PC725V0NSZXF
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC725V)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008189 (as model No. PC725V)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
DIP 6 pin Darlington
Phototransistor output, High
Collector-emitter Voltage, High
Power Photocoupler
1. 6 pin DIP package
2. Double transfer mold package (Ideal for Flow
Soldering)
3. High collector-emitter voltage (VCEO:300V)
4.
Darlington phototransistor output (CTR : MIN. 1 000%
at I
F
=1mA, V
CE
=2V)
5. Large collector power dissipation (PC:300mW)
6. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
7. Lead-free and RoHS directive compliant
■ Description
PC725V0NSZXF Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 6 pin DIP, available in SMT
gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 300V, CTR is MIN. 1 000%
at input current of 1mA and collector power dissipation is
300mW.
1Sheet No.: D2-A04502EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC725V0NSZXF Series
1. Home appliances
2. Programmable controllers
3. Personal computer peripherals
■ Applications
■ Internal Connection Diagram
Anode
Cathode
NC
Emitter
1
1
2
3
4
Collector
5
Base
6
2
6
5
3 4
2
Sheet No.: D2-A04502EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC725V0NSZXF] 2. Through-Hole (VDE option) [ex. PC725V0YSZXF]
3. SMT Gullwing Lead-Form [ex. PC725V0NIPXF]4.
SMT Gullwing Lead-Form (VDE option) [ex. PC725V0YIPXF]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
PC725V
SHARP
mark
"S"
Date code
Anode
mark
Factory
identification mark
7.12±0.3
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
4
VDE
Identification mark
Anode
mark
PC725V
SHARP
mark
"S"
Date code
Factory
identification mark
7.12±0.5 7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
PC725V
SHARP
mark
"S"
Date code
Anode
mark
Factory
identification mark
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
VDE Identification mark
1 2 3
6 5 4
4
Anode
mark
PC725V
SHARP
mark
"S"
Date code
Factory
identification mark
PC725V0NSZXF Series
Product mass : approx. 0.35gProduct mass : approx. 0.35g
Product mass : approx. 0.36gProduct mass : approx. 0.36g
3
Sheet No.: D2-A04502EN
(Unit : mm)
5. Wide SMT Gullwing Lead-Form
[ex. PC725V0NUZXF]
6. Wide SMT Gullwing Lead-Form (VDE option)
[ex. PC725V0YUZXF]
7.62±0.3
0.26±0.1
0.75±0.25 0.75±0.25
12.0MAX.
10.16±0.5
0.25±0.25
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
7.12±0.5
2.54±0.25
3.5±0.5
Anode
mark
Date code
SHARP mark "S"
PC725V
Factory
identification mark
Anode mark
6.5±0.5
0.6±0.2
1.2±0.3
VDE Identification mark
7.62±0.3
0.26±0.1
0.75±0.25 0.75±0.25
12.0MAX.
10.16±0.5
0.25±0.25
Epoxy resin
7.12±0.5
2.54±0.25
3.5±0.5
Date code
SHARP mark "S"
4
PC725V
Factory
identification mark
PC725V0NSZXF Series
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.35gProduct mass : approx. 0.35g
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
4
repeats in a 20 year cycle
Sheet No.: D2-A04502EN
PC725V0NSZXF Series
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please Contact the local SHARP sales reprsentative to see the actual status of
the production.
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A04502EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current
Transfer
charac-
teristics
Collector-base breakdown voltage
Current transfer ratio
Collector-emitter breakdown voltage
Emitter-base breakdown voltage
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
MIN.
−
−
−
300
10
−
5×1010
−
1
−
−
TYP.
1.2
30
−
−
−
−
40
−
1×1011
0.6
7
100
20
MAX.
1.4
250
1 000
−
−
−
150
1.2
−
1.0
−
300
100
Unit
V
V
V
pF
nA
V
mA
V
Ω
pF
kHz
µs
µs
Symbol
VF
Ct
ICEO
BVCEO
BVEBO
BVCBO
IC
VCE (sat)
fC
tr
tf
RISO
Cf
Response time Rise time
Fall time
Input
Output
IF=10mA
V=0, f=1kHz
Reverse current −−10 µAIRVR=4V
Peak forward voltage −−3.0 VVFM IFM=0.5V
VCE=200V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IC=0.1mA, IF=0
IF=1mA, VCE=2V
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=2V, IC=20mA, RL=100Ω
VCE=2V, IC=20mA, RL=100Ω −3dB
IF=20mA, IC=100mA
300
6
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation
Reverse voltage
mW
V
Output
Collector-emitter voltage
V
Collector-base voltage
Emitter-base voltage
V
V
Collector current mA
mA
Collector power dissipation
Collector current (reverse)
mW
*2 Isolation voltage
Operating temperature
Total power dissipation
˚C
mW
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VR
VCEO
VCBO
VEBO
IC
−IC
PC
Viso (rms)
Topr
Ptot
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Rating
50
1
70
6
300
300
6
150
10
300
−25 to +100
350
−40 to +125
260
5kV
5
PC725V0NSZXF Series
Sheet No.: D2-A04502EN
■ Model Line-up
PC725V0NSZXF PC725V0YSZXF
−−−−−− Approved
PC725V0NIZXF PC725V0YIZXF PC725V0NIPXF PC725V0YIPXF PC725V0NUZXF PC725V0YUZXF
Lead Form
Package
Model No.
DIN
EN60747-5-2
Sleeve
Through-Hole
50pcs/sleeve
Taping
1 000pcs/reel
SMT Gullwing Wide SMT Gullwing
−−−−−− Approved −−−−−− Approved −−−−−− Approved
6
Please contact a local SHARP sales representative to inquire about production status.
PC725V0NSZXF Series
Sheet No.: D2-A04502EN
0
−25
30
025505575100 125
40
50
60
20
10
Ambient temperature Ta (˚C)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
−25 0 25 50 75 100 125
0
50
100
150
200
250
300
350
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
00.511.5 2 2.5 3 3.5
10
100
1
Forward voltage VF (V)
Forward current IF (mA)
50˚C 25˚C
0˚C
−25˚C
Ta=75˚C
Fig.6 Forward Current vs. Forward Voltage
Duty ratio
Pulse width≤100µs
Ta=25˚C
0.01
0.1
10−310−210−1
Peak forward current IFM (A)
1
10
1
Fig.5 Peak Forward Current vs. Duty Ratio
7
PC725V0NSZXF Series
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Total power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
100
00255075100 125
−25
200
300
400
500
Diode power dissipation P (mW)
100
80
70
60
40
20
0025 5550 75 100 125
−25
Ambient temperature Ta (˚C)
Sheet No.: D2-A04502EN
10−9
10−8
10−7
10−6
10−4
−25 2505075100
10−5
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
VCE=200V
RBF=∞
Fig.11 Collector Dark Current vs. Ambient
Temperature
1 000
100
10
1
Response time (µs)
0.01 0.1 1
VCE=2V
IC=20mA
RBE=∞
Ta=25˚C
ts
tf
td
tr
Load resistance RL (kΩ)
Fig.12 Response Time vs. Load Resistance
100
0
50
150
0255075100
Relative current transfer ratio (%)
Ambient temperature Ta (˚C)
−25
IF=1mA
VCE=2V
RBE=∞
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
0
0.2
−25 0 25 50 75 100
0.4
0.6
0.8
1
1.2
Ambient temperature Ta (˚C)
Collector-emitter saturation voltage VCE(sat) (V)
IF=20mA
IC=100mA
RBE=∞
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
8
PC725V0NSZXF Series
0
0.1
Current transfer ratio CTR (%)
110
Forward current IF (mA)
8 000
5 000
6 000
7 000
4 000
3 000
2 000
1 000
VCE=2V
Ta=25˚C
RBE=∞
RBE=1MΩ
RBE=500kΩ
RBE=200kΩ
RBE=100kΩ
Fig.7 Current Transfer Ratio vs. Forward
Current
0
0
Collector current IC (mA)
20
160
12345678
40
60
80
100
120
140
3mA
2mA
1mA
0.7mA
0.5mA
1.5mA
Collector-emitter voltage VCE (V)
IF=5mA RBE=∞
Ta=25˚C
PC (MAX.)
Fig.8 Collector Current vs. Collector-emitter
Voltage
Sheet No.: D2-A04502EN
VCC
RD
Output
RL
VCE
Please refer to the conditions in Fig.14
Fig.15 Test Circuit for Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
9
PC725V0NSZXF Series
VCC
tr
tr
ts
90%
10%
td
Output
Input
RL
RD
Input Output
VCE
Please refer to the conditions in Fig.12
Fig.13 Test Circuit for Response Time
Frequency f (kHz)
−5
0.1
−15
101 100
−20
−25
−10
0
5
100Ω
10Ω
Voltage gain Av (dB)
RL=1kΩ
VCE=2V
IC=20mA
RBE=∞
Ta=25˚C
Fig.14 Frequency Response
Sheet No.: D2-A04502EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
SMT Gullwing lead-form Wide SMT Gullwing lead-form
2.542.54
1.7
2.2
10.2
2.542.54
1.7
2.2
8.2
(Unit : mm)
● Design guide
PC725V0NSZXF Series
Sheet No.: D2-A04502EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC725V0NSZXF Series
Sheet No.: D2-A04502EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
12
PC725V0NSZXF Series
Sheet No.: D2-A04502EN
■ Package specification
13
12.0
6.7
5.8
10.8
520
±2
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
PC725V0NSZXF Series
(Unit : mm)
Sheet No.: D2-A04502EN
14
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚MAX.
Dimensions List (Unit:mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC725V0NSZXF Series
Sheet No.: D2-A04502EN
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
15
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
12.2±0.1
I
0.4±0.05
J
4.1±0.1
K
7.6±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚MAX.
F D
K
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
25.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC725V0NSZXF Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
16
Sheet No.: D2-A04502EN
■ Important Notices
PC725V0NSZXF Series
[E221]
