K M Y Last update: 2012.9.28 No.RHC-K-HTS-0001-7
(Uncontrolled copy)
Specification
(Reference)
Title: FIXED THICK FILM CHIP RESISTORS;
RECTANGULAR TYPE & HIGH OHM
Style: RHC16,20
RoHS COMPLIANCE ITEM
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Issue Dept.: Research & Development Department Hokkaido Research Center
K M Y Drawing No: RHC−K−HTS−0001 /7
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM
RHC16,20 Page: 1/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.9.28
1. Scope
1.1 This specification covers the detail requirements for fixed thick film chip resistors; rectangular type & high ohm, style of
RHC16,20.
1.2 Applicable documents
JIS C 5201: 1994, JIS C 5202: 1990
2. Classification
Type designation shall be the following form.
(Example) RHC 20
10G0 MTP
1 2 3 4 5
Style
1 Fixed thick film chip resistors; rectangular type & high ohm
2 Size
3 Rated resistance Example; 10G0 → 10GΩ
4 Tolerance on rated resistance
5 Packaging form
3. Rating
3.1 The ratings shall be in accordance with Table−1.
Table−1
Style
Rated
voltage
(V)
Temperature
coefficient of
resistance (10−6/°C)
Rated resistance
range (Ω) Tolerance on rated resistance
Preferred
number series
for resistors
Isolation
voltage
(V)
100M∼270M J(±5%)
100M∼4G K(±10%)
RHC16 0∼−2,000
100M∼150G M(±20%), N(±30%), H(±50%)
100M∼1G J(±5%), K(±10%)
±2,000 100M∼10G
RHC20
15
±4,000 100G∼150G M(±20%), N(±30%), H(±50%)
E12 100
Style Working temperature range(°C)
RHC16 −55~+155
RHC20 −55~+125
3.2 Derating
The derated values of load at temperature in excess of 70 °C shall be as indicated by the following curve.
Figure–1 Derating curve
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol Packaging form Standard packaging
quantity / units
B Bulk (loose package) 1,000 pcs.
TP Paper taping 8mm width, 4mm pitches 5,000 pcs.
Style
−55
100
70 125
0
A
rea of recommended
operation
Percentage
of the load
A
mbient temperature (°C)
(%)
15
5
RHC20
RHC16
K M Y Drawing No: RHC−K−HTS−0001 /7
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM
RHC16,20 Page: 2/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.9.28
5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.
Figure−2
Table−3 Unit: mm
Style L W H c d
RHC16 1.6±0.1 +0.15
0.8
−0.05 0.45±0.10 0.3±0.1 0.3±0.1
RHC20 2.0±0.1 1.25±0.10 0.55±0.10 0.4±0.2 0.4±0.2
5.2 Net weight (Reference)
Style Net weight(mg)
RHC16 2
RHC20 5
6. Performance
6.1 The standard condition for tests shall be in accordance with Sub−clause 3, JIS C 5202: 1990.
6.2 The performance shall be satisfied in Table−4.
Table−4(1)
No. Test items Condition of test (JIS C 5202) Performance requirements
1 DC resistance Sub−clause 5.1
Measuring voltage: 15 V
Within the specified tolerance of rated
resistance.
2 Temperature
characteristics of
resistance
Sub−clause 5.2
Test condition: 5 °C / 35 °C
See table−1.
3 Voltage coefficient Sub−clause 5.3
Measuring voltage: 5 V / 15 V
RHC16
100MΩ≤R<100GΩ: Within ±1 %/V
100GΩ≤R≤150GΩ: Within ±2 %/V
RHC20
100MΩ≤R≤10GΩ: Within 0∼−2 %/V
100GΩ≤R≤150GΩ: Within ±10 %/V
4 Insulation resistance Sub−clause 5.6
The resistor shall be fixed on the test fixture as
shown in Figure−4.
Test potential: 100 Vdc
Test period: 1 min.
10 TΩ min.
5 Capacitance Measuring voltage: 1 V
Measuring frequency: 10 kHz, 100kHz, 1MHz
1 pF max.
L
c
H
dd
W
c
K M Y Drawing No: RHC−K−HTS−0001 /7
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM
RHC16,20 Page: 3/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.9.28
Table−4(2)
No. Test items Condition of test (JIS C 5202) Performance requirements
6 Terminal strength
(Pulling test)
Lead wire (RHC16: φ0.4 mm, RHC20: φ0.47
mm) shall be soldered to the center of terminal.
One side is fixed and the specified load shall be
applied to the other side in the direction of axial.
Duration: 10 s ± 1 s
Not be peeled off by the pulling force
under 5 N.
RHC16: 3 N
7 Substrate bending test Sub−clause 6.1.4 (1)
The resistor shall be mounted on the test
substrate as shown in Figure−3.
Bending value: 5 mm
(Among the fulcrums: 90 mm)
Duration: 10 s ± 1 s
No evidence of mechanical damage.
8 Resistance to soldering
heat
Sub−clause 6.10
Test by a piece.
Temp. of solder bath: 260 °C ± 5 °C
Immersion time: 10 s ± 1 s
After immersion into solder, leaving at the room
temp. for 1h or more and then measure the
resistance.
RHC16
100MΩ≤R≤10GΩ: Within ±1 %
10GΩ<R≤150GΩ: Within ±2 %
RHC20
100MΩ≤R≤10GΩ: Within ±1 %
100GΩ≤R≤150GΩ: Within ±5 %
No evidence of appearance damage
9 Solderability Sub−clause 6.11
Test by a piece.
Flux: Rosin−Methanol
Temp. of solder bath: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s
The surface of terminal immersed shall be
min. of 95% covered with a new coating of
solder.
Sub−clause 7.4
Test cycle: 5 cycles for duty cycle as specified
below.
Step Temperature (°C) Time (min)
1 Room temp. 2∼3
2 −55±3 30
3 Room temp. 2∼3
10
Temperature cycling
4 RHC16: 155±2
RHC20: 125±2 30
RHC16
100MΩ≤R≤10GΩ: Within ±1 %
10GΩ<R≤150GΩ: Within ±2 %
RHC20
100MΩ≤R≤10GΩ: Within ±1 %
100GΩ≤R≤150GΩ: Within ±5 %
No evidence of appearance damage
Sub−clause 7.5
Test temp. & relative humidity:
40 °C ± 2 °C & 90∼95 %
11 Humidity
+48
Test period: 1,000 h
0
RHC16
100MΩ≤R≤10GΩ: Within ±2 %
10GΩ<R≤150GΩ: Within ±5 %
RHC20
100MΩ≤R≤10GΩ: Within ±2 %
100GΩ≤R≤150GΩ: Within ±5 %
No evidence of appearance damage
Sub−clause 7.10
Test temp. & relative humidity:
70 °C ± 2 °C
Test voltage: Cycle of 1 h 30 min. ″ON″ and 30
min. ″OFF″ at dc rated voltage.
12 Load life
+48
Test period: 1,000 h
0
RHC16
100MΩ≤R≤10GΩ: Within ±3 %
10GΩ<R≤150GΩ: Within ±5 %
RHC20
100MΩ≤R≤10GΩ: Within ±3 %
100GΩ≤R≤150GΩ: Within ±20 %
No evidence of appearance damage
K M Y Drawing No: RHC−K−HTS−0001 /7
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM
RHC16,20 Page: 4/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.9.28
7. Test substrate
Unit: mm
Style a b c d
RHC16 1.0 3.6 1.2 3.0
RHC20 1.2 4.0 1.65 3.0
Figure−3 RHC SUBSTRATE BENDING TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1.6mm Thickness of copper clad: 0.035mm
Figure−4
R0.5mm
Metal block measurement
Point
A
Insulation plate
Metal plate
Measurement
point B Insulation surface Component
Pressure by
spring (1±0.2N)
:Copper clad
:Solder resist
d
a
d
c
14.5
40
b
70
100
Soldering land
K M Y Drawing No: RHC−K−HTS−0001 /7
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM
RHC16,20 Page: 5/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.9.28
8. Taping
8.1 Applicable documents JIS C 0806−3: 1999, EIAJ ET−7200B: 2003
8.2 Taping dimensions
Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−5 and Table−5.
Unit: mm
Figure−5
Table−5 Unit: mm
Style A B t
1 t 2
RHC16 1.15±0.15 1.9±0.2 0.6±0.1 0.8max.
RHC20 1.65±0.15 2.5±0.2 0.8±0.1 1.0max.
1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following Figure−6.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shall
maintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The resistors shall be faced to upward at the over coating side in the carrier cavity.
Figure−6
t 1
t 2
+
0.1
φ1.5
0
4
±
0.1
2
±
0.05 1.75±0.1
8±0.2
4
±
0.1 3.5±0.05
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
165°to180°
C
arr
i
er tape
T
op cover tape
Peel
−
off
(About 300mm/min)
Di
rec
ti
on o
f
unree
li
ng
K M Y Drawing No: RHC−K−HTS−0001 /7
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH OHM
RHC16,20 Page: 6/6
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.9.28
8.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−7 and Table−6.
Plastic reel (Based on EIAJ ET−7200B)
Unit: mm
Figure−7
Table−6 Unit: mm
Style A B Note
11.4±1.0 Injection molding
RHC16, 20 +1.0
9 0 13±1.0 Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
8.4 Leader and trailer tape.
Figure−8
9. Marking on package
The label of a minimum package shall be legibly marked with follows.
9.1 Marking A
(1) Classification (Style, Rated resistance, Tolerance on rated resistance, Packaging form)
(2) Quantity (3) Lot number (4) Manufacturer’s name or trade mark (5) Others
9.2 Marking B (KAMAYA Control label)
160mm min
.
100mm min
.
400mm min.
End
Trailer
Direction of unreeling
Leade
r
Start
φ21±0.8
2±0.5
Marking A
0
φ180
−1.5
+1
φ
60
0
φ
13±0.2
B
A
Marking B
