Ver. 201207 Multilayer Power Inductor CIG22L Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Excellent efficiency (High Q) High Current Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION Dimension [mm] TYPE 22 L W T 2.50.2 2.00.2 D 0.90.1 0.550.25 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance() Max. CIG22LR47MNE 1008/2520 0.47 20 % 0.040 25 % 1.80 CIG22L1R0MNE 1008/2520 1.00 20 % 0.060 25 % 1.60 CIG22L1R2MNE 1008/2520 1.20 20 % 0.065 25 % 1.50 CIG22L1R5MNE 1008/2520 1.50 20 % 0.070 25 % 1.50 CIG22L2R2MNE 1008/2520 2.2 20 % 0.080 25 % 1.30 CIG22L3R3MNE 1008/2520 3.3 20 % 0.100 25 % 1.20 CIG22L4R7MNE 1008/2520 4.7 20 % 0.110 25 % 1.10 CIG22L6R8MNE 1008/2520 6.8 20 % 0.203 30 % 0.80 CIG22L100MNE 1008/2520 10 20 % 0.323 30 % 0.60 Rated Current (A): DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25) Operating temperature range: -40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201207 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 22 (3) L (4) 1R0 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (L: Low Rdc) Inductance (1R0:1.0uH) (6) Tolerance (M:20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.