ASHL-0004-ES REV A
C. WANG
S. YAO
I. ENOMOTO
108-60047
ES
LOC
TITLE
Tyco Electronics
AMP Shanghai Ltd
PAGE
1 of 7
LTR
DIST
REVISION RECORD
DR
DATE
C.W
O
28JAN
04
0.6 mm Pitch Board to Board Connector, Free Height
Ty
pe
Lead free version
RELEASED FB00-0019-05
DR
CHK
APP NO REV
O
108-60047
Product Specification
0.6 mm Pitch Board to Board Connector, Free Height Type
Lead Free version
1. Scope:
1.1 Contents:
This specification covers the requirements for product performance, test methods and quality
assurance provisions of 0.6mm Pitch Board to Board Connector, Free Height Type, lead free
version.
2. Applicable Documents:
The following documents form a part of this specification to the extent specified herein. In the
event of conflict between the requirements of this specification and the product drawing, the
product drawing shall take precedence. In the event of conflict between the requirements of this
specification and the referenced documents, this specification shall take precedence.
2.1 AMP Specifications:
A. 109-5000 Test Specification, General Requirements for Test Methods
B. 501-60025 Test Report
2.1 Commercial Standards and Specifications:
A. MIL-STD-202 Test Methods for Electronic and Electric Parts.
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3. Requirements:
3.1 Design and Construction:
Product shall be of the design, construction and physical dimensions specified on the applicable
Product drawing.
3.2 Materials:
A. Contact : Copper Alloy
B. Housing : Thermo Plastic Molded Compound: L. C. P
C. Other : Ground-Plate Copper Alloy
3.3 Ratings:
A. Voltage Rating : 50 VAC
B. Current Rating : 0.5 A
C. Temperature Rating : -40°C TO 85°C
3.4 Performance Requirements and Test Descriptions:
The product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Fig. 2. All tests shall be performed in the room temperature, unless
otherwise specified.
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3.5 Test Requirements and Procedures Summary:
Para. Test Items Requirements Procedures
3.5.1
Confirmation of
Product Product shall be conforming to
the requirements of applicable
product drawing and
Application Specification.
Visually, dimensionally and
functionally inspected per
applicable quality inspection plan.
Electrical Requirements
3.5.2
Termination Resistance
(Low Level) 55 m Max. (Initial)
R=20 m Max. (Final)
Subject mated contacts assembled
in housing to 20 mV Max. open
circuit at 10 mA.
Fig. 1
AMP Spec. 109-5311-1
3.5.3
Dielectric withstanding
Voltage No creeping discharge nor
flashover shall occur.
Current leakage: 5 mA Max.
0.2 k VAC for 1 minute.
Test between adjacent circuits of
mated connectors.
AMP Spec. 109-5301
3.5.4
Insulation Resistance 500 M Min. (Initial)
100 M Min. (Final)
Impressed voltage 500 V DC.
Test between adjacent circuits of
mated connectors.
AMP Spec. 109-5302
3.5.5
Capacitance 5 p F Max. Test between the adjacent circuits
of mated connector.
MIL-STD-202 Method 305
1 kHz
3.5.6
Connector Mating
Force 0.9 N (90 gf) Max. per contact Operation Speed: 100mm/min.
Measure the force required to mate
connectors.
AMP Spec. 109-5206
3.5.7
Contact Unmating
Force 0.1 N (10 gf) min per contact. Operation Speed: 100 mm/min.
Measure the force required to
unmate connectors.
AMP Spec. 109-5206
Fig. 2 (To be continued)
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Para. Test Items Requirements Procedures
3.5.8 Durability (Repeated
Mate/Unmating)
R=20 m Max. (Final) Operation Speed : 100mm/min
No. of Cycles : 50 cycles.
AMP Spec. 109-5213
3.5.9 Vibration
(Low Frequency)
No electrical discontinuity
greater than 0.1 µsec. Shall
occur.
Subject mated connectors to 10-55-
10 Hz traversed in 1 minute at 1.52
mm amplitude 2 hours each of 3
mutually perpendicular planes.
100 mA applied.
AMP Spec. 109-201
3.5.10 Shock No electrical discontinuity
greater than 0.1 µsec. Shall
occur.
Accelerated Velocity: 50G
Waveform : Saw tooth shock pluse
Duration : 11 m sec.
Velocity Change : 11.3m/s²
Number of Drops : 3 drops each to
normal and reversed directions of X,
Y and Z axes, totally 18 drops
AMP Spec. 109-5208
3.5.11 Solderability Wet Solder Coverage:
95% Min.
Solder Temperature: 230±5°C
Immersion Duration: 3±0.5 seconds
Flux: Alpha 100
AMP Spec. 109-5203
Environmental Requirements
3.5.12 Resistance to Cold R= 20 m Max. (Final) Mated Connector
-40˚C±3°C, 96 hours
AMP Spec. 109-5108 Condition
3.5.13 Thermal Shock R=20 m Max. (Final) Mated connector -40˚C/30 min,
85˚C/30 min.
Making this a cycle, repeat 5 cycles.
AMP Spec. 109-5103 Condition
3.5.14 Humidity-Temperature
Cycling Insulation resistance (Final)
100 M Min.
Termination resistance
R=20 m Max. (Final)
Mated connector, 25~65˚C,
95% R. H. 10 cycles
Fig. 1 (To be continued)
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Para. Test Items Requirements Procedures
3.5.15 Salt Spray R=20 m Max. (Final) Subject mated connectors to 5% salt
concentration for 24 hours: MIL-
STD-202, Method 101 AMP Spec.
109-5101
3.5.16 Resistance to Reflow
Soldering Heat Tested housing shall show no
evidence of deformation or
fusion of housing and no
physical damage.
Test connector on PCB.
Pre-Heat 150~180˚C: 90±30 sec
min.
Heat over than 230˚C: 30±10 sec .
Heat Peak: 250+5/-0˚C Max.
3.5.17 Industrial Gas (SO
2)
R= 20 m Max. (Final) Mated connector SO
2
Gas: 10 ppm,
95% R. H.
25˚C, 24 hours
AMP Spec. 109-5107
3.5.18 Temperature Life (Heat
Aging)
R= 20 m Max. (Final) 85˚C, Duration: 4 days
AMP Spec. 109-5104
Fig. 2 (End)
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3.6 Product Qualification Test Sequence
Test Group
1 2 3 4 5 6 7 8 9 10 11 12
Test of Examination
Test Sequence (a)
Confirmation of Product 1,9 1,3 1,9 1,5 1,5 1,3 1,5 1,5 1,5 1,3 1,5 1,5
Termination Resistance (Low
Level) 2,6 2,8 2,4 2,4 2,4 2,4 2,4 2,4 2,4
Dielectric withstanding Voltage 3,7
Insulation Resistance 4,8
Capacitance 2
Vibration (Low Frequency) 3
Physical Shock 3
Connector Mating Force 3,6
Connector Unmating Force 4,7
Durability (Repeated
Mate/Unamting) 5
Solderability 2
Humidity-Temperature Cycling 5
Resistance to Reflow Soldering
Heat 2
Thermal Shock 3
Salt Spray 3
Industrial Gas (SO
2
) 3
Temperature Life (Heat Aging) 3
Resistance to Cold 3
(a) Numbers indicate sequence in which tests are performed.
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