CX24123-11Z - NXP Semiconductors - Datasheet.Directory

CX24118A

Advanced Modulation Digital Satellite Tuner

Rev. 02 — 8 September 2009 Product data sheet

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Abstract

Product data sheet Rev. 02 — 8 September 2009 2

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Ordering information

Type number Description Package

CX24118A-12Z* Advanced Modulation Digital Satellite Tuner 36-pin QFN

*Lead-free (Pb Free) and RoHS compliant

Revision history

Revision Date Description

02 20090908 Added Figure 12

01 20081125 First NXP version based on the Conexant 102322A data sheet.

Product data sheet Rev. 02 — 8 September 2009 3

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

General description

The CX24118A is a direct down-conversion satellite tuner intended for high-volume digital

video, audio, and data receivers. The CX24118A offers excellent phase noise performance

and very low implementation loss, required for advanced modulation systems such as 8PSK

and DVB-S2.

The CX24118A has a built-in auto-tuning system that eliminates the need for software

calibration. The on-chip fractional synthesizer enables fine frequency step size without

adversely affecting lock time. The CX24118A does not require a balun, thus reducing

external BOM cost. Its highly integrated design saves valuable board space and simplifies

RF layout.

Features

Single-chip RF-to-baseband satellite receiver

Zero-IF architecture eliminates the need for image reject filtering

Very low phase noise integrated Local Oscillators (LOs) for 8PSK and DVB-S2

applications

Variable baseband filters for optimal interference rejection

Auto-tuning system eliminates need for software calibration

Very low power consumption

Small (6 mm x 6 mm) footprint

Lead-free package

Applications

8PSK, DVB-S2, and advanced modulation set-top boxes

Commercial digital video, audio, and PVR receivers

Product Specifications

RF input: 925–2175 MHz

Symbol rate: 1–45 MSps

Noise figure: 10 dB, typical

Input IP3 at minimum gain: 10 dBm, typical

Block diagram

I_OUT

Q_OUT

VTUNE

CP_OUT

XSEL

XTAL1

XTAL2

CKREF_OUT

RF_IN

AGC

Crystal Oscillator

and

Clock Control

PLL and VCO

VCA

VGA1 Filter 2

I/Q

Mixer VGA2Filter 1

Final

Amplifier

DC Offset

Cancellation

DC Offset

Cancellation

AGC

Control Filter

Control

Logic

Interface SADD

SCL

SDA

: 2,

Product data sheet Rev. 02 — 8 September 2009 4

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Product data sheet Rev. 02 — 8 September 2009 5

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

1 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1.1 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1.2 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2 Functional Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.2 Downconverter and Baseband Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.3 Gain Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.4 Local Oscillator and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.5 Crystal Oscillator and Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.6 Automatic Tuning System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2.6.1 Auto-tuning Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3 Serial Programming Interface and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.1 Serial Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.3 Register Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.4 Register Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4 Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.1 Thermal Recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.2 Sleep Mode Procedures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.2.1 Changing from Normal Operation to Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.2.2 Changing from Sleep Mode to Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

5 Electrical, Thermal, and Mechanical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

5.1 S11 Plot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

5.2 Electrical and Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

5.2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

5.2.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

5.2.3 Receiver Electrical and Thermal Spe cifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

5.3 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Legal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Product data sheet Rev. 02 — 8 September 2009 6

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Product data sheet Rev. 02 — 8 September 2009 7

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Fig. 1 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Fig. 2 Detailed Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Fig. 3 Recommended Divider Settings vs. Frequency When Using 40 MHz Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Fig. 4 Third-Overtone Crystal Oscillator External Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Fig. 5 Serial Clock and Data Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Fig. 6 Typical Single-Byte Write Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Fig. 7 Typical Multiple-Bytes Write Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Fig. 8 Typical Single-Byte Read Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Fig. 9 Typical Multiple-Bytes Read Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Fig. 10 S11 Plot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Fig. 11 Package Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Fig. 12 Package Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Product data sheet Rev. 02 — 8 September 2009 8

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Product data sheet Rev. 02 — 8 September 2009 9

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Table 1. Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 2. Maximum Signal Level Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 3. Minimum Signal Level Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 4. Recommended Component Values for Third-Overtone Crystal Oscill ator External Circuit . . . . . . . . . . . . . . . . 19

Table 5. Crystal Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 6. Register Bit Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 7. Register Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 8. Thermal Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 9. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Table 10. Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Table 11. Receiver Electri cal Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Product data sheet Rev. 02 — 8 September 2009 10

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Product data sheet Rev. 02 — 8 September 2009 11

CX24118A

Chapter 1: Pin Descriptions

Rev. 02 — 8 September 2009 Product data sheet

1.1 Pin Diagram

Figure 1 provides a pinout of the CX24118A.

Figure 1. Pin Diagram

(Exposed Paddle = Gnd)

102322_002

CX24118A

N/C

VCC_VCO

VTUNE

VCC_CP

CP_OUT

XTAL_BIAS

VCC_XTAL

XTAL1

XTAL2

CKREF_OUT

VCC_DIG

GND_DIG

SDA

SCL

I_OUTN

I_OUTP

Q_OUTP

Q_OUTN

N/C

RF_INN

RF_INP

VCC1_RF

VCC1_BB

AGC

VCC2_BB

BB_REF

N/C

VCC_PS

XSEL

SADD

N/C

VCC2_RF

N/C

Product data sheet Rev. 02 — 8 September 2009 12

NXP Semiconductors CX24118A

Chapter 1: Pin Descriptions

1.2 Pin Assignments

Table 1 lists the CX24118A pin names, numbers, types, and descriptions.

Table 1. Pin Assignments

Pin Name Pin Number Type Description

N/C 1 N/C Not internally connected.

VCC_VCO 2 Power 3.3V power supply for the VCO section.

VTUNE 3 Input VCO tuning voltage input. The output of the external PLL loop filter is connected to this

pin.

VCC_CP 4 Power 3.3V power supply for the charge pump section.

CP_OUT 5 Output Charge pump output. The input of the external PLL loop filter is connected to this pin.

XTAL_BIAS 6 Input Crystal oscillator bias. For normal operation, leave this pin unconnected.

VCC_XTAL 7 Power 3.3V power supply for the crystal oscillator section.

XTAL1 8 Input Crystal oscillator input pins. Use a 40 MHz or 40.444 MHz third-overtone crystal

oscillator circuit.

XTAL2 9 Output

CKREF_OUT 10 Output Clock reference output. The maximum load allowed at this pin is 10 kΩ // 20 pF.

VCC_DIG 11 Power 3.3 V power supp ly for digital section.

GND_DIG 12 Ground Digital ground.

SDA 13 I/O Serial programming interface data signal. Open drain.

SCL 14 Input Serial programming interface clock signal.

I_OUTN 15 Output The negative differential I channel output to demodulator. Zout = 1 kΩ // 10 pF.

I_OUTP 16 Output The positive differential I channel output to demodulator. Zout = 1 kΩ // 10 pF.

Q_OUTP 17 Output The positive differential Q channel output to demodulator. Zout = 1 kΩ // 10 pF.

Q_OUTN 18 Output The negative differential Q channel output to demodulator. Zout = 1 kΩ // 10 pF.

N/C 19 N/C Not internally connected.

BB_REF 20 Input Current reference for baseband section. Place a 698 Ω ±1% resistor to ground.

VCC2_BB 21 Power 3.3 V power supply for the baseband section.

AGC 22 Input AGC control input from the demodulator, which controls the gain of the RF attenuator

and both baseband variable gain amplifiers. Zin = 10 kΩ // 20 pF.

VCC1_BB 23 Power 3.3 V power supply for the baseband section.

VCC1_RF 24 Power 3.3 V power supply pin for the RF section.

RF_INP 25 Input The positive differential RF signal input pin.

Product data sheet Rev. 02 — 8 September 2009 13

NXP Semiconductors CX24118A

Chapter 1: Pin Descriptions

RF_INN 26 Input The negative differential RF signal input pin. This pin should be AC grounded with a

capacitor to ground.

N/C 27 N/C Not internally connected.

N/C 28 N/C Not internally connected.

N/C 29 N/C Not internally connected.

N/C 30 N/C Not internally connected.

VCC2_RF 31 Power 3.3 V power supply pin for the RF section.

N/C 32 N/C Not internally connected.

N/C 33 N/C Not internally connected.

SADD 34 I/O Serial address select pin. This pin has an internal pull-up, so an open on this pin will be

a logic level high (default address of 54) and a short to ground will be a logic level low

(address of 14).

XSEL 35 Input Crystal bias select pin. Leave floating for operation with a 40 MHz third-overtone

crystal. This pin has an internal 30 kΩ pull-up resis tor.

VCC_PS 36 Power 3.3 V power supply for the prescaler section.

Exposed Paddle Ground The exposed paddle at the bottom of the chip is the common chip ground and the

thermal conductor.

Table 1. Pin Assignments

Pin Name Pin Number Type Description

Product data sheet Rev. 02 — 8 September 2009 14

NXP Semiconductors CX24118A

Chapter 1: Pin Descriptions

Product data sheet Rev. 02 — 8 September 2009 15

CX24118A

Chapter 2: Functional Descriptions

Rev. 02 — 8 September 2009 Product data sheet

2.1 General Description

The CX24118A is a highly integrated direct conversion tuner requiring a minimum of off-chip

components. It incorporates a low-noise amplifier with integrated Voltage Controlled

Attenuator (VCA), quadrature down converter, variable bandwidth base-band filter/amplifier,

fractional synthesizer , cryst al oscillator with buffered output, and an automatic tuning system.

The chip is controlled through a multi-byte read/write enabled I2C®-compatible interface.

A CX24118A detailed block diagram is shown in Figure 2.

Figure 2. Detailed Block Diagram

2.2 Downconverter and Baseband Filtering

The L band input from the LNB is fed into the CX24118A either differentially or single-ended.

The input signal goes through a low-noise amplification block and is downconverted to a

baseband frequency by quadrature downconversion. The output of the downconverter is

band limited by a variable bandwidth filter that can be set to 35, 40, 65, or 100 MHz. A

102322_007

XSEL

: 2

Square Wave

PFD Charge

Pump

Prescaler

VCO

OUTRefDiv

PLLRefDiv : 2

XTAL1

XTAL2

CKREF_OUT

I_OUT

Q_OUT

RF_IN

AGC

VCA

VGA1 Filter 2

I/Q

Mixer VGA2Filter 1

Final Amplifier

90o

18 Bit

DSM

Logic

Interface

SDA

SCL

SADD

VTUNE

: 2,

LODivSel

DC Offset

Cancellation

DC Offset

Cancellation

Sine Wave

CP_OUT

AGC

Control

Filter

Control

Product data sheet Rev. 02 — 8 September 2009 16

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

variable gain baseband amplifier section provides further amplification. The baseband

section includes a servo loop, which eliminates DC offset variations at the output. The

baseband amplifier section also includes a filter with finer bandwidth control between 2 MHz

and 65 MHz. The filter is optimized to provide stop band attenuation for anti-alias filtering and

adjacent channel performance.

2.3 Gain Settings

The CX24118A is controlled by a single AGC signal, providing a dynamic range of 90 dB.

The gain stages include an LNA (Low Noise Amplifier) and VCA (Voltage Controlled

Attenuator), VGA1 (Variable Gain Amplifier 1), VGA2, and a final amplifier. These gain

stages are shown in figure 2-1.

The gain and of fset of the different st ages can be adjusted to provide the best overall IP3 and

Noise Figure performance over input power. To optimize the performance at both high and

low powers, split gain settings are recommended. This involves estimating the input power in

order to select the best set of gain settings. The maximum signal level settings given in

Table 2 should be used when the input power is high while there is significant power from

other carriers within the satellite frequency range. The minimum signal level settings given in

Table 3 should be used when the input power is low or when significant power from other

carriers within the satellite frequency range does not exist. The transition point between the

minimum signal level settings and the maximum signal level settings is set at Pthreshold = -50

dBm.

Table 2. Maximum Signal Level Settings

Parameter Register Location Register Setting Meaning

RFVCAOff[1:0] 0x20[3:2] 00b -70 dB

BBVGA2Off[2:0] 0x1F[5:3] 111b -27 dB

BBVGA1Off[2:0] 0x1F[2:0] 111b -22 dB

BBAmpGain[3:0] 0x1D[3:0] 0011b 31 dB(1)

FOOTNOTES:

(1) This value is valid for the CX24116, CX24126, and CX24114 demodulators. For the CX24123

demodulator, use the setting that corresponds to 25 dB.

Product data sheet Rev. 02 — 8 September 2009 17

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

2.4 Local Oscillator and PLL

A bank of six Voltage Controlled Oscillators (VCOs) cover the entire 925 MHz to 2175 MHz

range for downconversion with adequate overlap between VCOs. Each VCO has two bands

of operation, high and low , resulting in a tot al of 12 virtual VCOs. All the VCOs are integrated

into the chip, eliminating the need for external varactor diodes. The automatic tun ing system

selects the appropriate VCO to generate the Local Oscillator (LO), eliminating the need for

calibration during initialization or channel change. The VCOs can also be selected manually,

overriding the automatic tuning system. For more information on the automatic tuning

system, see Section 2.6

The on-chip fractional synthesizer generates the LO with a very fine step size. The fractional

synthesizer consists of a 9-bit integer divider and an 18-bit sigma delta modulator with an 8-

level quantizer. The sigma delta modulator dithers the fractional division ratio to convert

spurious tones and quantization noise to white noise. The charge pump current selection is

based on the VCO tuning voltage, i.e., VCO output frequency. The charge pump tuning

system uses four tuning voltage ranges, and the charge pump current level for each range is

set automatically at every channel change to give optimum integrated phase noise.

The values to be programmed into the PLL’s integer and fractional divider registers are

computed as follows:

1. Set the dividers LODivSel (0x18[6]) and PLLRefDiv (0x02[1]) based on pre-defined or

calculated frequency ranges.

• See Figure 3 for recommended divider settings when using a 40 MHz crystal.

2. Calculate the total PLL division ratio.

Ndivider = ; if PLLRefDiv = 0

= ; if PLLRefDiv = 1

3. Calculate the integer divider PLLIntDiv[8:0].

PLLIntDiv[8:0] = Round[Ndivider] – 32

• The Round function rounds the result to the nearest integer.

• PLLIntDiv[8:0] can range from 6d to 511d. This is taken into consideration when

selecting the divider ranges.

Table 3. Minimum Signal Level Setting s

Parameter Register Location Register Setting Meaning

RFVCAOff[1:0] 0x20[3:2] 10b -64 dB

BBVGA2Off[2:0] 0x1F[5:3] 011b -29 dB

BBVGA1Off[2:0] 0x1F[2:0] 010b -32 dB

BBAmpGain[3:0] 0x1D[3:0] 0011b 31 dB(1)

FOOTNOTES:

(1) This value is valid for the CX24116, CX24126, and CX24114 demodulators. For the CX24123

demodulator, use the setting that corresponds to 25 dB.

FVCO 1×

Fxtal 2×

----------------------

FVCO 2×

Fxtal 2×

----------------------

Product data sheet Rev. 02 — 8 September 2009 18

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

4. Calculate the fractional divider PLLFracDiv[17:0].

PLLFracDiv[17:0] = Round [218 x (Ndivider - PLLIntDiv[8:0] - 32)]

• To avoid fractional spurs, the fractional divider should not produce VCO

frequencies within 250 kHz or 125 kHz of the frequencies generated by

PLLFracDiv[17:0] = 0.0 or 0.5 respectively.

• When the requested frequency is within 250 kHz of the frequency generated by

PLLFracDiv[17:0] = 0.0, the PLL should be put into integer mode. Integer mode is

enabled by setting register bit DSMByp (0x10[6]) to 1.

• When the requested frequency is within 125 kHz of the frequency generated by

PLLFracDiv[17:0] = 0.5, the closest fractional value outside of the keep-out range

should be used.

Figure 3. Recommended Divider Settings vs. Frequency When Using 40 MHz Crystal

2.5 Crystal Oscillator and Reference Clock

The crystal oscillator should be used with a 40 MHz or 40.444 MHz third-overtone crystal. It

generates the reference frequency for the fractional synthesizer and provides the clock for

the rest of the system. It is also divided and buf fered to produce an external clock that can be

used as a clock signal for the demodulator. Register bit OutRefDiv (0x02[2]) sets the

frequency of the reference clock output at pin CKREF_OUT so that when OUTRefDiv = 0, a

925 1165

Divider ratio

÷ 4

1500

f (MHz) 2175

÷ 2

÷ 1

LODivSel

LLRefDiv

(1)

(2)

REN_003

(3)

(1) The LO divider is changed to ÷4 below 1165 MHz in order to keep the VCO frequency out of the input frequency range of 925

to 2175 MHz.

(2) The PLL frequency divider is changed across the frequency band to optimize phase noise while keeping the value of

PLLInDiv[8:0] within its usable range of 65-511d.

(3) This reference divider break-point is set at 37.5*Fxtal. For a 40 MHz Xtal, this value is 1500 MHz.

Product data sheet Rev. 02 — 8 September 2009 19

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

40 MHz sinusoidal clock is produced, and when OUTRefDiv = 1, a 20 MHz square clock is

produced (when OUTRefDiv = 1 mode is used, the XTAL_BIAS pin needs to be grounded).

The third overtone crystal requires external circuitry to load the crystal properly at the third-

overtone frequency while suppressing the fundamental frequency. This circuit is shown in

Figure 4, and the recommended component values are listed in Table 4. The external

components should be RF type components (high Q) with good characteristics at 40 MHz.

Figure 4. Third-Overtone Crystal Oscillator External Circuit

The selected crystal should be a high-quality crystal with minimum drive level dependencies.

Table 5 lists the required crystal characteristics. Component tolerances should be 5 percent

or better.

Table 4. Recommended Component Values for Third-Overtone Crystal Oscillator

External Circuit

Component Value

C122 pF

C256 pF

C31 nF

L1390 nH

102322_014

To System

To Demodulator

XTAL_BIAS

XSEL

: 2

CKREF_OUT

OUTRefDiv

XTAL2

XTAL1

635 89

C1 C2

CX24118A

Product data sheet Rev. 02 — 8 September 2009 20

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

2.6 Automatic Tuning System

The CX24118A uses an automatic tuning system to select the VCO and band during channel

change. The system selects among the 12 virtual VCOs (VCO1–VCO6, each with a high and

low band) based on preload values that are programmed during initialization. The automatic

tuning system does not require time-consuming calibration during initialization or channel

change. The procedure for using the automatic tuning system is given in Section 2.6.1.

2.6.1 Auto-tuning Procedure

During Initialization

1. Program the tuning system preload values with the values provided by Conexant and

enable the automatic tuning system.

a. Set register field TUN1[5:0] (0x14[5:0]) to 0x0F.

– Register 0x14 also contains the tuning system enable bits, TUNAutoEn[1:0], which

should be programmed to 00b at the same time.

b. Set register TUN2[7:0] (0x15[7:0]) to 0xFF.

c. Set register TUN3[7:0] (0x16[7:0]) to 0xFF.

d. Set register TUN4[7:0] (0x17[7:0]) to 0xF0.

2. Program automatic charge pump levels with the values provided by Conexant. These

values are selected based on the VCO tuning voltage.

a. Set register field CPLevel1[1:0] (0x11[7:6]) to 11b.

b. Set register field CPLevel2[1:0] (0x11[5:4]) to 11b.

c. Set register field CPLevel3[1:0] (0x11[3:2]) to 10b.

Table 5. Crystal Requirements

Parameter Specification

Frequency 40.000 MHz (40.444 MHz(3))

Mode Parallel resonant, 3rd overtone

Frequency tolerance at 25 ºC 25 ppm

Frequency tolerance over

temperature 50 ppm

Maximum equivalent series

resistance (ESR) (1) 80

Aging 5 ppm/Year

Load Capacitance 18 pF

Maximum Drive Level(2) 1 mW

Operating Temperature Range 0 ºC to 70 ºC

FOOTNOTES:

(1) This is the maximum crystal series resistance for reliable startup at low energy levels. Compliance with

this spec at 10 nW is required. This number is also required at operating power levels.

(2) The power dissipated across the crystal will depend on the ESR of the crystal and the bias level of the

oscillator. Leaving the XTAL_BIAS pin open will create a lower bias current than if it were shorted to

ground.

(3) A 40.444 MHz crystal is only needed when DVB symbol rates of 44–45 MSps are required for the

CX24116 DVB-S2 demodulator.

Product data sheet Rev. 02 — 8 September 2009 21

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

d. Set register field CPLevel4[1:0] (0x11[1:0]) to 00b.

3. There are other registers not directly related to tuning system initialization that must also

be programmed. These values are not discussed here.

During Channel Change

1. Choose the appropriate dividers using register bits LODivSel (0x18[6]) and PLLRefDiv

(0x02[1])). For more detail, see Section 2.4

2. Select the gain settings. The minimum signal level settings can be used at this point.

3. Set the bandwidths of the baseband filters using register fields BBFil1BW[1:0] and

BBFil2BW[1:0] based on the symbol rate, roll-off, and desired carrier acquisition range.

4. Program the PLL dividers PLLIntDiv[8:0] and PLLFracDiv[17:0] using the values

generated from the procedure given in Section 2.4, and start the tuning process as

follows:

a. Program registers 0x19-0x1B.

b. Program the remaining PLL dividers into register 0x1C while setting the start bit

TUNReset (0x1C[4]) to 1.

5. Monitor PLL lock using register bit TUNLD. When lock has been achieved, measure the

power to determine the appropriate gain settings. Set new gain settings if required. See

Section 2.3 for more detail.

a. After lock, the charge pump values are automatically selected, based on the VCO

tuning voltage and the charge pump initialization values.

Product data sheet Rev. 02 — 8 September 2009 22

NXP Semiconductors CX24118A

Chapter 2: Functional Descriptions

Product data sheet Rev. 02 — 8 September 2009 23

CX24118A

Chapter 3: Serial Programming Interface and Registers

Rev. 02 — 8 September 2009 Product data sheet

3.1 Serial Programming Interface

The CX24118A uses an I2C-compatible serial interface. Th e serial clock and data lines, SCL

and SDA, are used to transfer data at a clock rate of up to 1 MHz. A direct, exclusive

connection is preferred between controlling master and the tuner slave. If the chip is put on a

common I2C bus shared by other devices, the ongoing traffic on the bus may cause RF

interference. Both lines operate on 3.3 V I/O voltage levels. The SDA line is open drain,

requiring an external pull-up resistor.

The serial clock and data signals for a typical transaction is shown in Figure 5.

Figure 5. Serial Clock and Data Signals

The START condition occurs on the falling edge of the SDA line when the SCL line is held

high. A STOP condition occurs on the rising edge of the SDA line when the SCL line is held

high. Every data word is 8 bit s long with MSB first, followed by an acknowledg e bit generated

by the receiving device. Each data transaction occurs between a START and a STOP

condition. The START condition is followed by a slave address. If this is the CX24118A

address, it generates an acknowledge bit on the SDA line.

The following are some typical read/write sequences:

Typical Single-Byte Write Procedure

1. Send the Start condition.

2. Send the CX24118A slave address, a write bit, and receive an ACK.

3. Send the CX24118A desired register address = n, and receive an ACK.

4. Send the byte for a desired register = n, and receive an ACK.

5. Send the Stop condition.

The above-described single-byte write procedure is shown in Figure 6.

In the figure, the following abbreviations are used:

S = Start

Dev Addr/wr = Device address with a write command

A = Acknowledge

P = Stop

SCL

SDA

MSB

LSB

(1)

(2)

Start Condition

Stop Condition

Address Data

(1)

Slave

Address

12345678 91234567891 23456789

102322_012

FOOTNOTE:

(1) Acknowledge generated by CX24118A.

(2) Subsequent bytes are assumed to be data for registers whose addresses follow in ascending order.

Product data sheet Rev. 02 — 8 September 2009 24

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

Figure 6. Typical Single-Byte Write Procedure

Typical Multiple-Bytes Write Procedure

1. Send the Start condition.

2. Send the CX24118A slave address, a write bit, and receive an ACK.

3. Send the CX24118A desired register address = n, and receive an ACK.

4. Send the byte destined for register n, and receive an ACK.

5. Send the byte destined for register n+1, and receive an ACK.

6. Send the byte destined for register n+2, and receive an ACK.

7. Send the data destined for register n+m, and receive an ACK

8. Send the Stop condition.

The above-described multiple-bytes write procedure is shown in Figure 7.

In the figure, the following abbreviations are used:

S = Start

Dev Addr/wr = Device address with a write command

A = Acknowledge

P = Stop

Figure 7. Typical Multiple-B ytes Write Procedure

Typical Single-Byte Read Procedure

1. Send the Start condition.

2. Send the CX24118A slave address, a write bit, and receive an ACK.

3. Send the CX24118A desired register address = n, and receive an ACK.

4. Send the Start condition.

5. Send the part's slave address, a read bit, and receive an ACK.

6. Receive the byte from the desired register n, and do not supply an ACK.

102322_008

SA AAPDev Addr/wr

Master Slave Master Master SlaveSlave

Reg. Address = n Data (n)

102322_009

SA AADev Addr/wr

Master Slave Master Master SlaveSlave

Reg. Address = n Data (n)

AAAPData (n+1) Data (n+2)

Master Slave Master Master SlaveSlave

Data (n+m)

Product data sheet Rev. 02 — 8 September 2009 25

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

7. Send the Stop condition.

The above-described single-byte read procedure is shown in Figure 8.

In the figure, the following abbreviations are used:

S = Start

Dev Addr/wr = Device address with a write command

A = Acknowledge

P = Stop

Dev Addr/r = Device address with a read command

Figure 8. Typical Single-Byte Read Procedure

Multiple-Bytes Read Procedure

1. Send the Start condition.

2. Send the CX24118A slave address, a write bit, and receive an ACK.

3. Send the CX24118A desired register address = n, and receive an ACK.

4. Send the Start condition.

5. Send the part's slave address, a read bit, and receive an ACK.

6. Receive the byte from register n, and supply an ACK.

7. Receive the byte from register n+1, and supply an ACK.

8. Receive the byte from register n+2, and supply an ACK.

9. Receive the data from register n+m, and do not supply an ACK.

10. Send the Stop condition.

The above-described multiple-bytes read procedure is shown in Figure 9.

In the figure, the following abbreviations are used:

S = Start

Dev Addr/wr = Device address with a write command

A = Acknowledge

P = Stop

Dev Addr/r = Device address with a read command

NOTE: When reading data from a slave, no ACK is supplied from master after the

last desired byte.

NOTE: When reading data from a slave, no ACK is supplied from master after the

last desired byte.

102322_010

SA ASDev Addr/wr Dev Addr/rd

Master Slave Master Slave

Reg. Address = n

Master

AAPData (n)

Slave Master Slave

Product data sheet Rev. 02 — 8 September 2009 26

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

Figure 9. Typical Multiple-B ytes Read Procedure

3.2 Registers

The register bit map is shown in Table 6.

Table 6. Register Bit Map (Sheet 1 of 2)

Global

00 CHPId[7:0]

01 CHPVer[7:0]

02 Reserved OUTRefDiv PLLRefDiv Reserved

Tuner

10 DSMClkPol DSMByp CPMan[1:0] CPDVal[1:0] TUNLD CPSel

11 CPLevel1[1:0] CPLevel2[1:0] CPLevel3[1:0] CPLevel4[1:0]

12 BsDelayVal[3:0] Reserved CPCtrl CPVal[1:0]

13 Reserved

14 TUNAutoEn[1:0] TUN1[5:0]

15 TUN2[7:0]

16 TUN3[7:0]

17 TUN4[7:0]

18 VCOSel[5] LODivSel VCOSel[4:0] VCOBandSel

19 PLLIntDiv[8:1]

1A PLLIntDiv[0] PLLFracDiv[17:11]

102322_011

SA ASDev Addr/wr Dev Addr/rd

Master Slave Master Slave

Reg. Address = n

Master

AAData (n) Data (n+1)

Slave Master Slave

AData (n+m)

MasterSlave

Product data sheet Rev. 02 — 8 September 2009 27

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

3.3 Register Index

The register index is shown in Table 7.

1B PLLFracDiv[10:3]

1C PLLFracDiv[2:0] TUNReset Reserved

1D Reserved BBFAmpGain[3:0]

1E BBFil1BW[1:0] BBFil2BW[5:0]

1F Reserved BBVGA2Off[2:0] BBVGA1Off[2:0]

20 Reserved RFVCABCDis RFVCAOff[1:0] Reserved

21 Reserved CPEn PSEn BBEn DCCorrEn Reserved RFVCAEn

FOOTNOTES:

(1) The values in this column are hexadecimal.

Table 7. Register Index

Field Name Address(1) Description

BBEn 21[3] Baseband Enable.

BBFAmpGain[3:0] 1D[3:0] Final Baseband Amplifier Gain.

BBFil1BW[1:0] 1E[7:6] Baseband Filter 1 Bandwidth.

BBFil2BW[5:0] 1E[5:0] Baseband Filter 2 Bandwidth.

BBVGA1Off[2:0] 1F[2:0] Baseband VGA1 Offset Control.

BBVGA2Off[2:0] 1F[5:3] Baseband VGA2 Offset Control.

BsDelayVal[3:0] 12[7:4] VCO Tuning System Delay.

CHPId[7:0] 00[7:0] Chip Identification Number.

CHPVer[7:0] 01[7:0] Chip Version Number.

CPCtrl 12[2] Charge Pump Control.

CPDVal[1:0] 10[3:2] Digital Charge Pump Valve.

CPEn 21[5] Charge Pump Enable.

CPLevel1[1:0] 11[7:6] Automatic Charge Pump Level 1 Select.

CPLevel2[1:0] 11[5:4] Automatic Charge Pump Level 2 Select.

CPLevel3[1:0] 11[3:2] Automatic Charge Pump Level 3 Select.

CPLevel4[1:0] 11[1:0] Automatic Charge Pump Level 4 Select.

Table 6. Register Bit Map (Sheet 2 of 2)

Product data sheet Rev. 02 — 8 September 2009 28

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

CPMan[1:0] 10[5:4] Manual Analog Charge Pump Select.

CPSel 10[0] Manual Override of Automatic Charge Pump Level Select.

CPVal[1:0] 12[1:0] Analog Charge Pump Level.

DCCorrEn 21[2] DC Offset Correction Enable.

DSMByp 10[6] Delta Sigma Modulator Bypass.

DSMClkPol 10[7] DSM Clock Polarity Select.

LODivSel 18[ 6] Local Oscillator (LO) Divide r Selec t.

OUTRefDiv 02[2] Output Reference Divider.

PLLFracDiv[17:0] 1A[6:0],

1B[7:0],

1C[7:5]

PLL Fractional Divider.

PLLIntDiv[8:0] 19[7:0],

1A[7] PLL Integer Divider.

PLLRefDiv 02[1] PLL Reference Divider.

PSEn 21[4] Prescaler Enable.

RFVCABCDis 20[4] RF VCA Bias Control Circuit Disable.

RFVCAEn 21[0] RF VCA Enable.

RFVCAOff[1:0] 20[3:2] RF VCA Offset Select.

TUN1[5:0] 14[5:0] Tuning System Configuration Register 1.

TUN2[7:0] 15[7:0] Tuning System Configuration Register 2.

TUN3[7:0] 16[7:0] Tuning System Configuration Register 3.

TUN4[7:0] 17[7:0] Tuning System Configuration Register 4.

TunAutoEn[1:0] 14[7:6] Auto-tuning System Enable.

TUNLD 10[1] PLL Lock Detect.

TUNReset 1C[4] Tuning System Reset.

VCOBandSel 18[0] VCO Band Select.

VCOSel[5:0] 18[7],

18[5:1] VCO Select.

FOOTNOTES:

(1) The values in this column are hexadecimal.

Table 7. Register Index

Field Name Address(1) Description

Product data sheet Rev. 02 — 8 September 2009 29

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

3.4 Register Detail

This section provides the register detail.

NOTE: POR refers to power-on reset value.

NOTE: All bits in the registers are Read/Write unless indicated otherwise in the bit

description.

00 43 CHPId[7:0]

CHPId[7:0] Chip Identification Number.

The current chip ID is 0x2 3. Read only.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

01 03 CHPVer[7:0]

CHPVer[7:0] Chip Version Number.

The current chip ve rsion is 0x03. Read only.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

02 00 Reserved OUTRefDiv PLLRefDiv Reserved

OUTRefDiv Output Reference Divider.

This bit selects the reference clock divider for the CKREF_OUT pin. See Section 2.5 for more detail.

0 = ÷1.

1 = ÷2.

PLLRefDiv PLL Reference Divider.

This bit selects the divi der for the tuner synthesizer reference frequency.

0 = ÷1.

1 = ÷2.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

10 00 DSMClkPol DSMByp CPMan[1:0] CPDVal[1:0] TUNLD CPSel

Product data sheet Rev. 02 — 8 September 2009 30

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

DSMClkPol DSM Clock Polarity Select.

0 = No clock inversion.

1 = Clock inversion. Use this setting for normal operation.

DSMByp Delta Sigma Modulator Bypass.

1 = Disables the delta sig m a mo d ulator, resulting in integer division.

0 = Delta sigma modulator along with prescaler defines the divider. Normal operation.

CPMan[1:0] Manual Analog Charge Pump Select.

Selection of analo g cha rge pu mp leve l in man ua l mo de whe n re gister bi t C PSel i s set to 1. Th e le vels a re de fin ed as

follows:

00b = 0.5 mA.

01b = 1.0 mA.

10b = 1.5 mA.

11b = 2.0 mA.

CPDV al[1:0] Digital Charge Pump Valve.

The digital charge pump is enabled during tuning only.

00b = 0.5 x analog charge pump level.

01b = 1.0 x analog charge pump level.

10b = 2.0 x analog charge pump level. Use this setting for normal operation.

11b = 3.0 x analog charge pump level.

TUNLD PLL Lock Detect.

0 = Synthesizer not frequency locked.

1 = Synthesizer is frequency locked.

CPSel Manual Override of Automatic Charge Pump Level Select.

0 = Automatic charge pump current selection.

1 = Manual charge pump current selection.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

11 00 CPLevel1[1:0] CPLevel2[1:0] CPLevel3[1:0] CPLevel4[1:0]

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

Product data sheet Rev. 02 — 8 September 2009 31

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

CPLevel1[1:0] Automatic Charge Pump Level 1 Select.

Charge pump level 1 is sele cted by the automatic tuning system when the VCO tuning voltage is greater than 2.0 V.

For normal operation, set to 11b.

CPLevel2[1:0] Automatic Charge Pump Level 2 Select.

Charge pump level 2 is selected by t he automatic tuning system when the VCO tuning voltage is between 1.5 V and

2.0 V.

For normal operation, set to 11b.

CPLevel3[1:0] Automatic Charge Pump Level 3 Select.

Charge pump level 3 is selected by t he automatic tuning system when the VCO tuning voltage is between 1.0 V and

1.5 V.

For normal operation, set to 10b.

CPLevel4[1:0] Automatic Charge Pump Level 4 Select.

Charge pump level 4 is selected by the automatic tuning syst em when the VCO tuning voltage is low er than 1.0 V.

For normal operation, set to 00b.

For each of the above register fields, the analog charge pump levels are set as follows:

00b = 0.5 mA.

01b = 1.0 mA.

10b = 1.5 mA.

11b = 2.0 mA.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

12 80 BsDelayVal[3:0] Reserved CPCtrl CPVal[1:0]

BsDelayVal[3:0] VCO Tuning System Delay.

VCO tuning system delay in reference clock cycles between the time tuning system is enabled and tuning starts. The

default is 8 counts and can be set between 0 and 15 counts of reference cycle. The reference cycle period is:

TREF = R/Reference oscillator frequency

R is the reference di vider value selected by register bit PLLRefDiv (0x02[1]).

For normal operation, set to 0x8.

CPCtrl Charge Pump Control.

0 = Analog charge pump turns OFF when the digital charge pump turns ON (when register bit TUNLD (0x10[1 ]) is

low).

1 = Analog charge pump always ON. Use this setting for nor mal operation.

CPV al[1:0] Analog Charge Pump Level.

This is the value selected by the automatic tuning system, as specified in register 0x11. The values correspond to the

following charge pump levels. Read only.

00b = 0.5 mA.

01b = 1.0 mA.

10b = 1.5 mA.

11b = 2.0 mA.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

14 00 TUNAutoEn[1:0] TUN1[5:0]

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

Product data sheet Rev. 02 — 8 September 2009 32

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

TUNAutoEn[1:0] Auto-tuning System Enable.

00b = Auto-tuning mode. The auto-tuning system selects the VCO. Normal operation.

01b = Manual tuning mode. The VCO is selected using register field VCOSel[5:0].

10b - 11b = Reserved.

TUN1[5:0] Tuning System Configuration Register 1.

For normal operation, set to 0x0F.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

15 00 TUN2[7:0]

TUN2[7:0] Tuning System Configuration Register 2.

For normal operation, set to 0xFF.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

16 00 TUN3[7:0]

TUN3[7:0] Tuning System Configuration Register 3.

For normal operation, set to 0xFF.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

17 00 TUN4[7:0]

TUN4[7:0] Tuning System Configuration Register 4.

For normal operation, set to 0xF0.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

18 00 VCOSel[5] LODivSel VCOSel[4:0] VCOBandSel

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

Product data sheet Rev. 02 — 8 September 2009 33

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

VCOSel[5] VCO 6 Select.

This bit, when read, indicates if VCO6 is selected.

0 = VCO 6 deselected.

1 = VCO 6 selected when VCOSel[4:0] = 00000b.

LODivSel Local Oscillator (LO) Divider Select.

This bit, when read, indicates the LO divider selected by the auto-tuning system. When written to, this bit selects the

divider.

0 = ÷2.

1 = ÷4.

VCOSel[4:0] VCO Select.

These bits, when rea d, in dica te the V CO se lected by t he au to -tun ing syst em. Th e V CO can be ma nu all y select ed by

writing to these bits. Only one VCO should be selected at a time.

00000b = None of these VCOs are selected.

00001b = VCO5 selected.

00010b = VCO4 selected.

00100b = VCO3 selected.

01000b = VCO2 selected.

10000b = VCO1 selected.

VCOBandSel VCO Band Select.

This bit is common to all VCOs.

This bit, when read, indicates the VCO band selected by the auto-tuning system. When written to, this bit selects the

VCO band.

0 = High band.

1 = Low band.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

19 00 PLLIntDiv[8:1]

1A 00 PLLIntDiv[0] PLLFracDiv[17:11]

1B 00 PLLFracDiv[10:3]

1C 10 PLLFracDiv[2:0] TUNReset Reserved

PLLIntDiv[8:0] PLL Integer Divider.

PLLFracDiv[17:0] PLL Fractional Divider.

TUNReset Tuning System Reset.

Setting this bit to 1 resets the auto-tuning system and starts the auto-tuning process. Write only.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

1D 00 Reserved BBFAmpGain[3:0]

BBFAmpGain[3:0] Final Baseband Amplifier Gain.

0000b = 37 dB gain.

0001b = 34 dB gain.

0011 b = 31 dB ga in. Use th is set ting unde r all cond itions .

0111b = 28 dB gain.

1111b = 25 dB gain.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

Product data sheet Rev. 02 — 8 September 2009 34

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

1E 00 BBFil1BW[1:0] BBFil2BW[5:0]

BBFil1BW[1:0] Baseband Filter 1 Band wi dth .

00b = 100 MHz.

01b = 65 MHz. Use this setting for 30–45 MSps operation.

10b = 40 MHz. Use this setting for 20–30 MSps operation.

11b = 35 MHz. Use this setting for 1–20 MSps operation.

BBFil2BW[5:0] Baseband Filter 2 Band w idth .

The filter bandwidth set is given by:

BW = 2 + BBFil2BW[5:0]

The bandwidth is adjustable in 63 steps with a step size of 1 MHz. The bandwidth range is 2 MHz to

65 MHz.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

1F 00 Reserved BBVGA2Off[2:0] BBVGA1Off[2:0]

BBVGA2Off[2:0] Baseband VGA2 Offset Control.

000b = –41 dB .

100b = –39 dB .

010b = –37 dB .

110b = –35 dB.

001b = –33 dB .

101b = –31 dB. Use this setting when fixed gain set tings are desired.

011b = –29 dB. Use this setting for minimum signal levels.

111b = –27 dB. Use this setting for maximum signal levels.

BBVGA1Off[2:0] Baseband VGA1 Offset Control.

000b = –36 dB .

100b = –34 dB .

010b = –32 dB. Use this setting for minimum signal levels.

110b = –30 dB.

001b = –28 dB. Use this setting when fixed gain set tings are desired.

101b = –26 dB .

011b = –24 dB.

111b = –22 dB. Use this setting for maximum signal levels.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

20 00 Reserved RFVCABCDis RFVCAOff[1:0] Reserved

Product data sheet Rev. 02 — 8 September 2009 35

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

RFVCABCDis RF VCA Bias Control Circuit Disable.

The VCA is made up of multiple, parallel, gain stages. When stages are unused, they are either turned off, or

completely disabled by shutting off their bias, according to the state of this bit.

0 = Bias in unused stages is turned off.

1 = Bias in unused stages is not turned off.

RFVCAOff[1:0] RF VCA Offset Select.

00b = –70 dB. Use thi s setting for maximum signal levels, and when fixed gain settings are desired.

01b = –67 dB.

10b = –64 dB. Use this setting for minimum si gnal levels.

11b = –6 1 dB.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

21 00 Reserved CPEn PSEn BBEn DCCorrEn Reserved RFVCAEn

CPEn Charge Pump Enable.

1 = Enable.

0 = Disable.

PSEn Prescaler Enable.

1 = Enable.

0 = Disable.

BBEn Baseband Enable.

1 = Enable.

0 = Disable.

DCCorrEn DC Offset Correction Enable.

1 = Enable.

0 = Disable.

RFVCAEn RF VCA Enable.

1 = Enable.

0 = Disable.

(Hex) POR D7 D6 D5 D4 D3 D2 D1 D0

Product data sheet Rev. 02 — 8 September 2009 36

NXP Semiconductors CX24118A

Chapter 3: Serial Programming Interface and Registers

Product data sheet Rev. 02 — 8 September 2009 37

CX24118A

Chapter 4: Application Information

Rev. 02 — 8 September 2009 Product data sheet

4.1 Thermal Recommendations

The CX24118A uses a thermally enhanced QFN package with an exposed paddle

underneath the device to dissipate heat. The exposed p addle is soldered directly to exposed

PCB ground on the top layer of the board. Thermal vias then connect the top PCB layer to

the other board layers. The more layers that are used, the better the thermal properties of the

chip will be. Table 8 lists the CX24118A thermal layout recommendations.

4.2 Sleep Mode Procedures

4.2.1 Changing from Normal Operation to Sleep Mode

To change the tuner from normal operation to sleep mode, use the following procedure:

1. Set register field TUNAutoEn[1:0] (0x14[7:6]) to 01b.

2. Set register field VCOSel[5:0] (0x18[7] and 0x18[5:0]) to 0.

3. Set the system enable bits (0x21[5:0]) to 0x00.

4.2.2 Changing from Sleep Mode to Normal Operation

To change the tuner from sleep mode to normal operation, use the following procedure:

1. Set register field TUNAutoEn[1:0] (0x14[7:6]) to 01b.

2. Set the system enable bits (0x21[5:0]) to 0x3F.

3. Restart the tuning system by setting TUNReset to 1.

Table 8. Thermal Recommendations

Parameter Recommendations

Number of PCB layers(1) 2 or 4

Numbers of thermal vias 16 (4x4 square matrix)

Thermal via spacing 0.85 mm from center to center

Solder mask opening under exposed

paddle(2) 3.7 x 3.7 mm

Metallization land pattern 3.7 x 3.7 mm

Via diameter 0.33 mm drill-hole size with 1 oz copper plating.

FOOTNOTES:

(1) As many of the layers should be grounded and connected to the thermal vias as possible.

(2) Same as the package exposed paddle. The area outside the solder mask opening to the pin pads

should be covered with solder mask.

Product data sheet Rev. 02 — 8 September 2009 38

NXP Semiconductors CX24118A

Chapter 4: Application Information

Product data sheet Rev. 02 — 08 September 2009 39

CX24118A

Chapter 5: Electrical, Thermal, and Mechanical Specification s

Rev. 02 — 08 September 2009 Product data sheet

5.1 S11 Plot

Figure 10. S11 Plot

102322_015

GENERAL NOTES:

1. m1

Frequency = 2.175 GHz

S (1,1) = 0.626 / -119.116

Impedance = Z0 * (0.304 - j0.547)

2. m2

Frequency = 925.0 MHz

S (1,1) = 0.482 / -84.258

Impedance = Z0 * (0.676 - j0.845), where Z0 = 50 Ω

3. The measurement was taken at the input of the device using a short 50 Ω coaxial cable stub.

m1 m2

Product data sheet Rev. 02 — 08 September 2009 40

NXP Semiconductors CX24118A

Chapter 5: Electrical, Thermal, and Mechanical Specifications

5.2 Electrical and Thermal Specifications

5.2.1 Absolute Maximum Ratings

5.2.2 Recommended Operating Conditions

5.2.3 Receiver Electrical and Thermal Specifications

Table 9. Absolute Maximum Ratings

Parameters Minimum Maximum Units

Supply voltage –0.3 3.6 V

Input voltage range (digital) –0.3 Vcc V

Storage temperature –65 +150 °C

Junction temperature +150 °C

Table 10. Recommended Operatin g Conditions

Parameter Minimum Typical Maximum Units

Ambient operating temperature 0 +25 +70 °C

Supply voltage 3.13 3.3 3.47 V

Table 11. Receiver Electrical Specifications (Sheet 1 of 3)

Parameter Conditions Min Typ Max Units

Supply current 160 240 mA

Powerdown current(1) 11 mA

RF frequency 925 2175 MHz

Input power(2) –69

(–81) –23

(–6) dBm

LO leakage(4) –80 –70 dBm

Gain control voltage 0.1 3 Volts

Maximum voltage gain At 1 MSps (Pin = –81 dBm) 77 dB

At 20 MSps (Pin = –70 dBm) 66 dB

At 45 MSps (Pin = –65 dBm) 61 dB

AGC range Gain control voltage

0.5 to 2. 5 V 90 dB

Vout into minimum load of 500 Ω single-ended

or 1 kΩ differential Single-ended 500 1000 mVpp

Product data sheet Rev. 02 — 08 September 2009 41

NXP Semiconductors CX24118A

Chapter 5: Electrical, Thermal, and Mechanical Specifications

Harmonics on baseband outputs @ 1 Vpp output

level (single-ended) –30 dBc

I/Q phase balance ±3 ±5 Deg.

I/Q amplitude balance ±1 ±3 dB

Noise figure floor at minimum input level of

–70 dBm SR = 20 MSps, filter BW = 18.5 MHz 10 12 dB

Passband amplitude ripple at baseband output DC to 0.8 x f3dB(4) 1dB

Group delay ripple at baseband output

170 kHz to 0.8 x f3dB SR = 1 MSps

f3dB = 3.175 MHz(5) 66 ns

SR = 20 MSps

f3dB = 16 MHz(5) 57 ns

SR = 45 MSps

f3dB = 33 MHz(5) 37 ns

Stopband attenuat ion at 2 * f3dB(4) at baseband

output 33 dB

Stopband attenuat ion at 3 * f3dB(4) at baseband

output 40 dB

IIP3 (Out-of-band)(6) +(31 and 60) MHz, Pin = –30 dBm(8) –5 10 dBm

+(91 and 180) MHz, Pin = –30 dBm(8) 5.5 10 dBm

In-Band OIP3 (into 1 kΩ load) –1 18 dBm

Spurious rejection (2xLO – RF) wanted and

interferer level set at –25dBm –30 –40 dBc

Spurious rejection (2xRF - LO) wanted and

interferer level set at –25 dBm –40 –45 dBc

Thermal resistance

of package θjc: using two-layer board 7.2 °C/W

θja: using two-layer board 47 °C/W

θjc: using four-layer board 4.8 °C/W

θja: using four-layer board 31.5 °C/W

Serial Interface Specifications

Serial programming interface clock f reque ncy 1 MHz

Input voltage High logic voltage: VIH 2.1 V

Low logic voltage: VIL 1.05 V

LO Specifications

Table 11. Receiver Electrical Specifications (Sheet 2 of 3)

Parameter Conditions Min Typ Max Units

Product data sheet Rev. 02 — 08 September 2009 42

NXP Semiconductors CX24118A

Chapter 5: Electrical, Thermal, and Mechanical Specifications

Operating VCO frequency 2330 4660 MHz

Tuning step size @ 40 MHz fref 160 Hz

Reference frequency 40 MHz

Spurs 1 MHz to 40 MHz offset frequencies –40 –30 dBc

Integrated DSB phase noise with 40 MHz reference

frequency Integrated from 1 kHz to 1 MHz offset

frequencies –44 –36 dBc

Lock time(8) Between any two frequencies within the

operating range of 925 MHz to 2175

MHz

15msec

Reference Oscillator Output Specifications

Reference oscillator output frequency(9) 40 (20) MHz

Reference oscillator output level 2 Vp–p

Reference oscillator output DC offset 1.6 V

FOOTNOTES:

(1) This is the current drawn when all blocks are disabled except the crystal oscillator and digital sections.

(2) –25 dBm is single tone power and –6 dBm is the aggregate average power of 40 QPSK modulated carriers.

–69 dBm is the minimum power at 20 MSps, and –81 dB is the minimum power at 1 MSps.

(3) This LO leakage is at RF_INP pin from 925 MHz–2175 MHz.

(4) f3dB is the baseband bandwidth given by:

(5) f3dB is calculated for alpha of 0.35, LNBoffset of 2.5 MHz. PLL step size, being very small (160 Hz), can be ignored.

(6) These IIP3 tone offsets are specifically for a symbol rate of 20 MSps, with the overall filter bandwidth set at 18.5 MHz and the bandwidth

of the filter at the mixer output set at 35 MHz. The IIP3 tone offsets scale with symbol rate assuming a channel spacing of 1.5*SR. Thus

the ±(31,60) MHz tones correspond to ±(1.5*SR, 3*SR) MHz and the ±(91,180) MHz tones correspond to ±(4.5*SR, 9*SR) MHz.

(7) This level is derived assuming –23 dBm is the maximum level of all other transponders, an operating symbol rate of 20 MSps and a C/I of

7 dB.

(8) From after serial communication has been received to stable lock.

(9) The output level is across 10 kΩ || 20 pF load. The output waveform is sinusoidal when register bit OUTRefDiv (0x02[2]) is set to ÷1, and

is a square wave when OutRefDiv is set to ÷2.

Table 11. Receiver Electrical Specifications (Sheet 3 of 3)

Parameter Conditions Min Typ Max Units

--------1 alpha+()×LNBoffset 1

---PLL step size()×++

Product data sheet Rev. 02 — 08 September 2009 43

NXP Semiconductors CX24118A

Chapter 5: Electrical, Thermal, and Mechanical Specifications

5.3 Mechanical Specifications

The CX24118A uses two 36-pin Quad Flat No-Lead (QFN) plastic packages.

The CX24118A package diagrams are shown in Figure 11 and Figure 12.

Figure 11. Package Diagram

102322_006

TOP VIEW

Pin 1

Indicator

DD1

A1A3

SIDE VIEW

BOTTOM VIEW

Pin 1

Indicator

4 x P

See Detail A

----

0.00

----

3.55

0.18

0.50

0.24

----

0.90

0.05

0.70

3.85

0.30

0.75

0.60

0.85

0.01

0.65

0.20 REF.

6.00 BSC

5.75 BSC

3.70

0.23

0.50 BSC

0.60

0.42

----

Dim.

Min. Max.Nom.

All Dimensions

in Millimeters

4 x P

Detail A

Seating

Plane

Product data sheet Rev. 02 — 08 September 2009 44

NXP Semiconductors CX24118A

Chapter 5: Electrical, Thermal, and Mechanical Specifications

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT1092-2 - - -

- - -

sot1092-2_po

Unit

mm max

nom

min

1.00

0.85

0.80

0.05

0.02

0.00

0.30

0.21

0.18 0.2 6.1

6.0

5.9

6.1

6.0

5.9 0.5 0.1 0.05

A(1)

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

VQFN36: plastic thermal enhanced very thin quad flat package; no leads;

6 terminals; body 6 x 6 x 0.85 mm SOT1092

-2

A1bcD

(1)

0.1

4.05

3.90

3.75

E(1) Eh

4.05

3.90

3.75

0.65

0.55

0.45

0.05

0 2.5 5 mm

scale

terminal 1

index area

terminal 1

index area

eAC B

vCw

10 18

2836

detail X

09-02-23

09-02-24

Figure 12. Package Diagram

Product data sheet Rev. 02 — 8 September 2009 45

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

Legal information

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[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Definitions

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internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warrant ies as to t he accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Disclaimers

General — In formation in this document is believed to be accurate and

reliable. However, NXP Semiconductors d oes not give an y represent ations or

warranties, expressed or impli ed, as to the accuracy or completeness of such

information and shall have no liability for th e co nsequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and with out

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraf t,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ra tings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other co nditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may af fect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertain i ng to warranty,

intellectual property rights infringement and limitation of liability, unless

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any inconsistency or conflict between inf ormation in this document and such

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No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

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Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respective ow ners.

I2C-bus — logo is a tradema rk of NXP B.V.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors CX24118A

Advanced Modulation Digital Satellite Tuner

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 8 September 2009

Document identifier: CX24118A_N_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.