1
ISL21080
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
FGA is a trademark of Intersil Corporation. Copyright Intersil Americas Inc. 2009, 2010. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
300nA NanoPower Voltage References
ISL21080
The ISL21080 analog voltage references feature low
supply voltage operation at ultra-low 310nA typ, 1.5µA
max operating current. Additionally, the ISL21080 family
features guaranteed initial accuracy as low as ±0.2%
and 50ppm/°C temperature coefficient.
These references are ideal for general purpose portable
applications to extend battery life at lower cost. The
ISL21080 is provided in the industry standard 3 Ld
SOT-23 pinout.
The ISL21080 output voltages can be used as precision
voltage sources for voltage monitors, control loops,
standby voltages for low power states for DSP, FPGA,
Datapath Controllers, microcontrollers and other core
voltages: 0.9V, 1.024V, 1.25V, 1.5V, 2.048V, 2.5V, 3.0V,
3.3V, 4.096V and 5.0V.
Special Note: Post-assembly x-ray inspection may lead to
permanent changes in device output voltage and should be
minimized or avoided. For further information, please see
Applications Information” on page 14 and AN1533, “X-Ray
Effects on Intersil FGA References”.
Applications*(see page 20)
Energy Harvesting Applications
Wireless Sensor Network Applications
Low Power Voltage Sources for Controllers, FPGA,
ASICs or Logic Devices
Battery Management/Monitoring
Low Power Standby Voltages
•Portable Instrumentation
Consumer/Medical Electronics
Wearable Electronics
Lower Cost Industrial and Instrumentation
Power Regulation Circuits
Control Loops and Compensation Networks
LED/Diode Supply
Features
Reference Output Voltage . . . . . 0.900V, 1.024V, 1.250V,
1.500V, 2.048V, 2.500V, 3.000V, 3.300V, 4.096V, 5.000V
Initial Accuracy:
- ISL21080-09 and -10 . . . . . . . . . . . . . . . . . . ±0.7%
- ISL21080-12 . . . . . . . . . . . . . . . . . . . . . . . . ±0.6%
- ISL21080-15. . . . . . . . . . . . . . . . . . . . . . . . . ±0.5%
- ISL21080-20 and -25 . . . . . . . . . . . . . . . . . . ±0.3%
- ISL21080-30, -33, -41, and -50 . . . . . . . . ±0.2%
Input Voltage Range:
- ISL21080-09. . . . . . . . . . . . . . . . . . . . . 2.0V to 5.5V
- ISL21080-10, -12, -15, -20 and -25 . . . . .2.7V to 5.5V
- ISL21080-30. . . . . . . . . . . . . . . . . . . . . 3.2V to 5.5V
- ISL21080-33. . . . . . . . . . . . . . . . . . . . . 3.5V to 5.5V
- ISL21080-41. . . . . . . . . . . . . . . . . . . . . 4.5V to 8.0V
- ISL21080-50. . . . . . . . . . . . . . . . . . 5.5V to 8.0V
Output Voltage Noise . . . . 30µVP-P (0.1Hz to 10Hz)
Supply Current. . . . . . . . . . . . . . . . . . 1.5µA (Max)
Tempco . . . . . . . . . . . . . . . . . . . . . . . . 50ppm/°C
Output Current Capability . . . . . . . . . . . . . . ±7mA
Operating Temperature Range . . . . -40°C to +85°C
Package . . . . . . . . . . . . . . . . . . . . . . 3 Ld SOT-23
Pb-Free (RoHS compliant)
Related Literature*(see page 20)
•See AN1494, “Reflow and PC Board Assembly Effects
on Intersil FGA References”
•See AN1533, “X-Ray Effects on Intersil FGA
References
FIGURE 1. IIN vs VIN, 3 UNITS
0
100
200
300
400
500
VIN (V)
IN (nA)
UNIT 1
UNIT 3
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.34.5 4.7 4.9 5.1 5.3 5.5
UNIT 2
May 25, 2010
FN6934.4
2FN6934.4
May 25, 2010
Pin Configuration
ISL21080
(3 LD SOT-23)
TOP VIEW
1
2
3
VOUT
GND
VIN
Pin Descriptions
PIN NUMBER PIN NAME DESCRIPTION
1V
IN Input Voltage Connection.
2V
OUT Voltage Reference Output
3 GND Ground Connection
Ordering Information
PART NUMBER
(Notes 1, 2)
PART
MARKING
VOUT OPTION
(V)
GRADE
(%)
TEMP. RANGE
(°C)
PACKAGE
Tape & Reel
(Pb-Free)
PKG.
DWG. #
ISL21080DIH309Z-TK BCLA 0.9 ±0.7 -40 to +85 3 Ld SOT-23 P3.064
ISL21080DIH310Z-TK BCMA 1.024 ±0.7 -40 to +85 3 Ld SOT-23 P3.064
ISL21080DIH312Z-TK BCNA 1.25 ±0.6 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH315Z-TK BCDA 1.5 ±0.5 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH320Z-TK BCPA 2.048 ±0.3 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH325Z-TK BCRA 2.5 ±0.3 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH330Z-TK BCSA 3.0 ±0.2 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH333Z-TK BCTA 3.3 ±0.2 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH341Z-TK BCVA 4.096 ±0.2 -40 to +85 3 Ld SOT-23 P3.064
ISL21080CIH350Z-TK BCWA 5.0 ±0.2 -40 to +85 3 Ld SOT-23 P3.064
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21080. For more information on MSL please
see techbrief TB363.
ISL21080
3FN6934.4
May 25, 2010
Absolute Maximum Ratings Thermal Information
Max Voltage
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V
V
IN to GND (ISL21080-41 and 50 only) . . . -0.5V to +10V
V
OUT to GND (10s) . . . . . . . . . . . . . . -0.5V to VOUT +1V
V
OUT to GND (10s)
ISL21080-41 and 50 only . . . . . . . . . . -0.5V to +5.1V
ESD Ratings
Human Body Model (Tested to JESD22-A114) . . . . . . . 5kV
Machine Model (Tested to JESD22-A115) . . . . . . . . . 500V
Charged Device Model (Tested to JESD22-C101) . . . . . 2kV
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . 100mA
Environmental Operating Conditions
X-Ray Exposure (Note 4). . . . . . . . . . . . . . . . . . . .10mRem
Thermal Resistance (Typical, Notes 5, 6) θJA (°C/W) θJC (°C/W)
3 Lead SOT-23 . . . . . . . . . . . . . . . 275 110
Maximum Junction Temperature . . . . . . . . . . . . . . . +107°C
Continuous Power Dissipation (TA = +85°C). . . . . . . . 99mW
Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile (Note 7) . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature. . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure
levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 14.
5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
6. For θJC, the “case temp” location is taken at the package top center.
7. Post-reflow drift for the ISL21080 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4
double sided boards. The design engineer must take this into account when considering the reference voltage after assembly.
8. Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or
avoided. Initial accuracy can change 10mV or more under extreme radiation. Most inspection equipment will not affect the
FGA reference voltage, but if x-ray inspection is required, it is advisable to monitor the reference output voltage to verify
excessive shift has not occurred.
Electrical Specifications (ISL21080-09, VOUT = 0.9V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 0.9 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.7 +0.7 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 2.0 5.5 V
IIN Supply Current 0.35 1.5 µA
ΔVOUT /ΔVIN Line Regulation 2V < VIN < 5.5V 30 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 10mA 6 100 µV/mA
Sinking: -10mA IOUT 0mA 23 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 30 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 1 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 40 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 10 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +125°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 60 ppm
ISL21080
4FN6934.4
May 25, 2010
Electrical Specifications (ISL21080-10, VOUT = 1.024V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 1.024 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.7 +0.7 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 2.7 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 2.7V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 7mA 25 100 µV/mA
Sinking: -7mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 2.2 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
Electrical Specifications (ISL21080-12, VOUT = 1.25V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 1.25 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.6 +0.6 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 2.7 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 2.7V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 7mA 25 100 µV/mA
Sinking: -7mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
ISL21080
5FN6934.4
May 25, 2010
Electrical Specifications (ISL21080-15, VOUT = 1.5V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 1.5 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.5 +0.5 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 2.7 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 2.7V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 7mA 10 100 µV/mA
Sinking: -7mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
Electrical Specifications (ISL21080-20, VOUT = 2.048V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 2.048 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.3 +0.3 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 2.7 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 2.7V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 7mA 25 100 µV/mA
Sinking: -7mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
ISL21080
6FN6934.4
May 25, 2010
Electrical Specifications (ISL21080-25, VOUT = 2.5V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 2.5 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.3 +0.3 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 2.7 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 2.7V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 7mA 25 100 µV/mA
Sinking: -7mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
Electrical Specifications (ISL21080-30, VOUT = 3.0V) VIN = 5.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 3.0 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.2 +0.2 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 3.2 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 3.2V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 7mA 25 100 µV/mA
Sinking: -7mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
ISL21080
7FN6934.4
May 25, 2010
Electrical Specifications (ISL21080-33, VOUT = 3.3V) VIN = 5.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 3.3 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.2 +0.2 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 3.5 5.5 V
IIN Supply Current 0.31 1.5 µA
ΔVOUT /ΔVIN Line Regulation 3.5 V < VIN < 5.5V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 10mA 25 100 µV/mA
Sinking: -10mA IOUT 0mA 50 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
Electrical Specifications (ISL21080-41 VOUT = 4.096V) VIN = 5.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 4.096 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.2 +0.2 %
TC VOUT Output Voltage Temperature
Coefficient (Note 9)
50 ppm/°C
VIN Input Voltage Range 4.5 8.0 V
IIN Supply Current 0.5 1.5 µA
ΔVOUT /ΔVIN Line Regulation 4.5 V < VIN < 8.0V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 10mA 10 100 µV/mA
Sinking: -10mA IOUT 0mA 20 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 80 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
ISL21080
8FN6934.4
May 25, 2010
Electrical Specifications (ISL21080-50 VOUT = 5.0V) VIN = 6.5V, TA = -40°C to +85°C, IOUT = 0, unless otherwise
specified. Boldface limits apply over the operating temperature range, -40°C to
+85°C.
PARAMETER DESCRIPTION CONDITIONS
MIN
(Note 12) TYP
MAX
(Note 12) UNIT
VOUT Output Voltage 5.0 V
VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.2 +0.2 %
TC VOUT Output Voltage Temperature Coefficient
(Note 9)
50 ppm/°C
VIN Input Voltage Range 5.5 8.0 V
IIN Supply Current 0.5 1.5 µA
ΔVOUT /ΔVIN Line Regulation 5.5 V < VIN < 8.0V 80 350 µV/V
ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA IOUT 10mA 10 100 µV/mA
Sinking: -10mA IOUT 0mA 20 350 µV/mA
ISC Short Circuit Current TA = +25°C, VOUT tied to GND 80 mA
tRTurn-on Settling Time VOUT = ±0.1% with no load 4 ms
Ripple Rejection f = 120Hz -40 dB
eNOutput Voltage Noise 0.1Hz f 10Hz 30 µVP-P
VNBroadband Voltage Noise 10Hz f 1kHz 52 µVRMS
Noise Density f = 1kHz 1.1 µV/Hz
ΔVOUT/ΔTAThermal Hysteresis (Note 10) ΔTA = +165°C 100 ppm
ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 50 ppm
NOTES:
9. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is
divided by the temperature range; in this case, -40°C to +85°C = +125°C.
10. Thermal Hysteresis is the change of VOUT measured @ TA = +25°C after temperature cycling over a specified range, ΔTA. VOUT
is read initially at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is
taken at +25°C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For Δ
TA = +125°C, the device under test is cycled from +25°C to +85°C to -40°C to +25°C.
11. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately
10ppm/1khrs.
12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
Typical Performance Characteristics Curves VOUT = 0.9V, VIN = 3.0V, IOUT = 0mA,
TA = +25°C unless otherwise specified.
FIGURE 2. IIN vs VIN, 3 UNITS FIGURE 3. IIN vs VIN OVER-TEMPERATURE
0
0.1
0.2
0.3
0.4
0.5
0.6
2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2
IIN (µA)
VIN (V)
TYP
LOW
HIGH
VIN (V)
IIN (µA)
0
0.1
0.2
0.3
0.4
0.5
0.6
2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2
+85°C
-40°C +25°C
ISL21080
9FN6934.4
May 25, 2010
FIGURE 4. LINE REGULATION, 3 UNITS FIGURE 5. LINE REGULATION OVER-TEMPERATURE
FIGURE 6. VOUT vs TEMPERATURE NORMALIZED to
+25°C
FIGURE 7. LINE TRANSIENT RESPONSE, WITH
CAPACITIVE LOAD
FIGURE 8. LINE TRANSIENT RESPONSE FIGURE 9. LOAD REGULATION OVER-TEMPERATURE
Typical Performance Characteristics Curves VOUT = 0.9V, VIN = 3.0V, IOUT = 0mA,
TA = +25°C unless otherwise specified.
0.89980
0.89985
0.89990
0.89995
0.90000
0.90005
0.90010
0.90015
0.90020
2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2
0.9V AT VIN = 3.0V
VIN (V)
TYP
VOUT (V) NORMALIZED TO
HIGH
LOW
VIN (V)
TO VIN = 3.0V
VOUT (µV) NORMALIZED TO
-150
-100
-50
0
50
100
150
200
2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2
+25°C
+85°C
-40°C
0.8990
0.8995
0.9000
0.9005
0.9010
-40 -30 -20 -10 0 10 30 40 50 60 70 80
VOUT (V)
NORMALIZED TO +25°C
TEMPERATURE (°C)
TYP
HIGH
LOW
20
-200
-150
-100
-50
0
50
100
150
200
0 0.5 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
TIME (µs)
ΔVIN = +0.3V
ΔVIN = -0.3V
ΔVOUT (mV)
1.0
-200
-150
-100
0
50
100
150
200
ΔVIN = +0.3V
ΔVIN = -0.3V
ΔVOUT (mV)
-50
TIME (µs)
0 0.5 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.01.0 -500
0
500
-10-9-8-7-6-5-4-3-2-1 1 3 5 7 910
LOAD (mA)
SINKING SOURCING
+25°C
+85°C
-40°C
VOUT (µV)
86420
ISL21080
10 FN6934.4
May 25, 2010
FIGURE 10. LOAD TRANSIENT RESPONSE FIGURE 11. LOAD TRANSIENT RESPONSE
FIGURE 12. DROPOUT FIGURE 13. TURN-ON TIME
Typical Performance Characteristics Curves VOUT = 0.9V, VIN = 3.0V, IOUT = 0mA,
TA = +25°C unless otherwise specified.
-1000
-800
-600
-400
-200
0
200
400
600
800
1000
TIME (ms)
012345678910
ΔVOUT (mV)
ILOAD = +7mA
ILOAD = -7mA
-500
-400
-300
-200
-100
0
100
200
300
400
500
TIME (ms)
012345678910
ΔVOUT (mV)
ILOAD = +50µA
ILOAD = -50µA
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
VOUT (V)
VIN (V)
NO LOAD 7mA
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 0.3 0.6 0.9 1.2 1.5
TIME (ms)
VOUT (V)
TYP HIGH
VDD
LOW
Typical Performance Characteristics Curves VOUT = 1.5V, VIN = 3.0V, IOUT = 0mA,
TA = +25°C unless otherwise specified.
FIGURE 14. IIN vs VIN, 3 UNITS FIGURE 15. IIN vs VIN OVER-TEMPERATURE
0
100
200
300
400
500
VIN (V)
IN (nA)
UNIT 1
UNIT 3
2.73.13.53.94.34.75.15.5
UNIT 2
0
100
200
300
400
500
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
-40°C
+85°C
IN (nA)
VIN (V)
+25°C
ISL21080
11 FN6934.4
May 25, 2010
FIGURE 16. LINE REGULATION, 3 UNITS FIGURE 17. LINE REGULATION OVER-TEMPERATURE
FIGURE 18. VOUT vs TEMPERATURE NORMALIZED to
+25°C
FIGURE 19. LINE TRANSIENT RESPONSE, WITH
CAPACITIVE LOAD
FIGURE 20. LINE TRANSIENT RESPONSE FIGURE 21. LOAD REGULATION OVER-TEMPERATURE
Typical Performance Characteristics Curves VOUT = 1.5V, VIN = 3.0V, IOUT = 0mA,
TA = +25°C unless otherwise specified.
1.49980
1.49985
1.49990
1.49995
1.50005
1.50010
1.50015
1.50020
(NORMAILIZED TO 1.5V AT VIN = 3V)
1.50000
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
V
OUT
(V)
UNIT 2
UNIT 3
UNIT 1
VIN (V)
-150
-125
-100
-75
-50
-25
0
25
50
75
100
125
150
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
(NORMALIZED TO VIN = 3V)
+85°C
+25°C
-40°C
OUT
(µV)
V
VIN (V)
1.4995
1.4996
1.4997
1.4998
1.4999
1.5000
1.5001
1.5002
1.5003
1.5004
1.5005
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
VIN
(V)
V
OUT (V)
UNIT 1
UNIT 3
UNIT 2
CL= 500pF
ΔVIN = -0.3V
ΔVIN = 0.3V
1ms/DIV
50mV/DIV
ΔVIN = 0.3V
ΔVIN = -0.3V
CL= 0pF
1ms/DIV
50mV/DIV
-500
-300
-100
100
300
500
700
900
-7 -6 -5 -4 -3 -2 -1
SINKING OUTPUT CURRENT SOURCING
ΔVOUT (µV)
01234567
+85°C
-40°C
+25°C
0
ISL21080
12 FN6934.4
May 25, 2010
FIGURE 22. LOAD TRANSIENT RESPONSE FIGURE 23. LOAD TRANSIENT RESPONSE
FIGURE 24. DROPOUT FIGURE 25. TURN-ON TIME
FIGURE 26. ZOUT vs FREQUENCY FIGURE 27. PSRR vs FREQUENCY
Typical Performance Characteristics Curves VOUT = 1.5V, VIN = 3.0V, IOUT = 0mA,
TA = +25°C unless otherwise specified.
IL= 7mA
2ms/DIV
500mV/DIV
IL= -7mA
IL= 50μA
IL= -50μA
100mV/DIV
1ms/DIV
1.38
1.40
1.42
1.44
1.46
1.48
1.50
1.52
1.52.02.53.03.54.04.55.05.5
VIN (V)
VOUT (V)
7mA LOAD
NO LOAD
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
TIME (ms)
VOLTAGE (V)
VIN
UNIT 1
UNIT 3
UNIT 2
0
20
40
60
80
100
120
140
160
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
ZOUT (Ω)
1nF
10nF
100nF
NO LOAD
-70
-60
-50
-40
-30
-20
-10
0
10 100 1k 10k 100k
FREQUENCY (Hz)
PSRR (dB)
1M
NO LOAD
1nF
10nF
100nF
ISL21080
13 FN6934.4
May 25, 2010
Typical Performance Characteristics Curves TA = +25°C unless otherwise specified.
FIGURE 28. DROPOUT, ISL21080-10 FIGURE 29. DROPOUT, ISL21080-12
FIGURE 30. DROPOUT, ISL21080-25 FIGURE 31. DROPOUT, ISL21080-30
FIGURE 32. DROPOUT, ISL21080-33 FIGURE 33. DROPOUT, ISL21080-41
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
VOUT (V)
VIN (V)
NO LOAD 7mA
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.31.51.71.92.12.32.52.72.9
VOUT (V)
VIN (V)
NO LOAD 7mA
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
2.5 2.7 2.9 3.1 3.3 3.5
VOUT (V)
VIN (V)
NO LOAD 7mA
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.0 3.2 3.4 3.6 3.8 4.0
VOUT (V)
VIN (V)
NO LOAD 7mA
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.3 3.5 3.7 3.9 4.1 4.3 4.5
VOUT (V)
VIN (V)
NO LOAD 7mA
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.1 4.3 4.5 4.7 4.9 5.1
VOUT (V)
VIN (V)
NO LOAD 7mA
ISL21080
14 FN6934.4
May 25, 2010
Applications Information
FGA Technology
The ISL21080 series of voltage references use the
floating gate technology to create references with very
low drift and supply current. Essentially, the charge
stored on a floating gate cell is set precisely in
manufacturing. The reference voltage output itself is a
buffered version of the floating gate voltage. The
resulting reference device has excellent characteristics
which are unique in the industry: very low temperature
drift, high initial accuracy, and almost zero supply
current. Also, the reference voltage itself is not limited by
voltage bandgaps or zener settings, so a wide range of
reference voltages can be programmed (standard
voltage settings are provided, but customer-specific
voltages are available).
The process used for these reference devices is a floating
gate CMOS process, and the amplifier circuitry uses CMOS
transistors for amplifier and output transistor circuitry.
While providing excellent accuracy, there are limitations in
output noise level and load regulation due to the MOS
device characteristics. These limitations are addressed with
circuit techniques discussed in other sections.
Board Assembly Considerations
FGA references provide high accuracy and low
temperature drift but some PC board assembly
precautions are necessary. Normal Output voltage shifts
of 100µV to 1mV can be expected with Pb-free reflow
profiles or wave solder on multi-layer FR4 PC boards.
Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder
temperatures, this may reduce device initial accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized
or avoided. If x-ray inspection is required, it is advisable to
monitor the reference output voltage to verify excessive
shift has not occurred. If large amounts of shift are
observed, it is best to add an X-ray shield consisting of thin
zinc (300µm) sheeting to allow clear imaging, yet block
x-ray energy that affects the FGA reference.
FIGURE 34. DROPOUT, ISL21080-50
High Current Application
FIGURE 35. DIFFERENT VIN AT ROOM TEMPERATURE FIGURE 36. DIFFERENT VIN AT HIGH TEMPERATURE
(+85°C)
Typical Performance Characteristics Curves TA = +25°C unless otherwise specified.
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.0 5.2 5.4 5.6 5.8 6.0
VOUT (V)
VIN (V)
NO LOAD 7mA
1.492
1.494
1.496
1.498
1.500
1.502
0 5 10 15 20 25 30
ILOAD (mA)
VREF (V)
35
VIN = 5V
VIN = 3.3V
VIN = 3.5V
1.492
1.494
1.496
1.498
1.500
1.502
0 5 10 15 20 25 30
ILOAD (mA)
VREF (V)
VIN = 5V
VIN = 3.5V
VIN = 3.3V
35
ISL21080
15 FN6934.4
May 25, 2010
Special Applications Considerations
In addition to post-assembly examination, there are also
other X-ray sources that may affect the FGA reference
long term accuracy. Airport screening machines contain
X-rays and will have a cumulative effect on the voltage
reference output accuracy. Carry-on luggage screening
uses low level X-rays and is not a major source of output
voltage shift, however, if a product is expected to pass
through that type of screening over 100 times, it may
need to consider shielding with copper or aluminum.
Checked luggage X-rays are higher intensity and can
cause output voltage shift in much fewer passes, thus
devices expected to go through those machines should
definitely consider shielding. Note that just two layers of
1/2 ounce copper planes will reduce the received dose by
over 90%. The leadframe for the device which is on the
bottom also provides similar shielding.
If a device is expected to pass through luggage X-ray
machines numerous times, it is advised to mount a
2-layer (minimum) PC board on the top, and along with a
ground plane underneath will effectively shield it from
from 50 to 100 passes through the machine. Since these
machines vary in X-ray dose delivered, it is difficult to
produce an accurate maximum pass recommendation.
Nanopower Operation
Reference devices achieve their highest accuracy when
powered up continuously, and after initial stabilization
has taken place. This drift can be eliminated by leaving
the power on continuously.
The ISL21080 is the first high precision voltage reference
with ultra low power consumption that makes it possible to
leave power on continuously in battery operated circuits.
The ISL21080 consumes extremely low supply current due
to the proprietary FGA technology. Supply current at room
temperature is typically 350nA, which is 1 to 2 orders of
magnitude lower than competitive devices. Application
circuits using battery power will benefit greatly from having
an accurate, stable reference, which essentially presents no
load to the battery.
In particular, battery powered data converter circuits that
would normally require the entire circuit to be disabled
when not in use can remain powered up between
conversions as shown in Figure 37. Data acquisition
circuits providing 12 bits to 24 bits of accuracy can
operate with the reference device continuously biased
with no power penalty, providing the highest accuracy
and lowest possible long term drift.
Other reference devices consuming higher supply currents
will need to be disabled in between conversions to conserve
battery capacity. Absolute accuracy will suffer as the device
is biased and requires time to settle to its final value, or,
may not actually settle to a final value as power on time
may be short. Table 1 shows an example of battery life in
years for ISL21080 in various power on condition with
1.5µA maximum current consumption.
ISL21080 Used as a Low Cost Precision
Current Source
Using an N-JET and a Nanopower voltage reference,
ISL21080, a precision, low cost, high impedance current
source can be created. The precision of the current
source is largely dependent on the tempco and accuracy
of the reference. The current setting resistor contributes
less than 20% of the error.
Board Mounting Considerations
For applications requiring the highest accuracy, board
mounting location should be reviewed. Placing the device
in areas subject to slight twisting can cause degradation
of the accuracy of the reference voltage due to die
stresses. It is normally best to place the device near the
edge of a board, or the shortest side, as the axis of
bending is most limited at that location. Obviously,
mounting the device on flexprint or extremely thin PC
material will likewise cause loss of reference accuracy.
TABLE 1. EXAMPLE OF BATTERY LIFE IN YEARS FOR
ISL21080 IN VARIOUS POWER ON
CONDITIONS WITH 1.5µA MAX CURRENT
BATTERY RATING
(mAH) CONTINUOUS
50% DUTY
CYCLE
10% DUTY
CYCLE
40 3 6 30*
225 16.3* 32.6* 163*
NOTE: *Typical Li-ion battery has a shelf life of up to 10 years.
VIN = +3.0V
0.001µF TO 0.01µF
SERIAL
BUS
VIN VOUT
GND
ISL21080
REF IN
ENABLE
SCK
SDAT
A/D CONVERTER
12 TO 24-BIT
0.01µF
10µF
FIGURE 37. REFERENCE INPUT FOR ADC CONVERTER
ISL21080
16 FN6934.4
May 25, 2010
Noise Performance and Reduction
The output noise voltage in a 0.1Hz to 10Hz bandwidth is
typically 30µVP-P
. This is shown in the plot in the “Typical
Performance Characteristics Curves” which begin on
page 10. The noise measurement is made with a
bandpass filter made of a 1 pole high-pass filter with a
corner frequency at 0.1Hz and a 2-pole low-pass filter
with a corner frequency at 12.6Hz to create a filter with a
9.9Hz bandwidth. Noise in the 10kHz to 1MHz bandwidth
is approximately 400µVP-P with no capacitance on the
output, as shown in Figure 39. These noise
measurements are made with a 2 decade bandpass filter
made of a 1-pole high-pass filter with a corner frequency
at 1/10 of the center frequency and 1-pole low-pass filter
with a corner frequency at 10 times the center frequency.
Figure 39 also shows the noise in the 10kHz to 1MHz
band can be reduced to about 50µVP-P using a 0.001µF
capacitor on the output. Noise in the 1kHz to 100kHz
band can be further reduced using a 0.1µF capacitor on
the output, but noise in the 1Hz to 100Hz band increases
due to instability of the very low power amplifier with a
0.1µF capacitance load. For load capacitances above
0.001µF, the noise reduction network shown in Figure 40
is recommended. This network reduces noise
significantly over the full bandwidth. As shown in
Figure 39, noise is reduced to less than 40µVP-P from
1Hz to 1MHz using this network with a 0.01µF capacitor
and a 2kΩ resistor in series with a 10µF capacitor.
Turn-On Time
The ISL21080 devices have ultra-low supply current and
thus, the time to bias-up internal circuitry to final values
will be longer than with higher power references. Normal
turn-on time is typically 7ms. This is shown in Figure 38.
Since devices can vary in supply current down to
>300nA, turn-on time can last up to about 12ms. Care
should be taken in system design to include this delay
before measurements or conversions are started.
Temperature Coefficient
The limits stated for temperature coefficient (tempco)
are governed by the method of measurement. The
overwhelming standard for specifying the temperature
drift of a reference, is to measure the reference voltage
at two temperatures, take the total variation, (VHIGH -
VLOW), and divide by the temperature extremes of
measurement (THIGH –T
LOW). The result is divided by
the nominal reference voltage (at T = +25°C) and
multiplied by 106 to yield ppm/°C. This is the “Box”
method for specifying temperature coefficient.
FIGURE 38. ISL21080 USED AS A LOW COST
PRECISION CURRENT SOURCE
+8V TO 28V
0.01µF
VIN VOUT
10kΩ
RSET
0.1%
10ppm/°C
ISY ~ 0.31µA
IL AT 0.1% ACCURACY
~150.3µA
ISL21080-1.5 ZOUT > 100MΩ
ISET
VOUT
ISET = RSET
IL = ISET + IRSET
VOUT = 1.5V
GND
CL = 0
CL = 0.001µF
CL = 0.1µF
CL = 0.01µF AND 10µF + 2kΩ
400
350
300
250
200
150
100
50
0
1 10 100 1k 10k 100k
NOISE VOLTAGE (µVP-P)
FIGURE 39. NOISE REDUCTION
VIN = 3.0V
VIN
VO
GND
ISL21080
0.01µF
10µF
2kΩ
0.1µF
10µF
FIGURE 40. NOISE REDUCTION NETWORK
ISL21080
17 FN6934.4
May 25, 2010
Typical Application Circuits
FIGURE 41. PRECISION 2.5V 50mA REFERENCE
FIGURE 42. 2.5V FULL SCALE LOW-DRIFT 10-BIT ADJUSTABLE VOLTAGE SOURCE
FIGURE 43. KELVIN SENSED LOAD
VIN = 3.0V
2N2905
2.5V/50mA
0.001µF
VIN
VOUT
GND
ISL21080
R = 200Ω
VIN
VOUT
GND
2.7V TO 5.5V
0.1µF
0.001µF
VOUT
+
VCC RH
RL
X9119
VSS
SDA
SCL
2-WIRE BUS VOUT
(BUFFERED)
10µF
ISL21080
0.1µF
VIN
VOUT
GND
ISL21080
VOUT SENSE
LOAD
+
10µF
2.7V TO 5.5V
ISL21080
18 FN6934.4
May 25, 2010
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE REVISION CHANGE
5/12/10 FN6934.4 Changed Theta JA in the “Thermal Information” on page 3 from 170 to 275. Added Theta JC
and applicable note.
4/29/10 FN6934.3 Incorrect Thermal information, needs to be re-evaluated and added at a later date when the
final data is available. Removed Theta JC and applicable note from “Thermal Information” on
page 3.
4/14/10 Corrected y axis label on Figure 9 from “VOUT (V)” to “VOUT (µV)”
4/6/10 Source/sink for 0.9V option changed from 7mA to 10mA
Line regulation condition for 0.9V changed from 2.7V to 2V
Line regulation typical for 0.9V option changed from 10 to 30µV/V
ΔTA in Thermal Hysterisis conditions of 0.9V option changed from 165°C to 125°C
Moved “Board Assembly Considerations” and “Special Applications Considerations” to page 14.
Deleted “Handling and Board Mounting” section since “Board Assembly Considerations” on
page 14 contains same discussion.
Added “Special Note: Post-assembly x-ray inspection may lead to permanent changes in
device output voltage and should be minimized or avoided.” to “ISL21080” on page 1
Figures 2 and 3 revised to show line regulation and Iin down to 2V.
Figures 4 and 5 revised to show Vin down to 2V.
Added “Initial accuracy can change 10mV or more under extreme radiation.” to Note 8 on
page 3.
4/1/10 1. page 3: Change Vin Min from 2.7 to 2.0
2. page 3: Change Iin Typ from 0.31 to 0.35
3. page 3: Change Line Reg Typ from 80 to 10
4. page 3: Change Load Reg Condition from 7mA to 10mA and -7mA to -10mA
5. page 3: Change Load Reg Typ for Source from 25 to 6 and Sink from 50 to 23.
6. page 3: Change Isc Typ from 50 to 30
7. page 3: Change tR from 4 to 1
8. Change Ripple Rejection typ for all options from -30 to -40
9. page 3: Change eN typ from 30 to 40V
10. page 3: Change VN typ from 50 to 10V
11. page 3: Change Noise Density typ from 1.1 to 2.2
12. page 3: Change Long Term Stability from 50 to 60
13. Added Figure 2 to 13 on page 8 to page 10 for 0.9V curves.
14. Added Figure 28 to 34 on page 13 to page 14 for other options Dropout curve.
15. page 1: Change Input Voltage Range for 0.9V option from TBD to 2V to 5.5V
16. Added latch up to “Absolute Maximum Ratings” on page 3
17. Added Junction Temperature to “Thermal Information” on page 3
18. Added JEDEC standards used at the time of testing for “ESD Ratings” on page 3
19. HBM in “Absolute Maximum Ratings” on page 3 changed from 5.5kV to 5kV
20. Added Theta JC and applicable note.
3/25/10 Throughout- Converted to new format. Changes made as follows:
Moved “Pin Configuration” and “Pin Descriptions” to page 2
Added “Related Literature*(see page 20)” to page 1
Added key selling feature graphic Figure 1 to page 1
Added "Boldface limits apply..." note to common conditions of Electrical Specifications tables
on page 3 through page 8. Bolded applicable specs. Added Note 12 to MIN MAX columns of all
Electrical Specifications tables.
Added ““Environmental Operating Conditions” to page 3 and added Note 4
Added “The process used for these reference devices is a floating gate CMOS process, and the
amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While
providing excellent accuracy, there are limitations in output noise level and load regulation due
to the MOS device characteristics. These limitations are addressed with circuit techniques
discussed in other sections.” on page 14
ISL21080
19 FN6934.4
May 25, 2010
10/14/09 FN6934.2 1. Removed "Coming Soon" on page 1 and 2 for -10, -20, -41, and -50 options.
2. Page 1. Moved "ISL21080-50 5.5V to 8.0V" from bullet to sub-bullet.
3. Update package outline drawing P3.064 to most recent revision. Updates to package were
to add land pattern and move dimensions from table onto drawing (no change to package
dimensions)
09/04/09 FN6934.1 Converted to new Intersil template. Added Revision History and Products Information.
Updated Ordering Information to match Intrepid, numbered all notes and added Moisture
Sensitivity Note with links. Moved Pin Descriptions to page 1 to follow pinout
Changed in Features Section
From: Reference Output Voltage 1.25V, 1.5V, 2.500V, 3.300V
To: Reference Output Voltage 0.900V, 1.024V, 1.250V, 1.500V, 2.048V, 2.500V, 3.000V,
3.300V, 4.096V, 5.000V
From: Initial Accuracy: 1.5V ±0.5%
To: Initial Accuracy:
ISL21080-09 and -10 ±0.7%
ISL21080-12 ±0.6%
ISL21080-15 ±0.5%
ISL21080-20 and -25 ±0.3%
ISL21080-30, -33, -41, and -50 ±0.2%
FROM: Input Voltage Range
ISL21080-12 (Coming Soon) 2.7V to 5.5V
ISL21080-15 2.7V to 5.5V
ISL21080-25 (Coming Soon) 2.7V to 5.5V
ISL21080-33 (Coming Soon) 3.5V to 5.5V
TO: Input Voltage Range:
ISL21080-09, -10, -12, -15, -20, and -25 2.7V to 5.5V
ISL21080-09, -10, and 20 (Coming Soon)
ISL21080-30 3.2V to 5.5V
ISL21080-33 3.5V to 5.5V
ISL21080-41 (Coming Soon) 4.5V to 8.0V
Added: ISL21080-50 (Coming Soon) 5.5V to 8.0V Output Voltage Noise
30µVP-P (0.1Hz to 10Hz)
Updated Electrical Spec Tables by Tables with Voltage References 9, 10, 12, 20, 25, 30, 33
and 41.
Added to Abs Max Ratings:
VIN to GND (ISL21080-41 and 50 only -0.5V to +10V
VOUT to GND (10s)
(ISL21080-41 and 50 only -0.5V to +5.1V
Changed Tja in Thermal information from "202.70" to "170" to match ASYD in Intrepid
Added Note:
Post-assembly x-ray inspection may also lead to permanent changes in device output voltage
and should be minimized or avoided. Most inspection equipment will not affect the FGA
reference voltage, but if x-ray inspection is required, it is advisable to monitor the reference
output voltage to verify excessive shift has not occurred.
Added Special Applications Considerations Section on page 12.
07/28/09 FN6934.0 Initial Release.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev. (Continued)
DATE REVISION CHANGE
ISL21080
20
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6934.4
May 25, 2010
For additional products, see www.intersil.com/product_tree
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL21080
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
ISL21080
21 FN6934.4
May 25, 2010
ISL21080
Package Outline Drawing
P3.064
3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE (SOT23-3)
Rev 2, 9/09
Reference JEDEC TO-236.
Footlength is measured at reference to gauge plane.
Dimension does not include interlead flash or protrusions.
Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
DETAIL "A"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
C
0.10 C
0.20 M C
L
C1.30±0.10
C
L
0.950
2.37±0.27
2.92±0.12 4
4
10° TYP
(2 plcs)
0.013(MIN)
0.100(MAX)
SEATING PLANE
1.00±0.12
0.91±0.03
SEATING PLANE
GAUGE PLANE
0.25
0.31±0.10
DETAIL "A"
0.435±0.065 0 - 8 deg.
(2.15)
(1.25)
(0.60)
(0.95 typ.)
5
0.13±0.05
Dimensions in ( ) for Reference Only.
Interlead flash or protrusions shall not exceed 0.25mm per side.