Memory Module Specifications KVR16LS11/4 4GB 1Rx8 512M x 64-Bit PC3L-12800 CL11 204-Pin SODIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM's 512M x 64-bit (4GB) CL(IDD) 11 cycles DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 1Rx8, low Row Cycle Time (tRCmin) 48.125ns (min.) components. The SPD is programmed to JEDEC standard Refresh to Active/Refresh Command Time (tRFCmin) 260ns (min.) latency DDR3-1600 timing of 11-11-11 at 1.35V or 1.5V. This Row Active Time (tRASmin) 35ns (min.) 204-pin SODIMM uses gold contact fingers. The electrical and Maximum Operating Power (1.35V) = 2.376 W* UL Rating 94 V - 0 Operating Temperature 0o C to 85o C FEATURES Storage Temperature -55o C to +100o C JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~1.575V) Power Supply *Power will vary depending on the SDRAM. voltage, memory module, based on eight 512M x 8-bit FBGA mechanical specifications are as follows: VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) 800MHz fCK for 1600Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5 Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE 95C Asynchronous Reset PCB: Height1.18" (30mm), double sided component Lead Free RoHS Compliant Continued >> Document No. VALUERAM1347-001.D00 12/23/16 Page 1 MODULE DIMENSIONS: All measurements are in millimeters. (Tolerances on all dimensions are 0.12 unless otherwise specified) Document No. VALUERAM1347-001.D00 Page 2