 Fairchild Semiconductor Corporation FDS4559 Rev C1(W) FDS4559 April 2002 Symbol Parameter TA = 25C unless otherwise noted Test Conditions Type Min Typ Max Units Drain-Source Avalanche Ratings (Note 1) W DSS IAR Single Pulse Drain-Source Avalanche Energy Maximum Drain-Source Avalanche Current VDD = 30 V, ID = 4.5 A Q1 90 mJ Q1 4.5 A Off Characteristics BVDSS BVDSS TJ IDSS IGSS Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage On Characteristics VGS = 0 V, ID = 250 A VGS = 0 V, ID = -250 A ID = 250 A, Referenced to 25C ID = -250 A, Referenced to 25C VDS = 48 V, VGS = 0 V VDS = -48 V, VGS = 0 V VGS = +20 V, VDS = 0 V VGS = +20 V, VDS = 0 V Q1 Q2 Q1 Q2 Q1 Q2 Q1 Q2 60 -60 VDS = VGS, ID = 250 A VDS = VGS, ID = -250 A ID = 250 A, Referenced to 25C ID = -250 A, Referenced to 25C VGS = 10 V, ID = 4.5 A VGS = 10 V, ID = 4.5 A, TJ = 125C VGS = 4.5 V, ID = 4 A VGS = -10 V, ID = -3.5 A VGS = -10 V, ID = -3.5 A, TJ = 125C VGS = -4.5 V, ID = -3.1 A VGS = 10 V, VDS = 5 V VGS = -10 V, VDS = -5 V VDS = 10 V, ID = 4.5 A VDS = -5 V, ID = -3 5 A Q1 Q2 Q1 Q2 Q1 1 -1 Q1 Q2 Q1 Q2 Q1 VDS = 25 V, VGS = 0 V, f = 1.0 MHz Q2 VDS = -30 V, VGS = 0 V, f = 1.0 MHz Q1 VDD = 30 V, ID = 1 A, VGS = 10V, RGEN = 6 V 58 -49 mV/C 1 -1 +100 +100 A 3 -3 V nA (Note 2) VGS(th) Gate Threshold Voltage VGS(th) TJ RDS(on) Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance ID(on) On-State Drain Current gFS Forward Transconductance Q2 2.2 -1.6 -5.5 4 42 72 55 82 130 105 mV/C 55 94 75 105 190 135 20 -20 m A 14 9 S Q1 Q2 Q1 Q2 Q1 Q2 650 759 80 90 35 39 pF Q1 Q2 Q1 Q2 Q1 Q2 Q1 Q2 Q1 Q2 Q1 Q2 Q1 Q2 11 7 8 10 19 19 6 12 12.5 15 2.4 2.5 2.6 3.0 Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge pF pF (Note 2) Q2 VDD = -30 V, ID = -1 A, VGS = -10 V, RGEN = 6 Q1 VDS = 30 V, ID = 4.5 A, VGS = 10 V Q2 VDS = -30 V, ID = -3.5 A, VGS = -10V 20 14 18 20 35 34 15 22 18 21 ns ns ns ns nC nC nC FDS4559 Rev C1(W) FDS4559 Electrical Characteristics Symbol Parameter (continued) TA = 25C unless otherwise noted Test Conditions Type Min Typ Max Units Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current VSD Drain-Source Diode Forward VGS = 0 V, IS = 1.3 A (Note 2) Voltage VGS = 0 V, IS = -1.3 A (Note 2) Q1 Q2 Q1 Q2 0.8 -0.8 1.3 -1.3 1.2 -1.2 A V Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) 78C/W when mounted on a 0.5 in2 pad of 2 oz copper b) 125C/W when mounted on a .02 in2 pad of 2 oz copper c) 135C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% FDS4559 Rev C1(W) FDS4559 Electrical Characteristics FDS4559 Typical Characteristics: Q2 1.8 -ID, DRAIN CURRENT (A) VGS = -10V -6.0V 12 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 15 -4.5V -4.0V -5.0V -3.5V 9 6 -3.0V 3 -2.5V VGS = -3.5V 1.6 -4.0V 1.4 -4.5V -5.0V 1.2 -6.0V 0 -10V 1 2 3 4 0 5 2 4 6 8 10 -ID, DRAIN CURRENT (A) -VDS, DRAIN-SOURCE VOLTAGE (V) Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 2 0.4 ID = -3.5A VGS = -10V 1.8 RDS(ON), ON-RESISTANCE (OHM) RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE -8.0V 1 0.8 0 1.6 1.4 1.2 1 0.8 0.6 0.4 ID = -1.5A 0.3 TA = 125oC 0.2 0.1 TA = 25oC 0 -50 -25 0 25 50 75 100 125 150 175 2 4 o TJ, JUNCTION TEMPERATURE ( C) 6 8 10 -VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 TA = -55oC VDS = -5V -IS, REVERSE DRAIN CURRENT (A) 15 -ID, DRAIN CURRENT (A) -7.0V 25oC 12 125oC 9 6 3 0 VGS = 0V 10 TA = 125oC 25oC 1 -55oC 0.1 0.01 0.001 1 2 3 4 -VGS, GATE TO SOURCE VOLTAGE (V) Figure 5. Transfer Characteristics. 5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDS4559 Rev C1(W) FDS4559 Typical Characteristics: Q2 1200 VDS = 10V ID = -3.0A 20V f = 1 MHz V GS = 0 V 1000 8 30V CAPACITANCE (pF) -VGS, GATE-SOURCE VOLTAGE (V) 10 6 4 800 C ISS 600 400 2 200 C OSS C RSS 0 0 0 4 8 12 16 0 10 Qg, GATE CHARGE (nC) Figure 7. Gate Charge Characteristics. 30 40 50 60 Figure 8. Capacitance Characteristics. 40 P(pk), PEAK TRANSIENT POWER (W) 100 100s ID, DRAIN CURRENT (A) 20 -V DS , DRAIN TO SOURCE VOLTAGE (V) RDS(ON) LIMIT 10 10ms 100ms 1 1s 10s VGS = -10V SINGLE PULSE RJA = 135oC/W 0.1 DC TA = 25oC 0.01 0.1 1 10 100 -VDS, DRAIN-SOURCE VOLTAGE (V) Figure 9. Maximum Safe Operating Area. SINGLE PULSE RJA = 135C/W TA = 25C 30 20 10 0 0.01 0.1 1 10 100 1000 t1, TIME (sec) Figure 10. Single Pulse Maximum Power Dissipation. FDS4559 Rev C1(W) FDS4559 Typical Characteristics: Q1 1.8 VGS = 10V 6.0V 16 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE ID, DRAIN-SOURCE CURRENT (A) 20 4.5V 5.0V 4.0V 12 8 3.5V 4 1.6 VGS = 4.0V 1.4 4.5V 5.0V 1.2 6.0V 8.0V 0.8 0 0 1 2 3 0 4 4 8 12 16 20 ID, DRAIN CURRENT (A) VDS, DRAIN-SOURCE VOLTAGE (V) Figure 11. On-Region Characteristics. Figure 12. On-Resistance Variation with Drain Current and Gate Voltage. 0.14 2.2 ID = 2.3A ID = 4.5A VGS = 10V 2 RDS(ON), ON-RESISTANCE (OHM) RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 10V 1 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 -50 -25 0 25 50 75 100 125 150 0.12 0.1 TA = 125oC 0.08 0.06 0.04 TA = 25oC 0.02 0 175 2 4 6 8 10 o TJ, JUNCTION TEMPERATURE ( C) VGS, GATE TO SOURCE VOLTAGE (V) Figure 13. On-Resistance Variation with Temperature. Figure 14. On-Resistance Variation with Gate-to-Source Voltage. 100 20 ID, DRAIN CURRENT (A) 25oC IS, REVERSE DRAIN CURRENT (A) TA = -55oC VDS = 5V o 16 125 C 12 8 4 VGS = 0V 10 TA = 125oC 1 25oC 0.1 -55oC 0.01 0.001 0.0001 0 1 2 3 4 5 VGS, GATE TO SOURCE VOLTAGE (V) Figure 15. Transfer Characteristics. 6 0 0.2 0.4 0.6 0.8 1 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 16. Body Diode Forward Voltage Variation with Source Current and Temperature. FDS4559 Rev C1(W) FDS4559 Typical Characteristics: Q1 ID = 4.5A 900 VDS = 10V 8 30V f = 1MHz VGS = 0 V 800 20V CAPACITANCE (pF) VGS, GATE-SOURCE VOLTAGE (V) 10 6 4 2 700 CISS 600 500 400 300 200 COSS 100 0 CRSS 0 0 2 4 6 8 10 12 14 0 10 Qg, GATE CHARGE (nC) 20 30 40 50 Figure 17. Gate Charge Characteristics. Figure 18. Capacitance Characteristics. 40 100 SINGLE PULSE RJA = 135oC/W RDS(ON) LIMIT 100s 10 TA = 25oC 30 1m POWER (W) ID, DRAIN CURRENT (A) 60 VDS, DRAIN TO SOURCE VOLTAGE (V) 10ms 100ms 1 1s DC VGS= 10V SINGLE PULSE RJA= 135oC/W 0.1 20 10 TA= 25oC 0.01 0.1 1 10 0 0.01 100 0.1 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 19. Maximum Safe Operating Area. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 10 100 1000 SINGLE PULSE TIME (SEC) Figure 20. Single Pulse Maximum Power Dissipation. 1 D = 0.5 RJA(t) = r(t) + RJA RJA = 135C/W 0.2 0.1 0.1 0.05 P(pk) 0.02 0.01 t1 0.01 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 SINGLE PULSE 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec) Figure 21. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design. FDS4559 Rev C1(W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Bottomless CoolFET CROSSVOLT DenseTrench DOME EcoSPARK E2CMOSTM EnSignaTM FACT FACT Quiet Series FAST a FASTr FRFET GlobalOptoisolator GTO HiSeC I2C ISOPLANAR LittleFET MicroFET MicroPak MICROWIRE OPTOLOGIC a OPTOPLANAR PACMAN POP Power247 PowerTrench a QFET QS QT Optoelectronics Quiet Series SILENT SWITCHER a UHC SMART START UltraFET a SPM VCX STAR*POWER Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogic TruTranslation STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H5