SN74LVC1G3157
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
SCES424A – JANUARY 2003 - REVISED MAY 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
1.65-V to 5.5-V VCC Operation
D
Useful for Both Analog and Digital
Applications
D
Specified Break-Before-Make Switching
D
Rail-to-Rail Signal Handling
D
High Degree of Linearity
D
High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
D
Low On-State Resistance, Typically ≈6 Ω
(VCC = 4.5 V)
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes
of up to VCC (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING‡
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
p
SN74LVC1G3157YEPR
–40°C to 85°CNanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G3157YZPR _ _ _
_
SOT (SOT-23) – DBV Tape and reel SN74LVC1G3157DBVR CC5_
SOT (SC-70) – DCK Tape and reel SN74LVC1G3157DCKR C5_
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site.
FUNCTION TABLE
CONTROL
ON
SCHANNEL
L B1
H B2
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
B2
GND
B1
S
VCC
A
3
2
1
4
5
6
B1
GND
B2
A
VCC
S
YEP OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.