Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
Amphenol
Aerospace
Amphenol
Aerospace
Amphenol
Aerospace
Amphenol
Amphenol
Aerospace
LRM Typical Markets:
• Military & Commercial Aviation
• Military Vehicles
• Missiles/Ordnance
• C4ISR
• Space
• Radar
47
Amphenol
Aerospace
Amphenol
High Density HDB3/HSB3 Connectors
TABLE OF CONTENTS
Amphenol High Density HDB3 and HSB3
Connectors
• Table of Contents .. . .. . .. . .. . .. . .. . .. . .. . .. . ..47
• Introduction - Features, Options,
Performance ............................. 48, 49
HDB3
• HDB3 Mother Board Connector.................50
• HDB3 Daughter Board Connector .. . .. . .. . .. . ..51
• HDB3 I/O Connector . .. . .. . .. . .. . .. . .. . .. . .. . ..52
• HDB3 Stacker Connector.......................53
HSB3
• HSB3 Mother Board Connector .................54
• HSB3 Daughter Board Connector. .. . .. . .. . .. . ..55
• HSB3 Arrangements . .. . .. . .. . .. . .. . .. . .. . .. . ..56
• Recommended Board Layout -
HSB3 Daughter Board..........................57
• Recommended Board Layout -
HSB3 Mother Board ...........................58
• Hardware for both HDB3 and HSB3
Connectors .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . ..59
HDB3 and HSB3 Typical Markets:
• Transportation
• Medical Equipment
• Military & Commercial Avionics
• C4ISR
• UAVs
• Naval
• High Denition Cameras
48
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized Docking Conn./
Accessories/Install.
Introduction/
Pkg. Solutions/
Brush Contact
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Ruggedized
VME64x /
VITA 60, 66
Amphenol® High Density HDB3 and HSB3
Connectors
INTRODUCTION: FEATURES & OPTIONS
This new connector series of brush connectors incorpo-
rates a higher density contact pattern and lower mated
height than Amphenol’s standard low mating force
rectangular connectors. HDB3 connectors utilize the
same durable and reliable B3 brush contact in a tighter
.070” X .060” staggered grid pattern.
Amphenol’s HDB3 High Density Brush Series
with Tighter (.070 inch X .060 inch)
Staggered Grid Spacing
HDB3 I/O Connector
AMPHENOL’S BRUSH CONTACT - THE SUPERIOR
CHOICE FOR BOARD LEVEL INTERCONNECTS
HDB3 Stacker
HDB3 Stacker for Applications
that Need or Demand Parallel
Boards
Multiple strands of high tensile strength wire bundled together to
form brush-like contacts. See Brush Contact Technology section
of this catalog for further description.
HSB3 High Speed
HDB3 I/O Connector
HDB3 Mother Board
Connector
HDB3 Daughter Board/Mother Board
HDB3 Mother Board Connector
HDB3 Daughter
Board Connector
HDB3 Mother
Board Connector
HDB3 Advantages over Competitive
Connectors:
• Higher density contact pattern
• Uses less board space
• Allows for shorter mated height
• Provides the durability and performance of
the Brush contact
• Low cost
BRUSH CONTACT
HSB3 High Speed
Connectors
are Capable of 6.250
Gbps
AMPHENOL HDB3 COMPARED TO COMPETITION
Connector Features Amphenol
HDB3 Hypertronics
HPH Airborn
RM4
Contact System Brush Hyperoloid Pin & Socket
Durability, Mating Cycles 100,0000 2,000 500
Contact Mating Forces (ounces) 1.5 1.5 2.5
Mother Board .070 X .060 .075 X .075 .075 X .070
Daughter Board .070 X .060 .075 X .100 .075 X .100
Connector Width .350 .443 .400
Mated Height, MB to 4th row of DB .680 .986 .915
HIGH DENSITY STYLES
CONVENTIONAL PIN AND SOCKET
CRIMP CONTACT
New/Featured Product
49
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized
Docking Conn./
Accessories/Install.
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Introduction/
Pkg. Solutions/
Brush Contact
Ruggedized
VME 64x/
VITA 60, 66
Amphenol® High Density HDB3 and HSB3
Connectors
INTRODUCTION: FEATURES & PERFORMANCE
HDB3 & HSB3 HIGH DENSITY CONNECTOR
FEATURES:
Polarization: “D” shaped design
Keying: Optional keys offer 36 unique
keying combinations
Guide Pins Optional guide pins provide
additional alignment
Radial Misalignment:
Capable of correcting up to a
020” initial radial misalignment
Angular Misalignment:
Capable of mating with up to a
2° initial angular misalignment
Durability 100,000 mating cycles
Insertion/Extraction Force: 1.5 ounce typical per contact
Operating Temperature: -65° to 125°C
Current Rating: 2 amperes Hot swap 1 ampere
maximum (load dependent)
Insulation Resistance: 5 gigaohms minimum
Dielectric Withstanding
Voltage: 750 volts, 60 hertz, rms @ Sea
Level, 250 volts, 60 hertz,
rms @ 70,000 feet elevation
Solderability: MIL-STD-202, Method 208
Salt Fog: 48 Hours IAW MIL-STD-1344,
method 1001, test condition B
Humidity: IAW MIL-STD-1344, method
1002, type II
Vibration: 4 hours in each of 3 mutually
perpendicular axes IAW MIL
STD-1344, method 2005, test
condition V, letter H
Shock: 1 shock along each of three
mutually perpendicular axes
IAW MIL-STD-1344, method
2004,test condition G
Data Rate (HSB3): Capable of up to 6.250 Gbps
(consult Amphenol for
arrangement)
HDB3 & HSB3 HIGH DENSITY CONNECTOR
PERFORMANCE:
Insulator: Liquid crystal polymer, 30% glass
lled
Contact: Wire: Beryllium copper per ASTM B197;
nish is gold per ASTM B488 over
nickel per AMS-QQ-N-290
Holder: Brass similar to UNS C33500;
available nishes include gold per
MIL-G-45204, tin-lead per MIL-P-
81728 or tin per MIL-T-10727 (RoHS
Compliant)
Sleeve: Stainless steel per AMS-5514,
passivated IAW QQ-P-35 (Daughter-
board, I/O and Stacker connector)
HBD3 120 pin Mother Board and Daughter Board
MATERIALS:
HDB3 Mother Board and Daughter Board Mated
CUSTOM DESIGN AVAILABILITY:
HSB3 Hybrid Connector with Metal Shell
and RF Contacts supplied by SV Microwave*
* See more information on SMPM RF contacts in Other Rectangular Interconnects
Section, page 126. SMPM RF contacts can be supplied by Amphenol
SV Microwave. Phone: 561-840-1800
Website: www.svmicrowave.com
50
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized Docking Conn./
Accessories/Install.
Introduction/
Pkg. Solutions/
Brush Contact
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Ruggedized
VME64x /
VITA 60, 66
1. Connector Type
3. Brush Wire Plating
Number of
Contacts Dimension
ADimension
C
040 40 1.375 1.075
060 60 1.725 1.425
080 80 2.075 1.775
120 120 2.775 2.475
160 160 3.475 3.175
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
Type Stickout
(Dim. E)
22 PCB, Straight, .016 Dia 0.120
23 PCB, Straight, .016 Dia 0.150
24 PCB, Straight, .016 Dia 0.180
26 PCB, Straight, .016 Dia 0.240
28 PCB, Straight, .016 Dia 0.300
5. Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min. thick
Nickel
5
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
6
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
1. 2. 3. 4. 5. 6.
Number of
Contacts Brush Wire
Plating Termination Contact Termination
Finish Less Hardware
(Purchased separately see
pg XX for hardware options)
HDB-M4 -040 M 24 2 X
2. Number of Contacts
4. Termination
HDB3 MOTHER BOARD - HOW TO ORDER
Mates with:
• Daughter Board
• I/O
• Stacker
Mother Board Layout
C
.070
.060
.205
.035 .030
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
A.016 PCB TAIL
.005 M
.110 ±.005
HDB-M4
Designates HDB3 Mother Board
Amphenol® High Density HDB3
Mother Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
Mother Board
Daughter Board
6. Hardware
XLess Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
.350 .086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
PIN 1
C
A
.335 MAX.
.150 ±.005
E ±.020
TYP.
.016 ±.001
TYP.
.195 MIN. HEX
.070 MIN DEEP
(USE 3/16 HEX HEAD)
.090 TYP.
.030 TYP.
4
65
123
D
FE
ABC
51
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized
Docking Conn./
Accessories/Install.
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Introduction/
Pkg. Solutions/
Brush Contact
Ruggedized
VME 64x/
VITA 60, 66
Amphenol® High Density HDB3
Daughter Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
Number of
Contacts Dimen-
sion A Dimension
C
040 40 1.375 1.075
060 60 1.725 1.425
080 80 2.075 1.775
120 120 2.775 2.475
160 160 3.475 3.175
3. Brush Wire Plating
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
Type Stickout
(Dim. E)
01 PCB, Right Angle, .016 Dia. 0.090
02 PCB, Right Angle, .016 Dia. 0.120
03 PCB, Right Angle, .016 Dia. 0.150
04 PCB, Right Angle, .016 Dia. 0.180
06 PCB, Right Angle, .016 Dia. 0.300
4. Termination
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min.
thick Nickel
5
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
6
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
5. Contact Termination Finish
1. 2. 3. 4. 5.
Number of
Contacts Brush Wire
Plating Termination Contact Termination
Finish Less Hardware
(Purchased separately see
pg X for hardware options)
HDB-D4 -040 M 01 2 X
2. Number of Contacts
HDB3 DAUGHTER BOARD - HOW TO ORDER
Mates with:
• Mother Board
Daughter Board Layout
C
.025
.300
.150
.205
.070.035
.060
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
A.016 PCB TAIL
BOARD
EDGE
.005 M
.110 ±.005
.680
.620
.560
.500
MOTHER
BOARD
DAUGHTER
BOARD
MOTHER
BOARD
CONNECTOR
DAUGHTER
BOARD
CONNECTOR
Mated Height
Dimensions
1. Connector Type
HDB-D4
Designates HDB3 Daughter Board
6. Hardware
XLess Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
CA
.325
.540
.350
.350
.410
.470
.530
E
±.020 TYP
CONNECTOR
MOUNTING
SURFACE
E ±.020
TYP
123
654
PIN 1
ABC
FED
.086 MIN. DIA.
THRU HOLE
(USE NO.
2 SCREW)
ORGANIZER
(TO MAINTAIN
PIN ALIGNMENT
DURING CUSTOMER
INSTALLATION)
52 Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized Docking Conn./
Accessories/Install.
Introduction/
Pkg. Solutions/
Brush Contact
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Ruggedized
VME64x /
VITA 60, 66
Amphenol® High Density HDB3
I/O Connector
DIMENSIONAL DRAWING & HOW TO ORDER
3. Brush Wire Plating
Number
of Contacts Dimension A Dimension C
040 1.375 1.075
060 1.725 1.425
080 2.075 1.775
120 2.775 2.475
160 3.475 3.175
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
M22520/2-01 Crimp Tool
M22520/2-06 Positioner
4. Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min. thick
Nickel
1. 2. 3. 4.
Number of
Contacts
Brush Wire
Plating
Contact Termination
Finish
HDB-D4C -120 C 2
2. Number of Contacts
Mother Board
EXPLODED
ISOMETRIC VIEW
HDB3 I/O APPLICATIONS
Mates with:
• Standard Mother Board
1. Connector Type
HDB-D4C
Designates HDB3 I/O Connector
• Cable to board applications
• Crimp termination
• Uses wire well size 22D
HDB3 I/O - HOW TO ORDER
C
.350
A
2-56 THREAD
LOCKING SCREW SUPPLIED
PIN 1
MATING
SURFACE
REAR HALF
INPUT/OUTPUT
CONNECTOR
2 LOCKING SCREWS
SUPPLIED
FRONT HALF
INPUT/OUTPUT
CONNECTOR
REMOVABLE CRIMP CONTACTS
FOR SIZE 22 THRU 28 GAGE WIRE
THREADED BOSS
(2 REQUIRED FOR MOTHER BOARD
CONNECTOR SEE HARDWARE ON PAGE 59)
ASSEMBLED
INPUT/OUTPUT
CONNECTOR
MATING
MOTHER BOARD
CONNECTOR
I/O Connector
2-Piece Construction
53
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized
Docking Conn./
Accessories/Install.
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Introduction/
Pkg. Solutions/
Brush Contact
Ruggedized
VME 64x/
VITA 60, 66
STANDARD HDB3 MB
CONNECTOR WITH OPTIONAL GUIDE PINS STANDARD HDB3 MB SHOWN WITH
OPTIONAL LOCKING GUIDE PINS
HDB3 STACKER
CONNECTOR
Amphenol® High Density HDB3
Stacker Connector
DIMENSIONAL DRAWING & HOW TO ORDER
HDB-D4S
Designates HDB3 Stacker
Connector
3. Brush Wire Plating
Number
Diff Signals Number of
Contacts Dimension
ADimension
C
040 40 1.375 1.075
060 60 1.725 1.425
080 80 2.075 1.775
120 120 2.775 2.475
160 160 3.475 3.175
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
5. Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min.
thick Nickel
1. 2. 3. 4. 5. 6.
Number of
Contacts Brush Wire
Plating Termination Contact Termination
Finish Required
Field
HDB-D4S 120 C 22 2 X
1. Connector Type
2. Number of Contacts
4. Termination
Type Stickout
(Dim. E)
±.020
22 PCB, Straight, .016 Dia 0.100
23 PCB, Straight, .016 Dia 0.130
24 PCB, Straight, .016 Dia 0.160
28 PCB, Straight, .016 Dia 0.280
Stacker Connector Mother Board
HDB3 STACKER APPLICATIONS
Mates with:
• Standard Mother Board
For applications that need or demand parallel boards
HDB3 STACKER - HOW TO ORDER
EXPLODED
ISOMETRIC VIEW
.350
CA
.355 MAX
MATING
SURFACE
E
STICKOUT
PIN 1
54
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized Docking Conn./
Accessories/Install.
Introduction/
Pkg. Solutions/
Brush Contact
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Ruggedized
VME64x /
VITA 60, 66
4. Brush Wire Plating
Number
Differential
Pairs
No. Low
Speed
Signals
Dimension
ADimension
C
03 20 1.375 1.075
05 30 1.725 1.425
07 40 2.075 1.775
10 60 2.775 2.475
13 80 3.475 3.175
DStandard
6. Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min.
thick Nickel
5
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min.
thick Nickel
6
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
1. 2. 3. 4. 5. 6. 7.
Number of
Differential Pairs Differential
Signal Brush Wire
Plating Termination Contact
Termination
Finish
Less Hardware
(Purchased separately see
pg XX for hardware options)
HSB-M4 -03 DM 24 2 X
2. Number of Contacts
5. Termination
Type Stickout
(Dim. E)
22 PCB, Straight, .016 Dia 0.120
23 PCB, Straight, .016 Dia 0.150
24 PCB, Straight, .016 Dia 0.180
26 PCB, Straight, .016 Dia 0.240
28 PCB, Straight, .016 Dia 0.300
3. Differential Signal
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
Amphenol® High Density & High Speed
HSB3 Mother Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
HSB3 - HIGH SPEED SERIES 6.250 GBS
Mates with:
• High Speed Daughter Board
1. Connector Type
HSB-M4
Designates High Speed HDB3 I/O Connector
High speed conguration available that allows
data rates up to 6.250 Gb/s via 100 ohm
matched impedance differential pairs.
• Partially populated standard HDB3 mother
board and daugher board bodies
• Contact an Amphenol sales engineer for
validation results
HSB3 HIGH SPEED MOTHER BOARD - HOW TO ORDER
7. Hardware
XLess Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
CA
.350
PIN 1
D
E
B
F
C
A
4
5
2
6
3
1
.335
MAX
MATING
INTERFACECONNECTOR
MOUNTING
SURFACE
1
SHOWN WITH
OPTIONAL
GUIDE PIN
55
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized
Docking Conn./
Accessories/Install.
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Introduction/
Pkg. Solutions/
Brush Contact
Ruggedized
VME 64x/
VITA 60, 66
Amphenol® High Density & High Speed
HSB3 Daughter Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
HSB-D4
Designates High Speed HSB3 Daughter Board
4. Brush Wire Plating
Number
Diff Pairs
No. Low
Speed
Signals
Dimension
ADimension
D
03 20 1.375 1.075
05 30 1.725 1.425
07 40 2.075 1.775
10 60 2.775 2.475
13 80 3.475 3.175
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
Type Stickout
(Dim. E)
01 PCB, Right Angle, .016 Dia 0.090
02 PCB, Right Angle, .016 Dia 0.120
03 PCB, Right Angle, .016 Dia 0.150
04 PCB, Right Angle, .016 Dia 0.180
06 PCB, Right Angle, .016 Dia 0.300
6. Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min. thick
Nickel
5
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
6
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
1. 2. 3. 4. 5. 6. 7.
Number of
Differential Pairs Differential
Signals Brush Wire
Plating Termination Contact Termination
Finish
Less Hardware
(Purchased separately see pg
10 for hardware options)
HSB-D4 –03 DM 02 2 X
1. Connector Type
2. Number of Contacts
5. Termination
3. Differential Signals
DStandard
7. Hardware
XLess Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
DA
.325
.540
.350
.350
.410
.470
.530
E
±.020 TYP
CONNECTOR
MOUNTING
SURFACE
E ±.020
TYP
123
654
PIN 1
EMPTY
CAVITIES
ABC
FED
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
ORGANIZER
(TO AID IN PIN
ALIGNMENT)
Mates with:
• High Speed Mother Board
HSB3 HIGH SPEED DAUGHTER BOARD - HOW TO ORDER
56
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized Docking Conn./
Accessories/Install.
Introduction/
Pkg. Solutions/
Brush Contact
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Ruggedized
VME64x /
VITA 60, 66
Amphenol® High Density & High Speed
HSB3
ARRANGEMENTS
As viewed from front of daughter board connector
5
6
11
23
4E
F
ABC
D
5
6
11
23
4E
F
ABC
D
40 Pin Body with 3 Differential Pair, 20 Signal Contacts
80 Pin Body with 7 Differential Pair, 40 Signal Contacts
120 Pin Body with 10 Differential Pair, 60 Signal Contacts
160 Pin Body with 13 Differential Pair, 80 Signal Contacts
100 Ohm Differential Pair Contacts
Empty Contact Cavity
Standard Digital, Low Speed Signal Contacts
(100 Ohm Differential contact pairs capable of 6.250 Gb/s data rates)
KEY
5
6
11
23
4E
F
ABC
D
5
6
123
4E
F
ABC
D
1
60 Pin Body with 5 Differential Pair, 30 Signal Contacts
5
6
123
4E
F
ABC
D
1
57
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized
Docking Conn./
Accessories/Install.
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Introduction/
Pkg. Solutions/
Brush Contact
Ruggedized
VME 64x/
VITA 60, 66
Amphenol® High Density & High Speed
HSB3
RECOMMENDED BOARD LAYOUT - HSB3 DAUGHTER BOARD
.150- .305 MAX .025
TYP.
.070
SPACING TYP.
.205
TYP.
.210
2 PLACES
.275
3 DIFFERENTIAL PAIR
Ø.110 ± .005
2 PLACES
NON-PLATED
THRU HOLE
TYPICAL
FINISH HOLE SIZE
PER CUSTOMER STANDARDS
FOR A Ø.016 PCB TAIL
.060
TYP.
.145
TYP.
BOARD
EDGE
1.075
.035
Ø .005
5 DIFFERENTIAL PAIR .210
4 Places
1.425
BOARD
EDGE
.275
.150-.305 MAX
.150-.305 MAX
7 DIFFERENTIAL PAIR .210
6 Places
1.775
BOARD
EDGE
.205
.150- .305 MAX
2.475
10 DIFFERENTIAL PAIR .210
9 Places .275
BOARD
EDGE
.150- .305 MAX
3.175
13 DIFFERENTIAL PAIR .210
12 Places .275
BOARD
EDGE
HSB3 DAUGHTER BOARD
58
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized Docking Conn./
Accessories/Install.
Introduction/
Pkg. Solutions/
Brush Contact
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Ruggedized
VME64x /
VITA 60, 66
Amphenol® High Density & High Speed
HSB3
RECOMMENDED BOARD LAYOUT - HSB3 MOTHER BOARD
7 DIFFERENTIAL PAIR
5 DIFFERENTIAL PAIR
1.775
1.425
.205
.275
.210
6 places
.210
4 places
10 DIFFERENTIAL PAIR
2.475
.275 .210
9 PLACES
13 DIFFERENTIAL PAIR
3.175
.275 .210
12 PLACES
3 DIFFERENTIAL PAIR
1.075
.070 TYP.
SPACING
.035
.120
TYP.
.030
TYP.
.060
TYP.
.205
TYP. .275 .210
2 PLACES
FINISH HOLE SIZE PER
CUSTOMER STANDARDS
FOR A Ø.016 PCB TAIL
Ø.110 ± .005
2 PLACES TYP.
Ø .005
HSB3 MOTHER BOARD
59
Amphenol
Aerospace
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
LRM (Line Replaceable Modules)
Staggered/
GEN-X
Hybrids - Fiber Optics/
Hi Speed/RF/Power
Options/
Accessories
High Density
HDB3 HSB3
Hi Speed
Low Mating Force MIL-DTL-55302
Standard
Brush
Hybrids - Signal/Power/
Coax/Fiber Optics
Rack & Panel
Brush
Ruggedized
Docking Conn./
Accessories/Install.
LMD/LMS
Rectangular
Interconnects
Other
Rectangular
Interconnects
Introduction/
Pkg. Solutions/
Brush Contact
Ruggedized
VME 64x/
VITA 60, 66
Amphenol® High Density & High Speed
HDB3 & HSB3
HARDWARE FOR BOTH HDB3 AND HSB3
POLARIZATION KEYS
(OPTIONAL)
LOW PROFILE MOUNTING
NUT (OPTIONAL)
2-56 SCREW AND
WASHER 2 PLACES (NOT
SUPPLIED)
DAUGHTER BOARD
CONNECTOR ASSEMBLY
MOTHER BOARD CONNECTOR
GUIDE PIN (OPTIONAL)
MOTHER BOARD CONNECTOR
ASSEMBLY NOT INCLUDED
EXPLODED ISOMETRIC VIEW SHOWN WITH
OPTIONAL GUIDE PIN
EXPLODED ISOMETRIC VIEW
SHOWN WITH OPTIONAL LOW
PROFILE MOUNTING NUT
EXPLODED ISOMETRIC VIEW
SHOWN WITH OPTIONAL KEYING
EXPLODED ISOMETRIC VIEW
MOTHER BOARD
PART NUMBER TYPE STICKOUT
HDB-508803-001 POLARIZATION KEY 0.250
HDB-508803-002 POLARIZATION KEY 0.500
HDB-508803-003 POLARIZATION KEY 0.750
HDB-508802-001 GUIDE PIN 0.250
HDB-508802-002 GUIDE PIN 0.500
HDB-508802-003 GUIDE PIN 0.750
HDB-508808-001 THREADED BOSS* 0.250
HDB-508808-002 THREADED BOSS* 0.500
HDB-508808-003 THREADED BOSS* 0.750
HDB-508808-020 LOCKING GUIDE PIN 0.250
HDB-508808-021 LOCKING GUIDE PIN 0.500
HDB-508808-022 LOCKING GUIDE PIN 0.750
Shown with
Mother Board
Connector on page 53
Accepts
I/O Connector
Jack Screw
DAUGHTER BOARD
PART NUMBER TYPE
HDB-508804-000 POLARIZATION KEY
HDB-508804-001 LOW PROFILE MOUNTING NUT
* Required with Mother Board only when mating to I/O Connector
HARDWARE FOR ALL CONFIGURATIONS (Sold Separately)
Each connector requires (2) of the component hardware listed below. These components are sold as individual units.