厦门华联电子 GREEN SUPER BRIGHT LED SPECIFICATION
HFGA05012C-15
2002 年6月 第 5 页 共7页
2)不能以引线基材为支点成型。Do not form the leads with their bases as a fulcrum.
3) 成型位置应离环氧本体 5mm 以上。Forming location should be up to 5mm from the epoxy
body.
7.2 安装Installation
LED 安装在PCB 上,不能造成对引线施加压力。
Installation on PCB do not apply physical stress to the leads when mounting LED lamps on
PCB.
Correct Wrong
7.3 焊接 Soldering
1)环氧不可浸入锡槽内。Do not dip epoxy body into solder bath.
2)加热过程中不能对引线施加压力。Do not apply stress to the leads while they are heated.
3)使用电烙铁焊接时,电烙铁的功率应小于等于 30W, 焊接时间应小于 3秒。
When soldering LED, the solder iron power should be not more than 30W and with the soldering
time not more than 3 seconds.
9.4 清洗 Cleaning
1)在任何情况下,清洗时间应在常温1分钟之内进行。
In any case, the cleaning time should be 1 minute or less at a normal temperature.
2)不可用水清洗,以免腐蚀引线,推荐使用酒精。
Do not clean LEDs with water as the remains may rust the leads. Alcohol is suggested to be used.
3)用超声波清洗 LED 时,超声功率和时间应分别小于 300W 和30 秒;PCB 和LED 不能接触
振荡器;不能使PCB 上LED 产生共振。
When LEDs are ultrasonic-washed, use the ultrasonic output power of less than 300W and
the time of less than 30s; do not let the PCB and LEDs touch on the oscillator; do not resonate
the LEDs attached on the PCB.
7.5 超高亮LED 为静电敏感器件,所以静电和电涌会损坏 LED。要求使用时佩带防静电腕带,
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