© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 1
One world. One KEMET
Overview
KEMET’s high voltage surface mount MLCCs in X7R
Dielectric feature a 125°C maximum operating temperature
and are considered “temperature stable.” The Electronics
Industries Alliance (EIA) characterizes X7R dielectric as a
Class II material. Components of this classication are xed,
ceramic dielectric capacitors suited for bypass and decoupling
applications or for frequency discriminating circuits where Q
and stability of capacitance characteristics are not critical. X7R
exhibits a predictable change in capacitance with respect to
time and voltage and boasts a minimal change in capacitance
with reference to ambient temperature. Capacitance change is
limited to ±15% from -55°C to +125°C.
Available in a variety of case sizes and industry leading CV
values (capacitance/voltage), these devices exhibit low leakage
current and low ESR at high frequencies. Conventional uses
include both snubbers and lters in applications such as
switching power supplies and lighting ballasts. Their exceptional
performance at high frequencies has made high voltage MLCC's
the preferred dielectric choice of design engineers worldwide.
In addition to their use in power supplies, these capacitors
are widely used in industries related to automotive (hybrid),
telecommunications, medical, military, aerospace, semiconductors
and test/diagnostic equipment.
Automotive Grade is available for applications requiring proven,
reliable performance in harsh environments. Whether under-hood
or in-cabin, these capacitors are designed for mission and safety
critical automotive circuits. Stricter testing protocol and inspection
criteria have been established for automotive grade products
in recognition of potentially harsh environmental conditions.
KEMET automotive grade series capacitors meet the demanding
Automotive Electronics Council's AEC–Q200 qualication
requirements.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC
(Commercial & Automotive Grade)
Ordering Information
C1210 C154 KC R A C TU
Ceramic
Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated Voltage
(VDC)
Dielectric
Failure Rate/
Design
Termination
Finish
1
Packaging/Grade
(C-Spec)
2
0805
1206
1210
1808
1812
1825
2220
2225
C = Standard Two signicant
digits + number
of zeros.
J = ±5%
K = ±10%
M = ±20%
C = 500
B = 630
D = 1,000
F = 1,500
G = 2,000
Z = 2,500
H = 3,000
R = X7R A = N/A C = 100%
Matte Sn
L = SnPb (5%
minimum)
See "Packaging
C-Spec Ordering
Options Table"
below
1 Additional termination nish options may be available. Contact KEMET for details.
1, 2 SnPb termination nish option is not available on Automotive Grade product.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 2
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
1
Bulk Bag
Blank
7" Tape & Reel/Unmarked
TU
7" Tape & Reel/Marked
TM
Automotive Grade2
7" Reel
AUTO
13" Reel/Punched Paper
AUTO 7411
13" Reel/Embossed Plastic
AUTO 7210
1 C-Spec not required when ordering "Bulk Bag" packaging option.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of components.
2 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L"x W") and thickness dimension. See "Chip Thickness/Packaging Quantities" and
"Tape & Reel Packaging Information" sections of this document.
2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information" section of this document.
2 All Automotive packaging C-Specs listed exclude packaging of laser mark components. Please contact KEMET if you require a laser marked option.
Benets
• -55°C to +125°C operating temperature range
• Industry-leading CV values
• Exceptional performance at high frequencies
• Lead (Pb)-Free, RoHS and REACH compliant
• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, and
2225 case sizes
• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV,
2.5 KV, and 3 KV
• Capacitance offerings ranging from 10 pF to 0.33 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Low ESR and ESL
• Non-polar device, minimizing installation concerns
• Commercial and Automotive (AEC–Q200) grades available
• 100% pure matte tin-plated termination nish allowing for
excellent solderability
• SnPb plated termination nish option available upon request (5%
minimum)
Applications
Typical applications include switch mode power supplies (input lters, resonators, tank circuits, snubber circuits, output lters), high
voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in Ćuk
converters. Markets include power supply, LCD uorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical
equipment/control, LAN/WAN interface, analog and digital modems, and automotive (electric and hybrid vehicles, charging stations and
lighting) applications.
Application Note
X7R dielectric is not recommended for AC line ltering or pulse applications. These capacitors and/or the assembled circuit board
containing these capacitors may require a protective surface coating to prevent external surface arcing.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 3
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding
test methods and conditions are referenced in document AEC–Q200, Stress Test Quali cation for Passive Components. These
products are supported by a Product Change Noti cation (PCN) and Production Part Approval Process warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This
C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without
the requirement to submit a customer Source Controlled Drawing (SCD) or speci cation for review by a KEMET engineering specialist.
This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as
other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below).
Product Change Noti cation (PCN)
The KEMET Product Change Noti cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form,  t , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Noti cation due to: Days prior to
implementation
Process/Product change Obsolescence*
KEMET assigned
1
Yes (with approval and
sign off)
Yes
180 days Minimum
AUTO Yes (without approval) Yes 90 days Minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and speci cation requirements are properly understood and
ful lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET
Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET
assigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
● Part Number speci c PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 4
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
See Table 2 for
Thickness
0.50 (0.02) ± 0.25 (.010) 0.75 (.030) Solder Wave or
Solder Reow
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only
1808 4520 4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008) 0.60 (.024) ± 0.35 (.014)
1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
1825 4564 4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2225 5664 5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
Qualication/Certication
Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualication for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination nish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 5
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
Dielectric Withstanding Voltage (DWV)
150% of rated voltage for voltage rating of < 1,000 V
120% of rated voltage for voltage rating of ≥ 1,000 V
(5 ±1 second and charge/discharge not exceeding 50 mA)
Dissipation Factor (DF) Maximum Limit at 25ºC
2.5%
Insulation Resistance (IR) Limit at 25°C
See Insulation Resistance Limit Table
(500 VDC applied for 120 ±5 seconds at 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial Limit16/25 5.0
< 16 7.5
Insulation Resistance Limit Table (X7R Dielectric)
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
100 Megohm
Microfarads or 10 GΩ
0805 < 0.0039 µF ≥ 0.0039 µF
1206 < 0.012 µF ≥ 0.012 µF
1210 < 0.033 µF ≥ 0.033 µF
1808 < 0.018 µF ≥ 0.018 µF
1812 < 0.027 µF ≥ 0.027 µF
≥ 1825 All N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 6
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
Capacitance Cap
Code
Case Size/
Series C0805C C1206C C1210C C1808C C1812C
Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H
Rated Voltage (VDC)
500
630
1000
500
630
1000
1500
2000
500
630
1000
1500
2000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Capacitance
Tolerance
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
10 pF 100 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
11 pF 110 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
12 pF 120 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
13 pF 130 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
15 pF 150 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
16 pF 160 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
18 pF 180 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
20 pF 200 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
22 pF 220 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
24 pF 240 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
27 pF 270 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
30 pF 300 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
33 pF 330 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
36 pF 360 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
39 pF 390 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
43 pF 430 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
47 pF 470 J K M DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
51 pF 510 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
56 pF 560 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
62 pF 620 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
68 pF 680 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
75 pF 750 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
82 pF 820 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
91 pF 910 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK
100 pF 101 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LC LB GK GK GK GK GK GK GK
110 pF 111 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LC LB GK GK GK GK GK GK GK
120 pF 121 J K M DG DG DG EF EF EF EG EG FM FM FM FM FM LA LA LA LA LB LC LB GK GK GK GK GK GK GK
130 pF 131 J K M DG DG DG EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC LB GK GK GK GK GK GK GK
150 pF 151 J K M DG DG DG EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC LB GK GK GK GK GK GK GK
180 pF 181 J K M DG DG DG EF EF EF EG EG FG FG FG FM FM LA LA LA LA LC LC LB GK GK GK GK GK GK GK
220 pF 221 J K M DG DG DG EF EG EG EG EG FG FG FG FM FM LA LA LA LA LC LC LB GH GH GH GH GH GK GK
270 pF 271 J K M DG DG DG EF EG EG EG EG FG FG FG FK FK LA LA LA LB LC LC LC GH GH GH GH GH GK GK
330 pF 331 J K M DG DG DG EF EG EG EG EG FG FG FG FK FK LA LA LA LB LC LC LC GH GH GH GH GH GK GK
390 pF 391 J K M DG DG DG EG EG EG EG EG FG FG FG FK FS LA LA LA LB LB LB LC GK GK GK GK GK GK GK
470 pF 471 J K M DG DG DG EG EG EG EF EG FG FM FM FS FS LA LB LB LC LB LB LC GK GK GK GK GK GK GK
560 pF 561 J K M DG DG DG EG EG EG EF EG FG FM FM FS FL LA LB LB LC LB LB LC GH GH GH GK GH GK GK
680 pF 681 J K M DG DG DG EG EG EG EF EG FG FM FM FS FL LB LB LB LA LB LC LC GH GH GH GK GH GK GK
820 pF 821 J K M DG DG DG EG EF EF EF EG FG FM FM FL FL LB LB LB LA LB LC LC GH GH GH GK GH GK GK
1,000 pF 102 J K M DG DG DG EG EF EF EF EG FM FM FM FL FL LB LB LB LA LB LC LC GH GH GH GH GH GK GK
1,200 pF 122 J K M DG DG DG EF EF EF EG EG FM FK FK FL FM LC LC LC LB LC LA GH GK GK GH GH GK GK
1,500 pF 152 J K M DG DG DG EF EF EF EG EG FK FS FS FL FM LC LC LC LB LC LB GK GK GK GH GH GK
1,800 pF 182 J K M DG DG DG EF EF EF EG EG FK FS FS FL FM LC LC LC LB LC LC GK GK GK GH GH GK
2,000 pF 202 J K M DG DG DG EF EF EF EG EG FK FL FL FL FM LC LA LA LB LC LC GK GK GK GH GH GK
2,200 pF 222 J K M DG DG DG EF EF EF EG EG FK FL FL FL FM LC LA LA LB LC LC GK GK GK GH GH GK
2,700 pF 272 J K M DG DG DG EF EF EF EG FS FL FL FL FM LC LA LA LB LC GK GH GH GH GK GM
3,300 pF 332 J K M DG DG DG EF EF EF EG FS FL FL FL FM LA LA LA LB LA GK GH GH GH GK GM
3,900 pF 392 J K M DG DG DG EF EF EF EG FL FL FL FL FK LA LA LA LB LB GK GH GH GH GK GO
4,700 pF 472 J K M DG DG DG EF EF EF EG FL FL FL FL FK LA LA LA LB LC GH GH GH GH GH GO
5,600 pF 562 J K M DG DG EF EF EF EF FL FL FL FM FK LA LB LB LC GH GH GH GK GK
6,800 pF 682 J K M DG DG EG EG EG EF FL FL FL FM FS LA LB LB LC GH GH GH GK GM
8,200 pF 822 J K M DG DG EG EG EG EF FL FL FL FK LA LB LB LC GH GH GH GK GM
10,000 pF 103 J K M DG EG EG EG EG FL FL FL FK LA LB LB LC GH GH GH GK GO
Capacitance Cap
Code
Rated Voltage (VDC)
500
630
1000
500
630
1000
1500
2000
500
630
1000
1500
2000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H
Case Size/
Series
C0805C C1206C C1210C C1808C C1812C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 7
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Capacitance Cap
Code
Case Size/
Series C1825C C2220C C2225C
Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H
Rated Voltage (VDC)
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Capacitance
Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
100 pF 101 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
110 pF 111 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
120 pF 121 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
130 pF 131 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
150 pF 151 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
180 pF 181 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
220 pF 221 J K M HE HE HE HE HE HE HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF
270 pF 271 J K M HE HE HE HE HE HE HG JK JK JK JK JK JK JK KE KE KE KE KE KE KF
330 pF 331 J K M JE JE JE JE JE JK JK KE KE KE KE KE KE KF
390 pF 391 J K M JE JE JE JE JE JK JK KE KE KE KE KE KE KF
470 pF 471 J K M HG HG HG HG HG HG HG JE JE JE JE JE JK JK KF KF KF KF KE KE KF
560 pF 561 J K M HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KE KE KF
680 pF 681 J K M HG HG HG HG HG HG HG JE JE JE JK JK JK JK KF KF KF KF KE KF KF
820 pF 821 J K M HG HG HG HG HG HG HG JE JE JE JK JK JK JK KE KE KE KF KE KF KF
Capacitance Cap
Code
Rated Voltage (VDC)
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H
Case Size/
Series
C1825C C2220C C2225C
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes) cont'd
Table 1B – Capacitance Range/Selection Waterfall (1825–2225 Case Sizes)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
Capacitance Cap
Code
Case Size/
Series C0805C C1206C C1210C C1808C C1812C
Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H
Rated Voltage (VDC)
500
630
1000
500
630
1000
1500
2000
500
630
1000
1500
2000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Capacitance
Tolerance
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
12,000 pF 123 J K M DG EG EJ EJ FL FL FL FK LA LC LC LB GH GK GK GK
15,000 pF 153 J K M EG EJ EJ FL FL FL FL LA LC LC LC GH GK GK GH
18,000 pF 183 J K M EJ EJ EJ FL FL FL FM LA LE LE GH GK GK GM
22,000 pF 223 J K M EJ EJ EJ FL FM FM FM LA LE LE GH GK GK GM
27,000 pF 273 J K M EJ EJ FM FK FK FK LA LA LA GH GB GB GO
33,000 pF 333 J K M EJ EJ FM FG FH FS LC LA LA GH GB GB GO
39,000 pF 393 J K M EJ FK FG FH FS LC LA LA GH GB GB
47,000 pF 473 J K M EJ FK FH FK LC LA LB GH GB GC
56,000 pF 563 J K M EJ FG FH FK LC LA LB GH GB GE
62,000 pF 623 J K M EJ FG FK FS LA LA LC GK GB GE
68,000 pF 683 J K M EJ FG FK FS LA LA LC GE GE GE
82,000 pF 823 J K M FH FK LA LC GB GE GK
0.10 µF 104 J K M FK FS LA LC GB GH GJ
0.12 µF 124 J K M FK LA GE GK
0.15 µF 154 J K M FK LB GE GN
0.18 µF 184 J K M GF
0.22 µF 224 J K M GJ
0.27 µF 274 J K M GL
0.33 µF 334 J K M GS
Capacitance Cap
Code
Rated Voltage (VDC)
500
630
1000
500
630
1000
1500
2000
500
630
1000
1500
2000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H
Case Size/
Series
C0805C C1206C C1210C C1808C C1812C
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes) cont'd
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
Capacitance Cap
Code
Case Size/
Series C1825C C2220C C2225C
Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H
Rated Voltage (VDC)
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Capacitance
Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
1,000 pF 102 J K M HG HG HG HG HG HG HG JE JK JK JK JK JK JK KE KE KE KF KE KF KF
1,200 pF 122 J K M HG HG HG HG HG HG HG JE JK JK JK JK JK JK KE KE KE KF KF KF KF
1,500 pF 152 J K M HG HG HG HG HG HG HG JE JK JK JK JK JK JK KE KE KE KF KF KF KF
1,800 pF 182 J K M HE HE HE HE HE HG HG JE JK JK JK JK JK JK KE KE KE KF KF KF KF
2,000 pF 202 J K M HE HE HE HE HE HG HG JE JK JK JE JE JK JK KE KE KE KF KF KF KF
2,200 pF 222 J K M HE HE HE HE HE HG HG JE JK JK JE JE JK JK KF KE KE KF KF KF KF
2,700 pF 272 J K M HE HE HE HE HE HG JK JK JK JE JE JK JK KE KE KE KE KE KF KE
3,300 pF 332 J K M HE HE HE HE HE HG JK JK JK JE JE JK JE KE KE KE KE KE KF KE
3,900 pF 392 J K M HE HE HE HE HE HG JK JK JK JE JE JK JE KE KF KF KE KE KF KE
4,700 pF 472 J K M HE HE HE HE HE HG JK JK JK JE JK JE JE KE KF KF KE KE KF KE
5,600 pF 562 J K M HE HE HE HE HE HG JK JK JK JE JK JE JE KE KF KF KE KE KF KE
6,800 pF 682 J K M HE HE HE HE HE HJ JK JE JE JE JK JE JE KE KF KF KE KF KE KE
8,200 pF 822 J K M HE HE HE HE HE HJ JK JE JE JE JK JK JK KF KE KE KE KF KF KF
10,000 pF 103 J K M HE HE HE HE HJ HK JE JE JE JE JL JL JL KF KE KE KE KF KH KH
12,000 pF 123 J K M HE HE HE HG HJ JE JK JK JK JL JL JL KE KE KE KE KF KH KH
15,000 pF 153 J K M HE HE HE HG HK JE JK JK JK JL JN JN KE KE KE KE KF KJ KJ
18,000 pF 183 J K M HE HE HE HG JE JK JK JK JN KE KE KE KE KH
22,000 pF 223 J K M HE HG HG HG JE JK JK JK JN KE KF KF KF KJ
27,000 pF 273 J K M HE HG HG HG JE JK JK JK KE KF KF KF KJ
33,000 pF 333 J K M HE HG HG HE JE JK JK JK KE KF KF KF
39,000 pF 393 J K M HE HG HG HG JE JK JK JE KE KF KF KF
47,000 pF 473 J K M HE HG HG HJ JE JK JK JK KE KF KF KF
56,000 pF 563 J K M HE HG HG HJ JE JE JE JL KE KF KF KF
62,000 pF 623 J K M HG HG HG HK JE JE JE JL KE KF KF KH
68,000 pF 683 J K M HG HJ HJ HK JE JK JK JL KE KF KF KJ
82,000 pF 823 J K M HG HJ HJ JE JL JL JN KE KF KF KJ
0.10 µF 104 J K M HG HK HK JE JN JN KE KH KH KJ
0.12 µF 124 J K M HG JE JN JN KE KH KH
0.15 µF 154 J K M HG JK KF KJ KJ
0.18 µF 184 J K M HG JK KF
0.22 µF 224 J K M HG KF
Capacitance Cap
Code
Rated Voltage (VDC)
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H
Case Size/
Series
C1825C C2220C C2225C
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
DG
0805
1.25 ± 0.15
0
0
2,500
10,000
EF
1206
1.20 ± 0.15
0
0
2,500
10,000
EG
1206
1.60 ± 0.15
0
0
2,000
8,000
EJ
1206
1.70 ± 0.20
0
0
2,000
8,000
FG
1210
1.25 ± 0.15
0
0
2,500
10,000
FL
1210
1.40 ± 0.15
0
0
2,000
8,000
FH
1210
1.55 ± 0.15
0
0
2,000
8,000
FM
1210
1.70 ± 0.20
0
0
2,000
8,000
FK
1210
2.10 ± 0.20
0
0
2,000
8,000
FS
1210
2.50 ± 0.30
0
0
1,000
4,000
LE
1808
1.00 ± 0.10
0
0
2,500
10,000
LA
1808
1.40 ± 0.15
0
0
1,000
4,000
LB
1808
1.60 ± 0.15
0
0
1,000
4,000
LC
1808
2.00 ± 0.15
0
0
1,000
4,000
GB
1812
1.00 ± 0.10
0
0
1,000
4,000
GC
1812
1.10 ± 0.10
0
0
1,000
4,000
GE
1812
1.30 ± 0.10
0
0
1,000
4,000
GH
1812
1.40 ± 0.15
0
0
1,000
4,000
GF
1812
1.50 ± 0.10
0
0
1,000
4,000
GK
1812
1.60 ± 0.20
0
0
1,000
4,000
GJ
1812
1.70 ± 0.15
0
0
1,000
4,000
GN
1812
1.70 ± 0.20
0
0
1,000
4,000
GL
1812
1.90 ± 0.20
0
0
500
2,000
GM
1812
2.00 ± 0.20
0
0
500
2,000
GS
1812
2.10 ± 0.20
0
0
500
2,000
GO
1812
2.50 ± 0.20
0
0
500
2,000
HE
1825
1.40 ± 0.15
0
0
1,000
4,000
HG
1825
1.60 ± 0.20
0
0
1,000
4,000
HJ
1825
2.00 ± 0.20
0
0
500
2,000
HK
1825
2.50 ± 0.20
0
0
500
2,000
JE
2220
1.40 ± 0.15
0
0
1,000
4,000
JK
2220
1.60 ± 0.20
0
0
1,000
4,000
JL
2220
2.00 ± 0.20
0
0
500
2,000
JN
2220
2.50 ± 0.20
0
0
500
2,000
KE
2225
1.40 ± 0.15
0
0
1,000
4,000
KF
2225
1.60 ± 0.20
0
0
1,000
4,000
KH
2225
2.00 ± 0.20
0
0
500
2,000
KJ
2225
2.50 ± 0.20
0
0
500
2,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on nished chip thickness specications.
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.80 0.95 1.35 2.80 1.70
1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00
1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1808 4520 2.25 1.85 2.30 7.40 3.30 2.15 1.65 2.20 6.50 2.70 2.05 1.45 2.10 5.80 2.40
1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70
1825 4564 2.15 1.80 6.90 7.10 7.9 0 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00
2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60
2225 5664 2.85 2.10 6.90 8.80 7.9 0 2.75 1.90 6.80 7.9 0 7.3 0 2.65 1.70 6.70 7. 20 7.00
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Reow Soldering Prole:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended prole conditions for convection and IR reow reect the prole conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reow passes at these conditions.
Prole Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)235°C 260°C
Time Within 5°C of Maximum
Peak Temperature (tP)20 seconds maximum 30 seconds maximum
Ramp-Down Rate (TP to TL)6°C/second maximum 6°C/second maximum
Time 25°C to Peak
Temperature 6 minutes maximum 8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
Tsmin
25°C to Peak
tL
tS
25
tP
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling JESD22 Method JA–104 1,000 cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at
24 hours +/- 2 hours after test conclusion.
Moisture Resistance MIL–STD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours
after test conclusion.
Thermal Shock MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell
time – 15 minutes. Air – Air.
High Temperature Life MIL–STD–202 Method 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.2 X rated voltage applied.
Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Vibration MIL–STD–202 Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick, 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz.
Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Construction
Dielectric Material
(BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Base Metal
(Cu)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Base Metal
(Cu)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identi er(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
EIA Case Size Metric Size Code Capacitance
0603
1608
≤ 170 pF
0805
2012
≤ 150 pF
1206
3216
≤ 910 pF
1210
3225
≤ 2,000 pF
1808
4520
≤ 3,900 pF
1812
4532
≤ 6,700 pF
1825
4564
≤ 0.018 µF
2220
5650
≤ 0.027 µF
2225
5664
≤ 0.033 µF
KEMET
ID
2-Digit
Capacitance
Code
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identi ers
Alpha
Character
Numeral
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
0.1
1 0
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
B
0.11
1.1
11
110
1,10 0
11,000
110,000
1,100,000
11,000,000
110,000,000
C
0.12
1 2
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
1 3
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
1 5
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
F
0.16
1 6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
160,000,000
G
0.18
1 8
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.2
2 0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2 2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.3
3 0
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
3 3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3 6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3 9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4 3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5 6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6 2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6 8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
7 5
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
8 2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2 5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3 5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.4
4 0
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
4 5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.5
5 0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.6
6 0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.7
7 0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.8
8 0
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.9
9 0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 16
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Con guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size Tape size (W)*
Embossed Plastic
Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch (P1)* Pitch (P1)*
01005 – 0402 8 2 2
0603 8 4 4
0805 8 4444
1206 – 1210 8 4444
1805 – 1808 12 4 4
≥ 1812 12 8 8
KPS 1210 12 8 8
KPS 1812 & 2220 16 12 12
Array 0508 & 0612 8 4 4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance speci cations.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 17
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 18
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1 Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 19
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 20
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W
1
W
2
Maximum W
3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 21
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 22
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Corporate Of ces
Fort Lauderdale, FL
Tel: 954-766-2800
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
Central
Novi, MI
Tel: 248-306-9353
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Europe
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Skopje, Macedonia
Tel: 389-2-55-14-623
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Kamen, Germany
Tel: 49-2307-438110
Northern Europe
Harlow, United Kingdom
Tel: 44-1279-460122
Espoo, Finland
Tel: 358-9-5406-5000
Asia
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Shenzhen, China
Tel: 86-755-2518-1306
Beijing, China
Tel: 86-10-5877-1075
Shanghai, China
Tel: 86-21-6447-0707
Seoul, South Korea
Tel: 82-2-6294-0550
Taipei, Taiwan
Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6701-8033
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1010_X7R_HV_SMD • 3/4/2015 23
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET speci cally disclaims – any warranty concerning suitability for a speci c customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.