MSP430 Hardware Tools User's Guide Literature Number: SLAU278V May 2009 - Revised May 2015 Contents Preface ........................................................................................................................................ 9 1 Get Started Now! ................................................................................................................ 13 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.15 1.16 1.17 1.18 1.19 1.20 2 Hardware FAQs ............................................................................................................ 32 Known Issues ............................................................................................................... 34 Hardware ........................................................................................................................... 36 B.1 B.2 B.3 B.4 B.5 B.6 B.7 B.8 B.9 B.10 B.11 B.12 B.13 B.14 2 Signal Connections for In-System Programming and Debugging ................................................... 25 External Power ............................................................................................................. 29 Bootstrap Loader (BSL) ................................................................................................... 29 Frequently Asked Questions and Known Issues .................................................................... 31 A.1 A.2 B 14 15 15 15 15 15 15 16 16 16 16 17 17 19 19 20 20 20 21 22 Design Considerations for In-Circuit Programming ................................................................ 24 2.1 2.2 2.3 A Flash Emulation Tool (FET) Overview................................................................................... Kit Contents, MSP-FET430PIF ........................................................................................... Kit Contents, eZ430-F2013 ............................................................................................... Kit Contents, eZ430-T2012 ............................................................................................... Kit Contents, eZ430-RF2500 ............................................................................................. Kit Contents, eZ430-RF2500T ............................................................................................ Kit Contents, eZ430-RF2500-SEH ....................................................................................... Kit Contents, eZ430-Chronos-xxx ........................................................................................ Kit Contents, MSP-FET430UIF ........................................................................................... Kit Contents, MSP-FET .................................................................................................... Kit Contents, MSP-FET430xx ............................................................................................ Kit Contents, FET430F6137RF900 ...................................................................................... Kit Contents, MSP-TS430xx .............................................................................................. Kit Contents, EM430Fx1x7RF900 ....................................................................................... Hardware Installation, MSP-FET430PIF ................................................................................ Hardware Installation, MSP-FET430UIF ................................................................................ Hardware Installation, MSP-FET ......................................................................................... Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 .......... Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ....... Important MSP430 Documents on the Web ............................................................................ MSP-TS430D8 .............................................................................................................. MSP-TS430PW14 .......................................................................................................... MSP-TS430L092 ........................................................................................................... MSP-TS430L092 Active Cable ........................................................................................... MSP-TS430PW24 .......................................................................................................... MSP-TS430DW28.......................................................................................................... MSP-TS430PW28 .......................................................................................................... MSP-TS430PW28A ........................................................................................................ MSP-TS430RHB32A....................................................................................................... MSP-TS430DA38 .......................................................................................................... MSP-TS430QFN23x0...................................................................................................... MSP-TS430RSB40......................................................................................................... MSP-TS430RHA40A....................................................................................................... MSP-TS430DL48 ........................................................................................................... Contents 38 41 44 47 50 53 56 59 62 65 68 71 74 77 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated www.ti.com B.15 B.16 B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 B.30 B.31 B.32 B.33 B.34 B.35 B.36 B.37 B.38 B.39 B.40 B.41 C MSP-TS430RGZ48B....................................................................................................... 80 MSP-TS430RGZ48C ...................................................................................................... 83 MSP-TS430PM64 .......................................................................................................... 86 MSP-TS430PM64A ........................................................................................................ 89 MSP-TS430PM64D ........................................................................................................ 92 MSP-TS430PM64F ........................................................................................................ 95 MSP-TS430RGC64B ...................................................................................................... 98 MSP-TS430RGC64C ..................................................................................................... 101 MSP-TS430RGC64USB ................................................................................................. 105 MSP-TS430PN80 ......................................................................................................... 109 MSP-TS430PN80A ....................................................................................................... 112 MSP-TS430PN80USB ................................................................................................... 115 MSP-TS430PZ100 ........................................................................................................ 119 MSP-TS430PZ100A ...................................................................................................... 122 MSP-TS430PZ100B ...................................................................................................... 125 MSP-TS430PZ100C ...................................................................................................... 128 MSP-TS430PZ100D ...................................................................................................... 131 MSP-TS430PZ5x100 ..................................................................................................... 134 MSP-TS430PZ100USB .................................................................................................. 137 MSP-TS430PZ100AUSB ................................................................................................ 141 MSP-TS430PEU128...................................................................................................... 145 EM430F5137RF900 ...................................................................................................... 148 EM430F6137RF900 ...................................................................................................... 152 EM430F6147RF900 ...................................................................................................... 156 MSP-FET .................................................................................................................. 160 B.39.1 Features ......................................................................................................... 160 B.39.2 Release Notes .................................................................................................. 160 B.39.3 Schematics ...................................................................................................... 163 B.39.4 Layout ............................................................................................................ 168 B.39.5 LED Signals ..................................................................................................... 168 B.39.6 JTAG Target Connector ....................................................................................... 169 B.39.7 Specifications ................................................................................................... 171 B.39.8 MSP-FET Revision History .................................................................................... 171 MSP-FET430PIF .......................................................................................................... 172 MSP-FET430UIF.......................................................................................................... 174 B.41.1 MSP-FET430UIF Revision History ........................................................................... 179 Hardware Installation Guide ............................................................................................... 181 C.1 Hardware Installation ..................................................................................................... 182 Revision History ........................................................................................................................ 188 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Contents Copyright (c) 2009-2015, Texas Instruments Incorporated 3 www.ti.com List of Figures 2-1. Signal Connections for 4-Wire JTAG Communication................................................................. 26 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx, and MSP430F4xx Devices .............................................................................. 27 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices ..................................................................................................... 28 B-1. MSP-TS430D8 Target Socket Module, Schematic .................................................................... 38 B-2. MSP-TS430D8 Target Socket Module, PCB ........................................................................... 39 B-3. MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 41 B-4. MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 42 B-5. MSP-TS430L092 Target Socket Module, Schematic .................................................................. 44 B-6. MSP-TS430L092 Target Socket Module, PCB ......................................................................... 45 B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 47 B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB ......................................................... 48 B-9. MSP-TS430PW24 Target Socket Module, Schematic ................................................................ 50 B-10. MSP-TS430PW24 Target Socket Module, PCB ....................................................................... 51 B-11. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 53 B-12. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 54 B-13. MSP-TS430PW28 Target Socket Module, Schematic ................................................................ 56 B-14. MSP-TS430PW28 Target Socket Module, PCB ....................................................................... 57 B-15. MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 59 B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) .............................................................. 60 B-17. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 62 B-18. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 63 B-19. MSP-TS430DA38 Target Socket Module, Schematic ................................................................. 65 B-20. MSP-TS430DA38 Target Socket Module, PCB ........................................................................ 66 B-21. MSP-TS430QFN23x0 Target Socket Module, Schematic ............................................................ 68 B-22. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 69 B-23. MSP-TS430RSB40 Target Socket Module, Schematic ............................................................... 71 B-24. MSP-TS430RSB40 Target Socket Module, PCB ...................................................................... 72 B-25. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 74 B-26. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 75 B-27. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 77 B-28. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 78 B-29. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 80 B-30. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 81 B-31. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................. 83 B-32. MSP-TS430RGZ48C Target Socket Module, PCB .................................................................... 84 B-33. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 86 B-34. MSP-TS430PM64 Target Socket Module, PCB ........................................................................ 87 B-35. MSP-TS430PM64A Target Socket Module, Schematic ............................................................... 89 B-36. MSP-TS430PM64A Target Socket Module, PCB ...................................................................... 90 B-37. MSP-TS430PM64D Target Socket Module, Schematic ............................................................... 92 B-38. MSP-TS430PM64D Target Socket Module, PCB ...................................................................... 93 B-39. MSP-TS430PM64F Target Socket Module, Schematic ............................................................... 95 B-40. MSP-TS430PM64F Target Socket Module, PCB ...................................................................... 96 B-41. MSP-TS430RGC64B Target Socket Module, Schematic ............................................................. 98 B-42. MSP-TS430RGC64B Target Socket Module, PCB .................................................................... 99 B-43. MSP-TS430RGC64C Target Socket Module, Schematic ........................................................... 102 4 List of Figures SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated www.ti.com B-44. MSP-TS430RGC64C Target Socket Module, PCB .................................................................. 103 B-45. MSP-TS430RGC64USB Target Socket Module, Schematic........................................................ 105 B-46. MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... 106 ............................................................... MSP-TS430PN80 Target Socket Module, PCB ...................................................................... MSP-TS430PN80A Target Socket Module, Schematic.............................................................. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... MSP-TS430PN80USB Target Socket Module, PCB ................................................................. MSP-TS430PZ100 Target Socket Module, Schematic .............................................................. MSP-TS430PZ100 Target Socket Module, PCB ..................................................................... MSP-TS430PZ100A Target Socket Module, Schematic ............................................................ MSP-TS430PZ100A Target Socket Module, PCB ................................................................... MSP-TS430PZ100B Target Socket Module, Schematic ............................................................ MSP-TS430PZ100B Target Socket Module, PCB ................................................................... MSP-TS430PZ100C Target Socket Module, Schematic ............................................................ MSP-TS430PZ100C Target Socket Module, PCB ................................................................... MSP-TS430PZ100D Target Socket Module, Schematic ............................................................ MSP-TS430PZ100D Target Socket Module, PCB ................................................................... MSP-TS430PZ5x100 Target Socket Module, Schematic ........................................................... MSP-TS430PZ5x100 Target Socket Module, PCB .................................................................. MSP-TS430PZ100USB Target Socket Module, Schematic ......................................................... MSP-TS430PZ100USB Target Socket Module, PCB ................................................................ MSP-TS430PZ100AUSB Target Socket Module, Schematic ....................................................... MSP-TS430PZ100AUSB Target Socket Module, PCB .............................................................. MSP-TS430PEU128 Target Socket Module, Schematic ............................................................ MSP-TS430PEU128 Target Socket Module, PCB ................................................................... EM430F5137RF900 Target Board, Schematic ....................................................................... EM430F5137RF900 Target board, PCB............................................................................... EM430F6137RF900 Target Board, Schematic ....................................................................... EM430F6137RF900 Target Board, PCB .............................................................................. EM430F6147RF900 Target Board, Schematic ....................................................................... EM430F6147RF900 Target Board, PCB .............................................................................. MSP-FET Top View ...................................................................................................... MSP-FET Bottom View .................................................................................................. MSP-FET USB Debugger, Schematic (1 of 5) ........................................................................ MSP-FET USB Debugger, Schematic (2 of 5) ........................................................................ MSP-FET USB Debugger, Schematic (3 of 5) ........................................................................ MSP-FET USB Debugger, Schematic (4 of 5) ........................................................................ MSP-FET USB Debugger, Schematic (5 of 5) ........................................................................ MSP-FET USB Debugger, PCB (Top) ................................................................................. MSP-FET USB Debugger, PCB (Bottom) ............................................................................. JTAG Connector Pinout .................................................................................................. Pin States After Power-Up ............................................................................................... MSP-FET430PIF FET Interface Module, Schematic ................................................................. MSP-FET430PIF FET Interface Module, PCB ........................................................................ MSP-FET430UIF USB Interface, Schematic (1 of 4) ................................................................ MSP-FET430UIF USB Interface, Schematic (2 of 4) ................................................................ MSP-FET430UIF USB Interface, Schematic (3 of 4) ................................................................ B-47. MSP-TS430PN80 Target Socket Module, Schematic B-48. B-49. B-50. B-51. B-52. B-53. B-54. B-55. B-56. B-57. B-58. B-59. B-60. B-61. B-62. B-63. B-64. B-65. B-66. B-67. B-68. B-69. B-70. B-71. B-72. B-73. B-74. B-75. B-76. B-77. B-78. B-79. B-80. B-81. B-82. B-83. B-84. B-85. B-86. B-87. B-88. B-89. B-90. B-91. B-92. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback List of Figures Copyright (c) 2009-2015, Texas Instruments Incorporated 109 110 112 113 115 116 119 120 122 123 125 126 128 129 131 132 134 135 137 138 141 142 145 146 148 149 152 153 156 157 161 161 163 164 165 166 167 168 168 169 170 172 173 174 175 176 5 www.ti.com B-93. MSP-FET430UIF USB Interface, Schematic (4 of 4) ................................................................ 177 B-94. MSP-FET430UIF USB Interface, PCB ................................................................................. 178 6 C-1. Windows XP Hardware Wizard ......................................................................................... 182 C-2. Windows XP Driver Location Selection Folder........................................................................ 183 C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 ..................................... 185 C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 .................................... 186 List of Figures ................................... 184 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated www.ti.com List of Tables 1-1. Flash Emulation Tool (FET) Features and Device Compatibility..................................................... 14 1-2. Individual Kit Contents, MSP-TS430xx .................................................................................. 17 B-1. MSP-TS430D8 Bill of Materials B-2. MSP-TS430PW14 Bill of Materials....................................................................................... 43 B-3. MSP-TS430L092 Bill of Materials ........................................................................................ 46 B-4. MSP-TS430L092 JP1 Settings ........................................................................................... 48 B-5. MSP-TS430L092 Active Cable Bill of Materials ........................................................................ 49 B-6. MSP-TS430PW24 Bill of Materials....................................................................................... 52 B-7. MSP-TS430DW28 Bill of Materials B-8. MSP-TS430PW28 Bill of Materials B-9. B-10. B-11. B-12. B-13. B-14. B-15. B-16. B-17. B-18. B-19. B-20. B-21. B-22. B-23. B-24. B-25. B-26. B-27. B-28. B-29. B-30. B-31. B-32. B-33. B-34. B-35. B-36. B-37. B-38. B-39. B-40. B-41. B-42. B-43. B-44. B-45. .......................................................................................... 40 ...................................................................................... 55 ...................................................................................... 58 MSP-TS430PW28A Bill of Materials ..................................................................................... 61 MSP-TS430RHB32A Bill of Materials ................................................................................... 64 MSP-TS430DA38 Bill of Materials ....................................................................................... 67 MSP-TS430QFN23x0 Bill of Materials .................................................................................. 70 MSP-TS430RSB40 Bill of Materials ..................................................................................... 73 MSP-TS430RHA40A Bill of Materials ................................................................................... 76 MSP-TS430DL48 Bill of Materials ....................................................................................... 79 MSP-TS430RGZ48B Bill of Materials ................................................................................... 82 MSP-TS430RGZ48C Bill of Materials ................................................................................... 85 MSP-TS430PM64 Bill of Materials ....................................................................................... 88 MSP-TS430PM64A Bill of Materials ..................................................................................... 91 MSP-TS430PM64D Bill of Materials ..................................................................................... 94 MSP-TS430PM64F Bill of Materials (BOM) ............................................................................ 97 MSP-TS430RGC64B Bill of Materials.................................................................................. 100 MSP-TS430RGC64C Bill of Materials ................................................................................. 104 MSP-TS430RGC64USB Bill of Materials .............................................................................. 107 MSP-TS430PN80 Bill of Materials ...................................................................................... 111 MSP-TS430PN80A Bill of Materials .................................................................................... 114 MSP-TS430PN80USB Bill of Materials ................................................................................ 117 MSP-TS430PZ100 Bill of Materials .................................................................................... 121 MSP-TS430PZ100A Bill of Materials ................................................................................... 124 MSP-TS430PZ100B Bill of Materials ................................................................................... 127 MSP-TS430PZ100C Bill of Materials .................................................................................. 130 MSP-TS430PZ100D Bill of Materials .................................................................................. 133 MSP-TS430PZ5x100 Bill of Materials.................................................................................. 136 MSP-TS430PZ100USB Bill of Materials ............................................................................... 139 MSP-TS430PZ100AUSB Bill of Materials ............................................................................. 143 MSP-TS430PEU128 Bill of Materials .................................................................................. 147 EM430F5137RF900 Bill of Materials ................................................................................... 150 EM430F6137RF900 Bill of Materials ................................................................................... 154 EM430F6147RF900 Bill of Materials ................................................................................... 158 UART Backchannel Implementation ................................................................................... 160 UART Backchannel Activation Commands............................................................................ 161 MSP Target BSL Activation Commands ............................................................................... 162 MSP-FET LED Signals ................................................................................................... 168 JTAG Connector Pin State by Operating Mode ...................................................................... 169 Specifications .............................................................................................................. 171 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback List of Tables Copyright (c) 2009-2015, Texas Instruments Incorporated 7 www.ti.com B-46. MSP-FET Revision History .............................................................................................. 171 C-1. 8 USB VIDs and PIDs Used in MSP430 Tools.......................................................................... 182 List of Tables SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Preface SLAU278V - May 2009 - Revised May 2015 Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430TM ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described. How to Use This Manual Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, provides instructions on installing the hardware and according software drivers. After you see how quick and easy it is to use the development tools, TI recommends that you read all of this manual. This manual describes the setup and operation of the FET but does not fully describe the MSP430TM microcontrollers or the development software systems. For details of these items, see the appropriate TI documents listed in Section 1.20. This manual applies to the following tools (and devices): * MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices) * MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices) * MSP-FET (successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430 devices) * eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices) * eZ430-T2012 (three MSP430F2012 based target boards) * eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices) * eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack) * eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target and solar energy harvesting module) * eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system contained in a watch. Includes <1 GHz RF USB access point) Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx. Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective target socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain also the USB debug interface (MSP-FET430UIF): * * FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB) FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green PCB) These tools contain the most up-to-date materials available at the time of packaging. For the latest materials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430 web site at www.ti.com/msp430 or contact your local TI sales office. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Read This First Copyright (c) 2009-2015, Texas Instruments Incorporated 9 Information About Cautions and Warnings www.ti.com Information About Cautions and Warnings This document may contain cautions and warnings. CAUTION This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment. WARNING This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection. Read each caution and warning carefully. Related Documentation From Texas Instruments MSP430 development tools documentation: Code Composer Studio for MSP430 User's Guide (literature number SLAU157) Code Composer Studio v5.x Core Edition (CCS Mediawiki) IAR Embedded Workbench for MSP430(tm) User's Guide (literature number SLAU138) IAR Embedded Workbench KickStart installer (literature number SLAC050) eZ430-F2013 Development Tool User's Guide (literature number SLAU176) eZ430-RF2480 Demonstration Kit User's Guide (literature number SWRU151) eZ430-RF2500 Development Tool User's Guide (literature number SLAU227) eZ430-RF2500-SEH Development Tool User's Guide (literature number SLAU273) eZ430-Chronos Development Tool User's Guide (literature number SLAU292) Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (literature number SLAU371) MSP-EXP430F5529 Experimenter Board User's Guide (literature number SLAU330) MSP-EXP430F5438 Experimenter Board User's Guide (literature number SLAU263) MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (literature number SLAU318) MSP Gang Programmer (MSP-GANG) User's Guide (literature number SLAU358) MSP430 Gang Programmer (MSP-GANG430) User's Guide (literature number SLAU101) MSP430 device user's guides: MSP430x1xx Family User's Guide (literature number SLAU049) MSP430x2xx Family User's Guide (literature number SLAU144) MSP430x3xx Family User's Guide (literature number SLAU012) MSP430x4xx Family User's Guide (literature number SLAU056) MSP430x5xx and MSP430x6xx Family User's Guide (literature number SLAU208) CC430 Family User's Guide (literature number SLAU259) 10 Read This First SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated If You Need Assistance www.ti.com MSP430FR57xx Family User's Guide (literature number SLAU272) MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367) If You Need Assistance Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provide open interaction with peer engineers, TI engineers, and other experts. Additional device-specific information can be found on the MSP430 web site. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Read This First Copyright (c) 2009-2015, Texas Instruments Incorporated 11 If You Need Assistance 12 www.ti.com Read This First SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Chapter 1 SLAU278V - May 2009 - Revised May 2015 Get Started Now! This chapter lists the contents of the FET and provides instruction on installing the hardware. Topic 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.15 1.16 1.17 1.18 1.19 1.20 ........................................................................................................................... Flash Emulation Tool (FET) Overview ................................................................... Kit Contents, MSP-FET430PIF .............................................................................. Kit Contents, eZ430-F2013 ................................................................................... Kit Contents, eZ430-T2012 ................................................................................... Kit Contents, eZ430-RF2500 ................................................................................ Kit Contents, eZ430-RF2500T ............................................................................... Kit Contents, eZ430-RF2500-SEH ......................................................................... Kit Contents, eZ430-Chronos-xxx ......................................................................... Kit Contents, MSP-FET430UIF .............................................................................. Kit Contents, MSP-FET ....................................................................................... Kit Contents, MSP-FET430xx .............................................................................. Kit Contents, FET430F6137RF900 ........................................................................ Kit Contents, MSP-TS430xx ................................................................................. Kit Contents, EM430Fx1x7RF900 .......................................................................... Hardware Installation, MSP-FET430PIF ................................................................. Hardware Installation, MSP-FET430UIF ................................................................. Hardware Installation, MSP-FET ........................................................................... Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529 ..................................................................................................... Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ............................................................................................. Important MSP430 Documents on the Web............................................................ SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Get Started Now! Copyright (c) 2009-2015, Texas Instruments Incorporated Page 14 15 15 15 15 15 15 16 16 16 16 17 17 19 19 20 20 20 21 22 13 Flash Emulation Tool (FET) Overview 1.1 www.ti.com Flash Emulation Tool (FET) Overview TI offers several flash emulation tools according to different requirements. Supports only F20xx, G2x01, G2x11, G2x21, G2x31 Supports MSP430F20xx, F21x2, F22xx, G2x01, G2x11, G2x21, G2x31, G2x53 Supports MSP430F20xx, F21x2, F22xx, G2x01, G2x11, G2x21, G2x31 Supports F5438, F5438A Supports BT5190, F5438A Supports only F552x Supports FR57xx, F5638, F6638 Supports only CC430F613x Allows fuse blow Adjustable target supply voltage 4-wire JTAG 2-wire JTAG (2) Application UART Supported by CCS for Windows Supported by CCS for Linux Supported by IAR (1) (2) 14 Fixed 2.8-V target supply voltage Fixed 3.6-V target supply voltage MSP-EXP430F5529 MSP-EXP430FR5739 MSP-FET LaunchPad (MSP-EXP430G2) MSP-FET430UIF Supports all programmable MSP430 and CC430 devices (F1xx, F2xx, F4xx, F5xx, F6xx, G2xx, L092, FR57xx, FR59xx, MSP430TCH5E) MSP-FET430PIF eZ430-Chronos MSP-WDSxx Metawatch eZ430-RF2560 eZ430-RF2480 eZ430-RF2500 eZ430-F2013 Table 1-1. Flash Emulation Tool (FET) Features and Device Compatibility (1) The MSP-FET430PIF is for legacy device support only. This emulation tool will not support any new devices released after 2011. The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface. Get Started Now! SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Kit Contents, MSP-FET430PIF www.ti.com 1.2 Kit Contents, MSP-FET430PIF * * * * One One One One READ ME FIRST document MSP-FET430PIF interface module 25-conductor cable 14-conductor cable NOTE: This part is obsolete and is not recommended to use in new design. 1.3 Kit Contents, eZ430-F2013 * * 1.4 Kit Contents, eZ430-T2012 * 1.5 One One One One One QUICK START GUIDE document eZ430-RF2500 CD-ROM eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board eZ430-RF2500T target board AAA battery pack with expansion board (batteries included) Kit Contents, eZ430-RF2500T * * 1.7 Three MSP430F2012-based target boards Kit Contents, eZ430-RF2500 * * * * * 1.6 One QUICK START GUIDE document One eZ430-F2013 development tool including one MSP430F2013 target board One eZ430-RF2500T target board One AAA battery pack with expansion board (batteries included) Kit Contents, eZ430-RF2500-SEH * * * * * One MSP430 development tool CD containing documentation and development software One eZ430-RF USB debugging interface Two eZ430-RF2500T wireless target boards One SEH-01 solar energy harvester board One AAA battery pack with expansion board (batteries included) SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Get Started Now! Copyright (c) 2009-2015, Texas Instruments Incorporated 15 Kit Contents, eZ430-Chronos-xxx 1.8 www.ti.com Kit Contents, eZ430-Chronos-xxx '433, '868, '915 * One QUICK START GUIDE document * One ez430-Chronos emulator * One screwdriver * Two spare screws eZ430-Chronos-433: - One 433-MHz eZ430-Chronos watch (battery included) - One 433-MHz eZ430-Chronos access point eZ430-Chronos-868: - One 868-MHz eZ430-Chronos watch (battery included) - One 868-MHz eZ430-Chronos access point eZ430-Chronos-915: - One 915-MHz eZ430-Chronos watch (battery included) - One 915-MHz eZ430-Chronos access point 1.9 Kit Contents, MSP-FET430UIF * * * * One One One One READ ME FIRST document MSP-FET430UIF interface module USB cable 14-conductor cable 1.10 Kit Contents, MSP-FET * * * * One One One One READ ME FIRST document MSP-FET interface module USB cable 14-conductor cable 1.11 Kit Contents, MSP-FET430xx * * * * * * * * One READ ME FIRST document One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the case, and a 2x7-pin male connector on the other end of the case. One USB cable One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz. A 2x7-pin male JTAG connector is also present on the PCB (see different setup for L092) One 14-Pin JTAG conductor cable One small box containing two MSP430 device samples (See table for Sample Type) One target socket module. To determine the devices used for each board and a summary of the board, see Table 1-2. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx kit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board. Refer to the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi. 16 Get Started Now! SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Kit Contents, FET430F6137RF900 www.ti.com 1.12 Kit Contents, FET430F6137RF900 * * * * * * * * * * * One READ ME FIRST document One legal notice One MSP-FET430UIF interface module Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2x7-pin male connector is also present on the PCB. Two CC430EM battery packs Four AAA batteries Two 868-MHz or 915-MHz antennas Two 32.768-kHz crystals 18 PCB 2x4-pin headers One USB cable One 14-pin JTAG conductor cable 1.13 Kit Contents, MSP-TS430xx * * * * * One READ ME FIRST document One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24) One target socket module A 2x7-pin male JTAG connector is also present on the PCB (see different setup for L092) MSP430 device samples (see Table 1-2 for sample type) Table 1-2. Individual Kit Contents, MSP-TS430xx Part Number Socket Type Supported Devices Included Devices MSP-TS430D8 (green PCB) 8-pin D (TSSOP ZIF) MSP430G2210, MSP430G2230 1 x MSP430G2210ID and 1 x MSP430G2230ID Two PCB 1x4-pin headers (two male and two female) Headers and Comment MSP-TS430PW14 (green PCB) 14-pin PW (TSSOP ZIF) MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, MSP430G2x31 2 x MSP430F2013IPW Four PCB 1x7-pin headers (two male and two female) MSP-TS430L092 (green PCB) 14-pin PW (TSSOP ZIF) MSP-TS430L092 2 x MSP430L092IPW Four PCB 1x7-pin headers (two male and two female). A "MicroMaTch" 10-pin female connector is also present on the PCB which connects the kit with an 'Active Cable' PCB; this 'Active Cable' PCB is connected by 14-pin JTAG cable with the FET430UIF MSP-TS430PW24 (green PCB) 24-pin PW (TSSOP ZIF) MSP430AFE2xx 2 x MSP430AFE253IPW Four PCB 1x12-pin headers (two male and two female) MSP-TS430DW28 (green PCB) 28-pin DW (SSOP ZIF) MSP430F11x1, MSP430F11x2, MSP430F12x, MSP430F12x2, MSP430F21xx Supports devices in 20- and 28-pin DA packages 2 x MSP430F123IDW Four PCB 1x12-pin headers (two male and two female) MSP-TS430PW28 (green PCB) 28-pin PW (TSSOP ZIF) MSP430F11x1, MSP430F11x2, MSP430F12x, MSP430F12x2, MSP430F21xx 2 x MSP430F2132IPW Four PCB 1x12-pin headers (two male and two female) MSP-TS430PW28A (red PCB) 28-pin PW (TSSOP ZIF) MSP430F20xx, MSP430G2xxx in 14-, 20-, and 28-pin PW packages, MSP430TCH5E in PW package 2 x MSP430G2452IPW20 Four PCB 1x12-pin headers (two male and two female) MSP-TS430RHB32A (red PCB) 32-pin RHB (QFN ZIF) MSP430i204x 2 x MSP430i2041TRHB Eight PCB 1x8-pin headers (four male and four female) MSP-TS430DA38 (green PCB) 38-pin DA (TSSOP ZIF) MSP430F22xx, MSP430G2x44, MSP430G2x55 2 x MSP430F2274IDA 2 x MSP430G2744IDA 2 x MSP430G2955IDA Four PCB 1x19-pin headers (two male and two female) MSP-TS430QFN23x0 (green PCB) 40-pin RHA (QFN ZIF) MSP430F23x0 2 x MSP430F2370IRHA Eight PCB 1x10-pin headers (four male and four female) MSP-TS430RSB40 (green PCB) 40-pin RSB (QFN ZIF) MSP430F51x1, MSP430F51x2 2 x MSP430F5172IRSB Eight PCB 1x10-pin headers (four male and four female) SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Get Started Now! Copyright (c) 2009-2015, Texas Instruments Incorporated 17 Kit Contents, MSP-TS430xx www.ti.com Table 1-2. Individual Kit Contents, MSP-TS430xx (continued) Part Number Socket Type MSP-TS430RHA40A (red PCB) 40-pin RHA (QFN ZIF) Supported Devices MSP430FR572x, MSP430FR573x MSP-TS430DL48 (green PCB) 48-pin DL (TSSOP ZIF) MSP-TS430RGZ48B (blue PCB) MSP-TS430RGZ48C (black PCB) Included Devices Headers and Comment 2 x MSP430FR5739IRHA Eight PCB 1x10-pin headers (four male and four female) MSP430F42x0 2 x MSP430F4270IDL Four PCB 2x12-pin headers (two male and two female) 48-pin RGZ (QFN ZIF) MSP430F534x 2 x MSP430F5342IRGZ Eight PCB 1x12-pin headers (four male and four female) 48-pin RGZ (QFN ZIF) MSP430FR58xx and MSP430FR59xx 2 x MSP430FR5969IRGZ Eight PCB 1x12-pin headers (four male and four female) MSP-TS430PM64 (green PCB) 64-pin PM (QFP ZIF) MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x, MSP430F16x1, MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x, MSP430F42xA, MSP430FE42x, MSP430FE42xA, MSP430FE42x2, MSP430FW42x TS Kit: 2 x MSP430F2618IPM; FET Kit: 2 x MSP430F417IPM and 2 x MSP430F169IPM Eight PCB 1x16-pin headers (four male and four female) MSP-TS430PM64A (red PCB) 64-pin PM (QFP ZIF) MSP430F41x2 2 x MSP430F4152IPM Eight PCB 1x16-pin headers (four male and four female) MSP-TS430PM64D (white PCB) 64-pin PM (QFP ZIF) MSP430FR413x, MSP430FR203x 2 x MSP430FR4133IPM Eight PCB 1x16-pin headers (four male and four female) MSP-TS430PM64F (purple PCB) 64-pin PM (QFP ZIF) MSP430FR6972 None. Free samples can be ordered in TI Store. Eight PCB 1x16-pin headers (four male and four female) MSP-TS430RGC64B (blue PCB) 64-pin RGC (QFN ZIF) MSP430F530x 2 x MSP430F5310IRGC Eight PCB 1x16-pin headers (four male and four female) MSP-TS430RGC64C (black PCB) 64-pin RGC (QFN ZIF) MSP430F522x, MSP430F521x, MSP430F523x, MSP430F524x, MSP430F525x 2 x MSP430F5229IRGC Eight PCB 1x16-pin headers (four male and four female) MSP-TS430RGC64USB (green PCB) 64-pin RGC (QFN ZIF) MSP430F550x, MSP430F551x, MSP430F552x 2 x MSP430F5510IRGC or 2 x MSP430F5528IRGC Eight PCB 1x16-pin headers (four male and four female) MSP-TS430PN80 (green PCB) 80-pin PN (QFP ZIF) MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, MSP430FG47x 2 x MSP430FG439IPN Eight PCB 1x20-pin headers (four male and four female) MSP-TS430PN80A (red PCB) 80-pin PN (QFP ZIF) MSP430F532x 2 x MSP430F5329IPN Eight PCB 1x20-pin headers (four male and four female) MSP-TS430PN80USB (green PCB) 80-pin PN (QFP ZIF) MSP430F552x, MSP430F551x 2 x MSP430F5529IPN Eight PCB 1x20-pin headers (four male and four female) MSP-TS430PZ100 (green PCB) 100-pin PZ (QFP ZIF) MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, MSP430F47xx 2 x MSP430FG4619IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ100A (red PCB) 100-pin PZ (QFP ZIF) MSP430F471xx 2 x MSP430F47197IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ100B (blue PCB) 100-pin PZ (QFP ZIF) MSP430F67xx 2 x MSP430F6733IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ100C (black PCB) 100-pin PZ (QFP ZIF) MSP430F645x, MSP430F643x, MSP430F535x, MSP430F533x 2 x MSP430F6438IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ100D (white PCB) 100-pin PZ (QFP ZIF) MSP430FR698x(1), MSP430FR688x(1) 2 x MSP430FR6989IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ5x100 (green PCB) 100-pin PZ (QFP ZIF) MSP430F543x, MSP430BT5190, MSP430SL5438A 2 x MSP430F5438IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ100USB (green PCB) 100-pin PZ (QFP ZIF) MSP430F665x, MSP430F663x, MSP430F563x 2 x MSP430F6638IPZ Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PZ100AUSB (blue PCB) 100-pin PZ (QFP ZIF) MSP430FG662x, MSP430FG642x None. Free samples can be ordered in TI Store. Eight PCB 1x25-pin headers (four male and four female) MSP-TS430PEU128 (green PCB) 128-pin PEU (QFP ZIF) MSP430F677x, MSP430F676x, MSP430F674x, MSP430F677x1, MSP430F676x1, MSP430F674x1 2 x MSP430F67791IPEU Four PCB 1x26-pin headers (two male and two female) and four PCB 1x38-pin headers (two male and two female) See the device data sheets for device specifications. Device errata can be found in the respective device product folder on the web provided as a PDF document. Depending on the device, errata may also be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi. 18 Get Started Now! SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Kit Contents, EM430Fx1x7RF900 www.ti.com 1.14 Kit Contents, EM430Fx1x7RF900 * * * * * * * * One READ ME FIRST document One legal notice Two target socket module MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which is soldered a CC430F5137 device in a 48-pin RGZ package. A 2x7-pin male connector is also present on the PCB MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device in a 64-pin RGC package. A 2x7-pin male connector is also present on the PCB MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which is soldered a CC430F6147 device in a 64-pin RGC package. A 2x7-pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868- or 915-MHz antennas Two 32.768-kHz crystals 18 PCB 2x4-pin headers 1.15 Hardware Installation, MSP-FET430PIF Follow these steps to install the hardware for the MSP-FET430PIF tools: 1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR Embedded Workbench installation. Note that a restart is required after the CCS or IAR Embedded Workbench installation for the driver to become active. 2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Get Started Now! Copyright (c) 2009-2015, Texas Instruments Incorporated 19 Hardware Installation, MSP-FET430UIF www.ti.com 1.16 Hardware Installation, MSP-FET430UIF Follow these steps to install the hardware for the MSP-FET430UIF tool: 1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE installation installs drivers automatically. 2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET should be recognized, as the USB device driver is installed automatically. If the driver has not been installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files. The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version of the tool. The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool. The USB driver is installed automatically. Detailed driver installation instructions can be found in Appendix C. 3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash for approximately two seconds. If the self-test passes successfully, the green LED stays on. 4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an MSP-TS430xxx target socket module. 5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG security fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA. 1.17 Hardware Installation, MSP-FET Follow these steps to install the hardware for the MSP-FET tool: 1. Install the IDE (CCS or IAR) that you plan to use before connecting MSP-FET to PC. During IDE installation, USB drivers are installed automatically. Make sure to use the latest IDE version, otherwise the USB drivers might not be able to recognize the MSP-FET. 2. Connect the MSP-FET to a USB port on the PC with the provided USB cable. 3. The following procedure applies to operation under Windows: (a) After connecting to the PC, the MSP-FET should be recognized automatically, as the USB device driver has been already installed together with the IDE. (b) If the driver has not been installed yet, the Found New Hardware wizard starts. Follow the instructions and point the wizard to the driver files. (c) The default location for CCS is c:\ti\ccsv6\ccs_base\emulation\drivers\msp430\USB_CDC. (d) The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>. 4. After connecting to a PC, the MSP-FET performs a self-test. If the self-test passes successfully, the green LED stays on. For a complete list of LED signals, please refer to the MSP-FET chapter in this document. 5. Connect the MSP-FET to a target board, such as an MSP-TS430xxx target socket module, with the 14-conductor cable. 6. Make sure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529 To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools, follow steps 1 and 2 of Section 1.16 20 Get Started Now! SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated www.ti.com Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools: 1. Follow steps 1 and 2 of Section 1.16 2. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC. Use the 14-conductor cable to connect the FET interface module to the supplied target socket module. 3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circular indentation on the top surface) aligns with the "1" mark on the PCB. 4. Ensure that the two jumpers (LED and VCC) near the 2x7-pin male connector are in place. Illustrations of the target socket modules and their parts are found in Appendix B. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Get Started Now! Copyright (c) 2009-2015, Texas Instruments Incorporated 21 Important MSP430 Documents on the Web www.ti.com 1.20 Important MSP430 Documents on the Web The primary sources of MSP430 information are the device-specific data sheet and user's guide. The MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents. PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is available, and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provide additional help besides the product help and Welcome page. PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker, and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the latest information) are available in HTML format in the same directories. A IAR specific Wiki Page is also available. 22 Get Started Now! SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated www.ti.com Important MSP430 Documents on the Web SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Get Started Now! Copyright (c) 2009-2015, Texas Instruments Incorporated 23 Chapter 2 SLAU278V - May 2009 - Revised May 2015 Design Considerations for In-Circuit Programming This chapter presents signal requirements for in-circuit programming of the MSP430. Topic 2.1 2.2 2.3 24 ........................................................................................................................... Page Signal Connections for In-System Programming and Debugging ............................. 25 External Power................................................................................................... 29 Bootstrap Loader (BSL) ...................................................................................... 29 Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback www.ti.com 2.1 Signal Connections for In-System Programming and Debugging Signal Connections for In-System Programming and Debugging MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430 With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSPFET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers, thus providing an easy way to program prototype boards, if desired. Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target device required to support in-system programming and debugging for 4-wire JTAG communication. Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is supported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230). The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430 User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138) for information on which interface method can be used on which device. The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430 are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board (through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCCsense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC present on the target board (that is, a battery or other local power supply) and adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCCsense feature and prevents any contention that might occur if the local on-board VCC were connected to the VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sense feature is not necessary (that is, if the target board is to be powered from the FET interface module, MSPGANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying VCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired to eliminate the jumper block. Pins 2 and 4 must not be connected at the same time. Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4-wire JTAG communication mode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAG mode, the RST connection must be made. The MSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated 25 Signal Connections for In-System Programming and Debugging www.ti.com VCC Important to connect MSP430Fxxx J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 kW (see Note B) C2 10 F C3 0.1 F JTAG VCC TOOL VCC TARGET TEST/VPP RST/NMI 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI TDO/TDI TDI/VPP TDI/VPP TMS TCK TMS TCK GND RST (see Note D) TEST/VPP (see Note C) C1 10 nF/2.2 nF (see Notes B and E) VSS/AVSS/DVSS A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2. B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family user's guide for the recommended configuration. C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data sheet to determine if this pin is available. D The connection to the JTAG connector RST pin is optional when using a device that supports only 4-wire JTAG communication mode, and it is not required for device programming or debugging. However, this connection is required when using a device that supports 2-wire JTAG communication mode in 4-wire JTAG mode. E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should not exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET). Some EVMs use a value of 1.1 nF to enable high-speed SBW communication. Figure 2-1. Signal Connections for 4-Wire JTAG Communication 26 Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Signal Connections for In-System Programming and Debugging www.ti.com VCC Important to connect MSP430Fxxx J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 k C2 10 F C3 0.1 F JTAG VCC TOOL VCC TARGET TEST/VPP 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND R2 330 TEST/SBWTCK C1 2.2 nF (See Note B) VSS/AVSS/DVSS A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection J2. B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI tools. Some EVMs use a value of 1.1 nF to enable high-speed SBW communication. C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 ) and do not connect TEST/VPP to TEST/SBWTCK. Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx, and MSP430F4xx Devices SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated 27 Signal Connections for In-System Programming and Debugging www.ti.com VCC Important to connect MSP430Fxxx J1 (see Note A) VCC/AVCC/DVCC J2 (see Note A) R1 47 k C2 10 F C3 0.1 F JTAG VCC TOOL VCC TARGET 2 1 4 3 6 5 8 7 10 9 12 11 14 13 TDO/TDI RST/NMI/SBWTDIO TCK GND TEST/SBWTCK C1 2.2 nF (See Note B) VSS/AVSS/DVSS A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug or programming adapter. B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF when using current TI tools. Some EVMs use a value of 1.1 nF to enable high-speed SBW communication. Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and MSP430F6xx Devices 28 Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback External Power www.ti.com 2.2 External Power The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Note that the target should not consume more than 60 mA, even as a peak current, as it may violate the USB specification. For example, if the target board has a capacitor on VCC more than 10 F, it may cause inrush current during capacitor charging that may exceed 60 mA. In this case, the current should be limited by the design of the target board, or an external power supply should be used. The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the target can be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin connector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically. Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected; not both at the same time. When a target socket module is powered from an external supply, the external supply powers the device on the target socket module and any user circuitry connected to the target socket module, and the FET interface module continues to be powered from the PC through the parallel port. If the externally supplied voltage differs from that of the FET interface module, the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module (so that it may adjust its output voltage levels accordingly). See the target socket module schematics in Appendix B. The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the tool through connections provided on the target socket modules. See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors. Note that the MSPFET430PIF is not recommended for new design. 2.3 Bootstrap Loader (BSL) The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices, these pins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program (a "bootstrap loader") that permits the flash memory to be erased and programmed using a reduced set of signals. The MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319) describes this interface. See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers. TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests providing access to these signals by, for example, a header). See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated 29 Bootstrap Loader (BSL) 30 www.ti.com Design Considerations for In-Circuit Programming Copyright (c) 2009-2015, Texas Instruments Incorporated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Appendix A SLAU278V - May 2009 - Revised May 2015 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware. Topic A.1 A.2 ........................................................................................................................... Page Hardware FAQs .................................................................................................. 32 Known Issues .................................................................................................... 34 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Frequently Asked Questions and Known Issues Copyright (c) 2009-2015, Texas Instruments Incorporated 31 Hardware FAQs A.1 www.ti.com Hardware FAQs 1. MSP430F22xx Target Socket Module (MSP-TS430DA38) - Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configuration and only to the period while a debug session is active. Workarounds: * Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly. * Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at top of Debug View). This prevents the debugger from accessing the MSP430 device while the application is running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature. * Use an external clock source to drive XIN directly. 2. With current interface hardware and software, there is a weakness when adapting target boards that are powered externally. This leads to an accidental fuse check in the MSP430 device. This is valid for PIF and UIF but is seen most often on the UIF. A solution is being developed. Workarounds: * Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the RST line, which also resets the device internal fuse logic. * Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down menu. This prevents the debugger from accessing the MCU while the application is running. Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature. * Use an external clock source to drive XIN directly. 3. The 14-conductor cable that connects the FET interface module and the target socket module must not exceed 8 inches (20 centimeters) in length. 4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB FET. 5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket module. See the schematic of the target socket module to populate the capacitor according to the data sheet of the device. 6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on the target socket module. See the schematic of the target socket module to populate the capacitor according to the data sheet of the device. 7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module. For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal data sheets for the value of capacitance. 8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C-SPY (as any required clocking and timing is derived from the internal DCO and FLL). 9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability: For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected. For C-SPY: "Release JTAG On Go" must be selected. 10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 is that the family members are code and architecturally compatible, so code developed on one device (for example, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent set of peripherals). 32 Frequently Asked Questions and Known Issues Copyright (c) 2009-2015, Texas Instruments Incorporated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware FAQs www.ti.com 11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI. 12. The device current is higher then expected. The device current measurement may not be accurate with the debugger connected to the device. For accurate measurement, disconnect the debugger. Additionally some unused pins of the device should be terminated. See the Connection of Unused Pins table in the device's family user's guide. 13. The following ZIF sockets are used in the FET tools and target socket modules: * 8-pin device (D package): Yamaichi IC369-0082 * 14-pin device (PW package): Enplas OTS-14-065-01 * 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146 * 24-pin package (PW package): Enplas OTS-24(28)-0.65-02 * 28-pin device (DW package): Wells-CTI 652 D028 * 28-pin device (PW package): Enplas OTS-28-0.65-01 * 38-pin device (DA package): Yamaichi IC189-0382-037 * 40-pin device (RHA package): Enplas QFN-40B-0.5-01 * 40-pin device (RSB package): Enplas QFN-40B-0.4 * 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001 * 48-pin device (DL package): Yamaichi IC51-0482-1163 * 64-pin device (PM package): Yamaichi IC51-0644-807 * 64-pin device (RGC package): Yamaichi QFN11T064-006 * 80-pin device (PN package): Yamaichi IC201-0804-014 * 100-pin device (PZ package): Yamaichi IC201-1004-008 * 128-pin device (PEU package): Yamaichi IC500-1284-009P Enplas: www.enplas.com Wells-CTI: www.wellscti.com Yamaichi: www.yamaichi.us SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Frequently Asked Questions and Known Issues Copyright (c) 2009-2015, Texas Instruments Incorporated 33 Known Issues A.2 www.ti.com Known Issues MSP-FET430UIF Current detection algorithm of the UIF firmware Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequently switching on and off the target power supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control. A side issue is that if the UIF firmware has entered this switch on and switch off loop, it is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A power cycle is required to remove the device from this state. Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version 2.04.00.003 and higher do not show this problem. Update the software development tool to this version or higher to update the MSP-FET430UIF firmware. MSP-FET430PIF Some PCs do not supply 5 V through the parallel port Problem Description Device identification problems with modern PCs, because the parallel port often does not deliver 5 V as was common with earlier hardware. 1. When connected to a laptop, the test signal is clamped to 2.5 V. 2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter through pin 4 (sense). Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the VCC pads of the interface. The jumper on a the target socket must be switched to external power. 34 Frequently Asked Questions and Known Issues Copyright (c) 2009-2015, Texas Instruments Incorporated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback www.ti.com SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback MSP-FET430UIF -- Current detection algorithm of the UIF firmware Frequently Asked Questions and Known Issues Copyright (c) 2009-2015, Texas Instruments Incorporated 35 Appendix B SLAU278V - May 2009 - Revised May 2015 Hardware This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate productspecific user's guides. 36 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Appendix B www.ti.com Topic ........................................................................................................................... B.1 B.2 B.3 B.4 B.5 B.6 B.7 B.8 B.9 B.10 B.11 B.12 B.13 B.14 B.15 B.16 B.17 B.18 B.19 B.20 B.21 B.22 B.23 B.24 B.25 B.26 B.27 B.28 B.29 B.30 B.31 B.32 B.33 B.34 B.35 B.36 B.37 B.38 B.39 B.40 B.41 Page MSP-TS430D8 .................................................................................................... 38 MSP-TS430PW14 ................................................................................................ 41 MSP-TS430L092 ................................................................................................. 44 MSP-TS430L092 Active Cable .............................................................................. 47 MSP-TS430PW24 ................................................................................................ 50 MSP-TS430DW28................................................................................................ 53 MSP-TS430PW28 ................................................................................................ 56 MSP-TS430PW28A.............................................................................................. 59 MSP-TS430RHB32A ............................................................................................ 62 MSP-TS430DA38 ................................................................................................ 65 MSP-TS430QFN23x0 ........................................................................................... 68 MSP-TS430RSB40 .............................................................................................. 71 MSP-TS430RHA40A ............................................................................................ 74 MSP-TS430DL48 ................................................................................................ 77 MSP-TS430RGZ48B ............................................................................................ 80 MSP-TS430RGZ48C ............................................................................................ 83 MSP-TS430PM64 ................................................................................................ 86 MSP-TS430PM64A .............................................................................................. 89 MSP-TS430PM64D .............................................................................................. 92 MSP-TS430PM64F .............................................................................................. 95 MSP-TS430RGC64B ............................................................................................ 98 MSP-TS430RGC64C .......................................................................................... 101 MSP-TS430RGC64USB ...................................................................................... 105 MSP-TS430PN80 ............................................................................................... 109 MSP-TS430PN80A ............................................................................................ 112 MSP-TS430PN80USB ........................................................................................ 115 MSP-TS430PZ100 ............................................................................................. 119 MSP-TS430PZ100A ........................................................................................... 122 MSP-TS430PZ100B ........................................................................................... 125 MSP-TS430PZ100C ........................................................................................... 128 MSP-TS430PZ100D ........................................................................................... 131 MSP-TS430PZ5x100 .......................................................................................... 134 MSP-TS430PZ100USB ....................................................................................... 137 MSP-TS430PZ100AUSB ..................................................................................... 141 MSP-TS430PEU128 ........................................................................................... 145 EM430F5137RF900 ........................................................................................... 148 EM430F6137RF900 ........................................................................................... 152 EM430F6147RF900 ........................................................................................... 156 MSP-FET ......................................................................................................... 160 MSP-FET430PIF ................................................................................................ 172 MSP-FET430UIF ............................................................................................... 174 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 37 Vcc J5 3 2 1 14 12 10 8 6 4 2 SBW 2 1 C7 13 11 9 7 5 3 1 GND 330R R3 C5 100nF SBWTCK J4 R2 330R 1 2 3 4 TST/SBWTCK FE4L J1 VCC430 P1.2 P1.5 P1.6 U1 RST/SBWTDIO R5 47K MSP-TS430D8 DVCC P1.2/TA1/A2 P1.5/TA0/A5/SCLK P1.6/TA1/A6/SDO/SCL DNP GND C8 2.2nF 1 2 3 4 Socket: YA MAICHI Type: IC369-0082 DVSS TST/SBWTCK RST/SBWTDIO P1.7/A7/SDI/SDA 8 7 6 5 GND GND TST/SBWTCK RST/SBWTDIO P1.7 J2 FE4H 8 7 6 5 VCC J3 Ext_PWR REV: 1.0 GND 1 2 3 Sheet: /11 Copyright (c) 2009-2015, Texas Instruments Incorporated RST/SBWTDIO TST/SBWTCK to measure supply current J6 10uF/10V D1 green 2 1 ext int + GND MSP-TS430D8 MSP-TS430D8 Ta rget Socket Board TITLE: Document Number: Date: 28.07.201 1 11:03:35 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 38 MSP-TS430D8 B.1 www.ti.com MSP-TS430D8 Figure B-1. MSP-TS430D8 Target Socket Module, Schematic MSP-TS430D8 www.ti.com Jumper J5 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply 14-pin connector for debugging in Spy-Bi-Wire mode only (4-Wire JTAG not available) D1 LED connected to P1.2 Connector J3 External power connector Jumper J5 to "ext" Jumper J4 Open to disconnect LED Jumper J6 Open to measure current Orient Pin 1 of MSP430 device Figure B-2. MSP-TS430D8 Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 39 MSP-TS430D8 www.ti.com Table B-1. MSP-TS430D8 Bill of Materials Position No. per Board Ref Des Description Digi-Key Part No. Comment 1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 3 SBW 1 10-pin connector, male, TH HRP10H-ND 4 J3 1 3-pin header, male, TH SAM1035-03-ND 5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292 6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND 7 R5 1 47K, 0805 541-47000ATR-ND 8 C5 1 100nF, CSMD0805 311-1245-2-ND 9 R2, R3 2 330R, 0805 541-330ATR-ND 10 J1, J2 2 4-pin header, TH SAM1029-04-ND DNP: headers enclosed with kit. Keep vias free of solder. 10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit. 11 U1 1 SO8 Socket: Type IC369-0082 12 D1 1 red, LED 0603 13 MSP430 2 MSP430G2210, MSP430G2230 14 PCB 1 50,0mmx44,5mm 40 Manuf.: Yamaichi DNP: enclosed with kit. Is supplied by TI MSP-TS430D8 Rev. 1.0 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PW14 B.2 MSP-TS430PW14 www.ti.com Vcc J5 3 2 1 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 GND RST/NMI SBWTCK TMS TDI TDO/SBWTDIO J7 3 2 1 TEST/SBWTCK JTAG -> SBW -> XIN XOUT to measure supply current J6 Q1 DNP J4 R2 330R 1 2 3 4 5 6 7 TEST/SBWTCK J1 J8 3 2 1 C8 2.2nF 1 2 3 4 5 6 7 J9 3 2 1 P1.7/TDO 3 2 1 J10 GND XIN XOUT TEST/SBWTCK RST/SBWTDIO P1.7/TDO P1.6/TDI Socket: ENPLAS Type: OTS-14-065 14 13 12 11 10 9 8 P1.6/TDI 14 13 12 11 10 9 8 J2 3 2 1 J11 VCC P1.5/TMS 3 2 1 J12 2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1 4-wire JTAG: Set jumpers J7 to J12 to position 2-3 JTAG-Mode selection: RST/SBWTDIO R5 47K DNP GND VCC430 P1.0 P1.1 P1.2 P1.3 P1.4/TCK P1.5/TMS C3 100nF DNP GND MSP-TS430PW14 Ext_PWR J3 GND P1.4/TCK REV: 2.0 Sheet: 1/1 MSP-TS430PW14 Target Socket Board TITLE: Document Number: Date: 7/16/2007 8:22:36 AM Copyright (c) 2009-2015, Texas Instruments Incorporated 1 2 3 41 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback ext int 2 1 12pF C2 DNP 330R R3 12pF C1 DNP D1 green 2 1 C5 C7 100nF 10uF/10V GND + Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic MSP-TS430PW14 www.ti.com Connector JTAG For JTAG Tool Jumper J5 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector J3 External power connector Jumper J5 to "ext" D1 LED connected to P1.0 Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device Jumper J6 Open to measure current Figure B-4. MSP-TS430PW14 Target Socket Module, PCB 42 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PW14 www.ti.com Table B-2. MSP-TS430PW14 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C3, C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 6 J1, J2 0 Description Digi-Key Part No. Comment DNP DNP: C3 DNP 475-1056-2-ND DNP: Headers and receptacles enclosed with kit. Keep vias free of solder 7-pin header, TH SAM1029-07-ND : Header SAM1213-07-ND : Receptacle 7 J3, J5, J7, J8, J9, J10, J11, J12 8 3-pin header, male, TH SAM1035-03-ND Place jumpers on headers J5, J7, J8, J9, J10, J11, J12; Pos 1-2 8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2 9 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R2, R3 2 330 , SMD0805 541-330ATR-ND 15 R5 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas 17 PCB 1 56 x 53 mm 2 layers Apply to corners at bottom side DNP: enclosed with kit, supplied by TI 18 Adhesive plastic feet 4 For example, 3M Approximately 6mm width, Bumpons Part No. SJ2mm height 5302 19 MSP430 2 MSP430F2013IPW SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP: keep vias free of solder Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 43 MSP-TS430L092 B.3 www.ti.com MSP-TS430L092 Figure B-5. MSP-TS430L092 Target Socket Module, Schematic 44 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430L092 www.ti.com Settings of the MSP-TS430L092 Target Socket Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended: * JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read. * JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current consumption. For default operation, they should be closed. Connector J3 External power connector Jumper JP1 Write enable for EPROM Jumper JP3 Open to measure current Orient pin 1 of MSP430 device Figure B-6. MSP-TS430L092 Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 45 MSP-TS430L092 www.ti.com Table B-3. MSP-TS430L092 Bill of Materials Pos. Ref Des No. No. Per Board 1 C1, C2 2 330nF, SMD0603 2 C5 1 100n, SMD0603 3 C6 1 10u, SMD0805 4 C10 1 100n, SMD0603 5 EEPROM1 1 M95512 SO08 (SO8) 7 46 J1, J2 2 Description Digi-Key Part No. ST Micro M95160R Comment Digikey: 497-8688-1-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 7-pin header, TH SAM1213-07-ND : Header SAM1035-07-ND : Receptacle 8 J3 1 3-pin header, male, TH SAM1035-03-ND 9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe 11 J13 1 MICRO_STECKV_10 12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557 16 LED1, LED4 2 LEDCHIPLED_0603 17 Q2 1 BC817-16LT1SMD 18 R0, R6, R7 3 2K7, SMD0603 19 R1 1 1k, SMD0603 20 R2 1 47k, SMD0603 21 R4,R5, R8, R10, RC, RD 6 10k, SMD0603 22 RA 1 3.9k, SMD0603 23 RB 1 6.8k, SMD0603 24 U1 1 14 Pin Socket - IC189-0142146 Manuf. Yamaichi 22 MSP430 2 MSP430L092PWR DNP: Enclosed with kit. Is supplied by TI. DNP; Keep vias free of solder. Reichelt: MicroMaTchConnector: MM FL 10G Farnell: 1686065 BC817-16LT1SMD Hardware SOT23-BEC SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430L092 Active Cable www.ti.com B.4 MSP-TS430L092 Active Cable Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 47 MSP-TS430L092 Active Cable www.ti.com Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible: * JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4. Table B-4. MSP-TS430L092 JP1 Settings * Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function. Off On The active cable receives power from target socket. For this option, the target socket must have its own power supply. On Off The active cable receives power from the JTAG connector. On On The JTAG connector powers the active cable and the target socket. For this option, the target socket must not have its own power source, as this would cause a not defined state. JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero. JP2 Connector JTAG For JTAG Tool JP1 Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB 48 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430L092 Active Cable www.ti.com Table B-5. MSP-TS430L092 Active Cable Bill of Materials Pos. Ref Des No. Per Board 1 C1, C3, C5, C6 4 100nF, SMD0603 2 C2, C4 2 1uF, SMD0805 3 R1, R10 2 10K, SMD0603 4 R2 1 4K7, SMD0603 5 R5, R6, R7, R9 4 100, SMD0603 6 R8 1 680k, SMD0603 7 R11, R15 2 1K, SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0, SMD0603 11 IC1 1 SN74AUC1G04DBVR 12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Description Digi-Key Part No. Comment Manu: TI Manu: TI 13 J2 1 MICRO_STECKV_10 Reichelt: MicroMaTchConnector: MM FL 10G 14 JP1 1 2x2 Header JP2Q Put jumper on Position 1 and 2. Do not mix direction. 15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header 16 JTAG 1 14-pin connector, male, TH HRP14H-ND 17 Q1 1 BC817-25LT1SMD, SOT23BEC Digi-Key: BC81725LT1GOSCT-ND 18 U1, U2 2 TLVH431IDBVR SOT23-5 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Manu: TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 49 MSP-TS430PW24 B.5 www.ti.com MSP-TS430PW24 Figure B-9. MSP-TS430PW24 Target Socket Module, Schematic 50 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PW24 www.ti.com Connector JTAG For JTAG Tool Connector J5 External power connector Jumper JP1 to "ext" Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Figure B-10. MSP-TS430PW24 Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 51 MSP-TS430PW24 www.ti.com Table B-6. MSP-TS430PW24 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.2nF, SMD0805 3 C3, C7 2 10uF, 10V, SMD0805 4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2 0 12-pin header, TH SAM1029-07-ND SAM1213-07-ND DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. (Header and Receptacle) 7 J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 Place on 1-2 on JP1 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND see Pos 7 and 8 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 Q1 0 Crystal 12 R1, R7 2 330 , SMD0805 541-330ATR-ND 13 R5, R6, R8, R9, 2 0 Ohm, SMD0805 541-000ATR-ND 14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND U1 1 Socket: OTS 24(28)-06502-00 Manuf.: Enplas 16 PCB 1 68.5 x 61 mm 2 layers 17 Adhesive plastic feet 4 Approximately 6mm width, for example, 3M Bumpons Apply to corners at bottom side 2mm height Part No. SJ-5302 18 MSP430 2 MSP430AFE2xx 9 10 15 52 Description Digi-Key Part No. Comment DNP DNP: keep vias free of solder Hardware DNP R5, R6 DNP: enclosed with kit, supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430DW28 B.6 MSP-TS430DW28 www.ti.com If external supply voltage: - R9 GND C2 R8 0R R2 0R 2 Q1 560R R3 R1 - 12pF C1 12pF LED3 D1 14 12 10 8 6 4 2 JTAG ML14 13 11 9 7 5 3 1 J5 JP1Q 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 C8 TDO TDI TMS TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 10nF RST/NMI C5 C7 100nF 10uF/10V J4 JP1Q SMD-Footprint F123 TST/VPP 1 VCC430 2 3 P2.5 4 GND 5 XOUT 6 XIN RST/NMI 7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 U2 TST VCC P2.5 VSS XOUT XIN RST P2.0 P2.1 P2.2 P3.0 P3.1 P3.2 P3.3 R5 50K TST/VPP VCC TCK TMS TDI TDO U1 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SOCK28DW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 TDO TDI TMS TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 Socket: Yamaichi Type: IC189-0282-042 TST/VPP VCC430 P2.5 GND XOUT XIN RST/NMI P2.0 P2.1 P2.2 P3.0 P3.1 P3.2 P3.3 RST/NMI 1 2 3 4 5 6 7 8 9 10 11 12 13 14 FE14L J1 J2 FE14H 28 27 26 25 24 23 22 21 20 19 18 17 16 15 R7 0R R6 0R TITLE: J3 Ext_PWR MSP-TS430DW28 Document Number: R10 - R11 0R Sheet: 1/1 REV: 2.0 If external supply voltage: remove R11 and add R10 (0 Ohm) 10 8 6 4 RST/NMI 2 ML10 not assembled 9 7 5 3 1 BOOTST GND 1 2 3 MSP-TS430DW28 Target Socket DW28 GND Date: 11/14/2006 1:26:04 PM Copyright (c) 2009-2015, Texas Instruments Incorporated 53 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback remove R8 and add R9 (0 Ohm) R1, C1, C2 not assembled GND 2 1 + QUARZ3 Figure B-11. MSP-TS430DW28 Target Socket Module, Schematic MSP-TS430DW28 www.ti.com D1 LED connected to P1.0 Jumper J4 Open to disconnect LED Connector J3 External power connector Remove R8 and jumper R9 Jumper J5 Open to measure current Connector JTAG For JTAG Tool Orient Pin 1 of MSP430 device Connector BOOTST For Bootstrap Loader Tool Figure B-12. MSP-TS430DW28 Target Socket Module, PCB 54 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430DW28 www.ti.com Table B-7. MSP-TS430DW28 Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 100nF, SMD0805 3 C7 1 10uF, 10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1 3mm yellow RS: 228-4991 6 Q1 0 QUARZ, Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 7 J1, J2 2 Description Digi-Key Part No. Comment DNP: C1, C2, Cover holes while soldering DNP: Cover holes while soldering DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. 14-pin header, TH male : Header : Receptacle 7.1 2 DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. 14-pin header, TH female : Header : Receptacle 8 J3 1 3-Pin Connector, male 9 J4, J5 2 2-Pin Connector, male 10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121 12 R1, R2, R6, R7, R8,R9, R10, R11 4 0R, SMD0805 13 R3 1 560R, SMD0805 14 R5 1 47K, SMD0805 15 U1 1 SOP28DW socket 16 U2 0 TSSOP With jumper DNP, Cover holes while soldering DNP: R1, R2, R9, R10 Yamaichi: IC189-0282042 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 55 Vcc int ext 3 2 1 C4 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 VCC P1.0 GND JTAG -> SBW -> XOUT/P2.7 R6 0R DNP TEST/SBWTCK 100nF R5 0R XIN/P2.6 JP3 R4 47k TST VCC P2.5 VSS XOUT XIN RST P2.0 P2.1 P2.2 P3.0 P3.1 P3.2 P3.3 U1 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 14 13 12 11 10 9 8 7 6 5 4 3 2 1 J2 JP6 GND J5 - DNP R3 0R R2 DNP Ext_PWR 3 2 P1.4/TCK 1 JP9 10 8 6 4 2 DNP GND If external supply voltage: remove R11 and add R10 (0 Ohm) 9 7 5 3 1 BOOTST 3 2 P1.5/TMS 1 JP8 RST/SBWTDIO P1.1 TEST/SBWTCK 3 2 P1.6/TDI 1 JP7 3 2 P1.7/TDO 1 JTAG-Mode selection: 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2 RST/SBWTDIO C5 GND P1.7/TDO P1.6/TDI P1.5/TMS P1.4/TCK P1.3 P1.2 P1.1 P1.0 P2.4 P2.3 P3.7 P3.6 P3.5 P3.4 DNP 2.2nF 28 27 26 25 24 23 22 21 20 19 18 17 16 15 P2.2 3 2 1 RST/NMI TCK/SBWTCK TMS TDI TDO/SBWTDIO 3 2 1 R7 330R JP5 TEST/SBWTCK1 VCC430 2 3 P2.5 4 GND XOUT/P2.75 XIN/P2.6 6 RST/SBWTDIO7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 TEST/SBWTCK 3 2 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 MSP430F12xx JP4 J1 Socket: Enplas OTS-28-0.65-01 MSP-TS430PW28: Target Socket Board for MSP430's in PW28 package 3.1 Copyright (c) 2009-2015, Texas Instruments Incorporated JP1 2 1 VCC430 C2 12pF DNP DNP Q1 R1 330R DNP XTLGND C1 12pF D1 green 2 1 JP2 C3 10uF/10V GND + GND 2 1 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 56 MSP-TS430PW28 B.7 www.ti.com MSP-TS430PW28 Figure B-13. MSP-TS430PW28 Target Socket Module, Schematic MSP-TS430PW28 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P5.1 Figure B-14. MSP-TS430PW28 Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 57 MSP-TS430PW28 www.ti.com Table B-8. MSP-TS430PW28 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF, 10V Tantal Elko B 3 C4 1 100nF, SMD0805 4 C5 0 2.2nF, SMD0805 5 D1 1 LED green SMD0603 6 Q1 0 QUARZ, Crystal 7 J1, J2 2 Description (1) Digi-Key Part No. Comment DNP: C1, C2 , Cover holes while soldering DNP Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF DNP: Cover holes and neighboring holes while soldering DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 14-pin header, TH male : Header : Receptacle 7.1 2 DNP: headers and receptacles enclosed with kit.Keep vias free of solder. 14-pin header, TH female : Header : Receptacle (1) 58 8 J5, IP1 1 3-Pin Connector , male 8a JP1, JP4, JP5, JP6, JP7, JP8, JP9 7 3-Pin Connector , male Jumper on Pos 1-2 9 JP2, JP3 2 2-Pin Connector , male with Jumper 10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121 12 R1, R7 2 330R, SMD0805 12 R2, R3, R5, R6 0 0R, SMD0805 14 R4 1 47K, SMD0805 15 U1 1 SOP28PW socket DNP: Cover holes while soldering DNP Enplas: OTS-28-0.65-01 PCB 66 x 79 mm, two layers; Rubber stand off, four pieces Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PW28A www.ti.com B.8 MSP-TS430PW28A JTAG Mode selection: 4-wire JTAG: Set jumpers J4 to J9 to position 2-3 2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1 Figure B-15. MSP-TS430PW28A Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 59 MSP-TS430PW28A www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) 60 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PW28A www.ti.com Table B-9. MSP-TS430PW28A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C5 1 2.2nF, SMD0805 3 C3 1 10uF, 10V, SMD0805 4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2 0 14-pin header, TH 7 J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 Place on 1-2 on JP1 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND see Pos 7 an 8 14-pin connector, male, TH HRP14H-ND 9 10 JTAG 1 11 BOOTST 0 Description Digi-Key Part No. Comment DNP DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: (Header and Receptacle) DNP Keep vias free of solder Q1 0 Crystal Micro Crystal MS3V 32.768kHz, C(Load) = 12.5pF 13 R1, R7 2 330 , SMD0805 541-330ATR-ND 14 R2, R3,R5, R6, 0 0 Ohm, SMD0805 541-000ATR-ND 15 R4 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas 17 PCB 1 63.5 x 64.8 mm 2 layers 18 Adhesive plastic feet 4 Approximately 6mm width, for example, 3M Bumpons Apply to corners at bottom side 2mm height Part No. SJ-5302 19 MSP430 2 MSP430G2553IPW28 12 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP: keep vias free of solder DNP R2, R3,R5, R6 DNP: enclosed with kit, supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 61 ext Vcc DVCC 14 12 10 8 6 4 2 JP2 JTAG P1.4 13 11 9 7 5 3 1 GND DVCC RST/NMI TCK TMS TDI TDO C8 DNP 2.2nF R5 47K RST VCC C14 1 JP4 2 3 9 10 11 12 13 14 15 16 1 2 3 4 5 6 7 8 TDO 1 RST 2 RST/NMI 3 JP9 RST TEST/SBWTCK VREF AVSS ROSC GND DVCC VCORE A2.0+ A2.0A3.0+ A3.0- A0.0+ A0.0A1.0+ A1.0- J1 SAM1029-08-ND1-8 TCK TEST/SBWTCK R6 R8 R9 R10 R11 R12 R13 R14 R2 100nF DNP 10k DNP 10k DNP 10k DNP 10k DNP 10k DNP 10k DNP 10k DNP 10k 20k/0.1% R4 SAM1029-08-ND9-16 J2 U1 1 JP8 2 3 M TMS 1 JP7 2 3 I TDI 1 JP6 2 3 A0.0+ P2.7/TA0.2 A0.0P2.6/TA0.1 A1.0+ P2.5/TA0.0 A1.0P2.4/TA1.0 P2.3/VMONIN A2.0+ P2.2/TA1.2 A2.0P2.1/TA1.1 A3.0+ P2.0/TA1.0/CLKIN A3.0P1.7/UCB0SDA/UCB0SIMO/TA1CLK VREF P1.6/UCB0SCL/UCB0SOMI/TA0.2 AVSS P1.5/UCB0CLK/TA0.1 ROSC P1.4/UCB0STE/TA0.0 DVSS P1.3/UCA0TXD/UCA0SIMO/TA0CLK/TDO/TDI VCC VCORE P1.2/UCA0RXD/UCA0SOMI/ACLK/TDI/TCLK P1.1/UCA0CLK/SMCLK/TMS RST/NMI/SBWTDIO TEST/SBWTCK P1.0/UCA0STE/MCLK/TCK C TCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MSP430I2040TRHBQFN11T032-003 Socket: Yamaichi QFN11T032-003 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 O TDO JP5 1 2 3 <- SBW <- JTAG 24 23 22 21 20 19 18 17 32 31 30 29 28 27 26 25 J4 SAM1029-08-ND25-32 P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 P1.7 P1.6 P1.5 P1.4 O I M C SAM1029-08-ND17-2417-24 J3 MSP430: Target-Socket MSP-TS430RHB32A for MSP430i2040 GND Copyright (c) 2009-2015, Texas Instruments Incorporated 3 2 1 JP3 100nF C13 GND AVSS R3 330R AVSS int 1 JP1 2 10uF C12 D1 1 2 GND GND GND 0R C9 470nF GND GND 0R R1 1 2 3 PWR3 1.0 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 62 MSP-TS430RHB32A B.9 www.ti.com MSP-TS430RHB32A J5 Figure B-17. MSP-TS430RHB32A Target Socket Module, Schematic MSP-TS430RHB32A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool J5 1 1 1 1 2 2 2 2 2 2 Rev.: 1.0 RoHS R2 C14 R5 C8 Jumper JP2 Open to disconnect LED MSP-TS430RHB32A 3 3 JP8 JP4 JP5 JP6 JP7 3 3 JP9 3 3 9 J2 16 D1 LED connected to P1.4 P1.4 D1 R3 JP2 1 C13 C12 R4 C9 VCC JP3 JP1 1 SBW JTAG Curr. Meas. JTAG Jumper JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode 1 2 GND GND Vcc ext int 3 2 1 14 Jumper JP1 Open to measure current Connector J5 External power connector Jumper JP3 to "ext" R1 8 17 R14 R13 R12 R11 R10 R9 R8 R6 5 20 1 24 J1 1 J3 U1 25 30 32 J4 Orient Pin 1 of MSP430 device Figure B-18. MSP-TS430RHB32A Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 63 MSP-TS430RHB32A www.ti.com Table B-10. MSP-TS430RHB32A Bill of Materials Pos. No. per Board Ref Des Description Digi-Key Part No. Comment 1 PCB 1 76.9 x 67.6 mm MSP-TS430RHB32A Rev. 1 2 D1 1 green LED, DIODE0805 P516TR-ND 3 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 4 JP3, JP4, JP5, JP6, JP7, JP8, JP9 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2 (SBW) 5 R1, R4 2 0R, 0805 541-0.0ATR-ND 6 C8 1 2.2nF, CSMD0805 490-1628-2-ND DNP 7 R6, R8, R9, R10, R11, R12, R13, R14 8 10k, 0805 311-10KARTR-ND DNP 8 C12 1 10uF, CSMD0805 445-1371-2-ND 9 R2 1 20k/0.1%, 0805 P20KDACT-ND 10 R5 1 47K, 0805 311-47KARTR-ND 11 C13, C14 2 100nF, CSMD0805 311-1245-2-ND 12 R3 1 330R, 0805 541-330ATR-ND 13 C9 1 470nF, CSMD0805 445-1357-2-ND 14 J1, J2, J3, J4 1 8-pin header, TH SAM1029-08-ND DNP: headers and receptacles, enclosed with kit. Keep vias free of solder. 15 J1, J2, J3, J4 1 8-pin receptable, TH SAM1213-08-ND DNP: headers and receptacles, enclosed with kit. Keep vias free of solder. 16 JTAG 1 14-pin connector, male, TH HRP14H-ND 17 U1 1 Socket QFN11T032-003 Manuf.: Yamaichi 18 U1 1 MSP430i2041TRHB DNP: enclosed with kit. Is supplied by TI 19 J5 1 3-pin header, male, TH 20 Rubber stand 4 off 64 2 layers, red solder mask SAM1035-03-ND Buerklin: 20H1724 Hardware apply to corners at bottom side SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430DA38 www.ti.com B.10 MSP-TS430DA38 Vcc int ext 3 2 1 14 12 10 8 6 4 2 JTAG VCC430 C2 12pF DNP C1 12pF DNP D1 yellow 13 11 9 7 5 3 1 C5 100nF GND RST/NMI TCK/SBWTCK TMS TDI TDO/SBWTDIO VCC 3 2 1 JP4 J1 TEST/SBWTCK JTAG -> SBW -> P1.0 P2.7/XOUT Q1 DNP P2.6/XIN R3 560R JP3 R1 330R 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 P1.7/TDO 38 P1.6/TDI 37 P1.5/TMS 36 P1.4/TCK 35 34 P1.3 33 P1.2 32 P1.1 31 P1.0 30 P2.4 29 P2.3 28 P3.7 27 P3.6 26 P3.5 25 P3.4 24 P4.7 23 P4.6 22 P4.5 21 P4.4 20 P4.3 JP6 3 2 P1.7/TDO 1 3 2 1 JP8 3 2 1 J2 P2.2 3 2 1 JP9 DNP GND J3 DNP R11 0R R10 - DNP Ext_PWR P1.4/TCK 10 8 6 4 2 BOOTST 9 7 5 3 1 Sheet: 1/1 REV: 1.3 GND If external supply voltage: remove R11 and add R10 (0 Ohm) P1.5/TMS RST/SBWTDIO P1.1 TEST/SBWTCK JP7 P1.6/TDI JTAG-Mode selection: 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 2-wire "SpyBiWire":Set jumpers JP4 to JP9 to position 2-1 DNP GND R5 47k C8 10nF U1 TEST/SBWTCK P1.7/TDO DVCC P1.6/TDI P2.5 P1.5/TMS DVSS P1.4/TCK P2.7 P1.3 P2.6 P1.2 RST/SBWDAT P1.1 P2.0 P1.0 P2.1 P2.4 P2.2 P2.3 P3.0 P3.7 P3.1 P3.6 P3.2 P3.5 P3.3 P3.4 AVSS P4.7 AVCC P4.6 P4.0 Socket: P4.5 P4.1 Yamaichi P4.4 P4.2 IC189-0382-037P4.3 MSP430F2274IDA RST/SBWTDIO TEST/SBWTCK1 2 VCC430 3 P2.5 4 GND 5 P2.7/XOUT 6 P2.6/XIN RST/SBWTDIO7 8 P2.0 9 P2.1 10 P2.2 11 P3.0 12 P3.1 13 P3.2 14 P3.3 15 GND 16 VCC430 17 P4.0 18 P4.1 19 P4.2 JP5 3 TEST/SBWTCK 2 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 MSP-TS430DA38: MSP-TS430DA38 Target Socket Board for MSP430F2247IDA TITLE: Document Number: Date: 6/18/2008 11:04:56 AM Copyright (c) 2009-2015, Texas Instruments Incorporated 3 2 1 65 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback JP1 2 1 JP2 C7 10uF/10V GND GND 2 1 + Figure B-19. MSP-TS430DA38 Target Socket Module, Schematic MSP-TS430DA38 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient pin 1 of MSP430 device Jumper JP2 Open to measure current Connector J3 External power connector Jumper JP1 to "ext" Figure B-20. MSP-TS430DA38 Target Socket Module, PCB 66 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430DA38 www.ti.com Table B-11. MSP-TS430DA38 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 0 2.2nF, SMD0805 5 D1 1 green LED, SMD0603 6 J1, J2 0 Description Digi-Key Part No. Comment DNP DNP 475-1056-2-ND DNP: headers and receptacles enclosed with kit.Keep vias free of solder. 19-pin header, TH SAM1029-19-ND : Header SAM1213-19-ND : Receptacle 7 "J3, JP1, JP4, JP5, JP6, JP7, JP8, JP9" 8 3-pin header, male, TH SAM1035-03-ND Place jumpers on headers JP1, JP4,JP5, JP6, JP7, JP8, JP9; Pos 1-2 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header Place on: JP1 - JP9; Pos 1-2 9 Jumper 15-38-1024-ND 10 9 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R1, R3 2 330 , SMD0805 541-330ATR-ND 14 R10, R11 0 0 , SMD0805 541-000ATR-ND 15 R5 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC189-0382--037 17 PCB 1 67 x 66 mm 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430F2274IDA DNP: Keep vias free of solder DNP: Keep vias free of solder DNP Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ-5302 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Apply to corners at bottom side DNP: enclosed with kit supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 67 MSP-TS430QFN23x0 www.ti.com B.11 MSP-TS430QFN23x0 Figure B-21. MSP-TS430QFN23x0 Target Socket Module, Schematic 68 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430QFN23x0 www.ti.com Connector JTAG For JTAG Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP2 Open to measure current Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP1 to "ext" Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-22. MSP-TS430QFN23x0 Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 69 MSP-TS430QFN23x0 www.ti.com Table B-12. MSP-TS430QFN23x0 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C4 1 100nF, SMD0805 478-3351-2-ND 4 C5 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2, J3, J4 Digi-Key Part No. Comment DNP DNP: headers and receptacles enclosed with kit.Keep vias free of solder. 10-pin header, TH SAM1034-10-ND : Header SAM1212-10-ND : Receptacle 7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1; Pos 1-2. 8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3 HRP14H-ND 9 70 0 Description 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R1 1 330 , SMD0805 541-330ATR-ND 14 R2, R3 0 0 , SMD0805 541-000ATR-ND 15 R4 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas 17 PCB 1 79 x 66 mm 2 layers 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430F2370IRHA DNP: Keep vias free of solder DNP for example, 3M Bumpons Part No. SJ-5302 Hardware DNP: Keep vias free of solder Apply to corners at bottom side DNP: enclosed with kit supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RSB40 www.ti.com B.12 MSP-TS430RSB40 Figure B-23. MSP-TS430RSB40 Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 71 MSP-TS430RSB40 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Figure B-24. MSP-TS430RSB40 Target Socket Module, PCB 72 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RSB40 www.ti.com Table B-13. MSP-TS430RSB40 Bill of Materials Pos. Ref Des No. Per Board Description 1 C1, C2 0 12pF, SMD0805 2 C3, C7, C10, C12 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12 3 C4, C6, C8, C11 3 100nF, SMD0805 311-1245-2-ND DNP C11 4 C5 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 7 J1, J2, J3, J4 4 Digi-Key Part No. Comment DNP: C1, C2 P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 10-pin header, TH : Header : Receptacle 7.1 4 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 10-pin header, TH : Header : Receptacle 8 JP1, JP4,JP5, JP6, JP7, JP8, JP9, J5, JP10 9 3-pin header, male, TH SAM1035-03-ND Jumper: 1-2 on JP1, JP10; 2-3 on JP4-JP9 9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 10 JTAG 1 14-pin connector, male, TH HRP14H-ND 11 BOOTST 0 10-pin connector, male, TH Enplas DNP. Keep vias free of solder 12 U1 1 QFN-40B-0.4_ ENPLAS_SOCKET 13 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF DNP: Q1. Keep vias free of solder 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 15 16 R1,R7 2 330R SMD0805 17 R2, R3, R5, R6, R8, R9, R10 3 0R SMD0805 18 R4 1 47k SMD0805 19 MSP430 2 MSP430F5132 20 Rubber stand off 4 DNP R2, R3, R5, R6 DNP: enclosed with kit. Is supplied by TI select appropriate; for example, apply to corners at bottom side Buerklin: 20H1724 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 73 MSP-TS430RHA40A www.ti.com B.13 MSP-TS430RHA40A Figure B-25. MSP-TS430RHA40A Target Socket Module, Schematic 74 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RHA40A www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector J5 External power connector Jumper JP1 to "ext" Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-26. MSP-TS430RHA40A Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 75 MSP-TS430RHA40A www.ti.com Table B-14. MSP-TS430RHA40A Bill of Materials Position Ref Des No. per Board Description 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 2 C5 0 2.2nF, SMD0805 DNP C12 3 C3, C7 2 10uF, 10V, SMD0805 5 4 C4, C6 2 100nF, SMD0805 5 C9 1 470nF, SMD0805 6 D1 1 green LED, SMD0805 7 J1, J2, J3, J4 Digi-Key Part No. Comment DNP C11 478-3351-2-ND P516TR-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 4 10-pin header, TH : Header : Receptacle DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 7.1 4 10-pin header, TH : Header : Receptacle 8 J5, JP1, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9; Place on 1-2 on JP1 9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 9 Jumper 15-38-1024-ND HRP14H-ND 10 76 see Pos 8 an 9 11 JTAG 1 14-pin connector, male, TH 12 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder 13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas 14 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF 15 R1,R7 2 330R SMD0805 541-330ATR-ND 16 R2, R3, R5, R6, R8, R9, 2 0 Ohm, SMD0805 541-000ATR-ND 17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 19 Rubber stand off 4 20 MSP430 2 DNP: Q1. Keep vias free of solder DNP:R2, R3, R5, R6 2 layers select appropriate; for example, Buerklin: 20H1724 MSP430N5736IRHA Hardware apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430DL48 www.ti.com B.14 MSP-TS430DL48 ext int 3 2 1 JP1 2 1 + C7 10uF/10V 560R R3 12pF C1 12pF C2 GND D1 LED3 2 14 12 10 8 6 4 2 13 11 9 7 5 3 1 C8 10nF TCK TMS TDI TDO GND 1 3 5 7 9 11 13 15 17 19 21 23 2 4 6 8 10 12 14 16 18 20 22 24 R5 47K R4 0R J1 RST/NMI R12 0R VCC C3 100nF P5.4 P5.3 P5.2 COM0 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 S5 P5.7 P5.6 P5.5 P5.0 P5.1 LCDCAP LCDREF P1.0 P1.1 P1.2 P1.3 C4 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 P1.0 27 26 25 IC51-1387.KS-15186 TDO/TDI TDI/TCLK TMS TCK RST/NMI DVCC DVSS XIN XOUT AVSS AVCC VREF+ P6.0 P6.1 P6.2 P6.3 P6.4 P6.5 P6.6 P6.7 P1.7 P1.6 P1.5 P1.4 TITLE: 1 3 5 7 9 11 13 15 17 19 21 23 10uF/10V J3 J2 GND 2 4 6 8 10 12 14 16 18 20 22 24 Ext_PWR BSL_TX 0R R7 0R R6 MSP-TS430DL48 Document Number: ML10 10 8 6 4 2 BOOTST 9 7 5 3 1 BSL_RX Vcc ext int JP2 RST/NMI TCK REV: 1.3 Sheet: 1/1 Copyright (c) 2009-2015, Texas Instruments Incorporated 1 2 3 MSP-TS430DL48 Target Socket DL48 GND GND 77 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback JTAG ML14 J5 JP1Q P1.0 XOUT C5 100nF Q1 XIN 1 JP1Q J4 TDO 1 2 TDI TMS 3 TCK 4 RST/NMI 5 6 GND 7 8 XIN XOUT 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 U1 + Date: 11/14/2006 1:24:44 PM 1 2 3 Vcc Q1, C1, C2 not assembled GND QUARZ3 Figure B-27. MSP-TS430DL48 Target Socket Module, Schematic MSP-TS430DL48 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP2 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper J5 Open to measure current Connector J3 External power connector Jumper JP2 to "ext" D1 LED connected to P1.0 Jumper J4 Open to disconnect LED Orient pin 1 of MSP430 device Figure B-28. MSP-TS430DL48 Target Socket Module, PCB 78 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430DL48 www.ti.com Table B-15. MSP-TS430DL48 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C3, C5 2 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND 6 J1, J2 0 Description Digi-Key Part No. Comment DNP DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 24-pin header, TH SAM1034-12-ND : Header SAM1212-12-ND : Receptacle 7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1; Pos 1-2. DNP: JP2 8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5 HRP14H-ND 9 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH 12 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R3 1 560 , SMD0805 541-560ATR-ND 14 R4, R6, R7, R12 2 0 , SMD0805 541-000ATR-ND 15 R5 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-1387 KS-15186 17 PCB 1 58 x 66 mm 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430F4270IDL DNP: Keep vias free of solder DNP: Keep vias free of solder DNP: R6, R7 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ-5302 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Apply to corners at bottom side DNP: Enclosed with kit supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 79 MSP-TS430RGZ48B www.ti.com B.15 MSP-TS430RGZ48B Figure B-29. MSP-TS430RGZ48B Target Socket Module, Schematic 80 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGZ48B www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-30. MSP-TS430RGZ48B Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 81 MSP-TS430RGZ48B www.ti.com Table B-16. MSP-TS430RGZ48B Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C12 3 10uF, 6.3V, SMD0805 4 C5, C11, C13, C14 4 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 478-1403-2-ND 7 D1 1 green LED, SMD0805 P516TR-ND 8 J1, J2, J3, J4 0 12-pin header, TH SAM1029-12-ND (Header) SAM1213-12ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 9 J5 1 3-pin header, male, TH 10 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11 HRP14H-ND 12 Digi-Key Part No. Comment 311-1245-2-ND 13 JTAG 1 14-pin connector, male, TH 14 BOOTST 0 10-pin connector, male, TH 15 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF DNP: Q1 Keep vias free of solder 16 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 DNP: Q2 Keep vias free of solder 17 Insulating disk to Q2 0 Insulating disk to Q2 http://www.ettinger.de/Art_ Detail.cfm?ART_ARTNUM =70.08.121 18 R3, R7 2 330 , SMD0805 541-330ATR-ND 19 R1, R2, R4, R6, R8, R9,R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 20 R5 1 47k , SMD0805 541-47000ATR-ND U1 1 Socket: QFN11T048008_A101121_RGZ48 Manuf.: Yamaichi 22 PCB 1 81 x 76 mm 2 layers 23 Adhesive plastic feet 4 Approximately 6mm width, for example, 3M Bumpons Apply to corners at bottom side 2mm height Part No. SJ-5302 24 MSP430 2 MSP430F5342IRGZ 21 82 Description "DNP Keep vias free of solder" Hardware DNP: R6, R8, R9, R10, R11,R12 DNP: enclosed with kit, supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGZ48C www.ti.com B.16 MSP-TS430RGZ48C Vcc ext int J1 3 2 1 VCC 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 GND TEST/SBWTCK1 RST/NMI JP3 3 2 1 TCK/SBWTCK TMS TDI TDO/SBWTDIO JTAG -> TEST/SBWTCK R7 0R JP4 3 2 1 R4 47k JP5 3 2 PJ.0/TDO 1 DVSS 12 P4.6 11 P4.5 10 P4.4 9 P1.7 8 P1.6 7 P3.7 6 P3.6 5 P3.5 4 P3.4 3 P2.2 2 P2.1 1 DNP 36 35 34 33 32 31 30 29 28 27 26 25 DNP C9 JP7 GND 9 7 5 3 1 JP8 GND J2 Ext_PWR 3 2 PJ.3/TCK 1 100nF C6 DVCC C7 DNP 1uF/10V GND 10 8 6 4 2 DNP If external supply voltage: remove R3 and add R2 (0 Ohm) DNP BOOTST 3 2 PJ.2/TMS 1 HFGND RST/SBWTDIO P2.0 TEST/SBWTCK1 P2.1 DNP C8 DNP JP6 SV2 3 2 PJ.1/TDI 1 JTAG-Mode selection: 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2 SW1 DNP EVQ11 GND HFXOUT HFXIN C5 1.1nF RST/SBWTDIO U1 36_DVSS 35_P4.6 34_P4.5 33_P4.4 32_P1.7 31_P1.6 30_P3.7 29_P3.6 28_P3.5 27_P3.4 26_P2.2 25_P2.1 Target Socket Board for MSP430FR58xx, FR59xx IRGZ MSP-TS430RGZ48C 1.2 Copyright (c) 2009-2015, Texas Instruments Incorporated 3 2 1 83 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback SBW -> C2 DNP LFXIN LFXOUT SV1 1_P1.0 2_P1.1 3_P1.2 4_P3.0 5_P3.1 6_P3.2 7_P3.3 8_P4.7 9_P1.3 10_P1.4 11_P1.5 12_PJ.0_TDO QUARZ5 Q2 2 1 C4 DNP 1 P1.0 2 P1.1 3 P1.2 4 P3.0 5 P3.1 6 P3.2 7 P3.3 8 P4.7 9 P1.3 10 P1.4 11 P1.5 PJ.0/TDO 12 12 11 10 9 8 7 6 5 4 3 2 1 JP1 C3 100nF 1 2 3 4 5 6 7 8 9 10 11 12 R8 0R R9 0R DVCC AVCC 1uF/10V SV4 Q1 LFGND QUARZ5 DNP C1 DNP P1.3 P1.2 P1.1 P1.0 0R R6 0R R5 2 1 JP2 GND DVCC connection by via AVSS DVSS JP11 JP10 JP9 R2 - R3 0R 0R R12 0R R13 R14DNP R11 DNP D3 red (DNP) R10DNP R1 330R D2 yellow (DNP) D1 green GND SV3 DNP SW2 48 AVCC 47 AVSS 46 45 44 AVSS 43 42 41 AVSS 40 P2.4 39 P2.3 38 P2.7 37 DVCC 48_AVCC 47_AVSS 46_LFXOUT 45_LFXIN 44_AVSS 43_HFXOUT 42_HFXIN 41_AVSS 40_P2.4 39_P2.3 38_P2.7 37_DVCC 13_PJ.1_TDI 14_PJ.2_TMS 15_PJ.3/TCK 16_P4.0 17_P4.1 18_P4.2 19_P4.3 20_P2.5 21_P2.6 22_TEST/SBWTCK 23_RST/SBWTDIO 24_P2.0 13 1 PJ.1/TDI 2 PJ.2/TMS 14 3 PJ.3/TCK 15 4 P4.0 16 5 P4.1 17 6 P4.2 18 7 P4.3 19 8 P2.5 20 9 P2.6 21 10 TEST/SBWTCK22 11 RST/SBWTDIO 23 12 P2.0 24 2 1 2 1 2 1 TP1TP2 Figure B-31. MSP-TS430RGZ48C Target Socket Module, Schematic MSP-TS430RGZ48C www.ti.com Connector JTAG For JTAG Tool Jumper JP2 Analog/digital power C5 JP8 JP4 RST/SBWTDIO BOOTST 123 123 123 123 JP5 JP7 JP6 JP2 JP1 R4 DVCC AVCC 123 2 1 SBW int Ext. Pwr. Vcc 123 3 Vcc R2 TDO R3 1 2 JTAG ext PWR Jumper JP1 Open to measure current 10 1 2 TCK TMS TDI J1 Jumper J1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply 14 JTAG Jumpers JP3 to JP8 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector BOOTST For Bootstrap Loader Tool JP3 R7 TEST/SBWTCK 20 25 GND GND J2 MSP-TS430RGZ48C Rev. 1.2 RoHS 15 TP1 Clamshell GND QFN11T048-008 A101121 P1.3 45 C2 C1 C8 P1.0 R1 D1 R10 D2 R6 Q1 R5 R9 R8 C7 Q2 C9 RESET C6 SW1 R13 GND R12 C4 C3 R14 40 TP2 Orient Pin 1 of MSP430 device SW2 1 U1 LEDs connected to P1.0, P1.1, P1.2 via JP9, JP10, JP11 (only D1 assembled) JP9 P1.2 35 JP10 JP11 5 R11 D3 30 P1.1 10 Switch SW1 Device reset Connector J2 External power connector Jumper J1 to "ext" Switch SW2 Connected to P1.3 HF ands LF oscillators with capacitors and resistors to connect pinheads Figure B-32. MSP-TS430RGZ48C Target Socket Module, PCB NOTE: LFOSC and HFOSC pins are swapped at SV1. 42_HFXIN (pin 42) SV1 (pin 7) 43_HFXOUT (pin 43) SV1 (pin 6) 45_LFXIN (pin 45) SV1 (pin 10) 46_LFXOUT (pin 46) SV1 (pin 9) 84 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGZ48C www.ti.com Table B-17. MSP-TS430RGZ48C Bill of Materials Pos 1 Ref Des SV1, SV2, SV3, SV4 Number Per Board 4 Description Digi-Key Part Number 12-pin header, TH Comment DNP: headers and receptacles enclosed with kit. Keep vias free of solder. SAM1029-12-ND : Header : Receptacle 1.1 SV1, SV2, SV3, SV4 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header SAM1213-12-ND : Receptacle 2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP 4 J1, JP3, JP4, JP5, JP6, JP7, JP8 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 5 J2 1 3-pin header, male, TH SAM1035-03-ND 6 JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6, JP7, JP8 10 Jumper 15-38-1024-ND 7 R2, R3, R5, R6, R8, R9, R10, R11, R14 9 DNP, 0805 8 R12, R13, R7 3 0R, 0805 541-000ATR-ND 9 C5 1 1.1nF, CSMD0805 490-1623-2-ND 10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND 11 R4 1 47k, 0805 541-47000ATR-ND 12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND 13 R1 1 330R, 0805 541-330ATR-ND 14 C1, C2, C8, C9 4 DNP, CSMD0805 15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP 16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder 17 JTAG 1 14-pin connector, male, TH HRP14H-ND 18 Q1 1 DNP: MS3V-TR1 (32768kHz, 20ppm, 12.5pF) depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of solder 19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder 20 U1 1 Socket: QFN11T048-008 A101121-001 Manuf.: Yamaichi 20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI. 21 D1 1 green LED, DIODE0805 22 D3 1 red (DNP), DIODE0805 DNP 23 D2 1 yellow (DNP), DIODE0805 DNP 24 TP1, TP2 2 Testpoint 25 Rubber stand off 4 26 PCB 1 79.6 x 91.0 mm Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6, JP7, JP8 DNP DNP P516TR-ND DNP, keep pads free of solder Buerklin: 20H1724 apply to corners at bottom side MSP-TS430RGZ48C Rev. 1.2 2 layers, black solder mask SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 85 12pF C2 not assembled R9 12pF C1 R3 R4 2 13 11 9 7 5 3 1 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 100nF 1 0R R2 DVCC 2 3 4 5 6 7 XIN XOUT 10 11 12 13 14 15 16 10nF 47K VCC TCK TMS TDI TDO C8 R5 U2 MSP64PM Socket: Yamaichi IC51-0644-807 RST/NMI 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 C3 12pF not assembled C4 12pF 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 J3 10 8 6 4 2 BOOTST 9 7 5 3 1 ML10 not assembled J5 TITLE: MSP-TS430PM64 Document Number: PWR3 GND 1 2 3 For BSL usage add: R11 0R R6 R7 R13 R14 MSP430F14x : 0 0 open open MSP430F41x : open open 0 0 If external supply voltage: remove R11 and add R10 (0 Ohm) R10 - REV: 1.2 Sheet: 1/1 MSP-TS430PM64 Target Socket PM64 for F14x and F41x FE16-1-3 GND Date: 3/14/2006 10:46:30 AM Copyright (c) 2009-2015, Texas Instruments Incorporated JTAG ML14 1 C7 + 14 12 10 8 6 4 2 J6 JP1Q Open J6 if LCD is connected 560R 2 remove R8 and add R9 (0 Ohm) If external supply voltage: GND C5 FE16-1-1 0R 0R 0R R14 0R R7 R13 R6 FE16-1-4 XTCLK J2 10uF/10V 10uF/6,3V + C6 JP1Q not assembled J7 1 R1 0R 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 AVCC DVSS AVSS 61 60 59 RST TCK TMS TDI TDO 53 52 51 50 49 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 - LFXTCLK 0R R12 Q1 - R8 reserved for future enhancement LED3 D1 J4 FE16-1-2 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 86 www.ti.com MSP-TS430PM64 B.17 MSP-TS430PM64 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-33. MSP-TS430PM64 Target Socket Module, Schematic MSP-TS430PM64 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool D1 LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Jumper J7 Open to measure current Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-34. MSP-TS430PM64 Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 87 MSP-TS430PM64 www.ti.com Table B-18. MSP-TS430PM64 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 Digi-Key Part No. Comment DNP: C6 DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 16-pin header, TH SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header Place on: J6, J7 11 88 0 Description 2 Jumper 15-38-1024-ND 12 JTAG 1 14-pin connector, male, TH HRP14H-ND 13 BOOTST 0 10-pin connector, male, TH 14 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 15 R3 1 330 , SMD0805 541-330ATR-ND 16 R1, R2, R4, R6, R7, R8, R9, R10, R11, R12, R13, R14 3 0 , SMD0805 541-000ATR-ND 17 R5 1 47k , SMD0805 541-47000ATR-ND 18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 19 PCB 1 78 x 75 mm 2 layers 20 Rubber standoff 4 21 MSP430 22 DNP: Keep vias free of solder select appropriate MSP430F2619IPM MSP430F417IPM Hardware DNP: Keep vias free of solder DNP: R4, R6, R7, R9, R10, R11, R12, R13, R14 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PM64A www.ti.com B.18 MSP-TS430PM64A Vcc 3 2 ext 1 int JP3 2 1 JP2 14 12 10 8 6 4 2 R2 0R JTAG C5 100nF 13 11 9 7 5 3 1 DNP GND J4 R6 330R 3 TEST/SBWTCK 2 A 1 JP5 RST/NMI VCC TCK/SBWTCK TMS TDI TDO/SBWTDIO 3 2 1 JP4 AVCC AVSS Socket: Yamaichi IC51-0644-807 DNP GND R4 47k C3 2.2nF VCC430 RST/SBWTDIO B P1.0 P1.1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 3 2 P7.0/TDO 1 C JP6 J3 3 2 1 JP7 P7.1/TDI D DNP R13 0R TEST/SBWTCK A ADD LCD-CAP! P5.1 3 2 P7.2/TMS 1 E JP8 DNP 9 7 5 3 1 DNP R11 0R DNP RST/SBWTDIO B DNP R10 0R PWR3 GND 1 2 3 3 2 P7.3/TCK 1 F JP9 10 8 6 4 2 R14 0R BOOTST GND J5 Sheet: 1/1 REV: 1.1 If supplied by interface: populate R11 (0R), remove R10 If supplied locally: populate R10 (0R), remove R11 MSP-TS430PM64A MSP-TS430PM64A Target Socket for F4152 TITLE: Document Number: Date: 3/29/2011 3:07:02 PM Copyright (c) 2009-2015, Texas Instruments Incorporated 89 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback JTAG -> 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 SBW -> AVCC J1 VCC430 AVSS C4 100nF 0R R7 XIN Q1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 GND J2 A B F E D C VCC430 C6 10uF/6.3V R1 0R DNP 12pF C2 DNP R5 0R XOUT DNP R3 P5.1 330R JP1 Open JP1 if LCD is connected DNP 12pF C1 XTLGND D1 2 1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 GND GND 1 2 + Figure B-35. MSP-TS430PM64A Target Socket Module, Schematic MSP-TS430PM64A www.ti.com Connector JTAG For JTAG Tool Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector BOOTST For Bootstrap Loader Tool Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J5 External power connector Jumper JP3 to "ext" Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Jumper JP1 Open to disconnect LED D1 LED connected to P5.1 Figure B-36. MSP-TS430PM64A Target Socket Module, PCB 90 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PM64A www.ti.com Table B-19. MSP-TS430PM64A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2, 0 12pF, SMD0805 DNP 2 C3 0 2.2nF, SMD0805 DNP 3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND 4 C4, C5 2 100nF, SMD0805 478-3351-2-ND 5 D1 1 green LED, SMD0805 P516TR-ND 6 J1, J2, J3, J4 0 Description Digi-Key Part No. Comment DNP: Headers and receptacles enclosed with kit. Keep vias free of solder. 16-pin header, TH SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 7 J5, JP3, JP4, JP5, JP6, JP7, JP8, JP9 8 3-pin header, male, TH SAM1035-03-ND 8 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 2 Jumper 15-38-1024-ND Place on: J6, J7 HRP14H-ND 9 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R3, R6 2 330 , SMD0805 541-330ATR-ND 14 R1, R2, R5, R7, R9, R10, R11, R13, R14 2 0 , SMD0805 541-000ATR-ND 15 R4 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi 17 PCB 1 78 x 75 mm 4 layers 18 Rubber stand off 4 19 MSP430 2 12 select appropriate MSP430F4152IPM SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP: Keep vias free of solder DNP: R5, R7, R9, R10, R11, R13, R14 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 91 6 A Vcc int B ext GND 3 2 1 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 to measure supply current JP2 P4.6 P4.7 XIN C D 3 2 1 47K JP9 R4 TEST/SBWTCK VCC430 DNP EVQ11 E RST/SBWTDIO SW1 E 3 2 1 JP8 P1.7/TDO 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 F 3 2 1 JP7 3 2 1 JP6 P1.6/TDI P1.1 P1.0 9 J3 BSLRX 3 BSLTX 1 5 TEST/SBWTCK7 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 G 3 2 1 JP5 VCC P1.5/TMS Ext_PWR J5 P1.4/TCK BSL DNP R10 0R 10 8 DNP R11 0R 6 4 RST/SBWTDIO 2 BSL Interface 4-wire JTAG: Set jumpers J4 to J9 to position 2-3 2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 2-1 JTAG-Mode selection: P6.0/L16 P6.1/L17 P6.2/L18 P6.3/L19 P6.4/L20 P6.5/L21 P6.6/L22 P6.7/L23 P2.0/L24 P2.1/L25 P2.2/L26 P2.3/L27 P2.4/L28 P2.5/L29 P2.6/L30 P2.7/L31 File: MSP-TS430PM64D Datum:9/3/2014 3:08:18 PM G H H Rev.: 1.0 Target Socket Board for MSP430FR413xIPM and MSP430FR203xIPM Titel: MSP-TS430PM64D MSP430FR413xIPM / MSP430FR203xIPM Socket: Yamaichi IC51-0644-807 F 1 2 3 RST/NMI 3 2 1 TCK TMS TDI TDO/SBWTDIO P1.2 P1.1 P1.0 P1.3 SBW ->JP10 JTAG -> JP3 JP4 U1 P4.7/R13 P4.6/R23 P4.5/R33 P4.4/LCDC2 P4.3/LCDC1 P4.2/XOUT P4.1/XIN DVSS DVCC RST/NMI/SBWTDIO TEST/SBWTCK1 P4.0/TA1.1 P8.3/TA1.2 P8.2/TA1CLK P8.1/A1CLK/A9 P8.0/SMCLK/A8 J4 JP1 2 1 R5 R6 D2 DNP 330R DNP LED_Green D3 DNP 330R DNP LED_Green XOUT C6 P4.5 C7 C9 C8 1 1 P4.7 2 2 P4.6 3 3 P4.5 4 4 P4.4 5 5 P4.3 DNP 6 XOUT 6 R3 0R DNP 7 7 XIN R2 0R 8 8 GND 9 VCC430 9 10 10 RST/SBWTDIO 11 11 TEST/SBWTCK 12 12 13 13 14 14 15 15 16 16 Disconnect JP3 and JP4 before BSL use. GND 330R D1 LED_Green R1 SW2 C4 EVQ11 100nF DNP DNP 100nF P4.4 P4.3 J1 D I Seite 1/1 I A3 6 5 4 3 2 1 Copyright (c) 2009-2015, Texas Instruments Incorporated C3 12pF C2 TP1 TP2 12pF C1 DNP 100nF 100nF DNP 100nF DNP C 2 1 2 1 10uF/10V B J2 5 4 3 2 1 A 25 26 27 28 29 30 31 32 Q1 QUARZ5 C5 1.1nF 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 P7.0/L0 P7.1/L1 P7.2/L2 P7.3/L3 P7.4/L4 P7.5/L5 P7.6/L6 P7.7/L7 P3.0/L8 P3.1/L9 P3.2/L10 P3.3/L11 P3.4/L12 P3.5/L13 P3.6/L14 P3.7/L15 P1.7/TA0.1/TDO/A7 P1.6/TA0.2/TDI/TCLK/A6 P1.5/TA0CLK/TMS/A5 P1.4/MCLK/TCK/A4 P1.3/UCA0STE/A3 P1.2/UCA0CLK/A2 P1.1/UCA0RXD/UCA0SOMI/A1 P1.0/UCA0TXD/UCA0SIMO/A0 P5.7/L39 P5.6/L38 P5.5/L37 P5.4/L36 P5.3/UCB0SOMI/UCB0SCL/L35 P5.2/UCB0SIMO/UCB0SDA/L34 P5.1/UCB0CLK/L33 P5.0/UCB0STE/L32 P1.7/TDO 17 P1.6/TDI 18 P1.5/TMS 19 P1.4/TCK 20 21 P1.3 22 P1.2 23 P1.1 24 P1.0 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 92 www.ti.com MSP-TS430PM64D B.19 MSP-TS430PM64D Figure B-37. MSP-TS430PM64D Target Socket Module, Schematic MSP-TS430PM64D www.ti.com Connector JTAG For JTAG Tool 32 30 1 1 2 25 R11 JP3 R1 D1 JP4 R5 D2 R6 D3 20 P1.0 P1.1 P1.2 17 Switch SW2 Connected to P1.3 J1 SW2 C4 C3 Clamshell 35 33 U1 P1.3 10 GND GND C2 R3 Switch SW1 Device reset RESET 45 C8 C9 SW1 R2 C1 5 Connector J5 External power connector Jumper JP1 to "ext" R4 C5 Q1 VCC 40 J5 MSP-TS430PM64D Rev. 1.0 RoHS 1 2 JP6 JP7 JP8 3 1 2 3 1 2 3 1 2 Disconnect JP3 and JP4 before BSL use! 16 Curr. Meas. JP2 Jumper JP2 Open to measure current GND JP5 J2 TP1 3 3 SBW-> JTAG-> 3 ext VCC int 2 R10 1 2 BSL 10 1 2 JP10 JP9 3 2 1 JP1 Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply 14 JTAG Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector BOOTST For Bootstrap Loader Tool C7 C6 48 1 J3 IC51-0644-807 TP2 49 55 60 64 GND Orient Pin 1 of MSP430 device J4 Figure B-38. MSP-TS430PM64D Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 93 MSP-TS430PM64D www.ti.com Table B-20. MSP-TS430PM64D Bill of Materials Pos. No. per Board Ref Des Description Digi-Key Part No. Comment 1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white solder mask 2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder 3 D1 1 Green LED, HSMG-C170, DIODE0805 516-1434-1-ND Avago, Farnell 5790852 4 D2, D3 2 LED, DIODE0805 5 JP2, JP3, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 6 JP1, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG) 7 R1 1 330R, 0805 541-330ATR-ND 8 R5, R6 2 330R, 0805 541-330ATR-ND DNP 9 R2, R3, R10, R11 4 0R, 0805 541-0.0ATR-ND DNP 10 R4 1 47K, 0805 311-47KARTR-ND 11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND 12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND 13 C4 1 100nF, CSMD0805 311-1245-2-ND 14 C6, C7, C8, C9 4 100nF, CSMD0805 311-1245-2-ND 15 C5 1 1.1nF, CSMD0805 490-1623-2-ND 16 J1, J2, J3, J4 1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles, enclosed with kit. Keep vias free of solder. 17 J1, J2, J3, J4 1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles, enclosed with kit. Keep vias free of solder. 18 JTAG 1 14-pin connector, male, TH HRP14H-ND 19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi 20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Is supplied by TI. 21 J5 1 3-pin header, male, TH 22 Q1 1 Microcrystal 32768Hz, MS3V-T1R (32.768kHz, 20ppm, 12.5pF) 23 SW1, SW2 2 24 Rubber stand off 94 4 Panasonic EVQ11 DNP DNP SAM1035-03-ND P8079STB-ND DNP, Lacon: 1251459 Buerklin: 20H1724 apply to corners at bottom side Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PM64F www.ti.com B.20 MSP-TS430PM64F 6 Vcc ext int J1 A 3 2 1 2 1 JTAG 13 11 9 7 5 3 1 B STE RST/NMI JP3 3 2 1 TCK/SBWTCK TMS TDI TDO/SBWTDIO SBW -> JTAG -> GND TEST/SBWTCK1 14 RXD/SIMO TXD/SOMI/SDA12 SPICLK/SCL 10 8 6 4 2 VCC DVCC AVCC C TEST/SBWTCK JP4 3 2 1 47k R4 D DNP EVQ11 JP5 3 2 PJ.0/TDO 1 JP6 E 3 2 PJ.1/TDI 1 Jumpers JP3 to JP8 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. SW1 1.1nF C5 RST/SBWTDIO JP7 3 2 PJ.2/TMS 1 JP8 F G C11 100nF GND 2 1 I2C 2 1 H SPICLK/SCL1 TEST/SBWTCK 9 7 5 3 RXD/SIMO1 1 TXD/SOMI/SDA1 P1.7 P2.1 GND DVCC UART R15 10k JP16 R7 10k 1 2 3 BSL Tool Select: Open = BSL Connector Closed = JTAG Connector JP13 SPICLK/SCL JP15 JP14 RXD/SIMO P2.0 P1.6 TXD/SOMI/SDA J5 LFGND connection by via 3 2 PJ.3/TCK 1 DNP C2 DNP DNP C1 48 47 46 45 P1.0 44 P1.1 43 P1.2 42 P1.3 41 DVCC 40 DVSS 39 38 37 36 35 34 33 P2.0 BSL Rev.: 1.0 I GND J2 DNP Ext_PWR STE Page 1/1 I A3 If external supply voltage: remove R3 and add R2 (0 Ohm) RST/SBWTDIO 10 8 6 4 2 3 2 1 Title: MSP-TS430PM64F Target Socket Board for MSP430FR697x/687x devices H File: MSP-TS430PM64F Date: 10/20/2014 4:38:53 PM G R2 0R R3 0R 2 1 DNP DNP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 Socket: Yamaichi C51-0644-807 F 6 5 4 3 2 1 Copyright (c) 2009-2015, Texas Instruments Incorporated 1 2 SAM1129-16-ND JP1 GND LFXIN LFXOUT MSP430FR697XPM/RGC P9.7/A15/C15 P9.6/A14/C14 P9.5/A13/C13 P9.4/A12/C12 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREFP1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+ P1.2/TA1.1/TA0CLK/COUT/A2/C2 P1.3/TA1.2/A3/C3 DVCC2 DVSS2 P7.4/SMCLK/S11 P7.3/TA0.2/S12 P7.2/TA0.1/S13 P7.1/TA0.0/S14 P7.0/TA0CLK/S15 P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK/S16 QUARZ5 Q1 95 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback C4 SAM1129-16-ND SAM1129-16-ND E JP18 1 2 1 2 JP17 C3 D R6 0R R5 0R 100nF HFXIN HFXOUT AVSS AVCC DVCC DNP DNP AVSS C9 DNP Q2 HFGND QUARZ5 DNP C8 DNP U1 J6 P4.3/UCA0SOMI/UCA0RXD/UCB1STE/S4 P1.4/UCB0CLK/UCA0STE/TA1.0/S3 P1.5/UCB0STE/UCA0CLK/TA0.0/S2 P1.6/UCB0SIMO/UCB0SDA/TA0.1/S1 P1.7/UCB0SOMI/UCB0SCL/TA0.2/S0 R33/LCDCAP P6.0/R23 P6.1/R13/LCDREF P6.2/COUT/R03 P6.3/COM0 P6.4/TB0.0/COM1/S30 P6.5/TB0.1/COM2/S29 P6.6/TB0.2/COM3/S28 P3.0/UCB1CLK/TA3.2/S27 P3.1/UCB1SIMO/UCB1SDA/TA3.3/S26 P3.2/UCB1SOMI/UCB1SCL/TA3.4/S25 C10 DVCC 1 1 2 2 3 3 4 P1.6 4 5 SPICLK/SCL15 6 LCDCAP 6 7 7 8 8 9 9 10 10 11 11 12 12 13 13 14 14 15 15 16 16 LCDCAP GND 100nF C15 4u7 C AVSS C6 J3 100nF GND C7 P1.3 P1.2 P1.1 P1.0 DNP GND 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 DVCC DVSS 0R R8 0R R9 1uF/10V AVSS DVSS JP11 JP10 JP9 1uF/10V DVCC JP2 GND 0R R12 0R R13 R14DNP R11 DNP D3 red (DNP) R10DNP R1 330R D2 yellow (DNP) D1 green GND B SAM1129-16-ND 5 4 3 2 1 A J4 DNP SW2 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S5 DVSS1 DVCC3 DVCC1 DVSS3 TEST/SBWTCK P4.7/UCB1SOMI/UCB1SCL/TA1.2/S6 RST/NMI/SBWTDIO PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1P4.6/UCB1SIMO/UCB1SDA/TA1.1/S7 P4.5/UCB1CLK/TA1.0/S8 PJ.1/TDI/TCLK/MCLK/SRSCG0 P4.4/UCB1STE/TA1CLK/S9 PJ.2/TMS/ACLK/SROSCOFF P5.7/UCA1STE/TB0CLK/S10 PJ.3/TCK/COUT/SRCPUOFF AVSS3 P3.3/TA1.1/TB0CLK/S24 PJ.6/HFXIN P3.4/UCA1SIMO/UCA1TXD/TB0.0/S23 PJ.7/HFXOUT P3.5/UCA1SOMI/UCA1RXD/TB0.1/S22 AVSS2 P3.6/UCA1CLK/TB0.2/S21 PJ.5/LFXOUT P3.7/UCA1STE/TB0.3/S20 PJ.4/LFXIN P2.3/UCA0STE/TB0OUTH/S19 AVSS1 P2.2/UCA0CLK/TB0.4/RTCCLK/S18 AVCC1 P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S17 17 DVSS 17 18 DVCC 18 19TEST/SBWTCK 19 20RST/SBWTDIO 20 21 21PJ.0/TDO 22PJ.1/TDI 22 23PJ.2/TMS 23 24PJ.3/TCK 24 25 25 26 26 27 27 28 28 29 29 30 30 31 31 32RXD/SIMO1 32 2 1 2 1 2 1 TP1TP2 Figure B-39. MSP-TS430PM64F Target Socket Module, Schematic MSP-TS430PM64F www.ti.com BSL Tool Select Jumper JP13 to JP15 Open = BSL Connector Close = JTAG Connector Connector BSL For Bootstrap Loader BSL Interface Select Jumper J16 Close 1-2 for I2C Close 2-3 for UART 10 Close JP17 and JP18 to enable BSL pullups 14 1 2 Connector JTAG For JTAG Tool Jumper J1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply 1 2 R15 Connector J2 External power connector Jumper J1 to "ext" R7 30 20 Switch SW1 Device reset J4 10 15 Clamshell 5 Orient Pin 1 of MSP430 device 1 J3 HF and LF oscillators with capacitors and resistors to connect pinheads IC51-0644-807 D1 R1 D2R10 D3 R11 45 40 C11 Switch SW2 Connected to P1.3 25 U1 35 J5 Jumper JP1, JP2 Open to measure digital or analog current LEDs connected to P1.0, P1.1, P1.2 via JP9, JP10, JP11 (only D1 assembled) Jumper JP3 to JP8 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode 50 55 60 J6 This target board supports UART or I2C BSL configuration. To select the configuration to use, set the jumpers as shown in the following table. Jumper Configuration UART BSL Configuration JP17 and JP18 Open I2C BSL Configuration Close JP16 Close 2-3 (UART) Close 1-2 (I2C) Figure B-40. MSP-TS430PM64F Target Socket Module, PCB 96 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PM64F www.ti.com Table B-21. MSP-TS430PM64F Bill of Materials (BOM) Ref Des Number per Board 1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask 2 JP1, JP2, JP9, JP13, JP14, JP15, 6 2-pin header, male, TH SAM1035-02-ND place jumper on header 3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only 4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder 5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2 6 JP3, JP4, JP5, JP6, JP7, JP8, JP16 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 7 J2 1 3-pin header, male, TH SAM1035-03-ND 8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND Pos. Description DigiKey Part Number Comment DNP 9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND 10 C5 1 1.1nF, CSMD0805 490-1623-2-ND 11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND 12 C15 1 4u7, CSMD0805 445-1370-1-ND 13 R7, R15 1 10k, 0805 541-10KATR-ND 14 R4 1 47k, 0805 541-47KATR-ND 15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND 16 R1 1 330R, 0805 541-330ATR-ND 17 R10, R11 2 330R, 0805 541-330ATR-ND DNP 18 R14 1 47k, 0805 541-47KATR-ND DNP 19 C1, C2, C8, C9 4 DNP, CSMD0805 20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459 21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459 22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND DNP: headers enclosed with kit. Keep vias free of solder. 23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND DNP: receptacles enclosed with kit. Keep vias free of solder. 24 TP1, TP2 2 Testpoint 25 BSL 1 10-pin connector, male, TH HRP10H-ND 26 JTAG 1 14-pin connector, male, TH HRP14H-ND 27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi 28 U1 2 MSP430FR6972IPMR DNP: enclosed with kit. Is supplied by TI. 29 Q1 1 DNP: MS3V-TR1 (32,768kHz/ 20ppm/12,5pF) depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of solder 30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder 516-1434-1-ND Avago, Farnell 5790852 31 D1 1 green LED, HSMG-C170 DIODE0805 32 D3 1 red (DNP), DIODE0805 33 D2 1 yellow (DNP), DIODE0805 34 Rubber stand off 4 DNP DNP DNP, keep pads free of solder DNP DNP Buerklin: 20H1724 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback apply to corners at bottom side Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 97 MSP-TS430RGC64B www.ti.com B.21 MSP-TS430RGC64B Figure B-41. MSP-TS430RGC64B Target Socket Module, Schematic 98 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGC64B www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP1 Open to measure current Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode If the system should be supplied via LDOI (J6), close JP4 and set JP3 to "ext" Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-42. MSP-TS430RGC64B Target Socket Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 99 MSP-TS430RGC64B www.ti.com Table B-22. MSP-TS430RGC64B Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10 3 10uF, 6.3V, SMD0805 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND 10 J1, J2, J3, J4 0 16-pin header, TH SAM1029-16-ND (Header) SAM1213-16-ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 11 J5 , J6 2 3-pin header, male, TH 12 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 13 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 14 Description Digi-Key Part No. 311-1245-2-ND 478-1403-2-ND 15 JTAG 1 14-pin connector, male, TH HRP14H-ND 16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder" 17 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF 18 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 19 Insulating disk to Q2 0 Insulating disk to Q2 http://www.ettinger.de/Art_ Detail.cfm?ART_ARTNUM =70.08.121 20 R3, R7 2 330 , SMD0805 541-330ATR-ND 21 R1, R2, R4, R6, R8, R9,R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 22 R5 1 47k , SMD0805 541-47000ATR-ND U1 1 Socket: QFN11T064-006N-HSP 24 PCB 1 85 x 76 mm 25 Adhesive plastic feet 4 Approximately 6mm width, 2mm height 26 D3,D4 27 MSP430 2 MSP430F5310 RGC 23 100 Comment DNP: Q1 Keep vias free of solder DNP: Q2 Keep vias free of solder DNP: R6, R8, R9, R10, R11,R12 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ-5302 Hardware Apply to corners at bottom side DNP: enclosed with kit, supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGC64C www.ti.com B.22 MSP-TS430RGC64C The MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIO input voltage supplied via header J6 (see Figure B-43). This development platform does not supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device operation. For correct JTAG connection, programming, and debug operation, it is important to follow this procedure: 1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to 0 V. 2. Enable the 1.8-V external DVIO power supply. 3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSPFET430UIF JTAG debugger interface). 4. Connect the MSP-FET430UIF JTAG connector to the target board. 5. Start the debug session using IAR or CCS IDE. For more information on debugging the MSP4and MSP430F525x, see the device-specific data sheets (MSP430F522x: SLAS718; MSP430F525x: SLAS903) and Designing with MSP430F522x and MSP430F521x Devices (SLAA558). For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain, short JP4 with the jumper. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 101 A 13 11 9 7 5 3 1 RST/NMI GND TCK TMS TDI TDO TCK 2 3 1 2 3 JP8 4 THERMAL_4 tbd C4 5 S.G. 9 7 5 3 1 J6 1 2 3 6 J5 0R DVCC 1 2 Size: 0R 1.1 MSP430 Tools TI Friesing Revision: Mentor Pads Logic V9 6 R11 PINHEAD_1X2 JP4 PINHEAD_1X3 GND GND BSL CN-ML10 0 1 8 6 4 2 BOOTST C16 GND C15 4.7uF 1 MSP-TS430RGC64C 100nF GND Comment: PINHEAD_1X3 3 2 1 DVIO Power Circle P1.2/TA0.1 P1.1/TA0.0 TEST/SBWTCK GND Name: SHORTCUT2 J3 12/14/10 Date: 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 tbd C3 XTLGND2 JP9 JP10 1 1 <-- SBW 2 2 I O 3 3 <-- JTAG TDI TDO PINHEAD_1X3 PINHEAD_1X3 GND Design: of Title of Schematic 1 Appr.: Page: Drawing#: 5 MSP-TS430RGC64C.sch Rev.: File: R12 PINHEAD_1X3 Q2 THERMAL_8 JP5 JP6 JP7 1 1 1 TDO 2 2 2 RSTDVCC_SBWTDIO C M 3 3 3 TCK TMS RST/NMI PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3 DVCC QUARZ_4PIN THERMAL_7 R7 330R TEST/SBWTCK THERMAL_6 R9 0R P3.3/UCA0TXD/UCA0SIMO P3.2/UCB0CLK/UCA0STE P3.1/UCB0SOMI/UCB0SCL P3.0/UCB0SIMO/UCB0SDA 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 26MHz/ASX53 THERMAL_5 1 14 12 10 8 6 4 2 JTAG DVSS DVIO P4.0/PM_UCB1STE P4.1/PM_UCB1SIMO P4.2/PM_UCB1SOMI P4.3/PM_UCB1CLK P4.4/PM_UCA1TXD P4.5/PM_UCA1RXD P4.6/PM_NONE P4.7/PM_NONE J4 P2.7/UCB0STE/UCA0CLK 4 A B C D Copyright (c) 2009-2015, Texas Instruments Incorporated R10 0R P7.2/TB0.2 C8 P7.3/TB0.3 3 ext 2 VCC 1 int JP3 P2.3/TA2.0 P3.4/UCA0RXD/UCA0SOMI P7.4/TB0.4 47K U1 MSP430F5229 P2.2/TA2CLK/SMCLK 2.2nF PJ.2/TMS R5 RSTDVCC_SBWTDIO PJ.3/TCK P1.1/TA0.0 JP1 R2 0R AVCC P5.4/XIN P1.0/TA0CLK/ACLK 1 2 P6.0/CB0/A0 P6.3/CB3/A3 P6.2/CB2/A2 P6.1/CB1/A1 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P5.0/A8/VEREF+ P5.1/A9/VEREF- AVSS P5.5/XOUT DVSS DVCC P7.5/TB0.5 P2.1/TA1.2 PINHEAD_1X2 10uF AVSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DVCC 15 16 BSLEN P2.0/TA1.1 C5 J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 RST/NMI P1.7/TA1.0 10uF C10 100nF C14 C13 R8 0R 100nF R6 0R C7 PJ.0/TDO P1.3/TA0.2 C6 100nF DVCC 10uF GND P5.2/XT2IN P1.6/TA1CLK/CBOUT R1 0R 12pF Q1 D1 0R R4 THERMAL_3 C1 12pF 2 R3 330R THERMAL_2 XTLGND C2 1 ??? PJ.1/TDI/TCLK P1.2/TA0.1 P7.0/TB0.0 P2.6/RTCCLK/DMAE0 P5.3/XT2OUT P1.5/TA0.4 P7.1/TB0.1 P2.5/TA2.2 TEST/SBWTCK P1.4/TA0.3 SHC1 GND 470nF C9 GND 3 THERMAL_1 65 66 67 68 69 70 71 72 C M I O 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 P2.4/TA2.1 B C D JP2 2 1 2 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RSTDVCC/SBWTDIO VCORE VCORE 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P1.1/TA0.0 P1.2/TA0.1 1 2 3 4 5 6 7 DVCC 8 9 10 11 12 13 14 15 16 D3 1 J2 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 102 www.ti.com MSP-TS430RGC64C Figure B-43. MSP-TS430RGC64C Target Socket Module, Schematic MSP-TS430RGC64C www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Jumper JP1 Open to measure current Connector BOOTST For Bootstrap Loader Tool Connector J6 External power connector to supply DVIO Jumper JP4 For F524x devices, close. For F522x, F523x, and F525x devices, close only if one power supply is used for VCC and DVIO, and if VCC is not higher then 1.98 V. Otherwise, supply DVIO over J6. Do not close if VCC > 1.98 V, as it may damage the chip. Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Connector J5 External power connector for DVCC Set jumper JP3 to "ext" IMPORTANT NOTE: Rev1.0 of the board does not have connection from pin 4 of BOOTST to pin 64 of MCU. To use BSL, these pins should be connected by a wire. D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-44. MSP-TS430RGC64C Target Socket Module, PCB Hardware 103 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGC64C www.ti.com Table B-23. MSP-TS430RGC64C Bill of Materials Item Qty Reference 1 0 C1, C2 12pF Value CAP, SMD, Ceramic, 0805 Description DNP C1 C2 Comment 2 0 C3, C4 tbd CAP, SMD, Ceramic, 0805 DNP C3 C4 4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805 5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 5 5 C8 2.2nF CAP, SMD, Ceramic, 0805 6 1 C9 470nF CAP, SMD, Ceramic, 0805 7 1 C16 4.7uF CAP, SMD, Ceramic, 0805 8 1 D1 Green LED LED, SMD, 0805 Supplier No. Digi-Key: 311-1245-2-ND Digi-Key: 478-1403-2-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header SAM1029-16-ND : Receptacle SAM1213-16-ND 9 4 J1-J4 16-pin header Pin header 1x16: Grid: 100mil (2.54 mm) 10 2 J5, J6 3-pin header, male, TH Pin header 1x3: Grid: 100mil (2.54 mm) 11 JP5, JP6, JP7, JP8, JP9, JP10 3-pin header, male, TH Pinheader 1x3: Grid: 100mil (2.54 mm) 12 JP3 3-pin header, male, TH Pin header 1x3: Grid: 100mil (2.54 place jumper on pins 1-2 mm) SAM1035-03-ND 13 JP1, JP2, JP4 2-pin header, male, TH Pin header 1x2; Grid: 100mil (2.54 place jumper on header mm) SAM1035-02-ND SAM1035-03-ND place jumpers on pins 2-3 Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 14 10 15 1 JTAG 2x7Pin,Wanne Header, THD, Male 2x7 Pin, Wanne, 100mil spacing HRP14H-ND 16 0 BOOTST 2x5Pin,Wanne Header, THD, Male 2x5 Pin, Wanne, 100mil spacing DNP 17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit. 18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND 19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406 20 2 R3, R7 330 Ohm, SMD0805 21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% DNP: R6, R8, R9, R10, R11,R12 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi R1, R2, R4, R6, R8, R9, R10, R11, R12 22 23 1 24 2 25 4 26 1 104 Jumper SAM1035-03-ND U1 MSP430 MSP430F5229IRGCR 541-330ATR-ND 84 x 76 mm 541-47000ATR-ND 541-000ATR-ND IC, MCU, SMD, 9.15x9.15mm Thermal Pad with Socket apply to corners at bottom side Rubber stand off Rubber stand off PCB 15-38-1024-ND Buerklin: 20H1724 84 x 76 mm Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGC64USB www.ti.com B.23 MSP-TS430RGC64USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-45. MSP-TS430RGC64USB Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 105 MSP-TS430RGC64USB www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP1 Open to measure current USB1 USB connector Connector JTAG For JTAG Tool Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-46. MSP-TS430RGC64USB Target Socket Module, PCB 106 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430RGC64USB www.ti.com Table B-24. MSP-TS430RGC64USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 4 Description Digi-Key Part No. Comment DNP: C1, C2 DNP: C10, C12 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 16-pin header, TH SAM1029-16-ND : Header SAM1213-16-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 Q1 0 Crystal Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134 16 R3, R7 2 330 , SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R12 2 0 , SMD0805 541-000ATR-ND 18 R10 1 100 , SMD0805 Buerklin: 07E500 18 R11 1 1M , SMD0805 18 R5 1 47k , SMD0805 19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber stand off 4 22 MSP430 2 MSP430F5509 RGC 23 Insulating disk to Q2 1 Insulating disk to Q2 http://www.ettinger.de/Art_Deta il.cfm?ART_ARTNUM=70.08.1 21 27 C33 1 220n SMD0603 Buerklin: 53D2074 28 C35 1 10p SMD0603 Buerklin: 56D102 29 C36 1 10p SMD0603 Buerklin: 56D102 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 32 C40 1 0.1u SMD0603 Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 34 IC7 1 TPD4E004 36 LED 0 JP3QE DNP: Q1 Keep vias free of solder DNP: R4, R6, R8, R9, R12 541-47000ATR-ND Buerklin: 20H1724 Apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI Manu: TI SAM1032-03-ND SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 107 MSP-TS430RGC64USB www.ti.com Table B-24. MSP-TS430RGC64USB Bill of Materials (continued) Pos. Ref Des No. Per Board 37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP 40 R13, R15, R16 0 470R Buerklin: 07E564 DNP 41 R33 1 1k4 / 1k5 Buerklin: 07E612 42 R34 1 27R Buerklin: 07E444 43 R35 1 27R Buerklin: 07E444 44 R36 1 33k Buerklin: 07E740 45 S1 0 PB P12225STB-ND DNP 46 S2 0 PB P12225STB-ND DNP 46 S3 1 PB P12225STB-ND 47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885 108 Description Digi-Key Part No. Hardware Comment SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PN80 www.ti.com B.24 MSP-TS430PN80 NOTE: For MSP430F47x and MSP430FG47x devices: Connect pins 7 and 10 (GND) externally to DVSS (see data sheet). Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet). For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1. Figure B-47. MSP-TS430PN80 Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 109 MSP-TS430PN80 www.ti.com Jumper JP2 Open to measure current Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply D1 LED connected to pin 12 Connector J5 External power connector Jumper JP1 to "ext" Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B-48. MSP-TS430PN80 Target Socket Module, PCB 110 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PN80 www.ti.com Table B-25. MSP-TS430PN80 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 D1 1 green LED, SMD0603 475-1056-2-ND 6 J1, J2, J3, J4 0 Description Digi-Key Part No. Comment DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 25-pin header, TH SAM1029-20-ND : Header SAM1213-20-ND : Receptacle 7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND 8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-2 HRP14H-ND 9 10 JTAG 1 14-pin connector, male, TH 11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 13 R3 1 560 , SMD0805 541-560ATR-ND 14 R1, R2, R4, R6, R7, R10, R11, R12 2 0 , SMD0805 541-000ATR-ND 15 R5 1 47k , SMD0805 541-47000ATR-ND 16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi 17 PCB 1 77 x 77 mm 2 layers 18 Adhesive Plastic feet 4 ~6mm width, 2mm height 19 MSP430 2 MSP430FG439IPN 12 DNP: Keep vias free of solder DNP: R4, R6, R7, R10, R11, R12 for example, 3M Bumpons Part Apply to corners at bottom side No. SJ-5302 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP: Enclosed with kit supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 111 MSP-TS430PN80A www.ti.com B.25 MSP-TS430PN80A Figure B-49. MSP-TS430PN80A Target Socket Module, Schematic 112 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PN80A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Jumper JP1 Open to measure current Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J6 If the system is supplied via LDOI, close JP4 and set JP3 to external Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 Figure B-50. MSP-TS430PN80A Target Socket Module, PCB Hardware 113 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PN80A www.ti.com Table B-26. MSP-TS430PN80A Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 2 C3, C4 0 47pF, SMD0805 DNP 3 C6, C7, C10, C12 3 10uF, 6.3V, SMD0805 DNP C10 4 C5, C11, C13, C14, C15 5 100nF, SMD0805 5 C8 1 2.2nF, SMD0805 6 C9 1 470nF, SMD0805 7 C16 1 4.7uF, SMD0805 8 C17 1 220nF, SMD0805 9 D1 1 green LED, SMD0805 P516TR-ND 10 J1, J2, J3, J4 0 20-pin header, TH SAM1029-20-ND (Header) SAM1213-20ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 11 J5 , J6 2 3-pin header, male, TH 12 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 13 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13 HRP14H-ND 14 114 Description Digi-Key Part No. Comment 311-1245-2-ND 478-1403-2-ND 15 JTAG 1 14-pin connector, male, TH 16 BOOTST 0 10-pin connector, male, TH 17 Q1 0 Crystal Micro Crystal MS3V-T1R 32.768kHz, C(Load) = 12.5pF DNP: Q1 Keep vias free of solder 18 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 DNP: Q2 Keep vias free of solder 19 Insulating disk to Q2 0 Insulating disk to Q2 http://www.ettinger.de/Art_ Detail.cfm?ART_ARTNUM =70.08.121 20 D3,D4 2 LL103A Buerklin: 24S3406 21 R3, R7 2 330 , SMD0805 541-330ATR-ND 22 R1, R2, R4, R6, R8, R9,R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 23 R5 1 47k , SMD0805 541-47000ATR-ND 24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi 25 PCB 1 77 x 91 mm 2 layers 26 Adhesive plastic feet 4 Approximately 6mm width, for example, 3M Bumpons Apply to corners at bottom side 2mm height Part No. SJ-5302 27 MSP430 2 MSP430F5329IPN "DNP Keep vias free of solder" Hardware DNP: R6, R8, R9, R10, R11,R12 DNP: enclosed with kit, supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PN80USB www.ti.com B.26 MSP-TS430PN80USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. NOTE: R11 should be populated. Figure B-51. MSP-TS430PN80USB Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 115 MSP-TS430PN80USB www.ti.com Connector JTAG For JTAG Tool Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply Jumper JP1 Open to measure current USB Connector Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP4 Close for USB bus powered device Button S3 BSL invoke Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-52. MSP-TS430PN80USB Target Socket Module, PCB 116 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PN80USB www.ti.com Table B-27. MSP-TS430PN80USB Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14 4 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND 7.1 4 Description Digi-Key Part No. Comment DNP: C1, C2 DNP: C10, C12 DNP: headers and receptacles enclosed with kit. Keep vias free of solder. DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 20-pin header, TH SAM1213-20-ND : Header : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8,JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header JP4 1 SAM1035-02-ND Place jumper only on one pin JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 11 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134" 16 R3, R7 2 330 , SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R12 2 0 , SMD0805 541-000ATR-ND 18 R10 1 100 , SMD0805 Buerklin: 07E500 18 R11 0 1M , SMD0805 18 R5 1 47k , SMD0805 19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber standoff 4 22 MSP430 2 MSP430F5529 23 Insulating disk to Q2 1 Insulating disk to Q2 http://www.ettinger.de/Art_De tail.cfm?ART_ARTNUM=70.0 8.121 27 C33 1 220n Buerklin: 53D2074 28 C35 1 10p Buerklin: 56D102 29 C36 1 10p Buerklin: 56D102 30 C38 1 220n Buerklin: 53D2074 DNP: Q1 Keep vias free of solder DNP: R4, R6, R8, R9, R12 DNP 541-47000ATR-ND Buerklin: 20H1724 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 117 MSP-TS430PN80USB www.ti.com Table B-27. MSP-TS430PN80USB Bill of Materials (continued) 118 Pos. Ref Des No. per Board 31 C39 1 4u7 Buerklin: 53D2086 32 C40 1 0.1u Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 34 IC7 1 TPD4E004 36 LED 0 JP3QE SAM1032-03-ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP 40 R13, R15, R16 0 470R Buerklin: 07E564 DNP 41 R33 1 1k4 Buerklin: 07E612 42 R34 1 27R Buerklin: 07E444 43 R35 1 27R Buerklin: 07E444 44 R36 1 33k Buerklin: 07E740 45 S1 0 PB P12225STB-ND DNP 46 S2 0 PB P12225STB-ND DNP 46 S3 1 PB P12225STB-ND 47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885 Description Digi-Key Part No. Comment Manu: TI Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100 www.ti.com B.27 MSP-TS430PZ100 NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made. Figure B-53. MSP-TS430PZ100 Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 119 MSP-TS430PZ100 www.ti.com Jumper J6 Open to disconnect LED Connector JTAG For JTAG Tool Jumper J7 Open to measure current Connector BOOTST For Bootstrap Loader Tool D1 LED connected to pin 12 Connector J5 External power connection Remove R8 and jumper R9 Orient Pin 1 of MSP430 device Figure B-54. MSP-TS430PZ100 Target Socket Module, PCB 120 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100 www.ti.com Table B-28. MSP-TS430PZ100 Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5 1 100nF, SMD0805 478-3351-2-ND 4 C8 1 10nF, SMD0805 478-1383-2-ND 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND 7 J1, J2, J3, J4 0 Description Digi-Key Part No. Comment DNP: C6 DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 25-pin header, TH SAM1029-25-ND : Header SAM1213-25-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header Place on: J6, J7 10 2 Jumper 15-38-1024-ND 11 JTAG 1 14-pin connector, male, TH HRP14H-ND 12 BOOTST 0 10-pin connector, male, TH 13 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 14 R3 1 330 , SMD0805 541-330ATR-ND 15 R1, R2, R4, R8, R9, R10, R11, R12 3 0 , SMD0805 541-000ATR-ND 16 R5 1 47k , SMD0805 541-47000ATR-ND U1 1 Socket: IC201-1004-008 or IC357-1004-53N 18 PCB 1 82 x 90 mm 19 Adhesive Plastic feet 4 ~6mm width, 2mm height 20 MSP430 2 MSP430FG4619IPZ 17 DNP: Keep vias free of solder DNP: Keep vias free of solder DNP: R4, R9, R10, R12 Manuf.: Yamaichi 2 layers for example, 3M Bumpons Part No. SJ-5302 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Apply to corners at bottom side DNP: enclosed with kit supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 121 MSP-TS430PZ100A www.ti.com B.28 MSP-TS430PZ100A Figure B-55. MSP-TS430PZ100A Target Socket Module, Schematic 122 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100A www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Jumper JP1 Open to measure current Connector BOOTST For Bootstrap Loader Tool Jumper JP2 Open to disconnect LED Connector J5 External power connector Jumper JP3 to "ext" D1 LED connected to P5.1 Orient Pin 1 of MSP430 Device Figure B-56. MSP-TS430PZ100A Target Socket Module, PCB Hardware 123 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100A www.ti.com Table B-29. MSP-TS430PZ100A Bill of Materials Pos. Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 DNP 1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. 2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND 4 C8 1 10nF, SMD0805 478-1358-1-ND 5 C6 0 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 67-1553-1-ND 7 J1, J2, J3, J4 Digi-Key Part No. Comment DNP DNP: Headers and receptacles enclosed with kit.Keep vias free of solder. 25-pin header, TH SAM1029-25-ND : Header SAM1213-25-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3 HRP14H-ND 12 124 0 Description 13 JTAG 1 14-pin connector, male, TH 14 BOOTST 0 10-pin connector, male, TH 15 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 16 R3 1 330 , SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R7, R8, R9, R10, R11, R12 2 0 , SMD0805 541-000ATR-ND 18 R5 1 47k , SMD0805 541-47000ATR-ND 19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi 20 PCB 1 90 x 82 mm 4 layers 21 Rubber standoff 4 22 MSP430 2 DNP: Keep vias free of solder Select appropriate MSP430F47197IPZ Hardware DNP: Keep vias free of solder DNP: R4, R6, R7, R8, R9, R10, R11, R12 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100B www.ti.com B.29 MSP-TS430PZ100B Figure B-57. MSP-TS430PZ100B Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 125 MSP-TS430PZ100B www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP3 to "ext" Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally D1 LED connected to P1.0 Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Jumper JP2 Open to disconnect LED Figure B-58. MSP-TS430PZ100B Target Socket Module, PCB 126 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100B www.ti.com Table B-30. MSP-TS430PZ100B Bill of Materials Position Ref Des No. per Board 1 C1, C2 0 12pF, SMD0805 2 C4, C5, C6 , C7, C8, C9 6 100nF, SMD0805 311-1245-2-ND 3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND 4 C11, C12 1 10 uF / 6.3 V SMD0805 5 C13, C14, C16, C18, C19, C29 6 4.7 uF SMD0805 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND (Header) SAM1213-25ND (Receptacle) DNP: Headers and receptacles enclosed with kit. Keep vias free of solder: 8 J5 1 3-pin header, male, TH 9 JP3, JP5, JP6, JP7, JP8, JP9, JP10 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 on JP5, JP6, JP7, JP8, JP9, JP10 place jumpers on pins 1-2 on JP3, 10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 11 JP11, JP12, JP13 3 4-pin header, male, TH 13 Jumper 15-38-1024-ND HRP14H-ND 12 Description Digi-Key Part No. Comment DNP C12 DNP place jumper on header 1-2 See Pos. 9 and Pos. 10 and Pos. 11 15 JTAG 1 14-pin connector, male, TH 16 BOOTST 0 10-pin connector, male, TH 17 Q1 0 Crystal 21 R3, R7 2 330 , SMD0805 541-330ATR-ND 22 R1, R2, R4, R6, R8, R10, R11 2 0 Ohm, SMD0805 541-000ATR-ND 23 R5 1 47k , SMD0805 541-47000ATR-ND 24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi 25 PCB 1 90 x 82 mm 2 layers 26 Adhesive plastic feet 4 Approximately 6mm width, for example, 3M Bumpons Apply to corners at bottom side 2mm height Part No. SJ-5302 27 MSP430 2 MSP430F6733IPZ "DNP Keep vias free of solder" DNP: Q1 Keep vias free of solder SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP: R4, R6, R8, R10, R11 DNP: enclosed with kit, supplied by TI Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 127 BOOTST 10 8 6 4 2 R10 R11 JTAG DNP DNP 13 11 9 7 5 3 1 0R 0R LDOO C18 100nF C19 100nF GND 1 JP5 2 3 DNP GND JP6 R9 XT2IN R12 XT2OUT TDO 1 RST 2 RST/NMI 3 1 JP4 2 LDOI/LDOO Interface GND R7 330R VCC GND TEST/SBWTCK TCK 1 J6 2 3 Note: If the system should be supplied via LDOI (J6) close JP4 and set JP3 to external LDOI GND RST/NMI TCK TMS TDI TDO RST R5 47K TEST/SBWTCK 2.2nF C8 DVCC1 GND U1 QFP100PZ 0R C TCK 0R D1 1 JP7 2 3 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 M TMS HCTC_XTL_4 DNP Q2G$1 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 P8.2 60 P8.1 59 P8.0 58 57 56 55 54 53 52 51 1 JP8 2 3 C3 DNP I TDI 47pF 47pF DNP C4 J3 DVCC1 1 JP9 2 3 GND O TDO C11 100nF C10 100nF DNP GND 4 3 2 1 VBAT DVCC1 GND 1 JP10<- SBW 2 3 <- JTAG JP11 1 2 3 GND PWR3 MSP430: Ta rget-Socket MSP-TS430PZ100C 1.1 Copyright (c) 2009-2015, Texas Instruments Incorporated 9 7 5 14 12 10 8 6 4 2 R1 0R R6 0R R8 0R R3 330R XTLGND2 VCC D4 Socket: Yamaichi IC201-1004-008 P1.0 3 Q2G$2 TEST/SBWTCK DNP D3 C17 DNP 100nF XIN XOUT 470nF GND P516TR-ND HCTC_XTL_4 LL103A 220nF C21 GND 4 BSL-Rx3 BSL-Tx 1 2 1 LL103A R2 0R AVCC DNP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 C16 P1.2 P1.1 DNP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 AVSS 16 17 18 19 20 21 22 23 24 25 DNP VBAT C15 BSL Interface GND JP3 int GND C5 100nF DVCC1 1 JP1 2 DNP C2 12pF 12pF + C7 4.7uF C12 100nF C9 1 2 ext 3 Vcc C1 J1 C13 100nF 0R R4 J2 RST GND XTLGND1 VCC + C6 AVSS 10uF/6.3V 4.7n 2 1 4 J4 GND JP2 LFXTCLK C14 100nF 10uF/6.3V HCTC_XTL_4 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 HCTC_XTL_4 100 99 98 97 96 C 95 M 94 93 I O 92 91 GND 90 DVCC1 89 88 VBAT 87 VBAK 86 85 84 AVSS 83 82 LDOO 81 LDOI 80 79 PU.1 78 77 PU.0 GND 76 26 27 28 29 30 31 32 33 34 35 P1.1 36 P1.2 37 38 39 40 P1.6 41 P1.7 42 43 44 45 46 47 48 49 50 Q1G$2 3 2 Q1G$1 1 100nF C20 DVCC1 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 128 www.ti.com MSP-TS430PZ100C B.30 MSP-TS430PZ100C J5 Figure B-59. MSP-TS430PZ100C Target Socket Module, Schematic MSP-TS430PZ100C www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP1 Open to measure current Connector JTAG For JTAG Tool JP3 14 1 2 BOOTST J5 R11 VCC JP4 D4 J6 C15 C21 LDOI/LDOO C20 1 2 3 75 1 95 90 85 80 76 Connector J5 External power connector Jumper JP3 to "ext" If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external R9 R12 C4 C3 100 Q2 5 0 70 C10 C11 C16 1 Orient Pin 1 of MSP430 device GND GND R10 JP1 + 1 2 3 123 123 123 123 int JP6 R5 C8 123 R2 SBW JTAG 4 ext R7 1 2 3 GND 1 C5 C7 JP7 J4 2 VBAT DVCC 3 D3 JP5 JP10 JP9 JP8 JTAG Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode 10 Vcc 1 2 Connector BOOTST For Bootstrap Loader Tool JP11 11 C18 C19 Q1 5 J3 0 + 60 R1 C6 65 2 R8 C1 C2 R6 C12 C13 C17 C14 U1 55 C9 R4 26 30 3540 45 50 51 25 J1 J2 D1 LED connected to P1.0 D1 R3 JP2 Jumper JP2 Open to disconnect LED Figure B-60. MSP-TS430PZ100C Target Socket Module, PCB Hardware 129 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100C www.ti.com Table B-31. MSP-TS430PZ100C Bill of Materials Pos. Ref Des Number Per Board Description Digi-Key Part No. Comment 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19, C20 6 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18,17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 4 25-pin header, TH SAM1213-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 7.1 DNP: C1, C2 DNP: C3, C4 DNP: C10, C12,C18, C17 8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8,JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header 10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 BOOTST 1 10-pin connector, male, TH HRP10H-ND 15 Q1 0 Crystal 16 Q2 1 Crystal 17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND 18 R1, R2, R4, R6, R8, R9, R10, R11, R12 3 0 Ohm, SMD0805 541-000ATR-ND 19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND 20 U1 1 Socket: IC357-1004-53N 21 PCB 1 79.5 x 99.5 mm 22 Rubber stand off 4 23 MSP430 2 MSP430F643x 24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042 26 D3, D4 2 LL103A Buerklin: 24S3406 27 JP11 1 4-pin header, male, TH SAM1035-04-ND 28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430 29 C21 1 220nF, SMD0805 Buerklin 53 D 2381 130 DNP, keep vias free of solder DNP: Q1 Keep vias free of solder DNP: Q2 Keep vias free of solder DNP: R6, R8, R9, R10, R11, R12 Manuf.: Yamaichi MSP-TS430PZ100C Rev 1.0 2 layers Buerklin: 20H1724 apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI. Hardware Place jumper on Pin 1 and Pin 2 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100D www.ti.com B.31 MSP-TS430PZ100D Vcc J1 A 3 2 1 VCC 14 12 10 8 6 4 2 JTAG 13 11 9 7 5 3 1 B RST/NMI JP3 3 2 1 TCK/SBWTCK TMS TDI TDO/SBWTDIO GND TEST/SBWTCK1 JTAG -> SBW -> C TEST/SBWTCK JP4 3 2 1 D EVQ11 GND DNP JP5 3 2 PJ.0/TDO 1 JP6 E 3 2 PJ.1/TDI 1 JP7 3 2 PJ.2/TMS 1 JTAG-Mode selection: 4-wire JTAG: Set jumpers JP3 to JP8 to position 2-3 2-wire "SpyBiWire": Set jumpers JP3 to JP8 to position 1-2 SW1 1.1nF C5 RST/SBWTDIO 47k R4 HFXIN HFXOUT JP8 F 3 2 PJ.3/TCK 1 DNP DNP DNP C9 DNP DNP C8 HFGND C7 100nF C6 DVCC 1uF/10V GND G J5 BSLTX H TEST/SBWTCK BSLRX RST/SBWTDIO DVCC ESIVCC C12 GND 9 7 5 3 1 10 8 6 4 2 BSL DNP Rev.: 1.2 I GND J2 Ext_PWR DNP DNP Seite 1/1 I A3 6 5 1 2 3 4 If external supply voltage: remove R3 and add R2 (0 Ohm) 1 JP12 2 DNP 100nF C13 DNP DNP 470nF C14 3 2 1 Bearb.:Petersen 1099/1/001/01.1 GND ESICOM 1uF/10V DNP GND File: MSP-TS430PZ100D Datum:7/9/2013 5:23:25 PM G H Target Socket Board for MSP430FR698xPZ, FR688xPZ Dok: Titel: MSP-TS430PZ100D FE25-1A3 75 75 ESIVCC ESIVCC 74 P9.7/ESICI3/A15/C15 74 73 P9.6/ESICI2/A14/C14 73 72 P9.5/ESICI1/A13/C13 72 71 P9.4/ESICI0/A12/C12 71 70 P9.3/ESICH3/ESITEST3/A11/C11 70 69 P9.2/ESICH2/ESITEST2/A10/C10 69 68 P9.1/ESICH1/ESITEST1/A9/C9 68 67 P9.0/ESICH0/ESITEST0/A8/C8 67 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF66 P1.0 66 P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+65 P1.1 65 P1.2/TA1.1/TA0CLK/COUT/A2/C2 64 P1.2 64 P1.3/ESITEST4/TA1.2/A3/C3 63 P1.3 63 62 P8.7/A4/C4 62 61 P8.6/A5/C5 61 60 P8.5/A6/C6 60 59 P8.4/A7/C7 59 58 DVCC 58 DVCC2 57 DVSS 57 DVSS2 56 P7.4/SMCLK/S13 56 55 P7.3/TA0.2/S14 55 54 P7.2/TA0.1/S15 54 53 P7.1/TA0.0/S16 53 52 P7.0/TA0CLK/S17 52 P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK51 BSLTX51 Socket: Yamaichi IC201-1004-008 F R2 - R3 0R ext int DVCC AVCC DNP DNP E QUARZ5 Q2 2 1 2 1 JP1 100nF C2 DNP C1 LFXIN LFXOUT P4.3/UCA0SOMI/UCA0RXD/UCB1STE P1.4/UCB0CLK/UCA0STE/TA1.0/S1 P1.5/UCB0STE/UCA0CLK/TA0.0/S0 P1.6/UCB0SIMO/USB0SDA/TA0.1 P1.7/UCB0SOMI/UCB0SCL/TA0.2 R33/LCDCAP P6.0/R23 P6.1/R13/LCDREF P6.2/COUT/R03 P6.3/COM0 P6.4/TB0.0/COM1 P6.5/TB0.1/COM2 P6.6/TB0.2/COM3 P2.4/TB0.3/COM4/S43 P2.5/TB0.4/COM5/S42 P2.6/TB0.5/COM6/S41 P2.7/TB0.6/COM7/S40 P10.2/TA1.0/SMCLK/S39 P5.0/TA1.1/MCLK/S38 P5.1/TA1.2/S37 P5.2/TA1.0/TA1CLK/ACLK/S36 P5.3/UCB1STE/S35 P3.0/UCB1CLK/S34 P3.1/UCB1SIMO/UCB1SDA/S33 P3.2/UCB1SOMI/UCB1SCL/S32 IC1 Q1 LFGND QUARZ5 DNP connection by via 100nF C11 GND DNP 1 1 2 2 3 3 4 4 5 5 6 LCDCAP 6 7 7 8 8 9 9 10 10 11 11 12 12 13 13 14 14 15 15 16 16 17 17 18 18 19 19 20 20 21 21 22 22 23 23 24 24 25 25 FE25-1A1 J3 C10 DVCC MSP430FR698XPZ LCDCAP 100nF C15 4u7 DNP D Copyright (c) 2009-2015, Texas Instruments Incorporated C4 DVCC 131 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback C3 DVCC P1.3 P1.2 P1.1 P1.0 GND ESIVSS 1uF/10V AVSS DVSS JP11 JP10 JP9 GND C AVSS AVCC ESICOM JP2 GND 0R R12 0R R13 R14DNP R11 DNP D3 red (DNP) R10DNP R1 330R D2 yellow (DNP) D1 green GND B AVSS 6 5 4 3 2 1 A J4 AVSS 0R R6 0R R5 R8 0R R9 0R GND FE25-1A4 R7 0R 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 DVCC DVSS P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100 DVSS1 99 DVCC3 DVCC1 98 DVSS3 TEST/SBWTCK P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97 XRST/NMI/SBWTDIO P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96 PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1 P10.0/SMCLK/S4 95 PJ.1/TDI/TCLK/MCLK/SRSCG0 P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94 PJ.2/TMS/ACLK/SROSCOFF P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93 PJ.3/TCK/COUT/SRCPUOFF P4.5/UCB1CLK/TA1.0/S7 92 P6.7/TA0CLK/S31 P4.4/UCB1STE/TA1CLK/S8 91 P7.5/TA0.2/S30 P5.7/UCA1STE/TB0CLK/S9 90 P7.6/TA0.1/S29 P5.6/UCA1CLK/S10 89 P10.1/TA0.0/S28 P5.5/UCA1SOMI/UCA1RXD/S11 88 P7.7/TA1.2/TB0OUTH/S27 P5.4/UCA1SIMO/UCA1TXD/S12 87 P3.3/TA1.1/TB0CLK/S26 86 AVSS2 P3.4/UCA1SIMO/UCA1TXD/TB0.0/S25 PJ.5/LFXOUT 85 P3.5/UCA1SOMI/UCA1RXD/TB0.1/S24 PJ.4/LFXIN 84 P3.6/UCA1CLK/TB0.2/S23 83 AVSS1 P3.7/UCA1STE/TB0.3/S22 PJ.6/HFXIN 82 P8.0/RTCCLK/S21 PJ.7/HFXOUT 81 P8.1/DMAE0/S20 80 AVSS3 P8.2/S19 79 AVCC1 P8.3/MCLK/S18 78 ESICOM P2.3/UCA0STE/TB0OUTH 77 ESICI P2.2/UCA0CLK/TB0.4/RTCCLK 76 ESIVSS P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0 26 DVSS 26 27 DVCC 27 28 TEST/SBWTCK28 29 RST/SBWTDIO29 30 PJ.0/TDO 30 31 PJ.1/TDI 31 32 PJ.2/TMS 32 33 PJ.3/TCK 33 34 34 35 35 36 36 37 37 38 38 39 39 40 40 41 41 42 42 43 43 44 44 45 45 46 46 47 47 48 48 49 49 50 BSLRX 50 DNP SW2 J6 FE25-1A2 2 1 2 1 2 1 TP1TP2 Figure B-61. MSP-TS430PZ100D Target Socket Module, Schematic MSP-TS430PZ100D www.ti.com Jumper J1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector JTAG For JTAG Tool 45 40 Vcc int R13 TEST/SBWTCK SBW 1 35 30 Jumper JP3 to JP8 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode C10 J4 26 R4 50 JTAG GND SW1 C5 25 J5 51 J2 TP2 Switch SW1 Device reset RESET JP1 10 C12 C13 C15 JP9 65 C11 Q1 Q2 5 C3 C4 70 80 85 90 J3 1 C2 R6 R5 C1 C8 R9 75 ESIVCC JP12 R7 JP2 AVCC 76 J6 R8 C9 D2 R10 D1 R1 C14 Orient Pin 1 of MSP430 device 1 R12 P1.0 JP11 D3 R11 P1.1 P1.2 JP10 R14 IC1 15 SW2 60 P1.3 RoHS C6 C7 Rev. 1.2 DVCC Switch SW2 Connected to P1.3 MSP-TS430PZ100D 20 55 Jumper JP1 Open to measure current LEDs connected to P1.0, P1.1, P1.2 via JP9, JP10, JP11 (only D1 assembled) PWR J1 ext R3 R2 Vcc GND GND Connector J2 External power connector Jumper J1 to "ext" JTAG BSL Ext. Pwr. 1 2 TDO RST/SBWTDIO 14 1 2 TCK TMS TDI 10 JP8 1 JP7 1 JP6 1 JP5 1 JP4 1 JP3 1 Connector BSL For Bootstrap Loader Tool 95 TP1 HF and LF oscillators with capacitors and resistors to connect pinheads GND 100 Figure B-62. MSP-TS430PZ100D Target Socket Module, PCB 132 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100D www.ti.com Table B-32. MSP-TS430PZ100D Bill of Materials Pos. Ref Des Number Per Board Description Digi-Key Part No. Comment 1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100D Rev 1.2 2 layers, white solder mask 2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 3 JP10, JP11, JP12 3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder 4 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2 5 JP3, JP4, JP5, JP6, JP7, JP8 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 6 J2 1 3-pin header, male, TH SAM1035-03-ND 7 R2, R3, R5, R6, R8, R9 6 0R, 0805 541-0.0ATR-ND 8 R7, R12, R13 3 0R, 0805 541-0.0ATR-ND 9 C5 1 1.1nF, CSMD0805 490-1623-2-ND 10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND 11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND 12 R4 1 47k, 0805 541-47KATR-ND 13 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND 14 C13 1 100nF, CSMD0805 490-1666-1-ND DNP 15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP 16 R1 1 330R, 0805 541-330ATR-ND 17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP 18 R10, R11 2 330R, 0805 541-330ATR-ND DNP 19 R14 1 47k, 0805 541-47KATR-ND DNP 20 C1, C2, C8, C9 4 DNP, CSMD0805 21 SW2 1 EVQ-11L05R P8079STB-ND DNP 22 SW1 1 EVQ-11L05R P8079STB-ND DNP 23 J3, J4, J5, J6 4 25-pin header, TH SAM1029-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header 24 J3, J4, J5, J6 4 25-pin receptacle, TH SAM1213-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Receptacle 25 TP1, TP2 2 Testpoint 26 BSL 1 10-pin connector, male, TH HRP10H-ND 27 JTAG 1 14-pin connector, male, TH HRP14H-ND 28 IC1 1 Socket: IC201-1004-008 29 IC1 1 MSP430FR6989 30 Q1 1 DNP: MS3V-TR1 (32768kHz/20ppm/12,5pF) depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of solder 31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder 32 D1 1 green LED, DIODE0805 P516TR-ND 33 D3 1 red (DNP), DIODE0805 34 D2 1 yellow (DNP), DIODE0805 35 Rubber stand off 4 DNP DNP DNP DNP, keep pads free of solder DNP, keep vias free of solder Manuf. Yamaichi DNP: enclosed with kit. Is supplied by TI DNP DNP Buerklin: 20H1724 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback apply to corners at bottom side Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 133 MSP-TS430PZ5x100 www.ti.com B.32 MSP-TS430PZ5x100 Figure B-63. MSP-TS430PZ5x100 Target Socket Module, Schematic 134 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ5x100 www.ti.com Connector JTAG For JTAG Tool Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Connector BOOTST For Bootstrap Loader Tool Connector J5 External power connector Jumper JP3 to "ext" Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 ofMSP430 device D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED Figure B-64. MSP-TS430PZ5x100 Target Socket Module, PCB Hardware 135 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ5x100 www.ti.com Table B-33. MSP-TS430PZ5x100 Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 1b C3, C4 2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND 3 C5, C10, C11, C12, C13, C14 4 100nF, SMD0805 311-1245-2-ND 4 C8 0 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 67-1553-1-ND 7 J1, J2, J3, J4 Digi-Key Part No. Comment 12pF, SMD0805 DNP 47pF, SMD0805 DNP: Only recommendation. Check your crystal spec. DNP: C12, C14 DNP DNP: headers and receptacles enclosed with kit. Keep vias free of solder. 25-pin header, TH SAM1029-25-ND : Header SAM1213-25-ND : Receptacle 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3 10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2 9 Jumper 15-38-1024-ND Place on JP1, JP2, JP3, JP5, JP6, JP7, JP8, JP9, JP10 HRP14H-ND 12 13 JTAG 1 14-pin connector, male, TH 14 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 16 R3, R7 2 330 , SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R10, R11, R12 3 0 , SMD0805 541-000ATR-ND 18 R5 1 47k , SMD0805 541-47000ATR-ND 19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi 20 PCB 1 90 x 82 mm 2 layers 21 Rubber standoff 4 22 MSP430 2 15 136 0 Description Select appropriate MSP430F5438IPZ Hardware DNP: Keep vias free of solder DNP: R6, R8, R9, R10, R11, R12 Apply to corners at bottom side DNP: Enclosed with kit supplied by TI SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100USB www.ti.com B.33 MSP-TS430PZ100USB Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V. Figure B-65. MSP-TS430PZ100USB Target Socket Module, Schematic SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 137 MSP-TS430PZ100USB www.ti.com Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply Jumper JP1 Open to measure current USB1 USB connector Connector JTAG For JTAG Tool Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1.0 LED1, LED2, LED3 LEDs connected to P8.0, P8.1, P8.2 Jumpers LED 1, 2, 3 Open to disconnect LED1, LED2, LED3 Figure B-66. MSP-TS430PZ100USB Target Socket Module, PCB 138 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100USB www.ti.com Table B-34. MSP-TS430PZ100USB Bill of Materials Pos. Ref Des No. Per Board 1 C1, C2 0 12pF, SMD0805 1.1 C3, C4 2 47pF, SMD0805 2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND 3 C5, C11, C13, C14, C19 5 100nF, SMD0805 311-1245-2-ND 3.1 C10, C12, C18, C17 0 100nF, SMD0805 311-1245-2-ND 4 C8 1 2.2nF, SMD0805 5 C9 1 470nF, SMD0805 478-1403-2-ND 6 D1 1 green LED, SMD0805 P516TR-ND 7 J1, J2, J3, J4 7.1 4 Description 25-pin header, TH Digi-Key Part No. Comment DNP: C1, C2 DNP: C10, C12,C18, C17 SAM1029-25-ND DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header : Receptacle DNP: headers and receptacles enclosed with kit. Keep vias free of solder. : Header : Receptacle 4 25-pin header, TH SAM1213-25-ND 8 J5 1 3-pin header, male, TH SAM1035-03-ND 9 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10 12 13 JTAG 1 14-pin connector, male, TH HRP14H-ND 14 Q1 0 Crystal Micro Crystal MS1V-T1K 32.768kHz, C(Load) = 12.5pF 15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134 16 R3, R7 2 330 , SMD0805 541-330ATR-ND 17 R1, R2, R4, R6, R8, R9, R12 3 0 , SMD0805 541-000ATR-ND 18 R10 1 100 , SMD0805 Buerklin: 07E500 18 R11 1 1M , SMD0603 18 R5 1 47k , SMD0805 19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber stand off 4 22 MSP430 2 MSP430F6638IPZ 23 Insulating disk to Q2 1 Insulating disk to Q2 24 C16 1 4.7 nF SMD0603 27 C33 1 220n SMD0603 Buerklin: 53D2074 28 C35, C36 2 10p SMD0603 Buerklin: 56D102 30 C38 1 220n SMD0603 Buerklin: 53D2074 31 C39 1 4u7 SMD0603 Buerklin: 53D2086 DNP: Q1. Keep vias free of solder DNP: R6, R8, R9, R12 not existing in Rev 1.0 541-47000ATR-ND Buerklin: 20H1724 apply to corners at bottom side DNP: enclosed with kit. Is supplied by TI http://www.ettinger.de/Art_Deta il.cfm?ART_ARTNUM=70.08.1 21 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 139 MSP-TS430PZ100USB www.ti.com Table B-34. MSP-TS430PZ100USB Bill of Materials (continued) Ref Des No. Per Board 32 C40 1 0.1u SMD0603 Buerklin: 53D2068 33 D2, D3, D4 3 LL103A Buerklin: 24S3406 34 IC7 1 TPD4E004 35 LED 0 JP3QE SAM1032-03-ND DNP 36 LED1, LED2, LED3 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP 37 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP 38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612 39 R34 1 27R SMD0603 Buerklin: 07E444 40 R35 1 27R SMD0603 Buerklin: 07E444 41 R36 1 33k SMD0603 Buerklin: 07E740 42 S1, S2, S3 1 PB P12225STB-ND 43 USB1 1 USB_RECEPTACLE FARNELL: 117-7885 44 JP11 1 4-pin header, male, TH SAM1035-04-ND Pos. 140 Description Digi-Key Part No. Comment Manu: TI Hardware DNP S1 and S2. (Only S3) place jumper only on Pin 1 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100AUSB www.ti.com B.34 MSP-TS430PZ100AUSB The development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642x flash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSPTS430PZ100AUSB kit. Free samples can be ordered from www.ti.com/product/MSP430FG6626/samplebuy. 14 12 10 8 6 4 2 100nF C5 R11 1M AVCC C40 0.1u 1 USB1 VBUS C38 220n GND 1 JP9 2 3 C33 220n 1 2 3 JP10 GND O TDO 1 JP4 2 D4 LL103A <- SBW <- JTAG P8.0 P8.1 6 P8.2 GND 4 GND 2 LED-1 1 LED-2 3 LED-3 5 GND 470R D- I TDI 1 2 3 GND LED3 D+ 1 JP8 2 3 C16 4.7n VBAK VBAT DVCC1 GND 470R D- 2 GND SHIELD C3 47pF VCC 4 3 2 1 R13 LED2 D+ 3 4 M TMS C4 GND JP11 C11 100nF C10 100nF DNP DNP P1.6 GND 1.1 Miscellaneous P1.7 S2 5 SHIELD1 1 JP7 2 3 USB Interface C TCK 0R 0R GND J3 DVCC1 GND R16 470R LL103A D2 GND 6 JP6 R12 R9 XT2OUT XT2IN 47pF P8.2 P8.1 P8.0 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 R15 LED1 Target socket board MSP-TS430PZ100AUSB for MSP430FG6626IPZ device S1 C39 4u7 GND GND TDO 1 RST 2 RST/NMI 3 DVCC1 1 JP5 2 3 DNP C18 33k R35 27R 10p C36 GND VCC TCK 100nF C19 DNP 100nF GND TEST/SBWTCK1 U1 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 D1 2 1 R34 27R 10p RST/NMI TCK TMS TDI TDO RST R5 47K DVCC1 TEST/SBWTCK DNP 0R NR 2.2nF C8 R1 0R R14 10uF/6,3V + C6 C14 0R 0R P9.7/S0 P9.6/S1 P9.5/S2 P9.4/S3 P9.3/S4 P9.2/S5 P9.1/S6 P9.0/S7 P8.7/S8 P8.6/UCB1SOMI/UCB1SCL/S9 P8.5/UCB1SIMO/UCB1SDA/S10 DVCC2 DVSS2 P8.4/UCB1CLK/UCA1STE/S11 P8.3/UCA1RXD/UCA1SOMI/S12 P8.2/UCA1TXD/UCA1SIMO/S13 P8.1/UCB1STE/UCA1CLK/S14 P8.0/TB0CLK/S15 P4.7/TB0OUTH/SVMOUT/S16 P4.6/TB0.6/S17 P4.5/TB0.5/S18 P4.4/TB0.4/S19 P4.3/TB0.3/S20 P4.2/TB0.2/S21 P4.1/TB0.1/S22 Socket: Yamaichi IC357-1004-053N R3 330R GND Copyright (c) 2009-2015, Texas Instruments Incorporated R36 141 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback V18 VUSB VBUS PU.1/DM PUR PU.0/DP GND 2 1 C35 13 11 9 7 5 3 1 R6 R8 P6.4/CB4/AD0+/OA0O P6.5/CB5/AD0-/OA0N P6.6/CB6/AD1+/GSW0A P6.7/CB7/AD1-/GSW0B MSP430FG6626IPZ P7.4/CB8/AD2+/OA1O P7.5/CB9/AD2-/OA1N P7.6/CB10/AD3+/GSW1A P7.7/CB11/AD3-/GSW1B P5.0/VREF+/VEREF+ P5.1//A4/DAC0 P5.6/A5/DAC1 NR AVSS1 XOUT XIN AVCC CPCAP P2.0/P2MAP0/DAC0 P2.1/P2MAP1/DAC1 P2.2/P2MAP2 P2.3/P2MAP3 P2.4/P2MAP4/R03 P2.5/P2MAP5 P2.6/P2MAP6/LCDREF/R13 P2.7/P2MAP7/R23 P1.0 Q2G$2 GND GND JTAG C7 R2 0R C17 100nF XOUT XIN 100nF 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 10 11 11 12 12 NR 13 AVSS 13 14 XOUT 14 15 15 XIN 16 16 AVCC 17 CPCAP 17 18 18 19 19 20 20 21 21 22 22 23 23 24 24 25 25 HCTC_XTL_4 Q2G$1 4 3 IO3 4 GND 5 IO4 6 VCC IO2 2 VBUS VUSB 3 2 1 JP3 GND 1 JP1 2 DVCC1 DNP DNP Q3 QUARZ5 12pF C2 DNP 12pF C1 J1 C15 2 1 HCTC_XTL_4 2 1 IO1 1 R33 1k4 PUR PU.0/DP PU.1/DM int ext Vcc GND GND + IC7 AVSS 22nF TPD4E004 DVCC1 C12 100nF DNP GND 2 1 10uF/6,3V 3 C13 100nF C9 470nF XTLGND2 JP2 J4 GND 0R R4 J2 TP2 TP1 100 100 99 99 98 98 97 97 96 96 95 C 95 94 M 94 93 I 93 92 O 92 91 91 90 GND 90 89 DVCC1 89 88 88 87 VBAT 87 86 VBAK 86 85 85 84 84 83 AVSS 83 82 V18 82 81 VUSB 81 80 VBUS 80 79 PU.1/DM 79 78 PUR 78 77 PU.0/DP 77 76 GND 76 P6.3/CB3/A3/OA1IP0 P6.2/CB2/A2/OA0IP0 P6.1/CB1/A1 P6.0/CB0/A0 RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK DVSS3 DVCC3 P5.7/DMAE0/RTCCLK VBAT VBAK P7.3/XT2OUT P7.2/XT2IN AVSS2 V18 VUSB VBUS PU.1/DM PUR PU.0/DP VSSU DVCC1 DVSS1 VCORE LCDCAP/R33 COM0 P5.3/COM1/S42 P5.4/COM2/S41 P5.5/COM3/S40 P1.0/TA0CLK/ACLK/S39 P1.1/TA0.0/S38 P1.2/TA0.1/S37 P1.3/TA0.2/S36 P1.4/TA0.3/S35 P1.5/TA0.4/S34 P1.6/TA0.1/S33 P1.7/TA0.2/S32 P3.0/TA1CLK/CBOUT/S31 P3.1/TA1.0/S30 P3.2/TA1.1/S29 P3.3/TA1.2/S28 P3.4/TA2CLK/SMCLK/S27 P3.5/TA2.0/S26 P3.6/TA2.1/S25 P3.7/TA2.2/S24 P4.0/TB0.0/S23 26 26 27 27 28 28 29 29 30 30 31 31 32 32 33 33 34 P1.0 34 35 35 36 36 37 37 38 38 39 39 40 P1.6 40 41 P1.7 41 42 42 43 43 44 44 45 45 46 46 47 47 48 48 49 49 50 50 AVSS R10 100R S3 XTLGND1 J5 PWR3 Figure B-67. MSP-TS430PZ100AUSB Target Socket Module, Schematic MSP-TS430PZ100AUSB www.ti.com Jumper JP3 1-2 (int): Power supply fromJTAG interface 2-3 (ext): External power supply Jumper JP1 Open to measure current USB1 USB connector Connector JTAG For JTAG Tool 14 Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode 3 2 1 1 2 3 4 VCC GND GND 1 2 Connector J5 External power connector Jumper JP3 to "ext" + 1 1 1 1 2 2 2 2 3 3 3 3 3 3 2 2 1 1 95 90 85 80 76 75 1 100 5 70 Orient Pin 1 of MSP430 device + 10 65 U1 15 60 20 Jumper JP2 Open to disconnect LED 55 26 30 35 40 45 50 51 25 D1 LED connected to P1.0 J2 J1 1 2 3 LED1, LED2, LED3 LEDs connected to P8.0, P8.1, P8.2 Jumpers LED 1, 2, 3 Open to disconnect LED1, LED2, LED3 Figure B-68. MSP-TS430PZ100AUSB Target Socket Module, PCB 142 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PZ100AUSB www.ti.com Table B-35. MSP-TS430PZ100AUSB Bill of Materials Pos. Ref Des No. Per Board 1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask 2 C1, C2 2 12pF, SMD0805 DNP: C1, C2 3 C10, C12, C17, C18 9 100nF, SMD0805 311-1245-2-ND 4 C15 1 22nF, CSMD0805 311-1242-1-ND 5 C16 1 4.7 nF SMD0603 311-1250-1-ND 6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND 7 C33, C38 2 220n SMD0603 Buerklin: 53D2074 8 C35, C36 2 10p SMD0603 Buerklin: 56D102 9 C39 1 4u7 SMD0603 Buerklin: 53D2086 10 C40 1 0.1u SMD0603 Buerklin: 53D2068 11 C5, C11, C13, C14, C19 5 100nF, SMD0805 311-1245-2-ND 12 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND 13 C8 1 2.2nF, CSMD0805 709-1339-1-ND 14 C9 1 470nF, SMD0805 478-1403-2-ND 516-1434-1-ND Description Digi-Key Part No. Comment DNP: C10, C12,C18, C17 15 D1 1 green LED, HSMG-C170 DIODE0805 16 D2, D4 2 LL103A, SOD-80 17 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI 18 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: Headers enclosed in kit. Keep vias free of solder. 19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND DNP: Receptacles enclosed in kit. Keep vias free of solder. 20 J5 1 3-pin header, male, TH SAM1035-03-ND 21 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header 22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 2 23 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2 24 JP5, JP6, JP7, JP8, JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 25 Jumpers for JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11 11 Jumper 15-38-1024-ND 26 JTAG 1 14-pin connector, male, TH HRP14H-ND 27 LED 1 JP3QE SAM1032-03-ND 28 LED1, LED2, LED3 3 FARNELL: 852-9833 DNP 29 MSP430 2 MSP430FG6626IPZ DNP: Free samples can be ordered in the TI Store 30 Q2 1 Crystal 31 Q3 1 MS3V-T1R (32.768kHz/ 20ppm/12.5pF) 32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND 33 R10 1 100R, R0603 541-100GCT-ND 34 R11 1 1M, R0603 541-1.0MGCT-ND 35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND 37 R3 1 330 Ohm, SMD0805 541-330ATR-ND Avago, Farnell 5790852 Buerklin: 24S3406 DNP Q2: 4MHz Buerklin: 78D134 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DNP Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 143 MSP-TS430PZ100AUSB www.ti.com Table B-35. MSP-TS430PZ100AUSB Bill of Materials (continued) Ref Des No. Per Board 38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612 39 R34, R35 2 27R SMD0603 Buerklin: 07E444 40 R36 1 33k SMD0603 41 R5 1 47k Ohm, SMD0805 541-47000ATR-ND 42 R6, R8, R9, R12 4 0 Ohm, SMD0805 541-000ATR-ND DNP 43 S1, S2 1 PB P12225STB-ND DNP 44 S3 1 PB P12225STB-ND 45 TP1, TP2 2 Test point DNP, Keep vias free of solder 46 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi 47 USB1 1 USB Receptacle FARNELL: 117-7885 48 Insulating disk for Q2 1 Insulating disk for Q2 ettinger.de 70.08.121 49 Rubber stand off 4 Pos. 144 Description Digi-Key Part No. Comment Buerklin: 07E740 Buerklin: 20H1724 Hardware Apply to corners at bottom side SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PEU128 www.ti.com B.35 MSP-TS430PEU128 VCC RST/NMI TCK TMS TDI TDO TEST/SBWTCK C JP11 1 2 3 4 TCK R7 330R GND 4.7uF C18 AUXVCC2 GND 4.7uF C19 AUXVCC1 TEST/SBWTCK VCC1 VCC1 GND JP12 1 2 3 4 GND D 1 JP5 2 3 TDO 1 RST 2 RST/NMI 3 VREF GND 470nF C10 GND JP6 PJ.3 TCK E 1 JP7 2 3 VASYS1/2 GND XIN XOUT AUXVCC3 RTCCAP1 RTCCAP0 P1.5/SMCLK/CB0/A5 P1.4/MCLK/SDCLK/CB1/A4 P1.3/ADC10CLK/TACLK/RTCCLK/A3 P1.2/ACLK/TA3.1/A2 P1.1/TA2.1/VEREF+/A1 P1.0/TA1.1/TA0.0/VEREF-/A0 P2.4/PM_TA2.0 P2.5/PM_UCB0SOMI/PM_UCB0SCL P2.6/PM_USB0SIMO/PM_UCB0SDA P2.7/PM_UCB0CLK P3.0/PM_UCA0RXD/PM_UCA0SOMI P3.1/PM_UCA0TXD/PM_UCA0SIMO P3.2/PM_UCA0CLK P3.3/PM_UCA1CLK P3.4/PM_UCA1RXD/PM_UCA1SOMI P3.5/PM_UCA1TXD/PM_UCA1SIMO COM0 COM1 P1.6/COM2 P1.7/COM3 P5.0/COM4 P5.1/COM5 P5.2/COM6 P5.3/COM7 LCDCAP/R33 P5.4/SDCLK/R23 P5.5/SD0DIO/LCDREF/R13 P5.6/SD1DIO/R03 P5.7/SD2DIO/CB2 P6.0/SD3DIO P3.6/PM_UCA2RXD/PM_UCA2SOMI P3.7/PM_UCA2TXD/PM_UCA2SIMO P4.0/PM_UCA2CLK E PJ.2 TMS IC1 1 JP8 2 3 PJ.1 TDI VASYS1/2 GND MSP430F677XIPEU# F 1 JP9 2 3 PJ.0 TDO JP10 1 2 3 ~RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P2.3/PM_TA1.0 P2.2/PM_TA0.2 P2.1/PM_TA0.1 P2.0/PM_TA0.0 P11.5/TACLK/RTCCLK P11.4/CBOUT P11.3/TA2.1 P11.2/TA1.1 P11.1/TA3.1/CB3 P11.0/S0 P10.7/S1 P10.6/S2 P10.5/S3 P10.4/S4 P10.3/S5 P10.2/S6 P10.1/S7 P10.0/S8 P9.7/S9 P9.6/S10 P9.5/S11 P9.4/S12 P9.3/S13 P9.2/S14 P9.1/S15 P9.0/S16 DVSS2 DVSYS P8.7/S17 P8.6/S18 P8.5/S19 P8.4/S20 F <- SBW GND DVDSYS P2.1 P2.0 G RST PJ.3 PJ.2 PJ.1 PJ.0 TEST/SBWTCK <- JTAG 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 J3 H GND DNP BOOTST TP1 TP2 C14 RST R10 0R DNP 10 8 6 4 2 Rev.: DNP R11 0R VCC 1.1 I GND PWR3 I Seite 1/1 Bearb.: Petersen Dok: 1080/1/001/01.1 DNP C9 100nF 4.7uF 100nF GND 9 TEST/SBWTCK 7 5 3 1 P2.1 P2.0 DVDSYS C6 GND H Titel: MSP430: Target-Socket MSP-TS430PEU128 for F6779 MSP-TS430PEU128 File: Datum: 22.05.2012 09:37:33 G 1 2 3 B JTAG 13 11 9 7 5 3 1 XIN XOUT VEREF+ C16 14 12 10 8 6 4 2 DVDSYS DNP DNP 12pF C2 LFXTCLK 12pFDNP C1 AUXVCC3 10uF/6,3V 1 0R R6 2 0R R8 AUXVCC33 4 5 6 7 8 9 10 VEREF+ 11 P1.0 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 LCDCAP 31 32 33 34 35 36 37 38 C4 4.7uF Vcc JP3 1 JP1 2 RST R5 47K DNP GND C3 2.2nF AVCC C13 GND VCC1 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 100nF 4 3 2 1 FE04-1 R2 C8 4.7uF AVSS 100nF 0R 0R JP13 1 2 3 4 P1.0 DNP J1 D A3 6 5 4 3 2 1 Copyright (c) 2009-2015, Texas Instruments Incorporated C17 145 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback J5 VCC C15 4.7uF A int DVCC C11 10uF/6,3V R1 2 1 GND C12 AVSS LCDCAP C29 4.7uF GND C J4 DVDSYS ext VCC1 JP4 C5 100nF GND JP2 GND B J2 100nF C7 100nF 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 0R 6 5 4 3 2 1 A DNP R4 VCORE GND DVCC DVDSYS AUXVCC1 AUXVCC2 VASYS1/2 AVCC AVSS SD6N0 SD6P0 SD5N0 SD5P0 SD4N0 SD4P0 VREF AVSS VASYS1/2 SD3N0 SD3P0 SD2N0 SD2P0 SD1N0 SD1P0 SD0N0 SD0P0 P4.1/PM_UCA3RXD/PM_UCA3SOMI P4.2/PM_UCA3TXD/PM_UCA3SIMO P4.3/PM_UCA3CLK P4.4/PM_UCB1SOMI/PM_UCB1SCL P4.5/PM_UCB1SIMO/PM_UCB1SDA P4.6/PM_UCB1CLK P4.7/PM_TA3.0 P6.1/SD4DIO/S39 P6.2/SD5DIO/S38 P6.3/SD6DIO/S37 P6.4/S36 P6.5/S35 P6.6/S34 P6.7/S33 P7.0/S32 P7.1/S31 P7.2/S30 P7.3/S29 P7.4/S28 P7.5/S27 P7.6/S26 P7.7/S25 P8.0/S24 P8.1/S23 P8.2/S22 P8.3/S21 Q1 QUARZ5 VCC1 GND 470nF C26 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 R3 VCORE DVSS1 DVCC VDSYS AUXVCC1 AUXVCC2 VASYS1 AVCC AVSS1 SD6N0 SD6P0 SD5N0 SD5P0 SD4N0 SD4P0 VREF AVSS2 VASYS2 SD3N0 SD3P0 SD2N0 SD2P0 SD1N0 SD1P0 SD0N0 SD0P0 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 330R D1 1 2 Figure B-69. MSP-TS430PEU128 Target Socket Module, Schematic MSP-TS430PEU128 www.ti.com JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally GND GND 1 3 2 1 3 2 1 3 2 1 JP6 JP7 JP8 JP9 95 14 Connector J5 External power connector Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector JTAG For JTAG Tool 10 80 C14 25 R11 R10 20 2 1 JTAG C2 R6 85 15 1 2 90 IC1 1 1 2 3 JP5 C7 C4 C16 1234 C19 C13 C8 DVCC 2 3 SBW 3 2 1 1234 C6 C9 C26 C10 C15 C17 C5 C11 C18 AUXVCC 3 JTAG AUXVCC1 JP11 4 GND R8 C1 Orient Pin 1 of MSP430 device R5 C3 105 RST/NMI TCK TMS TDI TDO TEST/SBWTCK 100 110 J5 JP10 R7 115 5 10 Jumper JP2 Open to disconnect LED 120 P1.0 JP2 R3 D1 D1 LED connected to P1.0 125 AUXVCC3 JP13 C12 AUXVCC2 JP12 1 R4 128 VCC JP4 J4 GND J1 JP1 R1 R2 TP1 Jumper JP1 Open to measure current Connector BOOTST For Bootstrap Loader Tool 75 2 1 C29 1 30 BOOTST int 70 MSP-TS430PEU128 RoHS Rev. 1.1 ext Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External power supply DVDSYS 65 35 JP3 40 45 50 55 J2 60 64 J3 TP2 GND Figure B-70. MSP-TS430PEU128 Target Socket Module, PCB NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications: * R7 value is changed to 0 instead of 330 . * JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2. * JP5 pin 2 is connected to IC1 pin 97. * BOOTST pin 7 is connected to IC1 pin 97. 146 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-TS430PEU128 www.ti.com Table B-36. MSP-TS430PEU128 Bill of Materials Pos. Ref Des No. Per Board 1 PCB 1 2 D1 3 JP1, JP2, JP4 4 JP5, JP6, JP7, JP8, JP9, JP10 6 5 JP11, JP12, JP13 6 JP3 7 JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11, JP12, JP13 13 8 R1, R2, R4, R6, R8 9 R10, R11 10 C3 11 C13, C14, C16, C17, C18, C19, C29 7 12 C11 13 C12 14 Description Digi-Key Part No. Comment 94x119.4mm, 4 layers MSP-TS430PEU128 Rev. 1.1 4 layers, green solder mask 1 green LED, DIODE0805 516-1434-1-ND 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW) 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC) 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 Jumper WM4592-ND 5 0R, 0805 541-0.0ATR-ND 2 0R, 0805 541-0.0ATR-ND DNP 1 2.2nF, CSMD0805 490-1628-2-ND DNP 4.7uF, 6.3V, CSMD0805 587-1302-2-ND 1 10uF, 6.3V, CSMD0805 445-1372-2-ND 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP 15 R5 1 47K, 0805 311-47KARTR-ND 16 C4, C5, C6, C7, C8, C15 6 100nF, CSMD0805 311-1245-2-ND 17 C9 1 100nF, CSMD0805 311-1245-2-ND 18 R3, R7 2 330R, 0805 541-330ATR-ND 19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND 20 BOOTST 1 10-pin connector, male, TH HRP10H-ND 21 JTAG 1 14-pin connector, male, TH HRP14H-ND 22 IC1 Socket 1 Socket: IC500-1284-009P 23 IC1 2 MSP430F67791IPEU 24 J5 1 3-pin header, male, TH 25 Q1 1 Crystal: MS3V-T1R 32.768kHz 12.5pF 20ppm DNP: Crystal enclosed with kit. Keep vias free of solder 26 TP1, TP2 2 Test point DNP, keep vias free of solder 27 J2,J4 2 28 J2,J4 2 29 J1, J3 2 30 J1, J3 2 31 Rubber feet 4 DNP DNP, keep vias free of solder Manuf. Yamaichi DNP: enclosed with kit. Is supplied by TI SAM1035-03-ND 26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias free of solder. 26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep vias free of solder. 38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias free of solder. 38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep vias free of solder. Rubber feet Buerklin: 20H1724 apply to bottom side corners SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 147 EM430F5137RF900 www.ti.com B.36 EM430F5137RF900 Figure B-71. EM430F5137RF900 Target Board, Schematic 148 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F5137RF900 www.ti.com JTAG connector Jumper JP2 Close EXT for external supply Close INT for JTAG supply Open to measure current jumper JP3 External power connector CON12 Jumper JP1 Spy-Bi-Wire mode VCC GND GND Jumper JP1 Close JTAG position to debug in JTAG mode Open to disconnect LEDs jumper JP5/JP10 LED D2 (red) connected to P3.6 via JP10 Close SBW position to debug in Spy-Bi-Wire mode Push-button S2 connected to P1.7 LED D1 (green) connected to P1.0 via JP5 Footprint for 32kHz crystal Use 0 resistor for R431/R441 to make XIN/XOUT available on connector port5 RF - Crystal Q1 26 MHz Reset button S1 RF - Signal SMA Figure B-72. EM430F5137RF900 Target board, PCB The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder. Hardware 149 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F5137RF900 www.ti.com Table B-37. EM430F5137RF900 Bill of Materials Item Reference No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz 2 C1-C5, C082, C222, C271, C281, C311, C321, C341, C412, C452 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 3 C071 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 16V, 10%, X5R 4 R401 1 RES0402, 47.0K Description Value Manufacturer's Part Number Manufacturer ASX-531(CS) AKER ELECTRONIC 0.1uF 0402YC104KAT2A AVX 0.47uF 0603YD474KAT2A AVX CRCW04024702F100 DALE 09 18 514 6323 HARTING 09 18 510 6323 HARTING 26M 47k 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm 6 CON10 0 HEADER, THU, MALE, 10P, 2X5, 20.32x9.2x9.45mm 7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT MS1V-T1K (UN) MICRO CRYSTAL 22-03-5035 MOLEX 9 Q3 0 UNINSTALLED CRYSTAL, SMT, 3P, MS1V (Customer Supply) 10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA 1k BLM15HG102SN1D MURATA GRM1555C1H101JZ01 MURATA 32.768k 12 L341 1 FERRITE, SMT, 0402, 1.0k, 250mA 13 C293 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF, 50V, 0.25pF, C0G(NP0) 100pF 14 L304 1 INDUCTOR, SMT, 0402, 2.2nH, 0.1nH, 220mA, 500MHz 0.0022u H LQP15MN2N2B02 MURATA 15 L303, L305 2 INDUCTOR, SMT, 0402, 15nH, 2%, 450mA, 250MHz 0.015uH LQW15AN15NG00 MURATA 16 L292, L302 2 INDUCTOR, SMT, 0402, 18nH, 2%, 370mA, 250MHz 0.018uH LQW15AN18NG00 MURATA 17 C291 1 CAPACITOR, SMT, 0402, CERAMIC, 1pF, 50V, 0.05pF, C0G(NP0) 18 C303 1 19 C292, C301C302, C304 20 1pF GRM1555C1H1R0WZ01 MURATA CAPACITOR, SMT, 0402, CERAMIC, 8.2pF, 50V, 0.05pF, C0G(NP0) 8.2pF GRM1555C1H8R2WZ01 MURATA 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF, 50V, 0.05pF, C0G(NP0) 1.5pF GRM1555C1H1R5WZ01 MURATA L291, L301 2 INDUCTOR, SMT, 0402, 12nH, 2%, 500mA, 250MHz 0.012uH 21 C282, C312, C351, C361, C371 5 CAPACITOR, SMT, 0402, CERAMIC, 2pF, 50V, 0.1pF, C0G 22 L1 1 INDUCTOR, SMT, 0402, 6.2nH, 0.1nH, 130mA, 500MHz 23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V 24 R4-R5, R051, R061, R431, R441 0 UNINSTALLED RESISTOR/JUMPER, SMT, 0402, 0 , 5%, 1/16W 24a R7 1 RESISTOR/JUMPER, SMT, 0402, 0 , 5%, 1/16W 150 LQW15AN12NG00 MURATA 2.0pF GRM1555C1H2R0BZ01 Murata 6.2nH LQP15MN6N2B02 Murata B3U-1000P OMRON 0 ERJ-2GE0R00X PANASONIC 0 ERJ-2GE0R00X PANASONIC Hardware Comment DNP DNP DNP SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F5137RF900 www.ti.com Table B-37. EM430F5137RF900 Bill of Materials (continued) Item Reference No. per Board 25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%, 1/16W, 330 330 ERJ-2GEJ331 PANASONIC 26 C431, C441 0 CAPACITOR, SMT, 0402, CER, 12pF, 50V, 5%, NPO 12pF ECJ-0EC1H120J PANASONIC 27 C401 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V, 10%, X7R 0.0022uF ECJ-0EB1H222K PANASONIC 28 R331 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 5% 56k ERJ-2GEJ563 PANASONIC 29 C081, C221, C411, C451 4 CAPACITOR, SMT, 0603, CERAMIC, 10uF, 6.3V, 20%, X5R 10uF ECJ-1VB0J106M PANASONIC 30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 , 5%, 1/16W 0 ERJ-2GE0R00X PANASONIC 31 C041 0 UNINSTALLED CAP CERAMIC 4.7UF 6.3V X5R 0603 4.7uF ECJ-1VB0J475K Panasonic 32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER 33 Q2 0 Crystal, SMT, 32.768 kHz MS3V-T1R Micro Crystal U1 1 DUT, SMT, PQFP, RGZ-48, 0.5mmLS, 7.15x7.15x1mm, THRM.PAD CC430F5137 TI 35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH 37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 38 JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP 39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP 40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 34 Description Value 32.768k Manufacturer's Part Number SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Manufacturer Comment DNP DNP DNP Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 151 EM430F6137RF900 www.ti.com B.37 EM430F6137RF900 Figure B-73. EM430F6137RF900 Target Board, Schematic 152 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F6137RF900 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumper JP2 Close INT for power supply via JTAG interface Close EXT to external power supply (CON12) Jumper JP3 Open to measure current CON12 External power connector Jumper JP2 to "EXT" Jumper JP1 Close JTAG position to debug in 4-wire JTAG mode Close SBW position to debug in Spy-Bi-Wire mode VCC GND GND Jumper JP1 in Spy-Bi-Wire mode Jumpers JP5, JP10 Open to disconnect LEDs D2 LED (red) connected to P3.6 via JP10 Push-button S2 Connected to P1.7 D1 LED (green) connected to P1.0 via JP5 Q2/Q3 Footprint for 32-kHz crystal R541 and R551 Use 0-W resistor to make P5.0 and P5.1 available on connector Port 5 Crystal Q1 RF - 26 MHz Button S1 Reset C392 C422 L451 X1 RF - Signal SMA Figure B-74. EM430F6137RF900 Target Board, PCB The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder. Hardware 153 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F6137RF900 www.ti.com Table B-38. EM430F6137RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-C5, C112, C252, C381, C391, C421, C431, C451, C522, C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 16V, 10%, X5R 0603YD474KAT2A AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No. Manufacturer 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm, 90deg 7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT 10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX 11 C361, C371 2 50V, 5%, 27pF GRM36COG270J50 MURATA 12 L451 1 FERRITE, SMT, 0402, 1.0k, 250mA BLM15HG102SN1D MURATA GRM1555C1H101JZ01 MURATA 13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF, 50V, 0.25pF, C0G(NP0) 14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, 0.2nH, 1000mA, 250MHz LQW15AN2N2C10 MURATA 15 L413, L415 2 INDUCTOR, SMT, 0402, 15nH, 5%, 460mA, 250MHz LQW15AN15NJ00 MURATA 16 L402, L412 2 INDUCTOR, SMT, 0402, 18nH, 5%, 370mA, 250MHz LQW15AN18NJ00 MURATA 17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V, 0.25pF, NP0 GJM1555C1H1R0CB01D MURATA 18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF, 50V, 0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA 19 C402, C411C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF, 50V, 0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA 20 L401, L411 2 INDUCTOR, SMT, 0402, 12nH, 5%, 500mA, 250MHz LQW15AN12NJ00 MURATA 21 C46-C48, C392, C422 5 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF, 50V, 0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 Murata 22 L1 1 INDUCTOR, SMT, 0402, 6.2nH, 0.1nH, 700mA, LQW15AN6N2D00 250MHz Murata 23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON 24 R7 1 RESISTOR/JUMPER, SMT, 0402, 0 , 5%, 1/16W ERJ-2GE0R00X (UN) PANASONIC 25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%, 1/16W, 330 ERJ-2GEJ331 PANASONIC 27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V, 10%, X7R ECJ-0EB1H222K PANASONIC 28 C111, C251, C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 10uF, 6.3V, 20%, X5R ECJ-1VB0J106M PANASONIC 28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC 29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC ERJ-2GE0R00X PANASONIC 30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 , 5%, 1/16W 31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER CC430F6137 TI 61300821121 WUERTH 33 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.PAD 34 JP1 1 Pin Connector 2x4pin 154 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F6137RF900 www.ti.com Table B-38. EM430F6137RF900 Bill of Materials (continued) Pos. Ref Des No. per Board Description Part No. Manufacturer 35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 155 EM430F6147RF900 www.ti.com B.38 EM430F6147RF900 Figure B-75. EM430F6147RF900 Target Board, Schematic 156 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F6147RF900 www.ti.com Connector JTAG For JTAG Tool Connector BOOTST For Bootstrap Loader Tool Jumpers JP6 and JP8 Close 1-2 for Bypass mode Close 2-3 for TPS mode Jumper JP9 TPS status TPS62730 Jumper JP3 Open to measure current CON12 External poser connector Jumper JP2 to "EXT" Jumper JP2 Close INT: Power supply via JTAG interface Close EXT: External power supply Jumpers JP5 and JP10 Open to disconnect LEDs Jumper JP1 Close JTAG position to debug in JTAG mode Close SBW position to debug in Spy-BI-Wire mode D2 LED (red) connected to P3.6 via JP10 Button S2 Connected to P1.7 D1 LED (green) connected to P1.0 via JP5 Orient pin 1 of MSP430 device 32-kHz crystal R554 and R551 Use 0-W resistor to make P5.0 and P5.1 available on connector Port 5 Crystal Q1 RF - 26 MHz SMA1 RF - Signal SMA Button S1 Reset Figure B-76. EM430F6147RF900 Target Board, PCB The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure correct battery insertion regarding the polarity as indicated in battery holder. Hardware 157 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F6147RF900 www.ti.com Table B-39. EM430F6147RF900 Bill of Materials Pos. Ref Des No. per Board 1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, 26MHz ASX-531(CS) AKER ELECTRONIC 2 C1-5 C112 C252 C381 C391 C421 C431 C451 C522 C562 14 CAPACITOR, SMT, 0402, CER, 16V, 10%, 0.1uF 0402YC104KAT2A AVX 3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF, 16V, 10%, X5R 0603YD474KAT2A AVX 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE 09 18 514 6323 HARTING Description Part No. Manufacturer 5 CON11 1 HEADER, THU, MALE, 14P, 2X7, 25.4x9.2x9.45mm, 90deg 7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT 10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX 11 C361, C371 2 50V, 5%, 27pF GRM36COG270J50 MURATA 12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA GRM1555C1H101JZ01 MURATA 13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF, 50V, 0.25pF, C0G(NP0) 14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, 0.2nH, 1000mA, 250MHz LQW15AN2N2C10 MURATA 15 L413 1 Inductor, SMD, 0402, 15nH, 5%, 370mA, 250MHz LQW15AN15NJ00 MURATA 15 L415 1 INDUCTOR,SMT,0402,15nH,5%,460mA,250M Hz LQW15AN15NJ00 MURATA 16 L402, L412 2 Inductor, SMD, 0402, 18nH, 5%, 460mA, 250MHz LQW15AN18NJ00 MURATA 17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V, 0.25pF, NP0 GJM1555C1H1R0CB01D MURATA 18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF, 50V, 0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA 19 C402, C411C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF, 50V, 0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA 20 L1, L401, L411 3 INDUCTOR, SMT, 0402, 12nH, 5%, 500mA, 250MHz LQW15AN12NJ00 MURATA 21 C46-C48, C392 4 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF, 50V, 0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 MURATA 22 L2 1 Inductor, SMD, 0805, 2.2uH, 20%, 600mA, 50MHz LQM21PN2R2MC0 MURATA 23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON 24 R1, R7, R551, R554 4 RESISTOR/JUMPER, SMT, 0402, 0 , 5%, 1/16W ERJ-2GE0R00X (UN) PANASONIC 25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%, 1/16W, 330 ERJ-2GEJ331 PANASONIC 27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V, 10%, X7R ECJ-0EB1H222K PANASONIC 28 C111, C251, C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V, ECJ-1VB0J105K 20%, X5R PANASONIC 28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 PANASONIC 29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC 30 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS, 9.15x9.15x1mm, THRM.PAD CC430F6147 TI 31 158 U1 ECJ-1VB0J475M Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated EM430F6147RF900 www.ti.com Table B-39. EM430F6147RF900 Bill of Materials (continued) Pos. Ref Des No. per Board 33 U2 1 IC, Step Down Converter with Bypass Mode for Low Power Wireless TPS62370 TI 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH 36a JP3, JP5, JP9, JP10 4 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA 38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA 1 CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%, X5R 38 C041 Description Part No. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Manufacturer MURATA Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 159 MSP-FET www.ti.com B.39 MSP-FET The MSP-FET is a powerful flash emulation tool to quickly begin application development on MSP430 microcontrollers. The MSP-FET provides a USB interface to program and debug the MSP430 devices in-system through the JTAG interface or the pin-saving Spy-Bi-Wire (2-wire JTAG) protocol. Furthermore, the USB interface can be used for UART backchannel and MSP target BSL communication. UART and I2C BSL communication modes are supported. The MSP-FET development tool supports development with all MSP430 devices and is designed for use with PCBs that contain MSP430 devices; for example, the MSP430 target socket boards. B.39.1 Features * * * * * USB debugging interface to connect a MSP430 MCU to a PC for real-time in-system programming and debugging Software configurable supply voltage between 1.8 V and 3.6 V at 100 mA Supports JTAG Security Fuse blow to protect code Supports all MSP430 boards with JTAG header Supports both JTAG and Spy-Bi-Wire (2-wire JTAG) debug protocols B.39.2 Release Notes The MSP-FET is supported by MSP Debug Stack (MSPDS) revision 3.4.0.20 and higher. Observe the following MSPDS-specific MSP-FET limitations. B.39.2.1 * * * MSPDS 3.4.0.20 Limitations EEM access to F149 and L092 devices is possible only when JTAG speed is set to slow. Poly Fuse Blow in Spy-Bi-Wire mode is in beta state and is not officially supported. The UART backchannel function is not implemented (even though an additional COM port is shown on the PC). B.39.2.2 MSPDS UART Backchannel Implementation In MSPDS v3.4.1.0 and later, the UART backchannel function is implemented and supported for the MSPFET. The baud rates that are supported depend on the target configuration and the debug settings. Table B-40 shows which baud rates are supported with certain configuration combinations. A green cell with means that the corresponding baud rate is supported without any data loss with the specified combination of settings. A red cell with means that the corresponding baud rate is not supported (data loss is expected) with the specified combination of settings. Table B-40. UART Backchannel Implementation 160 Target MCLK Frequency: 1 MHz 1 MHz 8 MHz 8 MHz 1 MHz 1 MHz 8 MHz 8 MHz Debugger: Active Active Active Active Inactive Inactive Inactive Inactive Flow Control: No Yes No Yes No Yes No Yes 4800 baud 9600 baud 19200 baud 28800 baud 38400 baud 57200 baud 115200 baud Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET www.ti.com Figure B-77. MSP-FET Top View Figure B-78. MSP-FET Bottom View B.39.2.3 MSPDS UART Backchannel Activation Commands The MSP-FET supports two different backchannel UART modes, one with flow control and one without. The different modes can be selected by opening the corresponding COM port with a dedicated baud rate. See Table B-41 for the specific baud rates for each command. NOTE: The baud rates used by these commands cannot be used for communication. If none of the specified commands are transferred before setting the communication baud rate, communication starts with these default settings: 3.3-V target VCC, no flow control mechanism. Table B-41. UART Backchannel Activation Commands Baud Rate Command 9620 Set all backchannel UART pins to high impedance - no current flow into target device 9621 Configure backchannel UART communication without handshake (default start behavior) 9622 Configure backchannel UART communication with handshake 9623 Voltage configuration command. When this command is received, target VCC is set to 3300 mV. After target VCC is configured, it is switched through to the target device. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 161 MSP-FET www.ti.com B.39.2.4 MSPDS MSP Target BSL Activation Commands The MSP-FET can be used for communication with the target device BSL through the I2C and UART protocols. The activation of the different protocols is equivalent to the MSP-FET backchannel UART. See Table B-42 for command details. In MSP-FET BSL communication mode, flow control is not available, because this is not supported by the MSP target device BSL. UART BSL: The MSP-FET BSL UART mode supports the following baud rates: 9600, 14400, 19200, 28800, 38400, 56000, 57600, and 115200. For the BSL UART, 8 + 1 + even parity is used. I2C BSL: The MSP-FET is always the I2C master, and the target device BSL is always the I2C slave. 7-bit I2C addressing mode is used with a fixed I2C slave address of 0x48. NOTE: If the MSP-FET is configured to support BSL communication, debugger functionality is disabled. To switch to debugger mode, either perform a power cycle (unplug the USB cable) or configure the baud rate to 8001. Table B-42. MSP Target BSL Activation Commands Baud Rate 162 Command 2 9620 Set all UART or I C pins to high impedance - no current flow into target device 9601 BSL entry sequence and power up 3.3 V (UART BSL) 100000 or 100001 BSL entry sequence and power up 3.3 V (I2C BSL) 400000 or 400001 BSL entry sequence and power up 3.3 V (I2C BSL) 9623 Power up 3.3 V 8001 Activate debugger Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET www.ti.com B.39.3 Schematics 1 A J1 A C D7 B0530W-7-F USB interface 1 0R R17 B 27R 27R C31 10p 1 VBUS bypass R3 100n R45 1 100n C6 C33 10p 1 C70 4.7u, dnp GND1 R62 100R C 100n C71 GND1 USB BSL activation VBUS5 VBUS PUR PU.0/DP PU.1/DM 1 P6.4/CB4/A4 VUSB A_VCC_DT 2 P6.5/CB5/A5 J5 A_VCC_DT_BSR 1k4 R2 R61 1M 1 VCC_DT_SENSE 3 P6.6/CB6/A6/DAC0 4 P6.7/CB7/A7/DAC1 7 P7.6/CB10/A14/DAC0 5 P7.4/CB8/A12 LED0 8 P7.7/CB11/A15/DAC1 DCDC_TEST VCC_DT_REF 6 P7.5/CB9/A13 VCC_DCDC_REF 9 P5.0/VREF+/VEREF+ DCDC_RST VREF+ 10 P5.1/VREF-/VEREF11 AVCC1 MCU_P2.2 MCU_P2.1 DCDC_PULSE MCU_DMAE0 22 21 20 P2.3/P2MAP3 19 P2.2/P2MAP2 18 P2.1/P2MAP1 17 P2.0/P2MAP0 16 P5.6/ADC12CLK/DMAE0 AVCC_POD FPGA_RESET 12 AVSS1 13 XIN 14 XOUT MCU_P2.3 23 15 AVSS2 MCU_P2.4 24 P2.5/P2MAP5 P2.6/P2MAP6/R03 P2.7/P2MAP7/LCDREF/ DVCC1 D Host MCU 1 U1 3 2 P1 MSP430F6638IPZR 1 1 220n C8 1 1 E P9.3/S4 71 P9.4/S3 72 P9.5/S2 73 P9.6/S1 74 P9.7/S0 75 FPGA_TCK FPGA_TDI FPGA_TMS FPGA_TDO FPGA_TRST MCU_P9.5 VCC_DT2SUPPLY_CTRL PWM_SETVF F HOST_RST P9.2/S5 70 HOST_SDA of A 3/12/2014 4k7 R28 4k7 R30 Rev 1 5 F HOST_SCL VCC_POD33 Debug i/f 27k R76 1n C55 P9.1/S6 69 GND1 P9.0/S7 68 1 MSP-FET Rev 1.2 MCU_P4.1 MCU_P4.2 MCU_P4.3 MCU_P4.4 MCU_P4.5 MCU_P4.6 MCU_P4.7 VCC_DT2TRGT_CTRL MCU_P8.1 MCU_P8.2 MCU_P8.3 DCDC_IO0 VCC_POD33 VCC_SUPPLY2TRGT_CTRL P4.2/TB0.2/S21 52 P4.3/TB0.3/S20 53 P4.4/TB0.4/S19 54 P4.5/TB0.5/S18 55 P4.6/TB0.6/S17 56 P4.7/TB0OUTH/SVMOUT57 P8.0/TB0CLK/S15 58 P8.1/UCB1STE 59 P8.2/UCA1TXD 60 P8.3/UCA1RXD 61 P8.4/UCB1CLK/UCA1ST62 DVSS2 63 DVCC2 64 P8.5/UCB1SIMO 65 P8.6/UCB1SOMI 66 P8.7/S8 67 1 3/12/2014 Number P4.1/TB0.1/S22 51 Title C Size Date Sheet VCC_POD33 C23 1 C5 VCC_POD33 MCU_P2.5 25 P7.2/XT2IN 84 R85 2 4.7u, dnp 1 + R1 10uF/6.3V 0R R50 MCU_P2.6 E 1 2 3 4 Copyright (c) 2009-2015, Texas Instruments Incorporated HOST_TDO 163 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback DCDC_IO1 P5.7/RTCCLK 88 C14 1 TPD4E004DRYR 3 33k R60 AVCC_POD AVCC_POD 0R MCU_P2.7 P2.4/P2MAP4 VCC_POD33 1 HOST_TMS IO4 5 U5 2 IO2 4 5 VCC_POD33 C7 100n 1 C9 100n 1 AVCC1 General power supply DVCC2 VCC_POD33 DVCC3 VCC_POD33 DVCC1 + LED1 D2 PJ.2/TMS 94 IO3 4 3 GND LED D1 MCU_P4.0 100n C18 1 P4.0/TB0.0/S23 VSSU 76 PU.0/DP PU.0/DP 77 PU.1/DM PU.1/DM 79 P3.5/TA2.0/S26 VBUS VBUS 80 VUSB V18 V18 82 P3.2/TA1.1/S29 PUR PUR 78 P3.7/TA2.2/S24 50 P3.6/TA2.1/S25 49 MCU_P3.7 48 MCU_P3.6 47 MCU_P3.5 AVSS3 83 P3.1/TA1.0/S30 VCC_POD33 DVCC3 89 P1.3/TA0.2/S36 81 VUSB P3.4/TA2CLK/SMCLK/S 46 P3.3/TA1.2/S28 MCU_P3.4 C12 C11 C17 1 D MCU_P1.7 45 MCU_P3.3 P7.3/XT2OUT 85 P1.7/TA0.2/S32 41 P3.0/TA1CLK/CBOUT/S VBAK VBAK 86 P1.6/TA0.1/S33 40 MCU_P1.6 HOST_TCK P5.4/COM2/S41 0R, dnp R46 470R 1 C MCU_P1.5 44 MCU_P3.2 VCC_POD33 87 VBAT P1.5/TA0.4/S34 39 P1.4/TA0.3/S35 38 MCU_P1.4 37 MCU_P1.3 43 MCU_P3.1 DVSS3 90 MCU_P1.1 42 MCU_P3.0 P1.2/TA0.1/S37 MCU_P1.2 36 TEST/SBWTCK 91 A_VCC_SUPPLY_HOST A_VBUS5 LCDCAP/R33 P6.0/CB0/A0 97 HOST_TDI PJ.1/TDI/TCLK P5.5/COM3/S40 A_VF P6.1/CB1/A1 98 HOST_TEST P1.1/TA0.0/S38 35 PJ.0/TDO 92 P1.0/TA0CLK/ACLK/S3 34 MCU_P1.0 93 TDIOFF_CTRL PJ.3/TCK 95 VF2TDI_CTRL 33 P5.3/COM1/S42 LED1 32 HOST_RST 31 RST/NMI/SBWTDIO 96 COM0 30 A_VCC_SENSE0_TRGT 99 P6.2/CB2/A2 P5.2/R23 29 10uF/6.3V 1 1 B R47 470R 100 P6.3/CB3/A3 VCORE(2) 26 DVSS1 27 VCORE 28 VF2TEST_CTRL VCC 6 1 IO1 LED0 1 C16 VBAK 470n 220n 4.7n V18 1 11 10 7 6 Additional supply C15 VCORE 2 3 4 68p A VREF+ Figure B-79. MSP-FET USB Debugger, Schematic (1 of 5) B 10n C50 100n C51 10n C52 10n C38 100n C39 10n C40 100n C41 10n C42 10n C48 2 C19 1 C FPGA_IO_TCK FPGA_IO_TDI 1 GND 2 GAA2/IO51RSB1 3 IO52RSB1 4 GAB2/IO53RSB1 5 IO95RSB1 6 GAC2/IO94RSB1 7 IO93RSB1 GEB0/IO74RSB1 GEA1/IO73RSB1 GEA0/IO72RSB1 VMV1 GNDQ MCU_P2.6 1 U2 IO17RSB0 83 MCU_P1.5 GDC2/IO56RSB1 IO18RSB0 82 MCU_P1.6 E MCU_P3.4 D MCU_P1.1 A3PN125-VQG100 1 1 MCU_P3.3 VMV1 GBA1/IO24RSB0 76 R5 1k Title C Size Date GNDQ 75 VMV0 74 GBA2/IO25RSB0 73 IO26RSB0 72 GBB2/IO27RSB0 71 GBC2/IO29RSB0 70 IO31RSB0 69 VCC 68 GND 67 VCCIB0 66 GCC1/IO35RSB0 65 GCC0/IO36RSB0 64 GCA1/IO39RSB0 63 GCA0/IO40RSB0 62 GCB2/IO42RSB0 61 GCC2/IO43RSB0 60 GDC1/IO45RSB0 59 GDC0/IO46RSB0 58 GND 51 VPUMP 52 NC 53 TDO 54 TRST 55 VJTAG 56 GDA1/IO49RSB0 57 Number 3/12/2014 VCC_POD33 MCU_P3.5 MCU_P3.6 MCU_P3.7 MCU_P4.0 MCU_P4.1 VCC_POD15 VCC_POD33 MCU_P4.2 MCU_P4.3 MCU_P4.4 MCU_P4.5 MCU_P4.6 MCU_P4.7 MCU_P8.1 MCU_P8.2 MCU_P8.3 VCC_POD33 27R VCC_POD33 R44 R4 1k 1 MSP-FET Rev 1.2 1 Sheet F FPGA_TRST of A 3/12/2014 FPGA_TDO Rev 2 5 F 1 2 3 4 Copyright (c) 2009-2015, Texas Instruments Incorporated FPGA_DIR_CTRL_TCK FPGA_IO_TMS FPGA_DIR_CTRL_TMS FPGA_DIR_CTRL_TDI 8 IO92RSB1 25 24 23 22 21 20 GEB1/IO75RSB1 19 GEC1/IO77RSB1 18 VCCIB1 17 VCC 16 GFA2/IO83RSB1 15 GFA1/IO84RSB1 14 VCCPLF 13 GFA0/IO85RSB1 12 VCOMPLF 11 GFB0/IO86RSB1 10 GFB1/IO87RSB1 9 GND FPGA_IO_TDO FPGA_DIR_CTRL_TDO MCU_P2.7 FPGA_DIR_CTRL_RST FPGA_IO_TEST VCC_POD33 VCC_POD15 FPGA_DIR_CTRL_TEST FPGA_IO_UART_TXD FPGA_IO_UART_RXD FPGA_DIR_CTRL_UART_TXD FPGA_DIR_CTRL_UART_RXD VCC_POD33 FPGA_IO_UART_CTS 93 A 100n C49 FPGA 10n C34 100n C37 100n C47 GBA0/IO23RSB0 77 E 1 1 1 1 L3 33n 100n C22 1 10n C21 VCC_POD15 + VCC_PLF 10uF/6.3V 100n C20 10n C36 1 100n C35 VCC_POD33 VCC_JTAG 10n C46 1 VCC_POD33 VCC_PUMP 100n C45 MCU_P3.2 TMS VCC_POD33 MCU_P2.5 GAC1/IO07RSB0 D MCU_P3.1 TDI GBB1/IO22RSB0 78 FPGA_TDI 1 C GBB0/IO21RSB0 79 FPGA_TMS VCC_POD15 VCC_POD33 VCC_PLF 10n 1 C44 1 100n 1 C43 B MCU_P3.0 TCK 50 MCU_P1.7 GDA2/IO54RSB1 GBC1/IO20RSB0 80 49 81 48 GBC0/IO19RSB0 47 MCU_P1.4 IO57RSB1 IO60RSB1 40 GDB2/IO55RSB1 FPGA_TCK VCC_POD33 87 VCCIB0 VCCIB1 39 VCC_POD33 46 GND 88 GND 38 2 3 4 A VCC_POD15 45 IO15RSB0 84 44 MCU_P1.3 IO58RSB1 43 MCU_P1.2 IO13RSB0 85 42 IO11RSB0 86 IO59RSB1 41 MCU_P1.0 IO10RSB0 90 IO61RSB1 MCU_DMAE0 100 IO00RSB0 VCC_POD15 VCC 89 VCC 37 MCU_P2.4 GAC0/IO06RSB0 94 IO64RSB1 FPGA_TP2 IO09RSB0 91 36 GAB1/IO05RSB0 95 IO65RSB1 FPGA_TP1 IO62RSB1 FPGA_RESET IO66RSB1 FPGA_TP0 IO08RSB0 92 35 MCU_P2.3 FPGA_IO_RST IO63RSB1 34 GAB0/IO04RSB0 96 33 IO67RSB1 32 MCU_P2.2 31 MCU_P2.1 IO68RSB1 GAA1/IO03RSB0 97 30 GAA0/IO02RSB0 98 29 1 1 1 MCU_P9.5 99 IO01RSB0 FF/GEB2/IO70RSB1 27 FPGA_IO_UART_RTS GEC2/IO69RSB1 28 FPGA_DIR_CTRL_UART_RTS GEA2/IO71RSB1 26 FPGA_DIR_CTRL_UART_CTS SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 164 www.ti.com MSP-FET Figure B-80. MSP-FET USB Debugger, Schematic (2 of 5) MSP-FET www.ti.com 1 B C57 + 4.7u C56 100n C63 DCDCGND C 1 G Q3 D8 1 L4 2 GND1 D 4.7u C29 DCDCGND 100n C53 R57 0.2 GND1 R25 150k VCC_DT_SENSE VCC_SUPPLY GND1 GND1 2.2u C26 DT current measurement shunt DCDCGND DCDCGND OUT 5 INA21XDCK 6 OUT U10 INA214AIDCKT NR 4 2 E 2.2u 2.2u 3 NO2 2 COM1 1 NO1 IN4 12 IN1 13 V+ 14 U20 TS3A4751PWR DCDC calibration switch C72 R56 R64 C69 COM4 10 NO4 11 5 IN2 NO3 8 COM3 9 4 COM2 DCDC_CAL1 6 IN3 TS3A4751PWR 7 GND GND1 Number 3/12/2014 R63 C73 1 DCDC_CAL0 F Rev 3/12/2014 of A 3 5 F GND1 VCC_SUPPLY 2.2u Sheet MSP-FET Rev 1.2 DCDC_CAL2 GND1 VCC_DT_BSR VCC_DT VCC_DT_REF C Size Date VCC_DT A VBUS5 2.2u DCDC_CAL0 D4 C3 Q4 3 U7 TPS73401DDCT 1 IN 2 GND GND1 3 EN GND1 1 VCC_SUPPLY S/W controlled DCDC converter DCDC MCU U4 MSP430G2452PW DVSS 14 XIN/P2.6 13 1 DVCC 2 P1.0/TA0CLK DCDC_CAL2 DCDC_TEST DCDC_RST HOST_SDA B1 E 2 DCDCGND R20 0R Energy measurement method protected under U.S. Patent Application 13/329,073 VCC_POD33 A_VCC_SUPPLY XOUT/P2.7 12 NMI-RST 10 TEST/SBWTCK 11 P1.7/SDI 9 3 P1.1/TA0.0 5 P1.3/ADC10CLK 4 P1.2/TA0.1 6 P1.4/TA0.2 DCDC_CAL1 DCDC_IO0 HOST_SCL DCDCGND C62 10n GND1 GND1 DT level shifter supply VBUS C10 1u GND1 VCC_POD33 DT current sense 10R R49 5 IN4 IN+ E 1 2 3 4 Copyright (c) 2009-2015, Texas Instruments Incorporated 2 S D 3 C1,C2 3 and subsequent patent applications DCDC_PULSE DCDC_IO1 P1.6/TA0.1 8 MSP430G2452PW 33p A_VCC_SUPPLY_HOST 7 P1.5/TA0.0 C66 R6 220k R7 220k C1 VCC_DCDC_REF 1n GND1 A_VCC_SUPPLY VCC_SUPPLY DCDC MCU reference voltage C28 33p 1 3 165 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback R53 R19 2 VCC_DT GND1 C24 1n 1 A1 10R R54 D C54 1n 1 R55 VCC_DT_BSR C R23 180k R24 160k VCC_SUPPLY R65 220k R15 220k 1 DCDC_RST VCC_POD33 DCDC MCU debug i/f 27k, dnp R26 C13 1n, dnp GND1 B C67 10p 2 3 4 A GND V+ REF 2 A2 C65 100n C68 1n GND1 Figure B-81. MSP-FET USB Debugger, Schematic (3 of 5) 1 A L2 33u A C B D10 B0530W-7-F + C74 VF 100u/10V GND1 VF = +5V ... 6.5V GND1 D3 Q1 C30 C BC817-16LT1 330n B GND1 E dnp DDZ9692-7 GND1 47k R29 GND1 TC_TEST_BSR VF2TDI_CTRL VF IN1 VDD U6 ADG821BRMZ-REEL7 S1 S2 D2 D1 IN2 GND U9 ADG821BRMZ-REEL7 IN1 VDD S2 D2 S1 GND IN2 D1 J6 VF VF_TDI VF C VF2TEST_CTRL 47k R22 47k R59 GND1 TC_TDI_FD TC_TDI_BSR GND1 D DIR 5 VCCB 6 B 4 1 VCCA 1 VCCA DIR 5 VCCB 6 B 4 DIR 5 VCCB 6 B 4 1 VCCA 1 VCCA DIR 5 VCCB 6 B 4 DIR 5 VCCB 6 U16 SN74LVC1T45DCKR 3 A 2 GND U15 SN74LVC1T45DCKR 3 A 2 GND U14 SN74LVC1T45DCKR 3 A 2 GND U13 SN74LVC1T45DCKR 3 A 2 GND U12 SN74LVC1T45DCKR DT level shifters VCC_POD33 FPGA_IO_TCK VCC_POD33 FPGA_IO_TMS VCC_POD33 FPGA_IO_TDI VCC_POD33 FPGA_IO_TDO VCC_POD33 1 VCCA B 4 2 GND 3 A E 100n C85 100n C82 F 100n C84 VCC_DT_TRGT 100n C83 C80 FPGA_IO_TEST VCC_POD33 FPGA_IO_UART_TXD VCC_POD33 FPGA_IO_UART_RXD VCC_POD33 FPGA_IO_UART_CTS VCC_POD33 FPGA_IO_UART_RTS 1 VCCA DIR 5 VCCB 6 B 4 2 GND 3 A B 4 DIR 5 VCCB 6 U22 SN74LVC1T45DCKR 1 VCCA 2 GND 3 A DIR 5 VCCB 6 U26 SN74LVC1T45DCKR 1 VCCA B 4 2 GND 3 A DIR 5 VCCB 6 U27 SN74LVC1T45DCKR 1 VCCA B 4 2 GND 3 A DIR 5 VCCB 6 U28 SN74LVC1T45DCKR 1 VCCA GND1 47k R88 GND1 47k R93 GND1 47k R96 GND1 IO6 6 IO7 7 IO8 8 TC_UART_TXD_FD TC_RST_FD TC_UART_RXD_FD TC_UART_RTS_FD B 4 2 GND 3 A FPGA_DIR_CTRL_TEST TC_TEST_FD TC_UART_RTS_FD 3/12/2014 of VCC_DT_TRGT 4 A F 5 Rev FPGA_DIR_CTRL_UART_RTS VCC_DT_TRGT VCC_DT_TRGT TC_UART_CTS_FD FPGA_DIR_CTRL_UART_CTS VCC_DT_TRGT VCC_DT_TRGT TC_UART_RXD_FD FPGA_DIR_CTRL_UART_RXD VCC_DT_TRGT VCC_DT_TRGT TC_UART_TXD_FD FPGA_DIR_CTRL_UART_TXD VCC_DT_TRGT VCC_DT_TRGT 47k, dnp R84 47k R87 47k R94 47k R95 47k 47k R101 R102 1 IO1 IO5 5 GND1 2 IO2 U3 TPD8E003DQDR 3 IO3 1 VCC_DT_TRGT 100n 100n TC_TCK_FD 4 IO4 TPD8E003DQD TC_UART_CTS_FD 1 Number 3/12/2014 Sheet MSP-FET Rev 1.2 VCC_JTAGLDO_TRGT C Size Date GND1 C79 TC_TEST_BSR GND1 100n IO8 8 TC_TMS_FD U17 SN74LVC1T45DCKR C78 IO7 7 VCC_POD33 100n 1 IO1 IO6 6 E 47k R86 C77 VCC_DT_TRGT FPGA_DIR_CTRL_TCK TC_TCK_FD VCC_DT_TRGT VCC_DT_TRGT FPGA_DIR_CTRL_TMS TC_TMS_FD VCC_DT_TRGT VCC_DT_TRGT FPGA_DIR_CTRL_TDI TC_TDI_FD VCC_DT_TRGT VCC_DT_TRGT FPGA_DIR_CTRL_TDO TC_TDO_FD VCC_DT_TRGT VCC_DT_TRGT FPGA_DIR_CTRL_RST TC_RST_FD 2 IO2 VCC_DT_TRGT 3 IO3 47k R100 47k R97 47k R92 47k R89 47k R27 VCC_POD33 47k R31 GND1 47k R90 GND1 47k R91 GND1 47k R98 GND1 47k R99 GND1 ESD protection VCC_SUPPLY_TRGT 4 IO4 U21 TPD8E003DQDR TC_TDO_FD TPD8E003DQD IO5 5 TC_TDI_BSR 1 VCC_SENSE0_TRGT FPGA_IO_RST 1 1 Fuse blow step-up converter VBUS PWM_SETVF C D6 DNP B0530W-7-F A VCC_DT VCC_DT_TRGT 47k R58 VF_TEST Fuse voltage multiplexer / VCC_DT to level shifters TC_TEST_FD VCC_POD33 47k R48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 D 1 2 3 4 Copyright (c) 2009-2015, Texas Instruments Incorporated 1 1 1 1 1 R13 100R 1 TDIOFF_CTRL 1 1 GND1 1 1 1 1 R14 D5 2k2 dnp MMSZ5232B-7-F 1 TC_TDO_FD R41 100R R40 100R R39 100R R38 100R R37 100R R34 100R R33 100R R32 100R R35 100R Target MCU connector VCC_SUPPLY_TRGT VF_TDI TC_TDI_BSR TC_TMS_FD VCC_SENSE0_TRGT VCC_JTAGLDO_TRGT TC_TCK_FD TC_TEST_BSR VF_TEST TC_RST_FD TC_UART_CTS_FD TC_UART_RTS_FD TC_UART_TXD_FD C VCC_DT2TRGT_CTRL R42 1k TC_UART_RXD_FD R43 100R B 9 GND 2 3 4 A 9 GND SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware 166 www.ti.com MSP-FET Figure B-82. MSP-FET USB Debugger, Schematic (4 of 5) MSP-FET www.ti.com 1 2 3 4 VBUS A 10n C25 3 EN2 2 IN 1 EN1 GND 4 OUT2 5 OUT1 6 U19 TLV7111533D MSP-FET power supply 1u C3 33p B 1u C59 PWRGND U18 1u C61 PWRGND 1 GND1 47k R16 VCC_POD15 R36 150k R12 270k VF VCC_SUPPLY_TRGT A_VBUS5 GND1 VCC_DT VCC_POD33 GND 6 IN2 7 COM1 8 NO2 5 33p C27 TS5A21366RSE 4 COM2 3 IN1 2 V+ 1 NO1 TS5A21366RSER PWRGND VBUS5 R51 240k A_VCC_SENSE0_TRGT R52 150k 1 B 1 A_VF C R79 150k R78 150k VCC_DT VCC_DT2SUPPLY_CTRL C4 33p C 1 C32 33p R9 150k VCC_DT_BSR A_VCC_DT R18 150k 1 C2 33p D D TP9 TP3 TP2 TP1 TP0 DCDC_IO0 DCDC_PULSE GND1 VBUS VCC_SUPPLY Test points A_VCC_DT_BSR E E TP4 TP5 TP6 TP7 TP8 C Size Date FPGA_TP0 FPGA_TP1 FPGA_TP2 GND1 DCDC_IO1 J2 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 HEADER_1X8_50MIL_A J3 J4 HEADER_1X8_50MIL_A 1 2 3 4 5 6 7 8 HEADER_1X8_50MIL_A TP11 F VBUS HOST_TEST HOST_TDO HOST_TDI HOST_TMS HOST_TCK HOST_RST VCC_DT GND1 A_VCC_SUPPLY_HOST DCDC_RST DCDC_TEST VCC_POD33 VCC_POD15 of GND1 3/12/2014 A 5 5 F FPGA_TRST FPGA_TCK FPGA_TMS FPGA_TDI FPGA_TDO HOST_SCL HOST_SDA VBUS5 MSP-FET Rev 1.2 1 Rev Common debug and test i/f Number 3/12/2014 Sheet 1 2 3 4 Copyright (c) 2009-2015, Texas Instruments Incorporated 167 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback C58 PWRGND PWRGND VCC_SUPPLY_TRGT VBUS VCC_SUPPLY Target power switch VCC_SUPPLY2TRGT_CTRL 47k R21 GND1 1 Analog inputs to Host MCU R11 150k R10 150k VCC_SENSE0_TRGT A R80R Figure B-83. MSP-FET USB Debugger, Schematic (5 of 5) MSP-FET www.ti.com B.39.4 Layout Figure B-84. MSP-FET USB Debugger, PCB (Top) Figure B-85. MSP-FET USB Debugger, PCB (Bottom) B.39.5 LED Signals The MSP-FET shows its operating states using two LEDs, one green and one red. Table B-43 lists all available operation modes. An or icon indicates that the LED is off, an or icon indicates that the LED is on, and an or icon indicates that the LED flashes. Table B-43. MSP-FET LED Signals Function Power LED Mode LED MSP-FET not connected to PC, or MSP-FET not ready; for example, after a major firmware update. Connect or reconnect MSP-FET to PC. MSP-FET connected and ready MSP-FET waiting for data transfer Ongoing data transfer An error has occurred; for example, target VCC overcurrent. Unplug MSP-FET from target, and cycle the power off and on. Check target connection, and reconnect MSP-FET. Firmware update in progress. Do not disconnect MSP-FET while both LEDs are blinking. FPGA update in progress. Do not disconnect MSP-FET while both LEDs are blinking rapidly. 168 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET www.ti.com B.39.6 JTAG Target Connector Figure B-86 shows the pinout of the JTAG connector. Figure B-86. JTAG Connector Pinout Table B-44. JTAG Connector Pin State by Operating Mode Pin Name After Power-Up When JTAG Protocol is Selected When Spy-Bi-Wire Protocol is Selected 1 TDO/TDI Hi-Z, pulled up to 3.3 V In, TDO In and Out, SBWTDIO 2 VCC_TOOL 3.3 V VCC 3 TDI/VPP Hi-Z, pulled up to 3.3 V Out, TDI Hi-Z, pulled up to VCC 4 VCC_TARGET In, external VCC sense In, external VCC sense 5 TMS Hi-Z, pulled up to 3.3 V Out, TMS Hi-Z, pulled up to VCC 6 N/C N/C N/C 7 TCK Hi-Z, pulled up to 3.3 V Out, TCK Out, SBWTCK 8 TEST/VPP Out, Gnd Out, TEST Hi-Z, pulled up to VCC 9 GND Ground Ground Ground 10 UART_CTS/SPI_CLK/I2C_SCL Hi-Z, pulled up to 3.3 V Out, Target UART Clear-ToSend Handshake input Out, Target UART Clear-ToSend Handshake input 11 RST Out, VCC Out, RST Out 12 UART_TXD/SPI_SOMI/I2C_SDA Hi-Z, pulled up to 3.3 V In, Target UART TXD output 13 UART_RTS Hi-Z, pulled up to 3.3 V 14 UART_RXD/SPI_SIMO Hi-Z, pulled up to 3.3 V Out, Target UART RXD input VCC In, external VCC sense N/C In, Target UART Ready-toSend Handshake output SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback In, Target UART TXD output In, Target UART Ready-toSend Handshake output Out, Target UART RXD input Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 169 MSP-FET www.ti.com Figure B-87 shows the state of each pin in the connector after power-up. Pin Signal - USB Power 2 VCC_TOOL 1 TDO/TDI 3 TDI 5 TMS 7 TCK 8 TEST 11 RST 12 UART_TXD 14 UART_RXD 10 UART_CTS 13 UART_RTS Figure B-87. Pin States After Power-Up 170 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET www.ti.com B.39.7 Specifications Table B-45 shows the physical and electrical specifications of the MSP-FET. Table B-45. Specifications Mechanical Size (without cables) 80 mm x 50 mm x 20 mm Interfaces USB interface USB 2.0, full speed Target interface JTAG 14-pin JTAG cable length 20 cm (max) Power supply USB powered, 200 mA (max) Target output voltage VCC_TOOL 1.8 V to 3.6 V Selectable in 0.1-V steps. VCC_TOOL available from JTAG pin 2. Target output current 100 mA (max) Current supplied through JTAG pin 2 Target output overcurrent detection level 160 mA (max) JTAG signal overcurrent detection level 30 mA (max) Total current supplied through JTAG pins 1, 3, 5, 7, 8, 10, 11, 12, 13, 14 External target supply Supported (1.8 V to 3.6 V) Connect external target voltage VCC_TARGET to JTAG pin 4. JTAG and SBW signals are regulated to external target voltage 100 mV. Fuse blow Supported For devices with poly-fuse See Table B-44 for pinout JTAG and Spy-Bi-Wire Interface, Electrical JTAG and Spy-Bi-Wire Interface, Timing JTAG clock speed 8 MHz (max) Protocol speed selectable by software SpyBiWire clock speed 8 MHz (max) Protocol speed selectable by software. System limitations due to external RC components on reset pin (SBWTDIO) might apply. JTAG and Spy-Bi-Wire Interface, Speed Flash write speed (JTAG) Up to 20 kB/sec Flash write speed (SpyBiWire) Up to 7 kB/sec FRAM write speed (JTAG) Up to 50 kB/sec FRAM write speed (SpyBiWire) Up to 14 kB/sec EnergyTraceTM Technology Target output current accuracy For target output voltage = 1.8 V to 3.6 V, target output current <75 mA and USB voltage = 5 V constant during and after calibration 2%, 500 nA B.39.8 MSP-FET Revision History Revision numbers are printed on the PCB and are stored in nonvolatile memory in firmware. Table B-46 shows the revision history of the MSP-FET. Table B-46. MSP-FET Revision History Revision Date Revision 1.2 March 2014 Comments Initial release SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 171 MSP-FET430PIF www.ti.com B.40 MSP-FET430PIF Figure B-88. MSP-FET430PIF FET Interface Module, Schematic 172 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET430PIF www.ti.com Figure B-89. MSP-FET430PIF FET Interface Module, PCB SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 173 MSP-FET430UIF www.ti.com B.41 MSP-FET430UIF Figure B-90. MSP-FET430UIF USB Interface, Schematic (1 of 4) 174 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET430UIF www.ti.com Figure B-91. MSP-FET430UIF USB Interface, Schematic (2 of 4) SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 175 MSP-FET430UIF www.ti.com Figure B-92. MSP-FET430UIF USB Interface, Schematic (3 of 4) 176 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET430UIF www.ti.com Figure B-93. MSP-FET430UIF USB Interface, Schematic (4 of 4) SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 177 MSP-FET430UIF www.ti.com Figure B-94. MSP-FET430UIF USB Interface, PCB 178 Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated MSP-FET430UIF www.ti.com B.41.1 MSP-FET430UIF Revision History Revision 1.3 * Initial released hardware version Assembly change on 1.3 (May 2005) * R29, R51, R42, R21, R22, R74: value changed from 330R to 100R Changes 1.3 to 1.4 (Aug 2005) * J5: VBUS and RESET additionally connected * R29, R51, R42, R21, R22, R74: value changed from 330R to 100R * U1, U7: F1612 can reset TUSB3410; R44 = 0R added * TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND * Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP * Pullups on TCK and TMS: R78, R79 added * U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV NOTE: Using a locally powered target board with hardware revision 1.4 Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunction with a locally powered target board is not possible. In this case, the target device RESET signal is pulled down by the FET tool. It is recommended to remove R62 to eliminate this restriction. This component is located close to the 14-pin connector on the MSP-FET430UIF PCB. See the schematic and PCB drawings in this document for the exact location of this component. Assembly change on 1.4a (January 2006) * R62: not populated SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Copyright (c) 2009-2015, Texas Instruments Incorporated 179 MSP-FET430UIF 180 www.ti.com Hardware SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Appendix C SLAU278V - May 2009 - Revised May 2015 Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP: * MSP-FET430UIF * eZ430-F2013 * eZ430-RF2500 * eZ430-Chronos * eZ430-RF2780 * eZ430-RF2560 * MSP-WDSxx "Metawatch" * LaunchPad (MSP-EXP430G2) * MSP-EXP430FR5739 * MSP-EXP430F5529 The installation procedure for other supported versions of Windows is very similar and, therefore, not shown here. Topic C.1 ........................................................................................................................... Page Hardware Installation ........................................................................................ 182 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Installation Guide Copyright (c) 2009-2015, Texas Instruments Incorporated 181 Hardware Installation C.1 www.ti.com Hardware Installation Table C-1 shows the USB VIDs and PIDs used in MSP430 tools. Table C-1. USB VIDs and PIDs Used in MSP430 Tools USB VID USB PID INF File Name eZ430-F2013 Tool 0x0451 0xF430 usbuart3410.inf eZ430-RF2500 0x0451 0xF432 430CDC.inf eZ430-RF2780 0x0451 0xF432 430CDC.inf eZ430-RF2560 0x0451 0xF432 430CDC.inf MSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.inf eZ430-Chronos 0x0451 0xF432 430CDC.inf MSP-FET430UIF (1) 0x2047 0x0010 msp430tools.inf MSP-FET 0x2047 0x0204 msp430tools.inf eZ-FET 0x2047 0x0203 msp430tools.inf LaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.inf MSP-EXP430FR5739 0x0451 0xF432 430CDC.inf MSP-EXP430F5529 0x0451 0xF432 430CDC.inf (1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID 0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively. 1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of IDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB Debug Interfaces without user interaction. After IDE installation the USB Debug Interface can be connected and will be ready to work within few seconds. 2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PC the Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window. 3. Select "Install from a list or specific location (Advanced)" (see Figure C-1). Figure C-1. Windows XP Hardware Wizard 182 Hardware Installation Guide SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Hardware Installation www.ti.com 4. Browse to the folder where the driver information files are located (see Figure C-2). For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, or c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool. For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART, or <Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>. Figure C-2. Windows XP Driver Location Selection Folder 5. The Wizard generates a message that an appropriate driver has been found. SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Installation Guide Copyright (c) 2009-2015, Texas Instruments Incorporated 183 Hardware Installation www.ti.com 6. The wizard installs the driver files. 7. The wizard shows a message that it has finished the installation of the software USB Debug Interface. 8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as shown in Figure C-3, Figure C-4, or Figure C-5. Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 184 Hardware Installation Guide SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Hardware Installation www.ti.com Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Installation Guide Copyright (c) 2009-2015, Texas Instruments Incorporated 185 Hardware Installation www.ti.com Figure C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 186 Hardware Installation Guide SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated Hardware Installation www.ti.com SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Hardware Installation Guide Copyright (c) 2009-2015, Texas Instruments Incorporated 187 Revision History www.ti.com Revision History Changes from January 14, 2015 to May 20, 2015 ........................................................................................................... Page * * * * * * Changed "Included Devices" column for MSP-TS430PM64F row ................................................................ 18 Added MSP-TS430PZ100AUSB to Table 1-2 ....................................................................................... 18 Added Section B.34, MSP-TS430PZ100AUSB .................................................................................... 141 Changed Figure B-71, EM430F5137RF900 Target Board, Schematic ......................................................... 148 Changed from "CC430F52x1" to "CC430F5137" for Item 34 in Table B-37 ................................................... 151 Changed Figure B-73, EM430F6137RF900 Target Board, Schematic ......................................................... 152 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 188 Revision History SLAU278V - May 2009 - Revised May 2015 Submit Documentation Feedback Copyright (c) 2009-2015, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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