TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 1Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Speed Infrared Emitting Diode, RoHS Compliant,
890 nm, GaAlAs Double Hetero
DESCRIPTION
TSMF1000 series are infrared, 890 nm emitting diodes in
GaAlAs double hetero (DH) technology with high radiant
power and high speed, molded in clear, untinted plastic
packages (with lens) for surface mounting (SMD).
FEATURES
Package type: surface mount
Package form: GW, RGW, yoke, axial
Dimensions (L x W x H in mm): 2.5 x 2 x 2.7
Peak wavelength: p = 890 nm
High radiant power
Angle of half intensity: = ± 17°
Low forward voltage
Suitable for high pulse current operation
Versatile terminal configurations
Package matches with detector TEMD1000
Floor life: 168 h, MSL 3, acc. J-STD-020
Compliant to RoHS Directive 2002/95/EC and in
accordance with WEEE 2002/96/EC
APPLICATIONS
IrDA compatible data transmission
Miniature light barrier
Photointerrupters
Optical switch
Control and drive circuits
Shaft encoders
Note
Test conditions see table “Basic Characteristics”
Note
MOQ: minimum order quantity
16758-5
TSMF1000
TSMF1030
TSMF1020
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) (deg) P (nm) tr (ns)
TSMF1000 5 ± 17 890 30
TSMF1020 5 ± 17 890 30
TSMF1030 5 ± 17 890 30
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
TSMF1000 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing
TSMF1020 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing
TSMF1030 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Yoke
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 2Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF100 mA
Peak forward current tp/T = 0.5, tp 100 μs IFM 200 mA
Surge forward current tp = 100 μs IFSM 0.8 A
Power dissipation PV180 mW
Junction temperature Tj100 °C
Operating temperature range Tamb - 40 to + 85 °C
Storage temperature range Tstg - 40 to + 100 °C
Soldering temperature t 5 s Tsd 260 °C
Thermal resistance junction/ambient Soldered on PCB, pad dimensions:
4 mm x 4 mm RthJA 400 K/W
0
20
40
60
80
100
120
140
160
180
200
0 102030405060708090100
21165
T
amb
- Ambient Temperature (°C)
PV - Power Dissipation (mW)
RthJA = 400 K/W
0
20
40
60
80
100
120
0 102030405060708090100
T
amb
- Ambient Temperature (°C)
21166
I
F
- Forward Current (mA)
R
thJA
= 400 K/W
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 20 mA VF1.3 1.5 V
IF = 1 A, tp = 100 μs VF2.4 V
Temperature coefficient of VFIF = 1 mA TKVF - 1.8 mV/K
Reverse current VR = 5 V IR10 μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 Cj160 pF
Radiant intensity IF = 20 mA Ie2.5 5 13 mW/sr
IF = 100 mA, tp = 100 μs Ie25 mW/sr
Radiant power IF = 100 mA, tp = 20 ms e35 mW
Temperature coefficient of eIF = 20 mA TKe- 0.6 %/K
Angle of half intensity ± 17 deg
Peak wavelength IF = 20 mA p890 nm
Spectral bandwidth IF = 20 mA  40 nm
Temperature coefficient of pIF = 20 mA TKp0.2 nm/K
Rise time IF = 20 mA tr30 ns
Fall time IF = 20 mA tf30 ns
Cut-off frequency IDC = 70 mA, IAC = 30 mA pp fc12 MHz
Virtual source diameter d 1.2 mm
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 3Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 3 - Pulse Forward Current vs. Pulse Duration
Fig. 4 - Forward Current vs. Forward Voltage
Fig. 5 - Radiant Intensity vs. Forward Current
Fig. 6 - Radiant Power vs. Forward Current
Fig. 7 - Rel. Radiant Intensity/Power vs. Ambient Temperature
Fig. 8 - Relative Radiant Power vs. Wavelength
0.01 0.1 1 10
1
10
100
1000
10 000
t
p
- Pulse Length (ms)
100
95 9985
I
F
- Forward Current (mA)
DC
t
p
/T = 0.005
0.5
0.2
0.1
0.01
0.05
0.02
T
amb
< 60 °C
V
F
- Forward Voltage (V)
94 8880
10
1
10
0
10
2
10
3
10
4
I
F
- Forward Current (mA)
43210
16189
103
101102104
100
0.1
1
10
1000
100
IF - Forward Current (mA)
Ie - Radiant Intensity (mW/sr)
- Radiant Power (mW)
e
I
F
- Forward Current (mA)
94 8007
10
3
10
1
10
2
10
4
10
0
0.1
1
10
1000
100
Φ
- 10 10 50 0 100
0
0.4
0.8
1.2
1.6
I
e rel
;
140
94 7993
I
F
= 20 mA
Φ
e rel
T
amb
- Ambient Temperature (°C)
800 900
λ - Wavelength (nm)
1000
20082
0
0.25
0.5
0.75
1.0
1.25
Φ
e rel
- Relative Radiant Power
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 4Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
PRECAUTIONS FOR USE
1. Over-current-proof
Customer must apply resistors for protection, otherwise
slight voltage shift will cause big current change (burn out
will happen).
2. Storage
Storage temperature and rel. humidity conditions are:
5 °C to 35 °C, R.H. 60 %.
Floor life must not exceed 168 h, acc. to JEDEC level 3,
J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in a
damp proof box with desiccant.
Considering tape life, we suggest to use products within
one year from production date.
If opened more than one week in an atmosphere 5 °C to
35 °C, R.H. 60 %, devices should be treated at 60 °C
± 5 °C for 15 h.
If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3.
REFLOW SOLDER PROFILE
Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile
Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020
S
rel
- Relative Sensitivity
94 8248
0.6
0.9
0.8
30°
10° 20°
40°
50°
60°
70°
80°
0.7
1.0
0
0.20.4
ϕ - Angular Displacement
60
80
100
120
140
160
180
200
220
240
260
0 20 40 60 80 100 120 140 160 180 200 220
Time (s)
Temperature (°C)
17172
+ 5 °C/s
5 s
60 s to 120 s
- 5 °C/s
22566
120 s max.
60 s max.
above 220 °C
260 °C max.
10 s max.
Pre-heating
180 °C to 200 °C
1 °C/s to 5 °C/s
1 °C/s to 5 °C/s
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 5Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: TSMF1000
PACKAGE DIMENSIONS in millimeters: TSMF1020
16159
16160
3.8 ± 0.2
Ø 1.9 ± 0.2
0.3
0.15 ± 0.05
0.75
1.4
2.7 ± 0.2
0.85
2.5 ± 0.2
1.1
2 ± 0.2
0.5
0.4
CA
4.5 ± 0.1
2.3 ± 0.1
1 ± 0.1
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 6Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: TSMF1030
REEL DIMENSIONS in millimeters
16228
Issue: 3; 11.06.08
Drawing-No.: 9.800-5080.01-4
Leader and trailer tape:
Parts mounted
Empty trailer (200 mm, min.)
Empty leader (400 mm, min.)
Direction of pulling out
Unreel direction
60.2 ±0.5
178 ±1
2.5
±0.5
Label posted here
coming out from reel
Tape position
X
X
13
± 0.5
13.2 ±1.5
16 ±0.2
18033
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 7Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING DIMENSIONS in millimeters: TSMF1000
TAPING DIMENSIONS in millimeters: TSMF1020
18031
3.05 ± 0.1
0.3 Ø 1.55 ± 0.05
4 ± 0.1
2 ± 0.05
4 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
12 ± 0.3
Top tape
Push pin through hole
Quantity per reel: 1000 pcs or 5000 pcs
Feed direction
Anode
TSMF1000, TSMF1020, TSMF1030
www.vishay.com Vishay Semiconductors
Rev. 1.8, 30-Jun-11 8Document Number: 81061
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING DIMENSIONS in millimeters: TSMF1030
18032
3.05 ± 0.1
0.3 Ø 1.55 ± 0.05
4 ± 0.1
2 ± 0.05
4 ± 0.1
1.75 ± 0.15.5 ± 0.05
12 ± 0.3
Top tape
Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs
Feed direction
Anode
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 02-Oct-12 1Document Number: 91000
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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