CY74FCT16373ATPVCT - Texas Instruments

16-Bit Latche

CY74FCT16373

CY74FCT162373

CCS054C - August 1994 - Revised October 2003

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modiﬁed to remove devices not offered.

Features

•I

off supports partial-power-down mode operation

• Edge-rate control circuitry for signiﬁcantly improved

noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)

packages

• Industrial temperature range of −40˚C to +85˚C

•V

CC = 5V ± 10%

CY74FCT16373T Features:

• 64 mA sink current, 32 mA source current

• Typical VOLP (ground bounce) <1.0V at VCC = 5V,

TA = 25˚C

CY74FCT162373T Features:

• Balanced 24 mA output drivers

• Reduced system switching noise

• Typical VOLP (ground bounce) <0.6V at VCC = 5V,

TA= 25˚C

Functional Description

CY74FCT16373T and CY74FCT162373T are 16-bit D-type

latches designed for use in bus applications requiring high

speed and low power. These devices can be used as two

independent 8-bit latches or as a single 16-bit latch by

connecting the Output Enable (OE) and Latch (LE) inputs.

Flow-through pinout and small shrink packaging aid in

simplifying board layout.

This device is fully speciﬁed for partial-power-down

applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backﬂow through the device

when it is powered down.

The CY74FCT16373T is ideally suited for driving

high-capacitance loads and low-impedance backplanes.

The CY74FCT162373T has 24-mA balanced output drivers

with current limiting resistors in the outputs. This reduces the

need for external terminating resistors and provides for

minimal undershoot and reduced ground bounce. The

CY74FCT162373T is ideal for driving transmission lines.

Logic Block Diagrams Pin Configuration

1OE

FCT162373-1

1LE

1D11O1

TO 7 OTHERCHANNELS

2OE

FCT162373-2

2LE

2D12O1

GND

1OE

SSOP/TSSOP/TVSOP

Top View

1O1

1O2

1O3

1O4

1D1

1D2

1D3

1D4

1LE

GND

VCC

1O7

1O8

1O5

1O6

1D5

1D6

1D7

1D8

VCC

GND

2O3

2O4

2O1

2O2

2D1

2D2

2D3

2D4

GND

VCC

2O7

2O8

2O5

2O6

2D5

2D6

2D7

2D8

VCC

GND

2OE 2LE

FCT162373-3

TO 7 OTHERCHANNELS

CY74FCT16373

CY74FCT162373

Maximum Ratings[2, 3]

(Above which the useful life may be impaired. For user

guidelines, not tested.)

Storage Temperature...................... Com’l −55°C to +125°C

Ambient Temperature with

Power Applied.................................Com’l −55°C to +125°C

DC Input Voltage .................................................−0.5V to +7.0V

DC Output Voltage ..............................................−0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin)...........................−60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Pin Description

Name Description

D Data Inputs

LE Latch Enable Inputs (Active HIGH)

OE Output Enable Inputs (Active LOW)

O Three-State Outputs

Function Table[1]

Inputs Outputs

D LE OE O

H H L H

L H L L

X L L Q0

X X H Z

Operating Range

Range Ambient

Temperature VCC

Industrial −40°C to +85°C 5V ± 10%

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.[4] Max. Unit

VIH Input HIGH Voltage 2.0 V

VIL Input LOW Voltage 0.8 V

VHInput Hysteresis[5] 100 mV

VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −0.7 −1.2 V

IIH Input HIGH Current VCC=Max., VI=VCC ±1µA

IIL Input LOW Current VCC=Max., VI=GND ±1µA

IOZH High Impedance Output Current

(Three-State Output pins) VCC=Max., VOUT=2.7V ±1µA

IOZL High Impedance Output Current

(Three-State Output pins) VCC=Max., VOUT=0.5V ±1µA

IOS Short Circuit Current[6] VCC=Max., VOUT=GND −80 −140 −200 mA

IOOutput Drive Current[6] VCC=Max., VOUT=2.5V −50 −180 mA

IOFF Power-Off Disable VCC=0V, VOUT≤4.5V[7] ±1µA

Output Drive Characteristics for CY74FCT16373T

Parameter Description Test Conditions Min. Typ.[4] Max. Unit

VOH Output HIGH Voltage VCC=Min., IOH=−3 mA 2.5 3.5 V

VCC=Min., IOH=−15 mA 2.4 3.5 V

VCC=Min., IOH=−32 mA 2.0 3.0 V

VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

Notes:

1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance. Q0=Previous state of ﬂip-ﬂop.

2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature

range.

3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

4. Typical values are at VCC=5.0V, TA= +25˚C ambient.

5. This parameter is speciﬁed but not tested.

6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reﬂect operational values. Otherwise prolonged shorting of

a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter

tests, IOS tests should be performed last.

7. Tested at +25˚C.

CY74FCT16373

CY74FCT162373

Output Drive Characteristics for CY74FCT162373T

Parameter Description Test Conditions Min. Typ.[4] Max. Unit

IODL Output LOW Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA

IODH Output HIGH Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA

VOH Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 V

VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

Capacitance[5] (TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.[4] Max. Unit

CIN Input Capacitance VIN = 0V 4.5 6.0 pF

COUT Output Capacitance VOUT = 0V 5.5 8.0 pF

Power Supply Characteristics

Parameter Description Test Conditions Typ.[4] Max. Unit

ICC QuiescentPowerSupply Current VCC=Max. VIN≤0.2V,

VIN≥VCC−0.2V 5 500 µA

∆ICC QuiescentPowerSupplyCurrent

(TTL inputs HIGH) VCC=Max. VIN=3.4V[8] 0.5 1.5 mA

ICCD Dynamic Power Supply

Current[9] VCC=Max., One Input

Toggling, 50% Duty Cycle,

Outputs Open, OE=GND

VIN=VCC or

VIN=GND 60 100 µA/MHz

ICTotal Power Supply Current[10] VCC=Max., f1=10 MHz,

50% Duty Cycle, Outputs

Open, One Bit Toggling,

OE=GND, LE=VCC

VIN=VCC or

VIN=GND 0.6 1.5 mA

VIN=3.4V or

VIN=GND 0.9 2.3 mA

VCC=Max., f1=2.5 MHz,

50% Duty Cycle, Outputs

Open,SixteenBitsToggling,

OE=GND, LE=VCC

VIN=VCC or

VIN=GND 2.4 4.5[11] mA

VIN=3.4V or

VIN=GND 6.4 16.5[11] mA

Notes:

8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.

9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

10. IC=I

QUIESCENT + IINPUTS + IDYNAMIC

IC=I

CC+∆ICCDHNT+ICCD(f0/2 + f1N1)

ICC = Quiescent Current with CMOS input levels

∆ICC = Power Supply Current for a TTL HIGH input(VIN=3.4V)

DH= Duty Cycle for TTL inputs HIGH

NT= Number of TTL inputs at DH

ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)

f0= Clock frequency for registered devices, otherwise zero

f1= Input signal frequency

N1= Number of inputs changing at f1

All currents are in milliamps and all frequencies are in megahertz.

11. Values for these conditions are examples of the ICC formula. These limits are speciﬁed but not tested.

CY74FCT16373

CY74FCT162373

Switching Characteristics Over the Operating Range[12]

CY74FCT16373AT

CY74FCT162373AT

Parameter Description Min. Max. Unit Fig. No.[13]

tPLH

tPHL Propagation Delay D to O 1.5 5.2 ns 1, 3

tPLH

tPHL Propagation Delay

LE to O 2.0 6.7 ns 1, 5

tPZH

tPZL Output Enable Time 1.5 6.1 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time 1.5 5.5 ns 1, 7, 8

tSU Set-Up Time HIGH or LOW, D to LE 2.0 ns 9

tHHold Time HIGH or LOW, D to LE 1.5 ns 9

tWLE Pulse Width HIGH 3.3 ns 5

tSK(O) Output Skew[14] 0.5 ns —

CY74FCT16373CT

CY74FCT162373CT

Parameter Description Min. Max. Unit Fig. No.[13]

tPLH

tPHL Propagation Delay

D to O 1.5 4.2 ns 1, 3

tPLH

tPHL Propagation Delay

LE to O 2.0 5.5 ns 1, 5

tPZH

tPZL Output Enable Time 1.5 5.5 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time 1.5 5.0 ns 1, 7, 8

tSU Set-Up Time HIGH or LOW, D to LE 2.0 ns 9

tHHold Time HIGH or LOW,

D to LE 1.5 ns 9

tWLE Pulse Width HIGH 3.3 ns 5

tSK(O) Output Skew[14] 0.5 ns —

Notes:

12. Minimum limits are speciﬁed but not tested on Propagation Delays.

13. See “Parameter Measurement Information” in the General Information section.

14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

CY74FCT16373

CY74FCT162373

Ordering Information CY74FCT16373

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

4.2 CY74FCT16373CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16373CTPVC/PVCT O48 48-Lead (300-Mil) SSOP

CY74FCT16373CTVR - 48-Lead (173-Mil) TVSOP

5.2 CY74FCT16373ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16373ATPVC/PVCT O48 48-Lead (300-Mil) SSOP

CY74FCT16373ATVR - 48-Lead (173-Mil) TVSOP

Ordering Information CY74FCT162373

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

4.2 74FCT162373CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT162373CTPVC O48 48-Lead (300-Mil) SSOP

74FCT162373CTPVCT O48 48-Lead (300-Mil) SSOP

5.2 74FCT162373ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT162373ATPVC O48 48-Lead (300-Mil) SSOP

74FCT162373ATPVCT O48 48-Lead (300-Mil) SSOP

CY74FCT16373

CY74FCT162373

Package Diagrams

48-Lead Shrunk Small Outline Package O48

48-Lead Thin Shrunk Small Outline Package Z48

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

74FCT162373ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162373ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162373ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162373CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162373CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162373ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

74FCT162373ETPVCT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

74FCT16373ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16373ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16373ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16373ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16373CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16373CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16373CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162373ATPVC ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162373CTPVC ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162373ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

CY74FCT162373ETPVC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2010

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

CY74FCT16373ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373ATPVC ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373CTPVC ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373CTVR ACTIVE TVSOP DGV 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373CTVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373CTVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16373ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

CY74FCT16373ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

CY74FCT16373ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available

CY74FCT16373ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available

FCT162373ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

FCT162373ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

FCT162373ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

FCT162373CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

FCT162373CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2010

Addendum-Page 3

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

74FCT162373ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

74FCT162373ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

74FCT162373CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

CY74FCT16373ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

CY74FCT16373ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

CY74FCT16373CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

CY74FCT16373CTVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74FCT162373ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0

74FCT162373ATPVCT SSOP DL 48 1000 367.0 367.0 55.0

74FCT162373CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0

CY74FCT16373ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0

CY74FCT16373ATPVCT SSOP DL 48 1000 367.0 367.0 55.0

CY74FCT16373CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0

CY74FCT16373CTVR TVSOP DGV 48 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE

24 PINS SHOWN

3,70

3,50 4,90

5,10

DIM

PINS **

4073251/E 08/00

1,20 MAX

Seating Plane

0,05

0,15

0,25

0,50

0,75

0,23

0,13

112

24 13

4,30

4,50

0,16 NOM

Gage Plane

7,90

7,70

382416

4,90

5,103,70

3,50

A MAX

A MIN

6,60

6,20

11,20

11,40

9,60

9,80

0,08

0,07

0,40

0°–8°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.

D. Falls within JEDEC: 24/48 Pins – MO-153

14/16/20/56 Pins – MO-194

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040048/E 12/01

48 PINS SHOWN

0.730

(18,54)

0.720

(18,29)

4828

0.370

(9,40)

(9,65)

0.380

Gage Plane

DIM

0.420 (10,67)

0.395 (10,03)

A MIN

A MAX

0.010 (0,25)

PINS **

0.630

(16,00)

(15,75)

0.620

0.010 (0,25)

Seating Plane

0.020 (0,51)

0.040 (1,02)

0.008 (0,203)

0.0135 (0,343)

0.008 (0,20) MIN

0.110 (2,79) MAX

0.299 (7,59)

0.291 (7,39)

0.004 (0,10)

0.005 (0,13)

0.025 (0,635)

0°–ā8°

0.005 (0,13)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. Falls within JEDEC MO-118

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040078/F 12/97

48 PINS SHOWN

0,25

0,15 NOM

Gage Plane

6,00

6,20 8,30

7,90

0,75

0,50

Seating Plane

0,27

0,17

1,20 MAX

0,08

0,10

0,50

0°–8°

14,10

13,90

DIM

A MAX

A MIN

PINS **

12,40

12,60

17,10

16,90

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

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