All specifications are subject to change without notice.
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
ACB series
Type:
Issue date:
HFxxACB2012 [0805 inch]*
HFxxACB3216 [1206 inch]
HFxxACB3225 [1210 inch]
HFxxACB4532 [1812 inch]
* Dimensions Code [EIA]
September 2012
Chip Beads
For signal line
(1/3)
001-03 / 20120918 / e9415_hf_acb.fm
• All specifications are subject to change without notice.
Chip Beads
For Signal Line
ACB Series
HFxxACB2012, HFxxACB3216, HFxxACB3225, HFxxACB4532
FEATURES
This extensive series completely covers impedance values
ranging from 7 to 125[100MHz] and can be applied to a wide
range of circuits.
The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30
materials. The most suitable component can be selected for the
circuit pattern and the suppression band.
These components are applicable for both flow and reflow
solderings, and have outstanding physical characteristics such
as excellent terminal strength, body strength, resistance to
soldering heat, solderability and mounting reliability.
Available reflow soldering.
It is a product conforming to RoHS directive.
PRODUCT IDENTIFICATION
(1) Material name
(2) Series name
(3) Dimension code
(4) Packaging style
T: ø180mm reel taping
TL: ø330mm reel taping
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
REFLOW SOLDERING
Dimensions in mm
Conformity to RoHS Directive
HF70 ACB 201209 - T
(1) (2) (3) (4)
Operating temperature range –40 to +125°C
Storage temperature range –40 to +125°C(After mount)
Packaging style Type Quantity
Taping
201209 2000 pieces/reel
321611 2000 pieces/reel
322513 2000 pieces/reel
453215 1000 pieces/reel
Ty p e L W T D
201209 2.0±0.2 1.25±0.2 0.9±0.2 0.3±0.2
321611 3.2±0.2 1.6±0.2 1.1±0.2 0.3±0.2
322513 3.2±0.2 2.5±0.2 1.3±0.2 0.3±0.2
453215 4.5±0.25 3.2±0.25 1.5±0.25 0.3±0.2
Ty p e a b c
201209 1.0 1.0 1.0
321611 1.1 2.2 1.4
322513 1.1 2.2 2.3
453215 1.5 3.0 3.0
L
W
D
T
Terminal
electrode
Ferrite
Insulation resin
No directionality
aba
c
Resist
Land pattern
Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(2/3)
001-03 / 20120918 / e9415_hf_acb.fm
• All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
HF70ACB201209 HF50ACB201209 HF30ACB201209
HF70ACB321611 HF50ACB321611 HF30ACB321611
HF70ACB322513 HF50ACB322513 HF30ACB322513
TEST EQUIPMENT:RF IMPEDANCE ANALYZER YHP4191A
Ty p e Pa r t N o. Impedance
()[100MHz]
DC
resistance
()max.
Rated
current
(mA)max.
201209
HF70ACB201209 10±25% 0.1 600
HF50ACB201209 11±25% 0.1 600
HF30ACB201209 7±25% 0.1 600
321611
HF70ACB321611 26±25% 0.2 500
HF50ACB321611 31±25% 0.2 500
HF30ACB321611 19±25% 0.2 500
322513
HF70ACB322513 52±25% 0.3 400
HF50ACB322513 60±25% 0.3 400
HF30ACB322513 31±25% 0.3 400
453215
HF70ACB453215 120±25% 0.4 300
HF50ACB453215 125±25% 0.4 300
HF30ACB453215 70±25% 0.4 300
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
RX
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
(3/3)
001-03 / 20120918 / e9415_hf_acb.fm
• All specifications are subject to change without notice.
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
HF70ACB453215 HF50ACB453215 HF30ACB453215
TEST EQUIPMENT:RF IMPEDANCE ANALYZER YHP4191A
PACKAGING STYLES
201209 TO 322513 TYPES
REEL DIMENSIONS
TAPE DIMENSIONS
453215 TYPE
REEL DIMENSIONS
TAPE DIMENSIONS
RX
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
R
X
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
RX
Z
1000
Frequency(MHz)
100
10
11 10 100 1000
Z, X, R(Ω)
Type ABCDT
201209 1.4±0.1 2.25±0.1 4.0±0.1 2.0±0.05 1.25max.
321611 1.75±0.1 3.45±0.1 4.0±0.1 2.0±0.05 1.4max.
322513 2.6±0.1 3.45±0.1 4.0±0.1 2.0±0.05 1.6max.
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
B
1.75±0.1
TA4.0±0.1 CD
Sprocket
hole 1.5
+0.1
–0.0
Dimensions in mm
0.2 to 0.35 Cavity
40 to 80 Taping 200min.
300min.
Drawing direction
Dimensions in mm
TypeABCDT
453215 3.37±0.1 4.75±0.1 8.0±0.1 2.0±0.05 1.8max.
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
17.0±1.4
13.0±0.3
Dimensions in mm
12.0±0.3 5.5±0.05
B
1.75±0.1
TA
4.0±0.1
D
C
Sprocket
hole 1.5
+0.1
–0.0
Dimensions in mm
0.3 to 0.4 Cavity
40 to 80 Taping 200min.
300min.
Drawing direction
Dimensions in mm