DISCRETE SEMICONDUCTORS DATA SHEET Package outlines Wideband hybrid amplifier modules 1998 Mar 19 File under Discrete Semiconductors, SC16 Philips Semiconductors Wideband hybrid amplifier modules MOUNTING AND SOLDERING RECOMMENDATIONS Mounting The heatsink surface must be flat, free of burrs and oxidation and be parallel to the mounting surface. The heatsink, mounting base and ground leads should be properly RF-grounded. Heatsink compound should be applied sparingly and evenly on the mounting base. Suitable heatsink compounds are Dow Corning 340, Eccotherm TC-5 (E&C) and Wakefield 120. When mounting CATV hybrid modules, the UNC screws must first be turned finger-tight. The screws should then be tightened to within the tolerance 0.5 Nm minimum and 0.7 Nm maximum. Soldering Modules may be soldered directly into a circuit using a soldering iron with a maximum temperature of 260 C for not more than 3 seconds when the soldered joints are a minimum of 3 mm from the module. 1998 Mar 19 2 Package outlines Philips Semiconductors Wideband hybrid amplifier modules Package outlines PACKAGE OUTLINES Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads SOT115D D E Z A2 1 2 3 4 5 6 7 8 9 A L F S W c e d U2 b q2 e1 Q w M y M B q1 B y M B y M B P U1 q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c d D E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L Q P min. max. 8.8 4.15 3.85 REFERENCES IEC JEDEC EIAJ q1 q2 38.1 25.4 10.2 S U1 U2 max. 4.2 44.75 8 EUROPEAN PROJECTION W w 6-32 0.25 UNC y Z max. 0.1 3.8 ISSUE DATE 97-04-10 SOT115D 1998 Mar 19 2.4 q 3 Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 8 gold-plated in-line leads SOT115G D E Z A2 1 2 3 5 6 7 8 9 A L F S W c e d U2 b q2 e1 Q w M y M B q1 B y M B y M B P U1 q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c d D E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L Q P min. max. 8.8 4.15 3.85 REFERENCES IEC JEDEC EIAJ q1 q2 38.1 25.4 10.2 S U1 U2 max. 4.2 44.75 8 EUROPEAN PROJECTION W w 6-32 0.25 UNC y Z max. 0.1 3.8 ISSUE DATE 97-04-10 SOT115G 1998 Mar 19 2.4 q 4 Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J D E Z P A2 1 2 3 5 7 8 9 A L F S W c e b w M e1 d U2 q2 Q B y M B q1 y M B P U1 q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c d D E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L Q P min. max. 8.8 4.15 3.85 REFERENCES IEC JEDEC EIAJ q1 q2 38.1 25.4 10.2 S U1 U2 max. 4.2 44.75 8 EUROPEAN PROJECTION W w 6-32 0.25 UNC y Z max. 0.1 3.8 ISSUE DATE 97-04-10 SOT115J 1998 Mar 19 2.4 q 5 Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended flat package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 7 gold-plated in-line leads SOT115N N D N1 N2 N3 M M1 M 2 E S2 Z P M3 A2 1 2 3 5 7 8 9 A S1 L F S c W e d U2 B b w M e1 Q q2 y M B q1 y M B y M B P U1 q connector 0 5 10 mm q2 S scale 10.2 4.2 S1 U1 U2 max. S2 A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 8 6-32 0.25 UNC N1 N3 P Q max. 5 1 4.15 3.85 2.4 L min. M M1 M2 M3 N 8.8 2.5 1.6 0.9 3 627 577 REFERENCES IEC JEDEC EIAJ N2 127 10.7 77 8.7 EUROPEAN PROJECTION y Z max. 0.1 12 q q1 38.1 25.4 ISSUE DATE 98-03-06 SOT115N 1998 Mar 19 w 16.7 4.95 44.75 16.1 4.55 DIMENSIONS (mm are the original dimensions) UNIT W 6 Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended flat package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 7 gold-plated in-line leads y1 M B SOT115P N D N1 N2 N3 M M1 M 2 E S2 Z P M3 A2 1 2 3 5 7 8 9 A S1 L F S c W e d U2 B b w M e1 Q q2 y M B q1 y M B y M B P U1 q connector 0 5 10 mm U1 U2 max. q2 S 10.2 4.2 16.7 4.95 44.75 16.1 4.55 scale S1 S2 8 DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 M3 8.8 2.5 1.6 0.9 3 REFERENCES IEC JEDEC EIAJ N1 N2 917 15.3 10.7 817 8.7 8.7 w 6-32 0.25 UNC y y1 Z max. 0.1 0.2 12 q q1 N3 P Q max. 5 1 4.15 3.85 2.4 EUROPEAN PROJECTION 38.1 25.4 ISSUE DATE 98-03-06 SOT115P 1998 Mar 19 N W 7 Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 7 gold-plated in-line leads y1 M B SOT115R N D N1 N2 N3 M M1 M 2 E S2 Z P M3 A2 1 2 3 5 7 8 9 A S1 L F S c W e d U2 B b w M e1 Q q2 y M B q1 y M B y M B P U1 q connector 0 5 10 mm U1 U2 max. q2 S 10.2 4.2 16.7 4.95 44.75 16.1 4.55 scale S1 S2 8 DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 M3 8.8 2.5 1.6 0.9 3 REFERENCES IEC JEDEC EIAJ N1 N2 917 15.3 10.7 817 8.7 8.7 w 6-32 0.25 UNC y y1 Z max. 0.1 0.2 12 q q1 N3 P Q max. 5 1 4.15 3.85 2.4 EUROPEAN PROJECTION 38.1 25.4 ISSUE DATE 98-03-06 SOT115R 1998 Mar 19 N W 8 Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads N D N1 N2 E S2 SOT115T Z P M M1 M2 A2 1 2 3 4 5 7 8 9 A S1 L F S W c e b w M e1 d U2 B q2 Q y M B q1 y M B y M B P U1 q 0 5 S1 10 mm 16.7 4.95 44.75 16.1 4.55 scale optical input U1 U2 max. S2 8 W w 6-32 0.25 UNC y Z max. 0.1 12 q2 S DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 8.8 2.5 1.6 0.9 1000 REFERENCES IEC JEDEC EIAJ N1 N2 P Q max. 10.7 8.7 5 1 4.15 3.85 2.4 EUROPEAN PROJECTION q q1 38.1 25.4 10.2 9 4.2 ISSUE DATE 98-03-06 SOT115T 1998 Mar 19 N min. Philips Semiconductors Wideband hybrid amplifier modules Package outlines Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 7 gold-plated in-line leads N D N1 N2 E S2 SOT115U Z P M M1 M2 A2 1 2 3 5 7 8 9 A S1 L F S W c e b w M e1 d U2 B q2 Q y M B q1 y M B y M B P U1 q 0 5 S1 10 mm 16.7 4.95 44.75 16.1 4.55 scale optical input U1 U2 max. S2 8 W w 6-32 0.25 UNC y Z max. 0.1 12 q2 S DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 8.8 2.5 1.6 0.9 1000 REFERENCES IEC JEDEC EIAJ N1 N2 P Q max. 10.7 8.7 5 1 4.15 3.85 2.4 EUROPEAN PROJECTION q q1 38.1 25.4 10.2 10 4.2 ISSUE DATE 97-08-24 SOT115U 1998 Mar 19 N min.