Amphenol Amphenol High Density HDB /HSB Connectors 3 3 TABLE OF CONTENTS Amphenol High Density HDB3 and HSB3 Connectors * Table of Contents . . .. . .. . .. . .. . .. . .. . .. . .. . .. .47 * Introduction - Features, Options, Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48, 49 HDB3 * * * * HDB3 Mother Board Connector . . . . . . . . . . . . . . . . 50 HDB3 Daughter Board Connector . . .. . .. . .. . .. .51 HDB3 I/O Connector . . . . . . . . . . . . . . . . . . . . . . . . . . 52 HDB3 Stacker Connector. . . . . . . . . . . . . . . . . . . . . . 53 HSB3 * * * * HSB3 Mother Board Connector . . . . . . . . . . . . . . . . 54 HSB3 Daughter Board Connector. . . . . . . . . . . . . . 55 HSB3 Arrangements . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Recommended Board Layout HSB3 Daughter Board. . . . . . . . . . . . . . . . . . . . . . . . . 57 * Recommended Board Layout HSB3 Mother Board . . .. . .. . .. . .. . .. . .. . .. . .. . .58 * Hardware for both HDB3 and HSB3 Connectors . . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. .59 3 HDB3Typical LRM and HSB Markets: Typical Markets: * * * * Transportation Military & Commercial Aviation Military Vehicles Medical Equipment Missiles/Ordnance Military & Commercial Avionics C4ISR * * UAVs C4ISR * * Naval Space * * High Radar Definition Cameras Amphenol Aerospace Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com 47 Amphenol Aerospace Amphenol(R) High Density HDB3 and HSB3 Connectors LRM (Line Replaceable Modules) High Density HSB3 HDB3 Hi Speed Low Mating Force MIL-DTL-55302 Other Rectangular Interconnects LMD/LMS Rectangular Interconnects Rack & Panel Brush Ruggedized Docking Conn./ Hybrids - Signal/Power/ Standard Coax/Fiber Optics Brush Accessories/Install. Ruggedized VME64x / VITA 60, 66 Options/ Hybrids - Fiber Optics/ Staggered/ Accessories Hi Speed/RF/Power GEN-X Introduction/ Pkg. Solutions/ Brush Contact INTRODUCTION: FEATURES & OPTIONS 48 New/Featured Product Amphenol's HDB3 High Density Brush Series with Tighter (.070 inch X .060 inch) Staggered Grid Spacing AMPHENOL'S BRUSH CONTACT - THE SUPERIOR CHOICE FOR BOARD LEVEL INTERCONNECTS BRUSH CONTACT This new connector series of brush connectors incorporates a higher density contact pattern and lower mated height than Amphenol's standard low mating force rectangular connectors. HDB3 connectors utilize the same durable and reliable B3 brush contact in a tighter .070" X .060" staggered grid pattern. HDB3 Advantages over Competitive Connectors: Multiple strands of high tensile strength wire bundled together to form brush-like contacts. See Brush Contact Technology section of this catalog for further description. * * * * Higher density contact pattern Uses less board space Allows for shorter mated height Provides the durability and performance of the Brush contact * Low cost CONVENTIONAL PIN AND SOCKET CRIMP CONTACT AMPHENOL HDB3 COMPARED TO COMPETITION Connector Features Contact System Durability, Mating Cycles Contact Mating Forces (ounces) Mother Board Daughter Board Connector Width Mated Height, MB to 4th row of DB Amphenol HDB3 Hypertronics HPH Airborn RM4 Brush 100,0000 1.5 .070 X .060 .070 X .060 .350 .680 Hyperoloid 2,000 1.5 .075 X .075 .075 X .100 .443 .986 Pin & Socket 500 2.5 .075 X .070 .075 X .100 .400 .915 HIGH DENSITY STYLES HDB3 Daughter Board/Mother Board HDB3 I/O Connector HDB3 Daughter Board Connector HDB3 I/O Connector HDB3 Mother Board Connector HDB3 Stacker HDB3 Mother Board Connector HSB3 High Speed HDB3 Stacker for Applications that Need or Demand Parallel Boards HSB3 High Speed Connectors are Capable of 6.250 Gbps HDB3 Mother Board Connector Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Amphenol(R) High Density HDB3 and HSB3 Connectors Amphenol Aerospace INTRODUCTION: FEATURES & PERFORMANCE Introduction/ Pkg. Solutions/ Brush Contact HDB3 & HSB3 HIGH DENSITY CONNECTOR PERFORMANCE: "D" shaped design Keying: Optional keys offer 36 unique keying combinations Guide Pins Optional guide pins provide additional alignment Radial Misalignment: Capable of correcting up to a 020" initial radial misalignment Angular Misalignment: Capable of mating with up to a 2 initial angular misalignment MATERIALS: Liquid crystal polymer, 30% glass filled Contact: Wire: Beryllium copper per ASTM B197; finish is gold per ASTM B488 over nickel per AMS-QQ-N-290 Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Other Rectangular Interconnects Sleeve: Stainless steel per AMS-5514, passivated IAW QQ-P-35 (Daughterboard, I/O and Stacker connector) LMD/LMS Rectangular Interconnects Holder: Brass similar to UNS C33500; available finishes include gold per MIL-G-45204, tin-lead per MIL-P 81728 or tin per MIL-T-10727 (RoHS Compliant) Rack & Panel Brush Ruggedized Insulator: Low Mating Force MIL-DTL-55302 Polarization: High Density HDB3 & HSB3 HIGH DENSITY CONNECTOR FEATURES: Standard Hybrids - Signal/Power/ Docking Conn./ Brush Coax/Fiber Optics Accessories/Install. * See more information on SMPM RF contacts in Other Rectangular Interconnects Section, page 126. SMPM RF contacts can be supplied by Amphenol SV Microwave. Phone: 561-840-1800 Website: www.svmicrowave.com HDB3 Mother Board and Daughter Board Mated HSB3 Hi Speed HSB3 Hybrid Connector with Metal Shell and RF Contacts supplied by SV Microwave* HDB3 CUSTOM DESIGN AVAILABILITY: Ruggedized VME 64x/ VITA 60, 66 Durability 100,000 mating cycles Insertion/Extraction Force: 1.5 ounce typical per contact Operating Temperature: -65 to 125C Current Rating: 2 amperes Hot swap 1 ampere maximum (load dependent) Insulation Resistance: 5 gigaohms minimum Dielectric Withstanding Voltage: 750 volts, 60 hertz, rms @ Sea Level, 250 volts, 60 hertz, rms @ 70,000 feet elevation Solderability: MIL-STD-202, Method 208 Salt Fog: 48 Hours IAW MIL-STD-1344, method 1001, test condition B Humidity: IAW MIL-STD-1344, method 1002, type II Vibration: 4 hours in each of 3 mutually perpendicular axes IAW MIL STD-1344, method 2005, test condition V, letter H Shock: 1 shock along each of three mutually perpendicular axes IAW MIL-STD-1344, method 2004,test condition G Data Rate (HSB3): Capable of up to 6.250 Gbps (consult Amphenol for arrangement) LRM (Line Replaceable Modules) Staggered/ Hybrids - Fiber Optics/ Options/ GEN-X Hi Speed/RF/Power Accessories HBD3 120 pin Mother Board and Daughter Board 49 Amphenol Aerospace Amphenol(R) High Density HDB3 Mother Board Connector Daughter Board 1. 1. Connector Type HDB-M4 HDB-M4 Designates HDB3 Mother Board 2. Number of Contacts 3. Brush Wire Plating 4. Termination -040 M 24 Other Rectangular Interconnects 6. Less Hardware (Purchased separately see pg XX for hardware options) 2 X 2. Number of Contacts .335 MAX. 22 23 24 26 28 Stickout (Dim. E) PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia 0.120 0.150 0.180 0.240 0.300 .016 .001 TYP. .090 TYP. .030 TYP. 5. Contact Termination Finish 2 5 6 6 4. Termination Type C A 0.000050 Au Min. thick over Nickel 0.000020 Au Min. thick over Nickel 6. Hardware Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min. thick Nickel Tin plated in accordance with ASTM B545, .00010 Min. thick Matte Tin over .00010 Min. thick Nickel Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper X Less Hardware Hardware is purchased separately (see page 59 for hardware options). Mother Board Layout C .110 .005 .205 .005 M .030 .060 PIN 1 E M C .086 MIN. DIA. THRU HOLE (USE NO. 2 SCREW) F 3. Brush Wire Plating D E .020 TYP. 4 3 2 1.075 1.425 1.775 2.475 3.175 1 1.375 1.725 2.075 2.775 3.475 40 60 80 120 160 C 040 060 080 120 160 .350 .150 .005 5 Number of Dimension Dimension Contacts A C .070 50 5. Contact Termination Finish B HSB3 HDB3 Hi Speed Mates with: * Daughter Board * I/O * Stacker A LRM (Line Replaceable Modules) Low Mating Force MIL-DTL-55302 Mother Board HDB3 MOTHER BOARD - HOW TO ORDER LMD/LMS Rectangular Interconnects Rack & Panel Brush Ruggedized Docking Conn./ Hybrids - Signal/Power/ Standard Coax/Fiber Optics Brush Accessories/Install. High Density Ruggedized VME64x / VITA 60, 66 Options/ Hybrids - Fiber Optics/ Staggered/ Accessories Hi Speed/RF/Power GEN-X Introduction/ Pkg. Solutions/ Brush Contact DIMENSIONAL DRAWING & HOW TO ORDER .035 FINISHED HOLE SIZE PER CUSTOMER STANDARDS FOR .016 PCB TAIL A Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com .195 MIN. HEX .070 MIN DEEP (USE 3/16 HEX HEAD) Amphenol Aerospace Amphenol(R) High Density HDB3 Daughter Board Connector DIMENSIONAL DRAWING & HOW TO ORDER Introduction/ Pkg. Solutions/ Brush Contact HDB3 DAUGHTER BOARD - HOW TO ORDER Mates with: * Mother Board 3. Brush Wire Plating 4. Termination HDB-D4 -040 M 01 5. Contact Termination Less Hardware (Purchased separately see Finish pg X for hardware options) 2 X Designates HDB3 Daughter Board .540 .325 2. Number of Contacts 1.075 1.425 1.775 2.475 3.175 5 1.375 1.725 2.075 2.775 3.475 PIN 1 4 40 60 80 120 160 040 060 080 120 160 E .020 TYP 3 Dimension C 2 Dimension A 6 1 Number of Contacts .086 MIN. DIA. THRU HOLE (USE NO. 2 SCREW) C A Ruggedized VME 64x/ VITA 60, 66 3. Brush Wire Plating M C 0.000050 Au Min. thick over Nickel 0.000020 Au Min. thick over Nickel CONNECTOR MOUNTING SURFACE E .020 TYP X .470 Less Hardware .530 Hardware is purchased separately (see page 59 for hardware options). Daughter Board Layout .060 DAUGHTER BOARD Rack & Panel Brush Ruggedized Mated Height Dimensions C DAUGHTER BOARD CONNECTOR .110 .005 .005 M .025 .035 .070 FINISHED HOLE SIZE PER CUSTOMER STANDARDS FOR .016 PCB TAIL A .300 .500 .150 .560 .205 MOTHER BOARD Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Other Rectangular Interconnects BOARD EDGE .680 .620 LMD/LMS Rectangular Interconnects MOTHER BOARD CONNECTOR Low Mating Force MIL-DTL-55302 .350 .410 6. Hardware Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min. thick Nickel Tin plated in accordance with ASTM B545, .00010 Min. thick Matte Tin over .00010 Min. thick Nickel Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper Standard Hybrids - Signal/Power/ Docking Conn./ Brush Coax/Fiber Optics Accessories/Install. 6 HSB3 Hi Speed 5 High Density .350 5. Contact Termination Finish 2 HDB3 0.090 0.120 0.150 0.180 0.300 D PCB, Right Angle, .016 Dia. PCB, Right Angle, .016 Dia. PCB, Right Angle, .016 Dia. PCB, Right Angle, .016 Dia. PCB, Right Angle, .016 Dia. E Stickout (Dim. E) C 01 02 03 04 06 Type B 4. Termination F A ORGANIZER (TO MAINTAIN PIN ALIGNMENT DURING CUSTOMER INSTALLATION) LRM (Line Replaceable Modules) 2. Number of Contacts Staggered/ Hybrids - Fiber Optics/ Options/ GEN-X Hi Speed/RF/Power Accessories 1. Connector Type HDB-D4 1. 51 Amphenol(R) High Density HDB3 I/O Connector HSB3 HDB3 Hi Speed * * * Cable to board applications Crimp termination Uses wire well size 22D HDB3 I/O - HOW TO ORDER Mother Board Mates with: * Standard Mother Board 1. Connector Type HDB-D4C Designates HDB3 I/O Connector 2-Piece Construction 1. 2. Number of Contacts 3. Brush Wire Plating 4. Contact Termination Finish HDB-D4C -120 C 2 2. Number of Contacts Number of Contacts 040 060 080 120 160 Dimension A Dimension C 1.375 1.725 2.075 2.775 3.475 1.075 1.425 1.775 2.475 3.175 2-56 THREAD LOCKING SCREW SUPPLIED PIN 1 3. Brush Wire Plating M C 0.000050 Au Min. thick over Nickel 0.000020 Au Min. thick over Nickel C A 4. Contact Termination Finish 2 Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min. thick Nickel MATING MOTHER BOARD CONNECTOR ASSEMBLED INPUT/OUTPUT CONNECTOR MATING SURFACE LRM (Line Replaceable Modules) Low Mating Force MIL-DTL-55302 I/O Connector HDB3 I/O APPLICATIONS .350 FRONT HALF INPUT/OUTPUT CONNECTOR REAR HALF INPUT/OUTPUT CONNECTOR Other Rectangular Interconnects LMD/LMS Rectangular Interconnects Rack & Panel Brush Ruggedized Docking Conn./ Hybrids - Signal/Power/ Standard Coax/Fiber Optics Brush Accessories/Install. High Density Ruggedized VME64x / VITA 60, 66 Options/ Hybrids - Fiber Optics/ Staggered/ Accessories Hi Speed/RF/Power GEN-X Introduction/ Pkg. Solutions/ Brush Contact DIMENSIONAL DRAWING & HOW TO ORDER 52 EXPLODED ISOMETRIC VIEW THREADED BOSS (2 REQUIRED FOR MOTHER BOARD CONNECTOR SEE HARDWARE ON PAGE 59) M22520/2-01 M22520/2-06 Crimp Tool Positioner 2 LOCKING SCREWS SUPPLIED REMOVABLE CRIMP CONTACTS FOR SIZE 22 THRU 28 GAGE WIRE Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Amphenol Aerospace Amphenol(R) High Density HDB3 Stacker Connector DIMENSIONAL DRAWING & HOW TO ORDER Introduction/ Pkg. Solutions/ Brush Contact HDB3 STACKER APPLICATIONS For applications that need or demand parallel boards Stacker Connector Mother Board 1. 1. Connector Type HDB-D4S 2. 3. Number of Contacts Brush Wire Plating 120 C HDB-D4S 4. 5. 6. Contact Termination Termination Finish 22 Required Field 2 X MATING SURFACE Designates HDB3 Stacker Connector .350 2. Number of Contacts Number Number of Diff Signals Contacts Dimension C 1.375 1.725 2.075 2.775 3.475 1.075 1.425 1.775 2.475 3.175 40 60 80 120 160 PIN 1 Ruggedized VME 64x/ VITA 60, 66 040 060 080 120 160 Dimension A C A HSB3 Hi Speed 0.000050 Au Min. thick over Nickel 0.000020 Au Min. thick over Nickel High Density HDB3 3. Brush Wire Plating M C 4. Termination PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia 5. Contact Termination Finish 2 .355 MAX Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min. thick Nickel STANDARD HDB3 MB SHOWN WITH OPTIONAL LOCKING GUIDE PINS LMD/LMS Rectangular Interconnects STANDARD HDB3 MB CONNECTOR WITH OPTIONAL GUIDE PINS HDB3 STACKER CONNECTOR Rack & Panel Brush Ruggedized EXPLODED ISOMETRIC VIEW E STICKOUT Low Mating Force MIL-DTL-55302 22 23 24 28 Stickout (Dim. E) .020 0.100 0.130 0.160 0.280 Standard Hybrids - Signal/Power/ Docking Conn./ Brush Coax/Fiber Optics Accessories/Install. Type LRM (Line Replaceable Modules) Mates with: * Standard Mother Board Staggered/ Hybrids - Fiber Optics/ Options/ GEN-X Hi Speed/RF/Power Accessories HDB3 STACKER - HOW TO ORDER Other Rectangular Interconnects Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com 53 Amphenol Aerospace Amphenol(R) High Density & High Speed HSB3 Mother Board Connector LRM (Line Replaceable Modules) Options/ Hybrids - Fiber Optics/ Staggered/ Accessories Hi Speed/RF/Power GEN-X Introduction/ Pkg. Solutions/ Brush Contact DIMENSIONAL DRAWING & HOW TO ORDER HSB3 - HIGH SPEED SERIES 6.250 GBS High speed configuration available that allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs. * Partially populated standard HDB3 mother board and daugher board bodies * Contact an Amphenol sales engineer for validation results HSB3 HIGH SPEED MOTHER BOARD - HOW TO ORDER Mates with: * High Speed Daughter Board 1. 2. Number of Differential Pairs 1. Connector Type HSB-M4 -03 HSB-M4 3. 4. 5. 6. Contact Differential Brush Wire Termination Termination Signal Plating Finish M D 24 4 1.075 1.425 1.775 2.475 3.175 5 1.375 1.725 2.075 2.775 3.475 6 Dimension C 1 Dimension A 3 MATING INTERFACE 2 No. Low Speed Signals 20 30 40 60 80 1 Number Differential Pairs 03 05 07 10 13 PIN 1 3. Differential Signal A C Standard Type Stickout (Dim. E) PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia PCB, Straight, .016 Dia 0.120 0.150 0.180 0.240 0.300 6. Contact Termination Finish 2 5 .350 .335 MAX SHOWN WITH OPTIONAL GUIDE PIN 7. Hardware X Less Hardware Hardware is purchased separately (see page 59 for hardware options). Other Rectangular Interconnects 6 Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min. thick Nickel Tin plated in accordance with ASTM B545, .00010 Min. thick Matte Tin over .00010 Min. thick Nickel Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper F 5. Termination 22 23 24 26 28 E C 0.000050 Au Min. thick over Nickel 0.000020 Au Min. thick over Nickel B M C D 4. Brush Wire Plating A Ruggedized VME64x / VITA 60, 66 HSB3 HDB3 Hi Speed High Density Low Mating Force MIL-DTL-55302 Docking Conn./ Hybrids - Signal/Power/ Standard Coax/Fiber Optics Brush Accessories/Install. Rack & Panel Brush Ruggedized 2 X Designates High Speed HDB I/O Connector D LMD/LMS Rectangular Interconnects (Purchased separately see pg XX for hardware options) 3 2. Number of Contacts 54 7. Less Hardware Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com CONNECTOR MOUNTING SURFACE Amphenol Aerospace Amphenol(R) High Density & High Speed HSB3 Daughter Board Connector DIMENSIONAL DRAWING & HOW TO ORDER Introduction/ Pkg. Solutions/ Brush Contact HSB3 HIGH SPEED DAUGHTER BOARD - HOW TO ORDER Mates with: * High Speed Mother Board 3. 4. 5. 6. Differential Signals Brush Wire Plating Termination Contact Termination Finish -03 D M 02 2 HSB-D4 1. Connector Type HSB-D4 .325 Designates High Speed HSB Daughter Board (Purchased separately see pg 10 for hardware options) X .540 3 7. Less Hardware .086 MIN. DIA. THRU HOLE (USE NO. 2 SCREW) 6 1 1.375 1.725 2.075 2.775 3.475 1.075 1.425 1.775 2.475 3.175 ORGANIZER (TO AID IN PIN ALIGNMENT) D Type Stickout (Dim. E) PCB, Right Angle, .016 Dia PCB, Right Angle, .016 Dia PCB, Right Angle, .016 Dia PCB, Right Angle, .016 Dia PCB, Right Angle, .016 Dia 0.090 0.120 0.150 0.180 0.300 .410 .470 .530 7. Hardware X Less Hardware Hardware is purchased separately (see page 59 for hardware options). Rack & Panel Brush Ruggedized 6 LMD/LMS Rectangular Interconnects Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min. thick Nickel Tin plated in accordance with ASTM B545, .00010 Min. thick Matte Tin over .00010 Min. thick Nickel Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper .350 Low Mating Force MIL-DTL-55302 CONNECTOR MOUNTING SURFACE E .020 TYP Standard Hybrids - Signal/Power/ Docking Conn./ Brush Coax/Fiber Optics Accessories/Install. 5 High Density 0.000050 Au Min. thick over Nickel 0.000020 Au Min. thick over Nickel 6. Contact Termination Finish 2 HSB3 Hi Speed .350 5. Termination 01 02 03 04 06 D C EMPTY CAVITIES HDB3 Standard 4. Brush Wire Plating M C E B D F A E .020 TYP 3. Differential Signals A Ruggedized VME 64x/ VITA 60, 66 Dimension D 5 PIN 1 Dimension A 4 03 05 07 10 13 No. Low Speed Signals 20 30 40 60 80 3 Number Diff Pairs 2 2. Number of Contacts LRM (Line Replaceable Modules) 2. Number of Differential Pairs Staggered/ Hybrids - Fiber Optics/ Options/ GEN-X Hi Speed/RF/Power Accessories 1. Other Rectangular Interconnects Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com 55 Amphenol Aerospace Amphenol(R) High Density & High Speed HSB3 Introduction/ Pkg. Solutions/ Brush Contact ARRANGEMENTS 5 6 LRM (Line Replaceable Modules) 2 3 A 1 High Density HSB3 HDB3 Hi Speed Low Mating Force MIL-DTL-55302 Docking Conn./ Hybrids - Signal/Power/ Standard Coax/Fiber Optics Brush Accessories/Install. Rack & Panel Brush Ruggedized 6 C 1 E F 4 2 3 A 1 1 4 2 56 B C E 5 6 D 60 Pin Body with 5 Differential Pair, 30 Signal Contacts 3 D F A 1 B C 80 Pin Body with 7 Differential Pair, 40 Signal Contacts 5 1 E 2 3 D F 4 6 A 1 B C 120 Pin Body with 10 Differential Pair, 60 Signal Contacts 5 1 E 4 6 2 3 F A 1 D B C 160 Pin Body with 13 Differential Pair, 80 Signal Contacts KEY 100 Ohm Differential Pair Contacts As viewed from front of daughter board connector (100 Ohm Differential contact pairs capable of 6.250 Gb/s data rates) Empty Contact Cavity Standard Digital, Low Speed Signal Contacts Other Rectangular Interconnects LMD/LMS Rectangular Interconnects B 5 D 40 Pin Body with 3 Differential Pair, 20 Signal Contacts Ruggedized VME64x / VITA 60, 66 Options/ Hybrids - Fiber Optics/ Staggered/ Accessories Hi Speed/RF/Power GEN-X 1 E F 4 Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Amphenol Aerospace Amphenol(R) High Density & High Speed HSB3 RECOMMENDED BOARD LAYOUT - HSB3 DAUGHTER BOARD Introduction/ Pkg. Solutions/ Brush Contact HSB3 DAUGHTER BOARD 1.075 .035 .070 SPACING TYP. FINISH HOLE SIZE PER CUSTOMER STANDARDS FOR A O.016 PCB TAIL .210 2 PLACES .205 TYP. .145 TYP. BOARD EDGE .275 3 DIFFERENTIAL PAIR 1.425 Ruggedized VME 64x/ VITA 60, 66 .150-.305 MAX High Density 5 DIFFERENTIAL PAIR HDB3 BOARD EDGE LRM (Line Replaceable Modules) .025 TYP. .150- .305 MAX .060 TYP. Staggered/ Hybrids - Fiber Optics/ Options/ GEN-X Hi Speed/RF/Power Accessories O.110 .005 2 PLACES NON-PLATED THRU HOLE TYPICAL O .005 .275 .210 4 Places HSB3 Hi Speed 1.775 BOARD EDGE 7 DIFFERENTIAL PAIR .205 .210 6 Places 2.475 BOARD EDGE .150- .305 MAX .210 9 Places Rack & Panel Brush Ruggedized 10 DIFFERENTIAL PAIR Low Mating Force MIL-DTL-55302 Standard Hybrids - Signal/Power/ Docking Conn./ Brush Coax/Fiber Optics Accessories/Install. .150-.305 MAX .275 3.175 LMD/LMS Rectangular Interconnects BOARD EDGE 13 DIFFERENTIAL PAIR .210 12 Places .275 Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Other Rectangular Interconnects .150- .305 MAX 57 Amphenol Aerospace Amphenol(R) High Density & High Speed HSB3 LRM (Line Replaceable Modules) HSB3 MOTHER BOARD 1.075 .060 TYP. .070 TYP. SPACING .030 TYP. .120 TYP. O.110 .005 2 PLACES TYP. O .005 .035 FINISH HOLE SIZE PER CUSTOMER STANDARDS FOR A O.016 PCB TAIL .205 TYP. .210 2 PLACES .275 3 DIFFERENTIAL PAIR 1.425 Ruggedized VME64x / VITA 60, 66 Options/ Hybrids - Fiber Optics/ Staggered/ Accessories Hi Speed/RF/Power GEN-X Introduction/ Pkg. Solutions/ Brush Contact RECOMMENDED BOARD LAYOUT - HSB3 MOTHER BOARD .210 4 places High Density HSB3 HDB3 Hi Speed Low Mating Force MIL-DTL-55302 5 DIFFERENTIAL PAIR 1.775 .205 .210 6 places 7 DIFFERENTIAL PAIR 2.475 .275 .210 9 PLACES 10 DIFFERENTIAL PAIR 3.175 .275 .210 12 PLACES 13 DIFFERENTIAL PAIR Other Rectangular Interconnects LMD/LMS Rectangular Interconnects Rack & Panel Brush Ruggedized Docking Conn./ Hybrids - Signal/Power/ Standard Coax/Fiber Optics Brush Accessories/Install. .275 58 Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Amphenol Aerospace Amphenol(R) High Density & High Speed HDB3 & HSB3 HARDWARE FOR BOTH HDB3 AND HSB3 Each connector requires (2) of the component hardware listed below. These components are sold as individual units. MOTHER BOARD STICKOUT HDB-508803-002 POLARIZATION KEY 0.500 HDB-508803-003 POLARIZATION KEY 0.750 HDB-508802-001 GUIDE PIN 0.250 HDB-508802-002 GUIDE PIN 0.500 HDB-508802-003 GUIDE PIN 0.750 HDB-508808-001 THREADED BOSS* 0.250 HDB-508808-002 THREADED BOSS* 0.500 HDB-508808-003 THREADED BOSS* 0.750 HDB-508808-020 LOCKING GUIDE PIN 0.250 HDB-508808-021 LOCKING GUIDE PIN 0.500 HDB-508808-022 LOCKING GUIDE PIN 0.750 Accepts I/O Connector Jack Screw Shown with Mother Board Connector on page 53 * Required with Mother Board only when mating to I/O Connector DAUGHTER BOARD TYPE HDB-508804-001 LOW PROFILE MOUNTING NUT High Density POLARIZATION KEY HSB3 Hi Speed HDB-508804-000 HDB3 PART NUMBER POLARIZATION KEYS (OPTIONAL) MOTHER BOARD CONNECTOR ASSEMBLY NOT INCLUDED EXPLODED ISOMETRIC VIEW SHOWN WITH OPTIONAL KEYING LOW PROFILE MOUNTING NUT (OPTIONAL) Rack & Panel Brush Ruggedized EXPLODED ISOMETRIC VIEW SHOWN WITH OPTIONAL GUIDE PIN Low Mating Force MIL-DTL-55302 DAUGHTER BOARD CONNECTOR ASSEMBLY Standard Hybrids - Signal/Power/ Docking Conn./ Brush Coax/Fiber Optics Accessories/Install. EXPLODED ISOMETRIC VIEW MOTHER BOARD CONNECTOR GUIDE PIN (OPTIONAL) LRM (Line Replaceable Modules) 0.250 Ruggedized VME 64x/ VITA 60, 66 TYPE POLARIZATION KEY Staggered/ Hybrids - Fiber Optics/ Options/ GEN-X Hi Speed/RF/Power Accessories PART NUMBER HDB-508803-001 Introduction/ Pkg. Solutions/ Brush Contact HARDWARE FOR ALL CONFIGURATIONS (Sold Separately) LMD/LMS Rectangular Interconnects 2-56 SCREW AND WASHER 2 PLACES (NOT SUPPLIED) Contact Amphenol Aerospace for more information at 800-678-0141 * www.amphenol-aerospace.com Other Rectangular Interconnects EXPLODED ISOMETRIC VIEW SHOWN WITH OPTIONAL LOW PROFILE MOUNTING NUT 59