4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm ILCX19 Series
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/20/12_C Specifications subject to change without notice
Page 1
1
43
2
0.45
+/-0.1
1.6
+/-0.1
Dimension Units: mm
Connection diagram
Recommended pad layout
1.05
1.25
0.75
0.85
+/-0.1
2.0
43
2
1
3
2
1
4
Product Features: Applications:
Low Cost SMD Package Fibre Channel
Ultra Miniature Package Server & Storage
Compatible with Leadfree Processing Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
* Not available at all frequencies. ** Not available for all temperature ranges.
Frequency 24 MHz to 60 MHz
ESR (Equivalent Series Resistance)
16.0 MHz – 23.9 MHz
24.0 MHz – 25.9 MHz
26.0 MHz – 39.9 MHz
40.0 MHz – 60.0 MHz
150 Max.
80 Max.
60 Max.
60 Max.
Shunt Capacitance (C0) 3 pF Max.
Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for more options)
Frequency Stability over
Temperature 50 ppm Standard (see Part Number Guide for more options)
Crystal Cut AT Cut
Load Capacitance 18 pF Standard
Drive Level 100 µW Max.
Aging 5 ppm Max. / Year Standard
Temperature
Operating 0 C to +70 C Standard (see Part Number Guide for more
options)
Storage -40 C to +85 C Standard
Part Number Guide Sample Part Number: ILCX19 - FB1F18 - 20.000
Package Tolerance
(ppm) at Roo m
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range Mode
(overtone) Load Capacitance
(pF) Frequency
ILCX19 -
B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C
F = Fundamental 18 pF Standard
Or Specify - 20.000 MHz
F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C
G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C
H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C
I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C
J = ±10 ppm* J = ±10 ppm** 9 = -10°C to +50°C
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm ILCX19 Series
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/20/12_C Specifications subject to change without notice
Page 2
Pb Free Solder Reflow Profile: Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Environmental Specifications
Thermal Shock MIL-STD-883, Method 1011, Condition A
Moisture Resistance MIL-STD-883, Method 1004
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Mechanical Vibration MIL-STD-883, Method 2007, Condition A
Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Hazardous Substance Pb-Free / RoHS / Green Compliant
Solderability JESD22-B102-D Method 2 (Preconditioning E)
Terminal Strength MIL-STD-883, Method 2004, Test Condition D
Gross Leak MIL-STD-883, Method 1014, Condition C
Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
Solvent Resistance MIL-STD-202, Method 215
Marking
Line 1: I, Date Code (yww)
Quantity per
Reel 3000
A 8 +/-.3
B 4 +/-.2
C 3.5 +/-.2
D 9 +/-1 or 12 +/-3
E 60 / 80
F 180
