165
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
Lightning Surge Protection - SP4062 Series
SP4062 Series
SP4062
Description
Applications
The SP4062 integrates 4 channels of low capacitance
diodes with an additional zener diode to protect sensitive
I/O pins against lightning induced surge events and
ESD. This robust device can safely absorb up to 20A per
IEC61000-4-5 (tP=8/20s) without performance degradation
and a minimum ±30kV ESD per IEC61000-4-2 international
standard. The low loading capacitance makes the SP4062
ideal for protecting high-speed signal pins.
Features
t&4%*&$
±30kV contact, ±30kV air
t&'5*&$"
(t
p
=5/50ns)
t-JHIUOJOH*&$
20A (t
p
=8/20µs)
t-PXDBQBDJUBODFPGQ'
(TYP) per I/O
t-PXMFBLBHFDVSSFOUPG
1µA (MAX) at 3.3V
t&UIFSOFU
Interfaces
t$VTUPNFS1SFNJTF
Equipment (CPE)
t7P*11IPOFT
t4FU5PQ#PYFT
t1#94ZTUFNT
Functional Block Diagram
GND
13
97
5
Pinout
13 5
79
GND
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Application Example
J1
J8
RJ-45 Connector *Package is shown as transparent Ethernet PHY
Tx+
Tx-
Rx-
Rx+
SP4062
PHY
SP4062 Series 3.3V 20A Diode Array RoHS Pb GREEN
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
166
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
Lightning Surge Protection - SP4062 Series
SP4062 Series
SP4062
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20s) 20.0 A
PPK Peak Pulse Power (tp=8/20µs) 300 W
TOP Operating Temperature -40 to 85 ºC
TSTOR Storage Temperature -50 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 3.3 V
Snap Back Voltage VSB ISB=50mA 2.8 V
Reverse Leakage Current ILEAK VR=2.5V, I/O to GND 0.5 1.0 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 6.0 V
IPP=5A, tp=8/20µs, Fwd 7.0 V
IPP=10A, tp=8/20µs, Fwd 8.0 V
IPP=20A, tp=8/20µs, Fwd 11.5 V
Dynamic Resistance RDYN (VC2-VC1)/(IPP2-IPP1) 0.25 Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±30 kV
IEC61000-4-2 (Air) ±30 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V 3.5 5.0 pF
Diode Capacitance1CI/O-I/O Reverse Bias=0V 2.0 pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Thermal Information
Parameter Rating Units
Storage Temperature Range -65 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Clamping Voltage vs. IPP
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (s)
Percent of I
PP
0 5 10 15 20
Peak Pulse Current-I
PP
(A)
0.0
2.0
4.0
6.0
10.0
12.0
Clamp Voltage (V
C
)
8.0
167
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
Lightning Surge Protection - SP4062 Series
SP4062 Series
SP4062
Capacitance vs. Bias
Bias Voltage (V)
Capacitance (pF)
0.0
1.0
2.0
3.0
4.0
5.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
reheat
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zone
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Ordering Information
Part Number Package Marking Min. Order Qty.
SP4062-04UTG µDFN-10 UH4 3000
Part Numbering System
Part Marking System
SP 4062 04 U T G
Series
Number of
Channels
Package
U= μDFN-10
T= Tape & Reel
G= Green
-
Silicon Protection
Array (SPA
TM
)
Family of
TVS Diode Arrays
U
*4
Product Series
U = SP4062
Assembly Site
Number o
Channels
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
168
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
Lightning Surge Protection - SP4062 Series
SP4062 Series
Package Dimensions — μDFN-10
Package μDFN-10 (2.6x2.6mm)
JEDEC MO-229
Symbol Millimeters Inches
Min Nom Max Min Nom Max
A0.45 0.50 0.55 0.018 0.020 0.022
A3 0.130 Ref 0.005 Ref
b0.17 0.22 0.27 0.006 0.008 0.010
D2.50 2.60 2.70 0.097 0.101 0.105
D2 2.10 2.15 2.20 0.081 0.083 0.085
E2.50 2.60 2.70 0.097 0.101 0.105
E2 1.21 1.26 1.31 0.046 0.049 0.051
e0.50 BSC 0.020 BSC
L0.35 0.40 0.45 0.014 0.016 0.018
D
E
B
Top View
A
A
Bottom View
0.10 C
b
A3
C
Seating
Plane
Side View
0.10 CB
MA
0.05C
e
D2
E2
2X
C
Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm)
T
B0
K0
P2 D0
E
F
P0
P1
D1
W
5º MAX
A0 5º MAX
User Feeding Direction
Pin 1 Location
Symbol Millimeters
A0 2.82 +/- 0.05
B0 2.82 +/- 0.05
D0 Ø1.50 + 0.10
D1 Ø 0.50 + 0.05
E1.75 +/- 0.10
F3.50 +/- 0.05
K0 0.76 +/- 0.05
P0 4.00 +/- 0.10
P1 4.00 +/- 0.10
P2 2.00 +/- 0.05
T0.25 +/- 0.02
W8.00 + 0.30 /- 0.10
Recommended Solder Pads μDFN-10L 2.6x2.6mm
B
CF
X
P
GZ
Y
Dimension
Symbol Millimeters Inches
B2.30 0.091
C2.20 0.087
F1.41 0.056
G1.65 0.065
P0.50 0.020
X0.37 0.015
Y0.55 0.022
Z2.75 0.108