100k 1M 10M 100M 200M
Gain (dB)
Frequency (Hz)
Phase (°)
0
-2
-4
0
50
100
25°C
85°C
-40°C
PHASE
GAIN
100k 1M 10M 200M
Frequency (Hz)
-4
-2
0
Gain (dB)
Phase (°)
0
50
100
AV = +2
AV = +5
AV = +10
AV = +1
GAIN
PHASE
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
LMH664x 2.7 V, 650 μA, 55 MHz, Rail-to-Rail Input and Output Amplifiers
with Shutdown Option
1 Features 3 Description
The LMH6645 (single) and LMH6646 (dual), rail-to-
1 (VS= 2.7V, TA= 25°C, RL= 1kto V+/2, AV= +1. rail input and output voltage feedback amplifiers, offer
Typical Values Unless Specified. high speed (55 MHz), and low voltage operation (2.7
3dB BW 55 MHz V) in addition to micro-power shutdown capability
Supply Voltage Range 2.5 V to 12 V (LMH6647, single).
Slew Rate 22 V/μsInput common mode voltage range exceeds either
Supply Current 650 μA/channel supply by 0.3 V, enhancing ease of use in multitude
of applications where previously only inferior devices
Output Short Circuit Current 42 mA could be used. Output voltage range extends to
Linear Output Current ±20 mA within 20 mV of either supply rails, allowing wide
Input Common Mode Voltage 0.3 V Beyond Rails dynamic range especially in low voltage applications.
Even with low supply current of 650 μA/amplifier,
Output Voltage Swing 20 mV from Rails output current capability is kept at a respectable ±20
Input Voltage Noise 17 nV/Hz mA for driving heavier loads. Important device
Input Current Noise 0.75 pA/Hz parameters such as BW, Slew Rate and output
current are kept relatively independent of the
2 Applications operating supply voltage by a combination of process
enhancements and design architecture.
Active Filters
High Speed Portable Devices Device Information(1)
Multiplexing Applications (LMH6647) PART NUMBER PACKAGE BODY SIZE (NOM)
Current Sense Buffer SOT-23 (5) 2.90 mm × 1.60 mm
LMH6645
High Speed Transducer Amp SOIC (8) 4.90 mm × 3.91 mm
SOIC (8) 4.90 mm × 3.91 mm
LMH6646 VSSOP (8) 3.00 mm × 3.00 mm
SOT-23 (6) 2.92 mm × 1.60 mm
LMH6647 SOIC (8) 4.90 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Closed Loop Frequency Response
Frequency Response for Various AVfor Various Temperature
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Table of Contents
8.2 Functional Block Diagram....................................... 18
1 Features.................................................................. 18.3 Feature Description................................................. 19
2 Applications ........................................................... 18.4 Device Functional Modes........................................ 20
3 Description............................................................. 19 Application and Implementation ........................ 22
4 Revision History..................................................... 29.1 Application Information............................................ 22
5 Description (continued)......................................... 39.2 Typical Application.................................................. 22
6 Pin Configuration and Functions......................... 310 Power Supply Recommendations ..................... 23
7 Specifications......................................................... 411 Layout................................................................... 24
7.1 Absolute Maximum Ratings ..................................... 411.1 Layout Guidelines ................................................. 24
7.2 Handling Ratings....................................................... 411.2 Layout Example .................................................... 24
7.3 Recommended Operating Conditions....................... 412 Device and Documentation Support................. 25
7.4 Thermal Information.................................................. 412.1 Documentation Support ........................................ 25
7.5 Electrical Characteristics 2.7 V................................. 512.2 Related Links ........................................................ 25
7.6 Electrical Characteristics 5V .................................... 712.3 Trademarks........................................................... 25
7.7 Electrical Characteristics ±5V .................................. 912.4 Electrostatic Discharge Caution............................ 25
7.8 Typical Performance Characteristics ...................... 11 12.5 Glossary................................................................ 25
8 Detailed Description............................................ 18 13 Mechanical, Packaging, and Orderable
8.1 Overview................................................................. 18 Information........................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2013) to Revision D Page
Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions,
Application and Implementation;Power Supply Recommendations;Layout;Device and Documentation Support;
Mechanical, Packaging, and Ordering Information................................................................................................................. 1
Changes from Revision B (April 2013) to Revision C Page
Changed layout of National Data Sheet to TI format ............................................................................................................. 1
2Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
V+
1
2
3
45
6
7
8
N/C
-IN
+IN
V-
OUTPUT
N/C
SD
+
-
OUTPUT
V-
+IN
V+
-IN
+-
1
2
3
5
4
6
SD
V+
1
2
3
4 5
6
7
8
N/C
-IN
+IN
V-
OUTPUT
N/C
N/C
+
-
OUTPUT
V-
+IN
V+
-IN
+-
1
2
3
5
4
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
5 Description (continued)
In portable applications, the LMH6647 provides shutdown capability while keeping the turn-off current to less
than 50 μA. Both turn-on and turn-off characteristics are well behaved with minimal output fluctuations during
transitions. This allows the part to be used in power saving mode, as well as multiplexing applications. Miniature
packages (SOT-23, VSSOP-8, and SOIC-8) are further means to ease the adoption of these low power high
speed devices in applications where board area is at a premium.
6 Pin Configuration and Functions
SOT-23-5 (LMH6645) SOIC-8 (LMH6645) SOIC-8 and VSSOP-8 (LMH6646)
Package DBV05A Package D08A Packages D08A and DGK08A
Top View Top View Top View
SOT-23-6 (LMH6647) SOIC-8 (LMH6647)
Package DBV06A Package D08A
Top View Top View
Pin Functions
PIN
NUMBER I/O DESCRIPTION
NAME LMH6645 LMH6646 LMH6647
DBV05A D08A DGK08A DBV06A D08A
-IN 4 2 4 2 I Inverting input
+IN 3 3 3 3 I Non-inverting input
-IN A 2 I Inverting Input Channel A
+IN A 3 I Non-inverting input Channel A
-IN B 6 I Inverting input Channel B
+IN B 5 I Non-inverting input Channel B
N/C 1,5,8 1,5 –– No Connection
OUTPUT 1 6 1 6 O Output
OUT A 1 O Output Channel A
OUT B 7 O Output Channel B
SD 5 8 I Shutdown
V-2 4 4 2 4 I Negative Supply
V+ 5 7 8 6 7 I Positive Supply
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings (1)(2)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Output short circuit duration See (3) and (4)
VIN differential ±2.5 V
V++0.8,
Voltage at input/output pins V
V0.8
Supply voltage (V+- V) 12.6 V
Junction temperature(5) +150
Infrared or Convection (20 sec) 235 °C
Soldering Information Wave Soldering (10 sec) 260
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) Output short circuit duration is infinite for VS< 6 V at room temperature and below. For VS> 6 V, allowable short circuit duration is 1.5
ms.
(5) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
7.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range 65 +150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000
pins(1)
V(ESD) Electrostatic discharge V
Machine model (MM)(2) 200
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. Human body
model, 1.5 kin series with 100pF.
(2) JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process. Machine model, 0
in series with 200 pF.
7.3 Recommended Operating Conditions(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Supply Voltage (V+ V) 2.5 12 V
Temperature Range(2) 40 +85 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board.
7.4 Thermal Information LMH6645 LMH6646 LMH6647
THERMAL METRIC(1) SOT-23 SOIC-8 VSSOP-8 SOT-23 SOIC-8 UNIT
5 PINS 8 PINS 8 PINS 8 PINS 6 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 265 190 190 235 265 190 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
7.5 Electrical Characteristics 2.7 V
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 2.7V, V= 0V, VCM = VO= V+/2, and Rf= 2k, and RL=
1kto V+/2. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
AV= +1, VOUT = 200 mVPP,
BW 3dB BW 40 55 MHz
VCM = 0.7 V
f = 100 kHz 17
enInput-referred voltage noise nV/Hz
f = 1 kHz 25
f = 100 kHz 0.75
inInput-referred current noise pA/Hz
f = 1 kHz 1.20
Cross-talk rejection f = 5MHz, Receiver:
CT Rej. 47 dB
(LMH6646 only) Rf= Rg= 510 , AV= +2
AV=1, VO= 2 VPP
SR Slew rate 15 22 V/μs
See (3),(4)
Turn-on time
TON 250 ns
(LMH6647 only)
Turn-off time
TOFF 560 ns
(LMH6647 only)
Shutdown threshold
THSD IS50μA 1.95 2.30 V
(LMH6647 only)
Shutdown pin input current
ISD See (5) 20 μA
(LMH6647 only)
3 ±1 3
VOS Input offset voltage 0V VCM 2.7 V mV
-40°C TJ85°C 4 4
TC VOS Input offset average drift See (6) ±5 μV/°C
0.40 2
VCM = 2.5 V (5) -40°C TJ85°C 2.2
IBInput bias current μA
0.68 2
VCM = 0.5 V (5) -40°C TJ85°C 2.2
IOS Input offset current 0 V VCM 2.7 V 1 500 nA
Common mode input
RIN 3 M
resistance
Common mode input
CIN 2 pF
capacitance
0.5 0.3
-40°C TJ85°C 0.1
Input common-mode
CMVR CMRR 50dB V
voltage range 3.0 3.2
-40°C TJ85°C 2.8
VCM Stepped from 0 V to 2.7 V 46 77
Common mode rejection
CMRR dB
ratio VCM Stepped from 0 V to 1.55 V 58 76
76 87
AVOL Large signal voltage gain VO= 0.35 V to 2.35 V dB
-40°C TJ85°C 74
RL= 1k to V+/2 2.55 2.66
Output swing high V
RL= 10k to V+/2 2.68
VORL= 1k to V+/2 40 150
Output swing low mV
RL= 10k to V+/2 20
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) Slew rate is the average of the rising and falling slew rates.
(4) ensured based on characterization only.
(5) Positive current corresponds to current flowing into the device.
(6) Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Electrical Characteristics 2.7 V (continued)
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 2.7V, V= 0V, VCM = VO= V+/2, and Rf= 2k, and RL=
1kto V+/2. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Sourcing to V43
VID = 200mV (7)(8)
ISC Output short circuit current mA
Sinking to V+42
VID =200mV (7)(8)
IOUT Output current VOUT = 0.5V from rails ±20 mA
V+= 2.7V to 3.7V or
PSRR Power supply rejection ratio 75 83 dB
V= 0V to 1V
Normal Operation 650 1250
Supply current
ISμA
(per channel) Shutdown Mode (LMH6647 only) 15 50
(7) Short circuit test is a momentary test.
(8) Output short circuit duration is infinite for VS< 6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5ms.
6Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
7.6 Electrical Characteristics 5V
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V= 0V, VCM = VO= V+/2, and Rf= 2k, and RL=
1kto V+/2. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
BW 3dB BW AV= +1, VOUT = 200 mVPP 40 55 MHz
f = 100kHz 17
enInput-referred voltage noise nV/Hz
f = 1kHz 25
f = 100kHz 0.75
inInput-referred current noise pA/Hz
f = 1kHz 1.20
Cross-talk rejection f = 5MHz, Receiver:
CT Rej. 47 dB
(LMH6646 only) Rf= Rg= 510, AV= +2
AV=1, VO= 2 VPP
SR Slew rate 15 22 V/μs
See (3),(4)
Turn-on time
TON 210 ns
(LMH6647 only)
Turn-off time
TOFF 500 ns
(LMH6647 only)
Shutdown threshold IS50μA
THSD 4.25 4.60 V
(LMH6647 only)
Shutdown pin input current See (5)
ISD 20 μA
(LMH6647 only) 0V VCM 5V 3 ±1 3
VOS Input offset voltage mV
-40°C TJ85°C 4 4
TC VOS Input offset average drift See (6) ±5 μV/C
VCM = 4.8V(5) +0.36 +2
-40°C TJ85°C 2.2
IBInput bias current μA
VCM = 0.5V(5) 0.68 2
-40°C TJ85°C 2.2
IOS Input offset current 0V VCM 5V 1 500 nA
Common mode input
RIN 3 M
resistance
Common mode input
CIN 2 pF
capacitance
0.5 0.3
-40°C TJ85°C 0.1
Input common-mode
CMVR CMRR 50dB V
voltage range 5.3 5.5
-40°C TJ85°C 5.1
VCM Stepped from 0V to 5V 56 82
Common mode rejection
CMRR dB
ratio VCM Stepped from 0V to 3.8V 66 85
76 85
AVOL Large signal voltage gain VO= 1.5V to 3.5V dB
-40°C TJ85°C 74
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) Slew rate is the average of the rising and falling slew rates.
(4) ensured based on characterization only.
(5) Positive current corresponds to current flowing into the device.
(6) Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Electrical Characteristics 5V (continued)
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V= 0V, VCM = VO= V+/2, and Rf= 2k, and RL=
1kto V+/2. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
RL= 1k to V+/2 4.80 4.95
Output swing high V
RL= 10k to V+/2 4.98
VORL= 1k to V+/2 50 200
Output swing low mV
RL= 10k to V+/2 20
Sourcing to V55
VID = 200mV (7)(8)
ISC Output short circuit current mA
Sinking to V+53
VID =200mV (7)(8)
IOUT Output current VOUT = 0.5V From rails ±20 mA
PSRR Power supply rejection ratio V+= 5V to 6V or V= 0V to 1V 75 95 dB
Normal Operation 700 1400
Supply current (per
ISμA
channel) Shutdown Mode (LMH6647 only) 10 50
(7) Short circuit test is a momentary test.
(8) Output short circuit duration is infinite for VS< 6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5ms.
8Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
7.7 Electrical Characteristics ±5V
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V=5V, VCM = VO= 0V, Rf= 2k, and RL= 1kto
GND. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
BW 3dB BW AV= +1, VOUT = 200 mVPP 40 55 MHz
f = 100 kHz 17
enInput-referred voltage noise nV/Hz
f = 1 kHz 25
f = 100 kHz 0.75
inInput-referred current noise pA/Hz
f = 1 kHz 1.20
Cross-talk rejection f = 5MHz, Receiver:
CT Rej. 47 dB
(LMH6646 only) Rf= Rg= 510 Ω, AV= +2
SR Slew rate AV=1, VO= 2 VPP(3) 15 22 V/μs
Turn-on time
TON 200 ns
(LMH6647 only)
Turn-off time
TOFF 700 ns
(LMH6647 only)
Shutdown threshold
THSD IS50 μA 4.25 4.60 V
(LMH6647 only)
Shutdown pin input current
ISD See (4) 20 μA
(LMH6647 only)
3 ±1 3
VOS Input offset voltage 5V VCM 5 V mV
-40°C TJ85°C 4 4
TC VOS Input offset average drift See (5) ±5 μV/°C
+0.40 +2
VCM = 4.8 V (4) -40°C TJ85°C +2.2
IBInput bias current μA
0.65 2
VCM =4.5 V (4) -40°C TJ85°C 2.2
IOS Input offset current 5V VCM 5 V 3 500 nA
Common mode input
RIN 3 M
resistance
Common mode input
CIN 2 pF
capacitance
5.5 5.3
-40°C TJ85°C 5.1
Input common-mode
CMVR CMRR 50dB V
voltage range 5.3 5.5
-40°C TJ85°C 5.1
VCM Stepped from 5 V to 5 V 60 84
Common mode rejection
CMRR dB
ratio VCM Stepped from 5 V to 3.5 V 66 104
76 85
AVOL Large signal voltage gain VO=2 V to 2 V dB
-40°C TJ85°C 74
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) Slew rate is the average of the rising and falling slew rates.
(4) Positive current corresponds to current flowing into the device.
(5) Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Electrical Characteristics ±5V (continued)
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V=5V, VCM = VO= 0V, Rf= 2k, and RL= 1kto
GND. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
RL= 1 k4.70 4.92
Output swing high V
RL= 10 k4.97
VORL= 1 k 4.93 4.70
Output swing low V
RL= 10 k 4.98
Sourcing to V66
VID = 200 mV(6)(7)
ISC Output short circuit current mA
Sinking to V+61
VID =200 mV(6)(7)
IOUT Output current VOUT = 0.5V from rails ±20 mA
PSRR Power supply rejection ratio V+= 5 V to 6 V or V=5 V to 6 V 76 95 dB
Normal Operation 725 1600
Supply current (per
ISμA
channel) Shutdown Mode (LMH6647 only) 10 50
(6) Short circuit test is a momentary test.
(7) Output short circuit duration is infinite for VS< 6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5ms.
10 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
VOUT (VPP)
100k 1M 10M
0.1
1
10
Frequency (Hz)
123456
-70
-65
-60
-55
-50
-45
-40
-35
-30
THD (dBc)
VOUT (VPP)
VS = ±2.5 V VS = ±5 V
100k 1M 10M 100M
Frequency (Hz)
0
10
30
50
70
Gain (dB)
60
40
20
Phase (°)
-20
0
20
40
60
80
100
PHASE
GAIN 85°C
-40°C
-40°C
85°C
123 4 567
VOUT (VPP)
-80
-75
-70
-65
-60
-55
-50
THD (dBc)
8
VS = ±2.5 V VS = ±5 V
100k 1M 10M 100M 200M
Gain (dB)
Frequency (Hz)
Phase (°)
0
-2
-4
0
50
100
25°C
85°C
-40°C
PHASE
GAIN
100k 1M 10M 200M
Frequency (Hz)
-4
-2
0
Gain (dB)
Phase (°)
0
50
100
AV = +2
AV = +5
AV = +10
AV = +1
GAIN
PHASE
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
7.8 Typical Performance Characteristics
At TJ= 25°C. Unless otherwise specified.
VS= ±5 V RL= 1 kΩ
AV= + 1 VS= ±2.5 V RL= 1k
VOUT = 200 mVpp
Figure 2. Frequency Response for Various AV
Figure 1. Closed Loop Frequency Response
for Various Temperature
RL= 500 Ωf = 100 KHz AV= +2
VS= ±2.5 V RL= 2k
Figure 4. THD vs. Output Swing
Figure 3. Open Loop Gain/Phase vs. Frequency
for Various Temperature
RL= 500 Ωf = 1 MHz AV= +2 RL= 500 ΩAV= +2 VS= ±5 V
Rf= Rg= 2K
Figure 5. THD vs. Output Swing Figure 6. Output Swing vs. Frequency
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LMH6645 LMH6646 LMH6647
0500 1.5k
RL (:)
10
100
1k
10k
VOUT from V+ (mV)
2k
1k
2.7 V
5 V
10 V
2.5k
RL (:)
10
100
1k
10k
VOUT from V+ (mV)
2.7 V
5 V
10 V
0500 1.5k 2.5k
2k
1k
.01 .1 110 100
ISINK (mA)
0.01
0.1
1.0
10
VOUT from V- (V)
-40°C
-40°C
85°C
85°C
VOUT from V+ (V)
.01 .1 110 100
ISOURCE (mA)
0.01
0.1
1.0
10
25°C
-40°C
-40°C
85°C
85°C
10 100 1k 10k 100k
FREQUENCY (Hz)
10
100
1000
en (nV/ Hz)
in (pA/ Hz)
10.00
1.00
0.10
VOLTAGE
CURRENT
01 2 3 4
0
50
100
150
200
250
Settling Time (ns)
Step Amplitude (VPP)
±0.1%
±1%
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Typical Performance Characteristics (continued)
At TJ= 25°C. Unless otherwise specified.
VS= ±2.5 V RL = 500 ΩCL= 13 pF
AV= -1
Figure 7. Settling Time vs. Step Size Figure 8. Noise vs. Frequency
VS= 10 V VS= 10 V
Figure 9. VOUT from V+vs. ISOURCE Figure 10. VOUT from Vvs. ISINK
T = 25°C AV= +1 T = -40°C AV= +1
Figure 11. Output Swing from V+vs. RL(tied to VS/2) Figure 12. Output Swing from V+vs. RL(Tied to VS/2)
12 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
Closed Loop Gain
1
10
100
1k
10k
CL (pF)
ts (± 1% Settling with CL) (ns)
1
10
100
1k
10k
ts
CL
12345
10k 100k 1M 10M 200M
Frequency (Hz)
0.02
0.1
100
500
ZOUT (:)
10
1.0
0500 1.5k 25k
RL (:)
10
100
1k
10k
VOUT from V- (mV)
2k
1k
2.7 V
5 V
10 V
0500 1.5k 2.5k
RL (:)
10
100
1k
10k
VOUT from V- (mV)
2k
1k
2.7 V
5 V
10 V
0500 1.5k 2.5k
RL (:)
10
100
1k
10k
VOUT from V+ (mV)
2k
1k
2.7 V
5 V
10 V
0RL (:)
10
100
1k
10k
VOUT from V- (mV)
2.7 V
5 V
10 V
500 1.5k 2.5k
2k
1k
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
Typical Performance Characteristics (continued)
At TJ= 25°C. Unless otherwise specified.
T = 25°C AV= +1
T = 85°C AV= +1
Figure 14. Output Swing from Vvs. RL(Tied to VS/2)
Figure 13. Output Swing from V+vs. RL(Tied to VS/2)
T = 85°C AV= +1
T = 40°C AV= +1
Figure 16. Output Swing from Vvs. RL(Tied to VS/2)
Figure 15. Output Swing from Vvs. RL(Tied to VS/2)
VS= ±2.5 V AV= +1
VS= +5 V 200 mVpp STEP 30% OVERSHOOT
Figure 18. ZOUT vs. Frequency
Figure 17. Cap Load Tolerance and Setting Time
vs. Closed Loop Gain
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LMH6645 LMH6646 LMH6647
12345678910 12
-0.3
-0.25
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
VOS (mV)
VS (V)
11
-40°C
25°C
85°C
0246810 12
-0.25
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
0.25
VOS (mV)
VOUT (V)
25°C
-40°C
85°C
-2
1k 10k 100k 1M 10M
Frequency (Hz)
30
40
50
60
70
80
90
100
CT (rej) (dB)
1k 10k 100k 1M 10M
Frequency (Hz)
10
20
30
40
50
60
70
80
90
CMRR (dB)
10
20
30
40
50
60
110
PSRR (dB)
100 1k 10k 100k 1M
Frequency (Hz)
70
80
90
100
10M
+PSRR
-PSRR
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Typical Performance Characteristics (continued)
At TJ= 25°C. Unless otherwise specified.
VS= ±2.5V RF= 10 kΩRG= 1 kΩVS= 5 V
Figure 19. PSRR vs. Frequency Figure 20. CMRR vs. Frequency
Receive CH.: AV= +2 VS= ±5 V N = 19k UNITS σ= 4.6 mV
Rf= Rg= 510
Figure 21. Crosstalk Rejection vs. Frequency Figure 22. VOS Distribution
(Output to Output, LMH6646)
VS= 10 V RL= 10 kΩto VS/2
VCM = 0.5 V
Figure 24. VOS vs. VOUT (a Typical Unit)
Figure 23. VOS vs. VS(a Typical Unit)
14 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
-0.5 00.5 11.5 22.5 3
VCM (V)
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
IB (µA)
85°C
-40°C
25°C
25°C -40°C
85°C
-5 5
VCM (V)
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
IB (µA)
-1 13
85°C
-40°C
25°C
-40°C 25°C
85°C
-3
-2
VCM (V)
-0.1
0
0.1
0.2
0.3
0.5
0.6
VOS (mV)
0 2 46810 12
25°C
85°C
-40°C
0.4
-1 VCM (V)
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
VOS (mV)
0123456
-40°C
25°C
85°C
-0.5
VCM (V)
0
0.1
0.2
0.
3
0.4
0.5
0.6
VOS (mV)
0 0.5 1 1.5 2 2.5 3
VS = 2.7V
25°C
85°C
-
40°C
0246810 12
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.4
VOS (mV)
VOUT (V)
25°C
-40°C
85°C
0.3
-2
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
Typical Performance Characteristics (continued)
At TJ= 25°C. Unless otherwise specified.
VS= 10 V RL= 1 kΩto VS/2 VS= 2.7 V
Figure 25. VOS vs. VOUT (a Typical Unit) Figure 26. VOS vs. VCM (a Typical Unit)
VS= 5 V VS= 10 V
Figure 27. VOS vs. VCM (a Typical Unit) Figure 28. VOS vs. VCM (a Typical Unit)
VS= ±5 V
VS= 2.7 V
Figure 30. IBvs. VCM
Figure 29. IBvs. VCM
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LMH6645 LMH6646 LMH6647
-0.5 0.5 1.5 2.5 3.5 4.5 5.5
-0.1
0
0.1
0.2
0.3
0.4
0.
5
0.6
0.7
0.8
0.9
IS (mA)
VSHUTDOWN (V)
85°C
-40°C
25°C
VS = 5V
-6 -4 -2 024 6
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
IS (mA)
VSHUTDOWN (V)
85°C
-40°C
25°C
12468 10 11 12
0.4
0.45
0.5
0.55
0.6
0.65
0.7
0.75
0.8
0.85
0.9
IS (mA) (per channel)
VS (V)
85°C
-40°C
25°C
3579
-0.15 0.35 0.85 1.35 1.85 2.35 2.85
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
IS (mA)
VSHUTDOWN (V)
85°C
-40°C
25°C
1246810 11 12
-0.7
-0.68
-0.66
-0.64
-0.62
-0.60
-0.58
-0.56
-0.54
-0.52
-0.50
IB (µA)
VS (V)
85°C
-40°C
25°C
3579
-7 -5 -3 -1 1357
0.45
0.5
0.55
0.6
0.65
0.7
0.75
0.8
0.85
0.9
0.95
IS (mA) (per channel)
VCM (V)
85°C
-40°C
25°C
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
Typical Performance Characteristics (continued)
At TJ= 25°C. Unless otherwise specified.
VCM = 0.2 V VS= ±5 V
Figure 31. IBvs. VSFigure 32. ISvs. VCM
VS= 2.7 V
VS= ±5 V VCM = 0.2 V
Figure 34. ISvs. VSHUTDOWN (LMH6647)
Figure 33. IS(mA) vs. Vs(V)
VS= ±5 V
VS= 5 V
Figure 36. ISvs. VSHUTDOWN (LMH6647)
Figure 35. ISvs. VSHUTDOWN (LMH6647)
16 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
1 V/DIV
400 ns/DIV
INPUT
OUTPUT
0.2 V/DIV
40 ns/DIV
0.2 V/DIV
40 ns/DIV
-3.5 -1.5 1.5 3.5
VSHUTDOWN (V)
1
10
100
1000
IVCC (µA)
-0.5 2.5-2.5 0.5
SHUTDOWN
PIN CURRENT
IVCC
85°C
25°C
-40°C
85°C
-40°C
25°C
-0.1
-1
-10
-100
ISHUTDOWN PIN (P$)
40 mV/DIV
20 ns/DIV
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
Typical Performance Characteristics (continued)
At TJ= 25°C. Unless otherwise specified.
VS= ±5 V RL= 1kΩAV= +1
VS= ±2.5 V VOUT = 0.2 Vpp
Figure 38. Small Signal Step Response
Figure 37. Shutdown Pin and Supply Current
vs. Shutdown Voltage (LMH6647)
VS= 5 V RL= 1 kΩVOUT = 1 Vpp
VS= 2.7 V RL= 1 kΩVOUT = 1 Vpp AV= -1
AV= +1
Figure 40. Large Signal Step Response
Figure 39. Large Signal Step Response
AV= +2 RL= 1 kΩ
VS= ±2.5 V Rf= Rg= 2 kΩ
Figure 41. Output Overload Recovery
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LMH6645 LMH6646 LMH6647
D1
D2
D3
D4
NON-INVERTING
INPUT
INVERTING
INPUT
RS
200-400:
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
8 Detailed Description
8.1 Overview
The LMH664x family is based on proprietary VIP10 dielectrically isolated bipolar process.
This device family architecture features the following:
Complimentary bipolar devices with exceptionally high ft(8 GHz) even under low supply voltage (2.7 V) and
low Collector bias current.
Rail-to-Rail input which allows the input common mode voltage to go beyond either rail by about 0.5 V
typically.
A class A-B “turn-around” stage with improved noise, offset, and reduced power dissipation compared to
similar speed devices (patent pending).
Common Emitter push-pull output stage capable of 20 mA output current (at 0.5 V from the supply rails) while
consuming only 700 μA of total supply current per channel. This architecture allows output to reach within
mV of either supply rail at light loads.
Consistent performance from any supply voltage (2.7 V to 10 V) with little variation with supply voltage for the
most important specifications (BW, SR, IOUT, for example)
8.2 Functional Block Diagram
Figure 42. LMH6647 Equivalent Input in Shutdown Mode
During shutdown, the input stage has an equivalent circuit as shown below in Figure 42.
18 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
2 V/DIV 2.00 µs/DIV
VOUT
SD
SD
RS
10k
+
-
Q1
LMH6647
5V
VIN
SHUTDOWN
INPUT
VOUT
V-
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
8.3 Feature Description
8.3.1 LMH6647 Micro-power Shutdown
To keep the output at or near ground during shutdown when there is no other device to hold the output low, a
switch (transistor) could be used to shunt the output to ground. Figure 43 shows a circuit where a NPN bipolar is
used to keep the output near ground (80 mV):
Figure 43. Active Pull-Down Schematic
Figure 44 shows the output waveform.
Figure 44. Output Held Low by Active Pull-Down Circuit
NOTE
For normal operation, tie the SD pin to V.
If bipolar transistor power dissipation is not tolerable, the switch could be by a N-channel enhancement mode
MOSFET.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
8.4 Device Functional Modes
The LMH6647 can be shutdown to save power and reduce its supply current to less than 50 μA ensured, by
applying a voltage to the SD pin. The SD pin is “active high” and needs to be tied to Vfor normal operation. This
input is low current (< 20 μA, 4 pF equivalent capacitance) and a resistor to V(20 k) will result in normal
operation. Shutdown is ensured when SD pin is 0.4V or less from V+at any operating supply voltage and
temperature.
In the shutdown mode, essentially all internal device biasing is turned off in order to minimize supply current flow
and the output goes into Hi-Z (high impedance) mode. Complete device Turn-on and Turn-off times vary
considerably relative to the output loading conditions, output voltage, and input impedance, but is generally
limited to less than 1μs (see tables for actual data).
As seen in Figure 42 in shutdown, there may be current flow through the internal diodes shown, caused by input
potential, if present. This current may flow through the external feedback resistor and result in an apparent output
signal. In most shutdown applications the presence of this output is inconsequential. However, if the output is
“forced” by another device such as in a multiplexer, the other device will need to conduct the current described in
order to maintain the output potential.
The total input common mode voltage range, which extends from below Vto beyond V+, is covered by both an
NPN and a PNP stage. The NPN stage is switched on whenever the input is less than 1.2 V from V+and the
PNP stage covers the rest of the range. In terms of the input voltage, there is an overlapping region where both
stages are processing the input signal. This region is about 0.5 V from beginning to the end. As far as the device
application is concerned, this transition is a transparent operation. However, keep in mind that the input bias
current value and direction will depend on which input stage is operating (see Figure 29). For low distortion
applications, it is best to keep the input common mode voltage from crossing this transition point. Low gain
settling applications, which generally encounter larger peak-to-peak input voltages, could be configured as
inverting stages to eliminate common mode voltage fluctuations.
In terms of the output, when the output swing approaches either supply rail, the output transistor will enter a
quasi-saturated state. A subtle effect of this operational region is that there is an increase in supply current in this
state (up to 1 mA). The onset of Quasi-saturation region is a function of output loading (current) and varies from
100 mV at no load to about 1 V when output is delivering 20 mA, as measured from supplies. Both input
common mode voltage and output voltage level affect the supply current (see Figure 32).
With 2.7V supplies and a common mode input voltage range that extends beyond either supply rail, the
LMH664x family is well suited to many low voltage/low power applications. Even with 2.7 V supplies, the -3dB
BW (@ AV= +1) is typically 55 MHz with a tested limit of 45 MHz. Production testing guarantees that process
variations will not compromise speed.
This device family is designed to avoid output phase reversal. With input over-drive, the output is kept near the
supply rail (or as close to it as mandated by the closed loop gain setting and the input voltage). Figure 45, below,
shows the input and output voltage when the input voltage significantly exceeds the supply voltages.
The output does not exhibit any phase reversal as some op amps do. However, if the input voltage range is
exceeded by more than a diode drop beyond either rail, the internal ESD protection diodes will start to conduct.
The current flow in these ESD diodes should be externally limited.
20 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
2 V/DIV 10.0 µs/DIV
INPUT OUTPUT
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
Device Functional Modes (continued)
Figure 45 demonstrates that the output is well behaved and there are no spikes or glitches due to the switching.
Switching times are approximately around 500 ns based on the time when the output is considered “valid”.
Figure 45. Input/Output Shown with Exceeded Input CMVR
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: LMH6645 LMH6646 LMH6647
+
-
+
-
LMH6647
LMH664
7
1/5
74HC04
1/5
74HC04
SELECT
INPUT
INPUT A
INPUT B
2k 2k
2k 2k
2.7V
2.7V
SHUTDOWN
SHUTDOWN
RL
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LMH664x family is well suited to many low voltage/low power applications and is designed to avoid output
phase reversal. Figure 45, for example, depicts the Input/Output Shown with Exceeded Input CMVR and
functions as a 2:1 MUX operating on a single 2.7-V power supply by utilizing the shutdown feature of the
LMH6647.
9.2 Typical Application
Figure 46. 2:1 MUX Operating off a 2.7V Single Supply
9.2.1 Design Requirements
This application requires fast, glitch-less transition between selected channels. The LMH6647 turn on and turn off
times are 250 ns and 560 ns respectively. Transition between channels is devoid of any excessive glitches.
9.2.2 Detailed Design Procedure
In this application, the LMH6647 output pins are directly tied to each other. The shutdown pin of each LMH6647
is driven in-opposite sense of the other (that is, “Low” on 1st LMH6647 with “High” on the 2nd LMH6647, and
vice versa). When shutdown is invoked, the device output enters Hi-Z state, while the alternate LMH6647 is
being powered on simultaneously. This way, the shutdown function serves the dual purpose of allowing only the
input associated with device which is not in shutdown to be selected and to appear at the output.
22 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
1 V/DIV 1 µs/DIV
VOUT
SELECT
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
Typical Application (continued)
9.2.3 Application Curve
Figure 47 shows the MUX output when selecting between a 1 MHz sine and a 250 KHz triangular waveform.
Figure 47. 2:1 MUX Output
10 Power Supply Recommendations
The LMH664x device family can operate off a single supply or with dual supplies. The input CM capability of the
parts (CMVR) extends covers the entire supply voltage range for maximum flexibility. Supplies should be
decoupled with low inductance, often ceramic, capacitors to ground less than 0.5 inches from the device pins.
The use of ground plane is recommended, and as in most high speed devices, it is advisable to remove ground
plane close to device sensitive pins such as the inputs.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
SNOS970D JUNE 2001REVISED NOVEMBER 2014
www.ti.com
11 Layout
11.1 Layout Guidelines
Generally, a good high-frequency layout will keep power supply and ground traces away from the inverting input
and output pins. Parasitic capacitances on these nodes to ground will cause frequency response peaking and
possible circuit oscillations. For more information, see Application Note OA-15, Frequent Faux Pas in Applying
Wideband Current Feedback Amplifiers (SNOA367).
Another important parameter in working with high speed/high performance amplifiers is the component values
selection. Choosing large valued external resistors will affect the closed loop behavior of the stage because of
the interaction of these resistors with parasitic capacitances. These capacitors could be inherent to the device or
a by-product of the board layout and component placement. Either way, keeping the resistor values lower will
diminish this interaction. On the other hand, choosing very low value resistors could load down nodes and will
contribute to higher overall power dissipation.
11.2 Layout Example
Figure 48. Layer2 Silk (SOT-23 Board Layout) Figure 49. Layer1 Silk (SOT-23 Board Layout)
24 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647
LMH6645
,
LMH6646
,
LMH6647
www.ti.com
SNOS970D JUNE 2001REVISED NOVEMBER 2014
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
Absolute Maximum Ratings for Soldering (SNOA549)
Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers, Application Note OA-15 (SNOA367)
Semiconductor and IC Package Thermal Metrics (SPRA953)
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
LMH6645 Click here Click here Click here Click here Click here
LMH6646 Click here Click here Click here Click here Click here
LMH6647 Click here Click here Click here Click here Click here
12.3 Trademarks
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 25
Product Folder Links: LMH6645 LMH6646 LMH6647
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH6645MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66
45MA
LMH6645MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66
45MA
LMH6645MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A68A
LMH6645MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A68A
LMH6646MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66
46MA
LMH6646MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66
46MA
LMH6646MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 A70A
LMH6646MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A70A
LMH6646MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A70A
LMH6647MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66
47MA
LMH6647MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH66
47MA
LMH6647MF NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 85 A69A
LMH6647MF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A69A
LMH6647MFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A69A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMH6645MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6645MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6645MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6646MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6646MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMH6646MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMH6646MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMH6647MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6647MF SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6647MF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6647MFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH6645MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6645MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6645MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMH6646MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6646MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMH6646MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMH6646MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMH6647MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6647MF SOT-23 DBV 6 1000 210.0 185.0 35.0
LMH6647MF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LMH6647MFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2017
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
0.22
0.08
0.25
3.0
2.6
2X 0.95
1.9
1.45 MAX
TYP
0.15
0.00
5X 0.5
0.3
TYP
0.6
0.3
TYP
8
0
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/C 04/2017
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
www.ti.com
PACKAGE OUTLINE
C
TYP
0.22
0.08
0.25
3.0
2.6
2X 0.95
1.9
1.45 MAX
TYP
0.15
0.00
5X 0.5
0.3
TYP
0.6
0.3
TYP
8
0
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/C 04/2017
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LMH6646MA LMH6646MA/NOPB LMH6646MAX LMH6646MAX/NOPB LMH6646MM LMH6646MM/NOPB
LMH6646MMX LMH6646MMX/NOPB LMH6646 MDC