Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16373T CY74FCT162373T 16-Bit Latches SCCS054C - August 1994 - Revised October 2003 Features Functional Description * Ioff supports partial-power-down mode operation * Edge-rate control circuitry for significantly improved noise characteristics * Typical output skew < 250 ps * ESD > 2000V * TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages * Industrial temperature range of -40C to +85C * VCC = 5V 10% CY74FCT16373T Features: * 64 mA sink current, 32 mA source current * Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25C The CY74FCT162373T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162373T is ideal for driving transmission lines. Pin Configuration Logic Block Diagrams SSOP/TSSOP/TVSOP Top View 1OE 1LE D 1O1 C TO 7 OTHER CHANNELS FCT162373-1 2OE 2LE 2D1 This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16373T is ideally suited for driving high-capacitance loads and low-impedance backplanes. CY74FCT162373T Features: * Balanced 24 mA output drivers * Reduced system switching noise * Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA= 25C 1D1 CY74FCT16373T and CY74FCT162373T are 16-bit D-type latches designed for use in bus applications requiring high speed and low power. These devices can be used as two independent 8-bit latches or as a single 16-bit latch by connecting the Output Enable (OE) and Latch (LE) inputs. Flow-through pinout and small shrink packaging aid in simplifying board layout. D 2O1 C TO 7 OTHER CHANNELS 1OE 1 48 1O1 2 47 1D1 1O2 3 46 1D2 GND 4 45 GND 1O3 5 44 1D3 1O4 6 43 1D4 VCC 1O5 7 42 8 41 VCC 1D5 1O6 1LE 9 40 1D6 GND 10 39 GND 1O7 11 38 1D7 1O8 37 36 1D8 2O1 12 13 2O2 14 35 2D2 GND 15 34 GND 2O3 16 33 2D3 2O4 17 32 2D4 VCC 2O5 18 31 19 30 VCC 2D5 2D1 2O6 20 29 2D6 GND 21 28 GND 2O7 22 27 2D7 2O8 23 26 2D8 2OE 24 25 2LE FCT162373-2 FCT162373-3 Copyright (c) 2003, Texas Instruments Incorporated CY74FCT16373T CY74FCT162373T Maximum Ratings[2, 3] Pin Description Name Description D Data Inputs LE Latch Enable Inputs (Active HIGH) OE Output Enable Inputs (Active LOW) O Three-State Outputs (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ...................... Com'l -55C to +125C Ambient Temperature with Power Applied................................. Com'l -55C to +125C DC Input Voltage .................................................-0.5V to +7.0V DC Output Voltage ..............................................-0.5V to +7.0V Function Table[1] Inputs Outputs DC Output Current (Maximum Sink Current/Pin) ...........................-60 to +120 mA D LE OE O Power Dissipation .......................................................... 1.0W H H L H Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) L H L L X L L Q0 X X H Z Operating Range Range Industrial Ambient Temperature VCC -40C to +85C 5V 10% Electrical Characteristics Over the Operating Range Parameter Description Test Conditions VIH Input HIGH Voltage VIL Input LOW Voltage VH Input Hysteresis[5] VIK Input Clamp Diode Voltage VCC=Min., IIN=-18 mA IIH Input HIGH Current IIL IOZH Min. Typ.[4] Max. 2.0 Unit V 0.8 100 -1.2 V VCC=Max., VI=VCC 1 A Input LOW Current VCC=Max., VI=GND 1 A High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=2.7V 1 A IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V 1 A IOS Short Circuit Current[6] VCC=Max., VOUT=GND -80 -200 mA Current[6] VCC=Max., VOUT=2.5V -50 -180 mA 1 A Max. Unit IO Output Drive IOFF Power-Off Disable -0.7 V mV -140 VCC=0V, VOUT4.5V[7] Output Drive Characteristics for CY74FCT16373T Parameter VOH VOL Description Output HIGH Voltage Output LOW Voltage Min. Typ.[4] VCC=Min., IOH=-3 mA 2.5 3.5 V VCC=Min., IOH=-15 mA 2.4 3.5 V VCC=Min., IOH=-32 mA 2.0 3.0 Test Conditions VCC=Min., IOL=64 mA 0.2 V 0.55 V Notes: 1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don't Care. Z = High Impedance. Q0=Previous state of flip-flop. 2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. Typical values are at VCC=5.0V, TA= +25C ambient. 5. This parameter is specified but not tested. 6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 7. Tested at +25C. 2 CY74FCT16373T CY74FCT162373T Output Drive Characteristics for CY74FCT162373T Parameter Description [6] Test Conditions Min. Typ.[4] Max. Unit IODL Output LOW Current VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA IODH Output HIGH Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V -60 -115 -150 mA VOH Output HIGH Voltage VCC=Min., IOH=-24 mA 2.4 3.3 VOL Output LOW Voltage VCC=Min., IOL=24 mA V 0.3 0.55 V Typ.[4] Max. Unit Capacitance[5] (TA = +25C, f = 1.0 MHz) Parameter Description Test Conditions CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Power Supply Characteristics Parameter Description Test Conditions Typ.[4] Max. Unit 5 500 A ICC Quiescent Power Supply Current VCC=Max. VIN0.2V, VINVCC-0.2V ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max. VIN=3.4V[8] 0.5 1.5 mA ICCD Dynamic Power Supply Current[9] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=GND VIN=VCC or VIN=GND 60 100 A/MHz IC Total Power Supply Current[10] VCC=Max., f1=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE=GND, LE=VCC VIN=VCC or VIN=GND 0.6 1.5 mA VIN=3.4V or VIN=GND 0.9 2.3 mA VCC=Max., f1=2.5 MHz, VIN=VCC or 50% Duty Cycle, Outputs VIN=GND Open, Sixteen Bits Toggling, VIN=3.4V or OE=GND, LE=VCC VIN=GND 2.4 4.5[11] mA 6.4 16.5[11] mA Notes: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 10. IC= IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input(VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 3 CY74FCT16373T CY74FCT162373T Switching Characteristics Over the Operating Range[12] CY74FCT16373AT CY74FCT162373AT Parameter Description Min. Max. Unit Fig. No.[13] tPLH tPHL Propagation Delay D to O 1.5 5.2 ns 1, 3 tPLH tPHL Propagation Delay LE to O 2.0 6.7 ns 1, 5 tPZH tPZL Output Enable Time 1.5 6.1 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.5 ns 1, 7, 8 tSU Set-Up Time HIGH or LOW, D to LE 2.0 ns 9 tH Hold Time HIGH or LOW, D to LE 1.5 ns 9 tW LE Pulse Width HIGH 3.3 tSK(O) Output Skew[14] 0.5 ns 5 ns -- CY74FCT16373CT CY74FCT162373CT Parameter Description Min. Max. Unit Fig. No.[13] tPLH tPHL Propagation Delay D to O 1.5 4.2 ns 1, 3 tPLH tPHL Propagation Delay LE to O 2.0 5.5 ns 1, 5 tPZH tPZL Output Enable Time 1.5 5.5 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.0 ns 1, 7, 8 tSU Set-Up Time HIGH or LOW, D to LE 2.0 ns 9 tH Hold Time HIGH or LOW, D to LE 1.5 ns 9 tW LE Pulse Width HIGH 3.3 ns 5 ns -- tSK(O) Output Skew[14] 0.5 Notes: 12. Minimum limits are specified but not tested on Propagation Delays. 13. See "Parameter Measurement Information" in the General Information section. 14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. 4 CY74FCT16373T CY74FCT162373T Ordering Information CY74FCT16373 Speed (ns) 4.2 Ordering Code Package Type CY74FCT16373CTPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16373CTPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT16373CTVR 5.2 Package Name - 48-Lead (173-Mil) TVSOP CY74FCT16373ATPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16373ATPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT16373ATVR - Operating Range Industrial Industrial 48-Lead (173-Mil) TVSOP Ordering Information CY74FCT162373 Speed (ns) 4.2 5.2 Ordering Code Package Name Package Type 74FCT162373CTPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162373CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162373CTPVCT O48 48-Lead (300-Mil) SSOP 74FCT162373ATPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162373ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162373ATPVCT O48 48-Lead (300-Mil) SSOP 5 Operating Range Industrial Industrial CY74FCT16373T CY74FCT162373T Package Diagrams 48-Lead Shrunk Small Outline Package O48 48-Lead Thin Shrunk Small Outline Package Z48 6 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 74FCT162373ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162373ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162373ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162373CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162373CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT162373ETPACT OBSOLETE TSSOP DGG 48 TBD TBD Call TI Call TI Samples Not Available Call TI 74FCT162373ETPVCT OBSOLETE TSSOP DGG 48 Call TI Samples Not Available 74FCT16373ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16373ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16373ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16373ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16373CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16373CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 74FCT16373CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT162373ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT162373CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT162373ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available CY74FCT162373ETPVC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 28-Aug-2010 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CY74FCT16373ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373CTVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373CTVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373CTVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CY74FCT16373ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available CY74FCT16373ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available CY74FCT16373ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available CY74FCT16373ETPVCT OBSOLETE SSOP DL 48 Call TI Call TI Samples Not Available FCT162373ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples FCT162373ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples FCT162373ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples FCT162373CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples FCT162373CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TBD (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2010 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74FCT162373ATPACT Package Package Pins Type Drawing TSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162373ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 74FCT162373CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16373ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16373ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16373CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16373CTVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162373ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162373ATPVCT SSOP DL 48 1000 367.0 367.0 55.0 74FCT162373CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16373ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16373ATPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16373CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16373CTVR TVSOP DGV 48 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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