SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 D D D D D D D D DB, DW, OR PW PACKAGE (TOP VIEW) Operate With 3-V to 5.5-V VCC Supply Operate Up To 1 Mbit/s Low Standby Current . . . 1 A Typ External Capacitors . . . 4 x 0.1 F Accept 5-V Logic Input With 3.3-V Supply Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II RS-232 Bus-Pin ESD Protection Exceeds 15 kV Using Human-Body Model (HBM) Applications - Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment EN C1+ V+ C1- C2+ C2- V- DOUT2 RIN2 ROUT2 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 FORCEOFF VCC GND DOUT1 RIN1 ROUT1 FORCEON DIN1 DIN2 INVALID description/ordering information The SN65C3223 and SN75C3223 consist of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The devices provide the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/s to 150 V/s Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 A. Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than -2.7 V or has been between -0.3 V and 0.3 V for less than 30 s. INVALID is low (invalid data) if the receiver input voltage is between -0.3 V and 0.3 V for more than 30 s. Refer to Figure 4 for receiver input levels. ORDERING INFORMATION SOIC - DW 0C 0 C to 70 70C C SSOP - DB TSSOP - PW SOIC - DW -40C -40 C to 85 85C C ORDERABLE PART NUMBER PACKAGE TA SSOP - DB TSSOP - PW Tube of 25 SN75C3223DW Reel of 2000 SN75C3223DWR Reel of 2000 SN75C3223DBR Tube of 70 SN75C3223PW Reel of 2000 SN75C3223PWR Tube of 25 SN65C3223DW Reel of 2000 SN65C3223DWR Reel of 2000 SN65C3223DBR Tube of 70 SN65C3223PW Reel of 2000 SN65C3223PWR TOP-SIDE MARKING 75C3223 CA3223 CA3223 65C3223 CB3223 CB3223 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$( !,'&$% &!" $ %)(&&#$% )(! $-( $(!"% (.#% %$!'"($% %$#,#!, /#!!#$0 !,'&$ )!&(%%1 ,(% $ (&(%%#!+0 &+',( $(%$1 #++ )#!#"($(!% POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 Function Tables EACH DRIVER INPUTS DIN FORCEON OUTPUT FORCEOFF VALID RIN RS-232 LEVEL DRIVER STATUS DOUT X X L X Z Powered off L H H X H H H H X L Normal operation with auto-powerdown disabled L L H Yes H H L H Yes L L L H No Z H L H No Z Normal operation with auto-powerdown enabled Powered off by auto-powerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance EACH RECEIVER INPUTS RIN EN VALID RIN RS-232 LEVEL OUTPUT ROUT L L X H H L X L X H X Z Open L No H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off logic diagram (positive logic) 17 13 DIN1 DOUT1 8 12 DIN2 FORCEOFF DOUT2 20 14 Auto-powerdown 11 INVALID FORCEON 1 EN 16 15 ROUT1 RIN1 9 10 ROUT2 2 RIN2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 7 V Negative output supply voltage range, V- (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to -7 V Supply voltage difference, V+ - V- (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V Input voltage range, VI: Driver, FORCEOFF, FORCEON, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25 V to 25 V Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -13.2 V to 13.2 V Receiver, INVALID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VCC + 0.3 V Package thermal impedance, JA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4 and Figure 6) VCC = 3.3 V VCC = 5 V VCC = 3.3 V VCC Supply voltage VIH Driver and control high-level input voltage VIL Driver and control low-level input voltage VCC = 5 V DIN, EN, FORCEOFF, FORCEON Driver and control input voltage DIN, EN, FORCEOFF, FORCEON VI Receiver input voltage TA Operating free-air temperature DIN, EN, FORCEOFF, FORCEON MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 V 2.4 0.8 0 5.5 -25 25 SN65C3223 -40 85 SN65C3223 0 70 V V C NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER II ICC Input leakage current Supply current TEST CONDITIONS EN, FORCEOFF, FORCEON MIN TYP MAX 0.01 1 A 0.3 1 mA Auto-powerdown disabled No load, FORCEOFF, FORCEON at VCC Powered off No load, FORCEOFF at GND 1 10 Auto-powerdown enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded 1 10 UNIT A All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER TEST CONDITIONS MIN TYP VOH VOL High-level output voltage DOUT at RL = 3 k to GND 5 5.4 Low-level output voltage DOUT at RL = 3 k to GND -5 -5.4 IIH IIL High-level input current VI = VCC VI at GND Low-level input current 0.01 IOS Short-circuit output current VCC = 3.6 V, VCC = 5.5 V, ro Output resistance VCC, V+, and V- = 0 V, VO = 0 V VO = 0 V VO = 2 V VO = 12 V, 300 MAX UNIT V V 1 A 0.01 1 A 35 60 35 90 mA 10M 25 VCC = 3 V to 3.6 V A VO = 10 V, VCC = 4.5 V to 5.5 V 25 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. Ioff Output leakage current FORCEOFF = GND switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER Maximum data rate (see Figure 1) TEST CONDITIONS RL = 3 k, k One DOUT switching MIN CL = 1000 pF CL = 250 pF, TYP CL = 1000 pF, VCC = 3 V to 4.5 V VCC = 4.5 V to 5.5 V See Figure 2 tsk(p) Pulse skew CL = 150 pF to 2500 pF, RL = 3 k to 7 k, SR(tr) Slew rate, transition region (see Figure 1) VCC = 3.3 V, RL = 3 k to 7 k CL = 150 pF to 1000 pF 1000 POST OFFICE BOX 655303 UNIT kbit/s 1000 300 18 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. 4 MAX 250 * DALLAS, TEXAS 75265 ns 150 V/s SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER VOH VOL MIN TYP VCC - 0.6 VCC - 0.1 TEST CONDITIONS High-level output voltage IOH = -1 mA IOL = 1.6 mA Low-level output voltage VIT+ Positive-going input threshold voltage VCC = 3.3 V VCC = 5 V VIT- Negative-going input threshold voltage VCC = 3.3 V VCC = 5 V Vhys Ioff Input hysteresis (VIT+ - VIT-) MAX V 0.4 1.6 2.4 1.9 2.4 0.6 1.1 0.8 1.4 0.05 EN = VCC ri Input resistance VI = 3 V to 25 V 3 5 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. V V V 0.5 Output leakage current UNIT V 10 A 7 k switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4) PARAMETER tPLH tPHL TEST CONDITIONS MIN TYP MAX UNIT Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns ten Output enable time CL= 150 pF, See Figure 4 RL = 3 k, 200 ns tdis Output disable time CL= 150 pF, See Figure 4 RL = 3 k, 200 ns tsk(p) Pulse skew See Figure 3 50 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 ns 5 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 AUTO-POWERDOWN SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT-(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC -2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC -0.3 VOH INVALID high-level output voltage IOH = -1 mA, FORCEOFF = VCC FORCEON = GND, VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEOFF = VCC FORCEON = GND, MAX UNIT 2.7 V V 0.3 V VCC - 0.6 V 0.4 V switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) TYP PARAMETER tvalid tinvalid UNIT Propagation delay time, low- to high-level output 1 s Propagation delay time, high- to low-level output 30 s 100 s ten Supply enable time All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 RL 1.5 V 0V CL (see Note A) tTHL 3V FORCEOFF Output tTLH 3V -3 V TEST CIRCUIT 3V -3 V VOH VOL VOLTAGE WAVEFORMS SR(tr) + t THL 6V or t TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 1. Driver Slew Rate 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 0V tPHL CL (see Note A) RL 3V FORCEOFF 1.5 V 1.5 V tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 2. Driver Pulse Skew EN 0V 3V Input 1.5 V 1.5 V -3 V Output Generator (see Note B) 50 tPHL CL (see Note A) tPLH VOH 50% Output 0V FORCEOFF 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 3. Receiver Propagation Delay Times 3V FORCEON 3 V or 0 V VCC S1 GND 1.5 V -3 V tPHZ (S1 at GND) Output CL (see Note A) EN Generator (see Note B) 1.5 V tPHZ (S1 at GND) RL 3 V or 0 V Input VOH Output 50% 0.3 V tPLZ (S1 at VCC) 0.3 V 50 Output 50% VOL tPZL (S1 at VCC) TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 4. Receiver Enable and Disable Times POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION 2.7 V 2.7 V 0V Receiver Input 0V 50 tvalid 50% VCC 50% VCC 0V ten INVALID CL = 30 pF (see Note A) V+ V+ 0.3 V VCC 0V 0.3 V Supply Voltages FORCEOFF FORCEON tinvalid DIN -3 V VCC INVALID Output Autopowerdown -2.7 V -2.7 V ROUT Generator (see Note B) 3V DOUT V- V- TEST CIRCUIT VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High 2.7 V IIIIIIIIIII IIIIIIIIIII IIIIIIIIIII IIIIIIIIIII IIIIIIIIIII Indeterminate 0.3 V 0V -0.3 V If Signal Remains Within This Region for More Than 30 s, INVALID Is Low Indeterminate -2.7 V Valid RS-232 Level, INVALID High Auto-powerdown disables drivers and reduces supply current to 1 A. NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 5. INVALID Propagation Delay Times and Supply Enabling Time 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS538B - JUNE 2002 - REVISED OCTOBER 2004 APPLICATION INFORMATION 2 20 Autopowerdown 1 EN VCC C1+ FORCEOFF 19 + + C1 - 3 C3 + V+ GND 18 - CBYPASS = 0.1 F - 4 5 17 C1- 16 C2+ DOUT1 RIN1 + C2 - 6 15 C2- ROUT1 5 k 7 C4 - 14 V- FORCEON + DOUT2 RIN2 ROUT2 8 13 9 12 10 11 DIN1 DIN2 INVALID 5 k C3 can be connected to VCC or GND. NOTE A: Resistor values shown are nominal. VCC vs CAPACITOR VALUES VCC C1 C2, C3, C4 3.3 V 0.3 V 5 V 0.5 V 3 V to 5.5 V 0.1 F 0.047 F 0.1 F 0.1 F 0.33 F 0.47 F Figure 6. Typical Operating Circuit and Capacitor Values POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp SN65C3223DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3223PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 20-Aug-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp SN75C3223DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3223PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com (3) 20-Aug-2011 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN65C3223DBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN65C3223DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN65C3223PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN75C3223DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN75C3223DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN75C3223PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65C3223DBR SSOP DB 20 2000 367.0 367.0 38.0 SN65C3223DWR SOIC DW 20 2000 367.0 367.0 45.0 SN65C3223PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN75C3223DBR SSOP DB 20 2000 367.0 367.0 38.0 SN75C3223DWR SOIC DW 20 2000 367.0 367.0 45.0 SN75C3223PWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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