DATA SH EET
File under Discrete Semiconductors, SC16 1998 Mar 19
DISCRETE SEMICONDUCTORS
Package outlines
Wideband hybrid amplifier modules
1998 Mar 19 2
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
MOUNTING AND SOLDERING RECOMMENDATIONS
Mounting
The heatsink surface must be flat, free of burrs and oxidation
and be parallel to the mounting surface.
The heatsink, mounting base and ground leads should be
properly RF-grounded.
Heatsink compound should be applied sparingly and evenly
on the mounting base. Suitable heatsink compounds are
Dow Corning 340, Eccotherm TC-5 (E&C) and Wakefield
120.
When mounting CATV hybrid modules, the UNC screws
must first be turned finger-tight. The screws should then be
tightened to within the tolerance 0.5 Nm minimum and 0.7
Nm maximum.
Soldering
Modules may be soldered directly into a circuit using a
soldering iron with a maximum temperature of 260 °C for not
more than 3 seconds when the soldered joints are a
minimum of 3 mm from the module.
1998 Mar 19 3
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
PACKAGE OUTLINES
UNIT A2
max. cee
1q
Q
max. q1U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 4.15
3.85 2.4 38.1 25.4
q2
10.2 4.2 44.75 8 0.25 0.1 3.8
bF
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115D
0 5 10 mm
scale
A
max. D
max. L
min.
E
max. Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads SOT115D
D
U1q
q1
b
F
S
A
Z
E
A2
L
c
d
Q
U2
M
w
78923
We
e
1
564
PyMB
yMB
1
B
d
max.
97-04-10
q2yMB
1998 Mar 19 4
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 4.15
3.85 2.4 38.1 25.4
q2
10.2 4.2 44.75 8 0.25 0.1 3.8
bF
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115G
0 5 10 mm
scale
A
max. D
max. L
min.
E
max. Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 8 gold-plated in-line leads SOT115G
D
U1q
q1
b
F
S
A
Z
E
A2
L
c
d
Q
U2
M
w
768923 5
We
e
1
PyMB
yMB
1
B
d
max.
97-04-10
q2yMB
1998 Mar 19 5
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1q2U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 4.15
3.85 2.4 38.1 25.4 10.2 4.2 44.75 8 0.25 0.1 3.8
bF
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115J
0 5 10 mm
scale
A
max. D
max. L
min.
E
max. Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J
D
U1q
q2
q1
b
F
S
A
Z P
E
A2
L
c
d
Q
U2
M
w
78923
We
e
1
5
P
1
d
max.
yMB
yMB
B
97-04-10
1998 Mar 19 6
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1
q2U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
98-03-06
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 627
577 4.15
3.85 2.4 38.1 25.4
10.2 4.2 44.75 8 0.25 0.1
connector
12
bF
2.5
M
1.6
M1
0.9
M2
3
M3N
127
77
N1
10.7
8.7
N2
5
1
N3
16.7
16.1
S1
4.95
4.55
S2
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115N
0 5 10 mm
scale
A
max. D
max. d
max. L
min.
E
max.
Z
max.
Rectangular single-ended flat package; aluminium flange;
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;
optical input with connector; 7 gold-plated in-line leads SOT115N
D
U1q
q2
q1
b
F
S
S1
S2
A
Z P
N
N1
N2
N3
MM1M2M3
E
A2
L
cdQ
U2
M
w
78923
We
e
1
5
P
1
yMB
yMB
yMB
B
1998 Mar 19 7
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1
q2U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
98-03-06
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 917
817 4.15
3.85 2.4 38.1 25.4
10.2 4.2 44.75 8 0.25 0.1
connector
12
bF
2.5
M
1.6
M1
0.9
M2
3
M3N
15.3
8.7
N1
10.7
8.7
N2
5
1
N3
16.7
16.1
S1
4.95
4.55
S2
∅ P
6-32
UNC
y
0.2
y1
w
S
DIMENSIONS (mm are the original dimensions)
SOT115P
0 5 10 mm
scale
A
max. D
max. d
max. L
min.
E
max.
Z
max.
Rectangular single-ended flat package; aluminium flange;
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;
optical input with connector; 7 gold-plated in-line leads SOT115P
D
U1q
q2
q1
b
F
S
S1
S2
A
Z P
N
N1
N2
N3
MM1M2M3
E
A2
L
cdQ
U2
M
w
78923
We
e
1
5
P
1
yMB
yMB
yMB
y
1
MB
B
1998 Mar 19 8
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1
q2U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
98-03-06
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 917
817 4.15
3.85 2.4 38.1 25.4
10.2 4.2 44.75 8 0.25 0.1
connector
12
bF
2.5
M
1.6
M1
0.9
M2
3
M3N
15.3
8.7
N1
10.7
8.7
N2
5
1
N3
16.7
16.1
S1
4.95
4.55
S2
∅ P
6-32
UNC
y
0.2
y1
w
S
DIMENSIONS (mm are the original dimensions)
SOT115R
0 5 10 mm
scale
A
max. D
max. d
max. L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange;
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;
optical input with connector; 7 gold-plated in-line leads SOT115R
D
U1q
q2
q1
b
F
S
S1
S2
A
Z P
N
N1
N2
N3
MM1M2M3
E
A2
L
cdQ
U2
M
w
78923
We
e
1
5
P
1
yMB
yMB
yMB
y
1
MB
B
1998 Mar 19 9
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1q2
U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 1000 4.15
3.85 2.4 38.1 25.4 10.2 4.2
44.75 8 0.25 0.1 12
bF
2.5
M
1.6
M1
0.9
M2N
min.
10.7
8.7
N1
5
1
N2
16.7
16.1
optical input
S1
4.95
4.55
S2
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115T
0 5 10 mm
scale
A
max. D
max. d
max. L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads SOT115T
D
U1q
q2
q1
b
F
S
S1
S2
A
Z P
N
N1
N2
MM1M2
E
A2
L
c
d
Q
U2
M
w
789234
We
e
1
5
P
1
yMB
yMB
yMB
B
98-03-06
1998 Mar 19 10
Philips Semiconductors
Wideband hybrid amplifier modules Package outlines
UNIT A2
max. cee
1q
Q
max. q1q2
U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 1000 4.15
3.85 2.4 38.1 25.4 10.2 4.2
44.75 8 0.25 0.1 12
bF
2.5
M
1.6
M1
0.9
M2N
min.
10.7
8.7
N1
5
1
N2
16.7
16.1
optical input
S1
4.95
4.55
S2
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115U
0 5 10 mm
scale
A
max. D
max. d
max. L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 7 gold-plated in-line leads SOT115U
D
U1q
q2
q1
b
F
S
S1
S2
A
Z P
N
N1
N2
MM1M2
E
A2
L
c
d
Q
U2
M
w
78923
We
e
1
5
P
1
yMB
yMB
yMB
B
97-08-24
