GP2L24J0000F
1
Sheet No.: D3-A02301EN
Date Oct. 3. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
GP2L24J0000F Detecting Distance : 0.7mm
Darlington Phototransistor Output
Compact Refl ective
Photointerrupter
■Description
GP2L24J0000F is a compact-package, darlington
phototransistor output, reflective photointerrupter,
with emitter and detector facing the same direction in
a molding that provides non-contact sensing. The
compact package series is a result of unique technology,
combing transfer and injection molding, that also blocks
visible light to minimize false detection.
■Features
1. Refl ective with Darlington Phototransistor Output
2. Highlights :
• Compact Size
3. Key Parameters :
• Optimal Sensing Distance : 0.7mm
• Package : 4×3×1.7mm
• Visible light cut resin to prevent
4. Lead free and RoHS directive compliant
■Agency approvals/Compliance
1. Compliant with RoHS directive
■Applications
1. Detection of object presence or motion.
2. Example : printer, optical storage
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Sheet No.: D3-A02301EN
GP2L24J0000F
■Internal Connection Diagram
■Outline Dimensions (Unit : mm)
Product mass : approx. 0.04g
• Tolerance : ±0.15mm
• ( ) : Reference dimensions
• The dimensions shown do not include
those of burrs.
Burr's dimension : 0.15mm MAX.
• The dimensions indicated by ∗ refer to
those measured from the lead bending
part.
0.75
C0.7
1.7
1.75
(2.0 )retnec retti
m
E
(4)
(4.
0)r
e
t
n
ec
rotc
e
t
e
D
θ : 0 to 20˚
∗4±0.2
4−0.15+0.2
−0.1
4−0.4+0.2
−0.1
4+0.2
−0.1 3+0.2
−0.1
3.5+0.1
−0
21
34
θ
±15˚
Date code mark
Top view
Anode
Top view
2
2
11
Emitter
Collector
4
3
Cathode
3
4
Plating material : SnCu (Cu : TYP. 2%)
3
Sheet No.: D3-A02301EN
GP2L24J0000F
Date code (Symbol)
January July
February August
March September
April October
May November
June December
Rank mark
There is no rank indicator.
Country of origin
Japan
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Sheet No.: D3-A02301EN
GP2L24J0000F
■Absolute Maximum Ratings
■Electro-optical Characteristics
(Ta=25˚C )
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
Reverse voltage VR6V
Power dissipation PD75 mW
Output
Collector-emitter voltage
VCEO 35 V
Emitter-collector voltage
VECO 6V
Collector current IC50 mA
Collector power dissipation PC75 mW
Total power dissipation Ptot 100 mW
Operating temperature Topr −25 to +85 ˚C
Storage temperature Tstg −40 to +100 ˚C
∗1Soldering temperature Tsol 260 ˚C
∗1 For 5s or less.
(Ta=25˚C )
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input
Forward voltage VFIF=20mA −1.2 1.4 V
Reverse current IRVR=6V −−
10 μA
Output Collector dark current ICEO VCE=10V −−1nA
Transfer
charac-
teristics
∗2 Collector current ICIF=4mA, VCE=2V 0.5 3 15 mA
∗3 Leak current ILEAK IF=4mA, VCE=5V −−5nA
Response time Rise time trVCE=2V, IC=10μA,
RL=100Ω, d=1mm
−80 400 μs
Fall time tf−70 400
∗2 The condition and arrangement of the refl ective object are shown below.
The rank splitting of collector current (IC) shall be executed according to the table below.
Rank Collector current, IC [mA]
(IF=4mA, VCE=2V) Package sleeve color
A 0.5 to 1.9 Yellow
B 1.45 to 5.4 Transparent
C 4 to 15 Green
∗3 Without refl ective object.
●Test Arrangement for Collector Current
d=1mm glass plate
Al evaporation
Soldering area
1mm or more
5
Sheet No.: D3-A02301EN
GP2L24J0000F
■Model Line-up
Please contact a local SHARP sales representative to inquire about production status.
Model No. Rank Collector current IC[mA]
(IF=4mA, VCE=2V, Ta=25˚C)
GP2L24J0000F A, B or C 0.5 to 15
GP2L24BJ000F B 1.45 to 5.4
GP2L24CJ000F C 4 to 15
GP2L24ABJ00F A or B 0.5 to 5.4
GP2L24BCJ00F B or C 1.45 to 15
∗ The ratio of each rank can not be guaranteed.
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Sheet No.: D3-A02301EN
GP2L24J0000F
Fig.5 Collector Current vs.
Forward Current
Fig.6 Collector Current vs.
Collector-emitter Voltage
Fig.3 Peak Forward Current vs. Duty Ratio Fig.4 Forward Current vs. Forward Voltage
Fig.1 Forward Current vs.
Ambient Temperature
Fig.2 Collector Power Dissipation vs.
Ambient Temperature
Peak forward current IFM (mA)
Duty ratio
100
10
10−2
10−310−1
1 000
Pulse width≤100μs
Ta=25˚C
1
Forward current IF (mA)
Forward voltage VF (V)
0 0.5 1 1.5 2
1
2.5 3
10
100
25˚C
0˚C
−25˚C
50˚C
Ta=75˚C
Collector current IC (mA)
Forward current IF (mA)
5
15
10
20
25
0
0 2.5 5.5 7.5 10 12.5 15
VCE=2V
Ta=25˚C
Collector current IC (mA)
Collector-emitter voltage VCE (V)
14
12
8
10
6
4
2
0
012108642
Ta=25˚C
16
4mA
2mA
7mA
10mA
IF=15mA
PC (MAX.)
Forward current IF (mA)
Ambient temperature Ta (˚C)
−25 0 25 50 75 100
0
10
20
30
40
50
60
85
Collector power dissipation P (mW)
Ambient temperature Ta (˚C)
−25 0 25 50 75 100
0
20
40
60
85
100
120
80
75
Ptot
P, P c
15
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Sheet No.: D3-A02301EN
GP2L24J0000F
Fig.7 Relative Collector Current vs.
Ambient Temperature
Fig.8 Collector Dark Current vs.
Ambient Temperature
Fig.9
Response Time vs. Load Resistance
Fig.11 Relative Collector Current vs.
Distance (Reference value)
Fig.12
Detecting Position Characteristics (1)
Fig.10
Test Circuit for Response Time
Relative collector current (%)
Ambient temperature Ta (˚C)
0 25 50 75 100
0
IF=4mA
VCE=5V
−25
50
25
75
100
125
150
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
25−25 50 75 1000
10−4
VCE=10V
10−11
10−10
10−9
10−8
10−7
10−6
10−5
Output
Output
Input
VCC
Input RD
RL
td
tr
tstf
90%
10%
Reflector
Plate
Relative collector current (%)
Distance between sensor and Al evaporation glass d (mm)
012 45
80
100
40
60
20
0
3
IF=4mA
VCE=2V
Ta=25˚C
Relative collector current (%)
Card moving distance L (mm)
−1
20
40
60
80
100
210 34567
IF=4mA
VCE=2V
d=1mm
Ta=25˚C
0
Response time tr, tf, td, ts (μs)
Load resistance RL (KΩ)
0.1
10
1
100
1 000
110010 1 000 10 000
VCE=2V
IC=10mA
Ta=25˚C tr
tf
td
ts
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Sheet No.: D3-A02301EN
GP2L24J0000F
Fig.13
Detecting Position Characteristics (2)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Fig.14
Test Condition for Distance & Detecting
Position Characteristics
Fig.15 Frequency Response Fig.16 Spectral Sensitivity (Detecting side)
Relative collector current (%)
Card moving distance L (mm)
65432
100
80
60
40
20
1−1−2
00
IF=4mA
VCE=2V
d=1mm
Ta=25˚C
Correspond to Fig.11
Al evaporation glass
d
Correspond to Fig.12
OMS card
L=0
d
−
White
1mm
Test condition
d=1mm
+
+
d=1mm
Test condition
1mm
White
−
d
L=0
OMS card
Correspond to Fig.13
Black Black
IF=4mA
VCE=2V
IF=4mA
VCE=2V
−20
−15
−10
−5
0
100Ω
5
10Ω
IF=10mA
VCE=2V
Ta=25˚C
RL=1kΩ
102103104105106
Frequency f (kHz)
Voltage gain Av (dB)
600
80
100
40
60
20
0
1 2001 1001 000900800700
yt
i
v
it
i
s
n
es
ev
i
t
al
e
R(%)
Wavelength λ (nm)
Ta=25˚C
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Sheet No.: D3-A02301EN
GP2L24J0000F
■Design Considerations
●Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) Distance characteristic
Please refer to Fig.11 (Relative collector current vs. Distance) to set the distance of the photointerrupter
and the object.
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In general, the emission of the IRED used in photointerrupter will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
●Parts
This product is assembled using the below parts.
• Photodetector (qty. : 1)
Category Material Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm) Response time (μs)
Phototransister Silicon (Si) 800 700 to 1 200 80
• Photo emitter (qty. : 1)
Category Material Maximum light emitting
wavelength (nm) I/O Frequency (MHz)
Infrared emitting diode
(non-coherent) Gallium arsenide (GaAs) 950 0.3
• Material
Case Lead frame Lead frame plating
Black polyphenylene 42Alloy SnCu plating
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Sheet No.: D3-A02301EN
GP2L24J0000F
■Manufacturing Guidelines
●Soldering Method
Flow Soldering:
Soldering should be completed below 260˚C and within 5 s.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by refl ow.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
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Sheet No.: D3-A02301EN
GP2L24J0000F
■Package specifi cation
●Sleeve package
Package materials
Sleeve : Polystyrene
Stopper : Styrene-Butadiene
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
MAX. 40 sleeves in one case.
Color of sleeve
Rank classifi cation is distinguished by the color of the sleeve as shown in the table below.
But the ratio of each rank can not be guaranteed.
Rank Color of sleeve
A Yellow
B Transparent
C Green
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Sheet No.: D3-A02301EN
GP2L24J0000F
■Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifi cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specifi ed in the relevant specifi cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Offi ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffi c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[H148]
