19-1945; Rev 6; 1/12 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package The MAX4691-MAX4694 are low-voltage CMOS analog ICs configured as an 8-channel multiplexer (MAX4691), two 4-channel multiplexers (MAX4692), three singlepole/double-throw (SPDT) switches (MAX4693), and four SPDT switches (MAX4694). The MAX4691/MAX4692/MAX4693 operate from either a single +2V to +11V power supply or dual 2V to 5.5V power supplies. When operating from 5V supplies they offer 25 on-resistance (RON), 3.5 (max) RON flatness, and 3 (max) matching between channels. The MAX4694 operates from a single +2V to +11V supply. Each switch has rail-to-rail signal handling and a low 1nA leakage current. All digital inputs are 1.8V logic-compatible when operating from a +3V supply and TTL compatible when operating from a +5V supply. The MAX4691-MAX4694 are available in 16-pin, 4mm 4mm QFN and TQFN and 16-bump UCSP packages. The chip-scale package (UCSPTM) occupies a 2mm 2mm area, significantly reducing the required PC board area. Applications Features o 16 Bump, 0.5mm-Pitch UCSP (2mm x 2mm) o 1.8V Logic Compatibility o Guaranteed On-Resistance 70 (max) with +2.7V Supply 35 (max) with +5V Supply 25 (max) with 4.5V Dual Supplies o Guaranteed Match Between Channels 5 (max) with +2.7V Supply 3 (max) with 4.5V Dual Supplies o Guaranteed Flatness Over Signal Range 3.5 (max) with 4.5V Dual Supplies o Low Leakage Currents Over Temperature 20nA (max) at +85C o Fast 90ns Transition Time o Guaranteed Break-Before-Make o Single-Supply Operation from +2V to +11V o Dual-Supply Operation from 2V to 5.5V (MAX4691/MAX4692/MAX4693) o V+ to V- Signal Handling o Low Crosstalk: -90dB (100kHz) Audio and Video Signal Routing Cellular Phones o High Off-Isolation: -88dB (100kHz) Battery-Operated Equipment Communications Circuits Ordering Information Modems TEMP RANGE PIN-PACKAGE MAX4691EBE+T -40C to +85C 16-Bump UCSP* MAX4691EGE+ -40C to +85C 16 QFN-EP MAX4691ETE+T -40C to +85C 16 TQFN-EP MAX4692EBE+T -40C to +85C 16-Bump UCSP* MAX4692EGE+ -40C to +85C 16 QFN-EP MAX4692ETE+T -40C to +85C 16 TQFN-EP MAX4693EBE+T -40C to +85C 16-Bump UCSP* MAX4693EGE+ -40C to +85C 16 QFN-EP X5 MAX4693ETE+T -40C to +85C 16 TQFN-EP X6 MAX4694EBE+T -40C to +85C 16-Bump UCSP* X7 MAX4694EGE+ -40C to +85C 16 QFN-EP MAX4694ETE+T -40C to +85C 16 TQFN-EP Functional Diagrams MAX4691 X0 X1 X2 X3 X X4 LOGIC A B EN C Pin Configurations appear at end of data sheet. Functional Diagrams continued at end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc. PART *UCSP reliability is integrally linked to the user's assembly methods, circuit board, and environment. See the UCSP Reliability section for more information. EP = Exposed pad. +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. MAX4691-MAX4694 General Description MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package ABSOLUTE MAXIMUM RATINGS V+ to GND ..............................................................-0.3V to +12V V+ to V- (MAX4691/MAX4692/MAX4693) ..............-0.3V to +12V Voltage into any Terminal (Note 1) ...... (V- - 0.3V) to (V+ + 0.3V) Continuous Current into any Terminal ............................. 20mA Peak Current W_, X_, Y_, Z_ (pulsed at 1ms, 10% duty cycle)...........................................................40mA ESD per Method 3015.7......................................................> 2kV Continuous Power Dissipation (TA = +70C) 16-Bump UCSP (derate 8.2mW/C above +70C) .... 659mW 16-Pin QFN (derate 18.5mW/C above +70C) ....... 1481mW 16-Pin TQFN (derate 16.9mW/C above +70C) ..... 1349mW Operating Temperature Range .......................... -40C to +85C Storage Temperature Range ............................ -65C to +150C Lead Temperature (TQFN, QFN only, soldering, 10s).... +300C Soldering Temperature (reflow) ...................................... +260C Note 1: Voltages exceeding V+ or V- on any signal terminal are clamped by internal diodes. Limit forward-diode current to maximum current rating. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS--Single +3V Supply (V+ = +2.7V to +3.6V, V- = 0V, VIH = +1.4V, VIL = +0.4V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Notes 2, 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN -40C to +85C 0 TYP MAX UNITS V+ V ANALOG SWITCH Analog Signal Range On-Resistance (Note 5) On-Resistance Match Between Channels (Notes 5, 6) 2 VW, VX, VY, VZ, VW_, VX_, VY_, VZ_ RON V+ = 2.7V; IW, IX, IY, IZ = 1mA VW_, VX_, VY_, VZ_ = 1.5V RON V+ = 2.7V; IW, IX, IY, IZ = 1mA VW_, VX_, VY_, VZ_ = 1.5V W_, X_, Y_, Z_ OffLeakage Current (Note 7) IW_, IX_, IY_, IZ_ V+ = 3.6V; VW, VX, VY, VZ = 3V, 0.6V; VW_, VX_, VY_, VZ_ = 0.6V, 3V W, X, Y, Z Off-Leakage Current (Note 7) IW(OFF), IX(OFF), IY(OFF), IZ(OFF) V+ = 3.6V; VW, VX, VY, VZ = 3V, 0.6V; VW_, VX_, VY_, VZ_ = 0.6V, 3V W, X, Y, Z On-Leakage Current (Note 7) IW(ON), IX(ON), IY(ON), IZ(ON) V+ = 3.6V; VW, VX, VY, VZ = 0.6V, 3V; VW_, VX_, VY_, VZ_ = 0.6V, 3V, or unconnected +25C 45 -40C to +85C 70 80 +25C 2 5 -40C to +85C 6 +25C -1 +1 -40C to +85C -10 +10 +25C -2 +2 -40C to +85C -20 +20 +25C -2 +2 -40C to +85C -20 +20 nA nA nA _______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package (V+ = +2.7V to +3.6V, V- = 0V, VIH = +1.4V, VIL = +0.4V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Notes 2, 3, 4) PARAMETER Input Off-Capacitance Output Off-Capacitance SYMBOL CW_(OFF), CX_(OFF), CY_(OFF), CZ_(OFF) CX(OFF), CY(OFF), CZ(OFF) CW(ON), CX(ON), CY(ON), CZ(ON) On-Capacitance CONDITIONS f = 1MHz, Figure 7 TA MIN +25C f = 1MHz, Figure 7 MAX4692 UNITS pF 68 +25C pF 36 MAX4693 20 MAX4691 78 MAX4692 MAX 9 MAX4691 f = 1MHz, Figure 7 TYP 46 +25C MAX4693 pF 30 DYNAMIC Enable Turn-On Time (MAX4691/MAX4692/ MAX4693) tON Enable Turn-Off Time (MAX4691/MAX4692/ MAX4693) tOFF VW_, VX_, VY_, VZ_ = 1.5V; RL = 300,CL = 35pF, Figure 2 +25C 180 300 ns 350 -40C to +85C +25C 70 100 VW_, VX_, VY_, VZ_ = 1.5V; RL = 300,CL = 35pF, Figure 2 -40C to +85C tTRANS VW_, VX_, VY_, VZ_ = 0V, 1.5V; RL = 300, CL = 35pF, Figure 3 -40C to +85C tBBM VW_, VX_, VY_, VZ_ = 1.5V; RL = 300, CL = 35pF, Figure 4 Q VGEN = 0V; RGEN = 0; CL = 1nF, Figure 5 +25C 0.1 pC Off-Isolation (Note 8) VISO f = 0.1MHz, RL = 50, CL = 5pF, Figure 6 +25C -70 dB Crosstalk (Note 9) VCT f = 0.1MHz, RL = 50, CL = 5pF, Figure 6 +25C -75 dB Address Transition Time Break-Before-Make Charge Injection ns 120 +25C 200 350 400 +25C 2 -40C to +85C 2 90 ns ns DIGITAL I/O Input Logic-High VIH 1.4 Input Logic-Low VIL Input Leakage Current IIN VA, VB, VC, V EN = 0V or V+ I+ V+ = 3.6V, VA, VB, VC, VEN = 0V or V+ -1 V 0.4 V +1 A SUPPLY Positive Supply Current +25C 0.1 -40C to +85C 1 A _______________________________________________________________________________________ 3 MAX4691-MAX4694 ELECTRICAL CHARACTERISTICS--Single +3V Supply (continued) MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package ELECTRICAL CHARACTERISTICS--Single +5V Supply (V+ = +4.5V to +5.5V, V- = 0V, VIH = +2V, VIL = +0.8V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Notes 2, 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN -40C to +85C 0 TYP MAX UNITS V+ V ANALOG SWITCH Analog Signal Range On-Resistance (Note 5) On-Resistance Match Between Channels (Notes 5, 6) On-Resistance Flatness (Note 10) W_, X_ , Y_, Z_ Off-Leakage Current (Note 7) W, X, Y, Z Off-Leakage Current (Note 7) W, X, Y, Z On-Leakage Current (Note 7) VW, VX, VY, VZ, VW_, VX_, VY_, VZ__ RON +25C V+ = 4.5V; IW, IX, IY, IZ = 1mA; VW_, VX_, VY_, VZ_ = 3.5V -40C to +85C 25 40 +25C RON RFLAT(ON) V+ = 4.5V; IW, IX, IY, IZ = 1mA; VW_, VX_, VY_, VZ_ = 3.5V 35 2 4 -40C to +85C 5 +25C V+ = 4.5V; IW, IX, IY, IZ = 1mA; VW_, VX_, VY_, VZ_ = 1V, 2.25V, 3.5V -40C to +85C IW_, IX_, IY_, IZ_ +25C V+ = 5.5V; VW, VX, VY, VZ = 4.5V, 1V_; VW_, VX_, VY_, VZ_ = 1V, 4.5V -40C to +85C IW(OFF), IX (OFF), IY(OFF), IZ(OFF) +25C V+ = 5.5V; VW, VX, VY, VZ = 4.5V, 1V_; VW_, VX_, VY_, VZ_ = 1V, 4.5V -40C to +85C IW(ON), IX(ON), IY(ON), IZ(ON) +25C V+ = 5.5V; VW, VX, VY, VZ = 1V, 4.5V_; VW_, VX_, VY_, VZ_ = 1V, 4.5V, or unconnected -40C to +85C 2 6 8 -1 +1 -10 +10 -2 +2 nA nA -20 +20 -2 +2 -20 +20 nA DYNAMIC +25C Enable Turn-On Time (MAX4691/MAX4692/MAX4693) tON VW_, VX_, VY_, VZ_ = 3V; RL = 300, CL = 35pF, Figure 2 -40C to +85C Enable Turn-Off Time (MAX4691/MAX4692/MAX4693) tOFF VW_, VX_, VY_, VZ_ = 3V; RL = 300, CL = 35pF, Figure 2 -40C to +85C Address Transition Time Break-Before-Make Charge Injection 4 tTRANS tBBM Q VW_, VX_, VY_, VZ_ = 0V, 3V; RL = 300, CL = 35pF, Figure 3 VW_, VX_, VY_, VZ_ = 3V; RL = 300, CL = 35pF, Figure 4 VGEN = 0V; RGEN = 0; CL = 1nF, Figure 5 90 150 +25C 45 60 70 +25C 100 -40C to +85C +25C 2 2 35 0.2 _______________________________________________________________________________________ ns ns 140 160 -40C to +85C +25C 130 ns ns pC Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package (V+ = +4.5V to +5.5V, V- = 0V, VIH = +2V, VIL = +0.8V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Notes 2, 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN TYP MAX UNITS Off-Isolation (Note 8) VISO f = 0.1MHz, RL = 50, CL = 5pF Figure 6 +25C -80 dB Crosstalk (Note 9) VCT f = 0.1MHz, RL = 50, CL = 5pF Figure 6 +25C -87 dB DIGITAL I/O Input Logic-High VIH Input Logic-Low 2 V VIL Input Leakage Current ILEAKAGE VIN_ = 0V or V+ -1 0.8 V +1 A SUPPLY Positive Supply Current I+ V+ = 5.5V; VIN_ = 0V or V+ +25C -40C to +85C 0.1 -1 A 1 ELECTRICAL CHARACTERISTICS--Dual 5V Supplies (MAX4691/MAX4692/MAX4693 only) (V+ = +4.5V to +5.5V, V- = -4.5V to -5.5V, VIH = +2V, VIL = +0.8V, TA = -40C to +85C, unless otherwise noted.) (Notes 2, 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN -40C to +85C V- TYP MAX UNITS V+ V ANALOG SWITCH Analog Signal Range On-Resistance (Note 5) On-Resistance Match Between Channels (Notes 5, 6) On-Resistance Flatness (Note 10) X_ , Y_, Z_ Off-Leakage Current (Note 7) X, Y, Z Off-Leakage Current (Note 7) VX, VY, VZ, VX_, VY_, VZ_ RON +25C V+ = 4.5V; IX, IY, IZ = 10mA; V- = -4.5V; VX_, VY_, VZ_ = 3.5V -40C to +85C 18 30 +25C RON RFLAT(ON) V+ = 4.5V; V- = -4.5V; IX, IY, IZ = 10mA; VX_, VY_, VZ_ = 3.5V 2 V+ = 5.5V; V- = -5.5V; VX, VY, VZ = +4.5V; VX_, VY_, VZ_ = 4.5V IX (OFF), IY(OFF), IZ(OFF) V+ = 5.5V; V- = -5.5V; VX, VY, VZ = +4.5V; VX_, VY_, VZ_ = 4.5V 3 -40C to +85C 4 +25C V+ = 4.5V; V- = -4.5V; IX, IY, IZ = 10mA; VX, VY, VZ = 3.5V, 0V, -3.5V -40C to +85C IX_, IY_, IZ_ 25 2.5 3.5 4 +25C -1 +1 -40C to +85C -10 +10 +25C -2 +2 -40C to +85C -20 +20 nA nA _______________________________________________________________________________________ 5 MAX4691-MAX4694 ELECTRICAL CHARACTERISTICS--Single +5V Supply (continued) MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package ELECTRICAL CHARACTERISTICS--Dual 5V Supplies (continued) (MAX4691/MAX4692/MAX4693 only) (V+ = +4.5V to +5.5V, V- = -4.5V to -5.5V, VIH = +2V, VIL = +0.8V, TA = -40C to +85C, unless otherwise noted.) (Notes 2, 3, 4) PARAMETER X, Y, Z On-Leakage Current (Note 7) SYMBOL IX(ON), IY(ON), IZ(ON) CONDITIONS V+ = 5.5V; V- = -5.5V; VX, VY, VZ = 4.5V; VX_, VY_, VZ_ = 4.5V, or unconnected TA MIN TYP MAX +25C -2 2 -40C to +85C -20 20 UNITS nA DYNAMIC tON +25C VX_, VY_, VZ_ = 3V; RL = 300, CL = 35pF, Figure 2 -40C to +85C 55 Enable Turn-On Time Enable Turn-Off Time tOFF +25C VX_, VY_, VZ_ = 3V; RL = 300, CL = 35pF, Figure 2 -40C to +85C 35 VX_, VY_, VZ_ = 0V, 3V; RL = 300, CL = 35pF, Figure 3 60 Address Transition Time Break-Before-Make Charge Injection tTRANS tBBM Q 80 90 50 60 +25C ns ns 90 ns -40C to +85C +25C VX_, VY_, VZ_ = 3V; RL = 300, CL = 35pF, Figure 4 -40C to +85C 100 2 20 ns 2 VGEN = 0V; R GEN = 0; CL = 1nF, Figure 5 +25C 1.8 pC Off-Isolation (Note 8) VISO f = 0.1MHz, RL = 50, CL = 5pF, Figure 6 +25C -82 dB Crosstalk (Note 9) VCT f = 0.1MHz, RL = 50, CL = 5pF, Figure 7 +25C -84 dB Total Harmonic Distortion THD f = 20Hz to 20kHz, VX, VY, VZ = 5Vp-p; RL = 600, +25C 0.02 % DIGITAL I/O Input Logic-High VIH 2 Input Logic-Low VIL Input Leakage Current IIN VA, VB, VC, V EN = 0V or V+ I+ V+ = 5.5V; V- = 5.5V; VA, VB, VC, V EN = 0V or V+ -1 V 0.8 V +1 A SUPPLY Positive Supply Current +25C 0.1 -40C to +85C 1 A Note 2: The algebraic convention, where the most negative value is a minimum and the most positive value is a maximum, is used in this data sheet. Note 3: UCSP parts are 100% tested at TA = +25C. Limits across the full temperature range are guaranteed by correlation. Note 4: QFN and TQFN parts are 100% tested at TA = +85C. Limits across the full temperature range are guaranteed by correlation. Note 5: UCSP RON and RON match are guaranteed by design. Note 6: RON = RON(MAX) - RON(MIN). Note 7: Leakage parameters are guaranteed by design. Note 8: Off-isolation = 20log10 (VW,X,Y,Z / VW_,X_,Y_,Z_), VW,X,Y,Z = output, VW_,X_,Y_,Z_ = input to off switch. Note 9: Between any two switches. Note 10: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. 6 _______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package ON-RESISTANCE vs. VX, VY, VZ AND TEMPERATURE (DUAL SUPPLIES) V+ = +3.3V V- = -3.3V TA = +85C 20 100 80 70 18 20 14 50 -4 -2 0 2 4 V+ = +10V 0 -3 -1 1 3 5 0 2 4 6 8 10 12 VX, VY, VZ (V) VX, VY, VZ (V) VW, VX, VY, VZ (V) ON-RESISTANCE vs. VW, VX, VY, VZ AND TEMPERATURE (SINGLE SUPPLY) ON-RESISTANCE vs. VW, VX, VY, VZ AND TEMPERATURE (SINGLE SUPPLY) SUPPLY CURRENT vs. TEMPERATURE (DUAL SUPPLIES) 40 V+ = +5V V- = -5V VA, VB, VC, VEN = 0V, +5V 1 30 TA = +25C 20 TA = +25C 10 MAX4691 toc06 TA = +85C RON () TA = +85C V+ = +3.3V I+, I- (nA) V+ = +5V MAX4691 toc05 50 MAX4691 toc04 34 32 30 28 26 24 22 20 18 16 14 12 10 I+ 0.1 I0.01 TA = -40C TA = -40C 10 1 2 3 4 0.001 SUPPLY CURRENT vs. TEMPERATURE (SINGLE SUPPLY) 0.1 0.01 0.001 10 35 TEMPERATURE (C) 60 85 60 85 2.0 1.8 1.6 VA, VB, VC, VEN (V) I+ 1 35 LOGIC-LEVEL THRESHOLD vs. V+ 1A 0.1A 0.01A 1mA 0.1mA 0.01mA 1A 0.1A 0.01A 1nA 0.1nA 0.01nA 1pA MAX4691 toc08 V+ = +5V VA, VB, VC, VEN = 0V, +5V 10 TEMPERATURE (C) I+ vs. LOGIC LEVEL MAX4691 toc07 10 -15 -15 VW, VX, VY, VZ (V) VW, VX, VY, VZ (V) -40 -40 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 5 MAX4691 toc09 0 I+, I- (nA) V+ = +7.5V 10 TA = -40C -5 6 V+ = +5V 20 6 -6 RON () TA = +25C 8 0 V+ = +3.3V 40 30 10 V+ = +5V V- = -5V V+ = +2.7V 60 16 12 10 V+ = +2V 90 RON () V+ = +2.7V V- = -2.7V V+ = +5V V- = -5V 22 RON () RON () 30 24 MAX4691 toc02 V+ = +2V V- = -2V MAX4691 toc01 40 ON-RESISTANCE vs. VW, VX, VY, VZ (SINGLE SUPPLY) MAX4691 toc03 ON-RESISTANCE vs. VX, VY, VZ (DUAL SUPPLIES) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 1 2 3 VA, VB, VC, VENB (V) 4 5 2 3 4 5 6 7 8 9 10 11 V+ (V) _______________________________________________________________________________________ 7 MAX4691-MAX4694 Typical Operating Characteristics (TA = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (TA = +25C, unless otherwise noted.) W, X, Y, Z 0.01 0.1 0.01 W_, X_, Y_, Z_ 0.001 0.001 MAX4691 toc12 1 65 TURN-ON/TURN-OFF TIME (ns) V+ = +5.5V V- = -5.5V OFF-LEAKAGE (nA) ON-LEAKAGE (nA) 0.1 MAX4691 toc11 V+ = +5.5V V- = -5.5V 1 10 MAX4691 toc10 10 TURN-ON/TURN-OFF TIME vs. TEMPERATURE (DUAL SUPPLY) OFF-LEAKAGE CURRENT vs. TEMPERATURE ON-LEAKAGE CURRENT vs. TEMPERATURE V+ = +5.5V V- = -5.5V 60 TURN-ON 55 50 TURN-OFF 45 40 35 10 35 60 -40 85 10 35 60 TEMPERATURE (C) TEMPERATURE (C) TURN-ON/TURN-OFF TIME vs. TEMPERATURE (SINGLE SUPPLY) TURN-ON/TURN-OFF TIME vs. SUPPLY VOLTAGE 70 60 TURN-OFF 50 40 330 280 2.5 230 2.0 TURN-ON 0 FREQUENCY RESPONSE vs. +3V SUPPLIES -20 ON-RESPONSE -20 -2 -1 0 1 2 3 4 5 V+ = +3V V- = 0V THD+N (%) LOSS (dB) -100 -3 0.1 -60 -80 0.01 V+ = +5V V- = -5V CROSSTALK CROSSTALK -4 TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY OFF-ISOLATION OFF-ISOLATION -80 -5 VW, VX, VY, VZ (V) ON-RESPONSE -40 -40 -60 6 0 MAX4691 toc16 0 2 85 MAX4691 toc17 60 V+ = +3V V- = 0V 0.5 FREQUENCY RESPONSE vs. 5V SUPPLIES 35 V+ = +5V V- = 0V TURN-OFF TEMPERATURE (C) 10 85 1.0 130 3 4 5 SUPPLY VOLTAGE V+, V- (V) -15 60 V+ = +5V V- = -5V 1.5 180 30 -40 35 3.0 80 30 10 CHARGE INJECTION vs. VW, VX, VY, VZ Q (pC) TURN-ON -15 3.5 MAX4691 toc14 V+ = +5.5V 80 -40 85 TEMPERATURE (C) 380 TURN-ON/TURN-OFF TIME (ns) MAX4691 toc13 90 -100 -120 -120 -140 -140 0.001 0.01 0.1 1 FREQUENCY (MHz) 8 -15 MAX4691 toc15 -15 MAX4691 toc18 -40 TURN-ON/TURN-OFF TIME (ns) 30 0.0001 0.0001 LOSS (dB) MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package 10 100 0.001 0.001 0.01 0.1 1 FREQUENCY (MHz) 10 100 10 100 1k FREQUENCY (Hz) _______________________________________________________________________________________ 10k 100k Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package MAX4691 PIN UCSP QFN-EP/ TQFN-EP A4, B4, C4, D4, A1, B1, C1, D1 16, 1, 3, 4, 12, 11, 9, 8 NAME X0-X7 FUNCTION Analog Switch Inputs 0-7 A2 13 X D3, D2, A3 5, 7, 15 A, B, C Analog Switch Common B2 14 V- Negative Analog Supply Voltage Input. Connect V- to GND for single-supply operation. B3 2 GND Ground. Connect to digital ground. (Analog signals have no ground reference; they are limited to V+ and V-.) C2 10 EN C3 6 V+ Positive Analog and Digital Supply Voltage Input -- -- EP Exposed Pad (QFN and TQFN only). Connect EP to V+. Digital Address Inputs Digital Enable Input. Normally connect EN to GND. EN can be driven to logic high to set all switches off. MAX4692 PIN UCSP QFN-EP/ TQFN-EP NAME FUNCTION A1, B1, C1, D1 12, 11, 9, 8 X0-X3 Analog Switch "X" Inputs 0-3 A4, B4, C4, D4 16, 1, 3, 4 Y0-Y3 Analog Switch "Y" Inputs 0-3 A2 13 X Analog Switch "X" Common Analog Switch "Y" Common A3 15 Y D3, D2 5, 7 A, B B2 14 V- B3 2 GND C2 10 EN C3 6 V+ Positive Analog and Digital Supply Voltage Input -- -- EP Exposed Pad (QFN and TQFN only). Connect EP to V+. Digital Address Inputs for both "X" and "Y" Analog Switches Negative Analog Supply Voltage Input. Connect V- to GND for single-supply Ground. Connect to digital ground. (Analog signals have no ground reference; they are limited to V+ and V-.) Digital Enable Input. Normally connect EN to GND. EN can be driven to logic high to set all switches off. _______________________________________________________________________________________ 9 MAX4691-MAX4694 Pin Description MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package Pin Description (continued) MAX4693 PIN 10 UCSP QFN-EP/ TQFN-EP NAME A1 12 X0 FUNCTION Analog Switch "X" Normally Closed Input B1 11 X1 Analog Switch "X" Normally Open Input A4 16 Y0 Analog Switch "Y" Normally Closed Input B4 1 Y1 Analog Switch "Y" Normally Open Input Analog Switch "Z" Normally Closed Input D1 8 Z0 C1 9 Z1 Analog Switch "Z" Normally Open Input A2 13 X Analog Switch "X" Common Analog Switch "Y" Common A3 15 Y D2 7 Z Analog Switch "Z" Common C4 3 A Analog Switch "X" Digital Control Input D4 4 B Analog Switch "Y" Digital Control Input D3 5 C Analog Switch "Z" Digital Control Input B2 14 V- Negative Analog Supply Voltage Input. Connect V- to GND for single-supply operation. B3 2 GND Ground. Connect GND to digital ground. (Analog signals have no ground reference; they are limited to V+ and V-.) C2 10 EN Digital Enable Input. Normally connect EN to GND. EN can be driven to logic high to set all switches off. C3 6 V+ Positive Analog and Digital Supply Voltage Input -- -- EP Exposed Pad (QFN and TQFN only). Connect EP to V+. ______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package MAX4694 PIN USCP QFN-EP/ TQFN-EP NAME FUNCTION D4 4 W0 C4 3 W1 Analog Switch "W" Normally Open Input A1 12 X0 Analog Switch "X" Normally Closed Input B1 11 X1 Analog Switch "X" Normally Open Input A4 16 Y0 Analog Switch "Y" Normally Closed Input B4 1 Y1 Analog Switch "Y" Normally Open Input D1 8 Z0 Analog Switch "Z" Normally Closed Input C1 9 Z1 Analog Switch "Z" Normally Open Input D3 5 W Analog Switch "W" Common A2 13 X Analog Switch "X" Common Analog Switch "W" Normally Closed Input A3 15 Y Analog Switch "Y" Common D2 7 Z Analog Switch "Z" Common B2 14 GND Ground B3 2 A Analog Switch "W" and "Y" Digital Control Input C2 10 B Analog Switch "X" and "Z" Digital Control Input C3 6 V+ Positive Analog and Digital Supply Voltage Input -- -- EP Exposed Pad (QFN and TQFN only). Connect EP to V+. ______________________________________________________________________________________ 11 MAX4691-MAX4694 Pin Description (continued) MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package Table 1. Truth Table/Switch Programming EN 1 ADDRESS BITS C2 B A MAX4691 MAX4692 ON SWITCHES MAX4693 MAX4694 1 X X X All switches open All switches open All switches open -- 0 0 0 0 X-X0 X-X0, Y-Y0 X-X0, Y-Y0, Z-Z0 W-W0, X-X0, Y-Y0, Z-Z0 0 0 0 1 X-X1 X-X1, Y-Y1 X-X1, Y-Y0, Z-Z0 W-W1, X-X0, Y-Y1, Z-Z0 0 0 1 0 X-X2 X-X2, Y-Y2 X-X0, Y-Y1, Z-Z0 W-W0, X-X1, Y-Y0, Z-Z1 0 0 1 1 X-X3 X-X3, Y-Y3 X-X1, Y-Y1, Z-Z0 W-W1, X-X1, Y-Y1, Z-Z1 0 1 0 0 X-X4 X-X0, Y-Y0 X-X0, Y-Y0, Z-Z1 W-W0, X-X0, Y-Y0, Z-Z0 0 1 0 1 X-X5 X-X1, Y-Y1 X-X1, Y-Y0, Z-Z1 W-W1, X-X0, Y-Y1, Z-Z0 0 1 1 0 X-X6 X-X2, Y-Y2 X-X0, Y-Y1, Z-Z1 W-W0, X-X1, Y-Y0, Z-Z1 0 1 1 1 X-X7 X-X3, Y-Y3 X-X1, Y-Y1, Z-Z1 W-W1, X-X1, Y-Y1, Z-Z1 X = Don't care 1. EN is not present on the MAX4694. 2. C is not present on the MAX4692 and MAX4694. Detailed Description The MAX4691-MAX4694 are low-voltage CMOS analog ICs configured as an 8-channel multiplexer (MAX4691), two 4-channel multiplexers (MAX4692), three SPDT switches (MAX4693), and four SPDT switches (MAX4694). All switches are bidirectional. The MAX4691/MAX4692/MAX4693 operate from either a single +2V to +11V power supply or dual 2V to 5.5V power supplies. When operating from 5V supplies they offer 25 on-resistance (RON), 3.5 max RON flatness, and 3 max matching between channels. The MAX4694 operates from a single +2V to +11V supply. Each switch has rail-to-rail signal handling, fast switching times of tON = 80ns, tOFF = 50ns, and a low 1nA leakage current. All digital inputs are 1.8V logic-compatible when operating from a +3V supply and TTL-compatible when operating from a +5V supply. Digital Inputs The MAX4691 and MAX4692 include address pins that allow control of the multiplexers. For the MAX4691, pins 12 A, B, C determine which switch is closed. The two 4-1 muxes in the MAX4692 are controlled by the same address pins (A and B). (Table 1) The MAX4693 and MAX4694 offer SPDT switches in triple and quadruple packages. In the MAX4693, each switch has a unique control input. The MAX4694 has two digital control inputs: A (for switches "W" and "Y") and B (for switches "X" and "Z"). (Table 1) Applications Information Power-Supply Considerations Overview The MAX4691-MAX4694 construction is typical of most CMOS analog switches. V+ and V-* are used to drive the internal CMOS switches and set the limits of the analog voltage on any switch. Reverse ESD-protection diodes are internally connected between each analog signal pin and both V+ and V-. If any analog signal exceeds V+ or V-, one of these diodes will conduct. *V- is found only on the MAX4691/MAX4692/MAX4693. ______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package Bipolar Supplies The MAX4691/MAX4692/MAX4693 operate with bipolar supplies between 2V and 5.5V. The V+ and V- supplies need not be symmetrical, but their difference cannot exceed the absolute maximum rating of +12V. Single Supply These devices operate from a single supply between +2V and +11V when V- is connected to GND. All of the bipolar precautions must be observed. At room temperature, they operate with a single supply at near or below +2V, although as supply voltage decreases, switch on-resistance and switching times become very high. Always bypass supplies with a 0.1F capacitor. Overvoltage Protection Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the devices. Always sequence V+ on first, then V-, followed by the logic inputs and by W, X, Y, Z. If power-supply sequencing is not possible, add two small signal diodes (D1, D2) in series with the supply pins for overvoltage protection (Figure 1). Adding diodes reduces the analog signal range to one diode drop below V+ and one diode drop above V-, but does not affect the devices' low switch resistance and low leakage characteristics. Device operation is unchanged, and the difference between V+ and Vshould not exceed 12V. These protection diodes are not recommended when using a single supply if signal levels must extend to ground. UCSP Reliability The chip-scale package (UCSP) represents a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering a UCSP. Performance through Operating Life Test and Moisture Resistance is equal to conventional package technology as it is primarily determined by the wafer-fabrication process. However, this form factor may not perform equally to a packaged product through traditional mechanical reliability tests. Mechanical stress performance is a greater consideration for a UCSP. UCSP solder joint contact integrity must be considered since the package is attached through direct solder contact to the user's PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environmental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim's website, at www.maxim-ic.com. V+ EXTERNAL BLOCKING DIODE D1 MAX4691 MAX4692 MAX4693 MAX4694 V+ * * COM NO * * V- EXTERNAL BLOCKING DIODE (GND) D2 V- (GND ) *INTERNAL PROTECTION DIODES ( ) ARE FOR THE MAX4694 ONLY, REPLACE V- WITH GND. Figure 1. Overvoltage Protection ______________________________________________________________________________________ 13 MAX4691-MAX4694 During normal operation, these (and other) reversebiased ESD diodes leak, forming the only current drawn from V+ or V-. Virtually all the analog leakage current comes from the ESD diodes. Although the ESD diodes on a given signal pin are identical, and therefore fairly well balanced, they are reverse biased differently. Each is biased by either V+ or V- and the analog signal. This means their leakages will vary as the signal varies. The difference in the two diode leakages to the V+ and V- pins constitutes the analog signal path leakage current. All analog leakage current flows between each pin and one of the supply terminals, not to the other switch terminal. This is why both sides of a given switch can show leakage currents of either the same or opposite polarity. V+ and GND power the internal logic and logic-level translators, and set both the input and output logic limits. The logic-level translators convert the logic levels into switched V+ and V- signals to drive the gates of the analog signals. This drive signal is the only connection between the logic supplies (and signals) and the analog supplies. V+ and V- have ESD-protection diodes on GND. Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package MAX4691-MAX4694 Test Circuits/Timing Diagrams V+ V+ A VEN V+ X0 B 50% V+ 0 X1-X7 VX0 C 90% MAX4691 VEN EN VOUT X GND V- VOUT 90% 35pF 50 0 300 V- tON tOFF V+ V+ A B 50% VEN V+ X0, Y0 V+ 0 X1, X2, X3, Y1, Y2, Y3 VX0, VY0 90% MAX4692 VEN EN X, Y GND VOUT V- 50 35pF VOUT 90% 0 300 V- tON tOFF V+ V+ A B C V+ VEN X1, Y1, Z1 V+ VW0, VX0, VY0, VZ0 MAX4693 X0, Y0, Z0 VEN EN GND V- X, Y, Z V- 50 VOUT 35pF 300 V- 50% 0 90% VOUT VW1, VX1, VY1, VZ1 90% tOFF V- = 0 FOR SINGLE-SUPPLY OPERATION. TEST EACH SECTION INDIVIDUALLY. Figure 2. Enable Transition Time 14 ______________________________________________________________________________________ tON Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package V+ V+ VA, VB, VC A 50 VA, VB, VC V+ X0 B V+ X1-X6 VX0 C X7 MAX4691 EN 90% VVOUT X GND 50% 0 V- 0 VOUT 35pF 90% VX7 300 V- tTRANS tTRANS V+ V+ VA, VB A B 50 X0, Y0 V+ 0 X1, X2, Y1, Y2 VX0, VY0 MAX4692 X3, Y3 EN 90% V- X, Y GND 50% VA, VB V+ VOUT V- 35pF 0 VOUT 90% VX3, VY3 300 V- tTRANS tTRANS V+ V+ VA, VB, VC A, B, C 50 VA, VB, VC V+ W1, X1, Y1, Z1 V- VW0, VX0, VY0, VZ0 MAX4693 MAX4694 EN V+ W0, X2, Y2, Z2, X0, Y0, Z0 X, Y, Z GND V- 50% 0 VOUT 35pF 300 V- 90% 0 VOUT VW1, VX1, VY1, VZ1t TRANS 90% tTRANS V- = 0 FOR SINGLE-SUPPLY OPERATION. (NOT PRESENT ON THE MAX4694) TEST EACH SECTION INDIVIDUALLY. Figure 3. Address Transition Time ______________________________________________________________________________________ 15 MAX4691-MAX4694 Test Circuits/Timing Diagrams (continued) Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package MAX4691-MAX4694 Test Circuits/Timing Diagrams (continued) V+ V+ VA, VB, VC VA, VB V+ X0-X7 A B 50 V+ X0-X3, Y0-Y3 A V+ B 50 V+ C MAX4692 MAX4691 EN VOUT X GND V- EN X, Y GND 35pF VOUT V- 35pF 300 300 V- VV+ VA, VB, VC A, B, C V+ W0, W1, X0, X1, Y0, Y1, Z0, Z1 tR < 20ns tF < 20ns V+ VA, VB, VC V+ 50% 0 50 MAX4693 MAX4694 EN VW, VX, VY, VZ 90% W, X, Y, Z GND V- VOUT 35pF 300 V- VOUT 0 V- = 0 FOR SINGLE-SUPPLY OPERATION. (NOT PRESENT ON THE MAX4694) TEST EACH SECTION INDIVIDUALLY. tBBM Figure 4. Break-Before-Make Interval V+ V+ A CHANNEL SELECT V+ W_, X_, Y_, Z_ VEN 0 B C VEN MAX4691- MAX4694 EN GND W, X, Y, Z V- 50 VOUT VOUT CL = 1000pF VV- = 0 FOR SINGLE-SUPPLY OPERATION. (NOT PRESENT ON THE MAX4694) TEST EACH SECTION INDIVIDUALLY. VOUT IS THE MEASURED VOLTAGE DUE TO CHARGE TRANSFER ERROR Q WHEN THE CHANNEL TURNS OFF. Q = VOUT X CL Figure 5. Charge Injection 16 VOUT ______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package V+ 10nF V+ W_, X_, Y_, Z_ A CHANNEL SELECT VIN NETWORK ANALYZER 50 50 OFF-ISOLATION = 20log VOUT VIN B C VEN MAX4691- MAX4694 ON-LOSS = 20log VOUT EN W, X, Y, Z V- GND MEAS. REF. CROSSTALK = 20log 50 50 VOUT VIN VOUT VIN 10nF VMEASUREMENTS ARE STANDARDIZED AGAINST SHORT AT SOCKET TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM AND "OFF" NO TERMINAL ON EACH SWITCH. ON LOSS IS MEASURED BETWEEN COM AND "ON" NO TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL (A, B, C) TO ALL OTHER CHANNELS. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED. V- IS NOT PRESENT ON THE MAX4694. Figure 6. Off-Isolation, On-Loss, and Crosstalk V+ V+ W_, X_, Y_, Z_ A CHANNEL SELECT B C MAX4691- MAX4694 EN GND W, X, Y, Z V- 1MHz CAPACITANCE ANALYZER V- V- IS NOT PRESENT ON THE MAX4694. Figure 7. Capacitance ______________________________________________________________________________________ 17 MAX4691-MAX4694 Test Circuits/Timing Diagrams (continued) Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package MAX4691-MAX4694 Functional Diagrams (continued) MAX4692 X0 X1 X X2 X3 Y0 Y1 Y Y2 Y3 LOGIC A B MAX4693 Z0 Z Z1 Y0 Y Y1 EN MAX4694 W0 W W1 X0 X X1 X0 X X1 Y0 Z0 Y Z Y1 Z1 EN A B C A B Chip Information PROCESS: BiCMOS 18 ______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package X5 V- GND X1 GND 2 EP* 12 X4 11 X5 MAX4691 C X6 EN V+ X2 D X7 B A X3 X2 10 4 9 EN 1 GND 2 X2 3 X3 4 X6 + MAX4691 *EP A X3 3 X1 X 1 V- X1 13 13 UCSP 5 6 7 8 A V+ B X7 QFN 12 X4 11 X5 10 EN 9 X6 12 X0 11 X1 10 EN 9 X2 8 14 X7 15 5 B 16 + C X0 X 14 C V- 7 X C B X4 + A X0 X0 4 15 3 6 2 V+ MAX4691 1 16 TOP VIEW TQFN *EXPOSED PAD. CONNECT EP TO V+. *EXPOSED PAD. CONNECT EP TO V+. X0 B X1 V- GND Y1 GND 2 11 X1 MAX4692 C X2 V+ EN Y2 Y2 Y3 X3 B A 10 4 9 EN X2 1 GND 2 Y2 3 Y3 4 + MAX4692 *EP Y3 A D 3 Y1 X 12 EP* 13 1 UCSP 8 Y1 X3 13 V- 14 14 15 7 16 + B Y0 X Y Y V- Y0 X Y 15 X0 + A Y0 6 4 5 3 V+ 2 16 MAX4692 1 5 6 7 8 A V+ B X3 QFN TQFN *EXPOSED PAD. CONNECT EP TO V+. *EXPOSED PAD. CONNECT EP TO V+. ______________________________________________________________________________________ 19 MAX4691-MAX4694 Pin Configurations Pin Configurations (continued) CONNECT EP TO V+. CONNECT EP TO V+. TOP VIEW X1 GND V- Y1 GND 2 11 X1 MAX4693 Z1 C EN V+ A A B D Z C 10 4 9 EN 1 2 A 3 B 4 Z1 + MAX4693 12 X0 11 X1 10 EN 9 Z1 12 X0 11 X1 10 B 9 Z1 *EP B C Z0 3 Y1 GND 5 6 7 8 C V+ Z Z0 UCSP Z0 B X X0 V- 12 EP* 13 1 8 Y1 Y + Y0 14 13 7 X 14 Z Y V- 15 Y0 X Y 16 15 X0 A Y0 6 4 5 3 + V+ 2 16 MAX4693 1 QFN TQFN *EXPOSED PAD. CONNECT EP TO V+. *EXPOSED PAD. CONNECT EP TO V+. 13 + Y0 Y1 1 12 X0 11 X1 X Y X 14 13 X GND 15 GND X0 Y 16 14 A Y0 Y 4 Y0 3 + 15 2 16 MAX4694 1 EP* 2 MAX4694 C Z0 B V+ Z W W1 W1 3 10 B W0 4 9 Z1 1 A 2 W1 3 W0 4 + MAX4694 *EP W0 W D Z1 Y1 8 A Z0 Y1 7 A Z GND 6 X1 5 B V+ MAX4691-MAX4694 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package UCSP 5 6 7 8 W V+ Z Z0 QFN TQFN *EXPOSED PAD. CONNECT EP TO V+. *EXPOSED PAD. CONNECT EP TO V+.. Package Information For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 20 PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 16 UCSP B16+1 21-0101 Refer to Application Note 1891 16 QFN-EP G1644+1 21-0106 90-0216 16 TQFN-EP T1644+4 21-0139 90-0070 ______________________________________________________________________________________ Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package REVISION NUMBER REVISION DATE 0 1/01 DESCRIPTION Initial release PAGES CHANGED -- 1 7/01 Added UCSP Package -- 2 2/03 Removed statement in Features section with UCSP now qualified -- 3 12/06 Exposed Paddle Connection information edited, style changes 1, 9, 10, 11, 19, 21, 22 4 8/08 Added part numbers, package diagram, and TQFN packaging 1-26 5 3/09 Added lead-free packaging, edited Pin Description, revised Chip Information, changed "floating" to "unconnected," style changes 6 1/12 Updated Absolute Maximum Ratings and Pin Description sections 1-6, 9, 10, 11, 18-21 2, 9, 10 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. 21 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2012 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX4691-MAX4694 Revision History