4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm Product Features: ILCX19 Series Applications: Low Cost SMD Package Ultra Miniature Package Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 2.0 +/-0.1 4 3 1 2 1.6 +/-0.1 Frequency 24 MHz to 60 MHz 0.45 +/-0.1 ESR (Equivalent Series Resistance) 150 Max. 80 Max. 60 Max. 60 Max. 16.0 MHz - 23.9 MHz 24.0 MHz - 25.9 MHz 26.0 MHz - 39.9 MHz 40.0 MHz - 60.0 MHz Shunt Capacitance (C0) 3 pF Max. Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature 50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard Drive Level 100 W Max. Aging 5 ppm Max. / Year Standard 1 2 4 3 Connection diagram 4 3 1 2 Recommended pad layout 0.85 0.75 Temperature 1.05 Operating 0 C to +70 C Standard (see Part Number Guide for more options) Storage -40 C to +85 C Standard 1.25 Part Number Guide Package ILCX19 - Sample Part Number: Dimension Units: mm ILCX19 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range B = 50 ppm B = 50 ppm 0 = 0C to +50C F = 30 ppm F = 30 ppm 1 = 0C to +70C G = 25 ppm G = 25 ppm 2 = -10C to +60C H = 20 ppm H = 20 ppm 3 = -20C to +70C I = 15 ppm I = 15 ppm** 5 = -40C to +85C J = 10 ppm* J = 10 ppm** 9 = -10C to +50C Mode (overtone) F = Fundamental Load Capacitance (pF) 18 pF Standard Or Specify * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 * Fax: 775-851-8882* e-mail: e-mail@ilsiamerica.com * www.ilsiamerica.com 12/20/12_C Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm Pb Free Solder Reflow Profile: ILCX19 Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 3000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I, Date Code (yww) ILSI America Phone: 775-851-8880 * Fax: 775-851-8882* e-mail: e-mail@ilsiamerica.com * www.ilsiamerica.com 12/20/12_C Specifications subject to change without notice Page 2