© 2005 Microchip Technology Inc. DS41191D-page 1
PIC12F629/675/PIC16F630/676
This document includes the
programming specifications for the
following devi ces:
1.0 PROGRAMMING THE
PIC12F629/675/PIC16F630/676
The PIC12F629/675/PIC16F630/676 is programmed
using a serial method. The Serial mode will allow the
PIC12F629/675/PIC16F630/676 to be programmed
while in the user’s system. This allows for increased
design flexibility. This programming specification
applies to PIC12F629/675/PIC16F630/676 devices in
all packages.
1.1 Hardware Requirements
The PIC12F629/675/PIC16F630/676 requires one
power supply for VDD (5.0V) and one for VPP (12V).
1.2 Programming Mode
The Programming mode for the PIC12F629/675/
PIC16F630/676 allows programming of user program
memory, data memory, special locations used for ID
and the Configuration Word register.
FIGURE 1-1: 8-PIN DIAGRAMS FOR PIC12F629/675
•PIC12F629 •PIC16F630
•PIC12F675 •PIC16F676
PDIP, SOI C
VSSVDD
GP5/T1CKI/OSC1/CLKIN
GP4/AN3/T1G/OSC2/CLKOUT
GP3/MCLR/VPP
GP0/AN0/CIN+/ICSPDAT
GP1/AN1/CIN-/VREF/ICSPCLK
GP2/AN2/T0CKI/INT/COUT
1
2
3
45
6
7
8
PIC12F675
VSS
VDD
GP5/T1CKI/OSC1/CLKIN
GP4/T1G/OSC2/CLKOUT
GP3/MCLR/VPP
GP0/CIN+/ICSPDAT
GP1/CIN-/ICSPCLK
GP2/T0CKI/INT/COUT
1
2
3
45
6
7
8
PIC12F629
1
2
3
45
6
7
8
PIC12F629
VSS
GP0/CIN+/ICSPDAT
GP1/CIN-/ICSPCLK
GP2/T0CKI/INT/COUT
VDD
GP5/TICKI/OSC1/CLKIN
GP4/TIG/OSC2/CLKOUT
GP3/MCLR/VDD
1
2
3
45
6
7
8
PIC12F675
VSS
GP0/AN0/CIN+/ICSPDAT
GP1/AN1/CIN-/ICSPCLK
GP2/AN2/T0CKI/INT/COUT
VDD
GP5/TICKI/OSC1/CLKIN
GP4/AN4/TIG/OSC2/CLKOUT
GP3/MCLR/VDD
DFN, DFN-S
PIC12F629/675/PIC16F630/676 Memory Programming
PIC12F629/675/PIC16F630/676
DS41191D-page 2 © 2005 Microchip Technology Inc.
FIGURE 1-2: 14-PIN DIAGRAMS FOR PIC16F630/676
PDIP, SOIC, TSSOP
1
2
3
4
5
6
7
14
13
12
9
11
10
8
PIC16F630
VDD
RA5/T1CKI/OSC1/CLKIN
RA4/T1G/OSC2/CLKOUT
RA3/MCLR/VPP
RC5
RC4
RC3
VSS
RA0/CIN+/ICSPDAT
RA1/CIN-/ICSPCLK
RA2/COUT/T0CKI/INT
RC0
RC1
RC2
1
2
3
4
5
6
7
14
13
12
9
11
10
8
PIC16F676
VDD
RA5/T1CKI/OSC1/CLKIN
RA4/T1G/OSC2/AN3/CLKOUT
RA3/MCLR/VPP
RC5
RC4
RC3/AN7
VSS
RA0/AN0/CIN+/ICSPDAT
RA1/AN1/CIN-/VREF/ICSPCLK
RA2/AN2/COUT/T0CKI/INT
RC0/AN4
RC1/AN5
RC2/AN6
QFN
1
2
3
49
10
11
12
5
6
7
8
16
15
14
13
PIC16F630
RA5/T1CKI/OSC1/CLKIN
RA4/T1G/OSC2/CLKOUT
RA3/MCLR/VPP
RC5
VDD
NC
NC
VSS
RA0/C1IN+/ICSPDAT
RA1/CIN-/VREF/ICSPCLK
RA2/COUT/T0CKI/INT
RC0
RC4
RC3
RC2
RC1
1
2
3
49
10
11
12
5
6
7
8
16
15
14
13
PIC16F676
RA5/T1CKI/OSC1/CLKIN
RA4/T1G/OSC2/CLKOUT
RA3/MCLR/VPP
RC5
VDD
NC
NC
VSS
RA0/AN0/C1IN+/ICSPDAT
RA1/AN1/CIN-/VREF/ICSPCLK
RA2/AN2/COUT/T0CKI/INT
RC0/AN4
RC4
RC3/AN7
RC2/AN6
RC1/AN5
© 2005 Microchip Technology Inc. DS41191D-page 3
PIC12F629/675/PIC16F630/676
FIGURE 1-3: 20-PIN DIAGRAM FOR rfPIC12F675F/H/K
TABLE 1-1: PI N D E SC R IP T IO N S ( DU R IN G PR OG RA M M IN G) : PIC12F629/675/PIC16F630/676
Pin Name During Programming
Function Pin Ty pe Pin Description
GP1 CLOCK I Clock Input – Schmitt Trigger Input (PIC12F629/675 only)
GP0 DATA I/O Data Input/Output – TTL Input (PIC12F629/675 only)
MCLR Programming Mode P(1) Program Mode Select
RA1 CLOCK I Clock Input – Schmitt Trigger Input (PIC16F630/676 only)
RA0 DATA I/O Data Input/Output – TTL Input (PIC16F630/676 only)
VDD VDD P Power Supply
VSS VSS PGround
Legend: I = Input, O = Output, P = Power
Note 1: In the PIC12F629/675/PIC16F630/676, the programming high voltage is internally generated. To activate
the Program mi ng m ode , hig h vo ltage ne eds to be appl ied to
the
MCLR input. Since the MC LR is used for
a level source, the MCLR does not draw any sign ificant current.
SSOP
VSS
GP2/T0CKI/INT/COUT
DATAFSK
GP1/CIN-/ICSPCLK
VDD
GP5/T1CKI/OSC1/CLKIN
GP3/MCLR/VPP
RFEN
CLKOUT
PS
VDDRF
GP4/T1G/OSC2/CLKOUT
DATAASK
2
3
4
5
6
7
8
9
•1 19
18
16
15
14
13
12
17
20
rfPIC12F675F/H/K
GP0/CIN+/ICSPDAT
LF
VSSRF
VSSRF ANT
10 11
FSKOUT
RFXTAL
PIC12F629/675/PIC16F630/676
DS41191D-page 4 © 2005 Microchip Technology Inc.
2.0 PROGRAM MODE ENTRY
2.1 User Program Memory Map
The user m emory space extends from 0 x0000-0x1FFF.
In Programming mode, the program memory space
extends from 0x0000-0x3FFF, the first half (0x0000-
0x1FFF) is user program memory and the second half
(0x2000 -0x3FFF ) is configu ratio n memory. The PC will
increment from 0x0000-0x1FFF and wrap to 0x000,
0x2000-0x3FFF and wrap around to 0x2000 (not to
0x0000 ). Once in co nfigura tion mem ory, the highes t bit
of the PC remains a ‘1’, thus always pointing to the
configu ration memo ry . The only way t o point t o the user
program memory is to reset the part and re-enter
Program/Verify mode as described in Section 2.3
“Program/Verify Mode”.
In the configuration memory space, 0x2000-0x201F are
physically implemented. However , only locations 0x2000-
0x2003 and 0x2007 are available. Other locations are
reserved.
2.2 ID Locations
A user may store iden tification information (ID) in four ID
locations. The ID locations are mapped in [0x2000:
0x2003]. It is recommended that the user use only the
seven Least Significant bits (LSb) of each ID location.
Locations read out normally, even after code protection.
The ID locations read out in an unscrambled fashion
after code protection is enabled. It is recommended that
ID location is written as “xx xxxx xbbb bbbb” where
‘bbb bbbb’ is ID information.
The 14 b its m ay be pro grammed, but only the LSbs are
disp layed by MPLA B® IDE. xxxx’ s are “don’t care ” bits
as they won’t be read by MPLAB® IDE.
FIGURE 2-1: PROGRAM MEMORY MAPPING
1FFF
2000
ID Location
ID Location
ID Location
ID Location
Reserved
Reserved
Reserved
Configuration Word
2008
3FFF
03FE
Implemented
1KW
Implemented
400
03FF Implemented
03FF OSCCAL
Maps to
0-3FF
Maps to
2000-201F
Reserved
201F
2000
2001
2002
2003
2004
2005
2006
2007
© 2005 Microchip Technology Inc. DS41191D-page 5
PIC12F629/675/PIC16F630/676
2.3 Program/Verify Mode
The Program/Verify mode is entered by holding pins clock
and data low while raising MCLR pin from VIL to VIHH
(high voltage). Apply VDD and data. Once in this mode,
the user program memory , data memory and the configu-
ration memory can be accessed and programmed in
serial fashion. Clock is Schmitt Trigger and data is TTL
input in this mode. GP4 (PIC12F629/675) or RA4
(PIC16F630/676) is tri-state, regardless of use setting.
The seque nce that enters the de vice in to the Program -
ming/Verify mode places all other logic into the Reset
state (the MCLR pin was initially at VIL). This means
that all I/O’s are in the Reset state (high-impedance
inputs).
FIGURE 2-2: ENTERING HIGH
VOLTAGE PROGRAM/
VERIFY MODE
The normal sequence for programming is to use the
Load Data command to set a value to be written at the
selected address. Issue the Begin Programming
command followed by a Read Data command to verify
and then increment the address.
A devic e Reset will c lear the P C and set t he add ress to
‘0’. The Increment Address command will increment
the PC. The Load Configuration command will set the
PC to 0x2000. The available commands are shown in
Table 2-1.
2.3.1 SERIAL PROGRAM/VERIFY
OPERATION
The clock pin is used as a clock input pin and the data
pin is used for entering command bits and data input/out-
put during serial operation. To input a command, the
clock pin (CLOCK) is cycled six times. Each command
bit is latched on the falling e dge of the clock with the LSb
of the command being input first. The data on pin DATA
is required to have a minimum setup and hol d time (see
Table 5-1), with respect to the falling edge of the clock.
Commands that have data associated with them (Read
and Load) are specified to have a minimum delay of 1 μs
between the com mand and the data. After this d elay , the
clock pin is cycled 16 times with the first cycle being a
Start bit and the last cycle being a Stop bit. Data is also
input and output LSb first.
Therefore, during a read operation, the LSb will be
transmitted onto pin DATA on the rising edge of the
second cycle. During a load operation, the LSb will be
latched on the falling edge of the second cycle. A
minimum 1 μs delay is also specified between
consecutive commands.
All command s are transmitted LSb first . Data words are
also transmitted LSb first. The data is transmitted on
the rising edge and latched on the falling edge of the
clock . To allow for decod ing of comm ands and reve rsal
of data pin configuration, a time separation of at least
1μs is required between a command and a data word
(or another command).
The commands that are available are described in
Table 2-1.
TABLE 2-1: COMMAND MAPPING FOR PIC12F629/675/PIC16F630/676
VPP
THLD0
DATA
SDATA = Input
CLOCK
VDD
TPPDP
Command Mapping (MSb … LSb) Data
Load Configuration XX00000, data (14), 0
Load Data for Program Memory XX00100, data (14), 0
Load Data for Data Memory XX00110, data (8), zero (6), 0
Read Data from Program Memory XX01000, data (14), 0
Read Data from Data Memory XX01010, data (8), zero (6), 0
Increment Address XX0110
Begin Programming 001000Internally Timed
Begin Programming 011000Externally Timed
End Programming 001010
Bulk Erase Program Memory XX1001Internally Timed
Bulk Erase Data Memory XX1011Internally Timed
PIC12F629/675/PIC16F630/676
DS41191D-page 6 © 2005 Microchip Technology Inc.
2.3.1.1 Load Configuration
After receiving this command, the Program Counter
(PC) will be set to 0x2000. Then, by applying 16 cycles
to the clock pin, the chip will load 14 bits in a data word,
as described above, which will be programmed into the
configuration memory. A description of the memory
mapping schemes of the program memory for normal
operation and Configuration mode operation is shown in
Figure 2-3. After the configuration memory is entered,
the only way to get b ack to the us er program m emory is
to exit the Program/Verify mode by taking MCLR low
(VIL).
FIGURE 2-3: LOAD CONFIGURATION COMMAND
2.3.1.2 Load Data For Program Memory
After receiving this command, the chip will load in a
14-bit data word when 16 cycles are applied, as
described previously. A timing diagram for the Load
Data command is shown in Figure 2-4.
FIGURE 2-4: LOAD DATA FOR PROGRAM MEMORY COMMAND
TSET1
THLD1
TDLY1
TDLY2
12 34 56
0000xx
12 34 5 15
16
strt_bit stp_bit
LSb MSb
0
GP1(1)
GP0(1)
CLOCK
DATA
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
TSET1
THLD1
TDLY1
TDLY2
12 34 56
000xx
12 34 5 15
16
strt_bit stp_bit
LSb MSb
GP1(1)
CLOCK
TSET1
THLD1
01
GP0(1)
DATA
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
© 2005 Microchip Technology Inc. DS41191D-page 7
PIC12F629/675/PIC16F630/676
2.3.1.3 Load Data For Data Memory
After receiving this command, the chip will load in a
14-bit da t a word w hen 16 cyc les are appli ed. How ever,
the data memory is only 8 bits wide and thus, only the
first 8 bits o f d at a afte r the Start bi t wi ll be prog ram me d
into the data memory. It is still necessary to cycle the
clock the full 16 cycles in order to allow the internal
circuitry to reset properly. The data memory contains
128 by tes . O nl y the l ower 8 bits o f t he PC ar e d ec ode d
by the data memory and therefore, if the PC is greater
than 0x7F, it will wrap around and address a location
within the physically implemented memory.
FIGURE 2-5: LOAD DATA FOR DATA MEMORY COMMAND
2.3.1.4 Read Data From Program Memory
After receiving this command, the chip will transmit
data bits out of the program memory (user or
configuration) currently accessed, starting with the
second rising edge of the clock input. The data pin will
go into Output mode on the second rising clock edge
and revert to Input mode (high-impedance) after the
16th rising edge.
If the program memory is co de- protected (C P = 0), the
data is read as zeros.
FIGURE 2-6: READ DATA FROM PROGRAM MEMORY COMMAND
TDLY1
TDLY2
12 34 56
1100
xx
12 34 515
16
TDLY3
Input Output Input
strt_bit stp_bit
LSb MSb
GP1(1)
CLOCK
GP0(1)
DATA
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
TDLY1
TDLY2
12 34 56
xx
12 34 515
16
TDLY3
Input Output Input
strt_bit stp_bi
t
LSb MSb
GP1(1)
CLOCK
GP0(1)
DATA TSET1THLD1
000
1
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
PIC12F629/675/PIC16F630/676
DS41191D-page 8 © 2005 Microchip Technology Inc.
2.3.1.5 Read Data From Data Memory
After receiving this command, the chip will transmit data
bits out of the data memory starting with the second
rising edge of the clock input. The data pin will go into
Output mode on the second rising edge and revert to
Input mode (high-impedance) after the 16th ris ing edge.
As previously stated, the data memory is 8 bits wide and
therefore, only the first 8 bits that are output are actual
data. If the data memory is code-protected, the data is
read as all zeros. A timing diagram of this command is
shown in Figure 2-7.
FIGURE 2-7: READ DATA FROM DATA MEMORY COMMAND
2.3.1.6 Increment Address
The PC is incremented when this command is
received. A timing diagram of this command is shown
in Figure 2-8.
It is not possible to decrement the address counter. To
reset this counter, the user should exit and re-enter
Programming mode.
FIGURE 2-8: INCREMENT ADDRESS COMMAND (PROGRAM/VERIFY)
TDLY1
TDLY2
12 34 56
xx
12 34 515
16
TDLY3
Input Output Input
strt_bit stp_bit
LSb MSb
GP1(1)
CLOCK
GP0(1)
DATA TSET1THLD1
100
1
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
TDLY1
TSET1
THLD1
TDLY2
1234 56
011 xx
12
x0
0
Next Command
GP1(1)
CLOCK
GP0(1)
DATA
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
© 2005 Microchip Technology Inc. DS41191D-page 9
PIC12F629/675/PIC16F630/676
2.3.1.7 Beg in Programmi ng (Internally
Timed)
A Load command must be given before every Begin
Programming command. Programming of the appropriate
memory (user program memory or data memory) will
begin after this command is received and decoded. An
internal timing mechanism executes a write. The user
must allow for program cycle time for programming to
complete. No End Programming command is required.
When programming data memory, the byte being
addressed is erased before being programmed.
FIGURE 2-9: BEGIN PROGRAMMING COMMAND (INTERNALLY TIMED)
GP1(1)
GP0(1)
Program/Verify Te st mode
TSET1
THLD1
TPROG1
12 3 4 56 12
x0
Next Command
010
00 0
TDLY1
CLOCK
DATA
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
PIC12F629/675/PIC16F630/676
DS41191D-page 10 © 2005 Microchip Technology Inc.
2.3.1.8 Begin Programming (Externally
Timed)
A Load command must be given before every Begin
Programming command. Programming of the appropriate
memory (user program memory or data memory) will
begin after this command is received and decoded.
Programming requires (TPROG2) time and is terminated
using an End Programming command (see Fi gure 2-11).
This command programs the current location, no erase is
performed.
FIGURE 2-10: BEGIN PROGRAMMING (EXTERNALLY TIMED)
FIGURE 2-11: END PROGRAMMING (SERIAL PROGRAM/VERIFY)
MCLR VIHH
ICSPCLK
ICSPDAT
Reset Program/Verify Test mode
TSET1
THLD1
TPROG2
123456
000 1
12
100 ns min.
}
}
x0
1
End Programming command
TDLY1
1 μs min.
0
MCLR VIHH
ICSPCLK
ICSPDAT
Reset Program/Verify Test mode
TSET1
THLD1
123456
010 0
12
100 ns min.
}
}
x0
1
Next Command
TDLY1
1 μs min.
0
© 2005 Microchip Technology Inc. DS41191D-page 11
PIC12F629/675/PIC16F630/676
2.3.1.9 Bulk Erase Program Memory
After this command is performed and Calibration bits are
erased, the entire program memory is erased. If data is
code-protected, data m emory w ill als o be erased.
To perform a bulk erase of the program memory, the
following sequence must be performed.
1. Read OSCCAL 0x3FF.
2. Verify RETLW instruction for OSCCAL location.
3. Read Configuration Word.
4. Do a Bulk Erase Program Memory command.
5. Wait TERA to complete bulk erase.
If the address is pointing to the ID/configuration
progra m memo ry (0x2000 -0x201 F), then both the user
memory and the ID locations will be erased.
FIGURE 2-12: BULK ERASE PROGRAM MEMORY COMMAND
Note 1: The OSCCAL word and BG bits must be
read prior to erasing the device and
restored during the programming
operation. OSCCAL is at location 0x3FF
and th e BG bi ts are bits 12 and 13 of the
Configuration Word (0x2007).
2: The OSCCAL location must contain the
RETLW inst ruction within its data in order
to be verified properly. The data in the
OSCCAL location should be ‘11 01xx
xxxx xxxx,’ where the x’s are “don’t
care” bits and are ignored by the
programmer.
GP1(1)
GP0(1)
Program/Verify Test mode
TSET1
THLD1
TERA
12 3 4 56 12
x0
Next Command
11x
00 x
TDLY1
CLOCK
DATA TSET1
THLD1
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
PIC12F629/675/PIC16F630/676
DS41191D-page 12 © 2005 Microchip Technology Inc.
2.3.1.10 Bulk Erase Data Memory
To perform a bulk erase of the data memory, the
following sequence must be performed.
1. Do a Bulk Erase Data Memory command.
2. Wait TERA to complete bulk erase.
Dat a memo ry won’t er ase if code-p rote cted (CPD = 0).
FIGURE 2-13: BULK ERASE DATA MEMORY COMMAND
Note: All bulk erase operations must take place
at 4.5V to 5.5V VDD range for PIC12F 629/
675/PIC16F630/676 devices and 2.0V to
5.5V VDD for PIC16F630-ICD device.
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
GP1(1)
GP0(1)
Program/ Verify Test mode
TSET1
THLD1
TERA
12 3 4 56 12
x0
Next Command
11
10 x
TDLY1
CLOCK
DATA x
© 2005 Microchip Technology Inc. DS41191D-page 13
PIC12F629/675/PIC16F630/676
FIGURE 2-14: PROGRAM FLOWCHART – PIC12F629/675/PIC16F630/676 PROGRAM MEMORY
Start
Program Cycle
Read Data
Program Memory
Data Corr ect? Report
Programming
Failure
All Locations
Done?
Verify all
Locations
Data Correct?
Done
Begin
Programming
Wait TPROG1
Program Cycle
No
No
No
Read and Save
Program
OSCCAL
OSCCAL val ue
Increment
Address
Command
from
Bulk Erase
Device
Read and Save
Band Gap Cal.
Value
Report Verify
Error
Program
Band Gap Ca l.
and Config. bits
Program Data
Memory
(if required)
Load Data
for
Program Memory
Yes
Yes
Command
(Internal ly tim ed)
Begin
Programming
Wait TPROG2
Command
(Externally timed)
End
Programming
Yes
No Report OSCCAL
Instruction
Error
RETLW Instruction
Correct?
PIC12F629/675/PIC16F630/676
DS41191D-page 14 © 2005 Microchip Technology Inc.
FIGURE 2-15: PROGRAM FLOWCHART – PIC12F629/675/PIC16F630/676 CONFIGURATION
MEMORY
Start
Load
Configuration
Data
Program Cycle
Read Data
Command
Data Correct? Report
Programming
Failure
Address =
0x2004?
Program
Cycle
(Config. Word)
Read Data
Command
Data Correct? Report
Programming
Failure
Done
Yes
No
Yes
Yes
No
Increment
Address
Command
No Increment
Address
Command
Increment
Address
Command
Increment
Address
Command
Set Bits 1 2 and
13 to Saved
Band Gap Bits
© 2005 Microchip Technology Inc. DS41191D-page 15
PIC12F629/675/PIC16F630/676
FIGURE 2-16: PROGRAM FLOWCHART – PIC12F629/675/PIC16F630/676 DATA MEMORY
Start
Program Cycle
Read Data
Data Memory
Data Correct? Report
Programming
Failure
All Locations
Done?
No
No
Increment
Address
Command
from
Yes
Yes
Done
Begin
Programming
Wa it TPROG1
Program Cycle
Load Data
for
Program Memory
Command
(Internally timed)
Begin
Programming
Wait TPROG2
Command
(Externally timed)
End
Programming
PIC12F629/675/PIC16F630/676
DS41191D-page 16 © 2005 Microchip Technology Inc.
FIGURE 2-17: PROGRAM FLOWCHART – PIC12F629/675/PIC16F630/676 ERASE FLASH
MEMORY
Read and Save
OSCCAL Value
Read and Save
Band Gap Cal.
Value
Bulk Erase Device
Program
OSCCAL
Program
Band Gap Cal.
Bits
Start
Done
RETLW Instruction
Correct? Report OSCCAL
Instruction Error
Yes
No
© 2005 Microchip Technology Inc. DS41191D-page 17
PIC12F629/675/PIC16F630/676
3.0 CONFIGURATION WORD
The PIC12F629/675/PIC16F630/676 has several
Configuration bits. These bits can be programmed
(reads ‘0’) or left unchanged (reads ‘1’) to select
various device configurations.
REGISTER 3-1: CONFIGURATION WORD FOR PIC12F629/675/PIC16F630/676
R/P-1 R/P-1 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
BG1 BG0 ———CPD CP BODEN MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 13 bit 0
bit 13-12 BG<1:0>: Band Gap Calibration bits(2)
00 = Lowest band gap voltage
...
11 = Highest band gap voltage
bit 11-9 Unimplemented: Read as ‘0’
bit 8 CPD: Code Protection Da t a bit
1 = Data memory is not protected
0 = Data memory is external read protected
bit 7 CP: Code Protection bit
1 = Program memory is not code-protected
0 = Program memory is code-protected
bit 6 BODEN: Brown-out Detect Enable bit(1)
1 = BOD enabled
0 = BOD disa bled
bit 5 MCLRE: MCLR Pin Function Select bit
1 = MCLR pin is MCLR function
0 = MCLR pin is alternate function, MCLR function is internally disabled
bit 4 PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enab led
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits(3)
000 = LP oscillator: Low-power cryst al on GP5 /T1CKI/OSC1/CLKIN and G P4/T1G/OSC2/CLKOUT
001 = XT oscillator: Cryst al/resonator on GP 5/T1CKI/OSC1/CLKIN and GP4/T1G/OSC2/CLKOUT
010 = HS oscillator: High-speed crystal /resonator on GP 5/T1CKI/OSC1/CLKIN and GP4/T1G/OSC2/CLKOUT
011 = EC: I/O function on GP4/T1G/OSC2/CLKOUT, CLKIN on GP5/T1CKI/OSC1/CLKIN
100 = INTO SC oscillator: I/O functi on on GP4/T1G/OSC2/CLKOUT, I/O function on GP5/T1CKI/OSC1/CLKIN
101 = INTOSC oscillator: CLKOUT function on GP4/T1G/OSC 2/CLKOUT, I/O function on GP5/T1CKI/OSC1/
CLKIN
110 = RC oscillator: I/O function on G P4/T1G/OSC2/CLKOUT, RC on GP5/T1CKI/OSC1/CLKIN
111 = RC oscillator: CLKOUT function on GP4/T1G/OSC2/CLKOUT, RC on GP5/T1CKI/OSC1/CLKIN
Note 1: Enabling Brown-out Detect Reset Enable does not automatically enable the Power-up Timer
Enable (PWRTE).
2: The Band Gap Cal ibration b its m ust be read and preserved, th en replac ed by t he user d uring any
bulk erase operation.
3: GP4 and GP5 apply to PIC12F629/675 only. For PIC16F630/676, use RA4 and RA5,
respectively.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PIC12F629/675/PIC16F630/676
DS41191D-page 18 © 2005 Microchip Technology Inc.
3.1 Device ID W ord
The device ID word for each device is located at 2006h.
TABLE 3-1: DEVICE ID VALUES
Device Device ID Value
Dev Rev
PIC12F629 00 1111 100 x xxxx
PIC12F675 00 1111 110 x xxxx
PIC16F630 01 0000 110 x xxxx
PIC16F676 01 0000 111 x xxxx
© 2005 Microchip Technology Inc. DS41191D-page 19
PIC12F629/675/PIC16F630/676
4.0 CODE PROTECTION
For PIC12F629/675/PIC16F630/676 devices, once
code protection is enabled, all program memory loca-
tions, except 0 X3FF, reads all ‘0’s. The ID locations and
the Configuration Word read out in an unprotected
fashion. Further programming is disabled for the entire
program memory. Data memory is protected with its
own Code Protection Data bit (CPD). It is possible to
progra m the ID loca tion s and the Conf igu rati on Word.
4.1 Disabling Code Protect ion
It is recommended that the following procedure be
performe d before a ny other programming is attem pted.
It is also possible to turn code protection off (CPD = 1)
using this procedure. However, all data within the
program memory and the data memory will be erased
when th is proc ed ure is e xe cu ted and thu s, th e s ec urit y
of the data or code is not compromised.
To disable code-protect:
a) Read and store OSCCAL and BG bits.
b) Execute Load Configuration (000000).
c) Execute Bulk Erase Program Memory (001001).
d) Wait TERA.
e) Execute Bulk Erase Data Memory (001011).
f) Wait TERA.
g) Reset device to reset address counter before
reprogram mi ng dev ic e.
h) Restore OSCCAL and BG bits.
4.2 Embedding Configurati on Word and ID Information in the Hex File
Note: To en sure syst em secu rity, if CPD bi t = 0,
step c) will also erase data memory.
To allow po rtab ility of co de, th e prog ramme r is require d to re ad th e Confi guratio n W ord and ID loc ations from the h ex
file wh en loa ding the he x fil e. If C onfi guratio n W ord i nfor mation was n ot pre sent i n the hex file, t hen a si mple warning
message may be issued. Similarly, while saving a hex file, Configuration Word and ID information must be included.
An option to not include this information may be provided.
Specifically for the PIC12F629 /675/PIC16F630/676 , the EEPROM dat a memory shou ld also be em bedded in the h ex
file (see Section 4.3.2 “Embedding Data EEPROM Contents In Hex File”).
Microchip Technology Incorporated feels strongly that this feature is important for the benefit of the end customer.
PIC12F629/675/PIC16F630/676
DS41191D-page 20 © 2005 Microchip Technology Inc.
4.3 Checksum Computation
4.3.1 CHECKSUM
Checksum is calculated by reading the contents of the
PIC12F629/675/PIC16F630/676 memory locations and
adding up the opcodes to the maximum user
addressable location (e.g., 0x3FE for the PIC12F629/
675/PIC16F630/676). Any carry bits exceeding 16 bits
are neglected. Finally, the Configuration Word
(appropriately masked) is added to the checksum.
Checksum computation for the devices is shown in
Table 4-1.
The checksum is calculated by summing the following:
• The conte nts of all program memory locations.
• The Configuration Word, appropriately masked.
• Masked ID locations (when applicable).
The 16 LSbs of this sum is the checksum.
The following table describes how to calculate the
checksum for each device.
TABLE 4-1: CHECKSUM COMPUTATION
4.3.2 EMBEDDING DATA EEPROM
CONTENTS IN HEX FILE
The programmer should be able to read data EEPROM
information from a hex file and conversely (as an option),
write data EEPROM contents to a hex file, along with
program memory information and fuse informatio n.
The 128 data memory locations are logically mapped
startin g at address 0x2100. The forma t for dat a memory
storage is one data byte per address location, LSb
aligned.
Note 1: The checksum calculation differs
depending on the code-protect setting.
Since the program memory location s read
out differently depending on the code-
protect setting, Table 4-1 describes how to
manipulate the actual program memory
values to simulate the values that would
be read from a protected device. When
calculating a checksum by reading a
device, the entire program memory can
simply be read and summed. The
Configuration Word and ID locations can
always be read.
2: Some older devices have an additional
value added in the checksum. This is to
maintain compatibility with older device
programmer checksums.
Device Code-Protect Checksum*Blank
Value 0x25E6 at 0 and
Max. Address
PIC12F629/675/
PIC16F630/676 OFF SUM[0x0000:0x3FE] + CFGW & 01FF BE00 89CE
ALL CFGW & 0x01FF + SUM_ID BF7F 8B4D
Legend: CFGW = Configuration Word
SUM[a:b] = [Sum of locations a to b inclusive]
SUM_ID = ID locations masked by 0xF then made into a 16-bit value with ID0 as the Most Significant
nibble.
For example: ID0 = 0x1, ID1 = 0x2, ID3 = 0x3, ID4 = 0x4, then SUM_ID = 0x1234
*Checksum = [Sum of all the individual expressions] MODULO [0xFFFF]
+ = Addition
& = Bitwise AND
© 2005 Microchip Technology Inc. DS41191D-page 21
PIC12F629/675/PIC16F630/676
5.0 PROGRAM/VERIFY MODE ELECTRICAL CHARACTERISTICS
TABLE 5-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY
MODE
AC/DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C ≤ TA ≤ +85°C
Operating Voltage 4.5V ≤ VDD ≤ 5.5V
Sym. Characteristics Min. Typ. Max. Units Conditions/Comments
General
VDD VDD level for word operations,
program memory 2.0
4.5 —5.5
5.5 V
VPIC16F630-ICD
PIC12F629/675,
PIC16F630/676
VDD VDD level for word operations, data
memory 4.5 —5.5 V
VDD VDD level for bulk erase/write
operat ion s, p rog ram and data memory 4.5 —5.5 V
VIHH High voltage on MCLR for
Programming mode entry VDD + 3.5 —13.5 V
TVHHR MCLR rise time (VSS to VHH) for
Programming mode entry ——
1.0 μs
TPPDP Hold time after VPP ↑5——μs
VIH1(CLOCK, DATA) input high level 0.8 VDD ——V
VIL1(CLOCK, DATA ) input low level 0.2 VDD ——V
TSET0CLOCK, DATA setup time before
MCLR↑ (Programming mode
selection pattern setup time) 100 ——ns
THLD0CLOCK, DATA hold time after MCLR ↑
(Programming mode selection pattern
setup time) 5——μs
Serial Program/Verify
TSET1Data in setup time before clock↓100 ——ns
THLD1Data in hold time after clock↓100 ——ns
TDLY1Data input not driven to next clock input
(delay required between command/data
or command/command) 1.0 ——μs
TDLY2Delay between clock↓ to clock↑ of
next comm and or data 1.0 ——μs
TDLY3Clock↑ to data out valid (during read
data) ——80 ns
TERA Erase cycle time —48ms
TPROG1Programming cycle time (internally
timed) —5
26
2.5 ms Data Me mory
Program Memor y
TPROG2Programming cycle time (externally
timed) 2—2ms
10°C ≤ TA ≤ +40°C
Program Memor y
TDIS Time delay from program to compare
(HV discharge time) 0.5 ——μs
PIC12F629/675/PIC16F630/676
DS41191D-page 22 © 2005 Microchip Technology Inc.
NOTES:
© 2005 Microchip Technology Inc. DS41191D-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIN D WHETHER EXPRESS OR IMPLIED ,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. U se of Microc hip’s products as critical com ponents in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART ,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporat ed in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Ther mist or,
MPASM, MPL I B, MP LINK , MPSIM, PICkit, PICD EM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, Powe rTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporat ed in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that it s family of products is one of the most secure families of it s kind on the market t oday, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microchip are commit ted to continuously improving the code protect ion featur es of our
products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS41191D-page 24 © 2005 Microchip Technology Inc.
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