Chip Bead For EMI Suppression CIS10P Series (1608 / EIA 0603) APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.7mm Smallest beads used in high current. CIS series is used for high current. 0.7mm 0.55~0.65mm 0.55~0.65mm DIMENSION Type 10 Dimension [mm] L W t d 1.60.15 0.80.15 0.80.15 0.30.2 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) ( )25%@100MHz ( ) Max. (mA) Max. CIS10P260AC 0.60.15 26 0.007 6000 CIS10P300AC 0.60.15 30 0.01 6000 CIS10P700AC 0.60.15 70 0.02 4000 CIS10P101AC 0.60.15 100 0.03 3000 CIS10P121AC 0.60.15 120 0.03 3000 CIS10P181AC 0.60.15 180 0.04 2500 CIS10P221NC 0.80.15 220 0.05 2500 CIS10P301NC 0.80.15 300 0.07 2000 CIS10P331NC 0.80.15 330 0.07 1700 CIS10P391NC 0.80.15 390 0.10 1200 CIS10P471NC 0.80.15 470 0.13 1500 CIS10P601NC 0.80.15 600 0.15 1300 CIS10J300NC 0.80.15 30 0.01 6000 Part No. CHARACTERISTIC DATA PRODUCT IDENTIFICATION CI (1) S (2) 10 (3) P (4) 260 A (5) (6) C (7) (1) Chip Beads (2) Ultra high current (3) Dimension (4) Material Code (5) Nominal impedance (260: 26 , 300:30 , 121:120 ) (6) Thickness option (N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging (C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Type Quantity (pcs/reel) Card Board Taping 4000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.