TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
PRODUCT INFORMATION
1
MAY 1989 - REVISED MARCH 1997Copyright © 1997, Power Innovations Limited, UK
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
●20 W Pulsed Power Dissipation
●100 V Capability
●2 A Continuous Collector Current
●4 A Peak Collector Current
LP PACKAGE
(TOP VIEW)
MDTRAB
E
C
B
1
2
3
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.
3. VCE = 20 V, IC = 1 A, PW = 10 ms, duty cycle ≤ 2%.
RATINGSYMBOLVALUEUNIT
Collector-base voltage (IE = 0)TIPP115
TIPP116
TIPP117VCBO
-60
-80
-100V
Collector-emitter voltage (IB = 0)TIPP115
TIPP116
TIPP117VCEO
-60
-80
-100V
Emitter-base voltageVEBO-5V
Continuous collector current IC-2A
Peak collector current (see Note 1)ICM-4A
Continuous base current IB-50mA
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)Ptot0.8W
Pulsed power dissipation (see Note 3)PT20W
Operating junction temperature rangeTj-55 to +150°C
Storage temperature rangeTstg-55 to +150°C
Lead temperature 3.2 mm from case for 10 secondsTL260°C
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
2
MAY 1989 - REVISED MARCH 1997
PRODUCT INFORMATION
NOTES: 4. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
electrical characteristics at 25°C case temperature
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V(BR)CEOCollector-emitter
breakdown voltageIC = -10 mA
(see Note 4)IB = 0TIPP115
TIPP116
TIPP117
-60
-80
-100V
ICEOCollector-emitter
cut-off current
VCE= -30 V
VCE= -40 V
VCE= -50 V
VBE =0
VBE =0
VBE =0
TIPP115
TIPP116
TIPP117
-2
-2
-2mA
ICBOCollector-base
cut-off current
VCE= -60 V
VCE= -80 V
VCE= -100 V
IB=0
IB=0
IB=0
TIPP115
TIPP116
TIPP117
-1
-1
-1mA
IEBOEmitter cut-off
currentVEB = -5 VIC=0-2mA
hFEForward current
transfer ratioVCE = -4 V
VCE = -4 VIC=-1A
IC= -2A(see Notes 4 and 5)1000
500
VCE(sat)Collector-emitter
saturation voltageIB = -8 mAIC=-2A(see Notes 4 and 5)-2.5V
VBEBase-emitter
voltageVCE = -4 VIC= -2 A(see Notes 4 and 5)-2.8V
VECParallel diode
forward voltageIE = -4 AIB=0(see Notes 4 and 5)-3.5V
3
MAY 1989 - REVISED MARCH 1997
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
PRODUCT INFORMATION
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
MECHANICAL DATA
ALL LINEAR DIMENSIONS IN MILLIMETERS
12,7 MIN.
2,03
2,67
4,44
5,21
3,43 MIN.
4,32
5,34
0,40
0,56
1,14
1,40
2,41
2,67
0,35
0,41
2,03
2,67
3,17
4,19
(see Note A)
Seating Plane
1
2
3
LP003 (TO-92) LP003 Falls Within JEDEC
TO-226AA Dimensions
MDXXAX
1,27
NOTE A: Lead dimensions are not controlled in this area.
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
4
MAY 1989 - REVISED MARCH 1997
PRODUCT INFORMATION
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
MECHANICAL DATA
LP003 (TO-92) - Formed Leads Version
ALL LINEAR DIMENSIONS IN MILLIMETERS
2,03
2,67
4,44
5,21
3,43 MIN.
4,32
5,34
0,40
0,56
2,40
2,90
0,35
0,41
2,03
2,67
3,17
4,19
4,00 MAX.
2,90
2,40
LP003 Falls Within JEDEC
TO-226AA Dimensions
12 3
MDXXAR
5
MAY 1989 - REVISED MARCH 1997
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
PRODUCT INFORMATION
LPR
tape dimensions
MECHANICAL DATA
LP Package (TO-92) Tape (Formed Lead Version)
ALL LINEAR DIMENSIONS IN MILLIMETERS
0,00
0,50
5,50
19,00
8,50
9,75
17,50
19,00
ø
3,70
4,30
12,40
13,00
5,95
6,75
2,40
2,90
8,50
11,00
15,50
16,50
17,66
27,68
23,00
32,00
11,70
13,70
2,50 MIN.
2,90
2,40
4,44
5,21
2,03
2,67
3,43 MIN.
4,32
5,34
4,00 MAX.
0,40
0,56
3,17
4,19
2,03
2,67
0,35
0,41
MDXXAS
TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
6
MAY 1989 - REVISED MARCH 1997
PRODUCT INFORMATION
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1997, Power Innovations Limited
