MMBD330T1G, SMMBD330T1G, MMBD770T1G, SMMBD770T1G Schottky Barrier Diodes http://onsemi.com Schottky barrier diodes are designed primarily for high-efficiency UHF and VHF detector applications. Readily available to many other fast switching RF and digital applications. They are housed in the SOT-323/SC-70 package which is designed for low-power surface mount applications. SC-70/SOT-323 CASE 419 Features Extremely Low Minority Carrier Lifetime Very Low Capacitance Low Reverse Leakage Available in 8 mm Tape and Reel AEC Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant* MAXIMUM RATINGS Rating Reverse Voltage MMBD330T1G, SMMBD330T1G MMBD770T1G, SMMBD770T1G Forward Continuous Current (DC) Nonrepetitive Peak Forward Current (Note 1) Symbol VR Value Unit Vdc 30 70 IF 200 mA IFSM 1.0 A PF mW Junction Temperature TJ -55 to +125 C Tstg -55 to +150 C 120 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 60 Hz Halfsine. 3 MARKING DIAGRAMS XX M G G 1 XX 4T 5H M G = Specific Device Code = MMBD330T1 = MMBD770T1 = Date Code = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon the manufacturing location. ORDERING INFORMATION Package Shipping MMBD330T1G SC-70 (Pb-Free) 3,000/Tape & Reel SMMBD330T1G SC-70 (Pb-Free) 3,000/Tape & Reel MMBD770T1G SC-70 (Pb-Free) 3,000/Tape & Reel SMMBD770T1G SC-70 (Pb-Free) 3,000/Tape & Reel Device Forward Power Dissipation TA = 25C Storage Temperature Range 1 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2011 November, 2011 - Rev. 6 1 Publication Order Number: MMBD330T1/D MMBD330T1G, SMMBD330T1G, MMBD770T1G, SMMBD770T1G ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Characteristic Reverse Breakdown Voltage (IR = 10 mA) MMBD330T1G, SMMBD330T1G MMBD770T1G, SMMBD770T1G V(BR)R Diode Capacitance (VR = 15 Volts, f = 1.0 MHZ) MMBD330T1G, SMMBD330T1G (VR = 20 Volts, f = 1.0 MHZ) MMBD770T1G, SMMBD770T1G CT Reverse Leakage (VR = 25 V) MMBD330T1G, SMMBD330T1G (VR = 35 V) MMBD770T1G, SMMBD770T1G IR Forward Voltage (IF = 1.0 mAdc) MMBD330T1G, SMMBD330T1G (IF = 10 mA) (IF = 1.0 mAdc) MMBD770T1G, SMMBD770T1G (IF = 10 mA) VF Min 2 Max Unit Volts 30 70 http://onsemi.com Typ - - - - pF - 0.9 1.5 - 0.5 1.0 nAdc - 13 200 - 9.0 200 Vdc - - 0.38 0.52 0.45 0.60 - - 0.42 0.70 0.50 1.0 MMBD330T1G, SMMBD330T1G, MMBD770T1G, SMMBD770T1G TYPICAL CHARACTERISTICS MMBD330T1G, SMMBD330T1G 2.8 500 t , MINORITY CARRIER LIFETIME (ps) CT, TOTAL CAPACITANCE (pF) MMBD330T1 f = 1.0 MHz 2.4 2.0 1.6 1.2 0.8 0.4 0 MMBD330T1 400 KRAKAUER METHOD 300 200 100 0 0 3.0 6.0 9.0 12 15 18 21 VR, REVERSE VOLTAGE (VOLTS) 24 27 30 0 Figure 1. Total Capacitance 30 50 70 40 60 IF, FORWARD CURRENT (mA) 20 80 90 100 Figure 2. Minority Carrier Lifetime 10 100 MMBD330T1 IF, FORWARD CURRENT (mA) MMBD330T1 IR, REVERSE LEAKAGE (m A) 10 TA = 100C 1.0 TA = 75C 0.1 TA = 85C 1.0 TA = 25C 0.01 TA = -40C 10 TA = 25C 0.1 0.001 0 6.0 12 18 VR, REVERSE VOLTAGE (VOLTS) 24 30 0.2 Figure 3. Reverse Leakage 0.4 0.6 0.8 VF, FORWARD VOLTAGE (VOLTS) Figure 4. Forward Voltage http://onsemi.com 3 1.0 1.2 MMBD330T1G, SMMBD330T1G, MMBD770T1G, SMMBD770T1G TYPICAL CHARACTERISTICS MMBD770T1G, SMMBD770T1G 2.0 500 t , MINORITY CARRIER LIFETIME (ps) CT, TOTAL CAPACITANCE (pF) MMBD770T1 f = 1.0 MHz 1.6 1.2 0.8 0.4 0 MMBD770T1 400 KRAKAUER METHOD 300 200 100 0 0 5.0 10 15 20 25 30 35 VR, REVERSE VOLTAGE (VOLTS) 40 45 50 0 10 Figure 5. Total Capacitance 40 60 30 50 70 IF, FORWARD CURRENT (mA) 80 90 100 Figure 6. Minority Carrier Lifetime 10 100 MMBD770T1 IF, FORWARD CURRENT (mA) MMBD770T1 IR, REVERSE LEAKAGE (m A) 20 TA = 100C 1.0 TA = 75C 0.1 10 TA = 85C TA = -40C 1.0 0.01 TA = 25C 0.001 TA = 25C 0.1 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 50 0.2 Figure 7. Reverse Leakage 0.4 0.8 1.2 VF, FORWARD VOLTAGE (VOLTS) Figure 8. Forward Voltage http://onsemi.com 4 1.6 2.0 MMBD330T1G, SMMBD330T1G, MMBD770T1G, SMMBD770T1G PACKAGE DIMENSIONS SC-70 (SOT-323) CASE 419-04 ISSUE N D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. e1 DIM A A1 A2 b c D E e e1 L HE 3 E HE 1 2 b e A 0.05 (0.002) c A2 MIN 0.80 0.00 0.30 0.10 1.80 1.15 1.20 0.20 2.00 MILLIMETERS NOM MAX 0.90 1.00 0.05 0.10 0.70 REF 0.35 0.40 0.18 0.25 2.10 2.20 1.24 1.35 1.30 1.40 0.65 BSC 0.38 0.56 2.10 2.40 MIN 0.032 0.000 0.012 0.004 0.071 0.045 0.047 0.008 0.079 INCHES NOM 0.035 0.002 0.028 REF 0.014 0.007 0.083 0.049 0.051 0.026 BSC 0.015 0.083 MAX 0.040 0.004 0.016 0.010 0.087 0.053 0.055 0.022 0.095 STYLE 2: PIN 1. ANODE 2. N.C. 3. CATHODE L A1 SOLDERING FOOTPRINT* 0.65 0.025 0.65 0.025 1.9 0.075 0.9 0.035 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca Sales Representative MMBD330T1/D