BAV19WS/BAV20WS/BAV21WS
410mW High Voltage SMD Switching Diode
Small Signal Diode
Flat Lead SOD-323F small outline plastic package
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Case : Flat lead SOD-323F small outline plastic package Min Max Min Max
1.15 1.40 0.045 0.055
2.30 2.80 0.091 0.110
0.25 0.40 0.010 0.016
1.60 1.80 0.063 0.071
0.80 1.10 0.031 0.043
0.05 0.15 0.002 0.006
Part No. Package Packing Code Packing Marking
BAV19WS SOD-323F RR 3K / 7" Reel S5
BAV20WS SOD-323F RR 3K / 7" Reel S6
BAV21WS SOD-323F RR 3K / 7" Reel S7
BAV19WS SOD-323F RRG 3K / 7" Reel S5
BAV20WS SOD-323F RRG 3K / 7" Reel S6
BAV21WS SOD-323F RRG 3K / 7" Reel S7
Maximum Ratings
Pulse width= 1μs
Pulse width= 1s
High temperature soldering guaranteed: 260°C/10s
A
Note1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
SOD-323F
Maximum Ratings and Electrical Characteristics
Features
Mechanical Data
Terminal: Matte tin plated, solderable
per MIL-STD-202, Method 208 guaranteed
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
°C
E
Value
mA200
200
250
2.5
mW
V
Junction and Storage Temperature Range TJ, TSTG -65 to + 150
Non-Repetitive Peak Forward Surge Current
0.5
VRRM
IF(AV)
Power Dissipation
Average Rectified Forward Current
Repetitive Peak Reverse Voltage
PD
Type Number
Polarity : Indicated by cathode band
Weight : 4.85±0.5 mg
Rating at 25°C ambient temperature unless otherwise specified.
Ordering Information
UnitsSymbol
Suggested PAD Layou
t
D
IFSM
Unit (inch)
Pin Configuration
Marking Code : S5, S6, S7
Dimensions
(mm)
F
Unit (mm)
A
B
C
D
A
B
C
E
F
Version : D10
BAV19WS/BAV20WS/BAV21WS
410mW High Voltage SMD Switching Diode
Small Signal Diode
Electrical Characteristics
IF= 100mA
IF=
Junction Capacitance
Tape & Reel specification
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Note 2: Test Condition : IR=100μA
Note 3: Test Condition : BAV19WS @ VR=100V, BAV20WS @ VR=150V, BAV21WS @ VR=200V
Note 4: Test Condition : IF=IR=30mA, RL=100Ω, IRR=3mA
Note 5: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10° within the determined cavity.
Note 6: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
W 8.30 Max.
Reel width W1 14.4 Max
P0 4.00 ±0.10
P1 2.00 ±0.10
Tape width
T 0.6 Max.
13.0 ± 0.5
K
D2
D1
D
E 1.75 ±0.10
50 Min.
F 3.50 ±0.05
Item Symbol Dimension(mm)
A 178 ± 1
2.40 Max.
Min
1.5 ± 0.1
250 -
UnitsMax
ns50
-
-
120 -
1.00-
200
Reverse Recovery Time (Note 4) Trr
Symbol
Breakdown Voltage
BAV19W
BAV20W (Note 2)
BAV21W
V
BAV19W
BAV20W (Note 3)
BAV21W
nA
V
CJ
-
VF
IR
VR
100
pF
User Direction of Feed
Reverse Leakage Current
Type Number
200mA
-
Forward Voltage
5.0
1.25
VR=0, f=1.0MHz
-
T
op
Co
v
e
r T
ape
Carieer Tape
A
n
y
Additional Label
(
If Required
)
TSC label
W1
D1D2
A
Version : D10
BAV19WS/BAV20WS/BAV21WS
410mW High Voltage SMD Switching Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Admissible Power Dissipation Curve
0
50
100
150
200
250
300
0 25 50 75 100 125 150
Power Dissipation (mW)
FIG 3 Leakage Current vs Junction
Temperature
0.01
0.1
1
10
100
0 100 200
Leakage Current (uA)
Ambient Temperature (°C)
Junction Temperature (℃)
FIG 2 Typical Forward Characterisics
0.01
0.1
1
10
100
1000
012
Forward Current (mA)
Forward Voltage (V)
Tj=25°C
Version : D10
